WO2011131164A1 - Optische vorrichtung und verfahren zur positionierung eines optischen elements über einem bildaufnahmeelement - Google Patents
Optische vorrichtung und verfahren zur positionierung eines optischen elements über einem bildaufnahmeelement Download PDFInfo
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- WO2011131164A1 WO2011131164A1 PCT/DE2011/000355 DE2011000355W WO2011131164A1 WO 2011131164 A1 WO2011131164 A1 WO 2011131164A1 DE 2011000355 W DE2011000355 W DE 2011000355W WO 2011131164 A1 WO2011131164 A1 WO 2011131164A1
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- optical
- optical element
- holding device
- image pickup
- image
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- 230000003287 optical effect Effects 0.000 title claims abstract description 175
- 238000000034 method Methods 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000006059 cover glass Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 4
- 230000005670 electromagnetic radiation Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the invention relates to an optical device, for example a camera module, and to a method for the production thereof, wherein an optical element is positioned via an image-receiving element, for example a picture chip.
- Intelligent driver assistance systems in motor vehicles often use a camera system as environment sensor, for example, to detect a variety of objects around the vehicle.
- the camera system is usually located behind the windshield of the vehicle and looks through it. Examples include vehicle cameras for detecting lane markings, night vision cameras or stereo cameras as optical distance sensors. In order to simultaneously perform different functions with only one camera, it may be necessary to insert into the optical path, i. in the beam path of the in the
- the invention is therefore based on the object of specifying an optical device and a method for the production thereof, wherein a clear and robust positioning of an optical element to an image-receiving element is produced with the lowest possible manufacturing and adjustment costs.
- An essential idea of the invention is to minimize possible tolerances in the positioning of an optical element via an image pickup element in such a way that an active adjustment can be dispensed with.
- the invention is based essentially on the basic idea of arranging a holding device for the optical element in the optical device, which comprises one or more stop edges, with respect to which the optical element and the image receiving element are aligned.
- the optical element and the image-receiving element can be positioned, for example, against the same or an edge of the holding device produced in a common method.
- the inventive method relates to the production of an optical device comprising at least one image pickup element and at least one optical element.
- the image pickup element may be an image chip or an image sensor, e.g. a CMOS or CCD image sensor.
- the image recording element preferably has a surface that is sensitive to electromagnetic radiation, with sensitive sensor units or pixels lying above and / or adjacent to one another for converting incidental optical radiation into electrical signals.
- CMOS and CCD image sensors have a two-dimensional (pixel) array of photosensitive photodiodes, i. a two-dimensional grid of pixel rows or pixel columns.
- the optical element is preferably arranged in the entire cross section of the beam path, the radiation incident on the sensitive surface of the image pickup element.
- the optical element in this case comprises at least two partial regions which have different optical properties, wherein the at least two partial regions, when the optical element is arranged in the optical path, with respect to the optical axis of the optical
- the optical properties of the at least two subareas of the optical element were preferably adjusted during production thereof such that at least two different distance ranges with sufficient image sharpness, in particular on separate regions, are simultaneously arranged on the sensitive surface of the image recording element by arranging the optical element in the beam path
- the simultaneous imaging of at least two different distance regions on the sensitive surface of the image recording element results in a division of the entire sensitive surface into at least two separate functional areas, eg for the simultaneous monitoring of two distance ranges by means of the device according to the invention.
- the optical element has at least one separating edge between the at least two partial regions.
- the at least one separating edge is aligned parallel to the pixel lines of the image recording element so that the number of pixel lines lying in the transition regions between the at least two functional regions of the image pickup element and thus can not be used for image processing purposes , as small as possible.
- the parallel alignment of the at least one separating edge of the optical element to the pixel or the chip lines of the image recording element takes place via a special holding device.
- the holding device can also serve to arrange the optical element at a certain distance from the image receiving element in the direction of the optical axis of the optical device and to position the optical element in one or more spatial directions perpendicular to the optical axis of the optical device.
- the holding device is preferably arranged as an additional component in the optical device and may be configured as a frame which is arranged around the image receiving element around. If the image-receiving element is applied to a printed circuit board and / or carrier plate within the optical device, the holding device may also be used e.g. around the image pickup element around on the conductor or carrier plate are arranged.
- the holding device comprises at least a first stop edge.
- the first stop edge preferably serves for aligning the image pickup element, for example by positioning or applying an outer edge of the image pickup element to the stop edge of the holding device. For aligning the optical element with the image pickup element, i. to
- the optical element can either be prepositioned in the holding device and / or aligned against a second stop edge of the holding device.
- the optical element is a cover glass.
- the cover glass is preferably formed with at least two, in arrangements in the optical device adjacent to the optical axis and in particular plane-parallel portions, wherein the at least two portions of the cover glass have a different material thickness in the direction of the optical axis of the optical device, so that it is in particular, the cover glass is a stepped cover glass.
- the increment between the at least two subregions corresponds in this case to the separating edge of the optical element.
- the image-receiving element is arranged in the holding device and the optical element is aligned in a later method step against at least one stop edge of the holding device.
- the optical element is arranged in the holding device and the image-receiving element is aligned in a later method step against at least one stop edge of the holding device.
- the optical element and the image pickup element are aligned against the same stop edge of the holding device. In this case, therefore, corresponds to the first stop edge, against which the image pickup element is aligned or positioned, the second stop edge, against which the optical element is aligned or positioned.
- the image recording element is arranged on a printed circuit board, for example a flex printed circuit board.
- the holding device can be arranged around the image receiving element and, for example, likewise on the printed circuit board.
- the holding device is designed with a support surface which is aligned perpendicular to the optical axis of the optical device.
- the image pickup element can be arranged on the support surface and aligned or positioned against at least one stop edge of the holding device 5.
- a printed circuit board is arranged on the side of the supporting surface opposite the image receiving element.
- An electrical ⁇ connection or contact between the printed circuit board and image receiving element is preferably carried out by means of bonds or wire bonds, which are guided through at least one breakthrough in the support surface.
- FIG. 1 an optical device is shown, as it is known from the prior art.
- the optical device comprises an image pickup element 2 with a for
- the image-receiving element 2 is arranged on a substrate, which is in this case a printed circuit board 4. Above the image pickup element 2, an optical element 5 is further arranged.
- the optical element 5 is designed with two subregions 11 and 12 which lie next to one another perpendicular to the optical axis 9 and whose optical properties are such during production
- optical element 5 In the case of the optical element 5 in FIG. 1, this is a stepped cover glass with two plane-parallel partial regions 11 and 12, which are adjacent to one another perpendicular to the optical axis 9, with different
- the partial regions 11 and 12 are delimited from one another by a separating edge 10, in this case in the form of the increment between the different material thicknesses of the two partial regions 11 and 12.
- the separating edge 10 of the optical element 5 must be very precisely opposite the sensitive surface 3 of the image-receiving element 2 be sufficient, for example, to achieve a desired division ratio of the sensitive surface 3 of the image pickup element 2. In this case, parallelism of the separating edge 10 to the chip rows or pixel rows on the sensitive surface 3 is particularly important.
- At least two different distance ranges can be imaged simultaneously on the sensitive surface 3 of the image pickup element 2 with sufficient image sharpness, resulting in a division of the entire sensitive surface 3 into separate functional regions 13 and 14 results.
- a close range in or in front of the motor vehicle can be monitored, eg the windshield of the motor vehicle for rain and / or dirt detection.
- a remote area can be monitored at the same time, for example for traffic sign and / or lane recognition and / or for the detection of other road users.
- the arrangement and alignment of an optical element 5 over an image pickup element 2 according to FIG. 1, in particular with a spacer 6 and by means of adhesive 7 and sealing means 8, proves to be very complex and requires additional equipment or a precise alignment of the optical element 5 active adjustment.
- FIG. 2 shows an example of a device 1 which can be produced by means of the method according to the invention.
- the optical device 1 from FIG. 2 comprises an image recording element 2 with a sensitive surface 3.
- the image recording element 2 is arranged on a printed circuit board 4, and is electrically connected to the printed circuit board 4 by means of wire bonds 15.
- the optical element 5 comprises two subregions 11 and 12, which are delimited from one another by a separating edge 10.
- the sensitive surface 3 of the image pickup element 2 is divided into two separate functional regions 13 and 14, whereby, for example, two different removal regions can be imaged simultaneously on the sensitive surface 3 with sufficient image sharpness.
- Sufficient image sharpness is preferably to be understood as an image sharpness which is sufficiently accurate for further image processing purposes.
- the arrangement or the alignment of the optical element 5 takes place above the picture-taking element 2 by means of a special holding device 16.
- the orientation of the optical element 5 comprises at least one of the following measures:
- the holding device 16 is designed as a frame which is arranged on the printed circuit board 4 around the picture-taking element 2 and comprises a first stop edge 17 against which the picture-taking element 2 is aligned or positioned.
- the optical element 5 is then aligned against the second stop edge 18.
- the second stop edge 18 is the same stop edge 17, against which the picture frame element 2 has also been aligned.
- the separating edge 10 of the optical element 5 is also configured with a predefined orientation to the outer edge of the optical element 5, for example by a manufacturing method according to FIG described method or by means of the holding device 16 a clear and accurate alignment of the optical element 5 to the image pickup element 2 and to its sensitive surface 3 are produced.
- On an active adjustment i. to an alignment of the optical element 5 with actively operated image pickup element 2, can thus be dispensed with.
- all measures enumerated above for aligning the optical element 5 can take place simultaneously by the holding device 16.
- edges 17 and 18 produced against the same or in a common method can minimize manufacturing tolerances become.
- the picture space element 2 can be arranged on the printed circuit board 4.
- the Garvomchtung 16 can be arranged on the circuit board and positioned with the first stop edge 17 against an outer edge of the Jardinaumahmeelements 2 become.
- the optical element 5 can either already be arranged on the holding device 16 or can only be arranged on the holding devices 16 in a later step and positioned against a second stop edge 18.
- FIG. 3 shows, by way of example, a method for producing an optical element 5 with defined orientation of a separating edge 10 with respect to an outer edge 19 of the optical element 5 by means of an auxiliary device 20. Glass plates with a step are typically produced by joining two individual elements 21 and 22.
- Fig. 3 shows an auxiliary device 20, which allows the two individual elements 21 and 22 to align very accurately against each other.
- FIG. 4 shows a preferred embodiment of the method according to the invention in which the optical element 5 is already pre-positioned in the holding device 16. This can be done according to Figure 4 with an auxiliary device 20 for accurate positioning of the separating edge 10 of the optical element relative to the frame edge 17. By the arrows in Fig. 4, the force for positioning against the stop is shown.
- a device or a method corresponding to FIG. 5a and FIG. 5b can be used for pre-positioning of the optical element 5 in the holding device 16 and for aligning the frame edge 17 with the separating edge 10 of the optical element 5.
- an auxiliary device 20 and an additional element 23 can be used, by means of which the distance between the separating edge 10 and the stop edge 17 is set.
- the shoulder in the stop edge 17 of the holding device 16 and the stepped configuration of the auxiliary device 20 makes it possible to deduct the additional element 23 after the positioning of the optical element 5 in the holding device. It is essential that the paragraph or the edge is discontinued in the holding device 16 upwards, so that in the relieved case, the additional element 23 can be tilted slightly according to Figure 5b and then withdrawn.
- Fig. 6 shows another example of an optical device 1 which can be manufactured by means of the method according to the invention.
- the optical device 1 is constructed in large parts in accordance with the description of FIG.
- the optical element 5 in FIG. 6 has already been pre-positioned in the holding device 16 before the holding device 16 on the printed circuit board 4 is aligned with the stop edge 17 against an outer edge of the image receiving element 2.
- the pre-positioning of the optical element 5 may be effected, for example, by means of a method corresponding to FIG. 4 or corresponding to FIGS. 5 a and 5 b.
- Fig. 7 shows another example of an optical device 1 which can be manufactured by the method according to the invention.
- the optical device of Fig. 7 is constructed in large parts corresponding to the devices 1 of Figures 2 and 6.
- the holding device in FIG. 7 is designed with a bearing surface 24 that is aligned perpendicular to the optical axis 9.
- the image pickup element 2 is arranged on the support surface 24.
- the image-receiving element 2 was aligned in the manufacture of the optical device 1 against a first stop edge 17, the optical element 5 against a second stop edge 18th
- FIGS. 8a to 8d show various embodiments of the method according to the invention for the exact alignment of the separating edge 10 of an optical element 5 with respect to the pixel or chip lines of an image recording element 2.
- the holding device 16 is in each case formed with a bearing surface 24 on which the image recording element 2 is arranged.
- an optical element 5 is arranged in the optical device 1, which is formed with two shoulders 26, which are aligned very accurately with respect to each other.
- One of the paragraphs 26 corresponds to the Trenn beau 10 of the optical element 5, which divides the sensitive surface 3 of the image pickup element 2 into two separate functional areas 13 and 14.
- the second of the two paragraphs 26 is positioned against the same stop edge 17 as the image pickup element 2, so that an exact alignment of the separation edge 10 to the pixel rows of the image pickup element 2 is achieved.
- Fig. 8b the alignment of the image pickup element 2 takes place against a first stop edge 17 of the holding device 16.
- the alignment of the optical element. 5 takes place against a second stop edge 18, which is aligned very precisely with respect to the first stop edge 17.
- FIG. 8c shows a variant in which the separating edge 10 of the optical element 5 is aligned very precisely with respect to the outer edge of the optical element 5 shown on the left in FIG. 8d.
- the left outer edge of the optical element 5 is thereby positioned against the same stop edge 17 of the holding device 16, against which the image receiving element 2 is aligned.
- FIG. 9 shows an optical device in which a printed circuit board 4 is arranged under a support plate 27. Imaging element 2 is arranged on support plate 27. The contact between image pickup element 2 and circuit board 4 via bonds 15, which are passed through corresponding openings 25 in the support plate 27. In the construction shown in FIG. 9, it must be ensured that the optical element 5 does not touch the image recording element 2 or its sensitive surface 3. For this purpose, a spacer 28 is required.
- Fig. 10a to 10c the support surface for the image pickup element 2 in relation to the support surface for the optical element 5 is pulled down or set down.
- the deep-drawing of the bearing surface for the image-receiving element 2 can take place, for example, in the same manufacturing process in which the openings 25 or the recesses for the bonds 15 are produced.
- An additional spacer 28 as in Fig. 9 is not required in this case.
- the construction described is illustrated by way of example in FIG. 10a in plan view and in FIGS. 10b and 10c in sectional views.
- the support plate on which the image pickup element 2 and the optical element 5 in Figures 10a to 10c can serve in particular as a holding device 16 for the inventive method or a device 1 according to the invention.
- the structure of an optical device 1 shown in FIGS. 10a to 10c may have the disadvantage that, in the case of a very thin printed circuit board 4, the deeper area of the carrier plate or of the holding device 16 protrudes downwards over the printed circuit board 4. This can lead to difficulties, for example, when loading the printed circuit board 4. In order to avoid such difficulties it is proposed e.g. a structure with a support plate or holding device 16 according to FIG. 1 1 or FIG. 12 to use.
- the support plate or the holding device 16 is designed as a stamped sheet metal part, with a wave-shaped shoulder 29 which defines an inner volume 30 in which the image pickup element 2 is arranged.
- the support plate or the holding device 16 is formed with a flat lower surface on which the circuit board 14 is arranged.
- the support plate or the holding device 16 in FIG. 12 is also configured on the side opposite the printed circuit board 4 with a shoulder 31 which serves as a support surface for the optical element 5 and which ensures that the optical element 5 is at the required distance from the image receiving element 2 is positioned.
- the shoulder 31 can be injection-molded onto the carrier plate or the holding device 16 in a manufacturing process.
- FIGS. 1 in the case of the proposed design variants for an optical device 1, FIGS.
- the structure is very stable in a Schmaufiiahmeelement 2, as shown in the figures, only two sides of contacts or contact pads, very stable. In principle, however, the design variants described above are also possible with image pickup elements 2 whose contacts are arranged circumferentially.
- the above-described optical devices 1 and the above-described methods for producing an optical device 1, in particular their different embodiments, can preferably be used for the production of cameras or camera systems, for example for use in motor vehicles.
- FIGS. 13 and 14 Possible embodiments of cameras or camera systems in which optical devices 1 according to the preceding descriptions are used are shown by way of example in FIGS. 13 and 14.
- additional elements such as a lens 32 comprising one or more lenses 34 are arranged in the camera systems and connected by means of adhesive 33 with the optical devices 1 according to the invention.
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims
Priority Applications (1)
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DE112011100181.9T DE112011100181B4 (de) | 2010-04-21 | 2011-03-30 | Positionierung eines optischen Elements über einem Bildaufnahmeelement |
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DE102010015555.1 | 2010-04-21 | ||
DE102010015555 | 2010-04-21 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013102820A1 (de) * | 2013-03-19 | 2014-09-25 | Conti Temic Microelectronic Gmbh | Stereokameramodul sowie Verfahren zur Herstellung |
DE102013217577A1 (de) * | 2013-09-04 | 2015-03-05 | Conti Temic Microelectronic Gmbh | Kamerasystem für ein Fahrzeug |
EP2942937A1 (de) | 2014-05-07 | 2015-11-11 | Autoliv Development AB | Kameramodul für ein Kraftfahrzeug und Verfahren zur Montage eines Kameramoduls |
EP3291529A1 (de) | 2016-09-02 | 2018-03-07 | Autoliv Development AB | Kameramodul für ein kraftfahrzeug und verfahren zur herstellung eines kameramoduls |
EP3783429A1 (de) | 2019-08-21 | 2021-02-24 | Veoneer Sweden AB | Verfahren und vorrichtung zur erstellung eines kameramoduls für ein kraftfahrzeug |
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WO1996021140A1 (en) * | 1994-12-30 | 1996-07-11 | Honeywell Inc. | Fabry-perot micro filter-detector |
EP0948059A1 (de) * | 1998-02-05 | 1999-10-06 | Asulab S.A. | Positionierungsmittel in einem mikroelektronischen Bauelement und Bildsensor mit Verwendung dieses Bauelements |
US20050098472A1 (en) * | 2003-11-08 | 2005-05-12 | Lutz Rissing | Optoelectronic component assembly |
DE102007057037A1 (de) * | 2007-11-27 | 2009-05-28 | Robert Bosch Gmbh | Sensorelement für spektroskopische oder optische Messungen und Verfahren zu dessen Herstellung |
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2011
- 2011-03-30 WO PCT/DE2011/000355 patent/WO2011131164A1/de active Application Filing
- 2011-03-30 DE DE112011100181.9T patent/DE112011100181B4/de active Active
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DE102007057037A1 (de) * | 2007-11-27 | 2009-05-28 | Robert Bosch Gmbh | Sensorelement für spektroskopische oder optische Messungen und Verfahren zu dessen Herstellung |
Cited By (6)
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DE102013102820A1 (de) * | 2013-03-19 | 2014-09-25 | Conti Temic Microelectronic Gmbh | Stereokameramodul sowie Verfahren zur Herstellung |
DE102013217577A1 (de) * | 2013-09-04 | 2015-03-05 | Conti Temic Microelectronic Gmbh | Kamerasystem für ein Fahrzeug |
EP2942937A1 (de) | 2014-05-07 | 2015-11-11 | Autoliv Development AB | Kameramodul für ein Kraftfahrzeug und Verfahren zur Montage eines Kameramoduls |
US10602034B2 (en) | 2014-05-07 | 2020-03-24 | Veoneer Sweden Ab | Camera module for a motor vehicle and method of mounting a camera module |
EP3291529A1 (de) | 2016-09-02 | 2018-03-07 | Autoliv Development AB | Kameramodul für ein kraftfahrzeug und verfahren zur herstellung eines kameramoduls |
EP3783429A1 (de) | 2019-08-21 | 2021-02-24 | Veoneer Sweden AB | Verfahren und vorrichtung zur erstellung eines kameramoduls für ein kraftfahrzeug |
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DE112011100181B4 (de) | 2022-09-29 |
DE112011100181A5 (de) | 2012-10-04 |
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