WO2011108358A3 - Dispenser for highly viscous fluid - Google Patents

Dispenser for highly viscous fluid Download PDF

Info

Publication number
WO2011108358A3
WO2011108358A3 PCT/JP2011/053309 JP2011053309W WO2011108358A3 WO 2011108358 A3 WO2011108358 A3 WO 2011108358A3 JP 2011053309 W JP2011053309 W JP 2011053309W WO 2011108358 A3 WO2011108358 A3 WO 2011108358A3
Authority
WO
WIPO (PCT)
Prior art keywords
viscous fluid
highly viscous
dispenser
discharging
outlet
Prior art date
Application number
PCT/JP2011/053309
Other languages
French (fr)
Other versions
WO2011108358A2 (en
Inventor
Toru Imaizumi
Kouichi Ozaki
Original Assignee
Dow Corning Toray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co., Ltd. filed Critical Dow Corning Toray Co., Ltd.
Priority to CN201180010320XA priority Critical patent/CN102770216A/en
Priority to KR1020127025581A priority patent/KR20130036216A/en
Priority to US13/582,100 priority patent/US20120325864A1/en
Priority to EP11708581A priority patent/EP2542351A2/en
Publication of WO2011108358A2 publication Critical patent/WO2011108358A2/en
Publication of WO2011108358A3 publication Critical patent/WO2011108358A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Reciprocating Pumps (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lubricants (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Details Of Reciprocating Pumps (AREA)

Abstract

The present invention relates to a dispenser for discharging a highly viscous fluid which possesses a viscosity ranging from 10 to 1,000 Pa's at 25°C and contains filler particles, the dispenser comprising: (i) a highly viscous fluid- supply part (A) equipped with a container (3) containing said highly viscous fluid (M) and possessing an outlet (3a) of said highly viscous fluid, a plunger (2) capable of discharging said highly viscous fluid from said outlet by pressing said highly viscous fluid contained in said container, and a servomotor (4) driving said plunger; and (ii) a highly viscous fluid- discharge part (B) equipped with a pipe (7) arranged for delivering said highly viscous fluid discharged from said outlet, an openable and closable valve (8) connected to said pipe, and a discharge port (9) for discharging said highly viscous fluid. The dispenser according to the present invention can stably discharge a specified amount of a highly viscous fluid containing filler particles for a long period of time, and can be used even in a clean room.
PCT/JP2011/053309 2010-03-03 2011-02-09 Dispenser for highly viscous fluid WO2011108358A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201180010320XA CN102770216A (en) 2010-03-03 2011-02-09 Dispenser for highly viscous fluid
KR1020127025581A KR20130036216A (en) 2010-03-03 2011-02-09 Dispenser for highly viscous fluid
US13/582,100 US20120325864A1 (en) 2010-03-03 2011-02-09 Dispenser For Highly Viscous Fluid
EP11708581A EP2542351A2 (en) 2010-03-03 2011-02-09 Dispenser for highly viscous fluid

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010046768A JP2011179468A (en) 2010-03-03 2010-03-03 Dispenser for high viscosity fluid
JP2010-046768 2010-03-03

Publications (2)

Publication Number Publication Date
WO2011108358A2 WO2011108358A2 (en) 2011-09-09
WO2011108358A3 true WO2011108358A3 (en) 2011-11-10

Family

ID=44246274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/053309 WO2011108358A2 (en) 2010-03-03 2011-02-09 Dispenser for highly viscous fluid

Country Status (7)

Country Link
US (1) US20120325864A1 (en)
EP (1) EP2542351A2 (en)
JP (1) JP2011179468A (en)
KR (1) KR20130036216A (en)
CN (1) CN102770216A (en)
TW (1) TW201143910A (en)
WO (1) WO2011108358A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9393586B2 (en) * 2012-11-21 2016-07-19 Nordson Corporation Dispenser and method of dispensing and controlling with a flow meter
US9847265B2 (en) 2012-11-21 2017-12-19 Nordson Corporation Flow metering for dispense monitoring and control
US10105725B2 (en) 2013-02-18 2018-10-23 The Boeing Company Fluid application device
US9016530B2 (en) 2013-05-03 2015-04-28 The Boeing Company Control valve having a disposable valve body
CN103386392B (en) * 2013-07-17 2015-09-16 常州欧凯电器有限公司 A micro machine sebific duct oiling device
US9095872B2 (en) 2013-07-26 2015-08-04 The Boeing Company Feedback control system for performing fluid dispensing operations
US9757759B2 (en) 2013-08-09 2017-09-12 The Boeing Company Method and apparatus for concurrently dispensing and fairing high viscosity fluid
US10525603B2 (en) 2013-08-22 2020-01-07 The Boeing Company Method and apparatus for exchanging nozzles and tips for a fluid dispensing system
US20150064357A1 (en) 2013-09-03 2015-03-05 The Boeing Company Tool for Applying a Fluid onto a Surface
US9501067B2 (en) * 2013-09-19 2016-11-22 Gpd Global, Inc. Fluid pressure regulation system for fluid-dispensing systems
CN103698187B (en) * 2013-12-27 2016-03-30 天津口岸检测分析开发服务有限公司 A kind of standard solution configures instrument and auto-allocation method automatically
CN104128217B (en) * 2014-07-15 2015-12-02 辽东学院 The quantitative quick filling machine of titrating solution
CN104456033B (en) * 2014-11-28 2017-01-04 鞍钢集团铁路运输设备制造公司 A kind of batch (-type) measured lubrication system and lubricating method
US9579678B2 (en) 2015-01-07 2017-02-28 Nordson Corporation Dispenser and method of dispensing and controlling with a flow meter
US9884329B2 (en) 2015-03-19 2018-02-06 The Boeing Company Adhesive applicator having reversibly extensible first and second edges
US20180347750A1 (en) * 2015-08-23 2018-12-06 Ramon Arreola Motorized Fluid Dispensing and Suction Apparatus
US10105728B2 (en) * 2015-10-15 2018-10-23 The Boeing Company Systems and apparatuses for applying glutinous substances
AU2017418989A1 (en) * 2017-06-15 2019-10-17 Halliburton Energy Services, Inc. Gel shear strength measurement using a cross-spring pivot
WO2019039852A1 (en) * 2017-08-22 2019-02-28 주식회사 엘지화학 Method for determining heat dissipation material dispensing device
US11598325B2 (en) 2017-08-22 2023-03-07 Lg Chem, Ltd. Method for determining dispensing apparatus for heat-dissipating material
TWI658869B (en) * 2017-11-17 2019-05-11 統旺科技工業股份有限公司 Fluid distributor
JP2020065990A (en) * 2018-10-26 2020-04-30 本田技研工業株式会社 Coating applicator
CN109529727B (en) * 2018-12-04 2021-06-15 吴�琳 Quantitative liquid feeding device for preparing perfume
KR102135050B1 (en) * 2018-12-21 2020-07-17 주식회사 성우하이텍 Adhesive applicator
CN110479550A (en) * 2019-06-11 2019-11-22 汉腾汽车有限公司 A kind of application of pressure transmitter in Glue Spreading Robot system
CN111335880A (en) * 2020-03-25 2020-06-26 西南石油大学 Fluid injection diagnosis test indoor test device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6527142B1 (en) * 1998-10-23 2003-03-04 Musashi Engineering, Inc. Liquid constant rate discharge method and device
US20060219166A1 (en) * 2005-03-31 2006-10-05 Toray Engineering Co., Ltd. Applicator device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2772188B2 (en) * 1992-01-23 1998-07-02 武蔵エンジニアリング株式会社 Liquid dispenser syringe plunger
JPH0658246A (en) * 1992-08-05 1994-03-01 F D K Eng:Kk Metering pump device
US6267266B1 (en) * 1995-11-16 2001-07-31 Nordson Corporation Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate
JPH1026060A (en) * 1996-07-08 1998-01-27 Mitsubishi Electric Corp Fuel injection device
US5927560A (en) * 1997-03-31 1999-07-27 Nordson Corporation Dispensing pump for epoxy encapsulation of integrated circuits
JP2000265943A (en) * 1999-03-11 2000-09-26 Noiberuku Kk Liquid discharging device
WO2002053297A1 (en) * 2000-12-27 2002-07-11 Toray Industries, Inc. Mouthpiece and device and method for applying coating fluid
US7018477B2 (en) * 2002-01-15 2006-03-28 Engel Harold J Dispensing system with a piston position sensor and fluid scanner
JP2007070492A (en) * 2005-09-07 2007-03-22 Hitachi Ltd Heat conductive grease, adhesive and elastomer composition, and cooling device
CN101257978A (en) * 2005-09-13 2008-09-03 新时代技研株式会社 Coating apparatus of heavy viscous material
JP4942978B2 (en) 2005-09-30 2012-05-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Thermally conductive silicone grease composition and semiconductor device using the same
JP4495749B2 (en) 2006-06-16 2010-07-07 信越化学工業株式会社 Thermally conductive silicone grease composition
JP2008274036A (en) 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd Silicone grease composition for heat radiation
KR100867429B1 (en) * 2007-05-08 2008-11-06 주식회사 케이씨텍 Device and method for coating a substrate
JP5272196B2 (en) 2008-08-22 2013-08-28 Ｕｈｔ株式会社 Cutting device
US20100133360A1 (en) * 2008-12-01 2010-06-03 Giovanni Gaetano Liquid food dispensing apparatus with programmably controlled depositor modules

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6527142B1 (en) * 1998-10-23 2003-03-04 Musashi Engineering, Inc. Liquid constant rate discharge method and device
US20060219166A1 (en) * 2005-03-31 2006-10-05 Toray Engineering Co., Ltd. Applicator device

Also Published As

Publication number Publication date
KR20130036216A (en) 2013-04-11
US20120325864A1 (en) 2012-12-27
TW201143910A (en) 2011-12-16
JP2011179468A (en) 2011-09-15
WO2011108358A2 (en) 2011-09-09
EP2542351A2 (en) 2013-01-09
CN102770216A (en) 2012-11-07

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