WO2011064387A3 - Method and substance mixtures for producing metal or metal-oxide layers - Google Patents

Method and substance mixtures for producing metal or metal-oxide layers Download PDF

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Publication number
WO2011064387A3
WO2011064387A3 PCT/EP2010/068516 EP2010068516W WO2011064387A3 WO 2011064387 A3 WO2011064387 A3 WO 2011064387A3 EP 2010068516 W EP2010068516 W EP 2010068516W WO 2011064387 A3 WO2011064387 A3 WO 2011064387A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal
oxide layers
substance mixtures
layers
producing
Prior art date
Application number
PCT/EP2010/068516
Other languages
German (de)
French (fr)
Other versions
WO2011064387A2 (en
Inventor
Wolfgang Ensinger
Mario BÖHME
Original Assignee
Technische Universität Darmstadt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universität Darmstadt filed Critical Technische Universität Darmstadt
Priority to EP10795639A priority Critical patent/EP2507407A2/en
Publication of WO2011064387A2 publication Critical patent/WO2011064387A2/en
Publication of WO2011064387A3 publication Critical patent/WO2011064387A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/1648—Porous product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/049—Manufacturing of an active layer by chemical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Catalysts (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Chemically Coating (AREA)

Abstract

The invention relates to a method for the electroless deposition of metals or metal oxides, wherein particle formation is prevented and smooth layers are formed. With this, layer thicknesses of 1 nm to 500 nm are achieved at temperatures between 0 and 100ºC. A composition of a plurality of layers is possible. The layers can be shaped by means of templates or printing, for example ink jet printing technique and screen printing.
PCT/EP2010/068516 2009-11-30 2010-11-30 Method and substance mixtures for producing metal or metal-oxide layers WO2011064387A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10795639A EP2507407A2 (en) 2009-11-30 2010-11-30 Method and substance mixtures for producing metal or metal-oxide layers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009056072.6 2009-11-30
DE102009056072A DE102009056072A1 (en) 2009-11-30 2009-11-30 Process and mixtures for the production of metallic or metal oxide layers

Publications (2)

Publication Number Publication Date
WO2011064387A2 WO2011064387A2 (en) 2011-06-03
WO2011064387A3 true WO2011064387A3 (en) 2012-01-05

Family

ID=43927142

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/068516 WO2011064387A2 (en) 2009-11-30 2010-11-30 Method and substance mixtures for producing metal or metal-oxide layers

Country Status (3)

Country Link
EP (1) EP2507407A2 (en)
DE (1) DE102009056072A1 (en)
WO (1) WO2011064387A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2985440B1 (en) 2012-01-11 2016-02-05 Ink Jet Tech DEVICE AND METHOD FOR RECOVERING PARTICLES WITHOUT POLLUTY DISPERSION
DE102013104396A1 (en) * 2013-04-30 2014-10-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Electrochemical storage device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180602A (en) * 1978-03-31 1979-12-25 Bell Telephone Laboratories, Incorporated Electroless plating of polyvinylidene fluoride
US6406750B1 (en) * 1999-05-28 2002-06-18 Osaka Municipal Government Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
WO2008112650A2 (en) * 2007-03-15 2008-09-18 Yazaki Corporation Capacitor electrodes comprising carbon nanotubes filled with one or more non- carbon materials
US20090214942A1 (en) * 2008-02-22 2009-08-27 Alliance For Sustainable Energy, Llc. Oriented nanotube electrodes for lithium ion batteries and supercapacitors

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2643424C3 (en) * 1976-09-27 1979-06-21 Polygram Gmbh, 2000 Hamburg Process for electroless nickel plating of non-conductive materials
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards
DE10023456A1 (en) 1999-07-29 2001-02-01 Creavis Tech & Innovation Gmbh Mesotubes and nanotubes
EP2113078A4 (en) 2007-01-29 2013-04-17 Nanexa Ab Active sensor surface and a method for manufacture thereof
DE102007035693A1 (en) 2007-07-30 2009-02-05 Technische Universität Darmstadt A monolithic porous member of substantially parallel nanotubes, method of making and using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180602A (en) * 1978-03-31 1979-12-25 Bell Telephone Laboratories, Incorporated Electroless plating of polyvinylidene fluoride
US6406750B1 (en) * 1999-05-28 2002-06-18 Osaka Municipal Government Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
WO2008112650A2 (en) * 2007-03-15 2008-09-18 Yazaki Corporation Capacitor electrodes comprising carbon nanotubes filled with one or more non- carbon materials
US20090214942A1 (en) * 2008-02-22 2009-08-27 Alliance For Sustainable Energy, Llc. Oriented nanotube electrodes for lithium ion batteries and supercapacitors

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
BERCU B ET AL: "Copper tubes prepared by electroless deposition in ion track templates", NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, SECTION - B:BEAM INTERACTIONS WITH MATERIALS AND ATOMS, ELSEVIER, AMSTERDAM, NL, vol. 225, no. 4, 1 October 2004 (2004-10-01), pages 497 - 502, XP004568373, ISSN: 0168-583X, DOI: 10.1016/J.NIMB.2004.06.011 *
C. N. R. RAO ET AL: "Synthesis of Inorganic Nanotubes", ADVANCED MATERIALS, vol. 21, no. 42, 13 November 2009 (2009-11-13), pages 4208 - 4233, XP055007010, ISSN: 0935-9648, DOI: 10.1002/adma.200803720 *
LEE J S ET AL: "Amorphous lead oxide nanotubes filled partially with single-crystalline lead", MATERIALS SCIENCE AND ENGINEERING B, ELSEVIER SEQUOIA, LAUSANNE, CH, vol. 122, no. 2, 15 September 2005 (2005-09-15), pages 85 - 89, XP025304959, ISSN: 0921-5107, [retrieved on 20050915], DOI: 10.1016/J.MSEB.2005.04.020 *
LEELA MOHANA REDDY A ET AL: "Nanocrystalline Metal Oxides Dispersed Multiwalled Carbon Nanotubes as Supercapacitor Electrodes", JOURNAL OF PHYSICAL CHEMISTRY PART C: NANOMATERIALS AND INTERFACES, AMERICAN CHEMICAL SOCIETY, US, vol. 111, no. 21, 2 May 2007 (2007-05-02), pages 7727 - 7734, XP002566210, ISSN: 1932-7447, DOI: 10.1021/JP069006M *
LI Y B ET AL: "Ga-filled single-crystalline MgO nanotube: Wide-temperature range nanothermometer", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 83, no. 5, 4 August 2003 (2003-08-04), pages 999 - 1001, XP012035711, ISSN: 0003-6951, DOI: 10.1063/1.1597422 *
MARIO BOEHME ET AL: "Room temperature synthesis of samarium oxide nanotubes using cost-effective electroless deposition methodRoom temperature synthesis of samarium oxide nanotubes using cost-effective electroless deposition method", JOURNAL OF EXPERIMENTAL NANOSCIENCE, no. e-pub, 4 January 2011 (2011-01-04), pages 1 - 10, XP008142768, ISSN: 1745-8080, [retrieved on 20110104], DOI: 10.1080/17458080.2010.533295 *
ROHAN J F ET AL: "Coaxial metal and magnetic alloy nanotubes in polycarbonate templates by electroless deposition", ELECTROCHEMISTRY COMMUNICATIONS, ELSEVIER, AMSTERDAM, NL, vol. 10, no. 9, 1 September 2008 (2008-09-01), pages 1419 - 1422, XP024099007, ISSN: 1388-2481, [retrieved on 20080716], DOI: 10.1016/J.ELECOM.2008.07.019 *
Y. LI ET AL: "Single-Crystalline In2O3 Nanotubes Filled with In", ADVANCED MATERIALS, vol. 15, no. 78, 17 April 2003 (2003-04-17), pages 581 - 585, XP055007012, ISSN: 0935-9648, DOI: 10.1002/adma.200304539 *

Also Published As

Publication number Publication date
WO2011064387A2 (en) 2011-06-03
DE102009056072A1 (en) 2011-06-01
EP2507407A2 (en) 2012-10-10

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