WO2011034293A2 - Heating pipe for an exhaust line, and exhaust line structure for a semiconductor manufacturing process - Google Patents

Heating pipe for an exhaust line, and exhaust line structure for a semiconductor manufacturing process Download PDF

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Publication number
WO2011034293A2
WO2011034293A2 PCT/KR2010/005672 KR2010005672W WO2011034293A2 WO 2011034293 A2 WO2011034293 A2 WO 2011034293A2 KR 2010005672 W KR2010005672 W KR 2010005672W WO 2011034293 A2 WO2011034293 A2 WO 2011034293A2
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Prior art keywords
pipe
exhaust line
heating
heat
insulating material
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PCT/KR2010/005672
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French (fr)
Korean (ko)
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WO2011034293A3 (en
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박영수
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Park Yeong Su
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Publication of WO2011034293A3 publication Critical patent/WO2011034293A3/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Definitions

  • the present invention relates to a heating pipe for the exhaust line and the exhaust line structure of the semiconductor process, and more particularly to prevent the powder deposition of the bent portion of the exhaust line and to maintain the pipe temperature at a constant high temperature (150 ⁇ 190 °C) It's about technology that makes it possible.
  • the semiconductor manufacturing process proceeds in the form of using a reaction gas or a process gas in the process chamber, and gas or reaction by-products, for example, powder, etc. remaining after a predetermined process is completed are discharged through an exhaust line.
  • FIG. 1 schematically illustrates the structure of an exhaust line of a general semiconductor manufacturing process.
  • Korean Patent Laid-Open Publication Nos. 10-2005-0117331 and 10-2007-0054984 disclose a technique having a heating jacket on an exhaust line.
  • the heating jacket as described above has a problem that heat transfer is not good, such as the air layer is formed due to poor adhesion to the pipe,
  • the registered patent has a problem in that the heating pipe has to be manufactured in the form of a double corrugated pipe, and not only the manufacturing is difficult, but also the workability is remarkably decreased when the two corrugated pipes are mutually coupled.
  • the hot wires interfere with the flexible characteristics of the corrugated pipes, causing a certain portion of the pipes to be bent, and there is a problem that powder is still generated at the bent portions.
  • the present invention has been made to solve the above problems, it is an object of the present invention to provide a heating pipe that can prevent the phenomenon of powder deposit in the exhaust line of the gas by maintaining the pipe at a desired high temperature.
  • a pipe made of a metal material having a flange portion at both ends, a hot wire wound spirally on the outer peripheral surface of the pipe, a heat-resistant insulating material located on the outside of the hot wire, the heat-resistant A heating pipe for an exhaust line including a heat insulating material positioned outside the insulating layer and a ring-shaped press-fit cap press-fitted to the outside of the heat insulating material on both end sides of the corrugated pipe.
  • the heating wire portion is formed in the receiving space therein, the band-shaped case portion formed with a partition wall in the center of the receiving space, the (+) pole heating wire located in one side space portion separated by the partition wall and the other separated by the partition wall It is preferable to include the negative electrode heating wire located in one side space part.
  • the hot wire portion is more preferably wound so that the gap between the hot wire portions becomes smaller from the gas input end to the gas output end of the pipe.
  • the heat resistant insulating material is more preferably formed by winding a tape-shaped asbestos.
  • the insulating material is an asbestos fabric is formed so as to surround the surface of the heat-resistant insulating material and the first insulating layer and an adhesive is applied to one surface of the second insulating layer of asbestos material which is adhered to the outer surface of the first insulating layer. It is more preferable to include.
  • a plurality of heating pipes for connecting between the gas chamber and the process chamber of the semiconductor manufacturing process, and the elbow member interposed in the bent connection portion of the heating pipe In the exhaust line structure,
  • the heating pipe is a metal pipe having a flange portion at both ends, a heating wire wound spirally on the outer circumferential surface of the pipe, a heat-resistant insulating material located outside the heating wire part, a heat insulating material located outside the heat-resistant insulating layer and the pipe
  • the exhaust line structure of the semiconductor process is characterized in that it comprises a ring-shaped press-fit cap press-fitted to the outer side of the insulating material on both ends, the outer circumferential surface of the elbow member is installed so as to surround the elbow member a heating jacket formed with a heating wire Is provided.
  • FIG. 1 schematically illustrates the structure of an exhaust line of a general semiconductor manufacturing process.
  • FIG. 2 schematically illustrates a structure of an exhaust line of a semiconductor manufacturing process to which a corrugated pipe is applied.
  • FIG. 3 is a partial cutaway perspective view showing the structure of the heating pipe for the exhaust line according to the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing the structure of the heating pipe for the exhaust line according to the first embodiment of the present invention.
  • FIG. 5 illustrates a winding structure of a hot wire unit according to a first embodiment of the present invention.
  • FIG. 6 illustrates an exhaust line structure of a semiconductor process according to a second embodiment of the present invention.
  • FIG 3 is a partial cutaway perspective view showing the structure of the heating pipe for exhaust line according to the first embodiment of the present invention
  • Figure 4 is a cross-sectional view showing the structure of the heating pipe for exhaust line according to the first embodiment of the present invention to be.
  • the heating pipe 10 for the exhaust line comprises a corrugated pipe 11, the hot wire portion 12, the heat-resistant insulating material 13, the heat insulating material (14, 15).
  • the corrugated pipe 11 is a cylindrical pipe made of metal, and a plurality of corrugations are formed, and flange portions 16 for connecting to the process chamber 100 and the gas scrubber 200 are integrally formed at both ends.
  • Corrugated pipe 11 is used a 0.3mm thick stainless steel material, in addition to the galvanized or heat-resistant synthetic resin can be.
  • the hot wire portion 12 is spirally formed on the outer circumferential surface of the corrugated pipe 11 to heat the corrugated pipe 11 so as to maintain the internal temperature of the corrugated pipe 11 at an appropriate temperature (50 to 190 ° C.).
  • the hot wire part 12 is divided into a band-shaped case part 12a and a partition wall 12c in which a receiving space is formed therein and a partition 12c is formed at the center of the receiving space. It comprises a (+) pole heating wire 12b located in the one side space part, and the (-) pole heating wire 12d located in the other one space part separated by the partition 12c.
  • the partition wall 12c is for preventing a short circuit between two heating wires, and two strands of heating wires are simultaneously installed in one heating wire part 12 so that the partition wall 12c can be connected to a power supply unit (not shown) through one connector 18. It has the advantage of being.
  • the heat resistant insulating material 13 is located on the outside of the hot wire portion and is preferably a structure in which tape-shaped asbestos is wound.
  • Asbestos is a fibrous magnesium-containing hydrous silicate mineral that is excellent in incombustibility, heat insulation, durability, fire resistance, insulation, and the like, and can withstand high temperature of the corrugated pipe 11 while providing electrical insulation.
  • the heat insulating members 14 and 15 are positioned outside the heat resistant insulating layer to prevent the heat provided from the hot wire part 12 from leaking to the outside, and are provided to cover the surface of the heat resistant insulating material 13 as asbestos fabric. 1, the insulating layer 14 and one surface is coated with an adhesive, and one surface to which the adhesive is applied includes a second insulating layer 15 made of asbestos material adhered to the outer surface of the first insulating layer 14.
  • the ring-shaped press-fit cap 17 is press-fitted to the outside of the second heat insulating material 15 on both end sides of the corrugated pipe 11 to perform a function of firmly supporting the flange portion 16.
  • FIG. 5 illustrates a winding structure of a hot wire unit according to the present invention.
  • the present invention does not wind the heating wires 12 on the outer circumferential surface of the corrugated pipe 11 at regular intervals, and the winding between the heating wires becomes smaller from the gas input end on the left side to the gas output end on the right side. Taking is a characteristic composition.
  • the heating pipe 10 of the exhaust line is very important to maintain the internal temperature of the pipe so that powder does not occur in the exhaust gas, and to do this, the heating wire should be wound at very close intervals or a high voltage should be applied to the heating wire.
  • the flexible characteristics of the corrugated pipe 11 are reduced and the unit cost is increased.
  • a high voltage is applied to the hot wire, the power consumption is high and a high voltage is applied even if a high voltage is applied. Heating is difficult.
  • the gas discharged from the process chamber 100 is a high temperature gas, the temperature is lowered in the process of being discharged through the exhaust line and powder is generated while being crushed on the inner wall of the pipe at a low temperature, the present applicant considers such characteristics
  • the gas is introduced from the process chamber 100 to increase the internal temperature of the hot wire portion 12, and the gap between the hot wire portion 12 toward the rear to effectively prevent the temperature drop of the gas. It is characteristic.
  • the temperature decreases a lot, and the heating wire portion 12 is wound more tightly on the outlet side instead of the bent portion, thereby making it possible to reliably prevent the generation of powder.
  • FIG. 6 illustrates an exhaust line structure of a semiconductor process according to a second embodiment of the present invention.
  • the second embodiment of the present invention is an elbow member having a bending portion between the heating pipe 10 and the heating pipe 10 as a straight pipe shape rather than a corrugated pipe structure in which the heating pipe 10 is flexible. It is a structure that connects to 300.
  • the heating pipe 10 maintains the temperature inside the heating pipe 10 without the heat provided from the heating wire part 12 like the first embodiment being discharged to the outside by the heat-resistant insulating material 13 and the heat insulating material 14, 15.
  • the elbow member 300 is installed so that the heating jacket 400 is installed on the outer circumferential surface of the elbow member 300 is wrapped because the elbow member 300 is used.
  • the heating jacket is installed only on the straight pipe and not on the elbow member, it is difficult to maintain high temperature in the elbow member primarily, and even in a long straight pipe, the heating jacket alone does not maintain sufficient heat retention, and thus the bending portion of the pipe is not provided. It causes a lot of powder on
  • the second embodiment of the present invention it is possible to maintain a sufficient high temperature in the heating pipe 10 as well as to maintain the temperature inside the tubular body at a high temperature by the heating jacket 400 installed on the outer circumferential surface of the elbow member 300. Since the powder generation is significantly reduced compared to the conventional.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pipe Accessories (AREA)
  • Thermal Insulation (AREA)
  • Exhaust Silencers (AREA)

Abstract

The present invention relates to a heating pipe for an exhaust line, comprising: a metal corrugated pipe, both ends of which have respective flanges; a hot wire wound into a spire along an outer surface of the corrugated pipe; a heat-resistant insulating member arranged along an outer surface of the hot wire; a lagging member formed along an outer surface of the heat-resistant insulating member; and ring-shaped press caps press-fitted onto an outer surface of the lagging member at both ends of the corrugated pipe. According to the present invention, the heating pipe can be maintained at a desired high-temperature level, thus preventing powder from being deposited in a gas exhaust line.

Description

배기라인용 히팅 파이프 및 반도체 공정의 배기라인 구조Exhaust Line Structure for Exhaust Line Heating Pipe and Semiconductor Process
본 발명은 배기라인용 히팅 파이프 및 반도체 공정의 배기라인 구조에 관한 것으로서, 보다 상세하게는 배기라인의 절곡 부위의 파우더 침적을 방지함과 아울러 파이프의 온도를 일정한 고온(150 ~ 190℃)으로 유지할 수 있도록 하는 기술에 관한 것이다. The present invention relates to a heating pipe for the exhaust line and the exhaust line structure of the semiconductor process, and more particularly to prevent the powder deposition of the bent portion of the exhaust line and to maintain the pipe temperature at a constant high temperature (150 ~ 190 ℃) It's about technology that makes it possible.
일반적으로 반도체 제조 공정은 프로세스 챔버에서 반응가스나 공정가스를 사용하는 형태로 진행되고, 소정의 공정이 완료된 후 잔류하는 가스나 반응 부산물, 예를 들면 파우더 등은 배기라인을 통해서 배출된다. In general, the semiconductor manufacturing process proceeds in the form of using a reaction gas or a process gas in the process chamber, and gas or reaction by-products, for example, powder, etc. remaining after a predetermined process is completed are discharged through an exhaust line.
도 1은 일반적인 반도체 제조공정의 배기 라인의 구조를 개략적으로 도시한 것이다. 1 schematically illustrates the structure of an exhaust line of a general semiconductor manufacturing process.
보통 화학 기상증착 설비의 경우, 화학기상증착 공정 수행 후 프로세스 챔버(100)로부터 배기되는 배기가스가 배기 파이프(400)를 통해 가스 세정기(200)로 배출될 때, 배기라인 내부에 미세한 분진 형태의 파우더가 생성되며, 이러한 파우더의 발생원인은 각 배기라인의 온도, 압력, 배기가스의 성분 등의 차이에 의해 좌우된다. In general, in the case of chemical vapor deposition facilities, when the exhaust gas exhausted from the process chamber 100 after the chemical vapor deposition process is discharged to the gas scrubber 200 through the exhaust pipe 400, a fine dust form is formed in the exhaust line. The powder is produced, and the cause of the powder depends on the difference in temperature, pressure, components of the exhaust gas, etc. in each exhaust line.
이와 같이, 미세한 분진 형태의 파우더가 배기라인의 내벽에 응축되면, 배기압 저하에 따른 설비 에러 발생 및 배기라인 막힘에 의한 배기가스의 역류 현상이 발생하여 공정 불량의 원인이 되고, 또 배기라인의 막힘으로 인해 진공펌프의 성능이 저하되는 현상이 발생한다. In this way, when the fine powder powder condenses on the inner wall of the exhaust line, an equipment error occurs due to a decrease in exhaust pressure and a backflow phenomenon of the exhaust gas due to clogging of the exhaust line causes a process failure, and The blockage causes the performance of the vacuum pump to deteriorate.
이와 같은 문제점을 해결하기 위해서 국내 공개특허 공개번호 10-2005-0117331호 및 10-2007-0054984호에서는 배기라인에 히팅자켓을 구비한 기술을 제시하고 있다. In order to solve this problem, Korean Patent Laid-Open Publication Nos. 10-2005-0117331 and 10-2007-0054984 disclose a technique having a heating jacket on an exhaust line.
그러나, 위와 같은 히팅자켓은 배관에 밀착성이 떨어져서 공기층이 형성되는 등 열전달이 잘 되지 않는 문제점이 있고,  However, the heating jacket as described above has a problem that heat transfer is not good, such as the air layer is formed due to poor adhesion to the pipe,
또 기존 배기라인은 평활관이어서 배관시 각도를 몇 번 꺽어서 연결 설치해야 하므로 유체가 관의 벽에 충돌하는 경우가 발생하고, 이로 인해 압력이 상승하면서 관의 연결부위인 엘보(300)에 파우더가 생성되는 문제점이 있다. In addition, since the existing exhaust line is a smooth pipe, the pipe must be connected at several angles, so that the fluid may collide with the wall of the pipe. There is a problem that is generated.
국내등록특허 10-0860593호에는 이러한 히팅자켓의 문제점을 해결하기 위해, 도 2에 도시된 바와 같이, 반도체 설비의 가스 배출라인에 설치되는 배기라인을 이중의 주름관 형태로 제작하고, 이중 주름관의 내부에 열선을 설치하여 주름관의 플렉시블한 배관 특성을 이용하여 유체 흐름에 대한 간섭(충돌 등)을 최소화할 수 있도록 하는 파이프 구조를 제시하고 있다. In Korean Patent No. 10-0860593, in order to solve the problem of the heating jacket, as shown in Figure 2, the exhaust line installed in the gas discharge line of the semiconductor equipment is made in the form of a double corrugated pipe, the inside of the double corrugated pipe A pipe structure is proposed to minimize the interference (collision, etc.) to the fluid flow by installing the heating wire in the pipe and using the flexible pipe characteristics of the corrugated pipe.
그러나, 상기 등록특허는 히팅 파이프를 2중 주름관 형태로 제작하여야 하므로 그 제작이 힘들뿐 아니라 2개의 주름관을 상호 결합시 작업성이 현저하게 떨어지는 문제점이 있다. However, the registered patent has a problem in that the heating pipe has to be manufactured in the form of a double corrugated pipe, and not only the manufacturing is difficult, but also the workability is remarkably decreased when the two corrugated pipes are mutually coupled.
또한, 2개의 주름관 간에 열선을 개재함으로써 열선이 주름관의 플렉시블한 특성을 방해하여 일정 부분 관이 절곡되는 현상이 발생되고 절곡된 부분에 파우더가 여전히 발생하는 문제점이 있다. In addition, by interposing a hot wire between the two corrugated pipes, the hot wires interfere with the flexible characteristics of the corrugated pipes, causing a certain portion of the pipes to be bent, and there is a problem that powder is still generated at the bent portions.
또한, 주름관을 각 배기라인에 연결하기 위해서는 별도의 연결 장치가 요구되고, 열 유출이 심해 관 외부에 원하는 적정 온도(50 ~ 190℃)를 유지하기 어려운 단점이 있다. In addition, in order to connect the corrugated pipe to each exhaust line, a separate connection device is required, and heat leakage is so severe that it is difficult to maintain a desired proper temperature (50 to 190 ° C.) outside the pipe.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 배관을 원하는 고온으로 유지시켜 가스의 배기라인에서 파우더가 침적되는 현상을 방지할 수 있는 히팅 파이프를 제공하는 것이다. The present invention has been made to solve the above problems, it is an object of the present invention to provide a heating pipe that can prevent the phenomenon of powder deposit in the exhaust line of the gas by maintaining the pipe at a desired high temperature.
상기와 같은 목적을 달성하기 위한 본 발명의 일측면에 따르면, 양단부에 플랜지부가 형성된 금속 재질의 파이프, 상기 파이프의 외주면에 나선형으로 권취되는 열선부, 상기 열선부의 외측에 위치하는 내열 절연재, 상기 내열 절연층의 외측에 위치하는 보온재 및 상기 주름관의 양 단부 측의 보온재의 외측에 압입되는 링 형상의 압입캡을 포함하는 것을 특징으로 하는 배기라인용 히팅 파이프가 제공된다. According to an aspect of the present invention for achieving the above object, a pipe made of a metal material having a flange portion at both ends, a hot wire wound spirally on the outer peripheral surface of the pipe, a heat-resistant insulating material located on the outside of the hot wire, the heat-resistant A heating pipe for an exhaust line is provided, including a heat insulating material positioned outside the insulating layer and a ring-shaped press-fit cap press-fitted to the outside of the heat insulating material on both end sides of the corrugated pipe.
여기서, 상기 열선부는 내부에 수용공간이 형성되고 상기 수용공간의 중앙에 격벽이 형성된 띠 형상의 케이스부, 상기 격벽으로 분리된 일측 공간부에 위치하는 (+)극 열선 및 상기 격벽으로 분리된 다른 일측 공간부에 위치하는 (-)극 열선을 포함하는 것이 바람직하다. Here, the heating wire portion is formed in the receiving space therein, the band-shaped case portion formed with a partition wall in the center of the receiving space, the (+) pole heating wire located in one side space portion separated by the partition wall and the other separated by the partition wall It is preferable to include the negative electrode heating wire located in one side space part.
그리고, 상기 열선부는 상기 파이프의 가스 입력단으로부터 가스 출력단으로 갈수록 열선부 간의 간격이 작아지도록 권취되는 것이 보다 바람직하다. The hot wire portion is more preferably wound so that the gap between the hot wire portions becomes smaller from the gas input end to the gas output end of the pipe.
또한, 상기 내열 절연재는 테이프 형상의 석면이 권취되어 형성되는 것이 더욱 바람직하다. In addition, the heat resistant insulating material is more preferably formed by winding a tape-shaped asbestos.
또한, 상기 보온재는 석면 원단이 상기 내열 절연재의 표면을 감싸도록 설치되는 제 1 보온층 및 일면에 접착제가 도포되어 상기 일면이 상기 제 1 보온층의 외면에 접착되는 석면 재질의 제 2 보온층을 포함하는 것이 더욱 바람직하다. In addition, the insulating material is an asbestos fabric is formed so as to surround the surface of the heat-resistant insulating material and the first insulating layer and an adhesive is applied to one surface of the second insulating layer of asbestos material which is adhered to the outer surface of the first insulating layer. It is more preferable to include.
상기와 같은 목적을 달성하기 위한 본 발명의 일측면에 따르면, 반도체 제조공정의 프로세스 챔버와 가스 세정기 간을 연결하기 위한 복수개의 히팅 파이프와, 상기 히팅 파이프의 절곡 연결부위에 개재되는 엘보부재를 포함하는 배기라인 구조에 있어서,  According to an aspect of the present invention for achieving the above object, a plurality of heating pipes for connecting between the gas chamber and the process chamber of the semiconductor manufacturing process, and the elbow member interposed in the bent connection portion of the heating pipe In the exhaust line structure,
상기 히팅 파이프는 양단부에 플랜지부가 형성된 금속 재질의 파이프, 상기 파이프의 외주면에 나선형으로 권취되는 열선부, 상기 열선부의 외측에 위치하는 내열 절연재, 상기 내열 절연층의 외측에 위치하는 보온재 및 상기 파이프의 양 단부 측의 보온재의 외측에 압입되는 링 형상의 압입캡을 포함하고, 상기 엘보부재의 외주면에는 열선이 형성된 히팅 자켓이 상기 엘보부재를 감싸도록 설치되는 것을 특징으로 하는 반도체 공정의 배기라인 구조가 제공된다. The heating pipe is a metal pipe having a flange portion at both ends, a heating wire wound spirally on the outer circumferential surface of the pipe, a heat-resistant insulating material located outside the heating wire part, a heat insulating material located outside the heat-resistant insulating layer and the pipe The exhaust line structure of the semiconductor process is characterized in that it comprises a ring-shaped press-fit cap press-fitted to the outer side of the insulating material on both ends, the outer circumferential surface of the elbow member is installed so as to surround the elbow member a heating jacket formed with a heating wire Is provided.
상기와 같은 본 발명에 따르면, 배관을 원하는 고온으로 유지시켜 가스의 배기라인에서 파우더가 침적되는 현상을 방지할 수 있는 효과가 있다.  According to the present invention as described above, it is possible to prevent the phenomenon that the powder is deposited in the exhaust line of the gas by maintaining the pipe at a desired high temperature.
도 1은 일반적인 반도체 제조공정의 배기 라인의 구조를 개략적으로 도시한 것이다. 1 schematically illustrates the structure of an exhaust line of a general semiconductor manufacturing process.
도 2는 주름관이 적용된 반도체 제조공정의 배기 라인의 구조를 개략적으로 도시한 것이다. 2 schematically illustrates a structure of an exhaust line of a semiconductor manufacturing process to which a corrugated pipe is applied.
도 3은 본 발명의 제 1 실시예에 따른 배기라인용 히팅 파이프의 구조를 도시한 부분 절개 사시도이다. 3 is a partial cutaway perspective view showing the structure of the heating pipe for the exhaust line according to the first embodiment of the present invention.
도 4는 본 발명의 제 1 실시예에 따른 배기라인용 히팅 파이프의 구조를 도시한 단면도이다. 4 is a cross-sectional view showing the structure of the heating pipe for the exhaust line according to the first embodiment of the present invention.
도 5는 본 발명의 제 1 실시예에 따른 열선부의 권취 구조를 도시한 것이다. 5 illustrates a winding structure of a hot wire unit according to a first embodiment of the present invention.
도 6은 본 발명의 제 2 실시예에 따른 반도체 공정의 배기라인 구조를 도시한 것이다. 6 illustrates an exhaust line structure of a semiconductor process according to a second embodiment of the present invention.
<주요도면부호에 관한 설명> <Description of main drawing code>
10 : 히팅 파이프  10: heating pipe
11 : 주름관 11: corrugated pipe
12 : 열선부  12: hot wire part
12a : 케이스부 12a: Case part
12b : (+)극 열선  12b: (+) pole heating wire
12c : 격벽 12c: bulkhead
12d : (-)극 열선  12d: (-) pole heating wire
13 : 내열 절연제 13: heat-resistant insulation
14 : 제 1 보온층  14: the first thermal insulation layer
15 : 제 2 보온층 15: second heat insulation layer
16 : 플랜지부  16: flange portion
17 : 압입캡 17: press-fit cap
18 : 커넥터  18: connector
100 : 프로세스 챔버 100: process chamber
200 : 가스 세정기  200: gas scrubber
300 : 엘보부재 300: elbow member
400 : 히팅 자켓 400: heating jacket
이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 일 실시예를 상세하게 설명하기로 한다.  Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
도 3은 본 발명의 제 1 실시예에 따른 배기라인용 히팅 파이프의 구조를 도시한 부분 절개 사시도이고, 도 4는 본 발명의 제 1 실시예에 따른 배기라인용 히팅 파이프의 구조를 도시한 단면도이다. 3 is a partial cutaway perspective view showing the structure of the heating pipe for exhaust line according to the first embodiment of the present invention, Figure 4 is a cross-sectional view showing the structure of the heating pipe for exhaust line according to the first embodiment of the present invention to be.
도면에 도시된 바와 같이, 본 발명에 따른 배기라인용 히팅 파이프(10)는 주름관(11), 열선부(12), 내열 절연재(13), 보온재(14, 15)를 포함하여 구성된다. As shown in the figure, the heating pipe 10 for the exhaust line according to the present invention comprises a corrugated pipe 11, the hot wire portion 12, the heat-resistant insulating material 13, the heat insulating material (14, 15).
주름관(11)은 금속 재질의 원통형 파이프로서 다수의 주름이 형성되어 있으며, 양단부에는 프로세스 챔버(100) 및 가스 세정기(200)와의 접속을 위한 플랜지부(16)가 일체로 형성되어 있다.  The corrugated pipe 11 is a cylindrical pipe made of metal, and a plurality of corrugations are formed, and flange portions 16 for connecting to the process chamber 100 and the gas scrubber 200 are integrally formed at both ends.
주름관(11)은 0.3mm 두께의 스테인레스 재질이 사용되었으며, 그 외에 아연도금이나 내열성의 합성수지인 것도 가능하다.  Corrugated pipe 11 is used a 0.3mm thick stainless steel material, in addition to the galvanized or heat-resistant synthetic resin can be.
열선부(12)는 주름관(11)의 외주면에 나선형으로 형성되어 주름관(11)을 가열하여 주름관(11)의 내부 온도를 적정 온도(50 ~ 190℃)로 유지하도록 하는 것이다.  The hot wire portion 12 is spirally formed on the outer circumferential surface of the corrugated pipe 11 to heat the corrugated pipe 11 so as to maintain the internal temperature of the corrugated pipe 11 at an appropriate temperature (50 to 190 ° C.).
열선부(12)는 도 4에 도시된 바와 같이, 열선부는 내부에 수용공간이 형성되고 상기 수용공간의 중앙에 격벽(12c)이 형성된 띠 형상의 케이스부(12a), 격벽(12c)으로 분리된 일측 공간부에 위치하는 (+)극 열선(12b) 및 격벽(12c)으로 분리된 다른 일측 공간부에 위치하는 (-)극 열선(12d)를 포함하여 구성된다.  As shown in FIG. 4, the hot wire part 12 is divided into a band-shaped case part 12a and a partition wall 12c in which a receiving space is formed therein and a partition 12c is formed at the center of the receiving space. It comprises a (+) pole heating wire 12b located in the one side space part, and the (-) pole heating wire 12d located in the other one space part separated by the partition 12c.
격벽(12c)은 2개의 열선 간의 합선을 방지하기 위한 것으로서, 하나의 열선부(12) 내에 두 가닥의 열선이 동시에 설치됨으로써 하나의 커넥터(18)를 통해 전원부(미도시)에 접속될 수 있게 되는 장점이 있다. The partition wall 12c is for preventing a short circuit between two heating wires, and two strands of heating wires are simultaneously installed in one heating wire part 12 so that the partition wall 12c can be connected to a power supply unit (not shown) through one connector 18. It has the advantage of being.
내열 절연재(13)는 열선부의 외측에 위치하는 것으로서 테이프 형상의 석면이 권취된 구조인 것이 바람직하다.  The heat resistant insulating material 13 is located on the outside of the hot wire portion and is preferably a structure in which tape-shaped asbestos is wound.
석면은 섬유상으로 마그네슘이 많은 함수규산염(含水硅酸鹽) 광물로서 불연성, 단열성, 내구성, 내화성, 절연성 등이 뛰어나 전기적 절연을 제공하면서도 주름관(11)의 고온을 견딜 수 있다. Asbestos is a fibrous magnesium-containing hydrous silicate mineral that is excellent in incombustibility, heat insulation, durability, fire resistance, insulation, and the like, and can withstand high temperature of the corrugated pipe 11 while providing electrical insulation.
보온재(14, 15)는 내열 절연층의 외측에 위치하여 열선부(12)에서 제공되는 열이 외부로 유출되는 것을 방지하는 것으로서, 석면 원단으로서 내열 절연재(13)의 표면을 감싸도록 설치되는 제 1 보온층(14) 및 일면에 접착제가 도포되어 접착제가 도포된 일면이 제 1 보온층(14)의 외면에 접착되는 석면 재질의 제 2 보온층(15)을 포함하여 구성된다. The heat insulating members 14 and 15 are positioned outside the heat resistant insulating layer to prevent the heat provided from the hot wire part 12 from leaking to the outside, and are provided to cover the surface of the heat resistant insulating material 13 as asbestos fabric. 1, the insulating layer 14 and one surface is coated with an adhesive, and one surface to which the adhesive is applied includes a second insulating layer 15 made of asbestos material adhered to the outer surface of the first insulating layer 14.
그리고, 주름관(11)의 양 단부 측의 제 2 보온재(15)의 외측에는 링 형상의 압입캡(17)이 압입되어 플랜지부(16)를 견고하게 지지하는 기능을 수행하게 된다. The ring-shaped press-fit cap 17 is press-fitted to the outside of the second heat insulating material 15 on both end sides of the corrugated pipe 11 to perform a function of firmly supporting the flange portion 16.
도 5는 본 발명에 따른 열선부의 권취 구조를 도시한 것이다. 5 illustrates a winding structure of a hot wire unit according to the present invention.
도 5에 도시된 바와 같이, 본 발명에서는 열선부(12)를 주름관(11)의 외주면에 일정한 간격으로 권취하지 않고, 좌측의 가스 입력단으로부터 우측의 가스 출력단으로 갈수록 열선부 간의 간격이 작아지도록 권취하는 것이 특징적인 구성이다. As shown in FIG. 5, the present invention does not wind the heating wires 12 on the outer circumferential surface of the corrugated pipe 11 at regular intervals, and the winding between the heating wires becomes smaller from the gas input end on the left side to the gas output end on the right side. Taking is a characteristic composition.
배기라인의 히팅 파이프(10)는 배기가스에서 파우더가 발생하지 않도록 파이프 내부 온도를 높게 유지하는 것이 매우 중요하며, 이를 위해서는 열선을 매우 조밀한 간격으로 권취하거나 열선에 높은 전압을 인가하여야 하는데 열선을 조밀한 간격으로 권취하는 경우 주름관(11)의 플렉시블한 특성이 감소되고 단가가 높아지는 문제점이 있으며, 열선에 높은 전압을 인가하는 경우 전력 소비가 높고 높은 전압을 인가하더라도 열선의 열용량으로 인해 일정 온도 이상의 가열이 힘든 문제점이 있다. The heating pipe 10 of the exhaust line is very important to maintain the internal temperature of the pipe so that powder does not occur in the exhaust gas, and to do this, the heating wire should be wound at very close intervals or a high voltage should be applied to the heating wire. When winding at close intervals, there is a problem in that the flexible characteristics of the corrugated pipe 11 are reduced and the unit cost is increased.When a high voltage is applied to the hot wire, the power consumption is high and a high voltage is applied even if a high voltage is applied. Heating is difficult.
통상, 프로세스 챔버(100)에서 배출되는 가스는 고온의 가스로서 배기라인을 통해 배출되는 과정에서 온도가 하강하며 낮은 온도에서 파이프의 내벽에 부닺히면서 파우더가 발생되므로, 본 출원인은 이러한 특성을 감안하여 프로세스 챔버(100)로부터 가스가 유입되어 내부 온도가 높은 부분은 열선부(12) 간의 간격을 크게 하고, 후방으로 갈수록 열선부(12)의 간격을 작게 하여 가스의 온도 하강을 효과적으로 방지하는 것이 특징이다. In general, the gas discharged from the process chamber 100 is a high temperature gas, the temperature is lowered in the process of being discharged through the exhaust line and powder is generated while being crushed on the inner wall of the pipe at a low temperature, the present applicant considers such characteristics Thus, the gas is introduced from the process chamber 100 to increase the internal temperature of the hot wire portion 12, and the gap between the hot wire portion 12 toward the rear to effectively prevent the temperature drop of the gas. It is characteristic.
특히, 온도 하강이 많이 일어나고 절곡부분이 아닌 배출구 측에는 열선부(12)를 더욱 촘촘히 권취하여 파우더 발생을 확실하게 방지할 수 있게 된다. In particular, the temperature decreases a lot, and the heating wire portion 12 is wound more tightly on the outlet side instead of the bent portion, thereby making it possible to reliably prevent the generation of powder.
도 6은 본 발명의 제 2 실시예에 따른 반도체 공정의 배기라인 구조를 도시한 것이다. 6 illustrates an exhaust line structure of a semiconductor process according to a second embodiment of the present invention.
도 6에 도시된 바와 같이, 본 발명의 제 2 실시예는 히팅 파이프(10)가 유연성을 갖는 주름관 구조가 아닌 직선관 형태로서 히팅 파이프(10)와 히팅 파이프(10)간의 절곡부위를 엘보부재(300)로 연결하는 구조이다.  As shown in FIG. 6, the second embodiment of the present invention is an elbow member having a bending portion between the heating pipe 10 and the heating pipe 10 as a straight pipe shape rather than a corrugated pipe structure in which the heating pipe 10 is flexible. It is a structure that connects to 300.
히팅 파이프(10)는 제 1 실시예와 같이 열선부(12)에서 제공되는 열이 내열 절연재(13), 보온재(14, 15)에 의해 외부로 유출되지 않고 히팅 파이프(10) 내부 온도를 유지하는 구조이고, 엘보부재(300)는 통상의 엘보부재가 사용되므로 엘보부재(300)의 외주면에 열선이 설치되어 있는 히팅 자켓(400)이 감싸도록 설치되어 있다. The heating pipe 10 maintains the temperature inside the heating pipe 10 without the heat provided from the heating wire part 12 like the first embodiment being discharged to the outside by the heat-resistant insulating material 13 and the heat insulating material 14, 15. The elbow member 300 is installed so that the heating jacket 400 is installed on the outer circumferential surface of the elbow member 300 is wrapped because the elbow member 300 is used.
종래의 경우 히팅 자켓이 직선 관체에만 설치되고 엘보부재에는 설치되지 않은 바, 1차적으로 엘보부재 내의 고온 유지가 어렵고, 길이가 긴 직선 관체 부분에서도 히팅 자켓만으로는 충분한 보온을 유지하지 못하여 관체의 절곡부위에 파우더가 많이 발생하게 되나,  In the conventional case, since the heating jacket is installed only on the straight pipe and not on the elbow member, it is difficult to maintain high temperature in the elbow member primarily, and even in a long straight pipe, the heating jacket alone does not maintain sufficient heat retention, and thus the bending portion of the pipe is not provided. It causes a lot of powder on
본 발명의 제 2 실시예에 의할 경우 히팅 파이프(10)에서 충분한 고온을 유지할 수 있음과 아울러 엘보부재(300)의 외주면에 설치된 히팅 자켓(400)에 의해 관체 내부의 온도를 고온으로 유지할 수 있게 되므로 종래에 비해 파우더 발생이 현저하게 감소된다. According to the second embodiment of the present invention, it is possible to maintain a sufficient high temperature in the heating pipe 10 as well as to maintain the temperature inside the tubular body at a high temperature by the heating jacket 400 installed on the outer circumferential surface of the elbow member 300. Since the powder generation is significantly reduced compared to the conventional.
비록 본 발명이 상기 언급된 바람직한 실시예와 관련하여 설명되어졌지만, 발명의 요지와 범위로부터 벗어남이 없이 다양한 수정이나 변형을 하는 것이 가능하다. 따라서 첨부된 특허청구의 범위는 본 발명의 요지에서 속하는 이러한 수정이나 변형을 포함할 것이다. Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims will cover such modifications and variations as fall within the spirit of the invention.

Claims (5)

  1. 양단부에 플랜지부가 형성된 금속 재질의 파이프; A metal pipe having flange portions at both ends thereof;
    상기 파이프의 외주면에 나선형으로 권취되는 열선부; A hot wire portion spirally wound around the outer circumferential surface of the pipe;
    상기 열선부의 외측에 위치하는 내열 절연재; A heat resistant insulating material positioned outside the hot wire portion;
    상기 내열 절연층의 외측에 위치하는 보온재; 및 An insulating material positioned outside the heat resistant insulating layer; And
    상기 파이프의 양 단부 측의 보온재의 외측에 압입되는 링 형상의 압입캡을 포함하되, Including a ring-shaped press-fit cap press-fitted on the outer side of the heat insulating material on both end sides of the pipe,
    상기 열선부는 내부에 수용공간이 형성되고 상기 수용공간의 중앙에 격벽이 형성된 띠 형상의 케이스부, 상기 격벽으로 분리된 일측 공간부에 위치하는 (+)극 열선 및 상기 격벽으로 분리된 다른 일측 공간부에 위치하는 (-)극 열선을 포함하는 것을 특징으로 하는 배기라인용 히팅 파이프. The hot wire portion has a receiving space formed therein and a strip-shaped case portion in which a partition wall is formed in the center of the receiving space, a (+) pole heating wire positioned at one space portion separated by the partition wall, and the other space separated by the partition wall. A heating pipe for an exhaust line, characterized in that it comprises a negative-pole heating wire located in the portion.
  2. 제 1 항에 있어서, The method of claim 1,
    상기 파이프는 주름관 또는 직선관 중 어느 하나인 것을 특징으로 하는 배기라인용 히팅 파이프. The pipe is a heating pipe for exhaust line, characterized in that any one of the corrugated pipe or straight pipe.
  3. 제 1 항에 있어서, The method of claim 1,
    상기 열선부는 상기 파이프의 가스 입력단으로부터 가스 출력단으로 갈수록 열선부 간의 간격이 작아지도록 권취되는 것을 특징으로 하는 배기라인용 히팅 파이프. The heating wire portion is a heating pipe for the exhaust line, characterized in that the gap between the heating wire portion from the gas input end to the gas output end of the pipe is reduced.
  4. 제 1 항에 있어서, The method of claim 1,
    상기 내열 절연재는 테이프 형상의 석면이 권취되어 형성되는 것을 특징으로 하는 배기라인용 히팅 파이프. The heat-resistant insulating material is a heating pipe for the exhaust line, characterized in that the tape-shaped asbestos is formed by winding.
  5. 제 1 항에 있어서, The method of claim 1,
    상기 보온재는 석면 원단이 상기 내열 절연재의 표면을 감싸도록 설치되는 제 1 보온층; 및 The heat insulating material is asbestos fabric first insulation layer is installed so as to surround the surface of the heat resistant insulating material; And
    일면에 접착제가 도포되어 상기 일면이 상기 제 1 보온층의 외면에 접착되는 석면 재질의 제 2 보온층을 포함하는 것을 특징으로 하는 배기라인용 히팅 파이프. The heating pipe for the exhaust line, characterized in that the adhesive is applied to one surface, the one surface comprises a second insulating layer of asbestos material bonded to the outer surface of the first insulating layer.
PCT/KR2010/005672 2009-09-15 2010-08-25 Heating pipe for an exhaust line, and exhaust line structure for a semiconductor manufacturing process WO2011034293A2 (en)

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KR1020090087134A KR100958112B1 (en) 2009-09-15 2009-09-15 A heating pipe for exchaust line and exchaust line structure of semiconductor production process
KR10-2009-0087134 2009-09-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110800094A (en) * 2017-06-27 2020-02-14 捷易斯路森科技有限公司 Triple tube heating device for exhaust gas heating of semiconductor and liquid crystal display manufacturing process easy to install

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101075170B1 (en) * 2011-02-01 2011-10-19 주식회사 에스엠아이 Heating pipe for exhaust line structure of semiconductor production process
KR101401853B1 (en) * 2012-11-07 2014-05-29 최성귀 Heating pipe for semiconductor manufacturing apparatus
KR101368336B1 (en) 2013-10-25 2014-02-28 주식회사 브이씨알 Discharge line assembly of the semiconductor manufacturing equipment for powder buildup preventing
CN106507514B (en) * 2016-10-21 2020-07-17 北京北方华创微电子装备有限公司 Process pipe exhaust pipeline with heating device and control method
KR102199310B1 (en) * 2020-06-15 2021-01-06 주식회사 컬처플러스 Fine dust measuring apparatus for air quality of interior
KR102195884B1 (en) * 2020-06-15 2020-12-28 주식회사 컬처플러스 Particle measuring instrument aerosol sampler with thermoelectric element
US12024771B2 (en) * 2022-08-01 2024-07-02 M. I Co., Ltd Method for manufacturing de-powder device for piping, and method for installing same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2239556Y (en) * 1995-12-25 1996-11-06 淄博市临淄镭射技术研究所 Multifunctional clad pipe
DE19721555A1 (en) * 1997-05-23 1998-11-26 Ruhrgas Ag Preheater for gas
JP2000024609A (en) 1998-07-15 2000-01-25 Nec Kansai Ltd Piping for gas containing powder
KR200244239Y1 (en) * 1999-02-09 2001-09-25 김경균 Waste gas transfer pipe and waste gas treatment apparatus using the same
KR200366263Y1 (en) * 2004-07-21 2004-11-04 비씨엔씨 주식회사 Flexible exhaust tube
JP4528099B2 (en) * 2004-11-22 2010-08-18 株式会社東京技術研究所 Piping heating structure
JP5128168B2 (en) * 2006-04-24 2013-01-23 三菱電線工業株式会社 Exhaust system
JP2008234939A (en) * 2007-03-19 2008-10-02 Kawai Denki Seisakusho:Kk Coating and heating device
KR101048255B1 (en) * 2007-04-19 2011-07-08 스펜션 엘엘씨 exhaust
CN201206695Y (en) * 2008-06-02 2009-03-11 大庆市红岗区龙腾金属管业制造有限责任公司 Interior heating polyurethane foam jacket pipe
KR100905289B1 (en) * 2008-12-10 2009-06-29 (주)화인 An apparatus for heating an exhaust pipe of semiconductor production process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110800094A (en) * 2017-06-27 2020-02-14 捷易斯路森科技有限公司 Triple tube heating device for exhaust gas heating of semiconductor and liquid crystal display manufacturing process easy to install

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CN102022601A (en) 2011-04-20

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