WO2011107072A3 - Cool-wall rack system - Google Patents

Cool-wall rack system Download PDF

Info

Publication number
WO2011107072A3
WO2011107072A3 PCT/DE2011/000192 DE2011000192W WO2011107072A3 WO 2011107072 A3 WO2011107072 A3 WO 2011107072A3 DE 2011000192 W DE2011000192 W DE 2011000192W WO 2011107072 A3 WO2011107072 A3 WO 2011107072A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
group
computing device
support structure
heat
Prior art date
Application number
PCT/DE2011/000192
Other languages
German (de)
French (fr)
Other versions
WO2011107072A2 (en
Inventor
Thomas Lewin
Thomas Endrullat
Original Assignee
Lewin Industries Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lewin Industries Gmbh filed Critical Lewin Industries Gmbh
Publication of WO2011107072A2 publication Critical patent/WO2011107072A2/en
Publication of WO2011107072A3 publication Critical patent/WO2011107072A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a component-group carrier (1) for a computing device (100), to which at least one electronic component group (104) of the computing device (100) that produces waste heat can be fastened such that the component-group carrier bears the weight of the at least one electronic component group (104). The invention further relates to a support structure (102) for a computing device (100) having at least one component group (104) that produces waste heat and a computing device (100) having a plurality of individual computers (104). According to the invention, in order to improve the cooling and the ease of installation of known component-group carriers and support structures, the component-group carrier (1) is designed as a heat sink (1a) having a heat dissipating element (2) and having at least one heat absorbing surface (6), which can be coupled to the component group (104) in a thermally conducting manner at least in some sections. According to the invention, this aim is achieved by the support structure (102) mentioned at the beginning in that the support structure (102) has a support device (101), which supports at least one component-group carrier according to the invention.
PCT/DE2011/000192 2010-03-01 2011-02-28 Cool-wall rack system WO2011107072A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010009761.6 2010-03-01
DE201010009761 DE102010009761A1 (en) 2010-03-01 2010-03-01 Cooling wall rack system

Publications (2)

Publication Number Publication Date
WO2011107072A2 WO2011107072A2 (en) 2011-09-09
WO2011107072A3 true WO2011107072A3 (en) 2012-02-09

Family

ID=44502000

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2011/000192 WO2011107072A2 (en) 2010-03-01 2011-02-28 Cool-wall rack system

Country Status (2)

Country Link
DE (1) DE102010009761A1 (en)
WO (1) WO2011107072A2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231456A1 (en) * 1985-12-13 1987-08-12 Ascom Hasler AG Process and device for the transfer of waste heat by at least one element of an electrical assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US7012807B2 (en) 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
DE202004010204U1 (en) * 2004-06-30 2004-09-16 Schroff Gmbh Rectangular housing for modular electronic building blocks, has top and bottom flat members accommodating manifolds for distributing and collecting cooling fluid supplied to individual building blocks
CN101044811A (en) 2004-11-14 2007-09-26 利伯特公司 Integrated heat exchanger(s) in a rack for vertical board style computer systems
US8117938B2 (en) 2006-07-05 2012-02-21 Ghsp, Inc. Shifter with shape memory alloy and safety
US8164901B2 (en) 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231456A1 (en) * 1985-12-13 1987-08-12 Ascom Hasler AG Process and device for the transfer of waste heat by at least one element of an electrical assembly

Also Published As

Publication number Publication date
DE102010009761A1 (en) 2011-09-01
WO2011107072A2 (en) 2011-09-09

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