FI20096110A0 - Process for processing materials by means of a laser apparatus - Google Patents

Process for processing materials by means of a laser apparatus

Info

Publication number
FI20096110A0
FI20096110A0 FI20096110A FI20096110A FI20096110A0 FI 20096110 A0 FI20096110 A0 FI 20096110A0 FI 20096110 A FI20096110 A FI 20096110A FI 20096110 A FI20096110 A FI 20096110A FI 20096110 A0 FI20096110 A0 FI 20096110A0
Authority
FI
Finland
Prior art keywords
laser apparatus
processing materials
materials
processing
laser
Prior art date
Application number
FI20096110A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20096110A (en
Inventor
Antti Salminen
Heidi Piili
Tuomas Purtonen
Original Assignee
Lappeenrannan Teknillinen Ylio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lappeenrannan Teknillinen Ylio filed Critical Lappeenrannan Teknillinen Ylio
Priority to FI20096110A priority Critical patent/FI20096110A/en
Publication of FI20096110A0 publication Critical patent/FI20096110A0/en
Priority to RU2012122720/02A priority patent/RU2012122720A/en
Priority to EP10826178A priority patent/EP2493651A2/en
Priority to PCT/FI2010/050857 priority patent/WO2011051567A2/en
Publication of FI20096110A publication Critical patent/FI20096110A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/38—Fabrics, fibrous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
FI20096110A 2009-10-28 2009-10-28 A method of working material with a laser device FI20096110A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20096110A FI20096110A (en) 2009-10-28 2009-10-28 A method of working material with a laser device
RU2012122720/02A RU2012122720A (en) 2009-10-28 2010-10-28 METHOD FOR PROCESSING MATERIAL USING A LASER DEVICE
EP10826178A EP2493651A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device
PCT/FI2010/050857 WO2011051567A2 (en) 2009-10-28 2010-10-28 Method for machining material by a laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20096110A FI20096110A (en) 2009-10-28 2009-10-28 A method of working material with a laser device

Publications (2)

Publication Number Publication Date
FI20096110A0 true FI20096110A0 (en) 2009-10-28
FI20096110A FI20096110A (en) 2011-04-29

Family

ID=41263524

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20096110A FI20096110A (en) 2009-10-28 2009-10-28 A method of working material with a laser device

Country Status (4)

Country Link
EP (1) EP2493651A2 (en)
FI (1) FI20096110A (en)
RU (1) RU2012122720A (en)
WO (1) WO2011051567A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2409808A1 (en) 2010-07-22 2012-01-25 Bystronic Laser AG Laser processing machine
EP2883647B1 (en) 2013-12-12 2019-05-29 Bystronic Laser AG Method for configuring a laser machining device
DE102014113323A1 (en) * 2014-09-16 2016-03-17 BMA Automation GmbH Method and apparatus for removing a plastic coating from a food loaf

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6563986A (en) * 1985-12-06 1987-06-11 Hughes Technology Pty. Ltd. Laser sawmill
FR2794675B1 (en) * 1999-06-11 2001-08-31 Brodart LASER MICROPERFORATION OF THERMOPLASTIC OR CELLULOSIC FILMS BY OPTICAL FIBERS
DE10020559A1 (en) * 2000-04-27 2001-10-31 Hannover Laser Zentrum Laser cutting device e.g. for laser surgery, uses ultra short laser pulses with duration of less than 300 picoseconds
FR2850308B1 (en) * 2003-01-28 2005-03-04 Commissariat Energie Atomique PERIPHERAL DEVICE FOR PRINTING AND CUTTING PAPER SHEETS USING LOW POWER LASER SOURCE
FR2897007B1 (en) * 2006-02-03 2008-04-11 Air Liquide METHOD OF CUTTING WITH A FIBER LASER WITH BEAM PARAMETER CONTROL
US20080174104A1 (en) * 2007-01-19 2008-07-24 Appleton Papers Inc. Secure documents - methods and applications

Also Published As

Publication number Publication date
EP2493651A2 (en) 2012-09-05
RU2012122720A (en) 2013-12-10
FI20096110A (en) 2011-04-29
WO2011051567A3 (en) 2011-07-21
WO2011051567A2 (en) 2011-05-05

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Legal Events

Date Code Title Description
FD Application lapsed