WO2011120644A1 - Device for assembling electric components on a printed circuit - Google Patents

Device for assembling electric components on a printed circuit Download PDF

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Publication number
WO2011120644A1
WO2011120644A1 PCT/EP2011/001384 EP2011001384W WO2011120644A1 WO 2011120644 A1 WO2011120644 A1 WO 2011120644A1 EP 2011001384 W EP2011001384 W EP 2011001384W WO 2011120644 A1 WO2011120644 A1 WO 2011120644A1
Authority
WO
WIPO (PCT)
Prior art keywords
connecting elements
metal connecting
insulating support
board
components
Prior art date
Application number
PCT/EP2011/001384
Other languages
French (fr)
Inventor
Bertrand Puzenat
Original Assignee
Valeo Systemes Thermiques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes Thermiques filed Critical Valeo Systemes Thermiques
Priority to CN201180027102.7A priority Critical patent/CN102934533B/en
Publication of WO2011120644A1 publication Critical patent/WO2011120644A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60HARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00Heating, cooling or ventilating [HVAC] devices
    • B60H1/00457Ventilation unit, e.g. combined with a radiator
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/04Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in series
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B6/00Compression machines, plants or systems, with several condenser circuits
    • F25B6/04Compression machines, plants or systems, with several condenser circuits arranged in series
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04Refrigeration circuit bypassing means
    • F25B2400/0409Refrigeration circuit bypassing means for the evaporator
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04Refrigeration circuit bypassing means
    • F25B2400/0411Refrigeration circuit bypassing means for the expansion valve or capillary tube
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00Problems to be solved
    • F25B2500/18Optimization, e.g. high integration of refrigeration components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/049PCB for one component, e.g. for mounting onto mother PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Definitions

  • the present invention relates to a device for assembling electrical components or the like on a printed circuit board or board such as that, in a particular application, though not exclusively, intended for a controller of a ventilation, heating and air-conditioning system engine. of a motor vehicle, as well as said system equipped with such an assembly device.
  • HVAC heating and air conditioning
  • the usual ventilation, heating and air conditioning (HVAC) systems include, in addition to heat exchangers, to obtain the expected results in terms of terms of heating, cooling, etc. , an electric motor with a blower wheel mounted on its shaft and designated by the term “fan motor unit”, whose rotation speed selected by the driver from a specific button on the dashboard, is controlled from a “controller” in the form of an electronic printed circuit board to which various components are assembled.
  • a reflow soldering process which consists in passing the board, previously coated on the surface with a metal solder layer (solder paste) with the contacts of the components positioned at the surface at the selected locations, in a soldering furnace; reflow, so as to melt the metal layer on the contacts then, after cooling, obtain the assembly of the components on the card, or
  • a wave soldering process especially when the components to be assembled are dimensionally larger, such as, for example, chemical capacitors, input filter coils or chokes, and the connections of the power source and the engine of the motorcycle fan group. It consists in passing, along the relevant surface of the board with the contacts of the components previously bonded to it, a wave of solder metal paste which secures the contacts of the components to the board by capillarity.
  • the present invention aims to overcome these drawbacks and concerns, for this purpose, a device for assembling components on a printed circuit board or board, such as that of an electric motor controller of a ventilation system. , heating and air conditioning of a vehicle, said card being coated with a weld metal layer.
  • the device is in the form of an intermediate module disposed between said card and said components intended to be mounted on it, and said intermediate module comprises:
  • the device overcomes the disadvantages related in particular to the low wettability of the lead-free alloy used during the process wave soldering, which does not occur with the reflow soldering process.
  • the intermediate module serving as an interface between the board and the components concerned is then attached to it while assembling the other components usually assembled by reflow during the same passage in the reflow oven, which does not imply an increase in the cost of manufacturing the card.
  • the large components such as, in the preferred application, the power supplies of the card and the motor, the coil and the capacitor of the input filter
  • the large components are reported on the metal connecting elements concerned. of the device.
  • said metal connecting elements each have a folded tab form having a first end portion with a bearing surface for contact with said card and a second end portion for attachment to said insulating support.
  • Said first and second end portions of the metal connecting elements are offset parallel to one another by an inclined central portion.
  • the insulating support is then parallel to the card and close to it, so as to minimize its size.
  • this conformation of the connecting elements releases the space on the card and under the module so as to install components or others.
  • said insulating support forms a frame at the periphery of which are derived said metal connecting elements.
  • said connecting elements protrude outside the frame.
  • these connecting elements extend beyond the periphery in a direction substantially parallel to the general plane of the insulating support.
  • said metallic connecting elements extend at the level of the second parts. end, by contact terminals with which are intended to cooperate the electrical components to be mounted on the intermediate module.
  • Said metal connecting elements are made of copper or copper alloy and said insulating support is made of non-electrically conductive plastic material or the like thermally resistant.
  • said insulating support is overmolded on said metal connecting elements, the first end portions thereof protruding outside the support and the second end portions being embedded in said insulating support, defining side receiving slots.
  • each metal connection element comprising a terminal for connecting a corresponding contact of a component to be mounted on said intermediate module and / or two terminals spaced parallel to one of the other for the mounting force of a corresponding contact of connection from a component to be mounted.
  • the invention also relates to a controller or control module of a motor-blower unit motor and blower wheel of a ventilation system, heating and / or air conditioning of a motor vehicle, comprising a card or printed circuit board said board being coated with a metal solder layer CM, wherein a device for assembling components to or on the board, as defined above, is installed.
  • Figure 1 shows, in perspective, an embodiment of the intermediate module assembly device according to the invention, before mounting on the printed circuit board of a ventilation system, heating and air conditioning of a vehicle.
  • Figure 2 is a top view of the metal connection elements of the module.
  • FIG. 3 shows, in perspective, the module assembly device, attached to the printed circuit board and carrying electrical components.
  • FIG. 4 is a detail view, in enlarged and cutaway perspective, of the connection of the contact tabs of a capacitor with the terminals of the relevant metal connection elements of the module.
  • the assembly device 1 of the invention is defined by an intermediate independent module 2 acting as an interface, as will be seen later with reference to FIG. a circuit board or circuit board C and electrical components CC, B to be connected by means of the device 1 at specific locations on the board. It is therefore clear that this module is separate from the printed circuit board or circuit board, the module being soldered by a reflow method on said card.
  • the intermediate module 2 comprises metal connecting elements 3 ensuring the passage of the current between the specific locations and the electrical components to be mounted, and an insulating support 4 now between them and separately from each other, the elements of 3.
  • the module 2 has a substantially parallelepipedal flat shape given by the insulating support 4 which defines a rectangular frame.
  • the connecting elements 3 which are six in number in this example, two centrally from the long sides 4B of the frame and four from two to two of the short sides 4C of the frame.
  • a different number of connecting elements 3 and another form of support 4 could be envisaged depending on the required specificities.
  • each connecting element 3 is made of a conductive metal such as copper or copper alloy and preferably tinned.
  • each connecting element 3 presents itself in the form of folded flat tab 3A, of rectangular cross-section, having first and second end portions 3C 3C connected in parallel with each other by a central inclined portion 3D.
  • the first flat end portion 3B constitutes a flat bearing surface 3E for contact with the printed circuit board and all of these bearing surfaces 3E elements is contained in the same plane to apply perfectly on the solder metal layer CM of the card, in order to be welded, according to the invention, by reflow.
  • the second flat end portion 3C ensures the maintenance of each connecting element 3 with the frame of the support 4 and, as will be seen below, the electrical connection with the components.
  • the support 4 is insulating from an electrical point of view and is made of a plastic material adapted to support the thermal profile of the reflow oven in which the device 1 mounted on the surface of the card must pass.
  • the plastic is thermally resistant, that is to say mechanically stable as the temperature is below 260 ° C (maximum temperature of a reflow oven with CM solder layer without plomp).
  • the obtaining of the module 2 is effected, for example, by an overmolding of the insulating support 4 with the second end portions 3C of the metal connecting elements 3 so that these, as shown in FIGS. 1 and 2, protrude perpendicularly from the sides 4B, 4C of the frame forming the insulating support.
  • FIGS. 1, 3 and 4 show in particular that the second end portions 3C of the elements are, after overmoulding, housed in slots 4D obtained in the support during its production, which slots 4D may be blind, for this purpose which relates to the four connecting elements from the short sides 4C, or through, with respect to the two connecting elements from the long sides 4B of the frame.
  • All of these second flat or flattened end portions 3C are in a same plane parallel to that of the first flattened end portions 3B, an offset being made by the inclined central portions 3D of elements.
  • the insulating support 4 is raised relative to the first parts 3B and, therefore, is parallel to the card C. It can thus receive, under the module, other common components.
  • the second end portions 3C of the connecting elements 3 all extend through contact terminals 3F with which the electrical components to be mounted are co-operating. As shown in Figures 1 and 2, these terminals 3F are, in this example, flat type rectangular cross section but could be different in whole or from one element to another.
  • the connecting elements 3 located on the short sides 4C of the insulating support 4 in the frame are each provided with a terminal 3F folded perpendicular to the second end portion 3C from which it is derived, that is, that is to say, the rectangular frame of the insulating support, being turned away from the first end portion 3B. Terminals 3F start on the side portion of the second end portion 3C which faces inwardly of the insulating support.
  • the terminals 3F of the two connecting elements 3 situated on the short side 4C on the left in FIG. 2 constitute the electrical power supply terminals, for example 12 volts, and the ground terminals to which the complementary terminals (contacts) not shown are connected. of the power supply source, and the terminals 3F of the two connecting elements 3 situated on the right in FIG. 2, relate to the power supply and ground terminals to which are connected those, not shown, coming from the motor group. system fan.
  • the insulating support 4 has two rectangular bases 4E surmounting the latter and surrounding the relevant terminals 3F of the connecting elements.
  • the insulating support 4 has a central part intended to receive the electrical components to be reported and the supply terminals 3F disposed on either side of this central part, at the small side 4C of the insulating support 4.
  • the connecting element 3 located at the center and at the top of FIG. 2 comprises four connection terminals 3F arranged perpendicularly in pairs, two of which are parallel to the general direction of the connecting element 3 so that these two terminals 3F are opposite the two terminals 3F of the connecting element 3 located in the center and bottom of Figure 2.
  • terminals 3F of the connecting element 3 located at the center and at the top of FIG. 2 are placed in the extension and opposite the terminals 3F of the connecting element 3 located at the top left of Figure 2. This arrangement of terminals 3F allows to install:
  • the fixing of the tabs P forming the contacts of the capacitor or chemical capacitance CC is effected by pinching obtained from two flat terminals 3F spaced parallel to one another and originating from the second parts of end 3C of the metal connecting elements located on the long sides 4B of the frame insulating support 4.
  • These terminals 3F are in the extension of the second end portions 3C, parallel to the plane of the support, so that the legs P form cylindrical insert force between the two respective parallel terminals of the connecting elements 3.
  • the insulating support 4 has in its central part bars having holes (two per bar) of axis perpendicular to the terminals 3F 3. The function of these holes is to provide access to pass the claws of a clamp whose purpose is to clamp the two adjacent terminals 3F against tabs P forming the contacts of the components to report on the modules 2.
  • the bearing surfaces 3E of the first end portions 3B of the metal connecting elements 4 are positioned at predetermined locations of C card, where is the CM solder metal layer.
  • the latter obviously serves to secure common components, not shown, other than those, larger, intended for the assembly device 1.
  • the first end portions 3B are secured via the bearing surfaces of the metal connection elements of the module 2 on the card C, as well as that of the usual components provided directly on the card C.
  • the assembly device 1 is perfectly fixed to the card by ensuring, by the metal connecting elements 3, the electrical conduction between board and components to be mounted on the module, especially since these copper or copper alloy elements are tinned to be compatible with the lead-free reflow process (eg n with nickel undercoat).
  • connections not shown such as those of the power source and the motor-fan unit, are plugged into the respective bases 4E of the intermediate module 2 and connected to the relevant parallel contact terminals 3F.
  • the tabs P of the chemical capacitor CC and the coil B of the large components are force-fed and pinched by the parallel terminals. corresponding 3F.
  • This operation can be done using a specific tool not shown and is facilitated by the holes in the bars of the insulating support 4 to access these terminals.
  • Other means for fixing the tabs on the terminals could be envisaged, such as laser fastening in particular.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a device for assembling electric components on a printed circuit board, wherein said device is provided in the form of an intermediate module (2) arranged between said board (C), which is coated with a metal solder layer (CM), and said components (CC, B,...) which are to be mounted thereon, and wherein said intermediate module (2) includes: a plurality of metal linking members (3), one side of which is mounted on said board (C) by means of remelting the solder metal layer (CM), and the other side of which, remote from the board, is suitable for receiving said components; and an insulating bracket (4) combining said metal linking members (3) separately from one another.

Description

Dispositif d'assemblage de composants électriques sur un circuit imprimé  Device for assembling electrical components on a printed circuit
La présente invention concerne un dispositif d'assemblage de composants électriques ou analogues sur une carte ou plaque de circuit imprimé telle que celle, dans une application particulière quoique non exclusive, destinée à un contrôleur d'un moteur de système de ventilation, chauffage et climatisation d'un véhicule automobile, ainsi que ledit système équipé d'un tel dispositif d'assemblage. The present invention relates to a device for assembling electrical components or the like on a printed circuit board or board such as that, in a particular application, though not exclusively, intended for a controller of a ventilation, heating and air-conditioning system engine. of a motor vehicle, as well as said system equipped with such an assembly device.
Pour pouvoir volontairement régler le débit du flux d'air amené dans l'habitacle d'un véhicule automobile, les systèmes de ventilation, chauffage et climatisation usuels (désignés HVAC en anglais) comprennent, en plus des échangeurs thermiques pour obtenir les résultats attendus en termes de chauffage, refroidissement, etc. , un moteur électrique avec une roue de pulseur montée sur son arbre et désigné par le terme « groupe moto- ventilateur », dont la vitesse de rotation sélectionnée par le conducteur depuis un bouton spécifique sur le tableau de bord, est commandée à partir d'un « contrôleur » sous forme d'une carte électronique de circuit imprimé à laquelle sont assemblés différents composants.  In order to voluntarily adjust the flow rate of the air flow brought into the passenger compartment of a motor vehicle, the usual ventilation, heating and air conditioning (HVAC) systems include, in addition to heat exchangers, to obtain the expected results in terms of terms of heating, cooling, etc. , an electric motor with a blower wheel mounted on its shaft and designated by the term "fan motor unit", whose rotation speed selected by the driver from a specific button on the dashboard, is controlled from a "controller" in the form of an electronic printed circuit board to which various components are assembled.
Actuellement, l'assemblage des contacts (pattes, broches, ...) des composants électriques montés ainsi en surface sur la carte s'effectue soit : Currently, the assembly of the contacts (lugs, pins, ...) of the electrical components thus mounted on the surface of the card is performed either:
- par un processus de soudage par refusion qui consiste à faire passer la carte, préalablement enduite en surface d'une couche métallique de soudure (pâte à braser) avec les contacts des composants positionnés en surface aux emplacements choisis, dans un four de soudage par refusion, de manière à faire fondre la couche métallique sur les contacts puis, après refroidissement, obtenir l'assemblage des composants sur la carte, ou - by a reflow soldering process which consists in passing the board, previously coated on the surface with a metal solder layer (solder paste) with the contacts of the components positioned at the surface at the selected locations, in a soldering furnace; reflow, so as to melt the metal layer on the contacts then, after cooling, obtain the assembly of the components on the card, or
- par un processus de soudage à la vague, notamment lorsque les composants à assembler sont dimensionnellement plus importants, comme par exemple, les condensateurs chimiques, les bobines ou selfs de filtre d'entrée, et les connexions de la source d'alimentation et du moteur du groupe moto-ventilateur. Il consiste à faire passer, le long de la surface concernée de la carte avec les contacts des composants préalablement collés sur celle-ci, une vague de pâte métallique de soudure qui solidarise par capillarité les contacts des composants à la carte. - by a wave soldering process, especially when the components to be assembled are dimensionally larger, such as, for example, chemical capacitors, input filter coils or chokes, and the connections of the power source and the engine of the motorcycle fan group. It consists in passing, along the relevant surface of the board with the contacts of the components previously bonded to it, a wave of solder metal paste which secures the contacts of the components to the board by capillarity.
Bien qu'il soit techniquement maîtrisé, le processus de soudage à la vague devient cependant beaucoup plus délicat à mettre en œuvre quand le choix se porte sur l'utilisation d'un alliage métallique (souvent à base d'étain) sans plomb, ce qui est, par ailleurs, de plus en plus le cas pour des raisons de santé et d'environnement.  Although technically mastered, the process of wave soldering becomes much more difficult to implement when the choice is to use a metal alloy (often tin-based) lead-free, which is, moreover, more and more the case for reasons of health and environment.
En effet, l'absence de plomb dans l'alliage métallique entraîne en contrepartie plusieurs inconvénients dont celui de diminuer notamment la mouillabilité de l'alliage de sorte que la soudure tend à ne pas se « déposer » sur toute la surface disponible entre les contacts et la carte. On obtient alors une soudure imparfaite des composants sur la carte pouvant contribuer par la suite à une mise au rebut de la carte électronique et de ses composants ou à des dysfonctionnements du moteur du système et au final à des opérations de maintenance voire de remplacement de l'ensemble carte-composants particulièrement coûteuses.  Indeed, the absence of lead in the metal alloy causes, in return, several disadvantages, particularly that of reducing the wettability of the alloy so that the weld tends not to "settle" over the entire available surface between the contacts. and the map. An imperfect weld of the components on the board is then obtained which can subsequently contribute to the scrapping of the electronic board and its components or to malfunctions of the engine of the system and ultimately to maintenance operations or even replacement of the particularly expensive card-component assembly.
La présente invention a pour but de remédier à ces inconvénients et concerne, à cet effet, un dispositif d'assemblage de composants sur une carte ou plaque de circuit imprimé, telle que celle d'un contrôleur de moteur électrique d'un système de ventilation, chauffage et climatisation d'un véhicule, ladite carte étant enduite d'une couche métallique de soudure.  The present invention aims to overcome these drawbacks and concerns, for this purpose, a device for assembling components on a printed circuit board or board, such as that of an electric motor controller of a ventilation system. , heating and air conditioning of a vehicle, said card being coated with a weld metal layer.
Selon l'invention, le dispositif se présente sous la forme d'un module intermédiaire disposé entre ladite carte et lesdits composants destinés à être montés sur celui-ci, et ledit module intermédiaire comprend :  According to the invention, the device is in the form of an intermediate module disposed between said card and said components intended to be mounted on it, and said intermediate module comprises:
- une pluralité d'éléments de liaison métalliques rapportés, d'un côté, sur ladite carte par refusion de la couche métallique de soudure et aptes à recevoir, de l'autre côté, distant de la carte, lesdits composants ; et a plurality of metallic connecting elements, on one side, on said card by reflow of the solder metal layer and able to receive, on the other side, remote from the card, said components; and
- un support isolant associant, de manière séparée les uns des autres, lesdits éléments de liaison métalliques. Ainsi, grâce au module intermédiaire monté en surface, par refusion, sur la carte de circuit imprimé et regroupant les « gros » composants, le dispositif s'affranchit des inconvénients liés notamment à la faible mouillabilité de l'alliage sans plomb utilisé lors du processus de soudage à la vague, ce qui ne se produit pas avec le processus de soudage par refusion. De plus, le module intermédiaire servant d'interface entre la carte et les composants concernés est alors rapporté sur celle-ci simultanément au montage des autres composants usuellement assemblés par refusion lors du même passage dans le four de refusion, ce qui n'implique pas une augmentation des coûts de fabrication de la carte. Après assemblage du module sur la carte, les gros composants (tels que, dans l'application préférentielle, les alimentations de la carte et du moteur, la bobine et le condensateur du filtre d'entrée) sont rapportés sur les éléments de liaison métalliques concernés du dispositif. an insulating support associating, separately from one another, said metallic connection elements. Thus, thanks to the intermediate module mounted on the surface, by reflow, on the printed circuit board and grouping the "large" components, the device overcomes the disadvantages related in particular to the low wettability of the lead-free alloy used during the process wave soldering, which does not occur with the reflow soldering process. In addition, the intermediate module serving as an interface between the board and the components concerned is then attached to it while assembling the other components usually assembled by reflow during the same passage in the reflow oven, which does not imply an increase in the cost of manufacturing the card. After assembly of the module on the card, the large components (such as, in the preferred application, the power supplies of the card and the motor, the coil and the capacitor of the input filter) are reported on the metal connecting elements concerned. of the device.
Selon une première caractéristique de l'invention, lesdits éléments de liaison métalliques présentent chacun une forme de patte pliée ayant une première partie d'extrémité à surface d'appui pour le contact avec ladite carte et une seconde partie d'extrémité pour la fixation audit support isolant.  According to a first feature of the invention, said metal connecting elements each have a folded tab form having a first end portion with a bearing surface for contact with said card and a second end portion for attachment to said insulating support.
Lesdites première et seconde parties d'extrémité des éléments de liaison métalliques sont décalées parallèlement l'une de l'autre par une partie centrale inclinée. Le support isolant est alors parallèle à la carte et proche de celle-ci, de sorte à minimiser son encombrement. De manière avantageuse, cette conformation des éléments de liaison dégage l'espace sur la carte et sous le module de sorte à y installer des composants ou autres.  Said first and second end portions of the metal connecting elements are offset parallel to one another by an inclined central portion. The insulating support is then parallel to the card and close to it, so as to minimize its size. Advantageously, this conformation of the connecting elements releases the space on the card and under the module so as to install components or others.
Selon une autre caractéristique de l'invention, ledit support isolant forme un cadre à la périphérie duquel sont issus lesdits éléments de liaison métalliques. De manière complémentaire, lesdits éléments de liaison font saillie extérieurement au cadre. Autrement dit, ces éléments de liaison s'étendent au-delà de la périphérie selon une direction sensiblement parallèle au plan général du support isolant.  According to another characteristic of the invention, said insulating support forms a frame at the periphery of which are derived said metal connecting elements. In a complementary manner, said connecting elements protrude outside the frame. In other words, these connecting elements extend beyond the periphery in a direction substantially parallel to the general plane of the insulating support.
Selon encore une autre caractéristique de l'invention, lesdits éléments de liaison métalliques se prolongent, au niveau des secondes parties d'extrémité, par des bornes de contact avec lesquelles sont destinés à coopérer les composants électriques à monter sur le module intermédiaire. According to yet another characteristic of the invention, said metallic connecting elements extend at the level of the second parts. end, by contact terminals with which are intended to cooperate the electrical components to be mounted on the intermediate module.
Lesdits éléments de liaison métalliques sont réalisés en cuivre ou alliage de cuivre et ledit support isolant est réalisé en matière plastique non conductrice d'électricité ou analogue résistante thermiquement.  Said metal connecting elements are made of copper or copper alloy and said insulating support is made of non-electrically conductive plastic material or the like thermally resistant.
Avantageusement, ledit support isolant est surmoulé sur lesdits éléments de liaison métalliques, les premières parties d'extrémité de ceux-ci faisant saillie extérieurement du support et les secondes parties d'extrémité étant noyées dans ledit support isolant, définissant des fentes latérales de réception.  Advantageously, said insulating support is overmolded on said metal connecting elements, the first end portions thereof protruding outside the support and the second end portions being embedded in said insulating support, defining side receiving slots.
Avantageusement encore, lesdites bornes de contact ont une section transversale rectangulaire, chaque élément de liaison métallique comprenant une borne pour la connexion d'un contact correspondant d'un composant à monter sur ledit module intermédiaire et/ou deux bornes espacées parallèlement l'une de l'autre pour le montage à force d'un contact correspondant de connexion issu d'un composant à monter.  Advantageously, said contact terminals have a rectangular cross section, each metal connection element comprising a terminal for connecting a corresponding contact of a component to be mounted on said intermediate module and / or two terminals spaced parallel to one of the other for the mounting force of a corresponding contact of connection from a component to be mounted.
L'invention vise également un contrôleur ou module de commande d'un groupe moto-ventilateur à moteur et roue de pulseur d'un système de ventilation, chauffage et/ou climatisation d'un véhicule automobile, comprenant une carte ou plaque de circuit imprimé, ladite carte étant enduite d'une couche métallique de soudure CM, dans lequel un dispositif d'assemblage de composants à ou sur la carte, tel que défini ci-dessus, est installé.  The invention also relates to a controller or control module of a motor-blower unit motor and blower wheel of a ventilation system, heating and / or air conditioning of a motor vehicle, comprising a card or printed circuit board said board being coated with a metal solder layer CM, wherein a device for assembling components to or on the board, as defined above, is installed.
Les figures annexées feront bien comprendre comment l'invention peut être réalisée et pourront servir à mieux définir l'invention, le cas échéant. Sur ces figures, des références identiques désignent des éléments semblables.  The appended figures will make it clear how the invention can be made and may serve to better define the invention, if necessary. In these figures, identical references designate similar elements.
La figure 1 montre, en perspective, un exemple de réalisation du dispositif d'assemblage à module intermédiaire conformément à l'invention, avant son montage sur la carte de circuit imprimé d'un système de ventilation, chauffage et climatisation d'un véhicule. La figure 2 est une vue de dessus des éléments de liaison métalliques du module. Figure 1 shows, in perspective, an embodiment of the intermediate module assembly device according to the invention, before mounting on the printed circuit board of a ventilation system, heating and air conditioning of a vehicle. Figure 2 is a top view of the metal connection elements of the module.
La figure 3 montre, en perspective, le dispositif d'assemblage à module, fixé à la carte de circuit imprimé et portant des composants électriques.  Figure 3 shows, in perspective, the module assembly device, attached to the printed circuit board and carrying electrical components.
La figure 4 est une vue de détail, en perspective agrandie et écorchée, de la liaison des pattes de contact d'un condensateur avec les bornes des éléments de liaison métalliques concernés du module.  FIG. 4 is a detail view, in enlarged and cutaway perspective, of the connection of the contact tabs of a capacitor with the terminals of the relevant metal connection elements of the module.
Dans l'exemple de réalisation illustré sur la figure 1 , le dispositif d'assemblage 1 de l'invention est défini par un module indépendant intermédiaire 2 assurant le rôle d'interface, comme on le verra ultérieurement en regard de la figure 3, entre une carte ou plaque de circuit imprimé C et des composants électriques CC, B à raccorder au moyen du dispositif 1 en des emplacements spécifiques de la carte. On comprend donc que ce module est distinct de la carte ou circuit imprimé, le module étant rapporté par brasage selon un procédé de refusion sur ladite carte.  In the exemplary embodiment illustrated in FIG. 1, the assembly device 1 of the invention is defined by an intermediate independent module 2 acting as an interface, as will be seen later with reference to FIG. a circuit board or circuit board C and electrical components CC, B to be connected by means of the device 1 at specific locations on the board. It is therefore clear that this module is separate from the printed circuit board or circuit board, the module being soldered by a reflow method on said card.
Pour cela, le module intermédiaire 2 comprend des éléments de liaison métalliques 3 assurant le passage du courant entre les emplacements spécifiques et les composants électriques à monter, et un support isolant 4 maintenant entre eux et de manière séparée les uns des autres, les éléments de liaison métalliques 3. Dans ce mode de réalisation, le module 2 a une forme sensiblement parallélépipédique plate donnée par le support isolant 4 qui définit un cadre rectangulaire. A la périphérie 4A de celui-ci sont prévus les éléments de liaison 3 qui sont au nombre de six dans cet exemple, deux issus centralement des grands côtés 4B du cadre et quatre issus deux à deux des petits côtés 4C du cadre. Bien évidemment, un nombre différent d'éléments de liaison 3 et une autre forme du support 4 pourraient être envisagés en fonction des spécificités requises.  For this, the intermediate module 2 comprises metal connecting elements 3 ensuring the passage of the current between the specific locations and the electrical components to be mounted, and an insulating support 4 now between them and separately from each other, the elements of 3. In this embodiment, the module 2 has a substantially parallelepipedal flat shape given by the insulating support 4 which defines a rectangular frame. At the periphery 4A thereof are provided the connecting elements 3 which are six in number in this example, two centrally from the long sides 4B of the frame and four from two to two of the short sides 4C of the frame. Of course, a different number of connecting elements 3 and another form of support 4 could be envisaged depending on the required specificities.
Plus particulièrement, les éléments de liaison métalliques 3 sont réalisés en un métal conducteur comme le cuivre ou alliage de cuivre et de préférence étamé. Structurellement, chaque élément de liaison 3 se présente sous une forme de patte aplatie pliée 3A, de section transversale rectangulaire, ayant des première 3B et seconde 3C parties d'extrémité reliées de manière décalée parallèlement l'une de l'autre par une partie centrale inclinée 3D. La première partie d'extrémité plate 3B constitue une surface d'appui plane 3E pour le contact avec la carte de circuit imprimé et l'ensemble de ces surfaces d'appui 3E des éléments est contenu dans un même plan pour s'appliquer parfaitement sur la couche métallique de soudure CM de la carte, afin d'y être soudé, selon l'invention, par refusion. La seconde partie d'extrémité plate 3C assure le maintien de chaque élément de liaison 3 avec le cadre du support 4 et, comme on le verra ci-après, la connexion électrique avec les composants. More particularly, the metal connecting elements 3 are made of a conductive metal such as copper or copper alloy and preferably tinned. Structurally, each connecting element 3 presents itself in the form of folded flat tab 3A, of rectangular cross-section, having first and second end portions 3C 3C connected in parallel with each other by a central inclined portion 3D. The first flat end portion 3B constitutes a flat bearing surface 3E for contact with the printed circuit board and all of these bearing surfaces 3E elements is contained in the same plane to apply perfectly on the solder metal layer CM of the card, in order to be welded, according to the invention, by reflow. The second flat end portion 3C ensures the maintenance of each connecting element 3 with the frame of the support 4 and, as will be seen below, the electrical connection with the components.
A ce propos, le support 4 est isolant d'un point de vu électrique et est réalisé en une matière plastique apte à supporter le profil thermique du four de refusion dans lequel le dispositif 1 monté en surface de la carte doit passer. Aussi la matière plastique est-elle résistante thermiquement, c'est-à- dire mécaniquement stable tant que la température est inférieure à 260°C (température maximum d'un four de refusion avec couche de soudure CM sans plomp). L'obtention du module 2 s'effectue, par exemple, par un surmoulage du support isolant 4 avec les secondes parties d'extrémité 3C des éléments de liaison métalliques 3 de sorte que ceux-ci, comme le montrent les figures 1 et 2, font saillie perpendiculairement des côtés 4B, 4C du cadre formant le support isolant.  In this regard, the support 4 is insulating from an electrical point of view and is made of a plastic material adapted to support the thermal profile of the reflow oven in which the device 1 mounted on the surface of the card must pass. Also the plastic is thermally resistant, that is to say mechanically stable as the temperature is below 260 ° C (maximum temperature of a reflow oven with CM solder layer without plomp). The obtaining of the module 2 is effected, for example, by an overmolding of the insulating support 4 with the second end portions 3C of the metal connecting elements 3 so that these, as shown in FIGS. 1 and 2, protrude perpendicularly from the sides 4B, 4C of the frame forming the insulating support.
On voit notamment, sur les figures 1 , 3 et 4 que les secondes parties d'extrémité 3C des éléments sont, après surmoulage, logées dans des fentes 4D obtenues dans le support lors de sa réalisation, lesquelles fentes 4D peuvent être borgnes, pour ce qui concerne les quatre éléments de liaison issus des petits côtés 4C, ou traversantes, pour ce qui concerne les deux éléments de liaison issus des grands côtés 4B du cadre. L'ensemble de ces secondes parties d'extrémité plates ou aplaties 3C se trouve dans un même plan décalé parallèlement de celui des premières parties d'extrémité aplaties 3B, un décalage étant opéré par les parties centrales inclinées 3D des éléments. De la sorte, le support isolant 4 est surélevé par rapport aux premières parties 3B et, donc, est éloigné parallèlement de la carte C. Celle-ci peut recevoir ainsi, sous le module, d'autres composants usuels. FIGS. 1, 3 and 4 show in particular that the second end portions 3C of the elements are, after overmoulding, housed in slots 4D obtained in the support during its production, which slots 4D may be blind, for this purpose which relates to the four connecting elements from the short sides 4C, or through, with respect to the two connecting elements from the long sides 4B of the frame. All of these second flat or flattened end portions 3C are in a same plane parallel to that of the first flattened end portions 3B, an offset being made by the inclined central portions 3D of elements. In this way, the insulating support 4 is raised relative to the first parts 3B and, therefore, is parallel to the card C. It can thus receive, under the module, other common components.
Par ailleurs, les secondes parties d'extrémité 3C des éléments de liaison 3 se prolongent toutes par des bornes de contact 3F avec lesquelles sont amenés à coopérer les composants électriques à monter. Comme le montrent les figures 1 et 2, ces bornes 3F sont, dans cet exemple, de type plat à section transversale rectangulaire mais pourraient être différentes en totalité ou d'un élément à l'autre. Dans notre exemple, les éléments de liaison 3 situés sur les petits côtés 4C du support isolant 4 en cadre sont munis chacun d'une borne 3F pliée perpendiculairement par rapport à la seconde partie d'extrémité 3C dont elle est issue, c'est-à-dire au cadre rectangulaire du support isolant, en étant tournée à l'opposé de la première partie d'extrémité 3B. Les bornes 3F débutent sur la partie latérale de la seconde partie d'extrémité 3C qui est tournée vers l'intérieur du support isolant.  Moreover, the second end portions 3C of the connecting elements 3 all extend through contact terminals 3F with which the electrical components to be mounted are co-operating. As shown in Figures 1 and 2, these terminals 3F are, in this example, flat type rectangular cross section but could be different in whole or from one element to another. In our example, the connecting elements 3 located on the short sides 4C of the insulating support 4 in the frame are each provided with a terminal 3F folded perpendicular to the second end portion 3C from which it is derived, that is, that is to say, the rectangular frame of the insulating support, being turned away from the first end portion 3B. Terminals 3F start on the side portion of the second end portion 3C which faces inwardly of the insulating support.
Les bornes 3F des deux éléments de liaison 3 situés sur le petit côté 4C à gauche sur la figure 2, constituent les bornes d'alimentation électrique, par exemple 12 volts, et de masse sur lesquelles se raccordent les bornes (contacts) complémentaires non représentées de la source d'alimentation électrique, et les bornes 3F des deux éléments de liaison 3 situés à droite sur la figure 2, concernent les bornes d'alimentation électrique et de masse sur lesquelles se raccordent celles, non représentées, issues du groupe moto- ventilateur du système. Pour recevoir les bornes de connexion complémentaires issues de la source d'alimentation et du groupe moto- ventilateur, le support isolant 4 présente deux embases rectangulaires 4E surmontant ce dernier et entourant les bornes concernées 3F des éléments de liaison. On constate donc que support isolant 4 présente une partie centrale vouer à recevoir les composants électriques à rapporter et des bornes d'alimentation 3F disposées de part et d'autre de cette partie centrale, au niveau des petit côté 4C du support isolant 4. L'élément de liaison 3 située au centre et en haut de la figure 2 comporte quatre bornes de liaisons 3F disposées perpendiculairement deux à deux, deux d'entrés elles étant parallèles à la direction générale de l'élément de liaison 3 de sorte que ces deux bornes 3F soient en face des deux bornes 3F de l'élément de liaison 3 située au centre et en bas de la figure 2. The terminals 3F of the two connecting elements 3 situated on the short side 4C on the left in FIG. 2, constitute the electrical power supply terminals, for example 12 volts, and the ground terminals to which the complementary terminals (contacts) not shown are connected. of the power supply source, and the terminals 3F of the two connecting elements 3 situated on the right in FIG. 2, relate to the power supply and ground terminals to which are connected those, not shown, coming from the motor group. system fan. To receive the complementary connection terminals from the power source and the motor-fan unit, the insulating support 4 has two rectangular bases 4E surmounting the latter and surrounding the relevant terminals 3F of the connecting elements. It can therefore be seen that the insulating support 4 has a central part intended to receive the electrical components to be reported and the supply terminals 3F disposed on either side of this central part, at the small side 4C of the insulating support 4. The connecting element 3 located at the center and at the top of FIG. 2 comprises four connection terminals 3F arranged perpendicularly in pairs, two of which are parallel to the general direction of the connecting element 3 so that these two terminals 3F are opposite the two terminals 3F of the connecting element 3 located in the center and bottom of Figure 2.
De même, les deux autres bornes 3F de l'élément de liaison 3 située au centre et en haut de la figure 2 sont placées dans le prolongement et en regard des bornes 3F de l'élément de liaison 3 située en haut et à gauche de la figure 2. Cette disposition des bornes 3F permet d'installer :  Similarly, the other two terminals 3F of the connecting element 3 located at the center and at the top of FIG. 2 are placed in the extension and opposite the terminals 3F of the connecting element 3 located at the top left of Figure 2. This arrangement of terminals 3F allows to install:
un premier composant entre l'élément de liaison 3 située en haut et à gauche de la figure 2 et l'élément de liaison 3 située au centre et en haut de cette même figure, et un second composant entre l'élément de liaison 3 située en haut et au centre de la figure 2 et l'élément de liaison 3 située en bas et au centre cette même figure.  a first component between the connecting element 3 situated at the top left of FIG. 2 and the connecting element 3 located at the center and at the top of this same figure, and a second component between the connecting element 3 situated above and in the center of Figure 2 and the connecting element 3 located at the bottom and center this same figure.
Comme le montre la figure 4, la fixation des pattes P formant les contacts du condensateur ou capacité chimique CC s'effectue par pincement obtenu à partir de deux bornes plates 3F espacées parallèlement l'une de l'autre et issues des secondes parties d'extrémité 3C des éléments de liaison métalliques situés sur les grands côtés 4B du support isolant en cadre 4. Ces bornes 3F se trouvent dans le prolongement des secondes parties d'extrémité 3C, parallèlement au plan du support, de sorte que les pattes P de forme cylindrique s'insèrent à force entre les deux bornes parallèles respectives des éléments de liaison 3.  As shown in FIG. 4, the fixing of the tabs P forming the contacts of the capacitor or chemical capacitance CC is effected by pinching obtained from two flat terminals 3F spaced parallel to one another and originating from the second parts of end 3C of the metal connecting elements located on the long sides 4B of the frame insulating support 4. These terminals 3F are in the extension of the second end portions 3C, parallel to the plane of the support, so that the legs P form cylindrical insert force between the two respective parallel terminals of the connecting elements 3.
Il en va de même pour fixer les pattes de contact non visibles de la bobine B partiellement illustrée sur la figure 3, et qui s'insèrent à force entre des paires de bornes parallèles 3F en vis-à-vis issues de deux éléments de liaison adjacents 3, l'un sur le petit côté 4C et l'autre sur le grand côté 4B, comme on le voit mieux sur la figure 2.  It is the same to fix the non-visible contact tabs of the coil B partially illustrated in FIG. 3, and which force fit between pairs of parallel terminals 3F facing each other from two connecting elements. adjacent 3, one on the short side 4C and the other on the long side 4B, as best seen in Figure 2.
Le support isolant 4 présente dans sa partie centrale des barreaux comportant des trous (deux par barreau) d'axe perpendiculaire aux bornes 3F des éléments de liaison centraux 3. La fonction de ces trous est d'offrir un accès pour passer les griffes d'une pince dont le but est de serrer les deux bornes 3F adjacentes contre des pattes P formant les contacts des composants à rapporter sur le modules 2. The insulating support 4 has in its central part bars having holes (two per bar) of axis perpendicular to the terminals 3F 3. The function of these holes is to provide access to pass the claws of a clamp whose purpose is to clamp the two adjacent terminals 3F against tabs P forming the contacts of the components to report on the modules 2.
Comme le montre la figure 3, avant le montage des composants sur le module intermédiaire 2 du dispositif d'assemblage 1 , les surfaces d'appui 3E des premières parties d'extrémité 3B des éléments de liaison métalliques 4 sont positionnées en des emplacements prédéterminés de la carte C, là où se trouve la couche métallique de soudure CM. Cette dernière sert bien évidemment à solidariser des composants usuels, non représentés, autres que ceux, plus volumineux, destinés au dispositif d'assemblage 1.  As shown in FIG. 3, before assembling the components on the intermediate module 2 of the assembly device 1, the bearing surfaces 3E of the first end portions 3B of the metal connecting elements 4 are positioned at predetermined locations of C card, where is the CM solder metal layer. The latter obviously serves to secure common components, not shown, other than those, larger, intended for the assembly device 1.
Par le passage de la carte de circuit imprimé C et du dispositif d'assemblage 1 monté en surface sur celle-ci dans le four de refusion non illustré, dont la chaleur fait fondre la couche CM (pâte à b raser) assurant la soudure, on obtient, après refroidissement, la solidarisation des premières parties d'extrémité 3B, via les surfaces d'appui, des éléments de liaison métalliques du module 2 sur la carte C, ainsi que celle des composants usuels prévus directement sur la carte C. Comme le soudage (brasage) par refusion n'implique pas les problèmes de mouillabilité engendrés par le soudage à la vague, le dispositif d'assemblage 1 est parfaitement fixé à la carte en assurant, par les éléments de liaison métalliques 3, la conduction électrique entre la carte et les composants à monter sur le module, d'autant plus que ces éléments en cuivre ou alliage de cuivre sont étamés de manière à être compatibles avec le processus de refusion sans plomb (par exemple, étain avec sous-couche en nickel).  Through the passage of the printed circuit board C and the assembly device 1 surface-mounted thereon in the non-illustrated reflow oven, the heat of which melts the layer CM (batter shaving) ensuring the welding, after cooling, the first end portions 3B are secured via the bearing surfaces of the metal connection elements of the module 2 on the card C, as well as that of the usual components provided directly on the card C. the soldering (soldering) by reflow does not imply the wettability problems generated by the wave soldering, the assembly device 1 is perfectly fixed to the card by ensuring, by the metal connecting elements 3, the electrical conduction between board and components to be mounted on the module, especially since these copper or copper alloy elements are tinned to be compatible with the lead-free reflow process (eg n with nickel undercoat).
Après sortie du four de refusion et refroidissement, les connectiques non représentées, comme celles de la source d'alimentation et du groupe moto-ventilateur, sont enfichées dans les embases respectives 4E du module intermédiaire 2 et raccordées aux bornes de contact parallèles concernées 3F. Puis, les pattes P du condensateur chimique CC et de la bobine B des gros composants sont introduites à force et pincées par les bornes parallèles correspondantes 3F. Cette opération peut être faite à l'aide d'un outil spécifique non représenté et est facilitée par les trous pratiqués dans les barreaux du support isolant 4 pour accéder à ces bornes. D'autres moyens de fixation des pattes sur les bornes pourraient être envisagés, tels qu'une solidarisation par laser notamment. After leaving the reflow oven and cooling, connections not shown, such as those of the power source and the motor-fan unit, are plugged into the respective bases 4E of the intermediate module 2 and connected to the relevant parallel contact terminals 3F. Then, the tabs P of the chemical capacitor CC and the coil B of the large components are force-fed and pinched by the parallel terminals. corresponding 3F. This operation can be done using a specific tool not shown and is facilitated by the holes in the bars of the insulating support 4 to access these terminals. Other means for fixing the tabs on the terminals could be envisaged, such as laser fastening in particular.

Claims

REVENDICATIONS
1. Dispositif d'assemblage de composants électriques ou analogues sur une carte ou plaque de circuit imprimé, caractérisé en ce qu'il se présente sous la forme d'un module intermédiaire (2) disposé entre ladite carte (C) et lesdits composants (CC, B,...) destinés à être montés sur celui-ci, et en ce que ledit module intermédiaire (2) comprend :  1. Device for assembling electrical components or the like on a printed circuit board or board, characterized in that it is in the form of an intermediate module (2) arranged between said board (C) and said components ( CC, B, ...) intended to be mounted thereto, and in that said intermediate module (2) comprises:
- une pluralité d'éléments de liaison métalliques (3) apte à être rapportés, d'un côté, sur ladite carte (C) par refusion et aptes à recevoir, de l'autre côté, distant de la carte, lesdits composants ; et  - A plurality of metal connecting elements (3) adapted to be reported on one side, on said card (C) by reflow and able to receive, on the other side, remote from the card, said components; and
- un support isolant (4) associant, de manière séparée les uns des autres, lesdits éléments de liaison métalliques (3). - an insulating support (4) associating, separately from each other, said metal connecting elements (3).
2. Dispositif selon la revendication 1 , dans lequel lesdits éléments de liaison métalliques (3) présentent chacun une forme de patte pliée (3A) ayant une première partie d'extrémité (3B) à surface d'appui (3E) pour le contact avec ladite carte et une seconde partie d'extrémité (3C) pour la fixation audit support isolant (4).  2. Device according to claim 1, wherein said metal connecting elements (3) each have a folded leg shape (3A) having a first end portion (3B) with a bearing surface (3E) for contact with said card and a second end portion (3C) for attachment to said insulating support (4).
3. Dispositif selon la revendication précédente dans lequel lesdites première et seconde parties d'extrémité (3B, 3C) des éléments de liaison métalliques (3) sont décalées parallèlement l'une de l'autre par une partie centrale inclinée (3D).  3. Device according to the preceding claim wherein said first and second end portions (3B, 3C) of the metal connecting elements (3) are offset parallel to each other by an inclined central portion (3D).
4. Dispositif selon l'une des revendications précédentes 1 à 3, dans lequel ledit support isolant (4) forme un cadre à la périphérie (4A) duquel sont issus lesdits éléments de liaison métalliques (3).  4. Device according to one of the preceding claims 1 to 3, wherein said insulating support (4) forms a frame at the periphery (4A) which are derived from said metal connecting elements (3).
5. Dispositif selon la revendication 4, dans lequel lesdits éléments de liaison (3) font saillie extérieurement au cadre.  5. Device according to claim 4, wherein said connecting elements (3) project externally to the frame.
6. Dispositif selon l'une quelconque des revendications précédentes, dans lequel lesdits éléments de liaison métalliques (3) se prolongent, au niveau des secondes parties d'extrémité (3C), par des bornes (3F) avec lesquelles sont destinés à coopérer les composants électriques à monter sur le module intermédiaire (2). 6. Device according to any one of the preceding claims, wherein said metal connecting elements (3) are extended at the second end portions (3C) by terminals (3F) with which are intended to cooperate the electrical components to be mounted on the intermediate module (2).
7. Dispositif selon l'une quelconque des revendications précédentes, dans lequel lesdits éléments de liaison métalliques (3) sont réalisés en cuivre ou alliage de cuivre. 7. Device according to any one of the preceding claims, wherein said metal connecting elements (3) are made of copper or copper alloy.
8. Dispositif selon l'une quelconque des revendications précédentes, dans lequel ledit support isolant (4) est réalisé en matière plastique ou analogue résistante thermiquement.  8. Device according to any one of the preceding claims, wherein said insulating support (4) is made of plastic or thermally resistant material.
9. Dispositif selon la revendication précédente, dans lequel ledit support isolant (4) est surmoulé sur lesdits éléments de liaison métalliques (3), les premières parties d'extrémité (3B) de ceux-ci faisant saillie extérieurement du support (4) et les secondes parties d'extrémité (3C) étant noyées dans ledit support isolant (4), définissant des fentes latérales de réception (4D).  9. Device according to the preceding claim, wherein said insulating support (4) is overmolded on said metal connecting elements (3), the first end portions (3B) thereof protruding externally from the support (4) and the second end portions (3C) being embedded in said insulating support (4), defining side receiving slits (4D).
10. Dispositif selon la revendication 6, dans lequel lesdites bornes (3F) ont une section transversale rectangulaire, chaque élément de liaison métallique (3) comprenant une borne pour la connexion d'un contact correspondant d'un composant à monter sur ledit module intermédiaire (2) et/ou deux bornes espacées parallèlement l'une de l'autre pour le montage à force d'un contact correspondant de connexion issu d'un composant à monter.  10. Device according to claim 6, wherein said terminals (3F) have a rectangular cross section, each metal connecting element (3) comprising a terminal for connecting a corresponding contact of a component to be mounted on said intermediate module. (2) and / or two terminals spaced parallel to each other for force mounting a corresponding contact of connection from a component to be mounted.
1 1. Contrôleur d'un groupe moto-ventilateur à moteur et roue de pulseur d'un système de ventilation, chauffage et/ou climatisation d'un véhicule automobile, comprenant une carte ou plaque de circuit imprimé, ladite carte étant enduite d'une couche métallique de soudure (CM), caractérisé en ce qu'il est équipé d'un dispositif d'assemblage (1) tel que défini selon l'une quelconque des revendications précédentes.  1 1. Controller of a motor-driven fan motor unit and blower wheel of a ventilation, heating and / or air-conditioning system for a motor vehicle, comprising a printed circuit board or board, said board being coated with a metal welding layer (CM), characterized in that it is equipped with an assembly device (1) as defined according to any one of the preceding claims.
PCT/EP2011/001384 2010-03-30 2011-03-21 Device for assembling electric components on a printed circuit WO2011120644A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102963237A (en) * 2012-11-28 2013-03-13 芜湖博耐尔汽车电气系统有限公司 Circuit board fixing mechanism for automobile air conditioner control panel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020160632A1 (en) * 2001-04-26 2002-10-31 Ralph Maldonado Low pitch, high density connector
EP1996000A2 (en) * 2007-05-24 2008-11-26 Delphi Technologies, Inc. Stand-off mounting apparatus for discrete electrical components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2785259Y (en) * 2005-03-23 2006-05-31 比亚迪股份有限公司 Controller for air-conditioning system of vehicles
CN100490138C (en) * 2006-08-07 2009-05-20 南茂科技股份有限公司 Semiconductor encapsulation structure for improving wafer shift upon pressing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020160632A1 (en) * 2001-04-26 2002-10-31 Ralph Maldonado Low pitch, high density connector
EP1996000A2 (en) * 2007-05-24 2008-11-26 Delphi Technologies, Inc. Stand-off mounting apparatus for discrete electrical components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102963237A (en) * 2012-11-28 2013-03-13 芜湖博耐尔汽车电气系统有限公司 Circuit board fixing mechanism for automobile air conditioner control panel

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CN102934533A (en) 2013-02-13

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