WO2011150734A1 - 一种具有双层灯罩的led灯泡 - Google Patents

一种具有双层灯罩的led灯泡 Download PDF

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Publication number
WO2011150734A1
WO2011150734A1 PCT/CN2011/073802 CN2011073802W WO2011150734A1 WO 2011150734 A1 WO2011150734 A1 WO 2011150734A1 CN 2011073802 W CN2011073802 W CN 2011073802W WO 2011150734 A1 WO2011150734 A1 WO 2011150734A1
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WIPO (PCT)
Prior art keywords
lampshade
led
layer
double
led chip
Prior art date
Application number
PCT/CN2011/073802
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English (en)
French (fr)
Inventor
沈李豪
Original Assignee
Shen Lihao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shen Lihao filed Critical Shen Lihao
Publication of WO2011150734A1 publication Critical patent/WO2011150734A1/zh

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the utility model relates to an LED light bulb, in particular to a double lampshade
  • the LED light source has the advantages of using a low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color illumination.
  • Phosphors are generally used in LED light sources, and their function is to combine light and color to form white light.
  • the conventional phosphor coating method is to mix the phosphor with the silicone potting and then spot-coat on the chip. Studies have shown that as the temperature rises, the quantum efficiency of the phosphor decreases, the light emission decreases, and the wavelength of the radiation changes, causing changes in the color temperature, chromaticity, and lumen of the white LED. Higher temperatures also accelerate the aging of the phosphor. In addition, there are problems with thermal stability of potting and phosphors at high temperatures.
  • the main object of the present invention is to overcome the above-mentioned deficiencies of the prior art, and to provide an LED bulb having a double-layer lampshade which can utilize a double-layer lampshade to change color temperature, improve LED luminous lumens and improve safety.
  • an LED lamp with a double-layer lampshade adopts the following technical solutions.
  • an LED bulb with a double-layer lampshade comprising a lampshade body, an LED chip, a phosphor layer and a base, wherein: the lampshade comprises an inner lampshade and an outer layer lampshade, and the inner layer lampshade is in the outer layer lampshade.
  • the LED chip, the inner layer lamp cover and the outer layer lamp cover are arranged in order from the inside to the outside, and the phosphor layer is coated on the side of the inner layer lamp cover on the LED chip.
  • the material of the lampshade can be any light transmissive material; or glass, plastic (such as PC, PS, etc.), or acrylic (PMMA), etc., the inner lampshade can be flat or round. Curved; coated phosphor layer can be added with different proportions of color phosphors to meet different color temperature requirements (such as blue LED plus yellow phosphor to produce white light), or increase the percentage of color rendering.
  • the utility model has the following beneficial effects: 1.
  • the phosphor layer By uniformly coating the phosphor layer on the inner surface of the inner lampshade (ie, on the side of the LED chip), there is a gap between the phosphor layer and the LED chip, which can open the phosphor layer and the high-heat LED wick.
  • the distance avoids the problem that the conventional technology improves the heat dissipation performance due to the phosphor layer adhered to the high-heat LED chip, causes the phosphor layer to be quenched and aged by high temperature, and causes the luminous efficiency to be lowered, thereby improving the LED chip and the phosphor.
  • the reliability of the layer and the lumen of the LED bulb The reliability of the layer and the lumen of the LED bulb.
  • the inner surface of the inner lampshade is coated with phosphor, which can be changed to achieve different color temperatures by changing the proportion of phosphors, further satisfying the user's demand for LED bulbs of different color temperatures.
  • the inner lampshade can also serve as a protection function, which improves the safety of use, especially in the use of AC LED lighting, and can better exert its protection effect.
  • the double-layer lampshade composed of the inner lampshade and the outer lampshade can also deal with the problems of glare and point light source which are common in LED lamps.
  • Figure 1 is a schematic diagram of a conventional LED bulb.
  • FIG. 2 is a partial cross-sectional view of the inner layer lampshade of the present invention in a circular arc shape.
  • Figure 3 is a partial cross-sectional view of the inner layer of the lampshade of the present invention in a plane.
  • Figure 4 is a cross-sectional view of the MR 16 of the present invention.
  • Figure 5 is a cross-sectional view of the PAR lamp of the present invention.
  • Figure 6 is a schematic view showing the rupture of the outer cover of the present invention.
  • the present invention has an LED bulb with a double-layer lampshade, comprising a lampshade body 1, an LED chip 2, a phosphor layer 3 and a base 4, wherein the lampshade 1 comprises an inner lampshade. 11 and the outer cover 12, the inner cover 11 is under the cover of the outer cover 12, and the LED chip 2, the inner cover 11 and the outer cover 12 are arranged in order from the inside to the outside, and the phosphor layer 3 is coated. On the side of the inner layer shade 11 that rests on the LED chip 2.
  • the inner lamp cover 1 1 can be flat or circular.
  • the overall material of the lampshade 1 can be any light transmissive material; or glass, or plastic (such as PC, PS, etc.), or acrylic (PMMA), etc.
  • the LED chip 2 and its circuit board, as well as the lampshade unit 1 are mounted on the base 4.
  • the inner layer lampshade 11 may be planar or arcuate, and the phosphor layer 3 is coated on the inner surface of the inner layer lampshade 1 1 and can be adjusted into various proportions and different colors to achieve various color temperatures.
  • the demand (such as blue LED plus yellow phosphor to produce white light), or increase the percentage of color rendering.
  • the LED chip 2 When the LED chip 2 emits light, a high temperature is generated. Since the phosphor 3 is not incorporated into the seal of the LED chip 2, it is coated on the inner surface of the inner cover 11 of the lampshade 1 to avoid phosphors. The phosphor in the layer 2 is subjected to temperature quenching and aging due to direct contact with the high-temperature LED chip, and the phosphor is deteriorated to cause a problem that the luminous efficiency is lowered, thereby improving the reliability of the phosphor layer 2 and the luminous lumen of the LED.
  • the LED chip 2 works as usual, so the user may have a direct risk of directly touching the power supply on the circuit board.
  • the layer cover 11 can also protect the consumer's function, especially in the use of the AC LED, and can better exert its protective effect.

Description

一种具有双层灯罩的 LED灯泡
技术领域
本实用新型涉及一种 LED灯泡, 尤其涉及一种具有双层灯罩的 说
LED灯泡。
背景技术 书
LED光源具有使用低压电源、 耗能少、 适用性强、 稳定性高、 响 应时间短、 对环境无污染、 多色发光等优点。 在 LED光源中一般使用 荧光粉, 其作用在于光色复合, 形成白光。 如图 1所示, 传统的荧光 粉涂敷方式是将荧光粉与矽胶灌封混合, 然后点涂在芯片上。 研究表 明, 随着温度上升, 荧光粉量子效率降低,出光减少, 辐射波长也会发 生变化, 从而引起白光 LED色温、 色度、 流明的变化, 较高的温度还 会加速荧光粉的老化。 此外, 高温下灌封胶和荧光粉, 热稳定性也存 在问题。
虽然说依蓝光 LED加上黄色荧光粉而形成白光, 随着白光 LED发 光效率的逐步提高, 将白光 LED应用在照明领域的可能性也越来越 大, 但要达到照明所需要的流明数, 无论是使用何种方法, 都会因为 必须在极小的 LED封装中处理极高的热量, 若组件无法散去这些热 量, 除了各种封装材料会由于彼此间膨胀系数的不同而有产品可靠性 的问题, 芯片的发光效率更会随着温度的上升而有明显地下降, 并造 成使用寿命明显地縮短及提高流明造价。 因此, 如何提高 LED的发光 流明, 成为目前 LED应用的重要课题。 另一方面, 目前传统的 LED灯泡均只有一层灯罩, 当灯罩破裂 时, LED仍会照常工作, 因此使用者可能有直接碰触电路板上之电源而 造成触电的风险, 尤其是在 AC LED运用照明上, 更是存在着极大的隐 m
实用新型内容
本实用新型的主要目的在于克服现有技术上述之不足, 提供一种 可以利用双层灯罩来改变色温、 提高 LED发光流明及提高安全性的一 种具有双层灯罩的 LED灯泡。
为达到上述目的, 本实用新型一种具有双层灯罩的 LED灯泡采用 如下技术方案。
构造一种具有双层灯罩的 LED灯泡, 包括一灯罩总体、 LED芯 片、 荧光粉层及底座, 其特征在于: 所述灯罩总体包括内层灯罩和外 层灯罩, 内层灯罩处于外层灯罩的罩盖之下, LED芯片、 内层灯罩和 外层灯罩从内到外依次设置, 荧光粉层涂布在内层灯罩靠 LED芯片的 那一面上。
对上述技术方案进行进一步阐述:
内层灯罩与外层灯罩间存在间隙。
LED芯片与内层灯罩间存在间隙。
所述灯罩总体的材质可为任意透光的材料; 或是玻璃, 或是塑料 (如 PC、 PS等) , 或是压克力 (PMMA) 等等, 内层灯罩可以是平 面的或是圆弧形的; 涂布的荧光粉层可根据需求来添加不同比例颜色 的荧光粉来达到不同的色温要求 (如蓝色 LED加黄色荧光粉而产生白 光) , 或增加演色性之百分比。
相对于现有技术, 本实用新型具有如下有益效果: 1、 通过将荧光粉层均匀涂布于内层灯罩的内表面 (即靠 LED芯 片的那一面上) , 荧光粉层与 LED芯片间存在间隙, 可使荧光粉层拉 开与高热的 LED灯芯的距离, 避免了传统技术由于荧光粉层贴着高热 的 LED芯片使散热性能变差、 使荧光粉层遭到高温猝灭和老化、 导致 发光效率降低的问题, 从而提高了 LED芯片及荧光粉层的可靠性和 LED灯泡的出光流明。
2、 内层灯罩的内表面涂有荧光粉, 可以通过改变荧光粉的比例来 达到不同的色温, 进一步满足了使用者对不同色温的 LED灯泡的需求
(如蓝色 LED加黄色荧光粉而产生白光) ; 还可以通过其来增加演色 性之百分比。
3、 当 LED灯具外层灯罩破裂时, 内层灯罩亦可起保护功用, 提高 了使用的安全性, 尤其在交流 LED运用照明上, 更能发挥其保护功 效。
4、 内层灯罩和外层灯罩构成的双层灯罩也能一并处理 LED灯具常 有的炫光及点光源的问题。 附图说明
图 1 是传统 LED灯泡示意图。
图 2 是本实用新型之内层灯罩为圆弧形的局部剖视图。
图 3 是本实用新型之内层灯罩为平面的局部剖视图。
图 4 是本实用新型之 MR16的剖视图。
图 5 是本实用新型之 PAR灯的剖视图。
图 6 是本实用新型之外层灯罩破裂示意图。
图中: 1、 灯罩总体; 1 1、 内层灯罩; 12、 外层灯罩; 2、 LED 芯片; 3、 荧光粉; 4、 底座。 具体实施方式
以下结合附图和实施例对本发明作进一步详细描述。
如图 2至图 5所示, 本实用新型一种具有双层灯罩的 LED灯泡, , 包括一灯罩总体 1, LED芯片 2, 荧光粉层 3及底座 4, 所述灯罩总体 1包括内层灯罩 11和外层灯罩 12, 内层灯罩 1 1处于外层灯罩 12的罩 盖之下, LED芯片 2、 内层灯罩 1 1和外层灯罩 12从内到外依次设 置, 荧光粉层 3涂布在内层灯罩 11靠 LED芯片 2的那一面上。
内层灯罩 1 1与外层灯罩 12间存在间隙。
LED芯片 2与内层灯罩 1 1间存在间隙。
内层灯罩 1 1可以是平面的或是圆弧形的。
灯罩总体 1的材质可为任意透光的材料; 或是玻璃, 或是塑料 (如 PC、 PS等) , 或是压克力 (PMMA) 等等,
LED芯片 2及其电路板、 还有灯罩总体 1安装在底座 4上。 内层灯罩 11可以是平面的或是圆弧形的, 且所述的荧光粉层 3涂 布于内层灯罩 1 1的内表面, 并可调配成各种比例及不同颜色来达到各 种色温的需求 (如蓝色 LED加黄色荧光粉而产生白光) , 或增加演色 性之百分比。
当 LED芯片 2发光时产生高温, 由于所述荧光粉 3并不是内掺于 LED芯片 2的封胶中, 而是涂在所述灯罩总体 1的内层灯罩 11的内表 面, 避免了荧光粉层 2中的荧光粉因直接接触高温的 LED芯片而发生 温度猝灭和老化、 使荧光粉变质而产生发光效率降低的问题, 从而提 高了荧光粉层 2的可靠性和 LED的出光流明。
当 LED灯泡外层灯罩 12破裂时 (如图 6 ) , LED芯片 2照常工 作, 因此使用者可能有直接碰触电路板上之电源之风险, 此时内 层灯罩 11在当外层灯罩 12破裂后, 亦可起保护消费者之功用, 尤其在交流 LED运用照明上, 更能发挥其保护功效。
当然, 以上的具有双层灯罩的 LED灯泡实施例只是在于说明而不 是限制本实用新型, 以上所述仅是本实用新型的较佳实施例, 凡依本 实用新型的技术方案所作出的等效变化或修饰, 均属于本实用新型保 护范围内。

Claims

权 利 要 求 书
1、 一种具有双层灯罩的 LED灯泡, 包括一灯罩总体 (1) , LED 芯片 (2) , 荧光粉层 (3) 及底座 (4) , 其特征在于: 所述灯罩总体
(1) 包括内层灯罩 (11) 和外层灯罩 (12) , 内层灯罩 (11) 处于外 层灯罩 (12) 的罩盖之下, LED芯片 (2) 、 内层灯罩 (11) 和外层灯 罩 (12) 从内到外依次设置, 荧光粉层 (3) 涂布在内层灯罩 (11) 靠 LED芯片 (2) 的那一面上。
2、 根据权利要求 1所述的一种具有双层灯罩的 LED灯泡, 其特征 在于: 内层灯罩 (11) 与外层灯罩 (12) 间存在间隙。
3、 根据权利要求 1所述的一种具有双层灯罩的 LED灯泡, 其特征 在于: LED芯片 (2) 与内层灯罩 (11) 间存在间隙。
4、 根据权利要求 1所述的一种具有双层灯罩的 LED灯泡, 其特征 在于: 内层灯罩 (11) 可以是平面的或是圆弧形的; 灯罩总体 (1) 的 材质可为透光的玻璃, 或是透光的塑料。
5、 根据权利要求 1所述的一种具有双层灯罩的 LED灯泡, 其特征 在于: LED芯片 (2) 及其电路板、 还有灯罩总体 (1) 安装在底座 (4) 上。
PCT/CN2011/073802 2010-06-04 2011-05-09 一种具有双层灯罩的led灯泡 WO2011150734A1 (zh)

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