WO2011051567A3 - Method for machining material by a laser device - Google Patents

Method for machining material by a laser device Download PDF

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Publication number
WO2011051567A3
WO2011051567A3 PCT/FI2010/050857 FI2010050857W WO2011051567A3 WO 2011051567 A3 WO2011051567 A3 WO 2011051567A3 FI 2010050857 W FI2010050857 W FI 2010050857W WO 2011051567 A3 WO2011051567 A3 WO 2011051567A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser device
laser beam
based material
natural fiber
fiber based
Prior art date
Application number
PCT/FI2010/050857
Other languages
French (fr)
Other versions
WO2011051567A2 (en
Inventor
Antti Salminen
Heidi Piili
Tuomas Purtonen
Original Assignee
Lappeenrannan Teknillinen Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lappeenrannan Teknillinen Yliopisto filed Critical Lappeenrannan Teknillinen Yliopisto
Priority to RU2012122720/02A priority Critical patent/RU2012122720A/en
Priority to EP10826178A priority patent/EP2493651A2/en
Publication of WO2011051567A2 publication Critical patent/WO2011051567A2/en
Publication of WO2011051567A3 publication Critical patent/WO2011051567A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/38—Fabrics, fibrous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

The invention relates to a method for machining material by a laser device. According to the invention the material that is used is a natural fiber based material which is machined by a laser device using optical fiber having the wavelength of the laser beam of between 200nm and 3000nm and having sufficient quality of the laser beam in order to reduce the size of the focal point and provide non-linear absorption behavior, and a threshold intensity of the laser beam produced by the laser device is determined in order to provide sufficient absorption, the size of the focal point to be used is adapted to be suitable for the machining method to be used, and the natural fiber based material is machined by directing the laser beam of the laser device thereto for the machining thereof at an intensity that exceeds the threshold intensity, and the natural fiber based material is machined in the area of non-linear absorption behavior wherein sufficient absorption of the laser beam is obtained in order to machine the natural fiber based material.
PCT/FI2010/050857 2009-10-28 2010-10-28 Method for machining material by a laser device WO2011051567A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
RU2012122720/02A RU2012122720A (en) 2009-10-28 2010-10-28 METHOD FOR PROCESSING MATERIAL USING A LASER DEVICE
EP10826178A EP2493651A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20096110A FI20096110A (en) 2009-10-28 2009-10-28 A method of working material with a laser device
FI20096110 2009-10-28

Publications (2)

Publication Number Publication Date
WO2011051567A2 WO2011051567A2 (en) 2011-05-05
WO2011051567A3 true WO2011051567A3 (en) 2011-07-21

Family

ID=41263524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2010/050857 WO2011051567A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device

Country Status (4)

Country Link
EP (1) EP2493651A2 (en)
FI (1) FI20096110A (en)
RU (1) RU2012122720A (en)
WO (1) WO2011051567A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2409808A1 (en) 2010-07-22 2012-01-25 Bystronic Laser AG Laser processing machine
EP2883647B1 (en) 2013-12-12 2019-05-29 Bystronic Laser AG Method for configuring a laser machining device
DE102014113323A1 (en) * 2014-09-16 2016-03-17 BMA Automation GmbH Method and apparatus for removing a plastic coating from a food loaf

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943700A (en) * 1985-12-06 1990-07-24 Austral Asian Lasers Pty. Ltd. Laser sawmill
EP1059139A1 (en) * 1999-06-11 2000-12-13 Brodart S.A. Laser microperforation of thermoplastic or cellulosic films by means of optical fibres
US20030110862A1 (en) * 2000-04-27 2003-06-19 Holger Lubatschowski Laser machining of materials
US20050158107A1 (en) * 2003-01-28 2005-07-21 Olivier Acher Peripheral which can be used to print and cut sheets of paper using a low-power laser source
US20080174104A1 (en) * 2007-01-19 2008-07-24 Appleton Papers Inc. Secure documents - methods and applications
US20090218326A1 (en) * 2006-02-03 2009-09-03 L'air Liquide Societe Anonyme Pour L'eploitation Des Procedes Georges Cladue Cutting method using a laser having at least one ytterbium-based fiber, in which at least the power of the laser source, the diameter of the focused beam and the beam quality factor are controlled

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943700A (en) * 1985-12-06 1990-07-24 Austral Asian Lasers Pty. Ltd. Laser sawmill
EP1059139A1 (en) * 1999-06-11 2000-12-13 Brodart S.A. Laser microperforation of thermoplastic or cellulosic films by means of optical fibres
US20030110862A1 (en) * 2000-04-27 2003-06-19 Holger Lubatschowski Laser machining of materials
US20050158107A1 (en) * 2003-01-28 2005-07-21 Olivier Acher Peripheral which can be used to print and cut sheets of paper using a low-power laser source
US20090218326A1 (en) * 2006-02-03 2009-09-03 L'air Liquide Societe Anonyme Pour L'eploitation Des Procedes Georges Cladue Cutting method using a laser having at least one ytterbium-based fiber, in which at least the power of the laser source, the diameter of the focused beam and the beam quality factor are controlled
US20080174104A1 (en) * 2007-01-19 2008-07-24 Appleton Papers Inc. Secure documents - methods and applications

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HERNANDEZ J. C. ET AL: "High-power Yb-doped Fibre Laser for Cutting Dry Pine Wood", PROCEEDINGS OF THE WORLD CONGRESS ON ENGINEERING WCE 2007, vol. 2, 2 July 2007 (2007-07-02) - 4 July 2007 (2007-07-04), XP002588715 *

Also Published As

Publication number Publication date
RU2012122720A (en) 2013-12-10
FI20096110A (en) 2011-04-29
FI20096110A0 (en) 2009-10-28
WO2011051567A2 (en) 2011-05-05
EP2493651A2 (en) 2012-09-05

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