WO2011042597A1 - A micromechanical resonator - Google Patents

A micromechanical resonator Download PDF

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Publication number
WO2011042597A1
WO2011042597A1 PCT/FI2010/050744 FI2010050744W WO2011042597A1 WO 2011042597 A1 WO2011042597 A1 WO 2011042597A1 FI 2010050744 W FI2010050744 W FI 2010050744W WO 2011042597 A1 WO2011042597 A1 WO 2011042597A1
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WO
WIPO (PCT)
Prior art keywords
resonator
accordance
previous
combination
parts
Prior art date
Application number
PCT/FI2010/050744
Other languages
French (fr)
Inventor
Aarne Oja
Tuomas Pensala
Johanna Meltaus
Original Assignee
Valtion Teknillinen Tutkimuskeskus
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Publication date
Application filed by Valtion Teknillinen Tutkimuskeskus filed Critical Valtion Teknillinen Tutkimuskeskus
Priority to JP2012530301A priority Critical patent/JP5704614B2/en
Priority to EP10821619.3A priority patent/EP2484008B1/en
Priority to US13/497,805 priority patent/US20120229226A1/en
Priority to CN201080043268.3A priority patent/CN102577118B/en
Publication of WO2011042597A1 publication Critical patent/WO2011042597A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02259—Driving or detection means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0081—Thermal properties
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02338—Suspension means
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2436—Disk resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2447—Beam resonators
    • H03H9/2452—Free-free beam resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2447—Beam resonators
    • H03H9/2463—Clamped-clamped beam resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/027—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the microelectro-mechanical [MEMS] type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0407—Temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
    • H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H2009/241—Bulk-mode MEMS resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H2009/2442—Square resonators

Definitions

  • the invention relates to a micromechanical resonator in according to the preamble of claim 1.
  • Thermal drift remains as the main obstacle in the way of Silicon MEMS resonators entering the market of quartz crystal oscillators. Compensation of the drift can be done by replacing part of the resonating volume with material showing opposite sign of thermal drift of resonance frequency than Silicon, such as amorphous S1O 2 . Resonator performance is then compromised as compared to purely single crystal resonator.
  • T he goal of the invention is achieved by virtue of locating the thermally compensating second material concentrated in specific places of the resonator.
  • a passive compensation of the thermal drift of resonance frequency is used with an optimised way by using the compensating material concentrated in the stress maximum(s) of the resonator.
  • the commercial significance is vast by providing a method to fabricate MEMS resonators that can potentially compete with the traditional quartz resonator technology.
  • This invention states how to minimize the amount of compensating material by placing it where it is most effective - that is - in the stress maximum (displacement node).
  • Another preferred embodiment of the invention is based on the use of S1O 2 or TeC> 2 in the middle of the vibrating structure.
  • a further preferred embodiment of the invention is based on dimensioning the parts of the second material of the resonator laterally larger than 10 ⁇ .
  • micromechanical resonator according to the invention is characterized by what is stated in the characterizing part of claim 1.
  • the invention provides significant benefits.
  • Some of the structure embodiments described in this application have the important advantage that fabrication tolerances of both the resonant frequency and of thermal coefficient of the resonance frequency are reduced. Fabrication tolerances affect device testing and tuning needs and affect significantly the cost of resonators. In a resonator with a fully oxidized spring area, there is only one interface, the circumference of the laterally relatively large oxide area in the middle of the resonator, whose exact location affects fabrication tolerances.
  • FIG. 1 shows a top view of a resonator applicable with the invention using a piezofilm as a part of the component.
  • FIG. 2a shows as a side view the resonator of figure 1.
  • FIG. 2b shows as a top view a photograph of an actual component of the resonator of figure 1.
  • FIG. 3 shows a top view of another resonator applicable with the invention using a piezofilm as a part of the component.
  • FIG. 4 shows as a side view the resonator of figure 3.
  • FIG. 6 shows as a schematic top view an electrostatically actuated plate resonator applicable with the invention.
  • FIG. 7a shows as a schematic top view a length extensional (LE) beam resonator applicable with the invention.
  • FIG. 7b shows as a schematic side view the length extensional (LE) beam resonator of figure 7a.
  • FIG. 7c shows as a schematic top view a length extensional (LE) beam resonator in accordance with the invention.
  • FIG. 7d shows as a schematic side view the length extensional (LE) beam resonator of figure 7c.
  • FIG. 7e shows as a schematic side view the length extensional (LE) beam resonator in accordance with one alternative solution of the invention.
  • FIG. 8a shows as a schematic top view a length extensional (LE) beam resonator with a fully filled compensating region in accordance with the invention.
  • FIG. 8b shows as a schematic side view the length extensional (LE) beam resonator of figure 8a.
  • FIG. 8c shows as a schematic top view a length extensional (LE) beam resonator with a partially filled compensating region (trenches) in accordance with the invention.
  • FIG. 8d shows as a schematic side view the length extensional (LE) beam resonator of figure 8c.
  • FIG. 8e shows as a schematic top view a length extensional (LE) beam resonator with a partially filled compensating region (plugs) in accordance with the invention.
  • FIG. 8f shows as a schematic side view the length extensional (LE) beam resonator of figure 8e.
  • Figures 9a-9c show schematically a possible method for fabricating a compensation region structure in accordance with the invention.
  • Figures 10a- 10b show schematically another possible method for fabricating a compensation region structure in accordance with the invention.
  • FIG. 11a shows as a schematic top view a square extensional (SE) plate resonator with a fully filled compensating region (trenches) in accordance with the invention.
  • SE square extensional
  • FIG. 1 lb shows as a schematic side view the resonator of figure 11a.
  • FIG. 11c shows as a perspective view the resonator element of figure 11a.
  • Figures 12a-12d show graphically the influence of the compensating region when positioned at the edges of the resonator.
  • Figures 13a- 13d show graphically the influence of the compensating region when positioned at the stress maximum the resonator in accordance with the invention
  • FIG. 4a shows as a schematic top view a vertical BAW SOI resonator with a fully filled compensating region in accordance with the invention.
  • FIG. 14b shows as a schematic side view the resonator of figure 8a.
  • Figures 15a-15e show graphically the influence of the compensating region in a vertical ID resonator having a 2.075 ⁇ Si0 2 spring in the middle at the stress maximum the resonator in accordance with the invention.
  • Figures 16a-16d show graphically the influence of the compensating region in a vertical ID resonator having a Si0 2 layers at top and bottom of the resonator.
  • Figures 17a-17d show graphically the influence of the compensating region in a vertical ID resonator having a ⁇ Si0 2 layers at ends of the resonator.
  • the present invention is related to micromechanical structures, where a resonator 3 is suspended to a supporting structure 1 by anchors 10.
  • the supporting structure 1 is in one typical embodiment of the invention a silicon device layer of a SOI (Silicon On Insulator) wafer.
  • SOI Silicon On Insulator
  • the dimensions and the suspension of the resonator 3 are such that it vibrates with a specific frequency 3 ⁇ 4 when excited by a corresponding electrical signal.
  • a typical length of a beam resonator is 320 ⁇ and height 20 ⁇ .
  • the excitation can be made capacitively by electrodes 5 formed on resonator 3 and on substrate 1 or alternatively by piezoelectric structures of figure 2a or 4.
  • the electrical signal can be conducted to the structures by electrodes or by making the complete structure conductive to the electrical signal.
  • Typical materials in a resonator are Si for conductive structures and amorphous Si0 2 for isolators. Amorphous Te 0 2 is also an alternative material for isolation. Also a SOI (Silicon On Insulator) wafer may be used as a preform for the resonator.
  • Figure 5 shows a plate resonator. Same principal arrangements apply to plate resonators, anchoring scheme is more complex and anchors not necessarily at nodes.
  • Si works as bottom/ground electrode.
  • Sio 2 insulator is applied everywhere but opened below ground contact to Si.
  • Figure 6 shows an electrostatically actuated device, where metallization are not applied on the resonator itself. Voltages are applied over vertical gaps in Si. An external electrical circuit 6 takes care of the excitation and maintenance of the resonance.
  • Figure s 7a and 7b show the resonator element 3 in more detail and also a stress profile for the resonator is presented with a maximum 7 in the middle of the beam 3.
  • FIGS 7a and 7b is presented the basic solution of the invention where a region of temperature compensating material 4, e.g., Si0 2 or Te0 2 (Tellurium oxide) is positioned at the stress maximum of beam 3.
  • the width of the area 4 is about 10 % of the length of the beam 3, but depending of the basic material and geometry of the beam it may vary in the range of 5 - 30%.
  • a glass material with similar thermal properties may be used.
  • the second material 4 may be placed at the ends of the resonator 3.
  • the areas of second material are laterally dimensioned to be larger than ⁇ . Lateral dimension here means the dimension in the plane of the upper surface 30 of the resonator 3.
  • This upper surface 30 of the resonator 3 is e.g. the surface visible in figure 7c or alternatively in figures 11a and 1 lb.
  • Figures 8a and 8b correspond to solution of figures 7a-7d.
  • Figures 8c-8d show a partially filled compensating region 4 formed by transverse trenches.
  • figures 9a-9c is described in more detail a process for manufacturing the resonator.
  • holes 20 are etched through silicon device layer (e.g., anisotropic dry etching). This is a standard etching process known by the man skilled in the art.
  • holes are filled by a deposition phase or alternatively a partial oxidization is made.
  • stage of figure 9c oxidation is extended to fill the complete volume.
  • the resonator 3 means the actual mechanically vibrating element and by the supporting structure 1 is meant the construction to which the resonator is suspended to.
  • the second material 4 also called here compensating material 4 has different thermal properties than the first material 2 of the supporting structure 1.
  • the thermal dependence of the sound velocity in the material is opposite to each other in these two structures. This condition is met for example to the following pairs: First material: Si
  • Second material amorphous S1O 2 or amorphous TeC" 2 or glass with suitable thermal properites.
  • a resonator may have several tension maximums at the specific frequency 3 ⁇ 4, and then the method will be applied to all of them.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The invention relates to a micromechanical resonator comprising a substrate (1) of first material (2), a resonator (3) suspended to the supporting structure (1), the resonator (3) being at least partially of the same material (2) as the supporting structure and dimensioned for resonation at a specific frequency fo, coupling means (5) for initiating, maintaining and coupling the resonation of the resonator (3) to an external circuit (6), and the resonator (3) including second material (4), the thermal properties of which being different from the first material (2). In accordance with the invention the resonator (3) includes the second material (4) located concentrated in specific places of the resonator (3).

Description

A micromechanical resonator
The invention relates to a micromechanical resonator in according to the preamble of claim 1.
Thermal drift remains as the main obstacle in the way of Silicon MEMS resonators entering the market of quartz crystal oscillators. Compensation of the drift can be done by replacing part of the resonating volume with material showing opposite sign of thermal drift of resonance frequency than Silicon, such as amorphous S1O2. Resonator performance is then compromised as compared to purely single crystal resonator.
Conventionally, problems relating to temperature drift of micromechanical resonators have been solved by using a temperature compensating surrounding structure (typically S1O2) around the basic silicon material or alternatively by using S1O2 as a part of the structure distributed essentially uniformly in the complete structure. This technology is described in more detail e.g., in publication "Temperature compensation in silicon-based microelectromechanical resonators", F. Schoen et al (ISBN: 978-1-4244-2978-3/09),
It is an object of the present invention to overcome at least some of the disadvantages of the above-described techniques and to provide an entirely novel type micromechanical resonator and a method for manufacturing a micromechanical resonator. T he goal of the invention is achieved by virtue of locating the thermally compensating second material concentrated in specific places of the resonator.
In one preferred embodiment of the invention a passive compensation of the thermal drift of resonance frequency is used with an optimised way by using the compensating material concentrated in the stress maximum(s) of the resonator. When realised, the commercial significance is vast by providing a method to fabricate MEMS resonators that can potentially compete with the traditional quartz resonator technology. This invention states how to minimize the amount of compensating material by placing it where it is most effective - that is - in the stress maximum (displacement node). Another preferred embodiment of the invention is based on the use of S1O2 or TeC>2 in the middle of the vibrating structure.
A further preferred embodiment of the invention is based on dimensioning the parts of the second material of the resonator laterally larger than 10 μιη.
More specifically, the micromechanical resonator according to the invention is characterized by what is stated in the characterizing part of claim 1.
The invention provides significant benefits.
Replacing a fraction of the resonating volume with material with opposite sign thermal drift of resonance frequency reduces the thermal drift. The fraction needed for a given level of reduction is at its smallest when the compensating material is placed at the stress maximum position for the resonance mode being used. Considering a beam vibrating in length extensional mode, placing small amount of compensating material at the ends of the beam i.e. at the stress minimums/displacement maximums, will have a very small effect as the compensating material acts mostly as a passive mass load only, whereas the rest of the beam material acts as spring. If, instead, the compensating material is placed in the middle of the beam, the compensating material acts mainly as the spring having high stress and strain within itself, and compensates the thermal drift more effectively.
Some of the structure embodiments described in this application (such as the fully oxidized spring area) have the important advantage that fabrication tolerances of both the resonant frequency and of thermal coefficient of the resonance frequency are reduced. Fabrication tolerances affect device testing and tuning needs and affect significantly the cost of resonators. In a resonator with a fully oxidized spring area, there is only one interface, the circumference of the laterally relatively large oxide area in the middle of the resonator, whose exact location affects fabrication tolerances.
Materials-based thermal compensation method have several advantages over various active electrical compensation schemes: there is no power consumption, they do not suffer from slowness of the servo system, nor is the spectral purity deteriorated.
In the following, the invention will be examined in greater detail with the help of exemplifying embodiments illustrated in the appended drawings, in which
FIG. 1 shows a top view of a resonator applicable with the invention using a piezofilm as a part of the component.
FIG. 2a shows as a side view the resonator of figure 1.
FIG. 2b shows as a top view a photograph of an actual component of the resonator of figure 1.
FIG. 3 shows a top view of another resonator applicable with the invention using a piezofilm as a part of the component.
FIG. 4 shows as a side view the resonator of figure 3.
FIG. 6 shows as a schematic top view an electrostatically actuated plate resonator applicable with the invention.
FIG. 7a shows as a schematic top view a length extensional (LE) beam resonator applicable with the invention. FIG. 7b shows as a schematic side view the length extensional (LE) beam resonator of figure 7a. FIG. 7c shows as a schematic top view a length extensional (LE) beam resonator in accordance with the invention. FIG. 7d shows as a schematic side view the length extensional (LE) beam resonator of figure 7c.
FIG. 7e shows as a schematic side view the length extensional (LE) beam resonator in accordance with one alternative solution of the invention.
FIG. 8a shows as a schematic top view a length extensional (LE) beam resonator with a fully filled compensating region in accordance with the invention.
FIG. 8b shows as a schematic side view the length extensional (LE) beam resonator of figure 8a.
FIG. 8c shows as a schematic top view a length extensional (LE) beam resonator with a partially filled compensating region (trenches) in accordance with the invention. FIG. 8d shows as a schematic side view the length extensional (LE) beam resonator of figure 8c.
FIG. 8e shows as a schematic top view a length extensional (LE) beam resonator with a partially filled compensating region (plugs) in accordance with the invention.
FIG. 8f shows as a schematic side view the length extensional (LE) beam resonator of figure 8e.
Figures 9a-9c show schematically a possible method for fabricating a compensation region structure in accordance with the invention. Figures 10a- 10b show schematically another possible method for fabricating a compensation region structure in accordance with the invention.
FIG. 11a shows as a schematic top view a square extensional (SE) plate resonator with a fully filled compensating region (trenches) in accordance with the invention.
FIG. 1 lb shows as a schematic side view the resonator of figure 11a.
FIG. 11c shows as a perspective view the resonator element of figure 11a.
Figures 12a-12d show graphically the influence of the compensating region when positioned at the edges of the resonator.
Figures 13a- 13d show graphically the influence of the compensating region when positioned at the stress maximum the resonator in accordance with the invention
FIG. 4a shows as a schematic top view a vertical BAW SOI resonator with a fully filled compensating region in accordance with the invention. FIG. 14b shows as a schematic side view the resonator of figure 8a.
Figures 15a-15e show graphically the influence of the compensating region in a vertical ID resonator having a 2.075 μπι Si02 spring in the middle at the stress maximum the resonator in accordance with the invention.
Figures 16a-16d show graphically the influence of the compensating region in a vertical ID resonator having a Si02 layers at top and bottom of the resonator.
Figures 17a-17d show graphically the influence of the compensating region in a vertical ID resonator having a μπι Si02 layers at ends of the resonator. In accordance with figures 1 - 4 the present invention is related to micromechanical structures, where a resonator 3 is suspended to a supporting structure 1 by anchors 10. The supporting structure 1 is in one typical embodiment of the invention a silicon device layer of a SOI (Silicon On Insulator) wafer. The dimensions and the suspension of the resonator 3 are such that it vibrates with a specific frequency ¾ when excited by a corresponding electrical signal. A typical length of a beam resonator is 320 μιη and height 20 μιη. The excitation can be made capacitively by electrodes 5 formed on resonator 3 and on substrate 1 or alternatively by piezoelectric structures of figure 2a or 4.
The electrical signal can be conducted to the structures by electrodes or by making the complete structure conductive to the electrical signal. Typical materials in a resonator are Si for conductive structures and amorphous Si02 for isolators. Amorphous Te 02 is also an alternative material for isolation. Also a SOI (Silicon On Insulator) wafer may be used as a preform for the resonator.
Figure 5 shows a plate resonator. Same principal arrangements apply to plate resonators, anchoring scheme is more complex and anchors not necessarily at nodes. In this picture Si works as bottom/ground electrode. Sio2 insulator is applied everywhere but opened below ground contact to Si.
Figure 6 shows an electrostatically actuated device, where metallization are not applied on the resonator itself. Voltages are applied over vertical gaps in Si. An external electrical circuit 6 takes care of the excitation and maintenance of the resonance.
Figure s 7a and 7b show the resonator element 3 in more detail and also a stress profile for the resonator is presented with a maximum 7 in the middle of the beam 3.
In figures 7a and 7b is presented the basic solution of the invention where a region of temperature compensating material 4, e.g., Si02 or Te02 (Tellurium oxide) is positioned at the stress maximum of beam 3. The width of the area 4 is about 10 % of the length of the beam 3, but depending of the basic material and geometry of the beam it may vary in the range of 5 - 30%. Instead of S1O2 or TeC>2, a glass material with similar thermal properties may be used. In accordance with figure 7e the second material 4 may be placed at the ends of the resonator 3. In one advantageous solution of the invention the areas of second material are laterally dimensioned to be larger than ΙΟμιη. Lateral dimension here means the dimension in the plane of the upper surface 30 of the resonator 3. This upper surface 30 of the resonator 3 is e.g. the surface visible in figure 7c or alternatively in figures 11a and 1 lb. By this dimensioning the problems with production tolerances may be minimized. This way dimensioning is applicable also for solutions of figures 7a and 7b if the other dimensioning rules, e.g., for f0 are met.
Figures 8a and 8b correspond to solution of figures 7a-7d. Figures 8c-8d show a partially filled compensating region 4 formed by transverse trenches.
In figures 9a-9c is described in more detail a process for manufacturing the resonator. In accordance with figure 9a holes 20 are etched through silicon device layer (e.g., anisotropic dry etching). This is a standard etching process known by the man skilled in the art. In figure 9b holes are filled by a deposition phase or alternatively a partial oxidization is made. In stage of figure 9c oxidation is extended to fill the complete volume.
In other words the typical embodiments of the invention are:
1) Creating an oxide or partially oxide (or other compensating material) region 4 through the depth of resonator device layer 4 in the middle of a square extensional resonator 3.
2) Creating an oxide or region of partially oxide (or other compensating material) 4 in the middle of a length extensional beam resonator 3.
3) Creating similarly compensation regions for other resonator geometries and resonant modes by placing the compensation material in the stress maximum/displacement node positions.
4) Placing compensating layer 4 in a vertically stacked thin-film-silicon-on-insulator resonator similarly in the stress maximum instead of extreme surfaces. Illustrations of the embodiments and associated simulation results have been described above with the figures.
This invention has focused on finding thermally compensated resonator structures which minimize the amount of oxide material by placing the oxide in a position with the largest effect on the thermal coefficient. Simulations on 1-D length-extensional resonators show that by placing the oxide at the end of the extending bars one needs as much as 38% volume ratio of the oxide. (The actual number is of course sensitive to the materials parameters which do have some uncertainty.) It should be noted that also this solution is a good solution if the large amount of oxide does not have any significant adverse effects. Assuming again the oxide area is "fully oxidized" (see the discussion above), the fabrication tolerances in the exact location of the oxide-silicon interface, do not have a large effect on the value of the resonance frequency of the value of the thermal coefficient. From the lithography point of view, it is in fact advantageous that the volumes of the silicon and the oxide would be as equal as possible. What differentiates such a structure from previously described solutions is again that the oxide forms one large volume (with all dimensions much larger than 1 micrometer).
In this application the resonator 3 means the actual mechanically vibrating element and by the supporting structure 1 is meant the construction to which the resonator is suspended to.
The second material 4, also called here compensating material 4, has different thermal properties than the first material 2 of the supporting structure 1. In the preferred embodiment of the invention the thermal dependence of the sound velocity in the material is opposite to each other in these two structures. This condition is met for example to the following pairs: First material: Si
Second material: amorphous S1O2 or amorphous TeC"2 or glass with suitable thermal properites.
For the man skilled in the art it is clear that a resonator may have several tension maximums at the specific frequency ¾, and then the method will be applied to all of them.

Claims

What is claimed is:
1. Micromechanical resonator comprising
• a supporting structure (1) of first material (2),
• a resonator (3) suspended to the supporting structure (1), the resonator (3) being at least partially of the same material (2) as the supporting structure and dimensioned for resonation at a specific frequency f0,
• coupling means (5) for initiating, maintaining and coupling the resonation of the resonator (3) to an external circuit (6), and
• the resonator (3) including second material (4), the thermal properties of which being different from the first material (2),
characterized in that
• the resonator (3) includes the second material (4) located concentrated in
specific places of the resonator (3), and
• the parts of the resonator (3) of the second material (4) are dimensioned laterally larger than 10 μιη.
2. A resonator in accordance with claim 1, characterized in that the parts of the resonator (3) of the second material (4) are at least mainly in an area(s) where the resonator (3) has a tension maximum(s) (7) at the specific frequency ¾.
3. A resonator in accordance with claim 1, characterized in that the parts of the resonator (3) of the second material (4) are at least mainly at the lateral ends of the resonator (3).
4. A resonator in accordance with any previous claim, characterized in that the first material (2) is silicon (Si) and the second material (4) is silicon oxide (S1O2) or
Tellurium oxide (Te02) or glass.
5. A resonator in accordance with any previous claim, characterized in that the resonator (3) is a beam suspended in the middle of the structure to the substrate (1).
6. A resonator in accordance with any previous claim, characterized in that the resonator (3) is a plate suspended to the substrate (1) from the corners of the plate (3).
7. A resonator in accordance with any previous claim or their combination,
characterized in that the parts of the second material (4) are uniform.
8. A resonator in accordance with any previous or their combination, characterized in that the parts of the second material (4) placed to the stress maximum are only partially filling the first material as trenches or plugs.
9. A resonator in accordance with any previous claim or their combination,
characterized in that the resonator (3) is a length extensional (LE) beam resonator.
10. A resonator in accordance with any claim 1-9 or their combination, characterized in that the resonator (3) is a square extensional (SE) plate resonator.
11. A resonator in accordance with any claim 1-9 or their combination, characterized in that the resonator (3) is a vertical BAW SOI resonator.
12. A resonator in accordance with any previous claim or their combination,
characterized in that the thermal dependence of the sound velocity of the first material (3) is opposite to the second material (4).
PCT/FI2010/050744 2009-09-28 2010-09-27 A micromechanical resonator WO2011042597A1 (en)

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US13/497,805 US20120229226A1 (en) 2009-09-28 2010-09-27 Micromechanical Resonator
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CN102577118B (en) 2016-03-16
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EP2484008B1 (en) 2016-08-10
CN102577118A (en) 2012-07-11
JP5704614B2 (en) 2015-04-22
JP2013506334A (en) 2013-02-21
FI20095988A0 (en) 2009-09-28
EP2484008A4 (en) 2014-06-18

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