WO2011149194A3 - 임프린트 장치 및 이를 이용한 임프린트 방법 - Google Patents

임프린트 장치 및 이를 이용한 임프린트 방법 Download PDF

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Publication number
WO2011149194A3
WO2011149194A3 PCT/KR2011/003192 KR2011003192W WO2011149194A3 WO 2011149194 A3 WO2011149194 A3 WO 2011149194A3 KR 2011003192 W KR2011003192 W KR 2011003192W WO 2011149194 A3 WO2011149194 A3 WO 2011149194A3
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WO
WIPO (PCT)
Prior art keywords
stamp
printed
imprinting
same
present
Prior art date
Application number
PCT/KR2011/003192
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English (en)
French (fr)
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WO2011149194A2 (ko
Inventor
이춘수
이석정
Original Assignee
에이피시스템 주식회사
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Application filed by 에이피시스템 주식회사 filed Critical 에이피시스템 주식회사
Publication of WO2011149194A2 publication Critical patent/WO2011149194A2/ko
Publication of WO2011149194A3 publication Critical patent/WO2011149194A3/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205—Particular pressure exerting means for making definite articles
    • B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
    • B29C2043/3233—Particular pressure exerting means for making definite articles pressurized gas, e.g. air exerting pressure on mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

본 발명은 임프린트 장치 및 이를 이용한 임프린트 방법에 관한 것이다. 특히, 피처리체에 나노 패턴을 균일하게 형성할 수 있는 임프린트 장치 및 이를 이용한 임프린트 방법에 관한 것이다. 본 발명의 일실시예에 따른 임프린트 장치는 피처리체를 안착시켜 위치 이동시키는 지지 유닛과, 패턴이 일면에 형성되는 스탬프를 진공 흡착하여 지지하고, 상기 스탬프의 일면이 상기 피처리체에 균일하게 눌리도록 상기 스탬프의 타면에 가스를 분사하여 밀어주는 템플레이트 유닛을 포함한다. 또한, 본 발명의 일실시예에 따른 임프린트 방법은 패턴이 있는 스탬프를 진공 흡착하는 단계와, 피처리체를 안착시켜 상기 스탬프에 근접되도록 위치 이동시키는 단계와, 상기 스탬프에 가스를 분사하여 상기 스탬프가 상기 피처리체에 밀착되도록 가압하는 단계를 포함한다.
PCT/KR2011/003192 2010-05-27 2011-04-29 임프린트 장치 및 이를 이용한 임프린트 방법 WO2011149194A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0049788 2010-05-27
KR1020100049788A KR101215990B1 (ko) 2010-05-27 2010-05-27 임프린트 장치 및 이를 이용한 임프린트 방법

Publications (2)

Publication Number Publication Date
WO2011149194A2 WO2011149194A2 (ko) 2011-12-01
WO2011149194A3 true WO2011149194A3 (ko) 2012-03-01

Family

ID=45004507

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/003192 WO2011149194A2 (ko) 2010-05-27 2011-04-29 임프린트 장치 및 이를 이용한 임프린트 방법

Country Status (2)

Country Link
KR (1) KR101215990B1 (ko)
WO (1) WO2011149194A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113885295B (zh) * 2020-07-01 2024-03-08 吉佳蓝科技股份有限公司 纳米压印用复制模制作装置
KR102237277B1 (ko) * 2020-07-01 2021-04-07 주식회사 기가레인 나노 임프린트용 레플리카 몰드 제작 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070081578A (ko) * 2006-02-13 2007-08-17 삼성전자주식회사 임프린트 장치 및 이를 이용한 임프린트 방법
KR20080040800A (ko) * 2006-11-03 2008-05-09 주식회사 에이디피엔지니어링 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
KR20080046479A (ko) * 2006-11-22 2008-05-27 주식회사 에이디피엔지니어링 임프린트 장치 및 임프린트 방법
KR20100022823A (ko) * 2008-08-20 2010-03-03 주식회사 에이디피엔지니어링 미세 패턴 임프린트 장치 및 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070081578A (ko) * 2006-02-13 2007-08-17 삼성전자주식회사 임프린트 장치 및 이를 이용한 임프린트 방법
KR20080040800A (ko) * 2006-11-03 2008-05-09 주식회사 에이디피엔지니어링 미세패턴 형성장치 및 이를 이용한 미세패턴 형성방법
KR20080046479A (ko) * 2006-11-22 2008-05-27 주식회사 에이디피엔지니어링 임프린트 장치 및 임프린트 방법
KR20100022823A (ko) * 2008-08-20 2010-03-03 주식회사 에이디피엔지니어링 미세 패턴 임프린트 장치 및 방법

Also Published As

Publication number Publication date
WO2011149194A2 (ko) 2011-12-01
KR20110130237A (ko) 2011-12-05
KR101215990B1 (ko) 2012-12-27

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