WO2011116968A3 - Système et procédé de traitement à base de faisceau laser - Google Patents

Système et procédé de traitement à base de faisceau laser Download PDF

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Publication number
WO2011116968A3
WO2011116968A3 PCT/EP2011/001481 EP2011001481W WO2011116968A3 WO 2011116968 A3 WO2011116968 A3 WO 2011116968A3 EP 2011001481 W EP2011001481 W EP 2011001481W WO 2011116968 A3 WO2011116968 A3 WO 2011116968A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
beam based
based processing
present
efficient
Prior art date
Application number
PCT/EP2011/001481
Other languages
English (en)
Other versions
WO2011116968A2 (fr
Inventor
Oliver Haupt
Frank Siegel
Original Assignee
Laser Zentrum Hannover E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Zentrum Hannover E.V. filed Critical Laser Zentrum Hannover E.V.
Publication of WO2011116968A2 publication Critical patent/WO2011116968A2/fr
Publication of WO2011116968A3 publication Critical patent/WO2011116968A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Abstract

Selon un premier aspect, la présente invention concerne un système ou un dispositif permettant un traitement rapide, efficace et souple à base de faisceau laser. La présente invention fournit en outre un procédé de traitement à base de faisceau laser, par exemple dans le domaine de la formation par laser de haute précision de motifs et de microstructures ou de surfaces de grande échelle.
PCT/EP2011/001481 2010-03-24 2011-03-24 Système et procédé de traitement à base de faisceau laser WO2011116968A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10003131 2010-03-24
EP10003131.9 2010-03-24

Publications (2)

Publication Number Publication Date
WO2011116968A2 WO2011116968A2 (fr) 2011-09-29
WO2011116968A3 true WO2011116968A3 (fr) 2012-06-07

Family

ID=44227572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/001481 WO2011116968A2 (fr) 2010-03-24 2011-03-24 Système et procédé de traitement à base de faisceau laser

Country Status (1)

Country Link
WO (1) WO2011116968A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103962719B (zh) * 2013-02-01 2017-04-12 三星显示有限公司 掩模制造装置及利用激光束制造掩模的方法

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Publication number Priority date Publication date Assignee Title
DE102013100509A1 (de) * 2012-01-20 2013-07-25 Rofin-Baasel Lasertech Gmbh & Co. Kg Verfahren zum Herstellen einer Berstscheibe
DE102012010635B4 (de) 2012-05-18 2022-04-07 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
KR20140036593A (ko) 2012-09-17 2014-03-26 삼성디스플레이 주식회사 레이저 가공 장치
KR102208818B1 (ko) 2012-11-20 2021-01-28 삼성디스플레이 주식회사 레이저 가공 장치
TWI543833B (zh) 2013-01-28 2016-08-01 先進科技新加坡有限公司 將半導體基板輻射開槽之方法
CN103240524B (zh) * 2013-05-23 2015-07-08 广东工业大学 一种基于扫描振镜的分时分焦装置及方法
DE102014012733B3 (de) * 2014-08-26 2015-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Abtastung einer Objektfläche mit mehreren Laserstrahlen und Verfahren zum Betrieb der Anordnung
TW201611933A (en) * 2014-09-19 2016-04-01 Youngtek Electronics Corp Laser beam splitting angle pick-up device
DE102015004646A1 (de) * 2015-04-15 2016-10-20 Jenoptik Optical Systems Gmbh Verfahren und Vorrichtung zum Erzeugen eines Lichtpunkts
CN116727865A (zh) * 2017-10-25 2023-09-12 株式会社尼康 加工装置及移动体的制造方法
DE102020123790A1 (de) 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen eines Werkstücks
DE102020123789A1 (de) 2020-09-11 2022-03-17 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Trennen eines Werkstücks
CN116673604B (zh) * 2023-07-10 2024-03-26 武汉元禄光电技术有限公司 一种增加单次激光刻蚀线宽和提高效率的方法及装置

Citations (6)

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GB2337720A (en) * 1998-05-29 1999-12-01 Exitech Ltd Apparatus and method for drilling microvia holes in electrical circuit interconnection packages
EP1043110A2 (fr) * 1999-04-02 2000-10-11 Murata Manufacturing Co., Ltd. Méthode d'usinage de feuilles crue de céramique et appareil pour la fabrication de celles-ci
US20030103107A1 (en) * 2001-11-30 2003-06-05 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm
US6635849B1 (en) * 1999-03-05 2003-10-21 Mitsubishi Denki Kabushiki Kaisha Laser beam machine for micro-hole machining
JP2008173651A (ja) * 2007-01-16 2008-07-31 Mitsubishi Electric Corp Ｄｏｅ調整方法およびレーザ加工装置
EP2143518A1 (fr) * 2008-07-11 2010-01-13 INNOLAS SYSTEMS GmbH Dispositif de traitement laser et procédé de traitement laser doté d'un point focal double ou multiple à l'aide d'un scanner galvanométrique

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3346374B2 (ja) 1999-06-23 2002-11-18 住友電気工業株式会社 レーザ穴開け加工装置
JP4664852B2 (ja) 2006-03-31 2011-04-06 三菱電機株式会社 レーザ加工装置
DE102007037133A1 (de) 2006-08-24 2008-03-13 Nanosystec Gmbh Verfahren und Vorrichtung zur Erzeugung einer Mehrzahl von Material-Schwächungsbereichen oder Perforierungen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2337720A (en) * 1998-05-29 1999-12-01 Exitech Ltd Apparatus and method for drilling microvia holes in electrical circuit interconnection packages
US6635849B1 (en) * 1999-03-05 2003-10-21 Mitsubishi Denki Kabushiki Kaisha Laser beam machine for micro-hole machining
EP1043110A2 (fr) * 1999-04-02 2000-10-11 Murata Manufacturing Co., Ltd. Méthode d'usinage de feuilles crue de céramique et appareil pour la fabrication de celles-ci
US20030103107A1 (en) * 2001-11-30 2003-06-05 Chen-Hsiung Cheng Method of laser milling using constant tool path algorithm
JP2008173651A (ja) * 2007-01-16 2008-07-31 Mitsubishi Electric Corp Ｄｏｅ調整方法およびレーザ加工装置
EP2143518A1 (fr) * 2008-07-11 2010-01-13 INNOLAS SYSTEMS GmbH Dispositif de traitement laser et procédé de traitement laser doté d'un point focal double ou multiple à l'aide d'un scanner galvanométrique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103962719B (zh) * 2013-02-01 2017-04-12 三星显示有限公司 掩模制造装置及利用激光束制造掩模的方法

Also Published As

Publication number Publication date
WO2011116968A2 (fr) 2011-09-29

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