WO2011122120A1

WO2011122120A1 - Wiring line, display device, and television receiver

Info

Publication number: WO2011122120A1
Application number: PCT/JP2011/052708
Authority: WO
Inventors: 達朗黒田
Original assignee: シャープ株式会社
Priority date: 2010-03-31
Filing date: 2011-02-09
Publication date: 2011-10-06

Abstract

Disclosed are: a wiring line which can prevent the ejection of an electromagnetic wave to outsiders; and a display device and a television receiver, each of which is equipped with the wiring line. Specifically disclosed is a wiring line (70) for connecting a substrate, which can be connected to a control substrate (30) and a driver substrate (60). The wiring line (70) is characterized by comprising: a flexible substrate (71) through which a high-frequency signal output from the control substrate (30) travels; an aluminum sheet (74) which is so arranged as to cover the flexible substrate (71) and can block an electromagnetic wave radiated from the flexible substrate (71); and a PET sheet (73) which is intercalated between the flexible substrate (71) and the aluminum sheet (74).

Description

Wiring, display device, TV receiver

The present invention relates to wiring, a display device, and a television receiver.

Display devices including a display panel (for example, a liquid crystal panel) are used for electronic devices such as televisions, mobile phones, and computers. Such a display device includes electronic components such as a drive substrate for driving the display panel and a control substrate for controlling the drive of the display panel, and each substrate is electrically connected via a wiring (for example, a flexible substrate). What is connected to is known (for example, Patent Document 1 below).

JP 2007-86162 A

(Problems to be solved by the invention)
From the wiring for connecting the electronic components as described above, an electromagnetic wave is generated along with the transmission of the signal and affects other electronic devices (so-called electromagnetic interference (EMI)). Concerned.

The present invention has been completed based on the above situation, and an object thereof is to provide a wiring capable of suppressing a situation in which electromagnetic waves are emitted to the outside. It is another object of the present invention to provide a display device and a television receiver provided with such wiring.

(Means for solving the problem)
In order to solve the above problems, the wiring of the present invention is a wiring connected to an electronic component, and is arranged so as to cover the conductive wire, a conductive wire through which a high-frequency signal output from the electronic component flows, It includes a shielding sheet capable of shielding electromagnetic waves radiated from the conductive wire, and an insulating sheet interposed between the conductive wire and the shielding sheet.

In the present invention, by providing the shielding sheet, it is possible to suppress a situation where electromagnetic waves radiated from the conductive wire are emitted to the outside of the wiring. Thereby, the situation where the electromagnetic waves emitted to the outside affect other electronic devices can be suppressed. Furthermore, since the insulating sheet is interposed between the conductive wire and the shielding sheet, the contact between the conductive wire and the shielding sheet can be suppressed. Thereby, the situation where the conductive wire and the shielding sheet are electrically connected to change the impedance of the conductive wire can be suppressed, and the high-frequency signal can be transmitted more reliably. In other words, in the wiring of the present invention, while the electromagnetic wave can be shielded by the shielding member, the impedance change of the conductive wire, which is a concern, can be suppressed by providing the shielding sheet, and overall high electrical reliability can be obtained. .

In the above-described configuration, the conductive wire is a flexible wiring, and the insulating sheet includes a plurality of insulating sheet pieces arranged in the longitudinal direction of the wiring with gaps therebetween, and the wiring includes the insulating wire. The sheet can be bent in the longitudinal direction in the gap.

If the insulating sheet is composed of a plurality of sheet pieces and is arranged through a gap, the gap between the sheet pieces in the wiring can be bent regardless of the material of the insulating sheet. That is, compared to the case where the insulating sheet is formed of an integral part (one sheet), the wiring can be easily bent and the wiring can be easily handled. Such a configuration is particularly suitable when the insulating sheet is made of a hard material that is difficult to bend.

Further, a fillet portion or a chamfered portion may be formed at the edge portion of the insulating sheet piece. If it is set as the structure which forms a fillet part and a chamfering part, when the edge part of a sheet piece contact | abuts another sheet | seat, the situation which damages this can be suppressed.

Further, the insulating sheet can have a thick part and a thin part. In a thin part, it becomes easier to bend | fold than a thick part, and it becomes easier to bend a wiring.

Further, the conductive wire is a flexible wiring, and the shielding sheet is configured by arranging a plurality of shielding sheet pieces in a longitudinal direction of the wiring via gaps, and the wiring is formed of the shielding sheet. The gap can be bent in the longitudinal direction.

With such a configuration, it is easier to bend the wiring and to handle the wiring, as compared with the case where the shielding sheet is configured as an integral part. Such a configuration is particularly suitable when the shielding sheet is made of a hard material that is difficult to bend.

Further, the shielding sheet is arranged so as to surround the periphery of the conductive wire, and one end and the other end of the shielding sheet are bonded in an overlapped state.

By surrounding the periphery of the conductive wire with the shielding sheet, it is possible to more reliably suppress the situation where electromagnetic waves radiated from the conductive wire are emitted to the outside. Moreover, the situation where a shielding sheet peels can be suppressed by adhere | attaching the one end part and other end part of a shielding sheet.

Further, it may be provided with an electromagnetic wave absorbing sheet that is disposed so as to cover the conductive wire and can absorb electromagnetic waves radiated from the conductive wire.

With such a configuration, electromagnetic waves radiated from the conductive wire can be absorbed. Thereby, it can suppress more reliably the situation where electromagnetic waves are radiate | emitted outside with the electromagnetic wave shielding effect by a shielding sheet.

The insulating sheet may be interposed between the conductive wire and the electromagnetic wave absorbing sheet. If it does in this way, it can control that a conductive wire and an electromagnetic wave absorption sheet contact. As a result, it is possible to suppress a situation in which the conductive wire and the electromagnetic wave absorbing sheet are electrically connected to change the impedance of the conductive wire, and a high-frequency signal can be transmitted more reliably.

In addition, the conductive wire is a flexible wiring, and the electromagnetic wave absorbing sheet is configured such that a plurality of electromagnetic wave absorbing sheet pieces are arranged in the longitudinal direction of the wiring via gaps, respectively. It can be made to be bendable in the longitudinal direction in the gap of the absorbent sheet.

With such a configuration, it is easier to bend the wiring and to handle the wiring, compared to the case where the electromagnetic wave absorbing sheet is configured as an integral part.

Further, a fillet portion or a chamfered portion may be formed on the edge portion of the electromagnetic wave absorbing sheet piece. If it is set as the structure which forms a fillet part and a chamfering part, when the edge part of a sheet piece contact | abuts another sheet | seat, the situation which damages this can be suppressed.

Further, at least one of the shielding sheet, the insulating sheet, and the electromagnetic wave absorbing sheet is formed with a groove portion extending in a direction intersecting with a longitudinal direction of the sheet,
The said wiring shall be bendable in the longitudinal direction in the said groove part of the said sheet | seat. With such a configuration, it is easy to bend the wiring in the groove, and the wiring can be easily handled.

An example of the shielding sheet is an aluminum sheet.

As the insulating sheet, an insulating synthetic resin sheet can be exemplified.

As the synthetic resin sheet, a PET sheet can be exemplified.

The synthetic resin sheet can be made of silicone rubber.

Next, in order to solve the above problems, a display device of the present invention includes a display panel capable of displaying an image, a drive substrate that transmits a drive signal for driving the display panel to the display panel, A control board that transmits a control signal for controlling driving of the display panel to the drive board; and a wiring that connects the drive board and the control board, and the wiring is configured by the wiring described above. It is characterized by being.

Further, the shielding sheet can be electrically connected to the ground of the control board or the driving board. By connecting the shielding sheet to the ground, electrostatic shielding can be performed by the shielding sheet, and electromagnetic waves can be shielded more reliably.

Further, a chassis supporting the display panel may be provided, and the shielding sheet may be attached to the chassis via an insulating member.

By attaching the shielding sheet to the chassis via an insulating member, it is possible to suppress the (electrically) contact between the shielding sheet and the chassis. Thereby, the situation which a shielding sheet and a chassis contact and the electric potential of a shielding sheet changes can be suppressed, and electromagnetic waves can be shielded more reliably.

Also, a liquid crystal panel can be exemplified as the display panel. Such a display device can be applied as a liquid crystal display device to various uses, for example, a desktop screen of a television or a personal computer, and is particularly suitable for a large screen.

Next, in order to solve the above-described problem, a television receiver according to the present invention includes the display device.

(The invention's effect)
ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the wiring which can suppress the situation where electromagnetic waves are radiate | emitted outside. In addition, a display device and a television receiver including such wiring can be provided.

The disassembled perspective view which shows schematic structure of the television receiver which concerns on Embodiment 1 of this invention. The disassembled perspective view which shows schematic structure of the liquid crystal display device with which the television receiver of FIG. 1 is provided. Sectional drawing which shows the cross-sectional structure along the short side direction of a liquid crystal display device. The top view which shows the wiring for board | substrate connection connected to the control board and the driver board | substrate. Sectional drawing which shows the board | substrate connection wiring of FIG. 4 (The figure cut | disconnected by the AA line of FIG. 4). The disassembled perspective view which shows the wiring for board | substrate connection. Sectional drawing which shows the wiring for board | substrate connection which concerns on Embodiment 2 of this invention. Sectional drawing which shows the board | substrate connection wiring of FIG. 7 (the figure cut | disconnected by the BB line of FIG. 7). Sectional drawing which shows the board | substrate connection wiring which concerns on Embodiment 3 of this invention. Sectional drawing which shows the wiring for board | substrate connection which concerns on Embodiment 4 of this invention. Sectional drawing which shows the wiring for board | substrate connection which concerns on Embodiment 5 of this invention. Sectional drawing which shows the wiring for board | substrate connection which concerns on Embodiment 6 of this invention. Sectional drawing which shows the wiring for board | substrate connection which concerns on Embodiment 7 of this invention.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a television receiver TV including the liquid crystal display device 10 is illustrated. In the following description, the upper side shown in FIG. 3 is the front side, and the lower side is the back side. As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, television broadcasting, and the like. A tuner T for receiving and a stand S are provided.

As shown in FIG. 2, the liquid crystal display device 10 (display device) includes a liquid crystal panel 11 (display panel) and a backlight device 12 that is an external light source, and these are integrally held by a bezel 13 or the like. It is like that. In the present embodiment, the liquid crystal display device 10 has a horizontally long rectangular shape as a whole, and is used in a vertically placed state, that is, in a form in which the panel surface 11c of the liquid crystal panel 11 is substantially parallel to the vertical direction (see FIG. 1).

Next, the liquid crystal panel 11 and the backlight device 12 constituting the liquid crystal display device 10 will be described (see FIGS. 2 and 3). The backlight device 12 is a so-called direct-type backlight device, and a light source (here, as a high-pressure discharge tube) is provided directly below the back surface of the panel surface 11c (that is, the display surface) of the liquid crystal panel 11 along the panel surface 11c. A plurality of cathode tubes 17 are used).

Further, the backlight device 12 includes a substantially box-shaped chassis 14 having an opening 14b on the upper surface side, and an optical member 15 (a diffusion plate 15a and an optical sheet 15b) attached so as to cover the opening 14b of the chassis 14. And a frame 16 for holding the optical member 15 on the chassis 14.

Further, in the chassis 14, there are a cold cathode tube 17, a lamp clip 18 (not shown in FIG. 3) for attaching the cold cathode tube 17 to the chassis 14, and a lamp holder that supports the end of the cold cathode tube 17. 19 and a holder 20 that collectively covers the ends of the cold cathode tube 17 group and the lamp holder 19. In the backlight device 12, the diffusion plate 15 a side is a light emission side from the cold cathode tube 17.

The chassis 14 is made of metal sheet metal and has conductivity. The chassis 14 is formed in a shallow substantially box shape including a rectangular bottom plate portion 14a and a side plate rising from its long side. The side plate on the long side of the chassis 14 has a shape that rises outward from the bottom plate portion 14a. The liquid crystal panel 11 is attached in a state of being substantially parallel to the bottom plate portion 14 a of the chassis 14.

The light reflection sheet 21 is disposed on the chassis 14 on the side opposite to the light emission side of the cold cathode tube 17 (the inner surface side of the bottom plate portion 14a of the chassis 14). The light reflecting sheet 21 is made of synthetic resin, and the surface thereof is white with excellent light reflectivity. As shown in FIG. 3, the light reflecting sheet 21 is laid so as to cover almost the entire area along the inner surface of the chassis 14. ing. The light reflecting sheet 21 can reflect the light emitted from the cold cathode tube 17 and reaching the light reflecting sheet 21 to the optical member 15 side.

The cold-cathode tube 17 has an elongated tubular shape, and the length direction (axial direction) thereof coincides with the long side direction of the chassis 14 and a large number of the cold-cathode tubes 17 are arranged in parallel with each other in the chassis 14. It is accommodated (see FIG. 2). The cold-cathode tube 17 is held by a synthetic resin lamp clip 18 having a white color, so that a slight gap is provided between the cold-cathode tube 17 and the chassis 14 (light reflecting sheet 21).

The end of each cold cathode tube 17 is fitted into a lamp holder 19, and a holder 20 is attached so as to cover the lamp holder 19. The holder 20 is made of a synthetic resin having a white color, and has a long and narrow box shape extending along the short side direction of the chassis 14 (see FIG. 2). The holder 20 has a stepped surface on which the diffusion plate 15a can be placed.

A diffusion plate 15 a and an optical sheet 15 b are disposed on the opening 14 b side of the chassis 14. The diffusion plate 15a is formed by dispersing and mixing light scattering particles in a plate member made of synthetic resin, and has a function of diffusing linear light emitted from the cold cathode tube 17 serving as a linear light source. As described above, the short side edge of the diffusion plate 15a is placed on the stepped surface of the holder 20, and the long side edge is placed on the edge of the side plate of the chassis 14 (see FIG. 3).

The optical sheet 15b disposed on the diffusion plate 15a is a laminate of a diffusion sheet, a lens sheet, and a reflective polarizing plate in order from the diffusion plate 15a side. The optical sheet 15b is emitted from the cold cathode tube 17 and passes through the diffusion plate 15a. It has a function of converting the light that has passed through into planar light. A frame 16 is installed on the upper surface side of the peripheral edge of the optical sheet 15b, and the liquid crystal panel 11 is disposed so as to be sandwiched between the frame 16 and the bezel 13. In other words, the liquid crystal panel 11 is supported by the chassis 14.

Subsequently, the liquid crystal panel 11 will be described. The liquid crystal panel 11 is attached so as to be substantially parallel to the bottom plate portion 14a of the chassis 14, and receives light emitted from the cold cathode tube 17 from the back side and displays an image on the panel surface 11c. . As shown in FIG. 3, the liquid crystal panel 11 is sealed between a pair of transparent (translucent)

glass substrates

41, 42 having a horizontally long rectangular shape, and both

substrates

41, 42. And a liquid crystal layer 43 whose optical characteristics change accordingly. The two

substrates

41 and 42 face each other and are bonded together with a predetermined gap (interval) therebetween, and the liquid crystal layer 43 sandwiched between the gaps is surrounded by a sealant and is in a liquid-tight state. Is held.

Both the

substrates

41 and 42 have the front side (front side, display side) as the CF substrate 41 and the back side (back side) as the array substrate 42. The array substrate 42 has TFTs and pixel electrodes (not shown) as switching elements on the inner surface side of the transparent (translucent) glass substrate (the liquid crystal layer 43 side and the surface facing the CF substrate 41). Are provided side by side. Around these TFTs and pixel electrodes, gate wirings and source wirings are arranged in a grid pattern. Of these, the pixel electrode is connected to the drain electrode of the TFT, the source wiring is connected to the source electrode of the TFT, and the gate wiring is connected to the gate electrode of the TFT. The pixel electrode is made of a transparent electrode such as ITO (Indium Tin Oxide) or ZnO (Zinc Oxide).

Of the array substrate 42, a portion where the pixel electrode is arranged is a display region (active region), and an outer peripheral portion (frame portion) outside thereof is a non-display region. On one long side and short side of the outer peripheral portion of the array substrate 42, as shown in FIG. 2, the end portion of each wiring (gate wiring and source wiring) has flexibility in the form of a thin film. One end of the LCD driver 50 is connected.

Ten LCD drivers 50 are arranged in a row at a predetermined interval on the lower side 11a in the vertical direction of the liquid crystal panel 11 in the vertically placed state, and six LCD drivers 50 are arranged in a similar manner on the left side 11b of the liquid crystal panel 11. Has been. The LCD driver 50 is configured such that a conductive path is printed on a thin film 51 and a driver 52 such as an LSI chip is mounted. The driver 52 has a predetermined thickness and partially protrudes from the surface of the LCD driver 50. As the LCD driver 50, a so-called SOF (System On Film) or TCP (Tape Carrier Package) is used.

A driver substrate 60 (drive substrate) that transmits a drive signal for driving the liquid crystal panel 11 is connected to an end of the LCD driver 50 opposite to the end connected to the liquid crystal panel 11. Yes. The LCD driver 50 is pressure-bonded to the array substrate 42 and the driver substrate 60 via an anisotropic conductive adhesive (ACF).

A control board 30 for controlling the driving of the liquid crystal panel 11 is provided on the surface of the chassis 14 opposite to the side where the cold cathode tubes 17 and the light reflecting sheet 21 are disposed (the outer surface of the bottom plate portion 14a of the chassis 14). Is attached.

The driver board 60 is connected to the control board 30 via a board connection wiring 70 described later. As a result, a drive signal is transmitted based on the control signal supplied from the control board 30, and the drive signal is supplied to each wiring (gate wiring and source wiring) of the liquid crystal panel 11 via the LCD driver 50 (display). Panel drive).

The driver board 60 has an elongated rectangular plate shape, and electronic parts such as capacitors and resistors are mounted on a synthetic resin board, and a conductive path is printed, and an end of the conductive path (driver board 60). The end of the LCD driver 50 is connected to one long side edge). Further, on the back surface of the driver board 60, the control board 30 is provided at the end opposite to the side to which the LCD driver 50 is connected, here, at one end of the other long side edge of the driver board 60. A driver board side connector 61 that is electrically connected to the control board side connector 33 is formed.

In the present embodiment, the driver board-side connector 61 is provided at the end on the near side of the two driver boards 60 arranged side by side, whereby the driver board-side connector 61 is connected. The size of the previous control board 30 can be made as small as possible. Of the driver boards 60, the one arranged on the vertical lower side (long side) 11a side in the liquid crystal panel 11 is the source driver board 60S, and the one arranged on the left side (short side) 11b side in the liquid crystal panel 11. The gate driver substrate 60G is used.

The source driver substrate 60S has its long side direction aligned with the direction in which the vertical lower side 11a of the liquid crystal panel 11 extends, and a predetermined interval (interval smaller than the length of the LCD driver 50) between the vertical direction lower side 11a. Two sheets are arranged at positions spaced apart from each other. Each source driver substrate 60S is connected to five LCD drivers 50 connected to the end of the source wiring and extending in the vertical direction from the liquid crystal panel 11, and a source for driving the liquid crystal panel 11 via the LCD driver 50. A signal is supplied to the liquid crystal panel 11.

The long side direction of the gate driver substrate 60G coincides with the extending direction of the left side 11b of the liquid crystal panel 11, and a predetermined interval (an interval smaller than the length of the LCD driver 50) is provided between the gate driver substrate 60G and the left side 11b. Two sheets are arranged at spaced apart positions. Each gate driver substrate 60G is connected to three LCD drivers 50 that are connected to the ends of the gate wiring and extend from the liquid crystal panel 11 in the horizontal direction, and a gate for driving the liquid crystal panel 11 via the LCD driver 50. A signal is supplied to the liquid crystal panel 11.

On the other hand, the CF substrate 41 disposed facing the array substrate 42 is provided with a counter electrode (not shown) facing the pixel electrode on the array substrate 42 side, and a color filter (not shown) at a position corresponding to each pixel. (Not shown) are provided side by side. The color filter is configured such that three colors of R (red), G (green), and B (blue) are alternately arranged. The CF substrate 41 has a size slightly smaller than the array substrate 42 so that a portion of the array substrate 42 connected to the LCD driver 50 is exposed. In addition,

polarizing plates

48a and 48b that are integrated with the front and back surfaces are disposed on the outer surface side (the side opposite to the liquid crystal layer 43) of both the

substrates

41 and 42, respectively (see FIG. 3).

The control board 30 is attached to the outer surface side (the side opposite to the side where the cold cathode tubes 17 are arranged) of the bottom plate portion 14a of the chassis 14 as described above. The control board 30 has a function of transmitting a control signal for controlling the driving of the liquid crystal panel 11 to the driver board 60. The control board 30 has a conductive path printed on a synthetic resin plate and a control circuit 32 made of an LSI chip or the like (see FIG. 4, not shown in FIG. 3). Two control board-side connectors 33 that are electrically connected to the conductive paths are provided at the end of the back surface of the control board 30.

As shown in FIG. 4, a ground pattern 39 is formed on the surface (back surface) of the control board 30 on which the control circuit 32 and the like are mounted. In addition, the formation location of the ground pattern 39 is not limited to this. Alternatively, the ground pattern 39 may be strengthened by forming a ground pattern on almost the entire surface of the control substrate 30 and electrically connecting the ground pattern 39 to the back surface side through a through hole.

Next, in the present embodiment, a board connection wiring 70 (wiring) for connecting the control board 30 (electronic component) and the driver board 60 (electronic component) will be described with reference to FIGS. FIG. 4 is a diagram showing the control board 30 and the driver board 60 (60S) in a state of being connected by the board connection wiring 70. As shown in FIG. As shown in FIG. 4 or FIG. 6, the board connection wiring 70 has a long plate shape, and is arranged outside the chassis 14 in a state of being bent in a substantially L shape. As shown in FIG. 5, the substrate connection wiring 70 includes a flexible substrate 71 (flexible wiring, conductive wire), two electromagnetic wave absorbing sheets 72, two PET sheets 73 (insulating sheets), and one sheet. An aluminum sheet 74 (shielding sheet) is provided.

The flexible substrate 71, the electromagnetic wave absorbing sheet 72, and the PET sheet 73 are each formed in a longitudinal shape and are laminated in a state in which the longitudinal directions are matched. Specifically, each electromagnetic wave absorbing sheet 72 is disposed so as to cover the front and back surfaces of the flexible substrate 71, and each PET sheet 73 is disposed so as to cover the front and back surfaces.

As shown in FIG. 6, the flexible substrate 71, the electromagnetic wave absorbing sheet 72, and the PET sheet 73 have substantially the same rectangular shape in plan view. Precisely, the electromagnetic wave absorbing sheet 72 is formed with a length slightly shorter than the flexible substrate 71 in the longitudinal direction, and the PET sheet 73 is electromagnetic wave absorbing in the long side direction and the short side direction (width direction). The length is slightly shorter than the sheet 72.

In addition, the flexible substrate 71, the electromagnetic wave absorbing sheet 72, and the PET sheet 73 are bonded to each contact surface via, for example, an adhesive (or a double-sided tape or the like). And the aluminum sheet 74 (shielding sheet) is distribute | arranged with respect to the laminated | stacked flexible board | substrate 71, the electromagnetic wave absorption sheet 72, and the PET sheet 73 in the form which covers the outer side.

The flexible substrate 71 is a substrate in which a large number of wiring patterns (not shown) are formed on a base material formed by forming an insulating and flexible material (for example, polyimide resin) into a film shape. is there. In the present embodiment, a terminal portion 71A on one end side of the flexible substrate 71 (see FIG. 6, a portion not covered with each

sheet

72, 73, 74) is connected to the driver substrate side connector 61 of the driver substrate 60, and the like. The terminal portion 71B on the end side is connected to the control board side connector 33 of the control board 30 respectively. Thereby, a high frequency signal flows from the control board 30 (electronic component) to the driver board 60 via the flexible board 71.

The electromagnetic wave absorbing sheet 72 is a synthetic resin sheet containing, for example, powder of a magnetic material (such as ferrite), and can absorb electromagnetic waves. An example of such an electromagnetic wave absorbing sheet 72 includes a product name “MU-005” manufactured by Takeuchi Kogyo, but is not limited to this, and any sheet having a structure capable of absorbing electromagnetic waves may be used. That's fine.

The PET sheet 73 is interposed between the flexible substrate 71 and the aluminum sheet 74, and has a function to suppress a situation where the aluminum sheet 74 and the flexible substrate 71 are in contact with each other and electrically connected. . In place of the PET sheet 73, it is also possible to use a synthetic resin sheet having insulating properties other than PET. Moreover, it is not limited to a synthetic resin sheet, and a sheet having an insulating property can be substituted.

The aluminum sheet 74 has a function of shielding electromagnetic waves. As shown in FIG. 5, the aluminum sheet 74 is arranged so as to wind the laminated flexible substrate 71, electromagnetic wave absorbing sheet 72, and PET sheet 73 from the outside. The inner surface of the aluminum sheet 74 is bonded to the outer surface of each PET sheet 73.

In the aluminum sheet 74, one end 74A and the other end 74B in a direction intersecting the longitudinal direction (vertical direction in FIG. 4) are overlapped, and the overlapping portion between the one end 74A and the other end 74B is an adhesive or the like. It is glued with. That is, the aluminum sheet 74 is arranged in a shape that covers both the front and back surfaces of the flexible substrate 71 (a shape that surrounds the periphery of the conductive wire). Thereby, when electromagnetic waves are radiated from the flexible substrate 71, the situation where the electromagnetic waves are emitted to the outside can be suppressed. Note that a sheet capable of shielding electromagnetic waves (for example, a metal sheet other than aluminum) can be used in place of the aluminum sheet 74.

As shown in FIG. 3, in the board connection wiring 70, an insulating material having elasticity is provided between a surface facing the bottom plate portion 14 a of the chassis 14 (that is, the outer surface of the aluminum sheet 74) and the bottom plate portion 14 a of the chassis 14. The member 80 (polon etc.) is arranged. Both front and back surfaces of the insulating member 80 are attached to the bottom plate portion 14a of the chassis 14 and the outer surface of the aluminum sheet 74 with double-sided tape or the like. That is, the aluminum sheet 74 (and thus the board connection wiring 70) is attached to the bottom plate portion 14a of the chassis 14 via the insulating member 80 (in other words, held on the chassis 14). Note that a member other than poron may be applied as the insulating member 80.

Further, as shown in FIG. 3, a ferrite core 81 for absorbing electromagnetic waves is attached to the board connection wiring 70. As shown in FIG. 4, the aluminum sheet 74 is electrically connected to the ground pattern 39 (ground) of the control board 30 via a connection member 83 (for example, a flexible board).

Next, an example of a procedure for attaching each member constituting the board connection wiring 70 will be described. As shown in FIG. 6, the electromagnetic wave absorbing sheets 72 are attached to both the front and back surfaces of the flexible substrate 71. Next, one PET sheet 73 (73A) is attached so as to cover the electromagnetic wave absorbing sheet 72 on the front side (the upper side in FIG. 6), and the other PET sheet 73 (73B) is attached to the inner surface of the aluminum sheet 74. . And after affixing the other PET sheet 73B to the electromagnetic wave absorbing sheet 72 on the back side, the remaining part of the aluminum sheet 74 (a part where the other PET sheet 73 is not affixed) is placed on the side of the one PET sheet 73A. It is folded and attached to the PET sheet 73A. At the same time, one end 74A of the aluminum sheet 74 is folded back toward the other end 74B and bonded to the other end 74B. Thereby, the board connection wiring 70 is completed. The procedure for pasting each sheet illustrated here is an example, and the present invention is not limited to this.

Next, the effect of this embodiment will be described. The board connection wiring 70 of this embodiment is a wiring connected to the control board 30 (electronic component) and the driver board 60 (electronic component), and a flexible board 71 through which a high-frequency signal output from the control board 30 flows. And an aluminum sheet 74 that covers the flexible substrate 71 and shields electromagnetic waves radiated from the flexible substrate 71, and a PET sheet 73 interposed between the flexible substrate 71 and the aluminum sheet 74.

In the present embodiment, by providing the aluminum sheet 74, it is possible to suppress a situation in which electromagnetic waves radiated from the flexible substrate 71 are emitted to the outside of the substrate connection wiring 70. Thereby, the situation where the electromagnetic waves emitted to the outside affect other electronic devices can be suppressed.

Furthermore, since the PET sheet 73 is interposed between the flexible substrate 71 and the aluminum sheet 74, the flexible substrate 71 and the aluminum sheet 74 can be prevented from contacting each other. Thereby, the flexible board | substrate 71 and the aluminum sheet 74 can be electrically connected, the situation where the impedance of the wiring pattern in the flexible board | substrate 71 changes can be suppressed, and a high frequency signal can be transmitted more reliably. That is, in the board connection wiring 70 of the present embodiment, while the electromagnetic sheet can be shielded by the aluminum sheet 74, the impedance change of the flexible board 71 which is concerned by providing the aluminum sheet 74 can be suppressed, which is generally high. Electrical reliability can be obtained.

Further, the aluminum sheet 74 is arranged so as to surround the periphery of the flexible substrate 71, and the one end portion 74A and the other end portion 74B of the aluminum sheet 74 are bonded in a superposed state.

By surrounding the periphery of the flexible substrate 71 with the aluminum sheet 74, it is possible to more reliably suppress a situation in which electromagnetic waves radiated from the flexible substrate 71 are emitted to the outside. Moreover, the situation where the aluminum sheet 74 peels can be suppressed by adhere | attaching the one end part 74A and the other end part 74B of the aluminum sheet 74. FIG.

Further, an electromagnetic wave absorbing sheet 72 is provided so as to cover the flexible substrate 71 and can absorb electromagnetic waves radiated from the flexible substrate 71.

With such a configuration, electromagnetic waves radiated from the flexible substrate 71 can be absorbed. Thereby, it can suppress more reliably the situation where electromagnetic waves are radiate | emitted outside with the electromagnetic wave shielding effect by the aluminum sheet 74. FIG.

Further, the aluminum sheet 74 is electrically connected to the ground pattern 39 of the control board 30. By connecting the aluminum sheet 74 to the ground pattern 39, electrostatic shielding can be performed by the aluminum sheet 74, and electromagnetic waves can be shielded more reliably.

Further, the chassis 14 that supports the liquid crystal panel 11 and has conductivity is provided, and the aluminum sheet 74 is attached to the chassis 14 via an insulating member 80.

The aluminum sheet 74 is held with respect to the chassis 14 by attaching the aluminum sheet 74 to the chassis 14 via the insulating member 80. Thereby, it can suppress that the aluminum sheet 74 and the chassis 14 contact (electrically). Thereby, the situation in which the aluminum sheet 74 and the chassis 14 come into contact with each other and the potential of the aluminum sheet 74 changes can be suppressed, and electromagnetic waves can be shielded more reliably.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. In the above embodiment, the electromagnetic wave absorbing sheet 72, the PET sheet 73, and the aluminum sheet 74 are respectively laminated on the front and back surfaces of the flexible substrate 71. On the other hand, the board connection wiring 170 of the present embodiment has a configuration in which an electromagnetic wave absorbing sheet 172, a PET sheet 173, and an aluminum sheet 174 are laminated on one surface 171A (the lower surface in FIG. 7) of the flexible substrate 171. Even with such a configuration, the effect of the above embodiment (the effect of blocking and absorbing electromagnetic waves) can be achieved.

As shown in FIG. 7, in the aluminum sheet 174, the end portions 174A on both sides in the short side direction are folded back so as to wrap around the other surface 171B of the flexible substrate 171, and are bonded thereto. Thereby, the peeling of the aluminum sheet 174 can be suppressed as compared with the configuration in which only the one surface 171A is adhered.

In the present embodiment, the other surface 171B of the flexible substrate 171 (the surface that is not entirely covered by the aluminum sheet 174) is arranged to face the bottom plate portion 14a of the chassis 14. In this way, both the front and back surfaces of the flexible substrate 171 can be covered by the aluminum sheet 174 and the chassis 14, and the electromagnetic wave shielding effect can be further enhanced.

FIG. 8 is a cross-sectional view showing the board connection wiring 170, and is an enlarged view showing a bent portion of the board connection wiring 170 in a bent state. As shown in FIG. 8, the PET sheet 173 is composed of a plurality of PET sheet pieces 173D having a planar view shape. The PET sheet pieces 173D are set to have the same length in the longitudinal direction of the board connection wiring 170, and are arranged side by side with a gap S therebetween.

In this way, if the PET sheet 173 is configured from a plurality of PET sheet pieces 173D and arranged via the gap S, the PET sheet 173 itself in the gap S between the PET sheet pieces 173D in the board connection wiring 170. It can be bent in the longitudinal direction regardless of the bendability. If the PET sheet 173 is formed as an integral part and has a property that is difficult to bend, the board connection wiring 170 is also difficult to bend. In this regard, in the present embodiment, the board connection wiring 170 can be easily bent and handled as compared with the case where the PET sheet 173 is configured as an integral part.

In addition, the number of PET sheet pieces 173D (the number of divisions of the PET sheet 173), the arrangement interval, the length in the longitudinal direction of the board connection wiring 170 (in other words, the position and length of the gap S) can be changed as appropriate. . That is, it is good also as a structure which forms the clearance gap S only in the location where bending is required on the PET sheet | seat 173. FIG.

In addition, the configuration in which the board connection wiring 170 can be bent by configuring the sheet from a plurality of sheet pieces in this manner can be applied not only to the PET sheet 173 but also to the electromagnetic wave absorbing sheet 172, the aluminum sheet 174, and the like. (In FIG. 8, indicated by an electromagnetic wave absorbing sheet piece 172D and an aluminum sheet piece 174D). Such a configuration is particularly suitable when the

sheets

172, 173, and 174 are made of a material or thickness that is hard and difficult to bend.

In the present embodiment, the

sheet pieces

172D, 173D, and 174D are stacked so as to overlap (that is, the gaps S between the

sheet pieces

172D, 173D, and 174D are also formed at the same location). Each contact surface is bonded.

<Embodiment 3>
Next, Embodiment 3 of the present invention will be described with reference to FIG. In the board connection wiring 270 of the present embodiment, the electromagnetic wave absorbing sheet 272 is composed of an electromagnetic wave absorbing sheet piece 272D, as in the second embodiment.
The PET sheet 273 is composed of a plurality of PET sheet pieces 273D.

Each electromagnetic wave absorbing sheet piece 272D and each PET sheet piece 273D have a planar view shape and a cross-sectional view shape. A chamfered portion 272 </ b> A is formed on the edge of the electromagnetic wave absorbing sheet piece 272 </ b> D facing the flexible substrate 271 in the longitudinal direction of the substrate connection wiring 270.

In this way, when the chamfered portion 272A is formed, the edge of each electromagnetic wave absorbing sheet piece 272D comes into contact with another member (in this case, the flexible substrate 271 in contact with each electromagnetic wave absorbing sheet piece 272D) (for example, When the board connection wiring 270 is bent, the situation of damaging the board connection wiring 270 can be suppressed.

Further, in each electromagnetic wave absorbing sheet piece 272D, since the chamfered portion 272A is formed in the adjacent edge portion, when the board connection wiring 270 is bent in the longitudinal direction, the edge portion of each adjacent electromagnetic wave absorbing sheet piece 272D. It becomes difficult for them to interfere with each other, and the board connection wiring 270 can be more easily bent.

On the other hand, on the side of each PET sheet piece 273D that faces the aluminum sheet 274, a fillet portion 273A (a shape that forms an arc shape in cross section) is formed at the edge in the longitudinal direction of the substrate connection wiring 270. Thus, by forming the fillet portion 273A, when the edge portion of each PET sheet piece 273D comes into contact with another member (in this case, the aluminum sheet 274 that comes into contact with each PET sheet piece 273D), Situations that hurt can be suppressed.

The chamfered portion described above may be formed at the edge of each PET sheet piece 273D, and the fillet portion may be formed at the edge of each electromagnetic wave absorbing sheet piece 272D.

<Embodiment 4>
Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a diagram showing a flexible substrate 371 and a PET sheet 373 in the substrate connection wiring 370 of the present embodiment. In FIG. 10, an electromagnetic wave absorbing sheet, an aluminum sheet, and the like are not shown.

In the present embodiment, the PET sheet 373 has a part of the thickness in the longitudinal direction smaller than the other part. In other words, the PET sheet 373 has a thick part 373B having a large thickness and a thin part 373E having a thickness smaller than that of the thick part 373B. A chamfered portion 373D is formed at a boundary portion (step portion) between the thick portion 373B and the thin portion 373E. Since the effect of the chamfered portion 373D is the same as that of the third embodiment, description thereof is omitted.

With such a configuration, the thin portion 373E is easier to bend than the thick portion 373B, and the board connection wiring 370 is easier to bend. According to the configuration of the present embodiment, only the portion that needs to be bent is the thin-walled portion 373E, and the other portions are the thick-walled portion 373B, so that the PET sheet 373 as a whole can be easily folded while maintaining the strength. It is effective without any damage. Here, the configuration in which the PET sheet 373 includes a thick portion and a thin portion is illustrated, but this configuration is applicable to an aluminum sheet or an electromagnetic wave absorbing sheet.

<Embodiment 5>
Next, Embodiment 5 of the present invention will be described with reference to FIG. FIG. 11 is a diagram showing a flexible substrate 471 and an insulating sheet 473 in the substrate connection wiring 470 of the present embodiment. In FIG. 11, an electromagnetic wave absorbing sheet, an aluminum sheet, and the like are not shown.

In the present embodiment, the PET sheet 473 is formed with a groove 473A that is recessed toward the flexible substrate 471. The groove portion 473A extends in a direction intersecting with the longitudinal direction of the insulating sheet (a through-direction in FIG. 11). A plurality of the groove portions 473A are arranged in the longitudinal direction of the PET sheet 473.

By forming the groove portion 473A in this way, the PET sheet 473 and thus the substrate connection wiring 470 can be easily bent at the position where the groove portion 473A is formed, and the substrate connection wiring 470 can be easily routed.

Further, in the present embodiment, fillets 473D may be formed on both edge portions in the longitudinal direction of the groove portion 473A (a chain line in FIG. 11). Since the effect of the fillet 473D is the same as that of the third embodiment, the description thereof is omitted. Further, a chamfered portion may be formed instead of the fillet 473D.

<Embodiment 6>
Next, Embodiment 6 of the present invention will be described with reference to FIG. FIG. 12 is a diagram showing a flexible substrate 571 and an electromagnetic wave absorbing sheet 572 in the substrate connection wiring 570 of the present embodiment. In FIG. 12, an insulating sheet and an aluminum sheet are not shown.

In the present embodiment, the electromagnetic wave absorbing sheet 572 is formed with a groove 572A that is recessed toward the flexible substrate 571. The groove portion 573A extends in a direction intersecting with the longitudinal direction of the electromagnetic wave absorbing sheet 572 (in the paper surface penetration direction in FIG. 11), and has a triangular shape in cross section. A plurality of the groove portions 573A are arranged in the longitudinal direction of the electromagnetic wave absorbing sheet 572.

By forming the groove portion 572A in this way, the electromagnetic wave absorbing sheet 572, and thus the substrate connection wiring 570, can be easily bent at the position where the groove portion 572A is formed, and the substrate connection wiring 570 can be easily routed.

Further, in the present embodiment, fillets 572D may be formed at both edges in the longitudinal direction of the groove 572A (a chain line in FIG. 12). About the effect of fillet 573D, since it is the same as that of the said Embodiment 3, description is abbreviate | omitted. Further, a chamfered portion may be formed instead of the fillet 573D. Here, the groove portion is formed in the electromagnetic wave absorbing sheet 572, but for example, the groove portion may be formed in an aluminum sheet.

<Embodiment 7>
Next, Embodiment 7 of the present invention will be described with reference to FIG. In the substrate connection wiring 670 of the present embodiment, the PET sheet 673 is disposed only in a part of the substrate connection wiring 670 in the longitudinal direction. The flexible substrate 671, the electromagnetic wave absorbing sheet 672, and the aluminum sheet 674 are set to have substantially the same length in the longitudinal direction.

More specifically, the PET sheet 673 is disposed only between the control board side connector 33 (not shown in FIG. 13, refer to FIG. 3) of the control board 30 and the ferrite core 81. In the board connection wiring 670 of the present embodiment, the driver board 60 side (left side in FIG. 13) from the ferrite core 81 needs to be bent upward in FIG. 9 in order to connect to the driver board 60. For this reason, in the part to be bent (between the ferrite core 81 and the driver substrate 60), the PET sheet 673 is not disposed and the structure is more easily bent. On the other hand, the portion disposed along the bottom plate portion 14a of the chassis 14 does not need to be bent, so that the PET sheet 673 is disposed. Further, a chamfered portion 673A is formed at the edge of the PET sheet 673, so that the situation where the aluminum sheet 674 is damaged can be suppressed.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

(1) The attachment locations of the control board 30 and the driver board 60 are not limited to the locations exemplified in the above embodiment. In the above embodiment, the configuration in which the wiring of the present invention is used as the substrate connection wiring 70 is exemplified, but the present invention is not limited to this. The wiring of the present invention can be used for an electronic component having a function of outputting a high frequency signal.

(2) In the above embodiment, the electromagnetic wave absorbing sheet 72 is arranged between the flexible substrate 71 and the PET sheet 73, but is not limited thereto. The stacking order of the PET sheet 73 and the electromagnetic wave absorbing sheet 72 may be switched, and the PET sheet 73 may be interposed between the flexible substrate 71 and the electromagnetic wave absorbing sheet 72. If it does in this way, it can control that flexible substrate 71 and electromagnetic wave absorption sheet 72 contact. Thereby, both can electrically connect and the situation where the impedance of flexible substrate 71 changes can be controlled, and a high frequency signal can be transmitted more certainly.

(3) In the above embodiment, the aluminum sheet 74 and the ground pattern 39 of the control board 30 are electrically connected. However, the present invention is not limited to this. The aluminum sheet 74 and the ground pattern of the driver board 60 may be electrically connected.

(4) In the above embodiment, the

sheets

72, 73, and 74 are attached to the flexible substrate 71. However, the present invention is not limited to this. For example, the

sheets

72, 73, and 74 may be stacked on the flexible substrate 71 by coating the flexible substrate 71 with the materials constituting each sheet in order.

(5) In each of the embodiments described above, the cold cathode tube 17 is used as the light source. However, other types of light sources may be used, for example, a hot cathode tube or an LED may be used.

(6) In each of the above embodiments, a liquid crystal display device using a liquid crystal panel as the display panel has been exemplified, but the present invention can also be applied to a display device using another type of display panel.

(7) In each of the above embodiments, the TFT is used as the switching element of the liquid crystal display device. However, the present invention can also be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)), and color display. In addition to the liquid crystal display device, the present invention can be applied to a liquid crystal display device that displays black and white.

(8) In the above embodiment, the PET sheet is exemplified as the insulating sheet, but the present invention is not limited to this. As the insulating sheet, a sheet made of silicone rubber or the like can be used. Moreover, it is also possible to radiate the heat at the time of energizing the flexible substrate by using a sheet with high heat dissipation. In addition, as the insulating sheet, it is also possible to use a highly flexible sheet such as acrylic or urethane.

DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 14 ... Chassis, 30 ... Control board (electronic component), 39 ... Ground pattern (ground of control board), 60 ... Driver board (drive board) , Electronic components), 70, 170 ... wiring for wiring (wiring), 71, 171 ... flexible substrate (conductive wire, flexible wiring), 72, 172 ... electromagnetic wave absorbing sheet, 73, 173 ... PET sheet (insulating sheet), 74, 174 ... Aluminum sheet (shielding sheet), 74A ... One end of the aluminum sheet (one end of the shielding sheet), 74B ... The other end of the aluminum sheet (the other end of the shielding sheet), 80 ... Insulating member, 172D ... Electromagnetic wave absorbing sheet piece, 173D ... PET sheet piece (insulating sheet piece), 174D ... Aluminum sheet piece (shielding sheet piece), S ... Gap (insulating sheet piece) Between, the electromagnetic wave absorption sheet of the gap, the gap between the shielding sheet), TV ... television receiver

Claims

Wiring connected to electronic components,
A conductive wire through which a high-frequency signal output from the electronic component flows;
A shielding sheet that is arranged in a manner to cover the conductive wire and can shield electromagnetic waves radiated from the conductive wire;
A wiring including an insulating sheet interposed between the conductive wire and the shielding sheet.
The conductive wire is a flexible wiring,
The insulating sheet is composed of a plurality of insulating sheet pieces arranged in the longitudinal direction of the wiring via gaps, respectively.
The wiring according to claim 1, wherein the wiring is bendable in a longitudinal direction in the gap of the insulating sheet.
The wiring according to claim 2, wherein a fillet portion or a chamfered portion is formed at an edge portion of the insulating sheet piece.
The wiring according to claim 1, wherein the insulating sheet has a thick part and a thin part.
The conductive wire is a flexible wiring,
The shielding sheet is composed of a plurality of shielding sheet pieces arranged in the longitudinal direction of the wiring via gaps, respectively.
The wiring according to claim 1, wherein the wiring can be bent in the longitudinal direction in the gap of the shielding sheet.
The shielding sheet is arranged so as to surround the conductive wire,
The wiring according to any one of claims 1 to 5, wherein one end portion and the other end portion of the shielding sheet are bonded in a superposed state.
The wiring according to any one of claims 1 to 6, further comprising an electromagnetic wave absorbing sheet disposed so as to cover the conductive wire and capable of absorbing electromagnetic waves radiated from the conductive wire.
The wiring according to claim 7, wherein the insulating sheet is interposed between the conductive wire and the electromagnetic wave absorbing sheet.
The conductive wire is a flexible wiring,
The electromagnetic wave absorbing sheet is configured such that a plurality of electromagnetic wave absorbing sheet pieces are arranged in the longitudinal direction of the wiring via gaps, respectively.
The wiring according to claim 7 or 8, wherein the wiring can be bent in the longitudinal direction in the gap of the electromagnetic wave absorbing sheet.
The wiring according to claim 9, wherein a fillet portion or a chamfered portion is formed at an edge portion of the electromagnetic wave absorbing sheet piece.
Of the shielding sheet, the insulating sheet, and the electromagnetic wave absorbing sheet, at least one of the sheets is formed with a groove portion extending in a direction intersecting with the longitudinal direction of any of the sheets,
The wiring according to claim 7 or 8, wherein the wiring can be bent in a longitudinal direction in the groove portion of any one of the sheets.
The wiring according to any one of claims 1 to 11, wherein the shielding sheet is an aluminum sheet.
The wiring according to any one of claims 1 to 12, wherein the insulating sheet is an insulating synthetic resin sheet.
14. The wiring according to claim 13, wherein the synthetic resin sheet is a PET sheet.
14. The wiring according to claim 13, wherein the synthetic resin sheet is made of silicone rubber.
A display panel capable of displaying images;
A drive substrate that transmits a drive signal for driving the display panel to the display panel;
A control board for transmitting a control signal for controlling the drive of the display panel to the drive board;
Wiring for connecting the drive board and the control board,
The display device, wherein the wiring is configured by the wiring according to any one of claims 1 to 15.
The display device according to claim 16, wherein the shielding sheet is electrically connected to a ground of the control board or the driving board.
A chassis for supporting the display panel;
The display device according to claim 16, wherein the shielding sheet is attached to the chassis via an insulating member.
The display device according to any one of claims 16 to 18, wherein the display panel is a liquid crystal panel using liquid crystal.
A television receiver comprising the display device according to any one of claims 16 to 19.