CZ306134B6 - Process for producing smart package based on a film provided with identification RFID tag - Google Patents

Abstract

On a film (3) back side, there are performed registration marks (4) RFID chips (1) in the form of a die-strap with connectors for an antenna (wings) are then adhesive bonded according these marks (4) on the front side in such a manner that the electrically conducting contacts are oriented upwards from the film (3). Subsequently, the film (3) front side is directly printed in the regions of the chips (1) with images of customized RFID antennas (2) such, that their ends overlap the electrically conducting contacts of the corresponding chip (1). The film (3) front side with the chips (1) and antenna print (2) can be covered and connected b lamination with another cover film (5) such that each tag is then situated within the space between the tow films (3, 5).

Description

Method of manufacturing an intelligent packaging based on a foil provided with an RFID identification tag

Field of technology

The invention relates to a method of manufacturing a smart package based on a film provided with an RFID identification tag with a chip containing electronically readable information about the packaged product and with a customized RFID antenna printed directly on the packaging film.

Prior art

At present, packages for goods equipped with RFID tags identifying packaged products and providing electronically readable information about the properties of these products are already known. Most of them are RFID tags designed as labels for sticking on packaging. This uses a combination of a glued RFID chip with an RFID antenna printed with conductive ink. Such a solution using printing with a conductive ink containing carbon or silver particles is, for example, the subject of Chinese Utility Model No. 202533979.

However, solutions using direct printing of packaging foils, especially polymeric, conductive printing inks are also beginning to appear. The subject of patent application US 2011/052792 is a general method of making electronic circuits by printing them with conductive ink on foil. The main, more specified application is the fabrication of an RFID tag, which consists in fabricating an RFID antenna by direct printing with conductive ink on the foil and then attaching the RFID chip to it by gluing it to the foil in the area of this conductive printing. A similar process of creating an RFID tag by printing it on foil, with the exception of the RFID chip, is also addressed in Korean Patent Application 2012/0077847. ’

The disadvantage of the above solutions consisting in printing the RFID antenna and subsequent gluing of the RFID chip is the high demands of this operation on production accuracy (in the order of tenths of a mm) and consequently the necessary nature of production technologies and technical solutions to implement them to eliminate potential causes of inaccuracy. caused by mechanical causes, thermal expansion due to the properties of the construction material, etc.). The result is high prices of production equipment and operational complexity of production. This is, for example, an obstacle to the application of RFID elements directly in the production of packaging materials.

The essence of the invention

The method of manufacturing an intelligent foil-based package provided with an RFID identification tag according to the invention contributes to a large extent to overcoming the above-mentioned disadvantages. This method of production consists in printing registration marks on the continuously moving foil at regular intervals, according to which, similarly to the known solutions, RFID tags containing an RFID chip glued to the foil and an RFID antenna printed on the foil are mounted. Then the legibility of the tags is verified, or the information required by the customer is loaded into them by a reader, and the foils are divided into semi-finished products, each of which contains one RFID tag. These semi-finished products are then processed into final packaging.

The essence of the invention consists in that registration marks are formed on the reverse side of the film with a thickness of 0.05 to 0.2 mm from a material selected from the group comprising LDPE, PP, PET and PA, and according to them RFID is first glued to the front side of the film. chips in the form of a die-strap with connectors for the antenna (wings) so that the conductive contacts are oriented upwards from the foil. Subsequently, the front side of the foil in the chip areas is directly printed with patterns of customized RFID antennas so that their ends overlap the conductive contacts of the respective chip. A conductive printing water-soluble ink with a viscosity (according to DIN 4) of 22 to 35 s, containing 3 to 7% of a solid component with a functional component consisting of silver or silver-treated copper particles, is used for printing.

- 1 CZ 306134 B6

The films used are preferably LDPE films with a thickness of 0.05 to 0.2 mm, biaxially oriented PP films with a thickness of 0.02 to 0.08 mm, PET films with a thickness of 0.02 to 0.08 mm or PA film with a thickness of 0.04 to 0.08 mm.

A non-conductive, solvent-free polyurethane-based adhesive is preferably used to adhere the RF1D chip.

The foil with the chips and the antenna print can then advantageously be overlapped and laminated to another cover foil so that each of the tags is then placed in the space between the two foils.

The main benefit of the solution according to the invention lies in the use of an available chip modification (die-strap chip with connectors and upward orientation of conductive contacts) combined with the use of a technical element - printing marks, used in printing techniques to achieve color registration. localization of objects applied in three operations a), b), c):

a) registration of a common graphic motif on the foil, acquired in the previous production step,

b) locating the chip on the opposite side of the same foil to a designated location, c) subsequently on the same side of the foil as ad b) printing the antenna.

The accuracy required to achieve a functional connection between the chip and the antenna in the production method according to the invention is in the order of millimeters, i.e. an order of magnitude lower accuracy than in the prior art solution. This is crucial in terms of reducing production costs.

The benefit of lamination with a covering foil, performed in the next production step, is mainly in meeting the legislative and hygienic requirements - ie. in separating the tag from direct contact with the packaged food. At the same time, its protection against environmental influences is addressed. A secondary benefit of lamination is that it ensures that the tag is inseparable from the film, even in those places of the package which are inaccessible for visual inspection of the integrity of the package.

Explanation of drawings

To further elucidate the essence of the invention, the attached drawing serves, where it represents:

Fig. 1 - diagram of the procedure of storing RFID chips and printing patterns of customized RFID antennas, Fig. 2 - diagram of subsequent lamination.

Examples of embodiments of the invention

Example 1

In an exemplary embodiment of a method of manufacturing a smart package (see Fig. 1) based on a film provided with an identification RFID tag, registration marks 4 were first printed on the reverse side of a continuously shifted film 3 in a given example from LDPE with a thickness of 0.05 to 0.2 mm. RFID chips 1 in the form of a die-strap with connectors for the antenna (wings) were first glued to the front side of the film, so that the conductive contacts are oriented upwards from the film.

The RFID chips used had the following parameters and properties:

meet the standards EPCGlobal ™ Gen2 (v. 1.0.9) and ISO / IEC 18000-6C, work on the frequency 860 to 960 MHz, communication is possible through inductive and backscatter coupling. Supported

-2GB 306134 B6 are optional Gen2 commands (write and delete in blocks). The chips have 192-bit memory, 96-bit memory for EPC, 32-bit for password, 32-bit for deactivation password, 32-bit TID memory. The thermal resistance of the chip is 150 ° C, for a maximum of 1 min., The perpendicular pressure on the chip is a maximum of 10 N / mm ² , when bending over the surface of the cylinder, the minimum diameter of the cylinder is 15 mm.

A non-conductive two-component solvent-free polyurethane-based adhesive was used to bond the RFID chip. Working temperatures during application and lamination were 30 to 60 ° C, applied adhesive weight 1.2 to 2 g / m ² .

Subsequently, the front side of the foil in the chip areas was directly printed with patterns of customized RFID antennas 2 so that their ends covered the conductive contacts of the respective chip. A conductive water-soluble ink with a viscosity of 22 to 35 s (DIN4), containing 3 to 7% solids, was used for printing. The functional component was silver particles, or. copper surface treated with silver. The printing was performed by transfer with a wet weight of 16 g / m ² . The drying temperature of the printing layer was max 110 ° C, the surface resistance of the printed antenna was 10 to 20 Ω / square.

Example 2

The method of production of the intelligent packaging and the materials used were identical to Example 1. However, the foil with chips and antenna print was subsequently covered and laminated with another cover foil 5 so that each tag is then placed in the space between two foils 3, 5 (see Fig. 2). The rollers of the laminating device were tempered to 30 to 80 ° C, the pressure of the laminating roller was at most 6 Atm.

Example 3

The method of manufacturing the smart package was as in Example 1 or 2, but BOPP film 3 with a thickness of 0.02 to 0.08 mm was used.

Example 4

The method of manufacturing the smart package corresponded to Example 1 or 2, but a PET film 3 with a thickness of 0.02 to 0.08 mm was used.

Example 5

The method of manufacturing the smart package corresponded to Example 1 or 2, but a film 3 of PA with a thickness of 0.04 to 0.08 mm was used.

Claims (7)

A method of manufacturing a smart package based on a foil provided with an RFID identification tag, comprising first printing registration marks on the continuously moving foil at regular intervals, according to which RFID tags containing an RFID chip glued to the foil and an RFID antenna printed on the foil are mounted, the legibility of the tags is verified, or the information required by the customer is loaded into them by a reader, the foils are divided into semi-finished products, each containing one RFID tag and these are then processed into final packaging, characterized in that on the reverse side of the foil (3) with a thickness of 0.05 to 0.2 mm from a material selected from the group consisting of LDPE, PP, PET and PA y -3GB 306134 B6 form registration marks (4) and according to them RFID chips (1) in the form of die-strap with connectors for the antenna (wings) are first glued to the front side of the foil (3) so that the conductive contacts are oriented upwards from the foil (3) and subsequently the front side of the foil (3) in the areas of the chips (1) is directly printed with patterns of customized RFID antennas (2) so that their ends overlap the conductive contacts of the respective chip (1), using a conductive printing water-soluble ink with a viscosity (according to DIN 4) of 22 to 35 s, containing 3 to 7% of a solid component with a functional component consisting of silver or copper particles surface-treated with silver. Method according to Claim 1, characterized in that an LDPE film with a thickness of 0.05 to 0.2 mm is used as the film (3). Method according to Claim 1, characterized in that a biaxially oriented PP film with a thickness of 0.02 to 0.08 mm is used as the film (3). Method according to Claim 1, characterized in that a PET film with a thickness of 0.02 to 0.08 mm is used as the film (3). Method according to Claim 1, characterized in that a PA film with a thickness of 0.04 to 0.08 mm is used as the film (3). The method according to claim 1, characterized in that a non-conductive solvent-free polyurethane-based adhesive is used for gluing the RFID chip. Method according to claim 1, characterized in that the front layer of the foil (3) with chips (1) and the print of the antennas (2) is covered and laminated with another cover foil (5) so that each of the tags is then deposited in the space between the two foils (3,5).