WO2011101701A1 - Procédé et appareil de personnalisation d'un objet portable - Google Patents

Procédé et appareil de personnalisation d'un objet portable Download PDF

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Publication number
WO2011101701A1
WO2011101701A1 PCT/IB2010/000624 IB2010000624W WO2011101701A1 WO 2011101701 A1 WO2011101701 A1 WO 2011101701A1 IB 2010000624 W IB2010000624 W IB 2010000624W WO 2011101701 A1 WO2011101701 A1 WO 2011101701A1
Authority
WO
WIPO (PCT)
Prior art keywords
personalisation
receptacle
objects
location
marking
Prior art date
Application number
PCT/IB2010/000624
Other languages
English (en)
Inventor
Dominique Perdoux
Patrick Baudron
Original Assignee
Datacard Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacard Corporation filed Critical Datacard Corporation
Priority to PCT/IB2010/000624 priority Critical patent/WO2011101701A1/fr
Publication of WO2011101701A1 publication Critical patent/WO2011101701A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K13/00—Conveying record carriers from one station to another, e.g. from stack to punching mechanism
    • G06K13/02—Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier having longitudinal dimension comparable with transverse dimension, e.g. punched card
    • G06K13/07—Transporting of cards between stations
    • G06K13/077—Transporting of cards between stations with intermittent movement; Braking or stopping movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch

Definitions

  • the present invention relates in general to a method and apparatus for personalising a portable object such as a card with or without a chip.
  • a potential application of an embodiment of the invention is in the graphical personalisation of a card.
  • SIM cards credit cards or telephone cards, as well as electronic purses and the like are known.
  • electronic purses and the like are known.
  • card personalisation system several personalisation
  • personalisation operations may include processes for graphical personalisation of
  • the card by relief marking of the card by embossing or stamping, printing on one or both surfaces of the card as well as processes for electronic personalisation of the card by transferring data to and from the memory of the card.
  • Some processes may include a step for verifying the cards at the end of the personalisation process. Typical the personalisation processes are carried out sequentially on a series ofD cards which are fed to a personalisation machine.
  • Some such systems use trays in which the supports to be personalised are arranged. These systems typically use a manipulator to move each card from the tray, one by one, to a position in which the required operation can be performed.
  • a personalisation operation for graphically marking the cards typically uses5 a marking device such as a laser marking machine to mark graphical data on the card.
  • the graphical data may for example include text such as the name of the bearer of the card, a serial number or code, a bar code, a photograph or drawings or other patterns or codes on the cards.
  • a laser marking machine for example, generally includes a marking element such as a laser transmitter, a marking
  • D location for placing a card to be marked opposite the marking element, a transfer path to supply the card to be marked to the marking location and to remove the cards already marked from the marking location.
  • a personalisation operation for electronic customisation of a card provided with a programmable smart object such as a chip typically involves transferring electronic data from a database to a smart object which is accessible via one of the surfaces of the card.
  • the card may be provided with a plurality of smart
  • the card may need to be flipped over so that the communication device transferring the electronic personalisation data can interface with one side of the card, and then the other.
  • a first aspect of the invention provides a personalisation apparatus for performing a
  • the apparatus comprising: a first object receptacle for holding a plurality of objects to be personalised, the objects being arranged in the first object receptacle such that a first surface of each object is exposed for the personalisation operation; a marking location for receiving the first object receptacle in a first marking configuration in5 which each first surface is exposed to a personalisation device for performing the personalisation operation; a second unequipped object receptacle rotatably movable from a first standby position to the personalisation location and co- operable with the first object receptacle to hold the objects in a sandwich configuration between the first object receptacle and the second object receptacle,D first rotation means for rotating the first and/or second receptable individually or as a unit between the personalisation location and the standby position; and flipping means for flipping the first object receptacle and the second object receptacle to reverse their respective positions such that the objects held between the first
  • a second aspect of the invention provides a method of performing a
  • the method comprising the steps of: transferring an equipped first object receptacle holding a plurality of objects to be marked from a transport path to a personalisation location
  • second object receptacle co-operates with the first object receptacle to hold the objects between the first and second object receptacles; rotating the first and second object receptacle as an integral unit from the personalisation location to the standby position; flipping the first and second object receptacle integral unit such that the first surface of the objects are moved from facing a first direction toD facing an opposing second direction; rotating the first and second object
  • a transfer device for transferring the first object receptacle between aD transporting path transporting the first object receptacle to and from the personalisation device, and the personalisation location;
  • a component mask for holding the objects in place in the first or second receptacle during the personalisation operation, the component mask being rotatably movable from a standby position to a second position overlying the first and/or second receptacle at the personalisation location in which the component mask holds the objects to be personalised in place; a graphical marking device for graphically marking an exposed surface of each object when the first object receptacle or a second object 5 receptacle holding the objects is in the personalisation location;
  • graphical marking device being a laser device
  • the objects may be SIM cards.
  • the first and the second receptacles are trays, such ID as for example JEDEC trays.
  • the apparatus may be in communication with an information system for providing personalisation data to the personalisation device, the personalisation g data corresponding to the personalisation to be effected on a said object, according to 15 the location of the said object in the first or second receptacle and to the surface of the said object being exposed for personalisation, and corresponding
  • orientation data so that the personalisation device is orientated with respect to the personalisation location to perform a personalisation on the corresponding object at the said exposed surface.
  • a third aspect of the invention provides a personalisation machine for
  • an object equipped with a memory the machine comprising a marking device according to any one of the preceding claims; and an electronic marking device according to any one of the preceding embodiments for entering5 data into the memory to electronically personalise the object.
  • the method may further include rotating a component mask, for holding the objects in place in the first or second receptacle during marking, from a standby position to a second position overlying the first and/or second receptacle at the personalisation location in which the component mask holds the objects to be marked in place during a personalisation operation at a surface the objects and rotating the component mask back to the standby position after the personalisation operation at the surface of the objects.
  • personalisation operation at an exposed surface of the objects comprises laser marking the exposed surface or transferring data to a smart zone of the object.
  • Parts of the methods according to the invention may be computer implemented.
  • the methods may be implemented in software on a programmable apparatus. They may also be implemented solely in hardware or in software, or in a combination thereof.
  • a tangible carrier medium may comprise a storage medium such as a floppy disk, a CD-ROM, a hard disk drive, a magnetic tape device or a solid state memory device and the like.
  • a transient carrier medium may include a signal such as an electrical signal, an electronic signal, an optical signal, an acoustic signal, a magnetic signal or an electromagnetic signal, e.g. a microwave or RF signal.
  • Figure 1 A is a schematic diagram of a front side of a SIM card to be graphically marked according to an embodiment of the invention
  • ID Figure 1 B is a schematic diagram of a form of a SIM card supplied within a frame body
  • Figure 1 C is a schematic diagram of a back side of a SIM card to be graphically marked according to an embodiment of the invention
  • Figure 2 is a schematic view of a personalisation machine according to an embodiment of the invention.
  • Figures 3A to 3S schematically illustrate the steps of graphically marking aD plurality of SIM cards according to embodiments of the invention
  • Figure 4A is a view in perspective of part of a marking device according to the embodiment of the invention with the component mask and empty tray in standby positions;
  • Figure 4B is a view in perspective of part of a marking device with two trays cooperating with one another at the marking location to hold the SIM cards in a sandwich configuration;
  • FIGS. 5A-5C are perspective views of a blocking system for holding and releasing the trays according to an embodiment of the invention.
  • FIG. 5 A first embodiment of a method of, of the invention will be described with reference to Figures 1 A to 3S.
  • the method is implemented to graphically mark both sides of a SIM (subscriber identity module) card. It will be appreciated however that methods of the invention may be applied to graphically mark other portable objects such as SIM (subscriber identity module) card.
  • SIM subscriber identity module
  • ID cards with or without a chip, or to perform an electronic personalisation operation via both surfaces of a card are provided.
  • a SIM card 80 comprises a SIM chip 81 on a SIM card body 82.
  • the SIM chip 81 includes a memory and communication elements for transferring data between the memory and a mobile terminal or an I5 electronic personalisation device in which the SIM card 80 is inserted.
  • a SIM card is used to identify a subscriber on mobile telephony devices (such as computers and mobile phones) and is generally available in two standard sizes.
  • the first standard size corresponds to the typical size of a credit card.
  • the newer, more popular miniature version such as illustrated in FIG. 1 A has a smallerD size.
  • Some smaller SIM cards are supplied as a full-sized card 83 with the smaller SIM card 80 being held in place by a few plastic links 84 that can be easily broken off to provide the smaller SIM card 80.
  • a SIM card typically stores a unique International Mobile Subscriber Identity (IMSI) to identify the subscriber to which the card is attributed to.
  • IMSI International Mobile Subscriber Identity
  • MCC Mobile Country Code
  • MNC Mobile Network Code
  • a SIM card as a smart card also has a unique serial number or integrated circuit card ID (ICC-ID) which is gEnerally printed on the SIM card body during the personalisation process of the card.
  • ICC-ID integrated circuit card ID
  • One of the mainD aims of at least one embodiment of the present invention involves the marking of data on the SIM card body by a graphical marking device.
  • the SIM card has a first front surface 801 on which the electrical contacts of the SIM chip 81 are visible and a second back surface 802, on the opposite face of the SIM card. Graphical marking where appropriate can be performed on both surfaces 801 and 802 of the SIM card 80.
  • SIM cards according to a first embodiment of the invention includes a processing bench 10 on top of which is mounted a horizontal transfer path 2 formed of a conveyor belt circulating between two end pulleys 21 , 22. At least one of the end pulleys is driven by a motor.
  • the conveyor belt is used to transfer trays T each
  • the personalisation machine 1 includes an electronic personalisation station 4 and a graphical marking station 5.
  • the personalisation machine 1 further comprises an unstacking device 3 which unstacks trays T one at a time from a batch of stacked trays and places them one by one on the conveyor belt 2 to be transferred to the
  • the unstacking device 3 includes a double inlet magazine allowing provisioning without having to stop the personalisation process. Each magazine is removable with a capacity for example of approximately 50 JEDEC trays.
  • the trays T thus introduced to the transfer path 2 are supplied to theD electronic personalisation station 4 which enables personalisation data to be memorised in the memory of the chip 80 of the SIM cards 80.
  • a loading device 40 introduces the trays T containing the SIM cards 80 to be personalised to the electronic personalisation station 4 and an unloading device 41 unloads the trays T containing the electronically personalised smart cards 80 from the5 personalisation station 4.
  • the trays T containing the SIM cards 80 are supplied via the transfer path of the conveyor belt to the marking station 5 for the graphical marking of supports of the SIM cards 80. After the SIM cards 80 in a tray T have been graphically marked the SIM cards 80 are then transported by the conveyor belt 2 to a stacking device 6 where they areD stacked in a magazine.
  • the SIM cards can then be transferred, to a further processing station (not shown) which verifies the personalisation of the card and/or manages preparation of the SIM cards for mailing.
  • a further processing station not shown
  • This information system 7 may include or be linked to a database 70 comprising personalisation data and marking data for each SIM card to be personalised.
  • the information system 7 transmits personalisation data relative to the SIM card to be personalised to the
  • the electronic personalisation station 4 transfers the respective personalisation data to the memory of the chip 81 of each SIM card 80. Data can be transferred to the memory chip 81 via electrical contacts or strips or via so called contact-less devices such as a radio antenna or an induction system. It will be appreciated that embodiments of the invention may be
  • I5 applied to an electronic personalisation of a card provided with access to one or more memory chips or zones via interfaces provided on both opposing main surfaces of the card.
  • the information system 7 transmits the marking data to the marking machine 5.
  • the marking dataD transmitted will correspond to the SIM card 80 being marked and the surface 801 or 802 of the SIM card.
  • the SIM card 80 to be marked may be identified by its position on the tray T.
  • the marking machine 5 prints the marking data onto the support 81 of the SIM card 8.
  • the marking data inscribed by the marking device 5 and the personalisation data recorded in the memory 81 by the electronic5 personalisation station 5 of a SIM card 80 can be correlated.
  • a control system (not shown), which can be controlled by the information system 7 , manages the sequential control of the personalisation machine.
  • the SIM cards 80 are arranged in a component matrix tray such as a JEDEC tray.
  • a component matrix tray such as a JEDEC tray.
  • Each JEDEC tray when equipped holds a plurality of SIM cardsD arranged in an array of rows and columns according to the specification of the JEDEC tray.
  • An example of such a tray TO can be seen in Figure 5B
  • the marking device 100 includes a laser marking device 101 housed in a laser chamber for graphically marking the SIM cards 80.
  • the marking device 100 has at least one marking location ML on a horizontal marking level located above and
  • the conveyor belt 102 for receiving a JEDEC tray T containing SIM cards 80 to be marked.
  • a JEDEC tray T is received at the marking location ML the SIM cards 80 are in an arrangement in the JEDEC tray T with the surface 801 or 802 of the SIM cards 80 to be marked facing towards the laser marking device 101 .
  • the laser marking device 101 is orientated such that an emitted laser
  • ID beam is projected generally perpendicularly with respect to the marking location ML level so that the laser beam can be directed towards the exposed surface of each SIM card 80 in the JEDEC tray T for laser marking.
  • the marking device 100 includes a component mask CM for fixing the SIM cards in place in a JEDEC tray TO received at the marking location ML during the
  • the component mask CM is adapted to the SIM card size and the JEDEC tray holding the SIM cards 80 to enable the SIM cards 80 to be held in place.
  • the component mask CM is rotatable by means of a motor about a rotation axis RP1 parallel to the marking location ML level from a standby position in which it is placed in an generally upright position, generally perpendicular to theD marking location level, to a component fixing position orientated parallel to the plane of the marking location. In the component fixing position the component mask CM is positioned on a JEDEC tray TO to hold the SIM cards 80 in place in the JEDEC tray 80 during the aspiration operation of the laser marking process.
  • An empty JEDEC tray T2 of the same specification as tray TO is positioned5 on the other side of the marking location ML from the component mask CM.
  • the empty JEDEC tray T2 is rotatable by means of a motor RP3M about a rotation axis RP3 orientated parallel to the marking level from a standby position, in which it is placed in a generally upright position with respect to the marking location ML plane, to a marking position orientated parallel to the plane of the marking locationD ML.
  • the JEDEC tray T2 is operable to cooperate with the JEDEC tray TO located at the marking location ML to hold the SIM cards 80 in a sandwich configuration between JEDEC tray TO and JEDEC tray T2.
  • ID JEDEC tray T2 is rotatable by means of a motor RP2M about a rotation axis RP2 parallel to rotation axis RP3 so that it can be rotated 180° about the rotation axis RP2. In this way the tray T2 can be rotated through an angle of 180° from facing in one direction to face a second direction opposite to the first direction 5 i.e. the tray T2 may be flipped or reversed.
  • the rotation about rotation axis RP2 can be carried out when tray T2 cooperates with tray TO to form a detachable unit with the SIM cards held between the two trays.
  • Conveyor belt section 102 transports JEDEC trays T-1 , TO and T1 containing the SIM cards 80 to and from the laser marking device 100.
  • Each ID JEDEC tray when it reaches a position of the conveyor belt section 102 corresponding to the marking location can be lifted from the conveyor belt level to the marking level by means of a transfer device 103 for marking by the laser 101 .
  • a tray blocking system as illustrated in FIGs. 5A to 5C blocks and releases the JEDEC trays TO, T2 during the various steps of the marking process.
  • I5 tray TO, T2 is provided with a projecting fixing ear FE at each longitudinal end of the respective tray TO, T2.
  • Each projection fixing ear FE is received in a respective fixing slot FC provided on a corresponding holder HO and H2 of the tray blocking system TBS controlled by motor RP2M.
  • the co-operation of the fixing ears FE of trays TO and T2and the fixing slots FS of holders HO and H2 fixes the trays TO andD T2 with respect to one another enabling them to hold the SIM cards 80 in a sandwich configuration between the two trays TO and T2.
  • the holders HO and H2 can be rotated with respect to each other to move one or other of the trays TO and T2 away from the other tray TO and T2.
  • the rotation of the holders HO and H2 with respect to one another is5 controlled by the motor RP3M.
  • a general marking cycle is presented as follows with reference to FIGS 3A to FIG 3S.
  • step S101 of the process for graphically marking surfaces of the SIM cards 80 as illustrated in FIG. 3A the conveyor belt 102 transports a JEDEC trayD TO containing multiple unmarked SIM cards 80 arranged in an array to a position Place 0, from where the JEDEC tray TO can be raised from the conveyor level to the marking level.
  • tray T1 Downstream from tray TO at a position Place 1 on the conveyor belt 102 is tray T1 which contains a number of SIM cards which have already
  • tray T-1 containing unmarked SIM cards.
  • On the marking level component mask CM is positioned in the upright standby position at one side of the marking location ML.
  • Empty tray T2 is positioned on the marking level in the upright standby position at the other side of the marking location ML facing towards the component mask CM.
  • the laser 101 is positioned facing towards the marking location ML and is in an inactive mode in which no laser beam is emitted.
  • tray TO is raised ID from the conveyor belt level to the marking location ML on the marking level by transfer device 103.
  • the component mask CM and the empty tray T2 remain blocked in the respective upright stand by position on either side of tray TO and orientated generally perpendicularly to tray TO.
  • step S103 of the marking cycle as illustrated in FIG. 3C the component I5 mask CM is rotated in a clockwise direction by an angle of 90° from the standby upright position to a position overlying the tray TO in order to hold the SIM cards in tray TO in place during the aspiration stage of the laser marking process.
  • the component mask CM is orientated parallel to the open surface of tray TO.
  • the front (verso) side 801 of the SIM cards 80 in the tray TO face upwardsD towards the laser device 101 .
  • Empty tray T2 remains blocked in the upright position perpendicular to tray TO.
  • step S104 of the marking cycle as illustrated in FIG. 3D the laser is activated to emit a laser beam towards the exposed verso surfaces of each of the SIM cards 80 in tray TO in order to carry out the printing process.
  • the axis of5 symmetry of the laser beam is projected perpendicularly relative to the exposed surface of each of the SIM cards during the marking of each card.
  • the laser beam can be programmed by information system 7 to mark a sequence of digits forming a code or any other desired graphical representation on the verso surface 801 of the SIM cards 80.
  • the graphical dataD defining the graphical marking to be carried out can be personalised to each SIM card 80 and to the surface of the respective SIM card being exposed.
  • the SIM card 80 to be marked is identified by its location in the JEDEC tray TO. According
  • step S105 of the marking cycle as illustrated in FIG. 3E the laser device 101 is inactivated so that it no longer emits a laser beam.
  • the component mask 5 CM is rotated 90° in an anticlockwise from the active SIM card holding position back to the standby position.
  • step S106 of the marking cycle as illustrated in FIG. 3F empty JEDEC tray T2 is rotated from the upright standby position by 90° in an anticlockwise direction onto JEDEC tray TO to rest in a position parallel to the marking level.
  • ID this position the open side of Tray T2 faces the open side of Tray TO with the marked surfaces 801 of the SIM cards 80 facing towards the closed surface of tray T2 through the open sides of tray TO and tray T2.
  • Tray T2 is blocked by RP2 in this position with the SIM cards 80 being held in a sandwich position between trays TO and T2.
  • step S107 of the marking cycle as illustrated in FIG. 3G rotator RP3 is released to rotate an integral unit of detachable trays TO and T2 from the marking location ML through an angle of 90° in a clockwise direction to the standby position where tray T2 had previously been positioned.
  • the SIM cards 80 are held in the sandwich position between trays T2 and TO.
  • step S108 of the marking cycle as illustrated in FIG. 3H the integral unit of trays TO and T2 are rotated together with the SIM cards by an angle 180° thereby flipping the respective positions of trays TO and T2 such that the positions of TO and T2 are reversed.
  • T2 faces in an opposite direction to the direction it was facing prior to the rotation and takes the position of TO before the5 rotation
  • the front surfaces 801 of SIM cards 80 sandwiched between the two trays TO and T2 are moved from facing one direction to facing an opposing direction - i.e. the direction of facing of the SIM cards is reversed, surface 801 faces the direction surface 802D was previously facing and vice versa.
  • step S109 as illustrated in FIG. 3I rotator RP3 is released and the integral unit of TO and T2 is rotated by 90° in an anticlockwise direction from the upright standby position to the marking location ML on the marking level.
  • I3 cards 80 are held between the trays TO and T2 in a marking position. Since the trays TO and T2 have been flipped over, when the integral unit of trays TO and T2 reaches the marking location ML, tray TO is uppermost overlying tray T2. Tray T2 faces upwards with its open side facing towards the laser device 101 while tray TO 5 faces downwards with the open side facing towards the marking location ML. In this configuration the verso or back surfaces 802 of the SIM cards 80 are orientated in a direction towards the laser device 101 .
  • step S1 10 as illustrated in FIG. 3J the trays TO and T2 are disengaged from one another. Tray TO is then rotated 90° in a clockwise direction about RP3
  • Tray T2 is positioned at the marking location with the open side of tray T2 facing towards the laser device 101 . Due to the position flipping manoeuvre performed in step S108 the SIM cards 80 are positioned in tray 2 with their unmarked recto sides 802 being exposed for marking while the verso front
  • step S1 1 1 as illustrated in FIG. 3K the component mask CM is rotated in a clockwise direction by an angle of 90° from the standby upright position onto the tray T2 in order to hold the SIM cards 80 in tray T2 in place during the aspirationD stage of the laser marking process.
  • the component mask CM is orientated parallel to the open surface of tray T2.
  • the unmarked (recto) side 802 of the SIM cards 80 face upwards towards the laser device 101 .
  • Tray TO which is empty at this stage of the process remains blocked in the upright standby position.
  • step S1 12 of the marking cycle as illustrated in FIG. 3L the laser is activated to emit a laser beam towards the exposed recto surfaces 802 of each of the SIM cards 80 in tray T2.
  • the axis of symmetry of the laser beam is projected perpendicularly relative to the exposed surfaces 802 of the SIM cards.
  • the laser beam can be programmed to mark a sequence ofD digits forming a code or any other graphical representation on the recto surface 802 of the SIM cards 80. Tray TO remains blocked in the upright standby position.
  • step S1 13 of the marking cycle as illustrated in FIG. 3M the laser device 101 is inactivated so that it no longer emits a laser beam.
  • I4 CP is rotated 90° in an anticlockwise from the active SIM card holding position back to the standby position.
  • step S1 14 of the marking cycle as illustrated in FIG. 3N empty JEDEC tray TO is rotated from the upright standby position by 90° in an anticlockwise
  • Tray TO 5 direction onto JEDEC tray T2 in a position parallel to the marking level.
  • the open side of Tray TO faces the open side of Tray T2 with the marked recto surfaces of the SIM cards facing towards the closed surface of tray TO through the open sides tray T2 and tray of TO.
  • Tray TO is blocked by RP2 in this position with the SIM cards 80 being held in a sandwich position between tray T2
  • step S1 15 of the marking cycle as illustrated in FIG. 30 rotator RP3 is released to rotate an integral unit of trays T2 and TO from the marking location ML through an angle of 90° in a clockwise direction to the standby position where tray TO had previously been positioned.
  • the SIM cards 80 are held in the sandwich I5 position between trays TO and T2.
  • step S1 16 of the marking cycle as illustrated in FIG. 3P the integral unit of trays TO and T2 are rotated together with the SIM cards 80 by an angle of 180° thereby flipping the respective position of trays TO and T2 such that T2 is faces in an opposite direction and takes the position of TO before the rotation and TO facesD in an opposite direction and takes the position of T2 before the rotation.
  • the SIM cards 80 sandwiched between the two trays TO and T2 are moved from facing one direction to facing an opposing direction.
  • the configuration of the trays TO and T2 is thus returned to the configuration prior to the flipping step in step S108.
  • tray TO is released from tray T2 and is moved with the SIM cards 80 though an angle of 90° in an anticlockwise direction from the upright standby position to the marking location.
  • Tray T2 which is now empty of SIM cards is held in the upright standby position.
  • the verso front side 801 of the SIM cards 80 are facing upwards to the open side of tray TO.
  • tray TO is lowered by the transfer device 103 from the marking location ML back to the conveyor belt 102.
  • the component mask CM and empty tray T2 remain fixed in the standby upright position on respective sides of the marking location .
  • step S1 19 as illustrated in FIG. 3S the conveyor belt 102 moves tray TO holding laser marked SIM cards 80 from position 0 to position +1 , tray T-1 holding a plurality of unmarked SIM cards 80 is moved from position place -1 to position Place 0 so that it can be transferred to the marking location ML at the marking 5 level by the transfer device 102. Tray T1 is moved on a further position downstream.
  • the marking cycle continues sequentially until all the SIM cards in a series of JEDEC trays have been marked on both surfaces 801 and 802 and the next stage of the personalisation process is implemented.
  • the methods according to the embodiments of the invention can enable increased production rates without manual intervention to reverse the cards since the flipping of the JEDEC trays enables the surface of the SIM card which is exposed to the laser beam to be reversed. Moreover embodiments of the invention enable a plurality of card supports to be marked at a processing station
  • JEDEC trays allows the positions of the SIM cards to be known and the respective SIM cards to be identified so that the corresponding graphical marking can be carried out.
  • the method according to the embodiments of the invention can findD applications in which graphical marking of a series of portable objects is desired.

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Abstract

L'invention concerne un appareil destiné à effectuer une opération de personnalisation sur des surfaces opposées d'un objet portable, l'appareil comportant : un premier réceptacle (T0) à objets servant à contenir une pluralité d'objets à personnaliser, les objets étant disposés dans le premier réceptacle à objets de telle sorte qu'une première surface de chaque objet soit exposée en vue de l'opération de personnalisation; un emplacement de personnalisation (LM) servant à recevoir le premier réceptacle à objets dans une première configuration de personnalisation où chaque première surface est exposée à un dispositif (101) de personnalisation afin d'effectuer l'opération de personnalisation; un deuxième réceptacle (T2) à objets non équipé, susceptible de pivoter d'une première position d'attente à l'emplacement de personnalisation et de coopérer avec le premier réceptacle à objets pour maintenir les objets dans une configuration en sandwich entre le premier réceptacle à objets et le deuxième réceptacle à objets, un premier moyen (RP3) de rotation servant à faire pivoter le premier et/ou le deuxième réceptacle individuellement ou solidairement entre l'emplacement de personnalisation et la position d'attente; et un moyen (RP2) de retournement servant à retourner le premier réceptacle à objets et le deuxième réceptacle à objets de façon à inverser leurs positions respectives de telle sorte que les objets maintenus entre le premier réceptacle à objets et le deuxième réceptacle à objets passent d'une orientation dans une première direction à une orientation dans une deuxième direction opposée, le deuxième réceptacle à objets permettant de maintenir les objets dans une deuxième configuration de personnalisation à l'emplacement de personnalisation où une deuxième surface opposée de chaque objet est exposée en vue de la personnalisation.
PCT/IB2010/000624 2010-02-22 2010-02-22 Procédé et appareil de personnalisation d'un objet portable WO2011101701A1 (fr)

Priority Applications (1)

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PCT/IB2010/000624 WO2011101701A1 (fr) 2010-02-22 2010-02-22 Procédé et appareil de personnalisation d'un objet portable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2010/000624 WO2011101701A1 (fr) 2010-02-22 2010-02-22 Procédé et appareil de personnalisation d'un objet portable

Publications (1)

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WO2011101701A1 true WO2011101701A1 (fr) 2011-08-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013178606A1 (fr) * 2012-05-30 2013-12-05 Gemalto S.A. Module et procédé de personnalisation graphique et électrique de cartes à puce intelligente
WO2021097133A1 (fr) * 2019-11-15 2021-05-20 Pax Labs, Inc. Machine de gravure au laser et d'écriture d'étiquette dans une cartouche de vapoteuse
FR3103404A1 (fr) * 2019-11-26 2021-05-28 Antonio Alves Dispositif de traitement de plusieurs faces d’objets, et procédé de traitement correspondant

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
DE102006052527A1 (de) * 2005-11-14 2007-05-24 Procard Gmbh Vorrichtung und Verfahren zum Herstellen personalisierter Dokumente
WO2009063292A1 (fr) * 2007-11-12 2009-05-22 Datacard Corporation Procédé et système pour personnaliser des objets intelligents
WO2010004375A1 (fr) * 2008-07-08 2010-01-14 Datacard Corporation Système de personnalisation de composants électroniques positionnés sur une carte et utilisation d'un tel système

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359253B1 (en) * 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
DE102006052527A1 (de) * 2005-11-14 2007-05-24 Procard Gmbh Vorrichtung und Verfahren zum Herstellen personalisierter Dokumente
WO2009063292A1 (fr) * 2007-11-12 2009-05-22 Datacard Corporation Procédé et système pour personnaliser des objets intelligents
WO2010004375A1 (fr) * 2008-07-08 2010-01-14 Datacard Corporation Système de personnalisation de composants électroniques positionnés sur une carte et utilisation d'un tel système

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013178606A1 (fr) * 2012-05-30 2013-12-05 Gemalto S.A. Module et procédé de personnalisation graphique et électrique de cartes à puce intelligente
WO2021097133A1 (fr) * 2019-11-15 2021-05-20 Pax Labs, Inc. Machine de gravure au laser et d'écriture d'étiquette dans une cartouche de vapoteuse
US11684090B2 (en) 2019-11-15 2023-06-27 Juul Labs, Inc. Machine for laser etching and tag writing a vaporizer cartridge
FR3103404A1 (fr) * 2019-11-26 2021-05-28 Antonio Alves Dispositif de traitement de plusieurs faces d’objets, et procédé de traitement correspondant
WO2021105913A1 (fr) * 2019-11-26 2021-06-03 Alves Antonio Dispositif de traitement de plusieurs faces d'objets, et procédé de traitement correspondant
US12049377B2 (en) 2019-11-26 2024-07-30 Antonio Alves Device for treating several surfaces of objects, and corresponding treatment method

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