WO2011142267A1

WO2011142267A1 - Organic semiconductor film and method for manufacturing the same, and stamp for contact printing

Info

Publication number: WO2011142267A1
Application number: PCT/JP2011/060296
Authority: WO
Inventors: 串田　尚; 裕義内藤
Original assignee: 帝人株式会社
Priority date: 2010-05-12
Filing date: 2011-04-27
Publication date: 2011-11-17
Also published as: KR20130079393A; TW201205913A; US20130099215A1; EP2571044A1; CN102870202A; JP5398910B2; JPWO2011142267A1

Abstract

Disclosed is an organic semiconductor film (10) which has a value of 1 or more but less than 10 for the ratio of the charge mobility [(charge mobility of the surface side having larger charge mobility)/(charge mobility of the surface side having smaller charge mobility)] of two opposing surface sides (11, 12). In addition, the organic semiconductor film (10) has a relative X-ray reflectance peak height of 2.0 or more with respect to the peak height of an organic semiconductor film which has the same thickness and materials and is manufactured by performing spin coating on a silicon wafer. Alternatively, the organic semiconductor film (10) has a value of 2 or more for the ratio of the charge mobility [(charge mobility of the surface side having larger charge mobility)/(charge mobility of the surface side having smaller charge mobility)] of the two opposing surface sides (11, 12).

Description

ORGANIC SEMICONDUCTOR FILM, ITS MANUFACTURING METHOD, AND CONTACT PRINT STAMP

The first and second aspects of the present invention relate to a novel organic semiconductor film and a method for manufacturing the same, and an organic semiconductor device and an electric circuit having such an organic semiconductor film.

The third aspect of the present invention relates to a novel contact print stamp, in particular, a contact print stamp used for manufacturing an organic semiconductor film, and a method for manufacturing an organic semiconductor film using such a contact print stamp.

In recent years, semiconductor films have been used for various applications such as semiconductor elements represented by thin film transistors (TFTs) and solar cells.

An inorganic semiconductor film mainly used at present, especially an inorganic semiconductor film using silicon as a semiconductor material, has a high manufacturing cost because a vacuum process such as chemical vapor deposition (CVD) or sputtering is used at the time of manufacture. In addition, it is difficult to form an inorganic semiconductor film on a polymer film or the like from the viewpoint of process temperature. Furthermore, it is difficult for inorganic semiconductor films to meet low-cost requirements such as lightweight and flexible elements expected to be put to practical use in the future and RF-ID (Radio Frequency IDentification).

In order to solve the above problems, it has been proposed to use an organic semiconductor film made of an organic semiconductor material. A vacuum deposition apparatus and a coating apparatus used for manufacturing an organic semiconductor film are less expensive than a CVD apparatus and a sputtering apparatus used for manufacturing an inorganic semiconductor film. In the production of an organic semiconductor film, since the process temperature is low, the organic semiconductor film can be formed on a polymer film or paper.

Here, in the formation of the organic semiconductor film, a solution method (such as a cast method, a spin coat method, a contact print method) in which a solution containing an organic semiconductor material is applied to a substrate, a stamp, etc., and the solvent is removed. And vapor deposition methods in which an organic semiconductor material is deposited on a substrate. Of these methods, the solution method is generally known to be preferable with respect to production cost, production rate, and the like, and various studies have been conducted (Patent Documents 1 to 3, and Non-Patent Documents 1 and 2). However, stably obtaining a high-quality organic semiconductor film by a solution method has not always been sufficiently achieved.

In addition, a field effect transistor having an organic semiconductor layer having at least two or more regions with different mobility has been proposed for the purpose of providing a field effect organic transistor having a high mobility and a high on / off ratio. (Patent Document 4). However, the technique described in Patent Document 4 is to reduce the leakage current by forming regions with different mobility in the organic semiconductor layer, thereby improving the on / off ratio. It is presumed that it does not improve over the organic semiconductor layer.

JP 2007-311377 A JP 2009-212127 A JP 2008-277728 A JP 2005-32978 A

An object of the first and second aspects of the present invention is to provide a novel organic semiconductor film, a manufacturing method thereof, and an organic semiconductor device having such an organic semiconductor film.

A third object of the present invention is to provide a novel contact print stamp, particularly a contact print stamp used for manufacturing an organic semiconductor film, and a method for manufacturing an organic semiconductor film using such a contact print stamp. That is.

<< First Invention >>
When manufacturing the organic semiconductor film by the solution method, the present inventors are not in contact with the base material or the first stamp by aging the undried organic semiconductor film on the base material or the first stamp. If the charge mobility of the organic semiconductor film is improved on the surface, and if the surface energy of such a substrate or the first stamp is small, the surface of the substrate or the surface contacting the first stamp is also organic The inventors found that the charge mobility of the semiconductor film was improved, and came up with the following novel organic semiconductor film of the present invention, a method for producing the same, and an organic semiconductor device.

<1> The ratio of the charge mobility on the two opposite surface sides {(charge mobility on the surface side with high charge mobility) / (charge mobility on the surface side with low charge mobility)} is 1 or more and 10 The relative X-ray reflection peak height is 2.0 or more when the peak height of the organic semiconductor film of the same thickness and material produced by spin coating on the silicon wafer is used as a reference Organic semiconductor film.

<2> The organic semiconductor film according to <1>, wherein the value of the charge mobility ratio is 5 or less.

<3> The organic semiconductor film according to <1> or <2>, wherein the organic semiconductor film is obtained by a solution method.

<4> The organic semiconductor film according to any one of <1> to <3>, wherein the organic semiconductor film is obtained by a contact printing method.

<5> The charge mobility on the surface side where the charge mobility of the organic semiconductor film is large is 1.00 × 10 ⁻⁵ cm ² / (V · s) or more, in the above items <1> to <4> The organic-semiconductor film in any one.

<6> providing an organic semiconductor solution in which the organic semiconductor material is dissolved and / or dispersed;
Applying the organic semiconductor solution onto a substrate or a first stamp to obtain an undried organic semiconductor film;
Aging the undried organic semiconductor film on the substrate or first stamp;
And the contact angle with respect to water of the surface of the base material or the first stamp is 100 ° or more.

<7> The method according to <6>, wherein the aging is performed by holding the undried organic semiconductor film for 10 seconds or more.

<8> The method according to <6> or <7>, wherein the aging is performed by maintaining the undried organic semiconductor film in an atmosphere of less than 50 ° C.

<9> The method according to any one of <6> to <8>, further comprising a step of transferring an organic semiconductor layer aged on the first stamp.

<10> The method according to any one of <6> to <9> above, further comprising a step of drying and / or firing the organic semiconductor layer aged on the substrate or the first stamp.

<11> The method according to any one of <6> to <10> above, wherein a contact angle with respect to water of the surface of the base material or the first stamp is 105 ° or more.

<12> An organic semiconductor device having the organic semiconductor film according to any one of <1> to <5> above.

<13> The organic semiconductor device according to <12>, which is a thin film transistor.

<14> The item <13>, wherein the organic semiconductor film is obtained by a contact printing method, and the organic semiconductor device is a bottom gate / bottom contact type or top gate / bottom contact type thin film transistor. The organic semiconductor device described.

<< Second Invention >>
When manufacturing the organic semiconductor film by the solution method, the present inventors are not in contact with the base material or the first stamp by aging the undried organic semiconductor film on the base material or the first stamp. In view of this, the inventors have found that the charge mobility of the organic semiconductor film is improved, and have arrived at the following novel organic semiconductor film of the present invention, a method for producing the same, and an organic semiconductor device.

<15> The ratio of the charge mobility on the two opposite surface sides {(charge mobility on the surface side with high charge mobility) / (charge mobility on the surface side with low charge mobility)} is 2 or more An organic semiconductor film.

<16> The organic semiconductor film according to <15>, wherein the value of the charge mobility ratio is 10 or more.

<17> The organic semiconductor film according to <15> or <16>, wherein the charge mobility ratio is 150 or less.

<18> The organic semiconductor film according to any one of <15> to <17>, wherein the organic semiconductor film is obtained by a solution method.

<19> The organic semiconductor film according to any one of <15> to <18>, wherein the organic semiconductor film is obtained by a contact printing method.

<20> The above <15> to <19>, wherein the charge mobility on the surface side of the organic semiconductor film having a large charge mobility is 1.00 × 10 ⁻⁵ cm ² / (V · s) or more. The organic-semiconductor film in any one.

<21> The relative X-ray reflection peak height is 1.3 or more when the peak thickness of the organic semiconductor film of the same thickness and material produced by spin coating on a silicon wafer is used as a reference The organic semiconductor film according to any one of <15> to <20>.

<22> The item according to any one of <15> to <21>, wherein the degree of crystal orientation of the organic semiconductor material constituting the organic semiconductor film gradually changes between the two opposing surfaces. Organic semiconductor film.

<23> providing an organic semiconductor solution in which the organic semiconductor material is dissolved and / or dispersed;
Applying the organic semiconductor solution onto a substrate or a first stamp to obtain an undried organic semiconductor film;
Aging the undried organic semiconductor film on the substrate or first stamp;
A method for producing an organic semiconductor film, comprising:

<24> The method according to <23>, wherein the aging is performed by holding the undried organic semiconductor film for 10 seconds or more.

<25> The method according to <23> or <24>, wherein the aging is performed by maintaining the undried organic semiconductor film in an atmosphere of less than 50 ° C.

<26> The method according to any one of <23> to <25>, further comprising a step of transferring an organic semiconductor layer aged on the first stamp.

<27> The method according to any one of <23> to <26> above, further comprising a step of drying and / or firing the organic semiconductor layer aged on the substrate or the first stamp.

<28> The method according to any one of <23> to <27> above, wherein the contact angle of the surface of the substrate or the first stamp with respect to water is 40 ° or more.

<29> An organic semiconductor device having the organic semiconductor film according to any one of <15> to <22> above.

<30> The organic semiconductor device according to <29>, which is a thin film transistor.

<31> In the above <30>, the organic semiconductor film is obtained by a contact printing method, and the organic semiconductor device is a bottom gate / bottom contact type or top gate / bottom contact type thin film transistor. The organic semiconductor device described.

<32> An electric circuit having two or more thin film transistors according to <30> or <31> above on one surface of a circuit substrate,
In at least one of the thin film transistors, the organic semiconductor film is disposed so that a surface side of the organic semiconductor film having a large charge mobility faces the circuit base material, and the surface side of the thin film transistor is the thin film transistor. In the at least another one of the thin film transistors, the surface of the organic semiconductor film having a large charge mobility faces the opposite side of the circuit substrate, and the organic semiconductor A film is disposed, and the surface side is an active surface in the thin film transistor.
electric circuit.

The present inventors improve the charge mobility of the obtained organic semiconductor film by using a contact printing stamp having a low surface energy transfer portion and a high surface energy peripheral portion around the transfer portion. As a result, the inventors have devised a novel contact printing stamp of the third invention described below and a method for producing an organic semiconductor film using such a contact printing stamp.

<33> A transfer portion for holding the organic semiconductor film to be transferred, and a peripheral edge around the transfer portion, and a contact angle of the transfer portion with respect to water is larger than a contact angle of the peripheral portion with respect to water. Stamp for contact printing that is larger than 20 °.

<34> The stamp according to <33>, wherein a contact angle of the transfer portion with respect to water is 40 ° or more.

<35> The stamp according to <33> or <34>, wherein the transfer portion and the peripheral portion are on the same plane.

<36> The stamp according to any one of <33> to <35>, wherein the transfer portion is a recess with respect to the peripheral portion.

<37> the size of the transfer portion is 0.01μm ^² ~ 1,000,000μm ^2, the <33> - <36> stamp according to any one of Items.

<38> a step of providing an organic semiconductor solution containing a solvent and an organic semiconductor material dissolved and / or dispersed in the solvent, and the organic semiconductor solution according to any one of the above items <33> to <37> Applying to the transfer part of the stamp described in to obtain an organic semiconductor film,
A method for producing an organic semiconductor film, comprising:

According to the novel organic semiconductor film of the first aspect of the present invention, high charge mobility is provided on both the surface not in contact with the base material or the first stamp and the surface in contact with the base material or the first stamp. can do.

According to the novel organic semiconductor film of the second aspect of the present invention, a large charge mobility can be provided by using a surface having a large charge mobility as an active surface.

According to the novel contact printing stamp of the third aspect of the present invention, an organic semiconductor film having improved semiconductor characteristics, for example, the organic semiconductor films of the first and second aspects of the present invention can be manufactured.

FIG. 1 is a diagram for explaining the organic semiconductor films of the first and second aspects of the present invention. FIG. 2 is a view for explaining the organic semiconductor film manufacturing methods of the first and second aspects of the present invention. FIG. 3 is a diagram for explaining a conventional method of manufacturing an organic semiconductor film. FIG. 4 is a diagram for explaining the thin film transistors of the first and second inventions. FIG. 5 is a view for explaining a third stamp of the present invention having a transfer portion-periphery portion structure. FIG. 6 is a side sectional view of a third stamp of the present invention having a transfer part-periphery part structure.

<< Organic Semiconductor Film of First Invention >>
In the organic semiconductor film of the first aspect of the present invention, the ratio of the charge mobility on the two opposite surface sides {(the charge mobility on the surface side having a large charge mobility) / (the charge mobility on the surface side having a small charge mobility) )} Value is 1 or more and less than 10 and relative peak heights of organic semiconductor films of the same thickness and material produced by spin coating on a silicon wafer are used as a reference. Is 2.0 or more. The value of the charge mobility ratio may be, for example, 7 or less, 5 or less, or 3 or less. That is, as shown in FIG. 1, in the organic semiconductor film 10 of the first aspect of the present invention, the charge mobility on the surface side 11 in contact with the substrate 15 and the charge mobility on the opposite surface side 12 are The difference is relatively small. The charge mobility can be evaluated not only directly but also from the orientation of the surface of the organic semiconductor film, the degree of crystallinity, and the like.

According to the organic semiconductor film of the first aspect of the present invention, high charge mobility can be provided when any surface is used as an active surface.

In the organic semiconductor film according to the first aspect of the present invention, when the peak height of the organic semiconductor film of the same thickness and material produced on the silicon wafer by spin coating is used as a reference, the relative X-ray reflection peak height is 2.0 or more, 2.2 or more, 2.4 or more, or 2.5 or more. Here, the large value of the relative X-ray reflection peak height means that the degree of crystallization over the entire thickness of the organic semiconductor film is large.

In the organic semiconductor film of the first aspect of the present invention, the charge mobility on both surfaces is, for example, 1.00 × 10 ⁻⁵ cm ² / (V · s) or more and 1.00 × 10 ⁻⁴ cm ² / (V S) or more, or 1.00 × 10 ⁻³ cm ² / (V · s) or more. Here, in the present invention, the charge mobility {cm ² / (V · s)} is the charge mobility on the surface of the organic semiconductor film, and represents the ease of movement of charges that are holes or electrons. .

The organic semiconductor film of the first aspect of the present invention can have an arbitrary thickness, for example, a thickness of 1 nm to 1 μm, or 10 nm to 500 nm.

In the organic semiconductor film of the first aspect of the present invention, the organic semiconductor film may be composed of any organic semiconductor material. Examples of such organic semiconductor materials include low molecular organic semiconductor molecules such as pentacene, thiophene, perylene, and fullerene materials, polyalkylthiophene, polyphenylene vinylene, polyfluorene-thiophene copolymers, and the like. Mention may be made of molecular organic semiconductor molecules.

The organic semiconductor film of the first aspect of the present invention is not limited depending on the manufacturing method thereof, and is therefore obtained by, for example, a molecular beam evaporation method (MBE method), a vacuum evaporation method, a chemical evaporation method, a solution method, or the like. It's okay.

However, the organic semiconductor film of the organic semiconductor film according to the first aspect of the present invention can be manufactured by a solution method, for example, a casting method, a spin coating method, a printing method such as a contact printing method, a dipping method, etc. May be preferred. When the organic semiconductor film of the present invention is a film obtained by a solution method, it is distinguished from those produced by other methods by the presence of a trace amount of solvent remaining in the organic semiconductor film, the shape and physical properties of the film, etc. be able to. The organic semiconductor film of the present invention can be obtained, for example, using the method of the present invention.

<< Organic Semiconductor Film of Second Invention >>
In the organic semiconductor film of the second aspect of the present invention, the ratio of the charge mobility on the two opposite surface sides {(charge mobility on the surface side having a large charge mobility) / (charge mobility on the surface side having a small charge mobility) )} Is 2 or more, 10 or more, 20 or more, 50 or more, 80 or more, or 100 or more. Moreover, the value of this ratio may be 150 or less, 130 or less, 100 or less, or 80 or less, for example. That is, as shown in FIG. 1, in the organic semiconductor film 10 of the present invention, there is a difference between the charge mobility on the surface side 11 in contact with the base material 15 and the charge mobility on the opposite surface side 12. Relatively large. The charge mobility can be evaluated not only directly but also from the orientation of the surface of the organic semiconductor film, the degree of crystallinity, and the like.

According to the organic semiconductor film of the second aspect of the present invention, a large charge mobility can be provided by using a surface having a large charge mobility as an active surface.

In the organic semiconductor film of the second aspect of the present invention, when the peak thickness of the organic semiconductor film of the same thickness and material produced by spin coating on the silicon wafer is used as a reference, the relative X-ray reflection peak height is 1.3 or more, 1.5 or more, 1.6 or more, 1.7 or more, 1.8 or more, or 1.9 or more. Here, the large value of the relative X-ray reflection peak height means that the degree of crystallization over the entire thickness of the organic semiconductor film is large.

For the charge mobility on the surface side where the charge mobility of the organic semiconductor film of the second invention is large, the description of the organic semiconductor film of the first invention can be referred to. Moreover, the description about the organic-semiconductor film of 1st this invention can be referred about the thickness of the organic-semiconductor film of 2nd this invention, organic-semiconductor material, and a manufacturing method.

Note that the organic semiconductor film of the second aspect of the present invention is an organic semiconductor film having a large ratio of charge mobility between two opposing surface sides, that is, an organic semiconductor film having different electrical characteristics between the two opposing surface sides. Nevertheless, there can be no discontinuous surface in the thickness direction of the film. That is, in the organic semiconductor film of the second aspect of the present invention, the degree of crystal orientation of the organic semiconductor material constituting the organic semiconductor film may be gradually changed between two opposing surfaces. According to this, it is possible to prevent a problem caused by discontinuously changing the degree of crystal orientation of the organic semiconductor material between two opposing surfaces. Such an organic semiconductor film can be obtained, for example, by forming a film at a time by the method of the second present invention. On the other hand, when the manufacturing conditions of the two opposite surfaces are changed as in Patent Document 4 so that the charge mobility on the two opposing surfaces is different, before and after the change of the manufacturing conditions, It is considered that the characteristics of the semiconductor film become discontinuous.

<< First Method of Manufacturing the Organic Semiconductor Film >>
A first inventive method for producing an organic semiconductor film comprises providing an organic semiconductor solution in which an organic semiconductor material is dissolved and / or dispersed, applying the organic semiconductor solution onto a substrate or a first stamp Then, a step of obtaining an undried organic semiconductor film and a step of aging the undried organic semiconductor film on the substrate or the first stamp are included. Here, the contact angle with respect to water of the surface of the substrate or the first stamp to which the organic semiconductor solution is applied is 100 ° or more or 105 ° or more.

According to the method of the first aspect of the present invention for manufacturing an organic semiconductor film, it is possible to manufacture the organic semiconductor film of the first aspect of the present invention, that is, an organic semiconductor film having a large charge mobility on two opposite surface sides. it can.

Specifically, according to the first method of the present invention for producing an organic semiconductor film, an undried organic semiconductor film 10 is aged on a base material or a first stamp 15 as shown in FIG. The organic semiconductor material in the undried organic semiconductor film is crystallized and self-organized on the surface side 12 not in contact with the base material or the first stamp, that is, the surface side 12 exposed to the surrounding atmosphere. It can be rearranged by sex or the like.

More specifically, on the surface side 12 not in contact with the base material or the first stamp 15, the organic semiconductor material in the undried organic semiconductor film is affected by the surface of the base material or the first stamp 15. Therefore, rearrangement is possible due to the crystallinity of the organic semiconductor material itself.

Further, during this aging, the surface side 11 in contact with the base material or the first stamp 15 has a small contact angle with respect to water on the surface of the base material or the first stamp 15, that is, the base material or the first stamp 15. Since the surface energy of the surface of the first stamp 15 is small, the organic semiconductor material in the undried organic semiconductor film 10 is in contact with the substrate or the surface of the first stamp 15. Or it is hard to be influenced by the surface of the 1st stamp 15, Therefore, it can rearrange by the crystallinity etc. of organic-semiconductor material itself.

That is, in the method of the first aspect of the present invention, rearrangement can be performed on either of the two

surface sides

11 and 12 facing each other due to the crystallinity of the organic semiconductor material itself. In any case, an organic semiconductor film having a low charge mobility and a high degree of crystallization over the entire thickness can be obtained.

On the other hand, in the conventional method of manufacturing the organic semiconductor film, as shown in FIG. 3, the organic semiconductor solution is dried immediately after the organic semiconductor solution is applied onto the base material or the first stamp 15. Therefore, it is difficult to rearrange the organic semiconductor material not only on the surface side 21 in contact with the base material or the first stamp 15 but also on the surface side 22 not in contact with the base material or the first stamp 15. Become. Therefore, in the conventional method, an organic semiconductor film having a small difference in charge mobility between the two opposing surface sides 21 and 22 but a small degree of crystallization over the entire thickness has been obtained.

<< Method of Second Invention for Producing Organic Half Film >>
A second inventive method for producing an organic semiconductor film comprises providing an organic semiconductor solution in which an organic semiconductor material is dissolved and / or dispersed, applying the organic semiconductor solution onto a substrate or a first stamp Then, a step of obtaining an undried organic semiconductor film and a step of aging the undried organic semiconductor film on the substrate or the first stamp are included.

According to the method of the second aspect of the present invention for producing an organic semiconductor film, the organic semiconductor film of the second aspect of the present invention, that is, an organic semiconductor film having a large difference in charge mobility between two opposing surface sides can be produced. it can.

Specifically, according to the second method of the present invention for producing an organic semiconductor film, the undried organic semiconductor film 10 is aged on a substrate or first stamp 15 as shown in FIG. The organic semiconductor material in the undried organic semiconductor film is crystallized and self-organized on the surface side 12 not in contact with the base material or the first stamp, that is, the surface side 12 exposed to the surrounding atmosphere. It can be rearranged by sex or the like.

More specifically, during this ripening, the organic semiconductor material in the undried organic semiconductor film 10 on the surface side 11 in contact with the substrate or the first stamp 15 is the substrate or the first The rearrangement may be limited by the influence of the surface of the stamp 15, in particular the affinity for the substrate or the surface of the first stamp 15. On the other hand, the organic semiconductor material in the undried organic semiconductor film is not easily affected by the surface of the base material or the first stamp 15 on the surface side 12 not in contact with the base material or the first stamp 15. Therefore, rearrangement can be performed by the crystallinity of the organic semiconductor material itself. That is, in the second method of the present invention, an organic semiconductor film having a large difference in charge mobility between the two

surface sides

11 and 12 facing each other can be obtained.

On the other hand, in the conventional method of manufacturing the organic semiconductor film, as shown in FIG. 3, the organic semiconductor solution is dried immediately after the organic semiconductor solution is applied onto the base material or the first stamp 15. Therefore, the organic semiconductor material cannot be rearranged not only on the surface side 21 in contact with the base material or the first stamp 15 but also on the surface side 22 not in contact with the base material or the first stamp 15. Therefore, in the conventional method, an organic semiconductor film having a small difference in charge mobility between the two opposing surface sides 21 and 22 has been obtained.

<< First and Second Methods for Producing Organic Semiconductor Film-Organic Semiconductor Material and Solvent >>
For the organic semiconductor material used in the method of the present invention, the description relating to the organic semiconductor film of the present invention can be referred to.

The solvent contained in the organic semiconductor solution used in the method of the present invention may be any solvent that can dissolve and / or disperse the organic semiconductor material. Examples of such a solvent include toluene, xylene, tetralin, decalin, chloroform, monochlorobenzene, dichlorobenzene, trichlorobenzene, and combinations thereof.

<< First and Second Methods for Producing Organic Semiconductor Film-Base Material and First Stamp >>
The substrate to which the organic semiconductor solution is applied in the first and second methods of the present invention may be any substrate intended to place the organic semiconductor film thereon. Thus, for example, examples of such a substrate include an inorganic material such as a silicon wafer and glass, and an organic material such as a polymer film.

Further, the first stamp to which the organic semiconductor solution is applied by the method of the present invention is an arbitrary stamp that can form an organic semiconductor film thereon and transfer the organic semiconductor film from the organic semiconductor film to a substrate or the like. It may be a stamp, that is, a contact printing stamp for forming an organic semiconductor film. Such a first stamp can be made of, for example, polysiloxane. The first stamp may be, for example, a stamp according to the third aspect of the present invention having a transfer portion-periphery portion structure described below.

The substrate or the first stamp to which the organic semiconductor solution is applied in the method of the first aspect of the invention has a surface having a relatively large contact angle with water, for example, a contact angle with water of 100 ° or more or 105 ° or more. It has a surface. Further, the substrate or the first stamp to which the organic semiconductor solution is applied in the method of the second invention has a surface having a relatively large contact angle with water, that is, the contact angle with water, for example, 40 ° or more and 50 °. As described above, the surface may be 60 ° or more, 70 ° or more, 80 ° or more, 90 ° or more, 100 ° or more, or 105 ° or more. Thus, a relatively large contact angle of the surface of the substrate with water means that the surface is relatively lyophobic, that is, the surface energy of the surface is relatively small.

In the present invention, the contact angle with respect to water is 25.degree. C., 50 .mu.L of water is dropped on the surface for measuring the contact angle, the shape of the dropped droplet is observed from the side, and the droplet and the surface are formed. It can be determined by measuring the angle.

Thus, when the substrate or first stamp to which the organic semiconductor solution is applied in the method of the present invention has a low surface energy surface, the organic semiconductor material in the undried organic semiconductor film is the substrate or the first stamp. Even on the surface in contact with one stamp, it is hardly affected by the surface of the base material or the first stamp, and therefore can be rearranged by the crystallinity of the organic semiconductor material itself.

The base material or the first stamp having a surface with a relatively large contact angle with water can be obtained, for example, by treating the surface of the base material or the first stamp with a lyophobic material. Examples of such lyophobic materials include silane, silazane, fluorine compounds, polyimide, polyester, polyethylene, polyphenylene sulfide, polyparaxylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, and combinations thereof. it can.

<< First and Second Invention Methods for Manufacturing Organic Semiconductor Film-Application >>
In the first and second methods of the present invention for producing an organic semiconductor film, any method such as a casting method, a spin coating method, a dipping method, etc. is used in order to apply the organic semiconductor solution to the substrate or the first stamp. Can be used.

<< First and Second Invention Methods for Producing Organic Semiconductor Film-Aging >>
The aging in the first and second methods of the present invention for producing an organic semiconductor film is, for example, an undried organic semiconductor film for 10 seconds or more, 30 seconds or more, 1 minute or more, 3 minutes or more, 5 minutes or more, or It can be held for 7 minutes or longer. The aging in the method of the present invention can be performed, for example, by holding an undried organic semiconductor film in an undried state for a predetermined period before drying and / or baking.

The aging in the method of the present invention can be performed, for example, by holding an undried organic semiconductor film in an atmosphere of less than 50 ° C, less than 40 ° C, or less than 30 ° C. Here, aging the undried organic semiconductor film at a relatively low temperature suppresses drying of the organic semiconductor film, and thus rearranges the organic semiconductor material on the surface not in contact with the substrate or the first stamp. May be preferred to promote

However, conditions such as time and temperature required for aging depend on the organic semiconductor material, solvent, base material, or first stamp used, and those skilled in the art will follow these descriptions in this specification. The conditions can be determined.

In the method of the present invention for producing an organic semiconductor film, the “undried organic semiconductor film” is such that the organic semiconductor material in the organic semiconductor film can be rearranged by the crystallinity of the organic semiconductor material itself. This means that the organic semiconductor film contains a solvent.

<< First and Second Invention Methods for Producing Organic Semiconductor Film-Drying >>
The first and second inventive methods of producing an organic semiconductor film can optionally further comprise drying and / or baking the organic semiconductor layer aged on the substrate or the first stamp. This drying and baking can be performed by exposing the aged organic semiconductor layer to an atmosphere of more than 40 ° C, more than 50 ° C, more than 70 ° C, and more than 100 ° C. This drying can also be performed by removing the solvent from the organic semiconductor solution under reduced pressure.

<< First and Second Invention Methods for Producing Organic Semiconductor Film-Transfer >>
In the method of the present invention for producing an organic semiconductor film, when the organic semiconductor solution is applied and aged on the first stamp, the method of the present invention transfers the organic semiconductor layer aged on the first stamp. It may further comprise a step, for example transferring to a substrate or a second stamp.

That is, for example, in this case, the organic semiconductor film formed on the first stamp can be directly transferred onto a substrate such as a silicon wafer or a polymer film. Also, in this case, the organic semiconductor film formed on the first stamp can be transferred to the second stamp and transferred from the second stamp to the substrate.

The transfer of the organic semiconductor film from the first stamp to the base material or the second stamp can be achieved by bringing the first stamp holding the organic semiconductor film into contact with the base material or the second stamp. . Here, the transfer conditions such as the contact time, the temperature of the first stamp, and the substrate can be arbitrarily determined so that transfer is possible.

Specifically, this transfer can be performed such that the temperature of the base material or the second stamp is higher than the temperature of the first stamp. In addition, this transfer may treat the surface of the first stamp to reduce adhesion to the organic semiconductor film and / or treat the surface of the substrate or the second stamp to adhere to the organic semiconductor film. This can be achieved by increasing sex. Still further, this transfer can be achieved by a combination of the above.

The second stamp used in the method of the present invention can transfer the organic semiconductor film formed on the first stamp, and from there, the organic semiconductor film can be transferred to a substrate or the like. It may be any stamp, ie a contact print stamp. Such a second stamp can be made of, for example, polysiloxane. The transfer of the organic semiconductor film from the second stamp to the base material can be performed as described for the transfer of the organic semiconductor film from the first stamp to the base material or the second stamp.

《Organic semiconductor device》
The organic semiconductor devices of the first and second inventions each have the organic semiconductor film of the first and second inventions. In the context of the present invention, “organic semiconductor device” means a device having an organic semiconductor film, and other layers such as an electrode layer and a dielectric layer are made of an inorganic material or an organic material. It may be made.

The organic semiconductor devices of the first and second inventions may be, for example, thin film transistors having the organic semiconductor films of the first and second inventions. For example, as shown in FIG. 4, the thin film transistor of the present invention includes (a) bottom gate / top contact type (BGTC type), (b) bottom gate / bottom contact type (BGBC type), and (c) top gate / top contact. Any of a type (TGTC type) and (d) a top gate / bottom contact type (TGBC type) may be used. In these

thin film transistors

130, 140, 150 and 160 of the present invention,

source electrodes

134, 144, 154, 164,

drain electrodes

135, 145, 155, 165,

gate electrodes

131, 141, 151, 161, a

gate insulating film

132, 142, 152, 162, and

semiconductor films

133, 143, 153, 163, the source and drain electrodes and the gate electrode are insulated from each other by the gate insulating film, and the source electrode is drained from the source electrode by the voltage applied to the gate electrode. Controls the current flowing through the semiconductor film to the electrode.

When the organic semiconductor device of the first and second inventions is a thin film transistor and the organic semiconductor layer of the thin film transistor is obtained by a contact printing method, this thin film transistor is particularly a bottom contact type thin film transistor, that is, a bottom It may be a gate / bottom contact type (BGBC type) or top gate / bottom contact type (TGBC type) thin film transistor.

Here, when a bottom contact type thin film transistor is manufactured by a conventional spin coating method, there is a difference in surface energy between the metal electrode existing on the substrate and the dielectric surface, so that it is formed particularly near the electrode / dielectric interface. An alignment disorder occurs in the organic transistor. Therefore, the contact resistance between the electrode and the organic semiconductor layer tends to increase.

On the other hand, when a bottom contact type thin film transistor is manufactured by a contact printing method, an organic semiconductor layer is formed on a stamp, and then the organic semiconductor layer is transferred to a substrate having an electrode. There is no problem like the case of law. Therefore, in the bottom contact type thin film transistor, there is a great advantage in forming the organic semiconductor layer by the contact printing method.

Further, the organic semiconductor devices of the first and second inventions may be, for example, solar cells having the organic semiconductor film of the invention. This solar cell has, for example, a structure in which a p-type semiconductor and an n-type semiconductor are joined, and an organic semiconductor film of the organic semiconductor film of the present invention is used as at least one of these p-type and n-type semiconductors.

"electric circuit"
The electric circuit of the present invention is an electric circuit having two or more thin film transistors of the second present invention on one surface of a circuit substrate.

In the electric circuit of the present invention, as shown in FIG. 4, in at least one of the second

thin film transistors

130 and 140 of the second present invention on one surface of the circuit substrate 100 such as a silicon wafer or a polymer film, The

organic semiconductor films

133 and 143 are arranged so that the surface sides 133a and 143a having high charge mobility of the

organic semiconductor films

133 and 143 face the circuit substrate, and the surface sides 133a and 143a The thin film transistor 2 is an active surface, that is, a surface on which a channel for carriers is formed. That is, for example, in the electric circuit of the present invention, at least one of the second thin film transistors on one surface of the circuit substrate 100 is the bottom gate type

thin film transistors

130 and 140.

In the electric circuit of the present invention, as shown in FIG. 4, in at least another one 150, 160 of the thin film transistor of the second invention, the

organic semiconductor films

153, 163 have a large charge mobility. The

organic semiconductor films

153 and 163 are arranged so that 153a and 163a face the opposite side of the circuit substrate 100, and the

surface sides

153a and 163a are active surfaces in the thin film transistor. That is, for example, in the electric circuit of the present invention, at least one of the thin film transistors on one surface of the circuit substrate 100 is the top gate type

thin film transistors

150 and 160.

Therefore, in the electric circuit according to the present invention, when a plurality of the thin film transistors according to the second aspect of the present invention are provided, the surface side of the organic semiconductor layer serving as an active surface in each transistor is a surface side having high charge mobility. That is, in the electric circuit of the present invention, when the thin film transistor of the second present invention is provided, the organic semiconductor film can provide high charge mobility in each thin film transistor.

Such an organic semiconductor film for the electric circuit of the present invention can be obtained by using the method of the second present invention for producing the organic semiconductor film of the second present invention.

More specifically, for example, when manufacturing the thin film transistor of the second aspect of the present invention in which the surface side of the organic semiconductor film having a large charge mobility faces the circuit substrate, that is, for example, a bottom gate type thin film transistor as shown in FIG. When manufacturing 130 and 140, in the second method of the present invention for manufacturing an organic semiconductor film, after aging an undried organic semiconductor film on the first stamp, the obtained organic semiconductor film is used as a circuit. By transferring to the substrate, the surface side of the organic semiconductor film having a large charge mobility can be made to face the circuit substrate.

Further, for example, when manufacturing the thin film transistor of the second aspect of the present invention in which the surface side of the organic semiconductor film having a large charge mobility faces the opposite side of the circuit substrate, that is, for example, a top gate type thin film transistor 150 as shown in FIG. , 160 in the method of the second present invention for manufacturing an organic semiconductor film, after aging an undried organic semiconductor film on the first stamp, The surface of the organic semiconductor film having high charge mobility can be directed to the opposite side of the circuit substrate. In this case, in the second method of the present invention for producing an organic semiconductor film, an undried organic semiconductor film is aged on a circuit substrate, and the surface side having a high charge mobility of the organic semiconductor film is formed on the circuit substrate. Can be directed to the other side of the material.

<< Transfer Part-Stamp of the Present Invention having a Peripheral Part Structure >>
In the first and second methods of the present invention, as the first and second stamps, the stamp of the present invention having the transfer portion-periphery portion structure shown below can be used.

The stamp of the present invention having a transfer part-peripheral part structure has a transfer part for holding the organic semiconductor film to be transferred, and a peripheral part around the transfer part, and the contact angle of the transfer part with respect to water is: It is 20 ° or more, 30 ° or more, 40 ° or more, 50 ° or more, 60 ° or more, 70 ° or more, 80 ° or more, 90 ° or more, or 100 ° or more larger than the contact angle of the peripheral portion with water.

Here, in the stamp of the present invention having the transfer portion-peripheral portion structure, when used in the first method of the present invention for producing an organic semiconductor film, for example, the contact angle of the transfer portion with respect to water is 105 ° or more or 110 °. That's all. Further, in the stamp of the present invention having the transfer portion-peripheral portion structure, when used in the second method of the present invention for manufacturing an organic semiconductor film, for example, the contact angle of the transfer portion with respect to water is 40 ° or more, 50 ° or more. 70 ° or more, 90 ° or more, 95 ° or more, 100 ° or more, 105 ° or more, or 110 ° or more.

That is, the stamp having the transfer part-periphery structure is a contact print stamp in which the transfer part is more lyophobic than the peripheral part. Here, being lyophobic means that the surface energy is low. Therefore, a stamp having a transfer portion-periphery structure has a contact surface with a low surface energy and a large surface energy at the peripheral portion. It can be said that it is a stamp.

When an organic semiconductor film is formed from an organic semiconductor solution on a transfer part of a stamp having a transfer part-periphery part structure, comparison is made by the presence of a lyophilic peripheral part around the lyophobic transfer part. It is possible to promote the formation of the organic semiconductor film from the organic semiconductor solution on the surface of the transfer portion by holding the film of the organic semiconductor solution on the surface of the transfer portion which is not easily wet. That is, according to this stamp, the organic semiconductor film can be formed even on the surface of the transfer portion that is relatively difficult to wet.

When forming an organic semiconductor film from an organic semiconductor solution in a transfer portion of a stamp having a transfer portion-peripheral portion structure, the organic semiconductor molecules are relatively unaffected by the surface of the transfer portion on the surface in contact with the transfer portion. It can be oriented by the action between organic semiconductor molecules. That is, according to the stamp having the transfer portion-periphery portion structure, when forming the organic semiconductor film from the organic semiconductor solution, an organic semiconductor film having a large charge mobility can be obtained on the surface side in contact with the transfer portion. .

On the other hand, the transfer part of a general contact printing stamp generally improves the wettability with respect to the organic semiconductor solution thereon, thereby enabling the formation of a film of the organic semiconductor solution stably. Has been lyophilic. Therefore, when an organic semiconductor film is formed from an organic semiconductor solution on a transfer portion of a general contact print stamp, the organic semiconductor molecules are affected by the transfer portion on the surface in contact with the transfer portion, and the organic semiconductor molecules It is difficult to align due to the action between. That is, in a general stamp for contact printing, when an organic semiconductor film is formed from an organic semiconductor solution, an organic semiconductor film having a large charge mobility on the side in contact with the transfer portion cannot be obtained.

In addition, when an organic semiconductor film is formed from an organic semiconductor solution on a transfer portion of a stamp having a transfer portion-periphery portion structure, the adhesion between the obtained organic semiconductor film and the transfer portion is relatively weak, and therefore relatively sparse. The organic semiconductor film can be transferred onto the surface of the liquid substrate, that is, the surface of the substrate having a contact angle with water of 50 ° or more, for example.

In contrast, as described above, the transfer portion of the conventional contact print stamp is generally lyophilic. Therefore, when an organic semiconductor film is formed from an organic semiconductor solution on a transfer portion of a conventional contact print stamp, the adhesion between the obtained organic semiconductor film and the transfer portion is relatively strong, and therefore relatively lyophobic. It has been difficult to transfer the organic semiconductor film onto the surface of the substrate, that is, the surface of the substrate having a contact angle with water of 50 ° or more, for example.

The stamp having the transfer portion-periphery portion structure may be any contact print stamp capable of forming an organic semiconductor film thereon and transferring the organic semiconductor film to a substrate or the like. Such a first stamp can be made of, for example, polysiloxane.

When polysiloxane is used as a material for a stamp having a transfer portion-peripheral portion structure, a lyophobic polysiloxane is prepared, and the surface corresponding to the peripheral portion is made lyophilic (hydrophilic) and applied to the transfer portion. By not performing such processing on the corresponding part, a stamp having a transfer part-periphery structure can be obtained. On the other hand, a lyophilic stamp material is prepared, the surface corresponding to the transfer portion is subjected to lyophobic (hydrophobic) treatment, and such treatment is not performed on the portion corresponding to the peripheral portion. A stamp having a part-periphery structure can be obtained. Further, a stamp having a transfer portion-periphery portion structure can be obtained by preparing a stamp material, lyophilicizing the surface corresponding to the peripheral portion, and lyophobicizing the surface corresponding to the transfer portion.

Specifically, in order to obtain a lyophobic transfer portion in a stamp having a transfer portion-periphery structure, a portion corresponding to the transfer portion on the surface of the stamp can be treated with a lyophobic material. Examples of such lyophobic materials include silane, silazane, fluorine compounds, polyimide, polyester, polyethylene, polyphenylene sulfide, polyparaxylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, and combinations thereof. it can.

Further, in a stamp having a transfer portion-peripheral portion structure, in order to obtain a lyophilic peripheral portion, a portion corresponding to the peripheral portion on the surface of the stamp is treated with ozone, ultraviolet light, an electron beam, a brass or the like. In addition, it can be formed of a lyophilic material.

A stamp having a transfer-periphery structure can have any shape and size that allows formation of an organic semiconductor film suitable for the intended application. Accordingly, the transfer unit - In the stamp having a peripheral edge structure, the size of one transfer ^{^{unit, 0.01μm 2 ~ 1,000,000μm 2, 0.1μm}} 2 ~ 100,000μm 2, or 1 [mu] m ² ~ 10, It may be 000 μm ² .

In the stamp having the transfer portion-peripheral portion structure, the peripheral portion can hold the organic semiconductor solution on the transfer portion, and the organic semiconductor film formed on the transfer portion is transferred to the second stamp or the substrate. It can have any shape and structure as much as possible. Therefore, in the stamp having the transfer portion-peripheral portion structure, the transfer portion and the peripheral portion may be on the same plane, or the transfer portion may be a concave portion with respect to the peripheral portion. Further, in the stamp having the transfer portion-peripheral portion structure, the portion where the organic semiconductor film is formed while holding the organic semiconductor film forms a convex portion, and in this convex portion, the transfer portion and the peripheral peripheral portion around it are formed. You may have.

Such a stamp is, for example, as shown in FIG. The stamp 50 shown in FIG. 5 has nine transfer portions 51 corresponding to the organic semiconductor film to be transferred. Here, a peripheral edge 52 for holding the organic semiconductor film to be transferred exists around each transfer portion 51.

Specifically, as shown in FIG. 6A, in the stamp having the transfer portion-periphery portion structure, the transfer portion 51a and the peripheral portion 52a may be on the same plane. In this case, it is possible to promote the holding of the organic semiconductor solution 61 on the transfer portion 51 a by the affinity between the peripheral edge portion 52 a and the organic semiconductor solution 61.

Further, in the stamp having the transfer part-periphery part structure, as shown in FIG. 6B, the transfer part 51b may be a concave part with respect to the peripheral part 52b. In this case, along with the affinity between the peripheral portion 52b and the organic semiconductor solution 61, the peripheral portion 52b becomes a three-dimensional enclosure, thereby promoting the holding of the organic semiconductor solution 61 on the transfer portion 51b. .

Furthermore, in the stamp having the transfer part-periphery part structure, as shown in FIG. 6C, the transfer part 51c and the peripheral part 52c may be convex with respect to other parts. In this case, it is possible to promote the holding of the organic semiconductor solution 61 on the transfer part 51c by the affinity between the peripheral part 52c and the organic semiconductor solution 61, and in a form corresponding to the shapes of the transfer part 51c and the peripheral part 52c. The organic semiconductor solution 61 can be held. In this case, the portion other than the transfer portion 51c and the peripheral edge portion 52c that are convex portions, that is, the concave portions may have a large or small affinity with the organic semiconductor solution 61, but the organic semiconductor solution 61 If the affinity for the organic semiconductor solution 61 is small, the organic semiconductor solution 61 can be prevented from being held in the recess.

A method of manufacturing an organic semiconductor film with a stamp having a transfer portion-periphery portion structure includes a step of providing an organic semiconductor solution containing a solvent and an organic semiconductor material dissolved and / or dispersed in the solvent, and the organic semiconductor Applying the solution to the transfer portion of the stamp having the transfer portion-periphery structure to form an organic semiconductor film.

The present invention will be described in detail using the following examples, but the present invention is not limited thereto. The evaluation methods used in the following examples are as follows.

Water contact angle:
The water contact angle was measured with pure water at 25 ° C. using a water contact angle meter CA-X manufactured by Kyowa Interface Science.

Relative X-ray reflection peak height:
Using RINT TTR II manufactured by Rigaku, the peak height of X-ray symmetric reflection of the organic semiconductor film was measured under the conditions of an X-ray source Cu-Kα ray and a rotating counter cathode 50 kV-300 mA (15 kW). This peak height is standardized to the same thickness based on the peak height of the organic semiconductor film of the material produced by spin coating on a silicon wafer (based on Example 12 (comparative)), and then the relative height evaluated. A large value of the relative X-ray reflection peak height means that the degree of crystallization over the entire thickness of the organic semiconductor film is large.

In addition, in the organic semiconductor film of regioregular poly (3-hexylthiophene) (“P3HT”), the peak height with respect to (100) plane symmetrical reflection was measured. In the following examples, the height of the X-ray reflection peak was evaluated for the organic semiconductor film transferred once, but the same value as in the case of transfer once can be obtained for transfer twice.

Charge mobility:
The charge mobility of the organic semiconductor film was evaluated using a 4200-SCS type semiconductor evaluation apparatus manufactured by Keithley. The standard deviation of charge mobility was calculated by evaluating the characteristics of 10 or more elements.

<< Examples 1 to 13 >>
In Examples 1 to 13, a bottom gate / top contact type (BGTC type) transistor was formed.

Example 1
(Production of stamps for contact printing)
Silicone rubber (SIM-260 manufactured by Shin-Etsu Chemical Co., Ltd.) was cured into a flat plate shape, and the oligomer was removed using hexane, which was provided as a stamp material.

The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the stamp material in which the transfer portion is thus masked is subjected to UV (ultraviolet) -ozone treatment. Performed for 30 minutes. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. This UV-ozone treatment provided a lyophilic surface at the periphery.

The water contact angle of the transfer part not subjected to UV-ozone treatment was 110 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for 30 minutes was 44 °. Further, twelve transfer portions exist on the stamp, and the size of each transfer portion was 100 μm × 2 mm.

(Inking of organic semiconductors)
1 part by mass of regioregular poly (3-hexylthiophene) (“P3HT”) (sold by Aldrich, manufactured by Plextronics, Plexcore OS1100, MW = 25,000-35,000) was dissolved in 99 parts by mass of toluene. A P3HT solution as an organic semiconductor solution was obtained. This P3HT solution was spin coated (1800 rpm, 20 seconds) onto the patterned stamp material. Thereafter, the P3HT solution was aged and dried for about 10 minutes as it was, thereby forming an organic semiconductor film on the stamp.

(Silicon base)
An n-type silicon wafer with a 300 nm thermal oxide film (plane orientation <100>, specific resistance 0.05Ω) was treated with hot concentrated sulfuric acid for 30 minutes, and then several times each using pure water, acetone, toluene, and hexane. Ultrasonic cleaning was performed. Further, this silicon wafer was cleaned with a UV ozone cleaning apparatus for 30 minutes to obtain a substrate. The water contact angle with respect to the surface of the silicon wafer was 4 °.

(Transfer once)
The stamp which has an organic-semiconductor film was fixed to the roller, and the roller with a stamp was obtained. The silicon substrate was heated and held at 75 ° C., and the stamped roller was brought into contact with the silicon substrate and rotated to transfer the entire organic semiconductor film to the substrate.

(Production of thin film transistor)
Gold is vacuum-deposited by a mask vapor deposition method at a position corresponding to the transfer part of the obtained organic semiconductor film to form a source electrode and a drain electrode (L / w = 50 μm / 1.5 mm), and a silicon substrate is formed. A thin film transistor was obtained using the gate electrode and the oxide film on the surface of the silicon substrate as the gate insulating film. That is, a thin film transistor having a configuration as indicated by 130 in FIG. 4 was obtained.

The charge mobility and the X-ray reflection peak height of the thin film transistor thus obtained, that is, a thin film transistor having an active surface on the air side during film formation, were measured. The results are shown in Table 1.

(Twice transfer)
In addition, instead of manufacturing a thin film transistor having an active surface that was on the air side during film formation by a single transfer, a thin film transistor having an active surface on the surface that was on the stamp side by film transfer was fabricated.

Specifically, the organic semiconductor film was transferred onto the second stamp instead of the silicon substrate (first transfer). Thereafter, the second stamp having the organic semiconductor film transferred thereon is fixed to a roll, brought into contact with a silicon substrate heated and held at 75 ° C., and rotated to transfer the organic semiconductor film onto the substrate. (Second transcription). Here, as the second stamp, a stamp material processed in the same manner as the transfer portion of the first stamp was used. That is, the water contact angle with respect to the surface of the second stamp was made the same as the water contact angle with respect to the surface of the transfer portion of the first stamp.

The charge mobility of the thin film transistor thus obtained, that is, the thin film transistor having the active surface as the surface on the stamp side at the time of film formation was measured. The results are shown in Table 1.

<< Example 2 >>
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was applied for 2 minutes to the entire stamp, ie, both the transfer area and the peripheral area.

The water contact angle of the transfer part subjected to UV-ozone treatment for 2 minutes was 107 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for a total of 32 minutes was 40 °.

(Production of thin film transistor)
Using the stamp thus obtained, in the same manner as in Example 1, a thin film transistor was produced in which the surface that was on the air side during film formation was the active surface by single transfer. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 1.

Further, as in Example 1, a thin film transistor was produced by transferring twice. The charge mobility of the thin film transistor thus obtained, that is, the thin film transistor having the active surface as the surface on the stamp side during film formation was measured. The results are shown in Table 1.

<< Example 2A >>
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was performed for 2.5 minutes on the entire stamp, ie, both the transfer area and the peripheral area.

The water contact angle of the transfer part subjected to UV-ozone treatment for 2 minutes was 105 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for a total of 32 minutes was 39 °.

Example 3
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was performed for 3 minutes on the entire stamp, ie, both the transfer area and the peripheral area.

The water contact angle of the transfer part subjected to UV-ozone treatment for 3 minutes was 104 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for a total of 33 minutes was 37 °.

Example 4
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was performed for 5 minutes on the entire stamp, ie, both the transferred area and the peripheral area.

The water contact angle of the transfer portion subjected to UV-ozone treatment for 5 minutes was 99 °, and the water contact angle of the peripheral portion subjected to UV-ozone treatment for a total of 35 minutes was 33 °.

Example 5
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was applied for 10 minutes to the entire stamp, ie, both the transfer area and the peripheral area.

The water contact angle of the transfer part subjected to UV-ozone treatment for 10 minutes was 95 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for 40 minutes in total was 21 °.

(Production of thin film transistor)
Using the stamp thus obtained, in the same manner as in Example 1, a thin film transistor was produced in which the surface that was on the air side during film formation was the active surface by single transfer. The obtained thin film transistor was measured for charge mobility and X-ray reflection peak height. The results are shown in Table 1.

Example 6
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. Next, the mask was removed, and the entire stamp, that is, both the transfer portion and the peripheral portion, was subjected to UV-ozone treatment for 20 minutes.

The water contact angle of the transfer part subjected to UV-ozone treatment for 20 minutes was 72 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for 50 minutes in total was 4 °.

(Production of thin film transistor)
Using the stamp thus obtained, in the same manner as in Example 1, a thin film transistor was produced in which the surface that was on the air side during film formation was the active surface by a single transfer. The obtained thin film transistor was measured for charge mobility and X-ray reflection peak height. The results are shown in Table 1.

Example 7
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. Next, the mask was removed, and the entire stamp, that is, both the transfer portion and the peripheral portion, was subjected to UV-ozone treatment for 30 minutes.

The water contact angle of the transfer part subjected to UV-ozone treatment for 30 minutes was 44 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for 60 minutes in total was 4 °.

In addition, as in Example 1, an attempt was made to produce a thin film transistor in which the surface that was on the stamp side at the time of film formation was the active surface by transferring twice. However, in this example, transfer from the above stamp to the second stamp could not be performed well, and thus a thin film transistor having the active surface as the surface that was on the stamp side during film formation could not be produced.

Example 8
(Production of stamps for contact printing)
The stamp material is cut into 20 mm square, a mask corresponding to the transfer portion is placed on the stamp material, the transfer portion is masked, and the UV-ozone treatment is applied to the stamp material in which the transfer portion is masked for 30 minutes. went. That is, the transfer portion was not subjected to UV-ozone treatment, and the peripheral portion was subjected to UV-ozone treatment. The mask was then removed and UV-ozone treatment was performed over 45 minutes on the entire stamp, ie, both the transfer and periphery.

The water contact angle of the transfer part subjected to UV-ozone treatment for 45 minutes was 8 °, and the water contact angle of the peripheral part subjected to UV-ozone treatment for 75 minutes in total was 4 °.

Example 9
Using the stamp obtained in the same manner as in Example 1, a thin film transistor having a surface that was on the air side at the time of film formation as an active surface was produced by a single transfer in the same manner as in Example 1. However, in this example, an F8T2 solution obtained as follows was used as the organic semiconductor solution instead of the P3HT solution. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 1.

Here, the F8T2 solution as the organic semiconductor solution is poly [(9,9′-dioctylfluoryl-2,7-diyl) -co-bithiophene] (“F8T2”) (manufactured by American Dice Source) 0.5 mass Part was obtained by dissolving in 99.5 parts by mass of toluene.

Further, as in Example 1, a thin film transistor was produced by transferring twice. The charge mobility of the thin film transistor thus obtained, that is, the thin film transistor having the active surface as the surface on the stamp side during film formation was measured. However, no significant semiconductor characteristics were observed in the organic semiconductor layer obtained in this example. The results are shown in Table 1.

<< Example 10 (Comparison) >>
In the same manner as in Example 1 except that the P3HT solution was applied to the stamp by spin coating and immediately transferred to the substrate without aging, the surface that was on the air side at the time of film formation by the single transfer was defined as the active surface. A thin film transistor was manufactured. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 1.

Example 11 (Comparison)
The stamp material was cut into 20 mm square and used as it was without any surface treatment. Here, the water contact angle on the surface of the stamp was 110 °. The stamp surface was spin-coated with a P3HT solution in the same manner as in Example 1. However, since the entire stamp surface is lyophobic, the organic semiconductor film cannot be stably formed on the stamp surface.

Example 12 (Comparison)
The P3HT solution used in Example 1 was spin-coated (1800 rpm, 20 seconds) directly on the silicon substrate used in Example 1. That is, a semiconductor film was formed directly on the substrate without using a stamp.

A source electrode and a drain electrode were formed on the obtained organic semiconductor film in the same manner as in Example 1 to obtain a thin film transistor.

The charge mobility and the X-ray reflection peak height of the thin film transistor thus obtained, that is, the thin film transistor that was not subjected to the aging process in a state where the active surface of the organic semiconductor layer faced air was measured. The results are shown in Table 1.

Example 13 (Comparison)
The F8T2 solution used in Example 9 was spin coated (1800 rpm, 20 seconds) directly on the silicon substrate used in Example 1. That is, a semiconductor film was formed directly on the substrate without using a stamp.

The charge mobility of the thin film transistor thus obtained, that is, the thin film transistor not subjected to the aging process in a state where the active surface of the organic semiconductor layer faces air was measured. However, no significant semiconductor characteristics were observed in the organic semiconductor layer obtained in this example. The results are shown in Table 1.

As understood from Examples 1 to 10 in Table 1, with the stamp having the transfer portion-periphery portion structure, the organic semiconductor film could be stably formed even on the lyophobic surface. In particular, as understood from Examples 1 to 3 in Table 1, in the stamp having the transfer portion-periphery portion structure, the organic semiconductor film is stably formed even on a lyophobic surface having a water contact angle exceeding 100 ° C. I was able to. In contrast, as understood from Example 11 (comparison) in Table 1, it is difficult to stably form an organic semiconductor film on a lyophobic surface with a stamp having no transfer portion-periphery portion structure. Met.

In the organic semiconductor films of Examples 1 to 9 where the aging was performed, the ratio of the charge mobility on the two opposite surface sides {(charge mobility on the surface side with large charge mobility) / (surface mobility on the surface side with small charge mobility) The value of charge mobility)} was larger than that of Example 10 (comparison) in which aging was not performed. Further, the value of this ratio is as the lyophobic property in the transfer portion of the stamp used for film formation becomes smaller, that is, as the transfer portion of the stamp used for film formation becomes lyophilic. It became bigger.

In the organic semiconductor films of Examples 1 and 2A, the ratio of the charge mobility on the two opposite surface sides {(the charge mobility on the surface side with a large charge mobility) / (the charge mobility on the surface side with a small charge mobility) } Was smaller than those of Examples 3 to 6, and the relative X-ray peak height representing the degree of crystallization over the entire thickness of the organic semiconductor film was large. This is thought to be due to the progress of crystallization of the organic semiconductor material on both the surface side that was in contact with the surface of the substrate or the first stamp during film formation and the surface side opposite to the surface side. It is done.

The relative X-ray peak height, which represents the degree of crystallization over the entire thickness of the organic semiconductor film, becomes smaller as the water contact angle of the transfer portion becomes smaller (or as the surface of the transfer portion becomes lyophilic), that is, in the transfer portion. The surface energy decreased as the surface energy increased. This is when the water contact angle of the transfer portion is small, as shown by the relatively low charge mobility on the surface side that was in contact with the substrate or the surface of the first stamp 15 during film formation. When the surface of the transfer portion is lyophilic, that is, when the surface energy is large, it is considered that the degree of crystallization of the organic semiconductor material is small on this surface side.

As can be seen from Table 1, in the organic semiconductor film of Example 10 (comparative) that was not aged, the ratio of the charge mobility on the two opposite surface sides was small, but the total thickness of the organic semiconductor film The relative X-ray peak height representing the degree of crystallization over the range was also small. In addition, regarding the organic semiconductor film of Example 10 (comparative), the value of the organic semiconductor film of Example 1 is temporarily used as the value of the charge mobility of the surface that was on the stamp side at the time of film formation. It is based on the understanding that the change in charge mobility due to the presence or absence of aging is relatively small on the surface that was on the stamp side during film formation.

<< Examples 14 and 15 >>
In Examples 14 and 15, a bottom gate / top contact type (BGTC type) transistor was formed.

Example 14
In the same manner as in Example 1 except that the silicon substrate was treated with hexamethyldisilazane (HMDS) and the substrate temperature was set to 130 ° C. in the transfer step to facilitate the transfer, air was transferred during film formation by a single transfer. A thin film transistor having an active surface on the side surface was prepared. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 2. Here, the water contact angle with respect to the surface of the silicon substrate treated with hexamethyldisilazane (HMDS) was 75 °.

The base material was treated with hexamethyldisilazane (HMDS) as follows.

A 20 mM toluene solution of HMDS was prepared. The above silicon substrate was immersed in the obtained HMDS solution and held for 7 days. After soaking, the substrate was washed with toluene and ethanol and ultrasonically washed in ethanol for 30 minutes. All the steps so far were performed in a glove box in which the humidity was controlled to 3% or less. Thereafter, the substrate was washed with pure water and heat treated at 100 ° C. for 5 minutes to obtain an HMDS treated substrate.

Example 15
In the same manner as in Example 1 except that the silicon substrate was treated with octadecyltrichlorosilane (OTS) and the substrate temperature was set to 130 ° C. in the transfer step to promote transfer, the air side was formed by film transfer once. A thin film transistor having an active surface as a surface suitable for the above was fabricated. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 2. Here, the water contact angle with respect to the surface of the silicon substrate treated with octadecyltrichlorosilane (OTS) was 108 °.

The base material was treated with octadecyltrichlorosilane as follows.

A 20 mM toluene solution of OTS was prepared. The above silicon substrate was immersed in the obtained OTS solution and held for 7 days. After soaking, the substrate was washed with toluene and ethanol and ultrasonically washed in ethanol for 30 minutes. All the steps so far were performed in a glove box in which the humidity was controlled to 3% or less. Thereafter, the substrate was washed with pure water and heat-treated at 100 ° C. for 5 minutes to obtain an OTS-treated substrate.

Table 2 also shows the results of the organic semiconductor film of Example 1 for comparison. As can be seen from Table 2, even when the organic semiconductor film is aged on the stamp and then transferred to the base material, the surface energy of the base material depends on the charge mobility of the organic semiconductor film. Is understood to have an impact. That is, from Table 2, the organic semiconductor film having a high charge mobility has a low surface energy even when the organic semiconductor film is aged on the stamp and then transferred to the base material. It is understood that it is preferred to obtain a membrane.

<< Examples 16 to 27 >>
In Examples 16 to 21, a bottom gate / top contact type (BGTC type) transistor was produced, and in Examples 22 to 27, a bottom gate / bottom contact type (BGBC type) transistor was produced.

Example 16
Example 1 (Air side / stamp side ratio: 2.8, relative X-ray peak intensity, except that 0.5 part by weight of P3HT was dissolved in 99.5 parts by weight of toluene to obtain a P3HT solution as an organic semiconductor solution. : 2.5), a bottom gate / top contact type (BGTC type) thin film transistor was produced.

The charge mobility of the thin film transistor thus obtained, that is, the thin film transistor having the active side as the surface on the air side during film formation was measured. The results are shown in Table 3.

Example 17
Except that the silicon substrate was treated with hexamethyldisilazane (HMDS) as in Example 14 and that the transfer was accelerated by setting the substrate temperature to 130 ° C. in the transfer step, as in Example 16, A BGTC-type thin film transistor was produced in which the active surface was the surface that was on the air side during film formation. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 3.

Example 18
As in Example 16, except that the silicon substrate was treated with octadecyltrichlorosilane (OTS) as in Example 15 and that the transfer was accelerated by setting the substrate temperature to 130 ° C. in the transfer step. A BGTC-type thin film transistor was produced in which the active surface was the surface that was on the air side when the film was formed. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 3.

Example 19 (Comparison)
The P3HT solution used in Example 16 was directly spin-coated (1800 rpm, 20 seconds) on the silicon substrate used in Example 16 to obtain a BGTC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

Example 20 (Comparison)
The P3HT solution used in Example 16 was spin-coated (1800 rpm, 20 seconds) directly on the HMDS-treated silicon substrate used in Example 17 to obtain a BGTC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

<< Example 21 (comparison) >>
The P3HT solution used in Example 16 was directly spin-coated (1800 rpm, 20 seconds) on the OTS-treated silicon substrate used in Example 18 to obtain a BGTC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

<< Example 22 >>
0.5 parts by mass of P3HT was dissolved in 99.5 parts by mass of toluene to obtain a P3HT solution as an organic semiconductor solution, and gold was vacuum deposited on the silicon wafer substrate after UV ozone cleaning by a mask deposition method. Then, Example 1 (air side surface / stamp side surface) except that a source electrode and a drain electrode (L / w = 50 μm / 1.5 mm) were formed to form a bottom gate / bottom contact type (BGBC type) thin film transistor. Ratio: 2.8, relative X-ray peak intensity: 2.5), and a thin film transistor was prepared. That is, a thin film transistor was formed in the same manner as in Example 6 except that a silicon wafer substrate having a gold electrode was used to form a BGBC type thin film transistor.

Example 23
In the same manner as in Example 22, except that the silicon substrate was treated with hexamethyldisilazane (HMDS) as in Example 14 and that the transfer was accelerated by setting the substrate temperature to 130 ° C. in the transfer step. A BGBC type thin film transistor was produced in which the active surface was the surface that was on the air side when the film was formed. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 3.

Example 24
As in Example 15, except that the silicon substrate was treated with octadecyltrichlorosilane (OTS) and that the transfer was accelerated by setting the substrate temperature to 130 ° C. in the transfer step. A BGBC type thin film transistor was produced in which the active surface was the surface that was on the air side when the film was formed. The charge mobility of the obtained thin film transistor was measured. The results are shown in Table 3.

Example 25
A thin film transistor was prepared in the same manner as in Example 22 except that the contact print stamp was prepared by the method of Example 5 (ratio of air side surface / stamp side surface: 86, relative X-ray peak intensity: 1.9). Table 3 shows the charge mobility of the obtained thin film transistor.

Example 26
A thin film transistor was prepared in the same manner as in Example 23 except that the contact print stamp was prepared by the method of Example 5. Table 3 shows the charge mobility of the obtained thin film transistor.

Example 27
A thin film transistor was produced in the same manner as in Example 24 except that the contact print stamp was produced by the method of Example 5. Table 3 shows the charge mobility of the obtained thin film transistor.

Example 28 (Comparison)
The P3HT solution used in Example 22 was directly spin-coated (1800 rpm, 20 seconds) on the silicon substrate used in Example 22 to obtain a BGBC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

Example 28 (Comparison)
The P3HT solution used in Example 22 was directly spin-coated (1800 rpm, 20 seconds) on the HMDS-treated silicon substrate used in Example 23 to obtain a BGBC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

Example 30 (Comparison)
The P3HT solution used in Example 22 was directly spin-coated (1800 rpm, 20 seconds) on the OTS-treated silicon substrate used in Example 24 to obtain a BGBC type thin film transistor. Table 3 shows the charge mobility of the obtained thin film transistor.

As can be seen from Table 3, the thin film transistors of Examples 16 to 18 and Examples 22 to 27 manufactured by the contact printing method are compared with the corresponding thin film transistors of Examples 19 to 21 and Examples 28 to 30 manufactured by the spin coat method. And has a good charge mobility.

In Table 3, “ratio to spin coating” indicates the ratio between the charge mobility of the thin film transistor manufactured by the contact printing method and the mobility of the thin film transistor manufactured by the corresponding spin coating method. As understood from this ratio, the rate of increase in mobility due to the use of the contact printing method in the production of the bottom gate / bottom contact type (BGBC type) thin film transistor is the bottom gate / top contact type (BGTC type). This is larger than that in the case of using the contact printing method in producing the thin film transistor. That is, it is understood that it is particularly preferable to use a contact printing method in the production of a BGBC type thin film transistor.

10, 133, 143, 153, 163 Organic semiconductor film of the present invention 11 Organic semiconductor film of the present invention (surface side in contact with substrate)
12 Organic semiconductor film of the present invention (opposite surface side in contact with substrate)
15, 100 Base material 20 Conventional organic semiconductor film 21 Conventional organic semiconductor film (surface side in contact with base material)
22 Conventional organic semiconductor film (opposite surface side in contact with substrate)
130, 140, 150, 160 Thin film transistor of the

present invention

131, 141, 151, 161

Gate electrode

132, 142, 152, 162

Gate insulating film

133, 143, 153, 163

Semiconductor film

134, 144, 154, 164

Source electrode

135, 145, 155, 165 Drain electrode 50 Stamp having transfer part-

periphery structure

51, 51a, 51b,

51c Transfer part

52, 52a, 52b, 52c Peripheral part 61 Organic semiconductor solution

Claims

The ratio of the charge mobility on the two opposite surface sides {(charge mobility on the surface side with high charge mobility) / (charge mobility on the surface side with low charge mobility)} is 1 or more and less than 10 And an organic semiconductor having a relative X-ray reflection peak height of 2.0 or more when the peak height of an organic semiconductor film of the same thickness and material produced by spin coating on a silicon wafer is used as a reference film.
The organic semiconductor film according to claim 1, wherein the value of the charge mobility ratio is 5 or less.
The organic semiconductor film according to claim 1 or 2, wherein the organic semiconductor film is obtained by a solution method.
The organic semiconductor film according to any one of claims 1 to 3, wherein the organic semiconductor film is obtained by a contact printing method.
5. The organic semiconductor according to claim 1, wherein the charge mobility on the surface side of the organic semiconductor film having a large charge mobility is 1.00 × 10 −5 cm 2 / (V · s) or more. film.
Providing an organic semiconductor solution in which the organic semiconductor material is dissolved and / or dispersed;
Applying the organic semiconductor solution onto a substrate or a first stamp to obtain an undried organic semiconductor film;
Aging the undried organic semiconductor film on the substrate or first stamp;
And an angle of contact with water on the surface of the base material or the first stamp is 100 ° or more.
The method according to claim 6, wherein the aging is performed by holding the undried organic semiconductor film for 10 seconds or more.
The method according to claim 6 or 7, wherein the aging is performed by maintaining the undried organic semiconductor film in an atmosphere of less than 50 ° C.
The method according to any one of claims 6 to 8, further comprising a step of transferring an organic semiconductor layer aged on the first stamp.
The method according to any one of claims 6 to 9, further comprising a step of drying and / or firing the organic semiconductor layer aged on the substrate or the first stamp.
The method according to any one of claims 6 to 10, wherein a contact angle with respect to water of the surface of the substrate or the first stamp is 105 ° or more.
An organic semiconductor device comprising the organic semiconductor film according to any one of claims 1 to 5.
The organic semiconductor device according to claim 12, which is a thin film transistor.
The organic semiconductor device according to claim 13, wherein the organic semiconductor film is obtained by a contact printing method, and the organic semiconductor device is a bottom gate / bottom contact type or top gate / bottom contact type thin film transistor. .
The ratio of the charge mobility on the two surface sides opposite to each other {(the charge mobility on the surface side having a large charge mobility) / (the charge mobility on the surface side having a small charge mobility)} is 2 or more. Semiconductor film.
The organic semiconductor film according to claim 15, wherein a value of the charge mobility ratio is 10 or more.
The organic semiconductor film according to claim 15 or 16, wherein a value of the charge mobility ratio is 150 or less.
The organic semiconductor film according to any one of claims 15 to 17, wherein the organic semiconductor film is obtained by a solution method.
The organic semiconductor film according to any one of claims 15 to 18, wherein the organic semiconductor film is obtained by a contact printing method.
The organic semiconductor according to any one of claims 15 to 19, wherein the charge mobility on the surface side of the organic semiconductor film having a large charge mobility is 1.00 × 10 -5 cm 2 / (V · s) or more. film.
The relative X-ray reflection peak height is 1.3 or more when the peak height of an organic semiconductor film of the same thickness and material produced by spin coating on a silicon wafer is used as a reference. The organic semiconductor film according to any one of 20.
The organic semiconductor film according to any one of claims 15 to 21, wherein the degree of crystal orientation of the organic semiconductor material constituting the organic semiconductor film gradually changes between the two opposing surfaces.
Providing an organic semiconductor solution in which the organic semiconductor material is dissolved and / or dispersed;
Applying the organic semiconductor solution onto a substrate or a first stamp to obtain an undried organic semiconductor film;
Aging the undried organic semiconductor film on the substrate or first stamp;
A method for producing an organic semiconductor film, comprising:
The method according to claim 23, wherein the aging is performed by holding the undried organic semiconductor film for 10 seconds or more.
The method according to claim 23 or 24, wherein the aging is performed by maintaining the undried organic semiconductor film in an atmosphere of less than 50 ° C.
The method according to any one of claims 23 to 25, further comprising a step of transferring an organic semiconductor layer aged on the first stamp.
The method according to any one of claims 23 to 26, further comprising the step of drying and / or baking the organic semiconductor layer aged on the substrate or the first stamp.
The method according to any one of claims 23 to 27, wherein a contact angle of water on the surface of the base material or the first stamp is 40 ° or more.
An organic semiconductor device having the organic semiconductor film according to any one of claims 15 to 22.
The organic-semiconductor device of Claim 29 which is a thin-film transistor.
The organic semiconductor device according to claim 30, wherein the organic semiconductor film is obtained by a contact printing method, and the organic semiconductor device is a bottom gate / bottom contact type or top gate / bottom contact type thin film transistor. .
An electric circuit having two or more thin film transistors according to claim 30 or 31 on one surface of a circuit substrate,
In at least one of the thin film transistors, the organic semiconductor film is disposed such that a surface side of the organic semiconductor film having a large charge mobility faces the circuit substrate, and the surface side of the thin film transistor is the thin film transistor. In the organic semiconductor, the surface side of the organic semiconductor film having a large charge mobility faces the opposite side of the circuit substrate in at least another one of the thin film transistors. A film is disposed, and the surface side is an active surface in the thin film transistor.
electric circuit.
A transfer part for holding the organic semiconductor film to be transferred, and a peripheral part around the transfer part, and the contact angle of the transfer part with water is 20 ° or more than the contact angle with water of the peripheral part A large stamp for contact printing.
34. The stamp according to claim 33, wherein a contact angle of the transfer portion with respect to water is 40 ° or more.
35. The stamp according to claim 33 or 34, wherein the transfer portion and the peripheral portion are on the same plane.
The stamp according to any one of claims 33 to 35, wherein the transfer portion is a recess with respect to the peripheral portion.
The size of the transfer portion is 0.01μm 2 ~ 1,000,000μm 2, the stamp according to any one of claims 33-36.
A step of providing an organic semiconductor solution containing a solvent and an organic semiconductor material dissolved and / or dispersed in the solvent, and the transfer of the stamp as claimed in any of claims 33 to 37. Applying to the part to obtain an organic semiconductor film,
A method for producing an organic semiconductor film, comprising: