WO2011102088A1

WO2011102088A1 - Electronic component

Info

Publication number: WO2011102088A1
Application number: PCT/JP2011/000559
Authority: WO
Inventors: 溝口　直樹; 正人野宮
Original assignee: 株式会社村田製作所
Priority date: 2010-02-18
Filing date: 2011-02-02
Publication date: 2011-08-25
Also published as: TW201206062A

Abstract

Disclosed is an electronic component with which generation of defective products in the manufacturing process can be suppressed and also with which magnetic permeability and dielectric constant can be readily adjusted. A magnetic resin layer (3) is provided on the main face of a multilayer substrate (2) formed by baking, and therefore there is no need for the unified simultaneous baking of a laminated dielectric ceramic layer and magnetic ceramic layer that is conventionally performed. Also, there is no risk at all of generation of defects at the interface between the multilayer substrate (2) and the magnetic resin layer (3), said defects being caused by heat when baking, and consequently generation of defective products in the manufacturing process can be suppressed. The dielectric constant of the multilayer substrate (2) can be readily adjusted by forming the multilayer substrate (2) by laminating and baking a ceramic green sheet having the desired dielectric constant. Furthermore, the magnetic permeability of the magnetic resin layer (3) can be readily adjusted by mixing various types of magnetic material and resin material, and consequently the magnetic permeability and dielectric constant can be readily adjusted.

Description

Electronic components

The present invention relates to a multilayer electronic component in which a pattern for forming a capacitor or a coil is provided.

Conventionally, an electronic component as a multilayer filter formed by simultaneously firing a laminated magnetic ceramic layer and a dielectric ceramic layer is known (see, for example, Patent Document 1). For example, in the multilayer filter 1500 shown as an example of the electronic component in FIG. 40, the coil layer 1504 by the conductor pattern 1513 is provided inside the magnetic ceramic layer 1501, and two or more internal electrodes 1505 to 1508 are inside. Dielectric

ceramic layers

1502 and 1503 in which capacitors are formed by being disposed are laminated on the upper and lower sides of the magnetic ceramic layer 1501, respectively. A capacitor and inductor layer 1504 is connected to the external electrodes 1510 and 1511 to form a multilayer filter 1500.

In the multilayer filter 1500, a plurality of magnetic ceramic green sheets for forming the magnetic ceramic layer 1501, a plurality of dielectric ceramic green sheets for forming the dielectric

ceramic layers

1502 and 1503, and a predetermined wiring pattern are formed. A multilayer substrate is configured by laminating green sheets. A multilayer substrate composed of a plurality of laminated ceramic green sheets is fired at around 1000 ° C. to produce a multilayer filter 1500 (so-called LTCC (Low Temperature Co-fired Ceramic). Ceramic) substrate). 40 is a view showing a multilayer filter 1500 which is an example of a conventional electronic component, and FIG. 40A is a perspective view showing the internal configuration through the body of the multilayer filter 1500, and FIG. FIG. 2 is a perspective view showing an appearance.

Japanese Unexamined Patent Publication No. 2003-69358 (paragraphs [0003], [0005], FIGS. 9, 10 and the like)

By the way, when the multilayer filter 1500 is fired at the same time, the magnetic ceramic layer 1501 and the dielectric

ceramic layers

1502 and 1503 contract due to evaporation of the solvent and binder contained in each green sheet. Since the magnetic ceramic layer 1501 and the dielectric

ceramic layers

1502 and 1503 which are different materials have different shrinkage amounts, stress is likely to be generated at the boundary between the layers 1501 to 1503. Accordingly, there is a possibility that warpage, undulation, distortion, cracking, etc. may occur in the multilayer substrate that has been co-fired. If warping, undulation, distortion, cracking, etc. occur in the multilayer filter 1500 during the manufacturing process, In this process, a defect occurs, or a mounting failure occurs when the manufactured multilayer filter 1500 is mounted.

Further, if a space is formed at the boundary between each of the layers 1501 to 1503 due to the difference in shrinkage between the magnetic ceramic layer 1501 and the dielectric

ceramic layers

1502 and 1503 and peeling occurs inside the multilayer substrate, the characteristics of the coil and the capacitor There is a possibility that the magnetic permeability and the dielectric constant that affect the resistance change. If the magnetic permeability and dielectric constant of each of the layers 1501 to 1503 change, desired coil characteristics and capacitor characteristics cannot be obtained.

In order to solve these problems, it is conceivable that the ceramic material constituting each of the layers 1501 to 1503 is selected so that the thermal contraction amounts of the magnetic ceramic layer 1501 and the dielectric

ceramic layers

1502 and 1503 are substantially the same. . However, in this case, since the ceramic composition material constituting each of the layers 1501 to 1503 is limited, the selection range of the magnetic permeability of the magnetic ceramic layer 1501 and the dielectric constant of the dielectric

ceramic layers

1502 and 1503 is significantly narrowed. Therefore, there is a problem that the multilayer filter 1500 having desired characteristics cannot be obtained, or even if the desired characteristics are obtained, the size of the multilayer filter 1500 is increased.

The present invention has been made in view of the above problems, and provides an electronic component capable of suppressing the occurrence of defective products in the manufacturing process and easily adjusting the magnetic permeability and the dielectric constant. Objective.

In order to achieve the above object, an electronic component of the present invention includes a multilayer substrate formed by firing laminated ceramic green sheets, and a magnetic resin layer provided on at least one main surface of the multilayer substrate. (Claim 1).

The electronic component of the present invention may further include a coil pattern that forms a coil (claim 2).

The coil pattern may be formed in a helical shape in the stacking direction of the multilayer substrate.

The coil pattern may be provided in contact with the magnetic resin layer (claim 4).

Further, at least a part of the coil pattern may be provided inside the magnetic resin layer (Claim 5).

Further, a metal film layer provided on the main surface of the magnetic resin layer opposite to the multilayer substrate is further provided, and the metal film layer is provided so as to overlap at least a part of the coil pattern in a top view. (Claim 6).

The electronic component of the present invention may further include a resonator pattern that forms a resonator (claim 7).

Further, as the resonator pattern, a first resonator pattern that forms a first resonator having a first coil and a second resonator pattern that forms a second resonator having a second coil are formed on the upper surface. The magnetic resin layer may be provided at least between the first coil pattern that forms the first coil and the second coil pattern that forms the second coil. Good (claim 8).

A cavity disposed between the first coil pattern and the second coil pattern may be provided in the multilayer substrate, and the cavity may be filled with a magnetic resin. ).

Further, a mask layer provided on a main surface of the multilayer substrate provided with the magnetic resin layer may be further provided, and the mask layer may be provided so as to surround the magnetic resin layer ( Claim 10).

The magnetic resin layer may be formed of a plurality of layers having different magnetic permeability (claim 11).

According to the invention of claim 1, the magnetic resin layer is provided on at least one main surface of the multilayer substrate formed by firing the laminated ceramic green sheets. That is, a multilayer substrate is formed by firing as a dielectric ceramic layer, and a magnetic resin layer is provided on at least one main surface of the formed multilayer substrate. Since there is no need to stack layers together and fire simultaneously, there may be warping, waviness, distortion, cracking, space, etc. due to heat during firing at the boundary between the multilayer substrate and the magnetic resin layer The generation of defective products in the manufacturing process can be suppressed. In addition, when a green sheet including a magnetic layer is fired, it is generally fired in an oxidizing atmosphere. In this case, it is necessary to use a metal that is difficult to oxidize, such as silver, as an electrode used inside. However, in this structure, since the magnetic layer is provided after firing, the green sheet on which the internal pattern is formed can be fired even in a reducing atmosphere. Therefore, it is also possible to use a metal that is easily oxidized, such as a copper electrode, for the internal electrode.

Moreover, the dielectric constant of the multilayer substrate can be easily adjusted by laminating and firing ceramic green sheets having a desired dielectric constant to form a multilayer substrate, and various magnetic materials and resin materials can be mixed. Since the magnetic permeability of the magnetic resin layer can be easily adjusted, the magnetic permeability and the dielectric constant can be easily adjusted.

According to the invention of claim 2, the electronic component of the present invention further includes a coil pattern forming a coil, and the coil pattern is formed so that a part of the magnetic field generated from the coil passes through the magnetic layer. This is practical because the inductance of the coil can be easily adjusted without changing the coil pattern by adjusting the magnetic permeability of the magnetic resin layer. Further, by adjusting the magnetic permeability of the magnetic resin layer, a large inductance can be obtained even if the coil pattern is reduced, so that the electronic component can be downsized.

According to the invention of claim 3, since the coil pattern is helically formed in the stacking direction of the multilayer substrate, the inductance of the coil increases in proportion to the square of the number of turns of the coil in the stacking direction. Since the magnetic flux generated by energizing the pattern is concentrated in the direction along the central axis of the coil, the magnetic resin layer is provided on at least one main surface of the multilayer substrate, so that the direction along the central axis of the coil Since the magnetic flux density of the magnetic flux generated in a concentrated manner can be increased efficiently, the coil inductance can be adjusted and increased more efficiently.

According to the invention of claim 4, the coil pattern is provided in contact with the magnetic resin layer, and the coil inductance can be adjusted more effectively by adjusting the magnetic permeability of the magnetic resin layer. .

According to the invention of claim 5, at least a part of the coil pattern is provided inside the magnetic resin layer, and the inductance of the coil is adjusted more effectively by adjusting the magnetic permeability of the magnetic resin layer. can do.

According to the sixth aspect of the present invention, the metal film layer is further provided on the main surface of the magnetic resin layer on the side opposite to the multilayer substrate, and the metal film layer overlaps at least a part of the coil pattern in a top view. Therefore, radiation and radiation generated from the coil can be suppressed by grounding the metal film layer.

According to the invention of claim 7, the electronic component of the present invention further includes a resonator pattern that forms a resonator, and resonates without changing the resonator pattern by adjusting the magnetic permeability of the magnetic resin layer. This is practical because the resonance frequency of the vessel can be easily adjusted. Further, by adjusting the magnetic permeability of the magnetic resin layer, a desired resonance frequency can be obtained even if the resonator pattern is reduced, and thus the electronic component can be reduced in size.

According to the invention of claim 8, as the resonator pattern, the first resonator pattern forming the first resonator having the first coil and the second resonance forming the second resonator having the second coil. The first and second coil patterns forming the first coil and the second coil pattern are electromagnetically coupled to form various filter circuits. Can do. At this time, magnetic flux generated in the first coil and the second coil by providing a magnetic resin layer between the first coil pattern forming the first coil and the second coil pattern forming the second coil. Are concentrated on the magnetic resin layer, so that the electromagnetic coupling due to the magnetic flux generated in each coil is inhibited, the electromagnetic coupling between the first coil and the second coil is weakened, and the coupling coefficient becomes small. The coupling coefficient in the electromagnetic coupling between the first coil and the second coil can be easily adjusted only by providing the magnetic resin layer.

According to invention of Claim 9, the cavity arrange | positioned between the 1st coil pattern which forms a 1st coil, and the 2nd coil pattern which forms a 2nd coil is provided in the multilayer substrate, Since the magnetic resin is filled in the magnetic resin, the magnetic flux generated in the first coil and the second coil concentrates on the magnetic resin filled in the cavity, so that the magnetic resin functions as an electromagnetic shield. The coupling coefficient in the electromagnetic coupling between the first coil and the second coil can be further reduced.

According to the tenth aspect of the present invention, it further comprises a mask layer provided on the main surface of the multilayer substrate provided with the magnetic resin layer, and the mask layer is provided so as to surround the magnetic resin layer. When a magnetic resin layer is provided on the main surface of the multilayer substrate with a magnetic resin paste or a magnetic resin mold, a desired portion of the main surface of the multilayer substrate ( The magnetic resin layer can be formed at the position).

According to the invention of claim 11, since the magnetic resin layer is formed of a plurality of layers having different magnetic permeability, the magnetic permeability of the magnetic resin layer can be adjusted more efficiently. For example, if the magnetic resin layer is formed so that the magnetic permeability of the surface layer is maximized or the magnetic loss is increased, radiation and radiation from the coil can be suppressed. In addition, this effect can be achieved even when there is a single magnetic resin layer. If the magnetic resin layer to be applied is selected to have a high magnetic permeability or a magnetic loss, radiation and radiation from the coil can be achieved. Can be effectively suppressed.

It is a figure which shows the multilayer chip type | mold resonator element which is 1st Embodiment of the electronic component of this invention. It is a figure which shows the equivalent circuit of the multilayer chip | tip resonator element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type | mold resonator element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type | mold resonator element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type | mold resonator element shown in FIG. It is a figure which shows the modification of the shape of a coil pattern. It is a figure which shows the modification of the structure of a coil pattern. It is a figure which shows the modification of the structure of a coil pattern. It is a figure which shows the example in which the mask layer was provided. It is a figure which shows the example from which the layer in which a coil pattern is provided differs. It is a figure which shows the example from which the layer in which a coil pattern is provided differs. It is a figure which shows the multilayer chip type | mold band pass filter element which is 2nd Embodiment of the electronic component of this invention. It is a figure which shows the equivalent circuit of the multilayer chip type band pass filter element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type band pass filter element shown in FIG. It is a figure which shows the multilayer chip type | mold planar resonator element which is 3rd Embodiment of the electronic component of this invention. FIG. 16 is a diagram showing an equivalent circuit of the multilayer chip type plate resonator element shown in FIG. 15. It is a figure which shows an example of the frequency characteristic of the multilayer chip type | mold planar resonator element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type | mold planar resonator element shown in FIG. It is a figure which shows the modification of a resonator pattern. It is a figure which shows the modification of a resonator pattern. It is a figure which shows the modification of a resonator pattern. It is a figure which shows the multilayer chip-type resonator element which is 4th Embodiment of the electronic component of this invention. It is a figure which shows 5th Embodiment of the electronic component of this invention. It is a principal part enlarged view of 6th Embodiment of the electronic component of this invention. It is a figure which shows an example of the relationship between the number of turns of a helical coil, and an inductance. It is a figure which shows an example of the relationship between the number of turns of a helical type coil, and Q value. It is a figure which shows the multilayer chip type | mold band pass filter element which is 7th Embodiment of the electronic component of this invention. It is a figure which shows the equivalent circuit of the multilayer chip type band pass filter element shown in FIG. It is a figure which shows an example of the frequency characteristic of the multilayer chip type band pass filter element shown in FIG. It is a figure which shows the modification of a coil pattern. It is a figure for demonstrating the effect by providing a magnetic body resin layer in a multilayer substrate. It is a figure which shows the equivalent circuit of the multilayer chip type band pass filter element which is 8th Embodiment of the electronic component of this invention. It is a figure which shows an example of the frequency characteristic of the multilayer chip type band pass filter element shown in FIG. It is a figure which shows the multilayer chip type | mold band pass filter element which is 9th Embodiment of the electronic component of this invention. It is a figure which shows the modification of the magnetic body resin layer provided in a multilayer substrate. It is a figure which shows the modification of the magnetic body resin layer provided in a multilayer substrate. It is a figure which shows the modification of the magnetic body resin layer provided in a multilayer substrate. It is a figure which shows the modification of the magnetic body resin layer provided in a multilayer substrate. It is a figure which shows the modification of the magnetic body resin layer provided in a multilayer substrate. It is a figure which shows the multilayer filter which is an example of the conventional electronic component.

<First Embodiment>
A multilayer chip resonator element 1 as a first embodiment of an electronic component of the present invention will be described with reference to FIGS.

FIG. 1 is a diagram showing a multilayer chip resonator element 1 according to the first embodiment, in which (a) is a cross-sectional view, and (b) to (f) are respective layers 3 constituting the multilayer chip resonator element 1. 20 to 23 are plan views, and (g) is a bottom view of the wiring layer 24. FIG. FIG. 2 is a diagram showing an equivalent circuit of the resonator circuit 4 provided in the multilayer chip resonator element 1 shown in FIG. 3 to 5 are diagrams showing examples of frequency characteristics of the multilayer chip resonator element 1 shown in FIG.

(Constitution)
As shown in FIG. 1A, a multilayer chip resonator element 1 includes a multilayer substrate 2 formed by firing laminated ceramic green sheets, and a magnetic body provided on one main surface of the multilayer substrate 2. As shown in FIG. 2, a resonator circuit 4 (corresponding to the “resonator pattern” of the present invention) formed of a conductor pattern such as Ag or Cu is provided inside the element 1. ing. The multilayer chip resonator element 1 has a width × length × height of about 8 mm on top of the multilayer substrate 2 formed in a shape of width × length × height of about 8 mm × 6 mm × 0.5 mm. A magnetic resin layer 3 formed in a shape of × 6 mm × 0.1 mm is laminated to form a so-called chip-type electronic component.

The multilayer substrate 2 includes a coil layer 20, a first capacitor layer 21, a second capacitor layer 22, a third capacitor layer 23, and a wiring layer 24, which are laminated and fired to form an integral dielectric ceramic. It is formed as a layer. The ceramic green sheets forming the layers 20 to 24 are obtained by forming a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent into a sheet by a film forming apparatus, and the temperature is higher than about 1000 ° C. The so-called low temperature firing is possible at a low temperature. The ceramic green sheets cut into a predetermined shape are subjected to via formation and various pattern printing using a conductor paste such as Ag or Cu to form the layers 20 to 24.

As shown in FIG. 1C, the coil layer 20 is provided with a spiral coil pattern 20a for forming the coil L1. An interlayer connection conductor (via conductor) 20b formed by filling a conductive paste is provided at one end of the coil pattern 20a for connection to the ground electrode G. Further, an interlayer connection conductor 20c having a via structure is provided at the other end of the coil pattern 20a for connection to the electrode pattern 21a forming the capacitor C3.

As shown in FIG. 1D, the first capacitor layer 21 is provided with an electrode pattern 21a that forms one electrode of the capacitor C3, and an interlayer connection conductor 21b having a via structure is provided at a predetermined location. ing. Further, as shown in FIG. 5E, the second capacitor layer 22 is provided with an electrode pattern 22a that forms the other electrode of the capacitor C3 and one electrode of the capacitors C1 and C2, and a predetermined location. In addition, an interlayer connection conductor 22b having a via structure is provided.

As shown in FIG. 1 (f), the third capacitor layer 23 is provided with an electrode pattern 23a that forms the other electrode of the capacitor C1 and an electrode pattern 23b that forms the other electrode of the capacitor C2. An interlayer connection conductor 23c having a via structure is provided at the location. The third capacitor layer 23 is provided with an interlayer connection conductor 23d for connecting the electrode pattern 23a and the input electrode P1, and an interlayer connection conductor 23e for connecting the electrode pattern 23b and the output electrode P2. ing.

As shown in FIG. 1 (g), the wiring layer 24 is provided with an input electrode P1, an output electrode P2, and a ground electrode G. One end of the coil pattern 20a of the coil layer 20 and the ground electrode G are connected via interlayer connection conductors 20b, 21b, 22b, and 23c. The other end of the coil pattern 20a of the coil layer 20 and the electrode pattern 21a of the first capacitor layer 21 are connected via an interlayer connection conductor 20c. The electrode pattern 23a of the third capacitor layer 23 and the input electrode P1 are connected via an interlayer connection conductor 23d, and the electrode pattern 23b of the third capacitor layer 23 and the output electrode P2 are connected via an interlayer connection conductor 23e. Thus, a resonator circuit 4 is formed.

As shown in FIG. 1B, the magnetic resin layer 3 is formed of, for example, a thermosetting resin, and various magnetic materials are mixed into the resin so that the magnetic resin layer 3 is desired. Is formed so as to have a magnetic permeability μr. Examples of the thermosetting resin include an epoxy resin, a phenol resin, and a cyanate resin.

In the following description, the magnetic permeability μr represents the relative magnetic permeability, and the dielectric constant εr represents the relative dielectric constant.

Next, an outline of an example of a method for manufacturing the multilayer chip resonator element 1 of FIG. 1 will be described. The multilayer chip resonator element 1 of this embodiment is manufactured by first forming the multilayer substrate 2 by low-temperature firing, and providing the magnetic resin layer 3 on one main surface of the formed multilayer substrate 2.

First, via holes are formed in a green sheet formed in a predetermined shape with a laser or the like and filled with a conductive paste to form via holes (via conductors) for interlayer connection. A conductive paste such as Ag or Cu Thus, a predetermined pattern is printed, and five green sheets for forming the respective layers 20 to 24 constituting the multilayer substrate 2 are prepared. Each green sheet is provided with a plurality of electrode patterns so that a large number of multilayer substrates 2 can be formed at a time.

Next, the layers 20 to 24 are laminated to form a laminate. Then, grooves for dividing the individual multilayer substrates 2 after firing are formed so as to surround the regions of the individual multilayer substrates 2. Subsequently, the multilayer body 2 is fired at a low temperature while being pressed to form an aggregate of the multilayer substrates 2.

Next, before being divided into individual multilayer substrates 2, a resin sheet is laminated on the aggregate of multilayer substrates 2, and this is heat-cured to provide the magnetic resin layer 3 on each multilayer substrate 2. Then, the multilayer chip resonator element 1 is completed by being divided into individual electronic components.

(Characteristic)
Next, the frequency characteristics of the multilayer chip resonator element 1 will be described. The resonance frequency f of the resonator is
f = 1 / 2π (L · C) ^1/2
Since L can be expressed as inductance C: capacitance, the resonance frequency f decreases as the inductance L or capacitance C increases.

Also, the size of the inductance L is generally proportional to the size of the magnetic permeability μr. Therefore, if the magnetic permeability μr of the member around the coil is increased, the inductance L is increased, and thereby the resonance frequency of the resonance frequency f is decreased.

(Frequency characteristics with and without magnetic resin layer 3)
FIG. 3 is a diagram showing the frequency characteristics of the multilayer chip resonator element 1 and the frequency characteristics of the resonator circuit 4 formed by the multilayer substrate 2 in a state where the magnetic resin layer 3 is not provided. The upper curve in the figure shows a reflection characteristic which is a power ratio between a signal input to the input electrode P1 and a reflected signal reflected inside the resonator circuit 4 and returning to the input electrode P1 (hereinafter referred to as “reflection”). Called "characteristics"). Also, the lower curve in the figure shows a pass characteristic that is a power ratio between the signal input to the input electrode P1 and the signal output from the output electrode P2 (hereinafter referred to as “pass characteristic”).

In FIG. 3, the dotted curve indicates the frequency characteristics of the resonator circuit 4 by the multilayer substrate 2 in the state where the magnetic resin layer 3 is not provided, and the solid curve indicates the multilayer chip resonator element 1. The frequency characteristic is shown, and the peak in the pass characteristic is the resonance frequency of the multilayer chip resonator element 1.

In the example shown in FIG. 3, the multilayer substrate 2 is formed so that the dielectric constant εr is 6 and the magnetic permeability μr of the magnetic resin layer 3 is 2. In the example described below, the multilayer substrate 2 is configured so that the magnetic permeability μr is 1.

As shown in FIG. 3, the resonance frequency f of the multilayer chip resonator element 1 provided with the magnetic resin layer 3 moves to the low frequency side.

(Frequency characteristics due to change of magnetic permeability μr of magnetic resin layer 3)
FIG. 4 shows the frequency characteristics of the multilayer chip resonator element 1 when the magnetic permeability μr of the magnetic resin layer 3 is changed. The upper curve shows the reflection characteristics and the lower curve passes. Show properties. The rightmost curve in the figure shows an example when the magnetic permeability of the magnetic resin layer 3 is configured to be 1, and hereinafter, the permeability of the magnetic resin layer 3 in order toward the low frequency side. An example is shown in which the magnetic susceptibility μr is configured to be 2, 4, 8, and 16.

As shown in FIG. 4, as the magnetic permeability μr of the magnetic resin layer 3 increases, the resonance frequency f of the multilayer chip resonator element 1 moves to the lower frequency side.

(Frequency characteristics due to change in thickness of magnetic resin layer 3)
FIG. 5 shows the frequency characteristics of the multilayer chip resonator element 1 when the thickness of the magnetic resin layer 3 is changed. The upper curve shows the reflection characteristics, and the lower curve shows the pass characteristics. Show. The rightmost curve in the figure shows an example when the magnetic resin layer 3 is not provided. Hereinafter, the thickness of the magnetic resin layer 3 is 0.05 mm and 0.1 mm in order toward the low frequency side. , 0.2 mm, 0.4 mm, and 1.0 mm.

As shown in FIG. 5, the amount of magnetic field generated in the coil L1 leaks outside the magnetic resin layer 3 as the thickness of the magnetic resin layer 3 increases, so that the multilayer chip resonator element The resonance frequency f of 1 moves to the low frequency side. Thus, by adjusting the thickness of the magnetic resin layer 3, the frequency characteristics of the multilayer chip resonator element 1 can be easily adjusted.

(Modification of coil pattern shape)
6A and 6B are diagrams showing modifications of the shape of the coil pattern, in which FIG. 6A shows a meander-shaped coil pattern 20d, FIG. 6B shows a line-shaped coil pattern 20e, and FIG. 6C shows a spiral-shaped coil pattern. The coil pattern 20f is shown. In the above example, the spiral coil pattern 20a is formed on one surface of the coil layer 20. However, the coil pattern 20d may be formed in the meander shape shown in FIG. The coil pattern 20e may be formed in the line shape shown, or the coil pattern may be formed in the spiral shape shown in FIG.

(Modified example of coil pattern structure)
FIG. 7 is a view showing a modification of the structure of the coil pattern 20 d, wherein (a) is a cross-sectional view of the multilayer chip resonator element 1, and (b) is a plan view of the coil layer 20. As shown in FIG. 7A, the magnetic resin layer 3 may be filled between the coil patterns 20a by forming the coil pattern 20d in a convex shape on one surface of the coil layer 20. .

8A and 8B are views showing a modification of the structure of the coil pattern 20d, where FIG. 8A is a cross-sectional view of the multilayer chip resonator element 1, and FIG. 8B is a plan view of the coil layer 20. FIG. As shown in FIG. 8A, the coil pattern 20d is formed so as to be buried in one surface of the coil layer 20, so that a ceramic layer as a dielectric is filled between the coil patterns 20a. Also good.

(Example in which mask layer 5 is provided)
FIG. 9 is a diagram showing an example in which a mask layer 5 is provided, where (a) is a cross-sectional view of the multilayer chip resonator element 1, (b) is a plan view of (a), and (c) is a mask layer. FIG.

9A and 9B, a mask layer 5 may be provided on the main surface of the multilayer substrate 2 provided with the magnetic resin layer 3 so as to surround the magnetic resin layer 3. The mask layer 5 may be formed of the same material as the ceramic constituting the multilayer substrate 2. That is, when the multilayer substrate 2 is formed, the mask layer 5 can be provided by further laminating and firing a green sheet processed as the mask layer 5.

If comprised in this way, since the mask layer 5 is provided so that the main surface of the multilayer substrate 2 may surround the magnetic body resin layer 3, it is multilayered by the magnetic body resin paste which has fluidity | liquidity, or a magnetic body resin mold. When the magnetic resin layer 3 is provided on the main surface of the substrate 2, the magnetic resin layer 3 can be formed at a predetermined position on the main surface of the multilayer substrate 2 by filling the mask layer 5 with a paste or a mold. It is possible to prevent the dripping from the edge of the main surface.

The shape of the mask layer 5 may be any shape as long as it surrounds the coil pattern 20d in a top view. For example, the mask layer is formed as a mask layer 5a shown in FIG. It may be configured.

(Example in which the coil pattern 20d is provided inside the multilayer substrate 2)
10A and 10B are diagrams showing examples in which the layers on which the coil pattern 20d is provided are different. FIG. 10A is a sectional view of the multilayer chip resonator element 1, and FIG. The frequency characteristics of the multilayer chip resonator element 1 at this time are shown, with the upper curve showing the reflection characteristics and the lower curve showing the pass characteristics. As shown in FIG. 10A, in this example, the coil pattern 20 d is provided in the vicinity of the interface between the multilayer substrate 2 and the magnetic resin layer 3 and inside the multilayer substrate 2.

Even with this configuration, as shown in FIG. 10B, the resonance frequency f of the multilayer chip resonator element 1 moves to the low frequency side. The rightmost curve in the figure shows an example when the magnetic resin layer 3 is not provided. Hereinafter, the coil pattern 20d has a depth of 0.025 mm from the interface in order toward the low frequency side. An example in which the coil pattern 20d is provided at a depth of 0.0125 mm from the interface and an example in which the coil pattern 20d is provided at the interface are shown.

Further, in the configuration shown in FIG. 10, since the coil pattern 20d is formed inside the multilayer substrate 2, the environmental resistance (durability) of the coil pattern 20d is improved and the coil pattern 20d is arranged in the vicinity of the coil pattern 20d. The resonance frequency can be finely adjusted by the magnetic resin layer 3.

(Example in which the coil pattern 20d is provided inside the magnetic resin layer 3)
FIG. 11 is a diagram showing an example in which the layer provided with the coil pattern 20d is different. (A) is a cross-sectional view of the multilayer chip resonator element 1, and (b) the coil pattern 20d is placed inside the magnetic resin layer 3. The frequency characteristic of the multilayer chip resonator element 1 when provided is shown, the upper curve shows the reflection characteristic, and the lower curve shows the pass characteristic. As shown in FIG. 11A, in this example, the coil pattern 20 d is provided in the vicinity of the interface between the multilayer substrate 2 and the magnetic resin layer 3 and inside the magnetic resin layer 3.

With this configuration, as shown in FIG. 11B, the resonance frequency f of the multilayer chip resonator element 1 can be moved to the lower frequency side. The rightmost curve in the figure shows an example when the magnetic resin layer 3 is not provided. Hereinafter, an example in which the coil pattern 20d is provided at the interface in the order toward the low frequency side, the coil An example in which the pattern 20d is provided at a height of 0.0125 mm from the interface is shown.

Therefore, according to this embodiment, the multilayer substrate 2 is formed as a dielectric ceramic layer by firing the laminated ceramic green sheets, and the magnetic resin layer 3 is formed on one main surface of the formed multilayer substrate 2. Since the electronic component having the magnetic resin layer 3 provided on the main surface of the multilayer substrate 2 is formed, the dielectric ceramic layer and the magnetic ceramic layer are laminated and integrated as in the past. There is no need for simultaneous firing, and there is no possibility of warping, undulation, distortion, cracking, space, or the like caused by heat during firing at the boundary between the multilayer substrate 2 and the magnetic resin layer 3, so in the manufacturing process Generation of defective products can be suppressed.

In addition, the dielectric constant of the multilayer substrate 2 can be easily adjusted by laminating and firing ceramic green sheets having a desired dielectric constant to form the multilayer substrate 2, and various magnetic materials and resin materials can be mixed. By doing so, the magnetic permeability μr of the magnetic resin layer 3 can be easily adjusted, so that the magnetic permeability μr and the dielectric constant εr can be easily adjusted.

Further, it is practical because the inductance L of the coil can be easily adjusted without changing the coil patterns 20a, 20d, 20e, and 20f by adjusting the magnetic permeability μr of the magnetic resin layer 3. Further, by adjusting the magnetic permeability μr of the magnetic resin layer 3, a large inductance L can be obtained even if the coil patterns 20a, 20d, and 20e are reduced. The electronic component can be downsized.

Further, by providing the coil patterns 20a, 20d, 20e, and 20f in the magnetic resin layer 3, the magnetic permeability μr of the magnetic resin layer 3 is adjusted, so that the coil inductance L is more effectively adjusted. be able to.

Further, it is practical because the resonance frequency f of the resonator circuit 4 can be easily adjusted without changing the circuit pattern of the resonator circuit 4 by adjusting the magnetic permeability μr of the magnetic resin layer 3. Further, by adjusting the magnetic permeability μr of the magnetic resin layer 3, a desired resonance frequency f can be obtained even if the circuit pattern forming the resonator circuit 4 is reduced. 1 can be reduced in size.

Conventionally, when a coil having a large inductance L is required, in order to form a coil having a desired inductance L, the coil pattern must be formed in a necessary length and shape. However, according to the configuration described above, the inductance L of the coil can be increased by the magnetic resin layer 3, so that the coil having a large inductance L inside the electronic component can be obtained. The height of the electronic component can be reduced.

Second Embodiment
Next, a multilayer chip type bandpass filter element 100 as a second embodiment of the electronic component of the present invention will be described with reference to FIGS.

12A and 12B are diagrams showing a multilayer chip type bandpass filter element 100 according to the second embodiment, in which FIG. 12A is a cross-sectional view, and FIGS. 12B to 10K are layers constituting the multilayer chip type bandpass filter element 100. FIG. 3 is a plan view of 103, 120-128. FIG. 13 is a diagram showing an equivalent circuit of the band pass filter circuit 104 provided in the multilayer chip type band pass filter element 100 shown in FIG. FIG. 14 is a diagram showing an example of frequency characteristics of the multilayer chip type bandpass filter element 100 shown in FIG.

The second embodiment is different from the first embodiment in that the circuit configuration provided in the multilayer chip type bandpass filter (BPF) element 100 is different as shown in FIGS. . Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by assigning a corresponding symbol.

(Constitution)
As shown in FIG. 12A, a multilayer chip type BPF element 100 includes a multilayer substrate 102 formed by firing laminated ceramic green sheets, and a magnetic resin provided on one main surface of the multilayer substrate 102. As shown in FIG. 13, a band pass filter circuit 104 formed of a conductor pattern such as Ag or Cu is provided therein. The multilayer chip type BPF element 100 is formed as a so-called chip type electronic component having a width × length × height of about 1.0 mm × 0.5 mm × 0.3 mm.

The multilayer substrate 102 includes a first coil layer 120, a connection layer 121, a second coil layer 122, an insulator (dielectric) layer 123, a first capacitor layer 124, a second capacitor layer 125, and a third capacitor layer. The capacitor layer 126, the wiring layer 127, and the dielectric layer 128 are laminated and fired to form a single body. Each of the layers 120 to 128 is formed of a ceramic green sheet similar to the ceramic green sheet described in the first embodiment. In this embodiment, the multilayer substrate 102 has a dielectric constant εr of 60. Has been.

As shown in FIG. 12C, the first coil layer 120 is provided with a pair of left and right coil patterns 120a that form the coil L11. The other end of each of the coil patterns 120a is connected to the one end 122b of each of the pair of left and right coil patterns 122a formed on the second coil layer 122 and the interlayer connection conductors 121a and 121b having a via structure provided symmetrically to the connection layer 121. Connected through. One end 120b of the left coil pattern 120a is connected to the input electrode P11 which is an external electrode, and one end 120c of the right coil pattern 120a is connected to the output electrode P12 which is an external electrode.

As shown in FIG. 12D, the connection layer 121 is connected to the other end of each of the two coil patterns 120 a of the first coil layer 120 and one end 122 b of the two coil patterns 122 a of the second coil layer 122. Interlayer connection conductors 121a and 121b having a via structure are provided. Further, as shown in FIG. 12E, the second coil layer 122 is provided with line-shaped coil patterns 122a forming the coil L12 symmetrically. One end 122b of the coil pattern 122a is connected to the other end of each coil pattern 120a formed on the left and right sides of the first coil layer 120 via the interlayer connection conductors 121a and 121b, and the other end of each coil pattern 122a. 122c is connected to the ground electrode G of the wiring layer 127 via an external electrode.

As shown in FIG. 12 (f), the insulator layer 123 is provided to adjust the interval between the electrode patterns. Also, as shown in FIG. 12G, the first capacitor layer 124 is provided with an electrode pattern 124a, and the electrode pattern 124a and the electrode patterns 125a and 125b provided on the second capacitor layer 125 are used. A capacitor C11 is formed.

As shown in FIG. 12 (h), the second capacitor layer 125 includes electrode patterns 125a and 125b for forming the capacitor C11, one electrode pattern 125a for forming one electrode of the capacitor C12, and one of the capacitor C13. The electrode pattern 125b for forming the electrode is provided. The electrode pattern 125a is connected to the input electrode P11 that is an external electrode, and the electrode pattern 125b is connected to the output electrode P12 that is an external electrode.

As shown in FIG. 12 (i), the third capacitor layer 126 is provided with an electrode pattern 126a that forms the other electrode of the capacitor C12 and an electrode pattern 126b that forms the other electrode of the capacitor C13. The electrode patterns 126a and 126b are connected to the ground electrode G of the wiring layer 127 via external electrodes, respectively.

As shown in FIG. 12 (j), the wiring layer 127 is provided with a ground electrode G. Then, the ground electrode G is connected to the other end 122c of the coil pattern 122a of the second coil layer 122 shown in FIG. 12 (e) via the external electrode and the electrode of the third capacitor layer 126 shown in FIG. 12 (i). The band-pass filter circuit 104 is formed by connecting the patterns 126a and 126b. Further, as shown in FIG. 12 (k), the insulator layer 123 is provided to adjust the interval between the electrode patterns.

As shown in FIG. 12B, the magnetic resin layer 103 is formed of a magnetic resin similar to the magnetic resin described in the first embodiment.

The multilayer chip type BPF element 100 is manufactured by a method similar to the manufacturing method described in the first embodiment.

(Frequency characteristics of bandpass filter)
Next, frequency characteristics of the multilayer chip type BPF element 100 will be described. FIG. 14 is a diagram showing the frequency characteristics of the multilayer chip type BPF element 100. The upper curve shows the reflection characteristics, and the lower curve shows the pass characteristics. Further, in each of the reflection characteristics and the transmission characteristics in the figure, the two curves on the right side indicate the frequency characteristics depending on the presence or absence of the magnetic resin layer 103, and the two curves on the left side indicate the magnetic resin layer 3. The frequency characteristic by the change of thickness is shown.

(1) Frequency characteristics depending on presence / absence of magnetic resin layer 103 In the example shown in FIG. 14, the magnetic resin layer 3 is configured such that the permeability μr is 1 and the thickness is 0.1 mm. Also, among the two curves on the right side of the figure, the right side shows an example when the magnetic resin layer 103 is not provided, and the left side shows an example when the magnetic resin layer 103 is provided. . As shown in the figure, the resonance frequency f of the multilayer chip type BPF element 100 provided with the magnetic resin layer 103 moves to the low frequency side.

(2) Frequency characteristics due to change in thickness of magnetic resin layer 103 In the example shown in FIG. 14, the magnetic resin layer 103 having a permeability μr of 20 is provided on the multilayer substrate 102. Of the two curves on the left side of the figure, the right side shows an example when the thickness of the magnetic resin layer 103 is 0.05 mm, and the left side shows an example when the thickness of the magnetic resin layer 103 is 0.1 mm. Indicates. As shown in the figure, when the thickness of the magnetic resin layer 103 is increased, the resonance frequency f of the multilayer chip type BPF element 100 moves to the lower frequency side.

As described above, also in this embodiment, the same effects as in the first embodiment can be obtained.

<Third Embodiment>
Next, a multilayer chip type plate resonator element 200 according to a third embodiment of the electronic component of the present invention will be described with reference to FIGS.

15A and 15B are diagrams showing a multilayer chip type plate resonator element 200 according to the third embodiment. FIG. 15A is a cross-sectional view, and FIGS. 203 and 220 are plan views, and (d) is a bottom view of the wiring layer 221. FIG. FIG. 16 is a diagram showing an equivalent circuit of the resonator circuit 204 provided in the multilayer chip type plate resonator element 200 shown in FIG. 17 and 18 are diagrams showing an example of frequency characteristics of the multilayer chip type plate resonator element 200 shown in FIG.

The third embodiment differs from the first and second embodiments in that the circuit configuration provided inside the multilayer chip type plate resonator element 200 is different as shown in FIGS. . The multilayer chip type plate resonator element 200 in this embodiment is configured as a distributed constant type resonator having a line length corresponding to a wavelength corresponding to a frequency of a signal to be blocked. Since other configurations are the same as those of the first and second embodiments, description of the configurations is omitted by assigning corresponding reference numerals.

(Constitution)
As shown in FIG. 15A, a multilayer chip type plate resonator element 200 includes a multilayer substrate 202 formed by firing laminated ceramic green sheets, and a magnetic layer provided on one main surface of the multilayer substrate 202. As shown in FIG. 16, a resonator circuit 204 formed of a conductor pattern such as Ag or Cu is provided inside. Further, the multilayer chip type plate resonator element 200 has a width × length × height of about 8 mm × 6 mm × 0.5 mm formed on the top of the multilayer substrate 202 having a width × length × height of about 8 mm × 6 mm × 0.5 mm. A magnetic resin layer 203 having a shape of 8 mm × 6 mm × 0.1 mm is laminated to form a so-called chip-type electronic component.

The multilayer substrate 202 is integrally formed as a dielectric ceramic layer by laminating and firing the resonator layer 220, the connection layer 222, and the wiring layer 221. Each layer 220 to 222 is formed of a ceramic green sheet similar to the ceramic green sheet described in the first embodiment. In this embodiment, the multilayer substrate 202 has a dielectric constant εr of 60. Has been.

As shown in FIG. 15C, the resonator layer 220 is provided with a resonator pattern 220a and input / output coupling electrodes 220b and 220c. The wiring layer 221 is provided with an input electrode P21, an output electrode P22, and a ground electrode G. The connection layer 222 is provided with interlayer connection conductors 222a and 222b, the input / output coupling electrode 220b and the input electrode P21 are connected via the interlayer connection conductor 222a, and the input / output coupling electrode 220c and the input electrode P22. Are connected via the interlayer connection conductor 222b, a resonator circuit 204 having capacitors C21 and C22 and a resonator RF shown in FIG. 16 is formed.

The capacitor C21 is a capacitance determined by the interval between the input / output coupling electrode 220b and the resonator pattern 220a, and the capacitor C22 is a capacitance determined by the interval between the input / output coupling electrode 220c and the resonator pattern 220a.

As shown in FIG. 15B, the magnetic resin layer 203 is formed of a magnetic resin similar to the magnetic resin described in the first embodiment.

The multilayer chip type plate resonator element 200 is manufactured by a method similar to the manufacturing method described in the first embodiment.

(Frequency characteristics with and without magnetic resin layer 203)
FIG. 17 is a diagram showing the frequency characteristics of the multilayer chip type plate resonator element 200 and the frequency characteristics of the resonator circuit 204 by the multilayer substrate 202 in a state where the magnetic resin layer 203 is not provided. The upper curve in the figure shows the reflection characteristics, and the lower curve in the figure shows the pass characteristics. In FIG. 17, the dotted curve indicates the frequency characteristics of the resonator circuit 204 by the multilayer substrate 202 in the state where the magnetic resin layer 3 is not provided, and the solid curve indicates the multilayer chip type plate resonator element 200. The frequency characteristics of are shown. In the example shown in FIG. 17, the magnetic material resin layer 203 is configured so that the magnetic permeability μr is 8.

As shown in FIG. 17, the resonance frequency f of the multilayer chip type plate resonator element 200 provided with the magnetic resin layer 203 moves to the low frequency side.

(Frequency characteristics due to change of magnetic permeability μr of magnetic resin layer 203)
FIG. 18 shows the frequency characteristics of the multilayer chip type plate resonator element 200 when the magnetic permeability μr of the magnetic resin layer 203 is changed. (A) shows the reflection characteristics, and (b) shows the passage characteristics. Show properties. Also, the rightmost curve in FIGS. 18 (a) and 18 (b) shows an example when the magnetic permeability μr of the magnetic resin layer 203 is configured to be 8, and will be directed to the low frequency side hereinafter. In this example, the magnetic resin layer 203 is configured so that the magnetic permeability μr is 16 and 32 in order. The magnetic permeability μr of the magnetic resin layer 203 can be changed by changing the content of the magnetic powder contained in the magnetic resin layer 203, that is, the ratio between the so-called resin component and the magnetic powder. Therefore, even if the thickness of the magnetic resin layer 203 is the same, the frequency of the resonator can be finely adjusted by changing the magnetic permeability μr.

As shown in FIG. 18, as the magnetic permeability μr of the magnetic resin layer 203 increases, the resonance frequency f of the multilayer chip type plate resonator element 200 moves to the lower frequency side.

(Modification of resonator pattern)
FIG. 19 shows a modification of the resonator pattern. FIG. 19A shows a λ / 2 resonator pattern 220d, and FIG. 19B shows a λ / 4 resonator pattern 220e with one end grounded. FIG. 20 shows a modification of the resonator pattern, in which (a) shows a ring-shaped resonator pattern 220f, (b) shows a circular resonator pattern 220g, and (c) shows a rectangular shape. A resonator pattern 220h is shown. FIG. 21 is a modification of the resonator pattern, and shows a dual mode resonator pattern 220i that forms a band-pass filter by generating two resonance modes.

In the above example, the resonator patterns 220a to 220c are formed in the resonator layer 220, but various resonator patterns shown as modified examples in FIGS. 19 to 21 may be formed instead.

<Fourth embodiment>
Next, a multilayer chip resonator element 1a according to a fourth embodiment of the electronic component of the present invention will be described with reference to FIG. 22A and 22B are views showing a multilayer chip resonator element 1a according to a fourth embodiment of the electronic component of the present invention, in which FIG. 22A is a cross-sectional view and FIG. 22B is a plan view.

The fourth embodiment is different from the first embodiment in that a metal film layer 6 is further provided on the upper surface of the magnetic resin layer 3 as shown in FIG. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by attaching the same reference numerals.

22A and 22B, the metal film layer 6 is provided so as to overlap with at least a part of the coil pattern 20a in a top view. The metal film layer 6 and the ground electrode G are connected by an interlayer connection conductor 6a having a via structure.

By the way, although a magnetic field is generated from the resonator pattern formed inside the electronic component and the coil pattern of the filter circuit, the generated magnetic field is radiated to the outside of the electronic component, so that other electronic components arranged close to the electronic component There is a risk of interfering with an electronic component and changing the characteristics of the component. In addition, when a magnetic field enters the electronic component from the outside, the characteristics of the coil or resonator provided in the electronic component may change.

Therefore, according to this embodiment, since the metal film layer 6 is provided on the upper surface of the magnetic resin layer 3 so as to overlap at least a part of the coil pattern 20a in a top view, the metal film layer 6 is grounded. Thus, radiation and radiation generated from the coil can be suppressed. In addition, it is possible to suppress a change in circuit pattern characteristics caused by a magnetic field entering from the outside.

<Fifth Embodiment>
Next, a fifth embodiment of the electronic component of the present invention will be described with reference to FIG. FIG. 23 is a view showing a fifth embodiment of the electronic component of the present invention.

The fifth embodiment is different from the first to fourth embodiments in that the magnetic resin layer 303 is formed of two layers having different magnetic permeability μr as shown in FIG. Since other configurations are the same as those of the first to fourth embodiments, description of the configurations will be omitted by attaching corresponding reference numerals.

As shown in FIG. 23, the electronic component 300 of this embodiment includes a multilayer substrate 302 and a magnetic resin layer 303. The magnetic resin layer 303 is composed of two layers 303b and 303a having different magnetic permeability μr.

If configured in this manner, the same effects as those of the first embodiment can be obtained, and the magnetic resin layer 303 is formed by a plurality of layers 303a and 303b having different magnetic permeability μr, thereby further improving the efficiency. The magnetic permeability μr of the magnetic resin layer 303 can be adjusted well. For example, it is possible to suppress radiation and radiation from the coil by increasing the magnetic permeability μr of the layer 303b or increasing the magnetic loss.

In this embodiment, the magnetic resin layer 303 is formed by the two layers 303a and 303b. However, the magnetic resin layer 303 may be configured by increasing the number of layers having different magnetic permeability μr. Good.

<Sixth Embodiment>
Next, a sixth embodiment of the electronic component of the present invention will be described with reference to FIGS. FIG. 24 is an enlarged view of an essential part of the sixth embodiment of the electronic component of the present invention. FIG. 25 is a diagram showing an example of the relationship between the number of turns of the helical coil and the inductance. FIG. 26 is a diagram illustrating an example of the relationship between the number of turns of the helical coil and the Q value.

As shown in FIG. 24, the sixth embodiment differs from the first embodiment in that coil patterns 420a to 422a forming a coil L41 are helical in the stacking direction of the multilayer substrate 402 forming the electronic component 400. It is the point formed in the shape. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by assigning a corresponding symbol.

(Constitution)
As shown in FIG. 24, an electronic component 400 includes a multilayer substrate 402 formed by firing laminated ceramic green sheets, and various filter circuits (inside with a conductive pattern such as Ag or Cu) ( (Not shown) is provided.

The multilayer substrate 402 includes first to third coil layers 420 to 422, a first to third coil layers 420 to 422, a connection layer (not shown), an insulator (dielectric) layer, a capacitor layer, and a wiring. The layers are integrally formed by laminating and firing. Each layer forming the multilayer substrate 402 is formed of a ceramic green sheet similar to the ceramic green sheet described in the first embodiment.

As shown in FIG. 24, the first to third coil layers 420 to 422 are provided with substantially U-shaped coil patterns 420a to 422a that form the coil L41. The first to third coil layers 420 to 422 are laminated so that the directions of the openings of the substantially U-shaped coil patterns 420a to 422a provided in the first to third coil layers 420 to 422 are alternately opposite to each other.

Then, one end 420b of the coil pattern 420a provided in the first coil layer and one end 421b of the coil pattern 421a provided in the second coil layer are connected by an interlayer connection conductor 420c having a via structure, and other than the coil pattern 421a. The end 421c and the other end 422b of the coil pattern 422a provided on the third coil layer 422 are connected by an interlayer connection conductor 421d having a via structure, thereby forming a helical coil L41.

The electronic component 400 is manufactured by a method similar to the manufacturing method described in the first embodiment. Moreover, the coil L41 which has arbitrary turns can be easily formed by laminating | stacking the some coil layer in which the substantially U-shaped coil pattern was formed suitably as mentioned above.

(Relationship between number of turns of coil L41 and inductance)
Next, the relationship between the number of turns of the coil L41 and the inductance will be described. FIG. 25 is a diagram showing an example of the relationship between the number of turns of the coil L41 and the inductance, and ♦ shows the relationship between the number of turns of the coil L41 and the inductance when the magnetic resin layer is not provided on the multilayer substrate. Indicates the relationship between the number of turns of the coil L41 and the inductance when a magnetic resin layer with magnetic permeability μr = 2 is provided on the multilayer substrate, and ■ indicates a magnetic resin layer with magnetic permeability μr = 4 provided on the multilayer substrate. The relationship between the number of turns of the coil L41 and the inductance when it is applied is shown.

As shown in FIG. 25, the inductance of the coil L41 increases in proportion to the square of the number of turns of the coil L41. Further, if the magnetic permeability μr of the magnetic resin layer provided on the multilayer substrate is increased, the inductance of the coil L41 increases.

(Relationship between number of turns of coil L41 and Q value)
Next, the relationship between the number of turns of the coil L41 and the Q value will be described. FIG. 26 is a diagram showing an example of the relationship between the number of turns of the coil L41 and the Q value, and ◆ shows the relationship between the number of turns of the coil L41 and the Q value when the magnetic resin layer is not provided on the multilayer substrate. , ▲ indicate the relationship between the number of turns of the coil L41 and the Q value when the magnetic resin layer having a magnetic permeability μr = 2 is provided on the multilayer substrate, and ■ indicates the multilayer of the magnetic resin layer having the magnetic permeability μr = 4. The relationship between the number of turns of the coil L41 and the Q value when provided on the substrate is shown.

As shown in FIG. 26, as the number of turns of the coil L41 increases, the Q value of the coil L41 also increases. Further, if the magnetic permeability μr of the magnetic resin layer provided on the multilayer substrate is increased, the Q value of the coil L41 increases.

As described above, also in this embodiment, the same effects as in the first embodiment can be obtained. Further, since the coil patterns 420a to 422a are formed in a helical shape in the stacking direction of the multilayer substrate 402, the inductance of the coil L41 increases in proportion to the square of the number of turns of the coil L41 in the stacking direction. Magnetic flux generated by energizing 420a to 422a is concentrated in the direction along the central axis of the coil L41. Therefore, by providing the magnetic resin layer on at least one main surface of the multilayer substrate 402, the magnetic flux density of the magnetic flux generated in a concentrated manner in the direction along the central axis of the coil L41 can be efficiently increased. The inductance of the coil L41 can be adjusted and increased more efficiently. Further, the Q value of the coil L41 can be efficiently increased by forming the magnetic resin layer with a material having a small magnetic loss.

Further, by providing the magnetic resin layer on one main surface of the multilayer substrate 402, the stray capacitance generated in the coil patterns 420a to 422a forming the coil L41 is affected by the dielectric constant εr of the magnetic resin layer. Since the coil patterns 420a to 422a are provided in the stacking direction on the multilayer substrate 402, the coil pattern 420a on the uppermost surface side or the coil pattern 422a on the lowermost surface side is most affected by the magnetic resin layer.

Therefore, even if the magnetic resin layer is provided on one main surface of the multilayer substrate 402 formed so that the coil L41 has a predetermined characteristic, the floating generated in a part of the coil patterns 420a to 422a forming the coil L41. Since only the capacitance is affected only by the dielectric constant εr of the magnetic resin layer, the characteristics of the coil L41 are not greatly influenced by the dielectric constant εr of the magnetic resin layer, so the design range of the magnetic resin layer is expanded, The range of selection of materials such as magnetic powder and resin for forming the magnetic resin layer can be expanded.

Although only the configuration of the coil L41 has been described in this embodiment, various electronic circuits such as a resonator circuit, a filter circuit, a balun circuit, a directional coupler, and an antenna circuit are electronically converted using the helical coil L41. It may be formed in the part 400.

<Seventh embodiment>
Next, a multilayer chip type bandpass filter element 500 according to a seventh embodiment of the electronic component of the present invention will be described with reference to FIGS.

FIG. 27 is a view showing a multilayer chip type bandpass filter element 500 according to the seventh embodiment, wherein (a) is a cross-sectional view, and (b) to (j) are each layer constituting the multilayer chip type bandpass filter element 500. 5 is a plan view of 503 and 520 to 527. FIG. FIG. 28 is a diagram showing an equivalent circuit of the band-pass filter circuit 504 provided in the multilayer chip type band-pass filter element 500 shown in FIG.

The seventh embodiment is different from the first embodiment in that the circuit configuration provided in the multilayer chip type bandpass filter (BPF) element 500 is different as shown in FIGS. .

That is, as the resonator pattern of the present invention, the first resonator pattern forming the first resonator circuit 504a having the first coil L51 and the second resonator circuit 504b having the second coil L52 are formed. Are arranged side by side on the multilayer substrate 502 in a top view. The magnetic resin layer 503 is provided at least between the first coil pattern 520a that forms the first coil L51 and the second coil pattern 520b that forms the second coil L52. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by assigning a corresponding symbol.

(Constitution)
As shown in FIG. 27A, a multilayer chip type BPF element 500 includes a multilayer substrate 502 formed by firing laminated ceramic green sheets, and a magnetic resin provided on one main surface of the multilayer substrate 502. As shown in FIG. 28, a band-pass filter circuit 504 formed of a conductor pattern such as Ag or Cu is provided therein.

The band-pass filter circuit 504 of this embodiment includes a first coil pattern 520a of the first coil L51 and a second coil pattern 520b of the second coil L52 that the first resonator circuit 504a and the second resonator circuit 504b have, respectively. Are formed by electromagnetic coupling.

The multilayer substrate 502 includes a first coil layer 520, a first connection layer 521, a first capacitor layer 522, a second capacitor layer 523, a second connection layer 524, a third capacitor layer 525, and a wiring layer 526. And an insulating (dielectric) layer 527 are laminated and fired to form a single body. Each of the layers 520 to 527 is formed of a ceramic green sheet similar to the ceramic green sheet described in the first embodiment.

As shown in FIG. 27C, the first coil layer 520 is provided with a substantially L-shaped first coil pattern 520a that forms the coil L51 and a second coil pattern 520b that forms the coil L52. It has been. Then, one end of the coil pattern 520a is provided with the electrode pattern 523a of the second capacitor layer 523 and the electrode pattern 525a of the third capacitor layer 525, and the first connection layer 521, the first capacitor layer 522, and the second connection layer 524. An interlayer connection conductor 520c having a via structure is provided.

In addition, the coil pattern 520b has one end through the electrode pattern 523b of the second capacitor layer 523 and the electrode pattern 525b of the third capacitor layer 525, and the first connection layer 521, the first capacitor layer 522, and the second connection layer 524. An interlayer connection conductor 520d having a via structure is provided. The other end of each of the coil pattern 520a and the coil pattern 520b is connected to a ground electrode that is an external electrode.

As shown in FIG. 27D, the first connection layer 521 includes one end of the first coil pattern 520a of the first coil layer 520, the electrode pattern 523a of the second capacitor layer 523, and the third capacitor layer 525. An interlayer connection conductor 521a having a via structure for connecting to the electrode pattern 525a is provided. In addition, one end of the second coil pattern 520b of the first coil layer 520, the electrode pattern 523b of the second capacitor layer 523, and the electrode pattern 525b of the third capacitor layer 525 are connected to the first connection layer 521. An interlayer connection conductor 521b having a via structure is provided.

As shown in FIG. 27E, the first capacitor layer 522 is provided with an electrode pattern 522a that forms the other electrode of the capacitor C52. The electrode pattern 522a and the second capacitor layer 523 are provided. A capacitor C52 is formed by the electrode pattern 523a. The first capacitor layer 522 is provided with an electrode pattern 522b that forms the other electrode of the capacitor C54. The capacitor C54 is formed by the electrode pattern 522b and the electrode pattern 523b provided on the second capacitor layer 523. It is formed. Electrode pattern 522a and electrode pattern 522b are each connected to a ground electrode which is an external electrode.

The first capacitor layer 522 is connected to one end of the first coil pattern 520a of the first coil layer 520, the electrode pattern 523a of the second capacitor layer 523, and the electrode pattern 525a of the third capacitor layer 525. An interlayer connection conductor 522c having a via structure is provided. The first capacitor layer 522 is connected to one end of the second coil pattern 520b of the first coil layer 520, the electrode pattern 523b of the second capacitor layer 523, and the electrode pattern 525b of the third capacitor layer 525. An interlayer connection conductor 522d having a via structure is provided.

As shown in FIG. 27F, the second capacitor layer 523 is provided with an electrode pattern 523a for forming one electrode of the capacitor C52 and an electrode pattern 523b for forming one electrode of the capacitor C54. ing.

As shown in FIG. 27G, the second connection layer 524 includes one end of the first coil pattern 520a of the first coil layer 520, the electrode pattern 523a of the second capacitor layer 523, and the third capacitor layer 525. An interlayer connection conductor 524a having a via structure for connecting to the electrode pattern 525a is provided. The second connection layer 524 is connected to one end of the second coil pattern 520b of the first coil layer 520, the electrode pattern 523b of the second capacitor layer 523, and the electrode pattern 525b of the third capacitor layer 525. An interlayer connection conductor 524b having a via structure is provided.

As shown in FIG. 27 (h), the third capacitor layer 525 is provided with an electrode pattern 525a that forms one electrode of the capacitor C51, and is provided in the electrode pattern 525a and the wiring layer 526. A capacitor C51 is formed by the electrode pattern 526a. The third capacitor layer 525 is provided with an electrode pattern 525b that forms one electrode of the capacitor C53, and the capacitor C53 is formed by the electrode pattern 525b and the electrode pattern 526b provided on the wiring layer 526. The

As shown in FIG. 27 (i), the wiring layer 526 is provided with an electrode pattern 526a that forms the other electrode of the capacitor C51 and an electrode pattern 526b that forms the other electrode of the capacitor C53. The electrode pattern 526a is connected to the input electrode P51 which is an external electrode, and the electrode pattern 526b is connected to the output electrode P52 which is an external electrode, thereby forming a band-pass filter circuit 504. Further, as shown in FIG. 12 (j), the insulator layer 527 is provided for adjusting the interval between the electrode patterns.

As shown in FIG. 27B, the magnetic resin layer 503 is formed of the same magnetic resin as the magnetic resin described in the first embodiment, and the first coil of the first coil layer 520 is formed. It arrange | positions between the pattern 520a and the 2nd coil pattern 520b.

The multilayer chip type BPF element 500 is manufactured by a method similar to the manufacturing method described in the first embodiment.

(Frequency characteristics of bandpass filter)
Next, frequency characteristics of the multilayer chip type BPF element 500 will be described. FIG. 29 is a diagram showing an example of frequency characteristics of the multilayer chip type BPF element 500 shown in FIG. 27. FIG. 29A shows a case where the coupling coefficient K = 0.4 in the electromagnetic coupling between the coil L51 and the coil L52. (B) shows the frequency characteristic when the coupling coefficient K = 0.5 in the electromagnetic coupling between the coil L51 and the coil L52, and (c) shows the frequency characteristic between the coil L51 and the coil L52. The frequency characteristic when the coupling coefficient K in electromagnetic coupling is 0.6 is shown. In each of FIGS. 29A to 29C, the upper curve indicates the reflection characteristic, and the lower curve indicates the transmission characteristic.

As shown in FIG. 29, when the coupling coefficient K in the electromagnetic coupling of the coils L51 and L52 forming the multilayer chip type BPF element 500 is changed, the frequency characteristics of the multilayer chip type BPF element 500 are changed.

(Coil pattern modification)
Next, an example of a modification of the coil pattern will be described. FIG. 30 is a view showing an example of a modification of the coil pattern. FIG. 30A shows the coil patterns 520a and 520b in this embodiment, and FIG. 30B shows a via structure formed in the stacking direction of the multilayer substrate 502. Coil patterns 520e and 520f are shown.

In this embodiment, as shown in FIG. 30A, substantially L-shaped coil patterns 520a and 520b are provided side by side in a top view, and a magnetic resin layer is provided between the coil pattern 520a and the coil pattern 520b. 503 is provided.

On the other hand, as shown in FIG. 30B, coil patterns 520e and 520f having a via structure provided in the stacking direction of the multilayer substrate 502 may be formed side by side in a top view. And it is good to provide the magnetic body resin layer 503 between the coil pattern 520e and the coil pattern 520f.

(Adjustment of coupling coefficient by magnetic resin layer)
Next, it will be described with reference to FIG. 31 that the coupling coefficient in the electromagnetic coupling between the coil L51 and the coil L52 is adjusted by providing the magnetic resin layer 503. 31A and 31B are diagrams for explaining the effect of providing the magnetic resin layer 503 on the multilayer substrate, wherein FIG. 31A is a diagram showing a state of the magnetic flux MF generated by the coil, and FIG. 31B is a magnetic resin layer. FIG. 5C is a diagram illustrating a state in which a magnetic resin layer 503 is provided on a multilayer substrate, and FIG. 5C is a diagram illustrating a change in magnetic flux MF.

As shown in FIG. 31A, when the coil patterns 520e and 520f are formed by the via structure, the magnetic flux MF is generated concentrically around the coil patterns 520e and 520f, and the coil pattern 520e is generated by the magnetic flux MF. , 520f is electromagnetically coupled. At this time, as shown in FIG. 31 (b), when the magnetic resin layer 503 is provided between the coil patterns 520e and 520f, the magnetic resin layer having a high magnetic permeability for the magnetic flux MF generated by both the coil patterns 520e and 520f. Concentrate on 503.

That is, as shown in FIG. 31 (c), the magnetic flux MF generated between the two coil patterns 520e and 520f moves in the direction of the coil patterns 520e and 520f, respectively, as indicated by arrows in the figure. Therefore, the electromagnetic coupling between the coil patterns 520e and 520f is weakened. As a result, the concentration of the magnetic flux MF on the magnetic resin layer 503 depends on the magnetic permeability μr of the magnetic resin layer 503. Therefore, by providing the multilayer resin 502 with the magnetic resin layer 503 having different magnetic permeability μr, the coil The coupling coefficient in the electromagnetic coupling between the patterns 520e and 520f can be adjusted.

As described above, also in this embodiment, the same effects as in the first embodiment can be obtained and the following effects can be obtained. That is, as the resonator pattern, the first resonator pattern forming the first resonator circuit 504a having the first coil L51 and the second resonator forming the second resonator circuit 504b having the second coil L52. By arranging the patterns on the multilayer substrate 502 in a top view, the first coil pattern 520a that forms the first coil L51 and the second coil pattern 520b that forms the second coil L52 are electromagnetically coupled. Various filter circuits (BPF circuit 504) can be formed.

At this time, by providing the magnetic resin layer 503 between the first coil pattern 520a forming the first coil L51 and the second coil pattern 520b forming the second coil L52, the first coil L51 and the first coil L51 Since the magnetic flux MF generated in the two coils L52 concentrates on the magnetic resin layer 503 having a high permeability μr, electromagnetic coupling by the magnetic flux MF generated in the coils L51 and L52 is inhibited, and the first coil L51 and the second coil L52 The electromagnetic coupling with the coil L52 is weakened and the coupling coefficient K is reduced. Since the degree of concentration of the magnetic flux MF on the magnetic resin layer 503 depends on the magnetic permeability μr of the magnetic resin layer 503, the coupling coefficient K in the electromagnetic coupling between the first coil L51 and the second coil L52 is determined by the magnetic permeability μr. Adjustment can be made simply by providing different magnetic resin layers 503 on the multilayer substrate 502.

Further, when it is desired to weaken the electromagnetic coupling between the first coil L51 and the second coil L52, the magnetic resin is applied to the multilayer substrate 502 without physically separating the first coil L51 and the second coil L52. Since the electromagnetic coupling can be weakened only by providing the layer 503, the multilayer chip BPF element 500 can be downsized.

Also, by providing a magnetic resin layer with a small magnetic loss, the leakage current loss can be reduced and the Q value of the coil can be increased (for example, tan δ <0.1 of the magnetic resin layer).

<Eighth Embodiment>
Next, a multilayer chip type bandpass filter device according to an eighth embodiment of the electronic component of the present invention will be described with reference to FIG.

(Constitution)
FIG. 32 is a diagram showing an equivalent circuit of a band-pass filter circuit 604 provided in the multilayer chip type band-pass filter element according to the eighth embodiment of the electronic component of the present invention. The eighth embodiment differs from the seventh embodiment in that the circuit configuration provided in the multilayer chip type bandpass filter (BPF) element is different as shown in FIG.

That is, the first coil L61 forming the first resonator circuit 604a and the second coil L62 forming the second resonator circuit 604b are coupled by the capacitor C65. Since the other configuration is the same as that of the seventh embodiment, description of the configuration is omitted by assigning a corresponding symbol.

(Frequency characteristics of bandpass filter)
Next, frequency characteristics of the multilayer chip type BPF element will be described. FIG. 33 is a diagram showing an example of frequency characteristics of the multilayer chip type bandpass filter element shown in FIG. 32. FIG. 33A shows a coupling coefficient K = 0.4 in electromagnetic coupling between the coil L61 and the coil L62. (B) shows the frequency characteristic when the coupling coefficient K = 0.5 in the electromagnetic coupling between the coil L61 and the coil L62, and (c) shows the frequency characteristic between the coil L61 and the coil L62. The frequency characteristic when the coupling coefficient K = 0.6 in the electromagnetic coupling is shown. Further, in each of FIGS. 33A to 33C, the upper curve indicates the reflection characteristic, and the lower curve indicates the transmission characteristic.

33, the frequency characteristic of the multilayer chip type BPF element 500 changes as the coupling coefficient K in the electromagnetic coupling of the coils L61 and L62 forming the multilayer chip type BPF element 500 changes.

As described above, this embodiment can achieve the same effects as those of the seventh embodiment.

<Ninth Embodiment>
Next, a multilayer chip type bandpass filter device 600 according to a ninth embodiment of the electronic component of the present invention will be described with reference to FIG. 34A and 34B are diagrams showing a multilayer chip type bandpass filter element 600 according to the ninth embodiment of the electronic component of the present invention, wherein FIG. 34A is a plan view, FIG. 34B is a cross-sectional view, and FIG. FIG.

(Constitution)
The ninth embodiment differs greatly from the seventh embodiment in that the first embodiment provided side by side on one main surface of the multilayer substrate 602 as shown in FIGS. 34 (a) and 34 (b). A cavity 610 is provided between the coil pattern 620 a and the second coil pattern 620 b, and the magnetic resin layer 603 is filled in the cavity 610. Since the other configuration is the same as that of the seventh embodiment, description of the configuration is omitted by assigning a corresponding symbol.

(Frequency characteristics of bandpass filter)
Next, frequency characteristics of the multilayer chip type BPF element 600 will be described. FIG. 34C shows the frequency characteristics depending on the presence or absence of the magnetic resin layer 603, the upper curve shows the reflection characteristics, and the lower curve shows the pass characteristics.

As shown in FIG. 34 (c), by providing the magnetic resin layer 603 between the

coil patterns

620a and 620b forming the multilayer chip type BPF element 500, the insertion loss at the passing frequency increases, and the first coil pattern It can be seen that the electromagnetic coupling between 620a and the second coil pattern 620b is weak.

As described above, also in this embodiment, the same effects as in the seventh embodiment can be obtained, and the following effects can be obtained. That is, a cavity 610 disposed between the first coil pattern 620a that forms the first coil and the second coil pattern 620b that forms the second coil is provided in the multilayer substrate 602, and the cavity 610 has a magnetic property. Since the body resin layer 603 is filled, the magnetic flux generated in the first coil and the second coil concentrates on the magnetic body resin layer 603 filled in the cavity 610, so that the magnetic body resin layer 603 serves as an electromagnetic shield. Since it functions, the coupling coefficient in the electromagnetic coupling between the first coil and the second coil can be further reduced. At this time, by increasing the magnetic permeability μr of the magnetic resin layer 603, the electromagnetic coupling between the first coil and the second coil can be substantially eliminated.

<Others>
Next, a modified example of the configuration in which the magnetic resin layer is provided on one main surface of the multilayer substrate will be described with reference to FIGS. FIG. 35 to FIG. 39 are views showing modifications of the magnetic resin layer provided on the multilayer substrate, in which (a) of each figure shows a plan view and (b) of each figure shows a sectional view. . In the following description, the same components as those in the above embodiment are denoted by the same reference numerals, and the description of the components is omitted.

As shown in FIG. 35, the magnetic resin layer 603a is filled by filling the cavity 610 provided on one main surface of the multilayer substrate 602 of the multilayer chip type BPF element 600 so as not to overflow the cavity 610. May be formed.

As shown in FIG. 36, a mask layer 705 is provided on one main surface of the multilayer substrate 702 of the electronic component 700, and the first coil pattern 720a and the second coil pattern 720b are formed in the recess formed by the mask layer 705. The magnetic resin layer 703 may be formed by filling a magnetic resin so that the whole is covered.

As shown in FIG. 37, a mask layer 805 and a cavity 810 disposed between the first coil pattern 820a and the second coil pattern 820b are provided on one main surface of the multilayer substrate 802 of the electronic component 800, and the mask The magnetic resin layer 803 may be formed by filling a concave portion formed by the layer 805 and the cavity 810 with a magnetic resin.

As shown in FIG. 38, when the first coil pattern 920a and the second coil pattern 920b having a via structure formed in the stacking direction of the multilayer substrate 902 of the electronic component 900 are provided, one of the multilayer substrates 902 The magnetic layer 903 may be formed by providing a mask layer 905 on the main surface and filling a concave portion formed by the mask layer 905 with a magnetic resin.

As shown in FIG. 39, when the first coil pattern 1020a and the second coil pattern 1020b having a via structure formed in the stacking direction of the multilayer substrate 1002 of the electronic component 1000 are provided, one of the multilayer substrates 1002 Alternatively, the magnetic resin layer 1003 may be formed by providing a cavity 1010 between the first coil pattern 1020a and the second coil pattern 1020b on the main surface and filling the cavity 1010 with a magnetic resin.

The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit thereof, for example, a magnetic material that requires a large inductance. Only the coil pattern for which the effect of the resin layer is desired is placed inside the magnetic resin layer or near the boundary between the magnetic resin layer and the dielectric ceramic layer, and the other coil patterns are arranged on the multilayer substrate (dielectric ceramic layer). You may make it arrange | position inside.

Also, it is desirable to configure the magnetic resin layer so that the magnetic permeability μr is greater than 1. Moreover, the particle diameter of the magnetic material constituting the magnetic resin layer may be any size, but in view of the use of electronic components in a higher frequency band, the particle diameter of the magnetic material is 2 μm or less. It is desirable that Further, by forming a magnetic resin layer with a small magnetic loss, the electronic component can be configured to be more suitable for high frequencies.

Moreover, since the above-described various effects can be achieved by providing the magnetic resin layer only on at least one main surface of the multilayer substrate as the dielectric ceramic layer, the magnetic resin layer of the electronic component is provided. An external electrode or the like can be easily formed on the unexposed surface. Therefore, the present invention can be easily applied to surface mount chip components. A magnetic resin layer may be provided on both main surfaces of the multilayer substrate.

Furthermore, as shown in FIGS. 1 and 12, when a capacitor or a coil is formed only by a dielectric layer on which a predetermined electrode pattern is formed, after the laminated dielectric layer is fired, Since it is only necessary to form a magnetic resin layer on at least one main surface, electronic parts can be easily manufactured. In addition, when the coil is formed of only a dielectric layer as in the prior art, a dielectric layer in which electrode patterns are not formed above and below the coil in order to minimize the decrease in the Q value due to the leakage current of the coil. 1 is formed as a dummy layer. However, in the configuration shown in FIGS. 1 and 12 of the present invention, the magnetic resin layer provided on the coil has a magnetic permeability μr of 1 or more. By providing, the height of the electronic component can be reduced.

The present invention can also be applied to a collective substrate such as a module. However, as shown in FIGS. 1 and 12, the application of the present invention to a chip-type passive component improves the advantages of the manufacturing method. In addition to being able to easily form one electronic component, the characteristics can be improved over the electrical characteristics when the electronic component is formed only of a dielectric layer.

In the above embodiment, a rectangular parallelepiped concave cavity is formed in the multilayer substrate. However, the shape of the cavity is not limited to the above-described shape, and the cavity may be formed through the multilayer substrate. A cavity may be formed.

The present invention can be widely applied to electronic components in which capacitors and coils are provided inside a multilayer substrate.

1,1a Multilayer chip resonator element (electronic component)
2, 102, 202, 302, 402, 502, 602, 702, 802, 902, 1002

Multilayer substrate

20a, 20d, 20e, 20f, 120a, 122a, 420a, 421a, 422a, 520a, 520b, 520e, 520f, 620a , 620b, 720a, 720b, 820a, 820b, 920a, 920b, 1020a, 1020b Coil pattern 3,103,203,303,503,603,603a, 703,803,903,1003 Magnetic resin layer 4,204,504a , 504b, 604a, 604b Resonator circuit (resonator pattern)
5,5a, 705,805,905 Mask layer 100,500,600 Multilayer chip type bandpass filter element (electronic component)
200 Multi-layer chip type plate resonator element (electronic component)
220a to

220i Resonator pattern

300, 400, 700, 800, 900, 1000

Electronic component

610, 810, 1010 Cavity

Claims

A multilayer substrate formed by firing laminated ceramic green sheets;
An electronic component comprising: a magnetic resin layer provided on at least one main surface of the multilayer substrate.
The electronic component according to claim 1, further comprising a coil pattern forming a coil.
The electronic component according to claim 2, wherein the coil pattern is formed in a helical shape in the stacking direction of the multilayer substrate.
4. The electronic component according to claim 2, wherein the coil pattern is provided in contact with the magnetic resin layer.
4. The electronic component according to claim 2, wherein at least a part of the coil pattern is provided inside the magnetic resin layer.
A metal film layer provided on the main surface of the magnetic resin layer opposite to the multilayer substrate;
The electronic component according to claim 2, wherein the metal film layer is provided so as to overlap at least a part of the coil pattern in a top view.
The electronic component according to claim 1, further comprising a resonator pattern that forms a resonator.
As the resonator pattern, a first resonator pattern forming a first resonator having a first coil and a second resonator pattern forming a second resonator having a second coil are viewed from above. The magnetic resin layer is provided side by side, and is provided between at least a first coil pattern that forms the first coil and a second coil pattern that forms the second coil. Electronic components described in
The electronic component according to claim 8, wherein a cavity disposed between the first coil pattern and the second coil pattern is provided in the multilayer substrate, and the cavity is filled with a magnetic resin. .
A mask layer provided on the main surface of the multilayer substrate provided with the magnetic resin layer;
The electronic component according to claim 1, wherein the mask layer is provided so as to surround the magnetic resin layer.
The electronic component according to claim 1, wherein the magnetic resin layer is formed of a plurality of layers having different magnetic permeability.