WO2011048667A1

WO2011048667A1 - Laser light source unit, image displaying device employing laser light source unit, and method for manufacturing laser light source unit

Info

Publication number: WO2011048667A1
Application number: PCT/JP2009/068067
Authority: WO
Inventors: 修己靭矢; 友二安藤; 暁棠葛
Original assignee: パイオニア株式会社
Priority date: 2009-10-20
Filing date: 2009-10-20
Publication date: 2011-04-28
Also published as: JP4611456B1; JPWO2011048667A1

Abstract

Provided is a laser light source unit which can be produced at a higher production yield and has improved laser light source heat-dissipation in a smaller unit size, and without incurring large equipment investment. Also provided are an image displaying device employing a laser light source unit and a method for manufacturing a laser light source unit. Of the three color laser light sources of the laser light source unit (9) that the image displaying device (1) is provided with, the blue laser (LD3) is disposed in a case (91) in a state wherein the blue laser (LD3) is installed in a CAN package, and the red laser (LD1) and the green laser (LD2) are disposed in a chip state in the case (91).

Description

LASER LIGHT SOURCE UNIT, IMAGE DISPLAY DEVICE EQUIPPED WITH THE LASER LIGHT SOURCE UNIT, AND METHOD FOR PRODUCING A LASER LIGHT SOURCE

The present invention relates to a laser light source unit used for, for example, a projector or a head-up display, an image display device including the laser light source unit, and a method for manufacturing the laser light source unit.

For example, in a projector or a head-up display as an image display device, a laser light source unit using two or more types of laser light sources such as red, blue, and green as a light source is used (see, for example, Patent Document 1).

This type of laser light source unit needs to be adjusted so that the position of the emitted light and the light diameter of each laser light source are the same at the target position. Here, a method for adjusting a laser light source unit using three laser light sources each having a semiconductor laser light source attached to a CAN package will be described with reference to FIG.

The laser light source unit 101 shown in FIG. 1 includes laser light sources LD11, LD12, and LD13,

collimator lenses

102, 103, and 104,

LD holders

105, 106, and 107,

mirrors

108 and 109, and a case 110. I have.

The laser light source LD11 is provided with a semiconductor laser light source G that generates green laser light in a CAN package. The laser light source LD12 has a semiconductor laser light source B that generates blue laser light attached to a CAN package. The laser light source LD13 is provided with a semiconductor laser light source R that generates red laser light in a CAN package.

The collimator lens 102 converts the laser light emitted from the laser light source LD11 into parallel light. The collimator lens 103 makes the laser light emitted from the laser light source LD12 into parallel light. The collimator lens 104 converts the laser light emitted from the laser light source LD13 into parallel light. The parallel light is cylindrical light having a diameter that is the size of the collimator lens 102, and is substantially parallel to the optical axis that connects the focal point and the center of the collimator lens.

LD holder 105 is attached to case 110 with screws. The laser light source LD11 is fixed to the LD holder 105 via an adhesive or the like. Here, the fixing direction of the laser light source LD11 can be adjusted in three axial directions (vertical, horizontal, and longitudinal directions in FIG. 1) by the screw. The LD holder 106 is attached to the case 110 with screws. The laser light source LD12 is fixed to the LD holder 106 via an adhesive or the like. Here, the fixing direction of the laser light source LD12 can be adjusted in three axial directions (vertical, horizontal, and longitudinal directions in FIG. 1) by the screw. The LD holder 107 is attached to the case 110 with screws. A laser light source LD13 is fixed to the LD holder 107 via an adhesive or the like. Here, the fixing direction of the laser light source LD13 can be adjusted in three axial directions (vertical, horizontal, and longitudinal directions in FIG. 1) by the screw.

The mirror 108 transmits the laser light emitted from the laser light source LD11 and reflects the laser light emitted from the laser light source LD12 toward the half mirror 111 described later. Further, the mirror 108 can adjust the position of the laser light emitted from the laser light source LD12 with a screw. The mirror 109 transmits the laser light emitted from the laser light source LD11 and the laser light emitted from the laser light source LD12 reflected by the mirror 108, and transmits the laser light emitted from the laser light source LD13 toward the half mirror 111 described later. reflect. Further, the mirror 109 can adjust the position of the laser light emitted from the laser light source LD13 with a screw.

The half mirror 111 is installed between the laser light source unit 101 and a target TG1, which will be described later, and transmits laser light emitted from the laser light source unit 101 to the target TG1 and partially reflects it to the target TG2.

The targets TG1 and TG2 are targets (targets) for confirming the position and diameter of the emitted light of the laser light source, the target TG1 is installed at a position coaxial with the emitted light of the laser light source unit 101, and the target TG2 is a half mirror. The optical path 111 is installed at a position bent vertically. The target TG2 is installed at a position closer to the target TG1 (position where the optical path becomes shorter).

Then, the laser light source unit 101 shown in FIG. 1 first performs the three-axis adjustment of the target LD11 so that the laser light source LD11 is turned on and the diameter and position of the emitted light enter the target at the target TG1. Next, the laser light source LD12 is turned on, and the three-axis adjustment of the laser light source LD12 is performed so that the laser light source LD12 coincides with the emission position of the laser light source LD11 on the target TG1 and the diameter enters the target. Thereafter, the target TG2 is confirmed, and if there is a deviation from the emission light position of the laser light source LD11, the position of the laser light source LD12 is readjusted and the emission light position of the laser light source LD11 on the targets TG1 and TG2 and the laser light source LD12. The laser light source LD12 is adjusted so that the amount of deviation from the emitted light position is approximately the same direction and the same distance.

Then, offset adjustment is performed without changing the angle of the mirror 108 (the adjustment screws provided at both ends of the mirror 108 are moved by the same amount), and the emitted light of the laser light source LD11 and the emitted light of the laser light source LD12 on the target TG1. Then, the mirror 108 is adjusted so that both the emitted light of the laser light source LD11 and the emitted light of the laser light source LD12 on the target TG2 coincide with each other. If they do not match or the diameter of the emitted light of the laser light source LD12 deviates from a predetermined value, the adjustment of the laser light source LD12 is repeated, and the emitted light of the laser light source LD11 and the emitted light of the laser light source LD12 are the same at the targets TG1 and TG2. If the light diameter falls within the predetermined range, the laser light source LD13 and the mirror 109 are finally adjusted in the same manner as the laser light source LD12 and the mirror 108, and the adjustment of the laser light source unit 101 is completed.

In addition to the method shown in FIG. 1, a method of fixing each laser light source after adjusting the position in a chip state as in the semiconductor module described in Patent Document 2 has been proposed.

JP 2009-122455 A Japanese Patent No. 3914670

Since the laser light source unit 101 described above uses a laser light source of a CAN package and further includes an adjustment mechanism using screws, there is a problem that downsizing is difficult and complicated.

The semiconductor module described in Patent Document 2 is advantageous for miniaturization because the laser light source is mounted in a chip state, but the semiconductor laser element that is a laser light source is usually in an initial state such as burn-in in a chip state. It is difficult to perform a test for selecting defective products, and it is necessary to perform a burn-in test after assembling as a semiconductor module (laser light source unit). Therefore, if at least one defective semiconductor laser element is incorporated, even if the remaining semiconductor laser elements are non-defective, the semiconductor module itself must be defective, and the yield of the semiconductor module deteriorates. There was a problem.

Further, the semiconductor module described in Patent Document 2 is provided with a metal plate such as a copper plate for heat dissipation of the semiconductor laser element. It becomes difficult to secure a sufficient area.

Furthermore, the semiconductor module described in Patent Document 2 requires equipment such as an adjuster to fix the three semiconductor laser elements, which requires a large capital investment.

Accordingly, the present invention provides, for example, a laser light source unit capable of improving yield and improving heat dissipation and miniaturization of a laser light source, and can be manufactured without much capital investment, and the laser light source unit. It is an object of the present invention to provide an image display device including the above and a method for manufacturing a laser light source unit.

In order to solve the above problems, the laser light source unit according to claim 1 includes a case, a plurality of laser light sources having different colors, and a combining element that superimposes light emitted from the laser light sources, The laser light source unit is disposed in the case so that the plurality of laser light sources have a predetermined diameter at a predetermined target position, and one of the plurality of laser light sources includes: It is provided in the case in a state of being attached to a CAN package or in a state of being attached to a frame package, and the remaining laser light source is provided in the case in a chip state.

According to a sixth aspect of the present invention, there is provided a laser light source unit manufacturing method comprising: a laser light source unit attached to one CAN package; and a laser light source unit having at least one chip state. A manufacturing method comprising: a first step of attaching a laser light source attached to the CAN package or attached to the frame package to the case; and a state attached to the CAN package or attached to the frame package. A second step of adjusting the position of the collimator lens and fixing the collimator lens to the case on the basis of the position and the light diameter of the emitted light of the laser light source in the closed state; Adjust the mounting position so that the diameter matches the laser light source mounted on the CAN package. A third step of fixing the serial case, is characterized by the sequential execution.

It is a block diagram of the conventional laser light source unit. It is a block diagram of the image display apparatus concerning one Example of this invention. It is the block diagram which showed the laser light source unit of the image display apparatus shown by FIG. It is explanatory drawing which shows the structure of the copper sheet metal of the laser light source unit shown by FIG. It is a flowchart which shows the manufacture procedure of the laser light source unit shown by FIG. FIG. 4 is a simplified diagram showing another configuration of the laser light source unit shown in FIG. 3. FIG. 4 is a simplified diagram showing another configuration of the laser light source unit shown in FIG. 3. FIG. 4 is a simplified diagram showing another configuration of the laser light source unit shown in FIG. 3.

Hereinafter, a laser light source unit according to an embodiment of the present invention will be described. The laser light source unit according to one embodiment of the present invention is provided in the case with one of the plurality of laser light sources attached to the CAN package or attached to the frame package, and the rest. Since the laser light source is provided in the case in a chip state, one becomes a laser light source for a CAN package or a frame package that has passed the burn-in test, and the yield can be improved as compared with a case where all are in a chip state. it can. In addition, equipment such as adjusters can be reduced, and capital investment can be reduced.

The laser light source attached to the CAN package or the laser light source attached to the frame package is a laser light emitted from a laser light source in a chip state where the laser light emitted from the laser light source of the case passes through the synthesis element. May be provided at a position shorter than the distance passing through the synthesis element. By doing so, the influence of the CAN package or the frame package can be reduced, and the laser light source unit can be reliably reduced in size as compared with the case where all are attached to the CAN package.

Further, a collimator lens that converts laser light that has passed through the combining element into parallel light may be provided at the subsequent stage of the combining element. By doing so, the number of parts can be reduced and the laser light source unit can be miniaturized as compared with the case where a collimator lens is provided between each laser light source and the combining element.

In the case, a laser light source in a chip state may be fixed to the case, and a heat radiating plate for radiating heat generated by the laser light source in the chip state may be provided corresponding to each laser light source. By doing so, the metal plate for heat radiation of the laser light source attached to the CAN package or attached to the frame package becomes unnecessary, and per metal plate compared to the case of all chips. The area can be widened to improve heat dissipation.

Further, the image display device may include the laser light source unit described above and an optical scanning unit that causes the image display unit to scan the light emitted from the user light source unit. By doing so, an image display device that is small in size and excellent in heat dissipation and high in yield can be configured.

Also, the laser light source attached to the CAN package or attached to the frame package is attached to the case, and the position of the collimator lens is adjusted and fixed based on the position and the light diameter of the emitted light of the laser light source. The laser light source unit is manufactured by sequentially executing the steps of fixing and fixing the laser light source in the chip state so that the position and the light diameter of the emitted light coincide with those of the laser light source attached to the CAN package. May be. This eliminates the need for adjustment when the laser light source is attached to the CAN package, and the remaining laser light sources in the chip state are adjusted based on the laser light source attached to the CAN package. It can be carried out. Furthermore, it is possible to reduce the number of facilities for adjusting and fixing the laser light source in the chip state and to simplify the manufacturing process as compared with a case where the laser light source is in the chip state.

An image display apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 2, the image display device 1 includes an image signal input unit 2, a video ASIC 3, a frame memory 4, a ROM 5, a RAM 6, a laser driver ASIC 7, a MEMS control unit 8, and a laser light source unit 9. And a MEMS mirror 10.

The image signal input unit 2 receives an image signal input from the outside and outputs it to the video ASIC 3.

The video ASIC 3 is a block that controls the laser driver ASIC 7 and the MEMS control unit 8 based on the image signal input from the image signal input unit 2 and the scanning position information input from the MEMS mirror 10, and is an ASIC (Application Specific Integrated Circuit). ). The video ASIC 3 includes a synchronization / image separation unit 31, a bit data conversion unit 32, a light emission pattern conversion unit 33, and a timing controller 34.

The synchronization / image separation unit 31 separates the image data displayed on the screen 11 serving as the image display unit and the synchronization signal from the image signal input from the image signal input unit 2 and writes the image data in the frame memory 4.

The bit data conversion unit 32 reads the image data written in the frame memory 4 and converts it into bit data.

The light emission pattern conversion unit 33 converts the bit data converted by the bit data conversion unit 32 into a signal representing the light emission pattern of each laser.

The timing controller 34 controls the operation timing of the synchronization / image separation unit 31 and the bit data conversion unit 32. The timing controller 34 also controls the operation timing of the MEMS control unit 8 described later.

In the frame memory 4, the image data separated by the synchronization / image separation unit 31 is written. The ROM 5 stores a control program and data for operating the video ASIC 3. The RAM 6 sequentially reads and writes various data as a work memory when the video AISC 3 operates.

The laser driver ASIC 7 is a block that generates a signal for driving a laser diode provided in a laser light source unit 9 to be described later, and is configured as an ASIC (Application Specific Specific Integrated Circuit). The laser driver ASIC 7 includes a red laser driving circuit 71, a green laser driving circuit 72, and a blue laser driving circuit 73.

The red laser driving circuit 71 drives the red laser LD1 based on the signal output from the light emission pattern conversion unit 33. The green laser driving circuit 72 drives the green laser LD2 based on the signal output from the light emission pattern conversion unit 33. The blue laser drive circuit 73 drives the blue laser LD3 based on the signal output from the light emission pattern conversion unit 33.

The MEMS control unit 8 controls the MEMS mirror 10 based on a signal output from the timing controller 34. The MEMS control unit 8 includes a servo circuit 81 and a driver circuit 82.

The servo circuit 81 controls the operation of the MEMS mirror 10 based on a signal from the timing controller 34.

The driver circuit 82 amplifies the control signal of the MEMS mirror 10 output from the servo circuit 81 to a predetermined level and outputs the amplified signal.

As shown in FIG. 3, the laser light source unit 9 includes a case 91, a wavelength selective element 92, a collimator lens 93, a red laser LD1, a green laser LD2, and a blue laser LD3.

The case 91 is formed in a substantially box shape with resin or the like, and as shown in FIG. 4, a copper sheet metal or the like is included so as to include the mounting positions of the respective lasers for heat radiation of the red laser LD1 and the green laser LD2 described later. The heat sinks 95 and 96 comprised by are inserted. Further, a part of the

heat radiating plates

95 and 96 is exposed on the outer surface of the case 91.

In addition, the case 91 is provided with a hole penetrating into the case 91 and a concave section in the CAN mounting portion 91a and a surface orthogonal to the CAN mounting portion 91a in order to mount a blue laser LD3 described later. In addition, a hole penetrating into the case 91 is provided, and a collimator mounting portion 91b having a concave cross section is formed.

The wavelength selective element 92 as a combining element is composed of, for example, a trichroic prism, and transmits the laser light emitted from the red laser LD1 toward the collimator lens 93 and reflects the laser light emitted from the green laser LD2. The surface 92a is reflected toward the collimator lens 93, and the laser light emitted from the blue laser LD3 is reflected at the reflection surface 92b toward the collimator lens 93. By doing in this way, the emitted light from each laser is superimposed. The wavelength selective element 92 is provided in the vicinity of the collimator mounting portion 91 b in the case 91.

The collimator lens 93 emits the laser beam incident from the wavelength selective element 92 to the MEMS mirror 10 as parallel light. The collimator lens 93 is fixed to the collimator mounting portion 91b of the case 91 with an UV-based adhesive 94 or the like after adjustment described later. That is, the collimator lens 93 is provided after the synthesis element.

The red laser LD1 as the laser light source in the chip state emits red laser light. The red laser LD1 is fixed at a position on the heat radiating plate 95 that is coaxial with the wavelength selective element 92 and the collimator lens 93 in the case 91 while the semiconductor laser light source is in a chip state or the chip is mounted on a submount or the like. ing.

The green laser LD2 as a laser light source in the chip state emits green laser light. The green laser LD2 has a semiconductor laser light source in a chip state, or the chip is mounted on a submount and the laser beam emitted from the case 91 can be reflected toward the collimator lens 93 by the reflecting surface 92a. Fixed in position. The positions of the red laser LD1 and the green laser LD2 may be switched. The chip state in the claims includes not only the die itself from which the semiconductor laser light source is separated from the wafer but also the state in which the die is placed on the submount as described above.

The blue laser LD3 as a laser light source attached to the CAN package or attached to the frame package emits blue laser light. In this embodiment, the blue laser LD 3 has a semiconductor laser light source chip B for generating blue laser light mounted in a CAN package, and is fixed to the CAN mounting portion 91 a of the case 91. The blue laser LD3 mounting position (CAN mounting portion 91a) is provided at a position where the distance through which the laser light emitted from the blue laser LD3 passes through the wavelength selective element 92 is the shortest. Needless to say, the laser light source attached to the CAN package or attached to the frame package is not limited to the blue laser light source.

The red laser LD1, the green laser LD2, and the blue laser LD3 need to have substantially the same optical distance from the laser beam emission position to the collimator lens 93 although there is a slight difference depending on the wavelength. In order to reduce the size of the laser light source unit 9, it is necessary to shorten this distance. However, since the blue laser LD3 is attached to the CAN package, the distance L from the semiconductor laser light source B to the outer edge of the CAN package is small. For this reason, it is not easy to bring the laser beam emission position close to the wavelength selective element 92 as in the red laser LD1 and the green laser LD2. Therefore, the distance that the emitted light of the blue laser LD3 passes through the wavelength selective element 92 is made shorter than the distance that the emitted light of the red laser LD1 and the green laser LD2 passes through the wavelength selective element 92, thereby emitting the laser light. The distance from the position to the collimator lens 93 is shortened to reduce the size of the laser light source unit 9. Of course, the shorter the distance that the emitted light of the blue laser LD3 passes through the wavelength selective element 92, the smaller the laser light source unit 9 contributes to the miniaturization of the laser light source unit 9, so that the configuration (collimator lens 93 is minimized) as shown in FIG. If the reflecting surface 92b is provided at the end portion on the side), the influence of the CAN package can be minimized.

The MEMS mirror 10 as a scanning unit reflects the laser light emitted from the laser light source unit 9 toward the screen 11. Further, in order to display an image input to the image signal input unit 2, it is movable so as to scan the screen 11 under the control of the MEMS control unit 8, and scanning position information at that time (for example, information such as a mirror angle) ) To the video ASIC 3.

Next, a procedure for manufacturing the laser light source unit 9 having the above-described configuration will be described with reference to the flowchart of FIG.

First, a CAN laser (blue laser LD3) is attached to the case 91 to which the wavelength selective element 92 is previously attached. At this time, it is only fixed to the CAN mounting portion 91a of the case 91, and adjustment is not performed (step S1). That is, step S1 corresponds to the first step in the claims.

Next, the position of the collimator lens 93 at the collimator mounting portion 91b is adjusted, and the position of the emitted light of the blue laser LD3 matches the target position on the target provided outside the laser light source unit 9, or the light on the target. It is determined whether the diameter is a predetermined size. When the position of the emitted light matches the target position and the light diameter is a predetermined size, the collimator lens 93 is fixed at that position, and so on. If not, the adjustment of the position of the collimator lens 93 is repeated until the position of the emitted light matches the target position and the light diameter reaches a predetermined size (steps S2 to S4). That is, steps S2 to S4 correspond to the second step in the claims.

Next, the fixing position of the first chip (for example, the red laser LD1 but the green laser LD2) may be adjusted. In this adjustment method, for example, the emitted light of the red laser LD1 coincides with the position and the light diameter of the emitted light of the blue laser LD3 on the target while holding the red laser LD1 with a chuck or the like and dropping the stylus. . Then, when the emitted light of the red laser LD1 reaches the position where the position and the light diameter of the emitted light of the blue laser LD3 coincide with each other on the target, the red laser LD1 is fixed with solder or the like (steps S5 to S7).

Next, the fixing position of the second chip (the semiconductor laser light source chip of the color not fixed in the above step) is adjusted. This adjustment method is also the same as that of the first chip. For example, while the green laser LD2 is gripped with a chuck or the like and the stylus is dropped and turned on, the emitted light of the green laser LD2 is reflected on the blue laser LD3 and red laser LD1 on the target. Match the position and light diameter. Then, when the emitted light of the green laser LD2 reaches the position where the positions and the light diameters of the emitted light of the blue laser LD3 and the red laser LD1 coincide with each other on the target, the green laser LD2 is fixed with solder or the like (steps S8 to S10). ). That is, steps S5 to S10 correspond to the third step of the claims.

According to the present embodiment, in the laser light source unit 9 provided in the image display device 1, among the three color laser light sources, the blue laser LD 3 is provided in the case 91 with being attached to the CAN package. Since the red laser LD1 and the green laser LD2 are provided in the case 91 in a chip state, the blue laser LD3 is composed of a CAN package product that has passed the burn-in test. Can be improved. Further, it is sufficient to provide two chips of

copper sheet metals

95 and 96 for heat dissipation, and the area per one copper sheet metal can be widened as compared with the case of three chips. In addition, equipment such as adjusters can be reduced, and capital investment can be reduced.

Also, the blue laser LD3 attached to the CAN package is provided at the position where the light emitted from the blue laser LD3 of the case 91 passes through the wavelength selective element 92 is the shortest. The laser light source unit 9 can be reliably reduced in size as compared with the case where the laser light source unit 9 is attached to.

Further, since the collimator lens 93 is provided after the wavelength selective element 92, the laser light source unit 9 can be made smaller than the collimator lens 93 provided between each laser light source and the wavelength selective element 92. it can.

In addition, by manufacturing according to the procedure of the flowchart of FIG. 5, adjustment when the blue laser LD 3 is attached becomes unnecessary. Further, the adjustment of the optical components can be performed only by the collimator lens 93. The red laser LD1 and the green laser LD2 can be adjusted with the blue laser LD3 as a reference. Furthermore, the number of facilities for adjusting and fixing the laser light source chip can be reduced as compared with the case of using a laser light source in a chip state, and the manufacturing process can be simplified.

In the embodiment, the blue laser light source is provided in the case 91 in a state of being attached to the CAN package. However, the case 91 is not limited to the CAN package and is attached to the case 91 in a state of being attached to a resin-molded frame package. It may be provided.

Further, the arrangement of the red laser LD1, the green laser LD2, and the blue laser LD3 in the laser light source unit 9 is not limited to that shown in the above-described embodiment, and may be configured as shown in FIGS. 6 to 8, for example. 6 to 8 show only the red laser LD1, the green laser LD2, the blue laser LD3, the wavelength selective element 92, and the collimator lens 93, and simplify the drawings. For example, in the case of the configuration of FIG. 6, since the green laser LD2 and the blue laser LD3 are arranged at point-symmetrical positions with the wavelength selective element 92 as the center, the projected area can be minimized.

According to the embodiment described above, the following laser light source unit 9 and the method for manufacturing the laser light source unit 9 are obtained.

(Supplementary Note 1) A case 91, a red laser LD1, a green laser LD2, and a blue laser LD3, and a wavelength selective element 92 that superimposes light emitted from the red laser LD1, the green laser LD2, and the blue laser LD3, A laser light source unit 9 disposed in the case 91 so that the red laser LD1, the green laser LD2, and the blue laser LD3 have a predetermined light diameter at a predetermined target position;
Of the red laser LD1, the green laser LD2, and the blue laser LD3, the blue laser LD3 is mounted on the CAN package and is provided in the case 91, and the red laser LD1 and the green laser LD2 are in the chip state in the case 91. A laser light source unit 9 is provided.

According to the laser light source unit 9, one becomes a laser light source of a CAN package that has passed the burn-in test, and the yield can be improved as compared with a case where all are in a chip state. In addition, equipment such as adjusters can be reduced, and capital investment can be reduced.

(Additional remark 2) It is a manufacturing method of the laser light source unit 9 which attaches blue laser LD3, red laser LD1, green laser LD2 to case 91,
Step S1 for attaching the blue laser LD3 to the case 91;
Steps S2, S3, and S4 for adjusting the position of the collimator lens 93 and fixing the collimator lens 93 to the case 91 based on the position and the light diameter of the emitted light of the blue laser LD3;
Steps S5, S6, S7, S8, S9, and S10 for fixing the red laser LD1 and the green laser LD2 to the case 91 by adjusting the mounting position so that the position and the light diameter of the emitted light coincide with those of the blue laser LD3;
Are sequentially executed. A method of manufacturing a laser light source unit.

According to this laser light source unit manufacturing method, adjustment when the blue laser LD3 is attached is not necessary, and the remaining red laser LD1 and green laser LD2 can be adjusted with the blue laser LD3 as a reference. Furthermore, the number of facilities for adjusting and fixing the laser light source chip can be reduced as compared with the case of using a laser light source in a chip state, and the manufacturing process can be simplified.

It should be noted that the above-described embodiments are merely representative forms of the present invention, and the present invention is not limited to the embodiments. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Image display apparatus 9 Laser light source unit 10 MEMS mirror (scanning means)
11 Screen (image display part)
91 Case 92 Wavelength selective element (synthetic element)
93 Collimator lens 95 Copper sheet metal (heat sink)
96 Copper sheet metal (heat sink)
LD1 Red laser (chip laser light source)
LD2 Green laser (laser light source in the chip state)
LD3 Blue laser (laser light source attached to the CAN package)
S1 CAN laser mounting (first step)
S2 Collimator lens adjustment (second step)
S3 Is the position / light diameter set in advance (second step)?
S4 Collimator lens fixation (second process)
S5 First chip fixing position adjustment (third step)
S6 Is the same position and light diameter as the output light of the CAN laser (third step)
S7 First chip fixing (third process)
S8 Second chip fixing position adjustment (third step)
Is it the same position and light diameter as the light emitted from the S9 CAN laser (third step)?
S10 Second chip fixing (third process)

Claims

A case, a plurality of laser light sources each having a different color, and a combining element that superimposes the light emitted from the laser light sources, wherein the plurality of laser light sources have a light diameter of a predetermined size at a predetermined target position A laser light source unit arranged in the case so that
Among the plurality of laser light sources, one laser light source is provided in the case in a state of being attached to a CAN package or in a state of being attached to a frame package, and the remaining laser light sources are in a chip state in the case. A laser light source unit provided.
The laser light source attached to the CAN package or attached to the frame package has a distance that the laser light emitted from the laser light source of the case passes through the combining element is emitted from the laser light source in the chip state. 2. The laser light source unit according to claim 1, wherein the laser light unit is provided at a position where the laser light is shorter than a distance passing through the combining element.
3. The laser light source unit according to claim 1, wherein a collimator lens that converts laser light that has passed through the combining element into parallel light is provided at a subsequent stage of the combining element.
The laser light source in a chip state is fixed to the case, and a heat radiating plate for radiating the heat generated by the laser light source is provided. The laser light source unit described in 1.
5. An image comprising: the laser light source unit according to claim 1; and an optical scanning unit that causes the image display unit to scan the laser light emitted from the user light source unit. Display device.
A method of manufacturing a laser light source unit in which a laser light source in a state attached to one CAN package or a state attached to a frame package and one or more laser light sources in a chip state are provided in a case,
A first step of attaching to the case a laser light source attached to the CAN package or attached to the frame package;
A second step of adjusting the position of the collimator lens and fixing the collimator lens to the case based on the position and the light diameter of the emitted light of the laser light source attached to the CAN package or attached to the frame package; ,
A third step of fixing the chip-shaped laser light source to the case by adjusting the mounting position so that the position and the light diameter of the emitted light coincide with those of the laser light source mounted on the CAN package;
Are sequentially executed. A method of manufacturing a laser light source unit.