WO2011014328A3 - Light-up prevention in electrostatic chucks - Google Patents
Light-up prevention in electrostatic chucks Download PDFInfo
- Publication number
- WO2011014328A3 WO2011014328A3 PCT/US2010/040284 US2010040284W WO2011014328A3 WO 2011014328 A3 WO2011014328 A3 WO 2011014328A3 US 2010040284 W US2010040284 W US 2010040284W WO 2011014328 A3 WO2011014328 A3 WO 2011014328A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- subterranean
- base plate
- electrically conductive
- electrostatic chuck
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012522844A JP2013500605A (en) | 2009-07-30 | 2010-06-29 | Ignition prevention in electrostatic chuck |
EP10804865A EP2460179A4 (en) | 2009-07-30 | 2010-06-29 | Light-up prevention in electrostatic chucks |
CN2010800327935A CN102473672A (en) | 2009-07-30 | 2010-06-29 | Light-up prevention in electrostatic chucks |
SG2012001616A SG177584A1 (en) | 2009-07-30 | 2010-06-29 | Light-up prevention in electrostatic chucks |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/512,520 | 2009-07-30 | ||
US12/512,520 US20110024049A1 (en) | 2009-07-30 | 2009-07-30 | Light-up prevention in electrostatic chucks |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011014328A2 WO2011014328A2 (en) | 2011-02-03 |
WO2011014328A3 true WO2011014328A3 (en) | 2011-05-05 |
Family
ID=43525875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/040284 WO2011014328A2 (en) | 2009-07-30 | 2010-06-29 | Light-up prevention in electrostatic chucks |
Country Status (8)
Country | Link |
---|---|
US (1) | US20110024049A1 (en) |
EP (1) | EP2460179A4 (en) |
JP (1) | JP2013500605A (en) |
KR (1) | KR20120048578A (en) |
CN (1) | CN102473672A (en) |
SG (2) | SG10201404264RA (en) |
TW (1) | TW201118979A (en) |
WO (1) | WO2011014328A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8336891B2 (en) * | 2008-03-11 | 2012-12-25 | Ngk Insulators, Ltd. | Electrostatic chuck |
US8937800B2 (en) * | 2012-04-24 | 2015-01-20 | Applied Materials, Inc. | Electrostatic chuck with advanced RF and temperature uniformity |
JP6139249B2 (en) * | 2013-04-26 | 2017-05-31 | 京セラ株式会社 | Sample holder |
US9666466B2 (en) * | 2013-05-07 | 2017-05-30 | Applied Materials, Inc. | Electrostatic chuck having thermally isolated zones with minimal crosstalk |
JP5811513B2 (en) | 2014-03-27 | 2015-11-11 | Toto株式会社 | Electrostatic chuck |
WO2015194031A1 (en) * | 2014-06-20 | 2015-12-23 | 株式会社ユーテック | Plasma cvd device and method for producing magnetic recording medium |
US10770270B2 (en) | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
US10535505B2 (en) * | 2016-11-11 | 2020-01-14 | Lam Research Corporation | Plasma light up suppression |
US10741425B2 (en) * | 2017-02-22 | 2020-08-11 | Lam Research Corporation | Helium plug design to reduce arcing |
US10916416B2 (en) * | 2017-11-14 | 2021-02-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer with modified surface and fabrication method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940020497A (en) * | 1993-02-16 | 1994-09-16 | 이노우에 아키라 | PLASMA PROCESSING APPARATUS |
KR19980022560A (en) * | 1996-09-23 | 1998-07-06 | 김광호 | Semiconductor Wafer Heat Treatment Equipment |
KR20020031290A (en) * | 2000-10-23 | 2002-05-01 | 시바타 마사하루 | Susceptors for semiconductor-producing apparatuses |
KR20030010824A (en) * | 2001-07-27 | 2003-02-06 | 삼성전자주식회사 | Bake equipment having a temperature compensation system |
KR20070072233A (en) * | 2005-12-31 | 2007-07-04 | 주식회사 아이피에스 | A susceptor for depositing thin film chamber |
KR20090035309A (en) * | 2007-10-05 | 2009-04-09 | 주식회사 실트론 | Manufacturing method and apparatus for epitaxial single-crystal substrate |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6059104B2 (en) * | 1982-02-03 | 1985-12-23 | 株式会社東芝 | electrostatic chuck board |
US5729423A (en) * | 1994-01-31 | 1998-03-17 | Applied Materials, Inc. | Puncture resistant electrostatic chuck |
JPH08507196A (en) * | 1994-01-31 | 1996-07-30 | アプライド マテリアルズ インコーポレイテッド | Electrostatic chuck with conformal insulator film |
US6141203A (en) * | 1994-03-03 | 2000-10-31 | Sherman; Arthur | Electrostatic chuck |
DE69524332T2 (en) * | 1994-09-19 | 2002-06-13 | Matsushita Electric Ind Co Ltd | Device for three-dimensional image reproduction |
US5583736A (en) * | 1994-11-17 | 1996-12-10 | The United States Of America As Represented By The Department Of Energy | Micromachined silicon electrostatic chuck |
US5644467A (en) * | 1995-09-28 | 1997-07-01 | Applied Materials, Inc. | Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck |
US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
JP2000003953A (en) * | 1998-06-15 | 2000-01-07 | Foi:Kk | Electrostatic chuck |
KR20010046528A (en) * | 1999-11-12 | 2001-06-15 | 윤종용 | Structure for cooling of electro static chuck |
US6606234B1 (en) * | 2000-09-05 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow |
US6422775B1 (en) * | 2001-03-23 | 2002-07-23 | Intel Corporation | Digital messaging pen |
TWI234417B (en) * | 2001-07-10 | 2005-06-11 | Tokyo Electron Ltd | Plasma procesor and plasma processing method |
JP4219927B2 (en) * | 2003-03-19 | 2009-02-04 | 東京エレクトロン株式会社 | Substrate holding mechanism, manufacturing method thereof, and substrate processing apparatus |
KR100505035B1 (en) * | 2003-11-17 | 2005-07-29 | 삼성전자주식회사 | Electrostatic chuck for supporting a substrate |
JP4413667B2 (en) * | 2004-03-19 | 2010-02-10 | 日本特殊陶業株式会社 | Electrostatic chuck |
US7667944B2 (en) * | 2007-06-29 | 2010-02-23 | Praxair Technology, Inc. | Polyceramic e-chuck |
-
2009
- 2009-07-30 US US12/512,520 patent/US20110024049A1/en not_active Abandoned
-
2010
- 2010-06-29 JP JP2012522844A patent/JP2013500605A/en active Pending
- 2010-06-29 WO PCT/US2010/040284 patent/WO2011014328A2/en active Application Filing
- 2010-06-29 SG SG10201404264RA patent/SG10201404264RA/en unknown
- 2010-06-29 SG SG2012001616A patent/SG177584A1/en unknown
- 2010-06-29 CN CN2010800327935A patent/CN102473672A/en active Pending
- 2010-06-29 KR KR1020127002270A patent/KR20120048578A/en not_active Application Discontinuation
- 2010-06-29 EP EP10804865A patent/EP2460179A4/en not_active Withdrawn
- 2010-07-27 TW TW099124694A patent/TW201118979A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940020497A (en) * | 1993-02-16 | 1994-09-16 | 이노우에 아키라 | PLASMA PROCESSING APPARATUS |
KR19980022560A (en) * | 1996-09-23 | 1998-07-06 | 김광호 | Semiconductor Wafer Heat Treatment Equipment |
KR20020031290A (en) * | 2000-10-23 | 2002-05-01 | 시바타 마사하루 | Susceptors for semiconductor-producing apparatuses |
KR20030010824A (en) * | 2001-07-27 | 2003-02-06 | 삼성전자주식회사 | Bake equipment having a temperature compensation system |
KR20070072233A (en) * | 2005-12-31 | 2007-07-04 | 주식회사 아이피에스 | A susceptor for depositing thin film chamber |
KR20090035309A (en) * | 2007-10-05 | 2009-04-09 | 주식회사 실트론 | Manufacturing method and apparatus for epitaxial single-crystal substrate |
Also Published As
Publication number | Publication date |
---|---|
SG177584A1 (en) | 2012-02-28 |
KR20120048578A (en) | 2012-05-15 |
EP2460179A2 (en) | 2012-06-06 |
US20110024049A1 (en) | 2011-02-03 |
SG10201404264RA (en) | 2014-10-30 |
CN102473672A (en) | 2012-05-23 |
JP2013500605A (en) | 2013-01-07 |
TW201118979A (en) | 2011-06-01 |
EP2460179A4 (en) | 2012-06-06 |
WO2011014328A2 (en) | 2011-02-03 |
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