WO2011067945A1 - Circuit board, circuit module, and electronic device - Google Patents

Circuit board, circuit module, and electronic device Download PDF

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Publication number
WO2011067945A1
WO2011067945A1 PCT/JP2010/007072 JP2010007072W WO2011067945A1 WO 2011067945 A1 WO2011067945 A1 WO 2011067945A1 JP 2010007072 W JP2010007072 W JP 2010007072W WO 2011067945 A1 WO2011067945 A1 WO 2011067945A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
recess
resin
conductive
conductive resin
Prior art date
Application number
PCT/JP2010/007072
Other languages
French (fr)
Japanese (ja)
Inventor
勝裕 井上
輝彦 南野
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2011544198A priority Critical patent/JPWO2011067945A1/en
Publication of WO2011067945A1 publication Critical patent/WO2011067945A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present invention relates to a circuit board on which an electromagnetic shield and thinning can be simultaneously realized, and a circuit module and an electronic device provided with the circuit board.
  • the recess 101 is formed in part of the main surface excluding the substrate end, and the component parts 102 are mounted on the recess 101. Thereafter, the sealing resin layer 103 is formed on the upper surface side of the component part 102. Next, a conductive resin layer 105 is formed to cover the electrode 104 provided on the main surface and the sealing resin layer 103. Since the electrode 104 is internally connected to the constant potential conductor pattern 106, a shielding effect on the element part 102 can be obtained. Thereby, an extremely thin structure can be taken while having high noise shielding properties.
  • connection surface between the electrode and the conductive resin is substantially the same surface as the substrate surface, external stress is easily applied to the connection surface, and the connection between the electrode and the conductive resin is There is a problem that it is easy to peel off.
  • the present invention has been made in view of the above-described problems of the prior art, and has a strong electromagnetic shielding property to an electronic component, and can cope with thinness and smallness by firmly connecting the electrode and the conductive resin. It is an object of the present invention to provide a circuit board.
  • the circuit board of the present invention is filled in the base, the recess formed in the base, the electronic component disposed on the bottom of the recess, the conductive film formed on the inner side surface of the recess, and the recess
  • An insulating resin in contact with the component, and a conductive resin covering the insulating resin and the electronic component and electrically connected to the conductive film are provided.
  • a shielding effect can be obtained by connecting the conductive film and the conductive resin. Furthermore, the shield formation can be completed inside the inner surface of the recess, and the area of the top surface of the recess can be reduced, and even if there is a step between the substrate surface and the insulating resin, The conductive film and the conductive resin can be stably connected. As a result, it is possible to provide a circuit board that is compatible with thinning and downsizing, which has shielding effects and is also capable of supporting.
  • the conductive film and the conductive resin are connected on the inner side surface, thereby providing the conductive film and the conductive film without providing an electrode around the recess. Of the connecting area with the conductive resin. This makes it possible to make the electrical connection between the conductive film and the conductive resin more reliable.
  • the circuit board includes the groove between the conductive film and the insulating resin, and the conductive resin is connected to the conductive film inside the groove. And expanding the connection area between the conductive film and the conductive resin, and the connection area between the conductive resin and the insulating resin. This makes it possible to improve the connection strength between the conductive resin, the conductive film, and the insulating resin. Further, according to one aspect of the present invention, in the circuit board, the formation of the groove is facilitated even when the depth of the recess is increased by having a surface where the conductive film and the insulating resin are in contact with each other. It is a thing. Thus, the connection strength between the conductive resin, the conductive film, and the insulating resin can be improved, and the groove formation can be stabilized regardless of the depth of the recess.
  • the circuit board is the above-mentioned circuit board, and the top surface of the recess has an electrode electrically connected to the conductive film, and the conductive resin and the electrode are in contact with each other to achieve conductivity.
  • the connection area between the resin and the conductive film is enlarged through the electrode. Thereby, the electrical connection between the conductive resin and the conductive film can be made more reliable.
  • the circuit board has the exposed portion on the top surface that is not covered by the electrode and the base is exposed, and the electrode and the conductive portion are in contact with the base at the exposed portion. It is possible to provide a connecting surface between the conductive resin and the base, which has higher strength than the connection with the resin. Thus, the connection strength between the conductive resin and the conductive film can be improved.
  • the circuit substrate has an opening on the top surface which is not covered by the electrode and through which the substrate is exposed, and is in contact with the substrate at the opening. It is possible to provide a connecting surface between the conductive resin and the base, which has higher strength than the connection with the resin. Thus, the connection strength between the conductive resin and the conductive film can be improved.
  • a shielding effect can be obtained by connecting the conductive film and the conductive resin. Furthermore, the shield formation can be completed inside the inner surface of the recess, and the area of the top surface of the recess can be reduced, and even if there is a step between the substrate surface and the insulating resin, The conductive film and the conductive resin can be stably connected. As a result, it is possible to provide a circuit board that is compatible with thinning and downsizing, which has shielding effects and is also capable of supporting.
  • Sectional drawing which showed the structure of the circuit board by Embodiment 1 of this invention.
  • (A)-(D) Cross-sectional view and top view showing a method of manufacturing a circuit board according to Embodiment 1 of the present invention
  • the top view which showed the structure of the circuit board by Embodiment 2 of this invention
  • the top view which showed the 1st modification of the groove
  • Sectional drawing which showed the structure of the circuit board by Embodiment 3 of this invention 6 is a cross-sectional view showing the configuration of a circuit board in which electrodes are disposed in the grooves of FIG.
  • Sectional view showing the configuration of a conventional circuit board Sectional drawing which showed the structure of the circuit board by Embodiment 4 of this invention (A) to (C) are cross sectional views showing a method of manufacturing a circuit board according to a fourth embodiment of the present invention Sectional drawing which showed the structure of the circuit board by Embodiment 5 of this invention.
  • Sectional drawing which showed the structure of the circuit board by Embodiment 6 of this invention are cross sectional views showing a method of manufacturing a circuit board according to a sixth embodiment of the present invention Sectional drawing which showed the structure of the circuit board by Embodiment 7 of this invention Sectional view showing the configuration of a circuit board according to Embodiment 8 of the present invention Sectional drawing which showed the structure of the circuit board by Embodiment 9 of this invention.
  • the top view which showed the structure of the circuit board by Embodiment 10 of this invention.
  • FIG. 1 shows a circuit board 1 to which the present invention is applied.
  • the circuit board 1 has a thin rectangular parallelepiped shape, and the base 2, the recess 3, a plurality of (two in the present embodiment) electronic components 4, the groove 5, the electrode 6, and the insulation are provided.
  • the conductive resin 8 are provided.
  • the base 2 is made of, for example, an appropriate insulating material such as glass, ceramics, epoxy resin, etc.
  • the recess 3 and the groove 5 are formed on one side or both sides, and the bottom 3A of the recess 3 and the substrate surface
  • the electrodes 6A and 6C for mounting the electronic component 4 are provided with the electrode 6, and the groove 5 is provided with the electrode 6B used for connection with the conductive resin 8.
  • the insulating resin 7 resin-seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3A is solidified in a state of being covered and embedded with an appropriate resin material. .
  • the circuit board 1 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even if an external force of a certain strength acts mechanically, and adhesion of moisture, dust, etc. Stable operation can be achieved by avoiding
  • a groove 5 is formed on the top surface 9.
  • the groove 5 is formed to such a depth that the bottom surface 5B and the electrode 6B are flush with each other, and the conductive resin 8 is filled therein.
  • the conductive resin 8 is formed on the insulating resin 7 and inside the groove 5 using a conductive resin made of an appropriate resin material or the like.
  • the conductive resin 8 shields the internal electronic components 4 by shielding electromagnetic waves from the outside and static electricity from the adjacent electronic components, and protects the internal electronic components 4 from static electricity or the like to the adjacent electronic components. Shield propagation.
  • the electrode 6B be electrically connected to the electrode 6C for ground through the via V and the internal wiring.
  • FIGS. 2 (A) to 2 (D) a method of manufacturing the circuit board 1 of the present embodiment will be described with reference to FIGS. 2 (A) to 2 (D).
  • the base material 2 As the base material 2, the recess 3 and the groove 5 are formed on the surface, and the protective electrode 10 covering the groove 5 is provided.
  • the electronic component 16 is mounted on the electrodes 4A and 4B of the recess 3 with respect to the above-described base material 2 to achieve electrical connection (mounting step) ).
  • components may be mounted on the recess 3 and the electrode 6 D outside the groove 5 or on the back surface of the recess 3.
  • the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
  • the top surface 9 of the base material 2, the top surface 11 of the conductive resin, and the protective electrode 10 are polished to a depth where the groove 5 is exposed using, for example, a grindstone.
  • the groove 5 is formed (groove forming step).
  • the portion covering the groove 5 of the protective electrode 10 is removed by, for example, router processing or mechanical peeling. By doing this, it is possible to form the groove without affecting the above-mentioned parts.
  • the conductive resin is applied by, for example, dispensing until the surface becomes flat. At this time, if coating is performed under vacuum, the filling property of the conductive resin into the groove 5 is further enhanced. Thereafter, the conductive resin is cured by an appropriate process such as heat curing (conductive resin layer forming process). From the above, a series of operation steps for manufacturing the circuit board 1 are completed.
  • the thickness can be reduced. Furthermore, since the connection between the conductive resin 8 and the electrode 6B is performed inside the groove 5, in the process of manufacturing the circuit board, the step between the top surface of the insulating resin 7 and the top surface 9 of the recess 3 is eliminated. In addition, even if the top surface 9 of the recess 3 and the insulating resin 7 are both polished, the electrical connection between the electrode 6B and the conductive resin 8 can be secured. Moreover, even if external stress is applied to the surface of the circuit board, the stress on the connection surface between the electrode 6B and the conductive resin 8 in the inside of the base material 2 is relaxed, so that an electrical connection resistant to external stress can be obtained. Further, since the conductive resin 8 enters the inside of the groove 5, the connection between the base 2 and the conductive resin 8 can be made strong. This makes it possible to provide a thin and stress-resistant circuit board.
  • FIG. 3 shows a top view of a circuit board 20 according to a second embodiment of the present invention.
  • the circuit board 20 is different from the circuit board 1 of the first embodiment in that grooves 5 are formed on four sides of the recess 3.
  • the circuit board 20 can completely surround all the electronic components 4 disposed in the recess 3 by forming the grooves 5 on the four sides of the recess 3. By this, in addition to the effect of the first embodiment, a strong electromagnetic shield can be applied to the electronic component 4.
  • the substrate 2 in which a plurality of grooves 5 are formed for one side of the recess 3 is used as the circuit board 20, but for example, as shown in FIG.
  • One groove 5 may be formed, and as shown in FIG. 5, the groove 5 may be formed continuously over the four sides of the recess 3.
  • FIG. 6 shows a cross-sectional view of a circuit board 30 according to a third embodiment of the present invention.
  • the circuit board 30 differs from the second embodiment and the third embodiment in that the groove 5 is formed to expose the base 2 at the side surface 5A.
  • the circuit board 30 has a structure in which the conductive resin 8 is connected to the base 2 at the side surface 5 A of the groove 5. Since the connection strength between the conductive resin 8 and the base 2 is higher than the connection strength between the metal and the resin, the connection between the conductive resin 8 and the base 2 is strong.
  • the groove 5 is formed by processing a router or the like, the side surface of the groove 5 is roughened, so the bonding area with the conductive resin 8 is increased, and a strength improvement effect can be obtained.
  • the connecting surface of the electrode 6B and the conductive resin 8 is surrounded by the connecting surface of the conductive resin 8 having a high connection strength and the side surface 5A, so the side surface 5A of the groove 5 as shown in FIG.
  • the connection strength between the electrode 6B and the conductive resin 8 can be improved more than that described above. This makes it possible to realize a circuit board in which the connection between the electrode 6B and the conductive resin 8 is reliable.
  • FIG. 9 shows a circuit board 40 to which the present invention is applied.
  • the circuit board 40 has a thin rectangular solid shape, and includes a base 2, a recess 3, a plurality of (two in the present embodiment) electronic components 4, a conductive film 13, and an electrode 6. , An insulating resin 7 and a conductive resin 8.
  • the base 2 is made of, for example, an appropriate insulating material such as glass, ceramic, epoxy resin, etc.
  • the recess 3 is formed on one side or both sides, and a conductive film is formed on the side surface 3 B of the recess 3 , The bottom surface 3A and electrodes 6A, 6B for mounting the electronic component 4 on the surface of the substrate.
  • the conductive film 13 is made of an appropriate conductive material such as metal or resin mixed with metal particles, and the top surface 9 of the base 2 and the recess 3 are formed by an appropriate method such as vapor deposition or plating. And the electrode 6C.
  • the insulating resin 7 resin-seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3A is solidified in a state of being covered and embedded with an appropriate resin material. .
  • the circuit board 40 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even if an external force of a certain strength is mechanically applied, and also adheres to water, dust, etc.
  • Stable operation can be achieved by avoiding
  • the conductive resin 8 is formed on the insulating resin 7 using a conductive resin made of an appropriate resin material or the like, and is in contact with the conductive film 13.
  • the conductive resin 8 shields the internal electronic components 4 by shielding electromagnetic waves from the outside and static electricity from the adjacent electronic components, and protects the internal electronic components 4 from static electricity or the like to the adjacent electronic components. Shield propagation.
  • the conductive resin be electrically connected to the ground electrode 6D through the conductive film 13, the electrode 6C, the via V, the internal wiring, and the like.
  • the recess 3 is formed on the surface as the substrate 2, and the conductive film 13 is provided on the side surface 3 B of the recess 3 and is in contact with the conductive film 13.
  • An electrode 6C and an electrode 6D for grounding located on the surface of the base material 2 are used in which a pattern wiring including a via V electrically connecting is formed.
  • the electronic component 4 is mounted on each of the electrodes 6A of the recess 3 with respect to the above-described base material 2 to achieve electrical connection (mounting step).
  • components may be mounted on the recess 3 and the outside of the conductive film 13 or the electrode 6 B on the back surface of the recess 3.
  • the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
  • the conductive resin 8 is applied by, for example, dispensing until the surface becomes flat. Thereafter, the conductive resin 8 is cured by an appropriate process such as heat curing (conductive resin layer forming process). From the above, a series of operation steps for manufacturing the circuit board 40 are completed.
  • the total thickness of the circuit board can be thinner than the conventional structure in which the components are disposed on the substrate without the recess.
  • the shield effect can be obtained by the connection of the conductive film 13 and the conductive resin 8.
  • the shield formation can be completed inside the inner side surface of the recess 3, the area of the top surface 9 of the recess 3 can be reduced, and the conductive resin 8 is formed on the inner side surface 3 B of the recess 3.
  • FIG. 11 shows a circuit board 50 according to a fifth embodiment of the present invention.
  • the circuit board 50 differs from the circuit board 40 of the fourth embodiment in that the conductive resin 8 is in contact with the inner side surface 15 of the conductive film 13.
  • the top surface 14 of the insulating resin 7 is formed parallel to the bottom surface 3A at a position sandwiched between the top surface 9 of the recess 3 and the bottom surface 3A, and the inner surface 15 of the conductive film is in contact with the insulating resin 7 It has surface 15A which contacts insulating resin, without doing.
  • connection area between the conductive film 13 and the conductive resin 8 can be expanded without providing an electrode around the recess 3, and the conductive film 13 and the conductive resin 8 can be used. Electrical connection can be made more secure. Thus, a circuit board with high electrical connection strength can be provided without increasing the external size of the circuit board.
  • FIG. 12 shows a circuit board 60 according to a sixth embodiment of the present invention.
  • the circuit board 60 differs from the circuit board 50 of the fifth embodiment in that a groove 16 is provided between the conductive film 13 and the insulating resin 7, and the conductive resin 8 and the conductive film are formed inside the groove 16. It is the point which makes the connection with 13.
  • a protective film 17 in contact with the inner side surface of the conductive film 13 is formed on the base material 2 of the present embodiment.
  • the protective film 17 is made of, for example, a material such as a water-soluble resin, and can be easily removed by using an appropriate removal method. Further, it is desirable that the removal method is such that the conductive film 13 is not affected by corrosion, peeling, and the like.
  • the electronic component 4 is mounted on the electrode 2A of the recess 3 with respect to the base material 2 to achieve electrical connection (mounting step).
  • components may be mounted on the recess 3 and the outside of the conductive film 13 or the electrode 6 B on the back surface of the recess 3.
  • the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
  • the protective film 17 is removed by an appropriate removal method to form the groove 16 (protective film removal step). From the above, a series of operation steps for forming the groove 16 are completed.
  • connection between the conductive resin 8 and the conductive film 13 is performed inside the groove 16 by forming the groove 16, the connection area between the conductive resin 8 and the conductive film 13 Can be expanded. Furthermore, the effect of protecting the connection surface from external stress can be obtained by keeping the connection surface away from the substrate surface. Further, since the connection area between the conductive resin 8 and the insulating resin 7 can be expanded, the connection strength between the conductive resin 8, the conductive film 13 and the insulating resin 7 can be improved, and the stress can be increased. It is possible to provide a strong circuit board.
  • FIG. 14 shows a circuit board 70 according to a seventh embodiment of the present invention.
  • the circuit board 70 differs from the circuit board 60 of the sixth embodiment in that it has a surface in which the conductive film 13 and the insulating resin 7 are in contact with each other.
  • the depth of the groove 16 can be kept constant regardless of the depth of the recess 3. Therefore, according to the present embodiment, by providing the surface where the conductive film 13 and the insulating resin 7 are in contact with each other, it is possible to form the groove 16 with such a depth that the protective film 17 can be reliably removed. As a result, it is possible to avoid a defect of the circuit board due to the residue of the protective film 17 and to stabilize the depth of the groove 16 so that the filling step of the conductive resin 8 can be made reliable.
  • FIG. 15 shows a circuit board 80 according to an eighth embodiment of the present invention.
  • the circuit board 80 differs from the circuit board 40 of the fourth embodiment in that the top surface 9 of the recess 3 has an electrode 18 electrically connected to the conductive film 13.
  • the connection area between the conductive resin 8 and the conductive film 13 can be enlarged through the electrode 18. Therefore, according to the present embodiment, the electrical connection between the conductive resin 8 and the conductive film 13 can be made more reliable.
  • the surface of the base material 2 is polished to adjust the height of the insulating resin 7 etc.
  • the surface of the electrode 18 is roughened to make the connection between the electrode 18 and the conductive resin 8 stronger. An effect is also produced.
  • FIG. 16 shows a circuit board 90 according to a ninth embodiment of the present invention.
  • the circuit board 90 is different from the circuit board 80 of the eighth embodiment in that the top surface 9 has an opening 19 which is not covered by the electrode 18 and the base material 2 is exposed.
  • the conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8 so that a reinforcing effect is obtained.
  • the reinforcing effect by the opening 19 is added to the effect of improving the connection strength between the conductive film 13 and the conductive resin 8 by the electrode 18, thereby providing a circuit board that is resistant to peeling by external stress. can do.
  • FIG. 17 shows a circuit board 91 according to a tenth embodiment of the present invention.
  • the circuit board 91 is different from the circuit board 90 of the ninth embodiment in that the top surface 9 has an opening 19 which is not covered by the electrode 18 and the base material 2 is exposed.
  • the conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8 so that a reinforcing effect is obtained.
  • the reinforcing effect by the adhesion between the base material 2 and the conductive resin 8 in the opening 19 can prevent the peeling between the electrode 18 and the conductive resin and improve the strength of the circuit board.
  • the present invention is not limited to those described in the above embodiments, but may be modified or applied by those skilled in the art based on the description of the specification and well-known techniques. Yes, within the scope of seeking protection.
  • the present invention can cope with thinning because the actual electronic component is mounted in the recess formed in the base material.
  • grooves are provided in the substrate, and conductive resin is applied to the inside of the grooves, so it is resistant to external stress while having a shield function, and small size such as mobile phones, PHS (Personal Handyphone System), PDA (Personal Digital Assistant) etc. Useful for electronic devices.
  • circuit board 2 base material 3 101 recess 3A recess bottom 3B recess side 4, 102 electronic component 5, 16 groove 5A groove Side 5B Bottom of groove 6, 12, 104, 106 Electrode 7, 103 Insulating resin 8, 105 Conductive resin 9 Top surface of substrate 10 Protective electrode 11 Top surface of insulating resin 13 Conductive film 14 Of insulating resin Top surface 15 Inner surface of conductive film 17 Protective film 18 Surface electrode 19 Opening V Via

Abstract

Provided is a thin compact circuit board that has a function to block the entrance of noises into internal electronic components and that further has an enhanced robustness against external stresses as well as a high reliability. A circuit board (40), which is shaped in a thin rectangular parallelepiped, comprises a substrate (2), a recess (3), electronic components (4), conductive films (13), electrodes (6), an insulative resin (7) and a conductive resin (8). The conductive films (13) are connected to the conductive resin (8), whereby a shield formation can be completed within the internal surfaces of the recess (3). Therefore, the area of the top surface (9) of the substrate can be reduced. Further, the connection of the conductive resin (8) to the conductive films (13) on the internal surfaces (3B) of the recess (3) allows stable electric connections to be obtained even if the mold height of the insulative resin (7) varies.

Description

回路基板、回路モジュール、及び電子機器Circuit board, circuit module, and electronic device
　本発明は、電磁シールドと薄型化とが同時に実現可能な回路基板、及びこの回路基板を備えた回路モジュールと電子機器に関するものである。 The present invention relates to a circuit board on which an electromagnetic shield and thinning can be simultaneously realized, and a circuit module and an electronic device provided with the circuit board.
　従来、基材上に凹部を形成し凹部に複数の要素部品を搭載してなる小型の電子部品が急速に普及している。この種の電子部品には、例えば、ＩＣやハイブリットモジュール等のように封止或いはモールドされたもの又は金属製キヤップで部品を覆ったもの、金属製キヤップに収納されたもの、前述の部品そのものを搭載した回路基板、などが存在する。 2. Description of the Related Art Conventionally, small-sized electronic components formed by forming a recess on a substrate and mounting a plurality of component parts in the recess are rapidly spreading. Examples of the electronic components of this type include ones that are sealed or molded such as ICs and hybrid modules, or those in which the components are covered with a metal cap, those housed in a metal cap, and the aforementioned components themselves. There are mounted circuit boards and the like.
　例えば、凹部上にＣＰＵやメモリ等のノイズ対策が必要な要素部品を搭載した場合、凹部を覆うようにシールド対策を施すことが対策は必要不可欠である。しかしながら、金属キヤップを搭載することによって電子部品の完成厚みは増大する。このため、近年、基板上の凹部に実装した要素部品に対してシールド効果を付与し、さらに薄型化に対応するため、回路基板の凹部に搭載した要素部品を導電性樹脂で被覆封止するようにした回路基盤の製造方法などが提案されている（例えば、特許文献１参照）。 For example, in the case where an element part requiring a noise countermeasure, such as a CPU or a memory, is mounted on a recess, it is essential to take a shielding measure so as to cover the recess. However, the mounting thickness of the electronic component is increased by mounting the metal cap. For this reason, in recent years, in order to provide a shielding effect to the component parts mounted in the recess on the substrate and to cope with further thinning, the component parts mounted in the recess of the circuit board are covered and sealed with a conductive resin. A method of manufacturing a circuit board or the like has been proposed (see, for example, Patent Document 1).
　即ち、図８に示す回路モジュール１００では、基板端部を除く主面の一部に凹部１０１を形成し、凹部１０１に要素部品１０２を搭載する。その後、要素部品１０２の上面側に封止樹脂層１０３を形成する。次に、主面に設けられた電極１０４と封止樹脂層１０３とを被覆するように導電性樹脂層１０５を形成する。電極１０４は該定電位導体パターン１０６と内部で接続しているため、要素部品１０２に対するシールド効果が得られる。これにより、高いノイズシールド性を持ちながら、極めて薄い構造をとることができる。 That is, in the circuit module 100 shown in FIG. 8, the recess 101 is formed in part of the main surface excluding the substrate end, and the component parts 102 are mounted on the recess 101. Thereafter, the sealing resin layer 103 is formed on the upper surface side of the component part 102. Next, a conductive resin layer 105 is formed to cover the electrode 104 provided on the main surface and the sealing resin layer 103. Since the electrode 104 is internally connected to the constant potential conductor pattern 106, a shielding effect on the element part 102 can be obtained. Thereby, an extremely thin structure can be taken while having high noise shielding properties.
日本国特許第２５６５３００号公報Japanese Patent No. 2565300
　しかしながら、上述した従来技術においては、電極と導電性樹脂との接続面が基材表面とほぼ同一面となっているため、外部応力が接続面にかかり易く、電極と導電性樹脂との接続が剥離し易いという課題がある。 However, in the prior art described above, since the connection surface between the electrode and the conductive resin is substantially the same surface as the substrate surface, external stress is easily applied to the connection surface, and the connection between the electrode and the conductive resin is There is a problem that it is easy to peel off.
　本発明は上述した従来技術の問題に鑑みなされたもので、電子部品への強固な電磁シールド性を有し、かつ、電極と導電性樹脂との接続を強固なものとした薄型・小型対応可能な回路基板を提供することを目的とするものである。 The present invention has been made in view of the above-described problems of the prior art, and has a strong electromagnetic shielding property to an electronic component, and can cope with thinness and smallness by firmly connecting the electrode and the conductive resin. It is an object of the present invention to provide a circuit board.
　本発明の回路基板は、基材と、基材に形成された凹部と、凹部の底面に配置された電子部品と、凹部の内側面に形成された導電性膜と、凹部に充填され、電子部品に接する絶縁性樹脂と、絶縁性樹脂と電子部品を覆い、導電性膜と電気的に接続する導電性樹脂とを備えている。 The circuit board of the present invention is filled in the base, the recess formed in the base, the electronic component disposed on the bottom of the recess, the conductive film formed on the inner side surface of the recess, and the recess An insulating resin in contact with the component, and a conductive resin covering the insulating resin and the electronic component and electrically connected to the conductive film are provided.
　凹部の内部に電子部品を配置することで薄型化することができる上に、導電性膜と導電性樹脂との接続によってシールド効果を得ることができる。更に、凹部内側面の内側でシールド形成を完結することができ、凹部の頂面の面積を削減することが可能となる上、基材表面と絶縁性樹脂の間に段差があったとしても、導電性膜と導電性樹脂とは安定して接続可能である。これにより、シールド効果を備え、対応力性も備えた、薄型化・小型化に対応可能な回路基板を提供できる。 In addition to being able to be thinned by arranging the electronic component inside the recess, a shielding effect can be obtained by connecting the conductive film and the conductive resin. Furthermore, the shield formation can be completed inside the inner surface of the recess, and the area of the top surface of the recess can be reduced, and even if there is a step between the substrate surface and the insulating resin, The conductive film and the conductive resin can be stably connected. As a result, it is possible to provide a circuit board that is compatible with thinning and downsizing, which has shielding effects and is also capable of supporting.
　また、本発明の一態様として、上記回路基板であって、導電性膜と導電性樹脂との接続を内側面にて行うことによって、凹部の周囲に電極を設けることなく、導電性膜と導電性樹脂との接続面積を拡大したものである。
　これにより、前記導電性膜と前記導電性樹脂との電気的な接続をより確実にすることが可能となる。 In one embodiment of the present invention, the conductive film and the conductive resin are connected on the inner side surface, thereby providing the conductive film and the conductive film without providing an electrode around the recess. Of the connecting area with the conductive resin.
This makes it possible to make the electrical connection between the conductive film and the conductive resin more reliable.
　また、本発明の一態様として、上記回路基板であって、導電性膜と絶縁性樹脂との間に溝を有し、溝の内部において導電性樹脂と導電性膜との接続を行うことにより、導電性膜と導電性樹脂との接続面積を拡大し、かつ、導電性樹脂と絶縁性樹脂との接続面積を拡大するものである。
　これにより、導電性樹脂と導電性膜と絶縁性樹脂との接続強度を向上させることが可能となる。
　また、本発明の一態様として、上記回路基板であって、導電性膜と絶縁性樹脂とが接触する面を持つことによって、凹部の深さが深くなっても、溝の形成を容易にするものである。
　これによって、導電性樹脂と導電性膜と絶縁性樹脂との接続強度を向上させることができ、かつ、凹部をどのような深さで形成したとしても、溝形成を安定させることができる。 In one embodiment of the present invention, the circuit board includes the groove between the conductive film and the insulating resin, and the conductive resin is connected to the conductive film inside the groove. And expanding the connection area between the conductive film and the conductive resin, and the connection area between the conductive resin and the insulating resin.
This makes it possible to improve the connection strength between the conductive resin, the conductive film, and the insulating resin.
Further, according to one aspect of the present invention, in the circuit board, the formation of the groove is facilitated even when the depth of the recess is increased by having a surface where the conductive film and the insulating resin are in contact with each other. It is a thing.
Thus, the connection strength between the conductive resin, the conductive film, and the insulating resin can be improved, and the groove formation can be stabilized regardless of the depth of the recess.
　また、本発明の一態様として、上記回路基板であって、凹部の頂面に、電性膜と電気的に接続した電極とを有し、導電性樹脂と電極とが接することによって、導電性樹脂と導電性膜との接続面積を電極を介して拡大するものである。
　これによって、導電性樹脂と導電性膜との電気的な接続をより確実にすることができる。 In one embodiment of the present invention, the circuit board is the above-mentioned circuit board, and the top surface of the recess has an electrode electrically connected to the conductive film, and the conductive resin and the electrode are in contact with each other to achieve conductivity. The connection area between the resin and the conductive film is enlarged through the electrode.
Thereby, the electrical connection between the conductive resin and the conductive film can be made more reliable.
　また、本発明の一態様として、上記回路基板であって、頂面に前記電極に覆われず基材が露出する露出部を有し、露出部において基材と接することによって、電極と導電性樹脂のとの接続よりも強度の高い導電性樹脂と基材のとの接続面を設けることができる。
　これによって、導電性樹脂と導電性膜との接続強度を向上させることができる。 In one embodiment of the present invention, the circuit board has the exposed portion on the top surface that is not covered by the electrode and the base is exposed, and the electrode and the conductive portion are in contact with the base at the exposed portion. It is possible to provide a connecting surface between the conductive resin and the base, which has higher strength than the connection with the resin.
Thus, the connection strength between the conductive resin and the conductive film can be improved.
　また、本発明の一態様として、上記回路基板であって、頂面に前記電極に覆われず基材が露出する開口部を有し、開口部において基材と接することによって、電極と導電性樹脂のとの接続よりも強度の高い導電性樹脂と基材のとの接続面を設けることができる。
　これによって、導電性樹脂と導電性膜との接続強度を向上させることができる。 In one embodiment of the present invention, the circuit substrate has an opening on the top surface which is not covered by the electrode and through which the substrate is exposed, and is in contact with the substrate at the opening. It is possible to provide a connecting surface between the conductive resin and the base, which has higher strength than the connection with the resin.
Thus, the connection strength between the conductive resin and the conductive film can be improved.
　凹部の内部に電子部品を配置することで薄型化することができる上に、導電性膜と導電性樹脂との接続によってシールド効果を得ることができる。更に、凹部内側面の内側でシールド形成を完結することができ、凹部の頂面の面積を削減することが可能となる上、基材表面と絶縁性樹脂の間に段差があったとしても、導電性膜と導電性樹脂とは安定して接続可能である。これにより、シールド効果を備え、対応力性も備えた、薄型化・小型化に対応可能な回路基板を提供できる。 In addition to being able to be thinned by arranging the electronic component inside the recess, a shielding effect can be obtained by connecting the conductive film and the conductive resin. Furthermore, the shield formation can be completed inside the inner surface of the recess, and the area of the top surface of the recess can be reduced, and even if there is a step between the substrate surface and the insulating resin, The conductive film and the conductive resin can be stably connected. As a result, it is possible to provide a circuit board that is compatible with thinning and downsizing, which has shielding effects and is also capable of supporting.
本発明の実施の形態１による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 1 of this invention. （Ａ）～（Ｄ）本発明の実施の形態１による回路基板の製造方法を示す断面図及び上面図(A)-(D) Cross-sectional view and top view showing a method of manufacturing a circuit board according to Embodiment 1 of the present invention 本発明の実施の形態２による回路基板の構成を示した上面図The top view which showed the structure of the circuit board by Embodiment 2 of this invention 本発明の実施の形態２による回路基板の溝の第１の変形例を示した上面図The top view which showed the 1st modification of the groove | channel of the circuit board by Embodiment 2 of this invention 本発明の実施の形態２による回路基板の溝の第１の変形例を示した上面図The top view which showed the 1st modification of the groove | channel of the circuit board by Embodiment 2 of this invention 本発明の実施の形態３による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 3 of this invention 図６の溝に電極を配置した回路基板の構成を示した断面図6 is a cross-sectional view showing the configuration of a circuit board in which electrodes are disposed in the grooves of FIG. 6 従来の回路基板の構成を示した断面図Sectional view showing the configuration of a conventional circuit board 本発明の実施の形態４による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 4 of this invention （Ａ）～（Ｃ）本発明の実施の形態４による回路基板の製造方法を示す断面図(A) to (C) are cross sectional views showing a method of manufacturing a circuit board according to a fourth embodiment of the present invention 本発明の実施の形態５による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 5 of this invention. 本発明の実施の形態６による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 6 of this invention （Ａ）～（Ｄ）本発明の実施の形態６による回路基板の製造方法を示す断面図(A) to (D) are cross sectional views showing a method of manufacturing a circuit board according to a sixth embodiment of the present invention 本発明の実施の形態７による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 7 of this invention 本発明の実施の形態８による回路基板の構成を示した断面図Sectional view showing the configuration of a circuit board according to Embodiment 8 of the present invention 本発明の実施の形態９による回路基板の構成を示した断面図Sectional drawing which showed the structure of the circuit board by Embodiment 9 of this invention. 本発明の実施の形態１０による回路基板の構成を示した上面図The top view which showed the structure of the circuit board by Embodiment 10 of this invention.
　以下、本発明の実施形態について、添付図面を参照しながら詳細に説明する。
（第１の実施形態）
　図１は本発明を適応した回路基板１を示している。回路基板１は厚さが薄い直方体形状を有するものであって、基材２と、凹部３と、複数（本実施形態では二つ）の電子部品４と、溝５と、電極６と、絶縁性樹脂７と、導電性樹脂８、とを備えている。
　基材２は、例えばガラス、セラミックス、エポキシ樹脂などの適宜の絶縁性の材料で構成されるもので、片面もしくは両面に凹部３と溝５が形成されており、凹部３の底面３Ａおよび基板表面には電子部品４を搭載するための電極６Ａ、６Ｃを、溝５には導電性樹脂８との接続に用いる電極６Ｂを備えている。
　絶縁性樹脂７は、基材２および電子部品４を樹脂封止するものであり、特に底面３Ａに実装された各電子部品４を、適宜の樹脂材料で覆って埋設させた状態で固めてある。絶縁性樹脂７を設けた回路基板１は、従来の場合と同様、ある程度の強さの外力が機械的に作用しても電子部品４が損傷するのを防止できるとともに、水分や埃などの付着を回避させることで安定した動作を発揮できる。 Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.
First Embodiment
FIG. 1 shows a circuit board 1 to which the present invention is applied. The circuit board 1 has a thin rectangular parallelepiped shape, and the base 2, the recess 3, a plurality of (two in the present embodiment) electronic components 4, the groove 5, the electrode 6, and the insulation are provided. And the conductive resin 8 are provided.
The base 2 is made of, for example, an appropriate insulating material such as glass, ceramics, epoxy resin, etc. The recess 3 and the groove 5 are formed on one side or both sides, and the bottom 3A of the recess 3 and the substrate surface The electrodes 6A and 6C for mounting the electronic component 4 are provided with the electrode 6, and the groove 5 is provided with the electrode 6B used for connection with the conductive resin 8.
The insulating resin 7 resin-seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3A is solidified in a state of being covered and embedded with an appropriate resin material. . As in the conventional case, the circuit board 1 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even if an external force of a certain strength acts mechanically, and adhesion of moisture, dust, etc. Stable operation can be achieved by avoiding
　本実施形態の基材２は頂面９上に溝５が形成されている。溝５は底面５Ｂと電極６Ｂが同一面となる深さまで形成され内部に導電性樹脂８が充填されている。
　導電性樹脂８は、適宜の樹脂材料などからなる導電性樹脂を用いて絶縁性樹脂７の上および溝５内部に形成されている。この導電性樹脂８により、外部からの電磁波及び隣接する電子部品からの静電気などをシールドして内部の電子部品４を保護するとともに、内部の電子部品４から発生する静電気などが隣接する電子部品へ伝搬するのをシールドする。 In the base material 2 of the present embodiment, a groove 5 is formed on the top surface 9. The groove 5 is formed to such a depth that the bottom surface 5B and the electrode 6B are flush with each other, and the conductive resin 8 is filled therein.
The conductive resin 8 is formed on the insulating resin 7 and inside the groove 5 using a conductive resin made of an appropriate resin material or the like. The conductive resin 8 shields the internal electronic components 4 by shielding electromagnetic waves from the outside and static electricity from the adjacent electronic components, and protects the internal electronic components 4 from static electricity or the like to the adjacent electronic components. Shield propagation.
　また、強固なシールド性を得るために、電極６ＢはビアＶや内部配線を通じてグランド用の電極６Ｃと電気的に接続されていることが望ましい。 Further, in order to obtain a strong shielding property, it is desirable that the electrode 6B be electrically connected to the electrode 6C for ground through the via V and the internal wiring.
　次に、本実施形態の回路基板１の製造方法について図２（Ａ）～（Ｄ）を参照しながら説明する。なお、本実施形態の回路基板１の製造では、基材２として、表面に凹部３、及び、溝５が形成されているとともに、溝５を覆う保護電極１０を有し、溝５の底面５Ａに位置する電極６Ａと、基材２の表面に位置する接地用の電極６Ｃを、電気的に接続するビアＶを含むパターン配線が形成されているものを用いる。
（１）初めに、図２（Ａ）に示すように、上記の基材２に対して、凹部３の電極４Ａ、４Ｂに、電子部品１６をそれぞれ搭載させて電気的接続を図る（実装工程）。
　図示はしていないが、凹部３、及び、溝５の外部、または凹部３の裏面の電極６Ｄに部品を搭載しても良い。
（２）その後、同図（Ｂ）に示すように、凹部３の内部に、電子部品４ごと覆うような状態で適宜の樹脂材料により構成された絶縁性樹脂７を形成し、一体に積層させて固める（モールド層形成工程）。
（３）次に、同図（Ｃ）に示すように、基材２の頂面９、導電性樹脂の頂面１１、保護電極１０、を例えば砥石などによって溝５が露出する深さまで研磨を行い、溝５を形成する（溝形成工程）。また、（１）の工程において凹部３、及び、溝５の外部に部品を搭載した場合においては、例えばルーター加工や機械的な引き剥しによって、保護電極１０の溝５を覆っている部分を除去することにより、前述した部品へ影響を与えること無く溝の形成が可能である。
（４）後に、前述した溝５に充填させるような状態で、導電性樹脂を例えばディスペンスなどによって表面が平坦な面状態となるまで塗布する。その際、真空下で塗布を行えば導電性樹脂の溝５への充填性が一層高まる。その後、熱硬化などの適宜の工程により、導電性樹脂を硬化させる（導電性樹脂層形成工程）。
　上記より、回路基板１製造のための一連の作業工程が終了する。 Next, a method of manufacturing the circuit board 1 of the present embodiment will be described with reference to FIGS. 2 (A) to 2 (D). In the manufacture of the circuit board 1 of the present embodiment, as the base material 2, the recess 3 and the groove 5 are formed on the surface, and the protective electrode 10 covering the groove 5 is provided. A pattern wiring including a via V for electrically connecting the electrode 6A located on the surface and the electrode 6C for grounding located on the surface of the base material 2 is used.
(1) First, as shown in FIG. 2 (A), the electronic component 16 is mounted on the electrodes 4A and 4B of the recess 3 with respect to the above-described base material 2 to achieve electrical connection (mounting step) ).
Although not shown, components may be mounted on the recess 3 and the electrode 6 D outside the groove 5 or on the back surface of the recess 3.
(2) Thereafter, as shown in FIG. 6B, the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
(3) Next, as shown in FIG. 6C, the top surface 9 of the base material 2, the top surface 11 of the conductive resin, and the protective electrode 10 are polished to a depth where the groove 5 is exposed using, for example, a grindstone. The groove 5 is formed (groove forming step). In the case where a component is mounted on the outside of the recess 3 and the groove 5 in the step (1), the portion covering the groove 5 of the protective electrode 10 is removed by, for example, router processing or mechanical peeling. By doing this, it is possible to form the groove without affecting the above-mentioned parts.
(4) After that, in a state in which the groove 5 described above is filled, the conductive resin is applied by, for example, dispensing until the surface becomes flat. At this time, if coating is performed under vacuum, the filling property of the conductive resin into the groove 5 is further enhanced. Thereafter, the conductive resin is cured by an appropriate process such as heat curing (conductive resin layer forming process).
From the above, a series of operation steps for manufacturing the circuit board 1 are completed.
　従って、本実施形態によれば、凹部３の内部に電子部品４を配置することで薄型化することができる。さらに、導電性樹脂８と電極６Ｂとの接続を溝５の内部で行っているので、回路基板の製造工程で、絶縁性樹脂７の頂面と凹部３の頂面９との段差を無くすために、凹部３の頂面９と絶縁性樹脂７を共に研磨したとしても、電極６Ｂと導電性樹脂８との電気的接続を確保することができる。そのうえ、回路基板表面へ外部応力が加わったとしても基材２の内部にある電極６Ｂと導電性樹脂８との接続面への応力は緩和されるので、外部応力に強い電気接続が得られる。また、溝５の内部に導電性樹脂８が入るので、基材２と導電性樹脂８の接続を強固なものとすることができる。これによって、薄型で応力に強い回路基板を提供することが可能となる。 Therefore, according to the present embodiment, by arranging the electronic component 4 inside the recess 3, the thickness can be reduced. Furthermore, since the connection between the conductive resin 8 and the electrode 6B is performed inside the groove 5, in the process of manufacturing the circuit board, the step between the top surface of the insulating resin 7 and the top surface 9 of the recess 3 is eliminated. In addition, even if the top surface 9 of the recess 3 and the insulating resin 7 are both polished, the electrical connection between the electrode 6B and the conductive resin 8 can be secured. Moreover, even if external stress is applied to the surface of the circuit board, the stress on the connection surface between the electrode 6B and the conductive resin 8 in the inside of the base material 2 is relaxed, so that an electrical connection resistant to external stress can be obtained. Further, since the conductive resin 8 enters the inside of the groove 5, the connection between the base 2 and the conductive resin 8 can be made strong. This makes it possible to provide a thin and stress-resistant circuit board.
（第２の実施形態）
　図３は、本発明の第２の実施形態に係る回路基板２０の上面図を示す。回路基板２０が第１の実施形態の回路基板１と異なる点は、凹部３の４辺に溝５を形成している点である。 Second Embodiment
FIG. 3 shows a top view of a circuit board 20 according to a second embodiment of the present invention. The circuit board 20 is different from the circuit board 1 of the first embodiment in that grooves 5 are formed on four sides of the recess 3.
　回路基板２０は、凹部３の４辺に溝５を形成することにより、凹部３に配置された全ての電子部品４を完全に囲うことができる。これによって、第１の実施形態の効果に加え、電子部品４に対し強固な電磁シールドを施すことができる。 The circuit board 20 can completely surround all the electronic components 4 disposed in the recess 3 by forming the grooves 5 on the four sides of the recess 3. By this, in addition to the effect of the first embodiment, a strong electromagnetic shield can be applied to the electronic component 4.
　なお、本実施形態では、回路基板２０として凹部３の１辺に対し複数個の溝５が形成されている基材２を用いたが、例えば図４に示すように凹部３の１辺に対し１個の溝５が形成されていてもよく、図５に示すように溝５が凹部３の４辺にわたって連なった形で形成されていてもよい。 In the present embodiment, the substrate 2 in which a plurality of grooves 5 are formed for one side of the recess 3 is used as the circuit board 20, but for example, as shown in FIG. One groove 5 may be formed, and as shown in FIG. 5, the groove 5 may be formed continuously over the four sides of the recess 3.
（第３の実施形態）
　図６は、本発明の第３の実施形態に係る回路基板３０の断面図を示す。回路基板３０が第２の実施形態、及び、第３の実施形態と異なる点は、溝５が側面５Ａにおいて基材２が露出するように形成されている点である。 Third Embodiment
FIG. 6 shows a cross-sectional view of a circuit board 30 according to a third embodiment of the present invention. The circuit board 30 differs from the second embodiment and the third embodiment in that the groove 5 is formed to expose the base 2 at the side surface 5A.
　回路基板３０は導電性樹脂８が溝５の側面５Ａで基材２と接続する構造となっている。導電性樹脂８と基材２との接続強度は金属と樹脂との接続強度よりも高いため、導電性樹脂８と基材２の接続が強固なものとなる。また、溝５の形成をルーター等の加工によって行った場合は溝５の側面が荒らされるため、導電性樹脂８との接着面積が増えさらに強度向上効果が得られる。これにより、電極６Ｂと導電性樹脂８との接続面が接続強度の高い導電性樹脂８と側面５Ａの接続面に囲まれるため、図７で示すような溝５の側面５Ａが電極１１で構成されているものよりも電極６Ｂと導電性樹脂８との接続強度を向上させることができる。これによって、電極６Ｂと導電性樹脂８との接続を確実なものとした回路基板を実現することが可能となる。 The circuit board 30 has a structure in which the conductive resin 8 is connected to the base 2 at the side surface 5 A of the groove 5. Since the connection strength between the conductive resin 8 and the base 2 is higher than the connection strength between the metal and the resin, the connection between the conductive resin 8 and the base 2 is strong. When the groove 5 is formed by processing a router or the like, the side surface of the groove 5 is roughened, so the bonding area with the conductive resin 8 is increased, and a strength improvement effect can be obtained. As a result, the connecting surface of the electrode 6B and the conductive resin 8 is surrounded by the connecting surface of the conductive resin 8 having a high connection strength and the side surface 5A, so the side surface 5A of the groove 5 as shown in FIG. The connection strength between the electrode 6B and the conductive resin 8 can be improved more than that described above. This makes it possible to realize a circuit board in which the connection between the electrode 6B and the conductive resin 8 is reliable.
　（第４の実施形態）
　図９は本発明を適応した回路基板４０を示している。回路基板４０は厚さが薄い直方体形状を有するものであって、基材２と、凹部３と、複数（本実施形態では二つ）の電子部品４と、導電性膜１３と、電極６と、絶縁性樹脂７と、導電性樹脂８、とを備えている。基材２は、例えばガラス、セラミックス、エポキシ樹脂などの適宜の絶縁性の材料で構成されるもので、片面もしくは両面に凹部３が形成されており、凹部３の側面部３Ｂには導電性膜を、底面３Ａおよび基板表面には電子部品４を搭載するための電極６Ａ、６Ｂを備えている。 Fourth Embodiment
FIG. 9 shows a circuit board 40 to which the present invention is applied. The circuit board 40 has a thin rectangular solid shape, and includes a base 2, a recess 3, a plurality of (two in the present embodiment) electronic components 4, a conductive film 13, and an electrode 6. , An insulating resin 7 and a conductive resin 8. The base 2 is made of, for example, an appropriate insulating material such as glass, ceramic, epoxy resin, etc. The recess 3 is formed on one side or both sides, and a conductive film is formed on the side surface 3 B of the recess 3 , The bottom surface 3A and electrodes 6A, 6B for mounting the electronic component 4 on the surface of the substrate.
　導電性膜１３は、金属、あるいは金属粒子を混合した樹脂などの適宜の導電性材料で構成されるもので、蒸着、メッキなどの適宜の手法で、基材２の頂面９と、凹部３の側面部３Ｂと、電極６Ｃとそれぞれ接するように形成されている。
　絶縁性樹脂７は、基材２および電子部品４を樹脂封止するものであり、特に底面３Ａに実装された各電子部品４を、適宜の樹脂材料で覆って埋設させた状態で固めてある。絶縁性樹脂７を設けた回路基板４０は、従来の場合と同様、ある程度の強さの外力が機械的に作用しても電子部品４が損傷するのを防止できるとともに、水分や埃などの付着を回避させることで安定した動作を発揮できる。
　導電性樹脂８は、適宜の樹脂材料などからなる導電性樹脂を用いて絶縁性樹脂７の上に形成され、導電性膜１３に接している。この導電性樹脂８により、外部からの電磁波及び隣接する電子部品からの静電気などをシールドして内部の電子部品４を保護するとともに、内部の電子部品４から発生する静電気などが隣接する電子部品へ伝搬するのをシールドする。 The conductive film 13 is made of an appropriate conductive material such as metal or resin mixed with metal particles, and the top surface 9 of the base 2 and the recess 3 are formed by an appropriate method such as vapor deposition or plating. And the electrode 6C.
The insulating resin 7 resin-seals the base material 2 and the electronic component 4, and in particular, the electronic component 4 mounted on the bottom surface 3A is solidified in a state of being covered and embedded with an appropriate resin material. . As in the conventional case, the circuit board 40 provided with the insulating resin 7 can prevent the electronic component 4 from being damaged even if an external force of a certain strength is mechanically applied, and also adheres to water, dust, etc. Stable operation can be achieved by avoiding
The conductive resin 8 is formed on the insulating resin 7 using a conductive resin made of an appropriate resin material or the like, and is in contact with the conductive film 13. The conductive resin 8 shields the internal electronic components 4 by shielding electromagnetic waves from the outside and static electricity from the adjacent electronic components, and protects the internal electronic components 4 from static electricity or the like to the adjacent electronic components. Shield propagation.
　また、強固なシールド性を得るために、導電性樹脂は導電性膜１３、電極６Ｃ、ビアＶ、内部配線などを通じてグランド用の電極６Ｄと電気的に接続されていることが望ましい。 Further, in order to obtain strong shielding performance, it is desirable that the conductive resin be electrically connected to the ground electrode 6D through the conductive film 13, the electrode 6C, the via V, the internal wiring, and the like.
　次に、本実施形態の回路基板４０の製造方法について図１０（Ａ）～（Ｃ）を参照しながら説明する。なお、本実施形態の回路基板４０の製造では、基材２として、表面に凹部３が形成されているとともに、凹部３の側面部３Ｂに導電性膜１３を有し、導電性膜１３と接する電極６Ｃと、基材２の表面に位置する接地用の電極６Ｄを、電気的に接続するビアＶを含むパターン配線が形成されているものを用いる。
（１）初めに、図１０（Ａ）に示すように、上記の基材２に対して、凹部３の電極６Ａに、電子部品４をそれぞれ搭載させて電気的接続を図る（実装工程）。
　図示はしていないが、凹部３、及び、導電性膜１３の外部、または凹部３の裏面の電極６Ｂに部品を搭載しても良い。
（２）その後、同図（Ｂ）に示すように、凹部３の内部に、電子部品４ごと覆うような状態で適宜の樹脂材料により構成された絶縁性樹脂７を形成し、一体に積層させて固める（モールド層形成工程）。
（３）次に、同図（Ｃ）に示すように、導電性樹脂８を例えばディスペンスなどによって表面が平坦な面状態となるまで塗布する。その後、熱硬化などの適宜の工程により、導電性樹脂８を硬化させる（導電性樹脂層形成工程）。
　上記より、回路基板４０製造のための一連の作業工程が終了する。 Next, a method of manufacturing the circuit board 40 of the present embodiment will be described with reference to FIGS. 10 (A) to 10 (C). In the manufacture of the circuit board 40 according to the present embodiment, the recess 3 is formed on the surface as the substrate 2, and the conductive film 13 is provided on the side surface 3 B of the recess 3 and is in contact with the conductive film 13. An electrode 6C and an electrode 6D for grounding located on the surface of the base material 2 are used in which a pattern wiring including a via V electrically connecting is formed.
(1) First, as shown in FIG. 10A, the electronic component 4 is mounted on each of the electrodes 6A of the recess 3 with respect to the above-described base material 2 to achieve electrical connection (mounting step).
Although not shown, components may be mounted on the recess 3 and the outside of the conductive film 13 or the electrode 6 B on the back surface of the recess 3.
(2) Thereafter, as shown in FIG. 6B, the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
(3) Next, as shown in FIG. 6C, the conductive resin 8 is applied by, for example, dispensing until the surface becomes flat. Thereafter, the conductive resin 8 is cured by an appropriate process such as heat curing (conductive resin layer forming process).
From the above, a series of operation steps for manufacturing the circuit board 40 are completed.
　従って、本実施形態によれば、凹部３の内部に電子部品４を配置することで従来の凹部のない基板に部品を配置する構造よりも回路基板の総厚を薄型化することができる上に、導電性膜１３と導電性樹脂８との接続によってシールド効果を得ることができる。更に、凹部３内側面の内側でシールド形成を完結することができるので、凹部３の頂面９の面積を削減することが可能となる上に、凹部３の内側面３Ｂにおいて導電性樹脂８と導電性膜１３接続することにより、絶縁性樹脂７のモールド高さがばらついたとしても、安定した電機接続を取ることが可能となる。これにより、シールド効果を備え、薄型化・小型化に対応可能な回路基板を提供できる。 Therefore, according to the present embodiment, by disposing the electronic component 4 inside the recess 3, the total thickness of the circuit board can be thinner than the conventional structure in which the components are disposed on the substrate without the recess. The shield effect can be obtained by the connection of the conductive film 13 and the conductive resin 8. Furthermore, since the shield formation can be completed inside the inner side surface of the recess 3, the area of the top surface 9 of the recess 3 can be reduced, and the conductive resin 8 is formed on the inner side surface 3 B of the recess 3. By connecting the conductive film 13, even when the mold height of the insulating resin 7 varies, stable electrical connection can be obtained. As a result, it is possible to provide a circuit board that has a shielding effect and can cope with thinning and downsizing.
（第５の実施形態）
　図１１は、本発明の第５の実施形態に係る回路基板５０を示す。回路基板５０が第４の実施形態の回路基板４０と異なる点は、導電性樹脂８が導電性膜１３の内側面１５と接する点である。 Fifth Embodiment
FIG. 11 shows a circuit board 50 according to a fifth embodiment of the present invention. The circuit board 50 differs from the circuit board 40 of the fourth embodiment in that the conductive resin 8 is in contact with the inner side surface 15 of the conductive film 13.
　絶縁性樹脂７の頂面１４は凹部３の頂面９と、底面３Ａに挟まれる位置に底面３Ａと並行する形で形成されており、導電性膜の内側面１５は絶縁性樹脂７と接触せず、絶縁性樹脂と接する面１５Ａを持つ。 The top surface 14 of the insulating resin 7 is formed parallel to the bottom surface 3A at a position sandwiched between the top surface 9 of the recess 3 and the bottom surface 3A, and the inner surface 15 of the conductive film is in contact with the insulating resin 7 It has surface 15A which contacts insulating resin, without doing.
　したがって、本実施形態によれば、凹部３の周囲に電極を設けることなく、導電性膜１３と導電性樹脂８との接続面積を拡大することができ、導電性膜１３と導電性樹脂８との電気的な接続をより確実にすることができる。これにより、回路基板の外形サイズを拡大することなく、電気的な接続強度の高い回路基板を提供できる。 Therefore, according to the present embodiment, the connection area between the conductive film 13 and the conductive resin 8 can be expanded without providing an electrode around the recess 3, and the conductive film 13 and the conductive resin 8 can be used. Electrical connection can be made more secure. Thus, a circuit board with high electrical connection strength can be provided without increasing the external size of the circuit board.
（第６の実施形態）
　図１２は、本発明の第６の実施形態に係る回路基板６０を示す。回路基板６０が第５の実施形態の回路基板５０と異なる点は、導電性膜１３と絶縁性樹脂７との間に溝１６を有し、溝１６の内部において導電性樹脂８と導電性膜１３との接続を行う点である。 Sixth Embodiment
FIG. 12 shows a circuit board 60 according to a sixth embodiment of the present invention. The circuit board 60 differs from the circuit board 50 of the fifth embodiment in that a groove 16 is provided between the conductive film 13 and the insulating resin 7, and the conductive resin 8 and the conductive film are formed inside the groove 16. It is the point which makes the connection with 13.
　次に、溝１６の形成方法ついて図１３（Ａ）～（Ｄ）を参照しながら説明する。本実施形態の基材２には導電性膜１３の内側面に接する保護膜１７が形成されている。 Next, a method of forming the groove 16 will be described with reference to FIGS. 13 (A) to 13 (D). A protective film 17 in contact with the inner side surface of the conductive film 13 is formed on the base material 2 of the present embodiment.
　保護膜１７は例えば水溶性樹脂などの材料で構成されており、適切な除去方法を用いれば容易に除去が可能なものである。また、除去方法は導電性膜１３に対して腐食、剥離等の影響のないものであることが望ましい。 The protective film 17 is made of, for example, a material such as a water-soluble resin, and can be easily removed by using an appropriate removal method. Further, it is desirable that the removal method is such that the conductive film 13 is not affected by corrosion, peeling, and the like.
（１）初めに、図１３（Ａ）に示すように、基材２に対して、凹部３の電極６Ａに、電子部品４をそれぞれ搭載させて電気的接続を図る（実装工程）。
　図示はしていないが、凹部３、及び、導電性膜１３の外部、または凹部３の裏面の電極６Ｂに部品を搭載しても良い。
（２）その後、同図（Ｂ）に示すように、凹部３の内部に、電子部品４ごと覆うような状態で適宜の樹脂材料により構成された絶縁性樹脂７を形成し、一体に積層させて固める（モールド層形成工程）。
（３）次に、同図（Ｃ）に示すように、保護膜１７を適宜の除去方法によって除去し、溝１６を形成する（保護膜除去工程）。
　上記より、溝１６を形成するための一連の作業工程が終了する。 (1) First, as shown in FIG. 13A, the electronic component 4 is mounted on the electrode 2A of the recess 3 with respect to the base material 2 to achieve electrical connection (mounting step).
Although not shown, components may be mounted on the recess 3 and the outside of the conductive film 13 or the electrode 6 B on the back surface of the recess 3.
(2) Thereafter, as shown in FIG. 6B, the insulating resin 7 made of an appropriate resin material is formed in the recess 3 so as to cover the entire electronic component 4 and integrally laminated. Solidify (mold layer forming step).
(3) Next, as shown in FIG. 6C, the protective film 17 is removed by an appropriate removal method to form the groove 16 (protective film removal step).
From the above, a series of operation steps for forming the groove 16 are completed.
　従って、本実施形態によれば、溝１６を形成することによって溝１６内部で導電性樹脂８と導電性膜１３との接続が行われるので、導電性樹脂８と導電性膜１３との接続面積を拡大することができる。さらに、接続面が基板表面から遠ざかることで外部応力から接続面を保護する効果も得ることができる。また、導電性樹脂８と絶縁性樹脂７との接続面積を拡大することもできるため、導電性樹脂８と導電性膜１３と絶縁性樹脂７との接続強度を向上させることが可能となり、応力に強い回路基板を提供することが可能となる。 Therefore, according to the present embodiment, since the connection between the conductive resin 8 and the conductive film 13 is performed inside the groove 16 by forming the groove 16, the connection area between the conductive resin 8 and the conductive film 13 Can be expanded. Furthermore, the effect of protecting the connection surface from external stress can be obtained by keeping the connection surface away from the substrate surface. Further, since the connection area between the conductive resin 8 and the insulating resin 7 can be expanded, the connection strength between the conductive resin 8, the conductive film 13 and the insulating resin 7 can be improved, and the stress can be increased. It is possible to provide a strong circuit board.
（第７の実施形態）
　図１４は、本発明の第７の実施形態に係る回路基板７０を示す。回路基板７０が第６の実施形態の回路基板６０と異なる点は、導電性膜１３と絶縁性樹脂７とが接触する面を持つ点である。 Seventh Embodiment
FIG. 14 shows a circuit board 70 according to a seventh embodiment of the present invention. The circuit board 70 differs from the circuit board 60 of the sixth embodiment in that it has a surface in which the conductive film 13 and the insulating resin 7 are in contact with each other.
　溝１６の形成においては、溝１６の深さが深くなるほど保護膜１７の除去は困難になり、溝の一部に保護膜１７が残る課題がある。そこで、導電性膜１３と絶縁性樹脂７とが接触する面を設けることによって、凹部３の深さによらず溝１６の深さを一定に保つことが可能となる。
　従って、本実施形態によれば、導電性膜１３と絶縁性樹脂７とが接触する面を設けることにより、溝１６を保護膜１７が確実に除去できる深さで形成することが可能となる。これによって、保護膜１７の残渣による回路基板の不具合を回避することができるうえに溝１６の深さを安定させることで導電性樹脂８の充填工程も確実なものとすることができる。 In the formation of the groove 16, as the depth of the groove 16 increases, removal of the protective film 17 becomes more difficult, and there is a problem that the protective film 17 remains in a part of the groove. Therefore, by providing the surface where the conductive film 13 and the insulating resin 7 are in contact, the depth of the groove 16 can be kept constant regardless of the depth of the recess 3.
Therefore, according to the present embodiment, by providing the surface where the conductive film 13 and the insulating resin 7 are in contact with each other, it is possible to form the groove 16 with such a depth that the protective film 17 can be reliably removed. As a result, it is possible to avoid a defect of the circuit board due to the residue of the protective film 17 and to stabilize the depth of the groove 16 so that the filling step of the conductive resin 8 can be made reliable.
（第８の実施形態）
　図１５は、本発明の第８の実施形態に係る回路基板８０を示す。回路基板８０が第４の実施形態の回路基板４０と異なる点は、凹部３の頂面９に、導電性膜１３と電気的に接続した電極１８と有している点である。
　導電性樹脂８と電極１８とが接することによって、導電性樹脂８と導電性膜１３との接続面積を電極１８を介して拡大することができる。
　従って、本実施形態によれば、導電性樹脂８と導電性膜１３との電気的な接続をより確実にすることができる。また、絶縁性樹脂７の高さ調整等のために基材２の表面を研磨した場合、電極１８の表面が荒れることによって、電極１８と導電性樹脂８との接続をより強固なものとする効果も生まれる。 Eighth Embodiment
FIG. 15 shows a circuit board 80 according to an eighth embodiment of the present invention. The circuit board 80 differs from the circuit board 40 of the fourth embodiment in that the top surface 9 of the recess 3 has an electrode 18 electrically connected to the conductive film 13.
When the conductive resin 8 and the electrode 18 are in contact with each other, the connection area between the conductive resin 8 and the conductive film 13 can be enlarged through the electrode 18.
Therefore, according to the present embodiment, the electrical connection between the conductive resin 8 and the conductive film 13 can be made more reliable. Further, when the surface of the base material 2 is polished to adjust the height of the insulating resin 7 etc., the surface of the electrode 18 is roughened to make the connection between the electrode 18 and the conductive resin 8 stronger. An effect is also produced.
（第９の実施形態）
　図１６は、本発明の第９の実施形態に係る回路基板９０を示す。回路基板９０が第８の実施形態の回路基板８０と異なる点は、頂面９に電極１８に覆われず基材２が露出する開口部１９を有する点である。
　導電性樹脂８は開口部１９において基材２と接しており、導電性樹脂８と基材２のとの接続は電極１８と導電性樹脂８との接続よりも強度が高いため補強効果が得られる。 Ninth Embodiment
FIG. 16 shows a circuit board 90 according to a ninth embodiment of the present invention. The circuit board 90 is different from the circuit board 80 of the eighth embodiment in that the top surface 9 has an opening 19 which is not covered by the electrode 18 and the base material 2 is exposed.
The conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8 so that a reinforcing effect is obtained. Be
　従って、本実施形態によれば、電極１８による導電性膜１３と導電性樹脂８との接続強度向上効果に、開口部１９による補強効果が加わることによって外部応力による引き剥がしに強い回路基板を提供することができる。 Therefore, according to the present embodiment, the reinforcing effect by the opening 19 is added to the effect of improving the connection strength between the conductive film 13 and the conductive resin 8 by the electrode 18, thereby providing a circuit board that is resistant to peeling by external stress. can do.
（第１０の実施形態）
　図１７は、本発明の第１０の実施形態に係る回路基板９１を示す。回路基板９１が第９の実施形態の回路基板９０と異なる点は、頂面９に電極１８に覆われず基材２が露出する開口部１９を有する点である。
　導電性樹脂８は開口部１９において基材２と接しており、導電性樹脂８と基材２のとの接続は電極１８と導電性樹脂８との接続よりも強度が高いため補強効果が得られる。
　従って、本実施形態によれば、開口部１９における基材２と導電性樹脂８との接着による補強効果によって電極１８と導電性樹脂との剥離を防止し回路基板の強度を向上することができる。
　なお、本発明は上記の実施形態において示されたものに限定されるものではなく、明細書の記載、並びに周知の技術に基づいて、当業者が変更、応用することも本発明の予定するところであり、保護を求める範囲に含まれる。 Tenth Embodiment
FIG. 17 shows a circuit board 91 according to a tenth embodiment of the present invention. The circuit board 91 is different from the circuit board 90 of the ninth embodiment in that the top surface 9 has an opening 19 which is not covered by the electrode 18 and the base material 2 is exposed.
The conductive resin 8 is in contact with the base material 2 at the opening 19 and the connection between the conductive resin 8 and the base material 2 is stronger than the connection between the electrode 18 and the conductive resin 8 so that a reinforcing effect is obtained. Be
Therefore, according to the present embodiment, the reinforcing effect by the adhesion between the base material 2 and the conductive resin 8 in the opening 19 can prevent the peeling between the electrode 18 and the conductive resin and improve the strength of the circuit board. .
The present invention is not limited to those described in the above embodiments, but may be modified or applied by those skilled in the art based on the description of the specification and well-known techniques. Yes, within the scope of seeking protection.
　本発明を詳細にまた特定の実施態様を参照して説明したが、本発明の精神と範囲を逸脱することなく様々な変更や修正を加えることができることは当業者にとって明らかである。 Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
　本出願は、２００９年１２月４日出願の日本特許出願（特願２００９－２７６２９１）に基づくものであり、その内容はここに参照として取り込まれる。 This application is based on Japanese Patent Application (Japanese Patent Application No. 2009-276291) filed on Dec. 4, 2009, the contents of which are incorporated herein by reference.
　本発明は、基材に形成された凹部に実電子部品を実装しているので、薄型化に対応可能である。また、基材に溝を設け、溝内部に導電性樹脂を塗布しているためシールド機能を持ちながら外部応力に強く、携帯電話機、ＰＨＳ（Personal Handyphone System）、ＰＤＡ（Personal Digital Assistant）などの小型の電子機器に有用である。 The present invention can cope with thinning because the actual electronic component is mounted in the recess formed in the base material. In addition, grooves are provided in the substrate, and conductive resin is applied to the inside of the grooves, so it is resistant to external stress while having a shield function, and small size such as mobile phones, PHS (Personal Handyphone System), PDA (Personal Digital Assistant) etc. Useful for electronic devices.
　１、１０、２０、３０、４０、５０、６０、７０、８０、９０、１００　　回路基板
　２　　基材
　３、１０１　　凹部
　３Ａ　　凹部の底面
　３Ｂ　　凹部の側面
　４、１０２　　電子部品
　５、１６　　溝
　５Ａ　　溝の側面
　５Ｂ　　溝の底面
　６、１２、１０４、１０６　　電極
　７、１０３　　絶縁性樹脂
　８、１０５　　導電性樹脂
　９　　基材の頂面
　１０　　保護電極
　１１　　絶縁性樹脂の頂面
　１３　　導電性膜
　１４　　絶縁性樹脂の頂面
　１５　　導電性膜の内側面
　１７　　保護膜
　１８　　表面電極
　１９　　開口部
　Ｖ　　ビア 1, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100 circuit board 2 base material 3, 101 recess 3A recess bottom 3B recess side 4, 102 electronic component 5, 16 groove 5A groove Side 5B Bottom of groove 6, 12, 104, 106 Electrode 7, 103 Insulating resin 8, 105 Conductive resin 9 Top surface of substrate 10 Protective electrode 11 Top surface of insulating resin 13 Conductive film 14 Of insulating resin Top surface 15 Inner surface of conductive film 17 Protective film 18 Surface electrode 19 Opening V Via

Claims (8)

  1. 　基材と、
    　前記基材に形成された凹部と、
    　前記凹部の底面に配置された電子部品と、
    　前記凹部の内側面に形成された導電性膜と、
    　前記凹部に充填され、前記電子部品に接する絶縁性樹脂と、
    　前記絶縁性樹脂と前記電子部品を覆い、前記導電性膜と電気的に接続する導電性樹脂と、を備える回路基板。     A substrate,
    A recess formed in the substrate;
    An electronic component disposed on the bottom of the recess;
    A conductive film formed on the inner side surface of the recess;
    An insulating resin filled in the recess and in contact with the electronic component;
    A circuit board comprising: the insulating resin; and a conductive resin which covers the electronic component and is electrically connected to the conductive film.
  2. 　請求項１に記載の回路基板であって、
    　前記導電性膜は前記内側面において、前記導電性樹脂と接する回路基板。     The circuit board according to claim 1, wherein
    The circuit board wherein the conductive film contacts the conductive resin on the inner side surface.
  3. 　請求項２に記載の回路基板であって、
    　前記導電性膜と前記絶縁性樹脂との間に溝を有し、前記導電性樹脂が前記溝の内部に充填され、前記溝の内部において前記導電性樹脂が前記導電性膜と接する回路基板。     The circuit board according to claim 2, wherein
    A circuit board having a groove between the conductive film and the insulating resin, the conductive resin being filled in the groove, and the conductive resin being in contact with the conductive film in the groove.
  4. 　請求項３に記載の回路基板であって、
    　前記導電性膜と前記絶縁性樹脂とが接している回路基板。     The circuit board according to claim 3, wherein
    A circuit board in which the conductive film and the insulating resin are in contact with each other.
  5. 　請求項１に記載の回路基板であって、
    　前記凹部の頂面に、前記導電性膜と電気的に接続した電極を有し、
    　前記導電性樹脂は前記電極に接する回路基板。     The circuit board according to claim 1, wherein
    It has an electrode electrically connected to the conductive film on the top surface of the recess,
    The circuit board in which the conductive resin contacts the electrode.
  6. 　請求項５に記載の回路基板であって、
    　前記頂面には前記電極に覆われず前記基材が露出する露出部を有し、
    　前記導電性樹脂は、前記露出部において前記基材と接する回路基板。     The circuit board according to claim 5, wherein
    The top surface has an exposed portion that is not covered by the electrode and the substrate is exposed,
    The circuit board wherein the conductive resin contacts the base at the exposed portion.
  7. 　請求項１から６のいずれか１項に記載の回路基板を備える回路モジュール。 A circuit module comprising the circuit board according to any one of claims 1 to 6.
  8. 　請求項１から６のいずれか１項に記載の回路基板を備える電子機器。 An electronic device comprising the circuit board according to any one of claims 1 to 6.
PCT/JP2010/007072 2009-12-04 2010-12-03 Circuit board, circuit module, and electronic device WO2011067945A1 (en)

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JP2009276291 2009-12-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019174748A1 (en) * 2018-03-16 2019-09-19 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method

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JPH07326688A (en) * 1994-05-31 1995-12-12 Nec Corp Semiconductor device
JPH09148477A (en) * 1995-11-21 1997-06-06 Oki Electric Ind Co Ltd Semiconductor element package and its manufacture
JP2004015160A (en) * 2002-06-04 2004-01-15 Tdk Corp Module with antenna
JP2005317908A (en) * 2004-03-31 2005-11-10 Alps Electric Co Ltd Board with built-in element and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326688A (en) * 1994-05-31 1995-12-12 Nec Corp Semiconductor device
JPH09148477A (en) * 1995-11-21 1997-06-06 Oki Electric Ind Co Ltd Semiconductor element package and its manufacture
JP2004015160A (en) * 2002-06-04 2004-01-15 Tdk Corp Module with antenna
JP2005317908A (en) * 2004-03-31 2005-11-10 Alps Electric Co Ltd Board with built-in element and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019174748A1 (en) * 2018-03-16 2019-09-19 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
CN111972051A (en) * 2018-03-16 2020-11-20 华为技术有限公司 Assembly and method for electromagnetic interference shielding
US11224121B2 (en) 2018-03-16 2022-01-11 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method

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