WO2011092251A3 - Optoelectronic semiconductor component and use of an optoelectronic semiconductor component in a motor vehicle headlight - Google Patents

Optoelectronic semiconductor component and use of an optoelectronic semiconductor component in a motor vehicle headlight Download PDF

Info

Publication number
WO2011092251A3
WO2011092251A3 PCT/EP2011/051155 EP2011051155W WO2011092251A3 WO 2011092251 A3 WO2011092251 A3 WO 2011092251A3 EP 2011051155 W EP2011051155 W EP 2011051155W WO 2011092251 A3 WO2011092251 A3 WO 2011092251A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor component
optoelectronic semiconductor
glass
motor vehicle
vehicle headlight
Prior art date
Application number
PCT/EP2011/051155
Other languages
German (de)
French (fr)
Other versions
WO2011092251A2 (en
Inventor
Angela Eberhardt
Joachim WIRTH-SCHÖN
Alfred Langer
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2011092251A2 publication Critical patent/WO2011092251A2/en
Publication of WO2011092251A3 publication Critical patent/WO2011092251A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers

Abstract

In at least one embodiment of the optoelectronic semiconductor component (1), said component comprises a carrier (2) and at least one optoelectronic semiconductor chip (3). The semiconductor chip (3) is based on an inorganic semiconductor material. The semiconductor component (1) further comprises a radiation-permeable cover (4), which comprises a glass or consists of a glass. The cover (4) is mechanically connected to the carrier (2) via a connecting means (5) which surrounds the semiconductor chip (3) in a frame-like manner. The connecting means (5) comprises a glass, glass solder, water glass and/or water glass adhesive or consists of one or more of the substances mentioned.
PCT/EP2011/051155 2010-01-28 2011-01-27 Optoelectronic semiconductor component and use of an optoelectronic semiconductor component in a motor vehicle headlight WO2011092251A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010006072.0 2010-01-28
DE201010006072 DE102010006072A1 (en) 2010-01-28 2010-01-28 Optoelectronic semiconductor device and use of an optoelectronic semiconductor device in a motor vehicle headlamp

Publications (2)

Publication Number Publication Date
WO2011092251A2 WO2011092251A2 (en) 2011-08-04
WO2011092251A3 true WO2011092251A3 (en) 2012-02-02

Family

ID=44201106

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/051155 WO2011092251A2 (en) 2010-01-28 2011-01-27 Optoelectronic semiconductor component and use of an optoelectronic semiconductor component in a motor vehicle headlight

Country Status (2)

Country Link
DE (1) DE102010006072A1 (en)
WO (1) WO2011092251A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014012572A1 (en) * 2012-07-16 2014-01-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device
DE102021118151A1 (en) 2021-07-14 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE AND OPTOELECTRONIC DEVICE

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
DE102007046348A1 (en) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Radiation-emitting device with glass cover and method for its production

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19803936A1 (en) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Expansion-compensated optoelectronic semiconductor component, in particular UV-emitting light-emitting diode and method for its production
DE10118630A1 (en) * 2001-04-12 2002-10-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Production of an optoelectronic semiconductor component comprises preparing sintered glass blanks, applying an adhesive to the surfaces of the blank to be connected, fixing both blanks in a tool, and forming a mechanical composite
DE102005040558A1 (en) * 2005-08-26 2007-03-01 Osram Opto Semiconductors Gmbh Method for producing a luminescence diode chip and luminescence diode chip
CN101548398A (en) * 2006-11-20 2009-09-30 3M创新有限公司 Optical bonding composition for LED light source
US20100283074A1 (en) * 2007-10-08 2010-11-11 Kelley Tommie W Light emitting diode with bonded semiconductor wavelength converter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
DE102007046348A1 (en) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Radiation-emitting device with glass cover and method for its production

Also Published As

Publication number Publication date
WO2011092251A2 (en) 2011-08-04
DE102010006072A1 (en) 2011-08-18

Similar Documents

Publication Publication Date Title
WO2013032725A3 (en) Glass as a substrate material and a final package for mems and ic devices
WO2009086289A3 (en) Solar cell package for solar concentrator
EP2390917A3 (en) Light emitting device and lighting apparatus
TW200746474A (en) Semiconductor device and semiconductor device fabrication method
TW200739964A (en) Light emitting device
EP2752873A3 (en) Semiconductor module
SG170099A1 (en) Integrated circuit package system with warp-free chip
EP2199339A4 (en) Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
WO2011009677A3 (en) Optoelectronic component and method for producing an optical element for an optoelectronic component
SG152984A1 (en) Drop-mold conformable material as an encapsulation for an integrated circuit package system
WO2010071386A3 (en) Light emitting device package, backlight unit, display device and lighting device
TW200741902A (en) Semiconductor package and, chip carrier thereof and method for fabricating the same
WO2011071657A3 (en) Optoelectronic device with bypass diode
WO2010077082A3 (en) Light-emitting-device package and a method for producing the same
WO2012072189A3 (en) Headlight lens for a vehicle headlight
TW200735414A (en) Power lamp package
WO2012037537A3 (en) Sealed packaging for microelectromechanical systems
TW200618266A (en) Optical device
TW200737551A (en) Semiconductor device and method for manufacturing the same
WO2014131830A3 (en) Chip card with integrated active components
WO2012108636A3 (en) Light emitting device having wavelength converting layer
WO2005050746A3 (en) Economic miniaturized construction technique and connection technique for light emitting diodes and other opto-electronic modules
WO2006116162A3 (en) Semiconductor package
SG148928A1 (en) Integrated circuit package in package system with adhesiveless package attach
WO2008021269A3 (en) Device chip carriers, modules, and methods of forming thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11703164

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11703164

Country of ref document: EP

Kind code of ref document: A2