WO2011013455A1

WO2011013455A1 - Illumination device, display device, and television receiving device

Info

Publication number: WO2011013455A1
Application number: PCT/JP2010/060093
Authority: WO
Inventors: 泰守黒水
Original assignee: シャープ株式会社
Priority date: 2009-07-29
Filing date: 2010-06-15
Publication date: 2011-02-03

Abstract

Disclosed is a backlight device (12) comprised of an LED (17) as a light source, a LED substrate (18) on which the LED (17) is mounted, a chassis (14) which contains the LED substrate (18) and has an attachment hole (14), a main body portion (24) which can sandwich and retain the LED substrate (18) together with the chassis (14), and a substrate retaining member (20) having an attachment portion (25) which is projected from the main body portion (24) toward the chassis (14) and is inserted into the attachment hole (14e). The attachment portion (25) has a sandwiching portion (25b) which can sandwich at least the chassis (14) together with the main body portion (24) in accordance with the movement of the substrate retaining member (20) in a direction along the plate surface of the chassis (14) while the attachment portion (25) is inserted into the attachment hole (14e).

Description

Lighting device, display device, and television receiver

The present invention relates to a lighting device, a display device, and a television receiver.

For example, since a liquid crystal panel used for a liquid crystal display device such as a liquid crystal television does not emit light, a backlight device is separately required as a lighting device. The backlight device is installed on the back side of the liquid crystal panel (on the side opposite to the display surface). The chassis has an open surface on the liquid crystal panel side, a light source accommodated in the chassis, A reflection sheet that is disposed along the inner surface and reflects light toward the opening of the chassis, and an optical member that is disposed at the opening of the chassis and efficiently emits light emitted from the light source toward the liquid crystal panel (a diffusion sheet) Etc.). Among the components of the backlight device described above, for example, an LED may be used as a light source. In that case, an LED substrate on which the LED is mounted is accommodated in the chassis.
In addition, what was described in following patent document 1 is known as an example of the backlight apparatus which used LED as a light source.

JP 2007-317423 A

(Problems to be solved by the invention)
By the way, when fixing the LED board to the chassis in a mounting state, screws are generally used, and when attaching or detaching the LED board to or from the chassis, it is necessary to work to attach or detach the screws. There is. However, when the fixing method by screwing is adopted, the workability of attaching / detaching the screw itself is not good, and it is necessary to use a large number of screws to stably fix the LED substrate. There is a problem that the number of parts increases and the number of operations for attaching and detaching screws increases, and workability is likely to deteriorate. In particular, as the number of LED substrates used increases with the increase in the screen size of liquid crystal display devices, the number of screws used and the number of screw attachment / detachment operations tend to increase further. .

The present invention has been completed based on the above-described circumstances, and aims to improve workability.

(Means for solving the problem)
The illuminating device of the present invention can be held by sandwiching the light source substrate between the light source, the light source substrate on which the light source is mounted, the chassis in which the light source substrate is accommodated and having a mounting hole, and the chassis. And a substrate holding member having a mounting portion that protrudes from the main body portion toward the chassis side and is inserted into the mounting hole, and the mounting portion is inserted into the mounting hole. As the holding member is moved in the direction along the plate surface of the chassis, the holding member has a holding part capable of holding at least the chassis with the main body part.

In this way, in order to attach the light source board to the chassis, with the light source board accommodated in the chassis, the board holding member mounting portion is inserted into the chassis mounting hole, and the board holding member is mounted on the chassis plate surface. When the substrate holding member is moved in the direction along, the substrate holding member is held in the attached state with respect to the chassis by at least the chassis being sandwiched between the main body portion and the clamping portion of the attaching portion. In this state, the light source substrate is held between the main body and the chassis so as to be attached to the chassis. On the other hand, when removing the light source board from the chassis, by moving the board holding member in the direction along the plate surface of the chassis and in the opposite direction to the time of attachment, releasing the clamping state of the chassis by the clamping part, The board holding member is removed from the chassis. Thereby, since the holding state of the light source substrate by the substrate holding member is released, the light source substrate can be removed from the chassis.

Conventionally, since the light source substrate is screwed, the workability of the work itself for attaching and detaching the screw tended to deteriorate easily, but according to the present invention, the substrate holding member is By performing the operation of moving in the direction along the plate surface of the chassis, it is easy to hold the light source substrate by the substrate holding member and to release the holding state. It is considered good.

By the way, since the substrate holding member according to the present invention holds the light source substrate between the chassis and the chassis, for example, the light source mounted on the light source substrate is defective and the light source substrate can be replaced or repaired. When necessary, it is necessary to remove the substrate holding member and the light source substrate from the chassis. For example, in the lamp clip holding the cold cathode tube, the substrate holding member is only required to be removed. It is said that the frequency of the removal work is increased. Further, since the number of use of the light source substrate tends to increase as the lighting device increases in size, the number of substrate holding members used and the number of attaching / detaching operations increase as the size increases. The From the above circumstances, by improving the workability at the time of attaching and detaching the substrate holding member that holds the light source substrate, the workability when repairing the lighting device and the workability when the lighting device is increased in size. It can be significantly improved.

The following configuration is preferable as an embodiment of the present invention.
(1) The light source substrate has a longitudinal shape and a plurality of the light sources are mounted side by side along the long side direction, whereas the mounting hole is a longitudinal length parallel to the long side direction of the light source substrate. The movement direction of the substrate holding member coincides with the long side direction of the light source substrate and the mounting hole. In this case, the light source substrate can be held or released by moving the substrate holding member along the long side direction of the light source substrate and the mounting hole.

(2) The said clamping part can clamp the said light source board with the said chassis between the said main-body parts. In this way, the light source substrate is sandwiched with the chassis between the main body portion and the sandwiching portion, so that the light source substrate can be more stably held. If the holding state in the light source substrate is stabilized, for example, heat transfer from the light source substrate to the chassis can be improved and heat dissipation characteristics can be improved, so that the light emission efficiency of the light source can be maintained high.

(3) The mounting portion is disposed at a position overlapping the light source substrate in a plan view, whereas the light source substrate has a through hole that communicates with the mounting hole and through which the mounting portion is passed. The edge part of the through-hole is clamped with the said chassis between the said main-body part and the said clamping part. In this way, since the edge of the through hole in the light source substrate is sandwiched between the main body and the sandwiching portion together with the chassis, the light source substrate can be more stably held.

(4) Whereas the wiring pattern for connecting the light sources extends along the long side direction on the light source substrate, the through hole is long in the light source substrate and the mounting hole. It has a longitudinal shape parallel to the side direction. In this case, since the through hole has a longitudinal shape parallel to the long side direction of the light source substrate and the mounting hole, that is, the extending direction of the wiring pattern, the through hole is assumed to be orthogonal to the extending direction of the wiring pattern. Compared to the case of forming a longitudinal shape, the short side dimension of the light source substrate can be reduced in forming the through hole and the wiring pattern in the light source substrate. Thereby, the material cost in the light source substrate can be reduced, and the arrangement space of the light source substrate in the chassis can be reduced.

(5) The mounting portion can be brought into contact with an edge portion of the through hole. In this way, the light source substrate can be positioned with respect to the substrate holding member by bringing the attachment portion into contact with the edge of the through hole.

(6) The main body has a longitudinal shape parallel to the long side direction of the light source substrate. According to this configuration, since the main body portion that holds the light source substrate between the holding portion and the holding portion has a longitudinal shape parallel to the long side direction of the light source substrate, the light source substrate can be more stably held. .

(7) The said main-body part is distribute | arranged to the position which becomes concentric about the short side direction with respect to the said light source substrate. In this way, the main body portion that holds the light source substrate between the holding portion and the holding portion is disposed at a position that is concentric with respect to the light source substrate in the short side direction. Can be held.

(8) The clamping portion has a longitudinal shape parallel to the long side direction of the light source substrate. According to this configuration, since the sandwiching portion that sandwiches the chassis and the light source substrate with the main body has a longitudinal shape parallel to the long side direction of the light source substrate, the light source substrate can be more stably held. .

(9) The main body is disposed in a region between the adjacent light sources in the light source substrate as viewed in a plan view. If it does in this way, the field between adjacent light sources among light source boards can be used effectively.

(10) The main body is disposed at an intermediate position between the light sources adjacent to each other in the light source substrate in a plan view. In this way, since the distance to each light source adjacent to the main body is substantially equal, the optical influence of the main body on the light emitted from each light source can be made substantially equal. Thereby, unevenness is less likely to occur in the emitted light in the illumination device.

(11) While the light source substrate has a longitudinal shape and a plurality of the light sources are mounted side by side along the long side direction, the mounting hole is a longitudinal direction parallel to the short side direction of the light source substrate. The movement direction in the said board | substrate holding member corresponds with the short side direction in the said light source board | substrate. If it does in this way, a light source board | substrate can be hold | maintained or a holding | maintenance state can be cancelled | released by moving a board | substrate holding member along the short side direction in a light source board | substrate.

(12) The main body is disposed in a region between the adjacent light sources in the light source substrate as viewed in a plan view. If it does in this way, the field between adjacent light sources among light source boards can be used effectively. Here, since the movement direction of the substrate holding member is the short side direction of the light source substrate, that is, the direction orthogonal to the arrangement direction of the light sources, the area between the adjacent light sources is secured at least as large as the dimensions of the main body. If so, the substrate holding member can be attached. That is, it is suitable when the arrangement pitch of the light sources is narrow.

(13) Whereas a plurality of the light source boards are arranged in parallel in the short side direction of the light source board in the chassis, the mounting hole and the mounting portion are connected to the light source board in a plan view. Are arranged at positions where they do not overlap. In this way, it is not necessary to form a hole through which the attachment portion is passed through the light source substrate, so that the manufacturing cost of the light source substrate can be reduced. Further, it is advantageous in forming a wiring pattern for connecting the light sources to each other on the light source substrate.

(14) While the plurality of light source boards are arranged in parallel in the short side direction of the light source board in the chassis, the main body is arranged to straddle the plurality of light source boards. . In this way, a plurality of light source substrates can be collectively held by one substrate holding member. As compared with the case where each light source substrate is individually held by the substrate holding member, the number of substrate holding members used and the number of attaching / detaching operations thereof can be reduced, so that the workability can be further improved.

(15) The clamping unit can clamp the light source substrate together with the chassis between the body unit. In this way, the light source substrate is sandwiched with the chassis between the main body portion and the sandwiching portion, so that the light source substrate can be more stably held. If the holding state in the light source substrate is stabilized, for example, heat transfer from the light source substrate to the chassis can be improved and heat dissipation characteristics can be improved, so that the light emission efficiency of the light source can be maintained high.

(16) A reflection member that reflects light is interposed between the main body and the light source substrate, and protrudes toward the reflection member on a surface facing the reflection member in the main body, An abutting portion that abuts against the reflecting member is provided. If it does in this way, a reflective member can be held with a light source substrate. Since the contact portion that contacts the reflecting member protrudes from the main body portion toward the reflecting member, the surface facing the reflecting member in the main body portion is in contact with the reflecting member over the entire area. As compared with, the contact area of the substrate holding member with respect to the reflecting member can be reduced. In other words, the reflective member is not in contact with the substrate holding member, and the area of the portion that is not pressed by the substrate holding member increases. This unpressed portion is more easily expanded and contracted when thermal expansion or contraction occurs due to a change in the thermal environment, compared to the portion pressed by the substrate holding member. And if the area of this unpressed part increases, the degree of freedom of expansion and contraction will increase as a whole reflecting member, so that deformation such as bending and warping accompanying expansion and contraction is suppressed from being locally revealed. Can do.

(17) The contact portion is disposed at a position away from the attachment portion in the main body portion. In this way, when a dimensional error occurs in manufacturing the substrate holding member, for example, when the protruding dimension of the abutting portion from the main body becomes larger than the set value, the pressing force acting on the reflecting member May become excessively large. Even in such a case, since the contact portion is arranged at a position away from the attachment portion in the main body portion, the pressing force that can be increased by elastically deforming the portion of the main body portion from the attachment portion to the contact portion. Can be absorbed. Thereby, it is possible to prevent an excessive pressing force from acting on the reflecting member from the abutting portion, thereby ensuring a degree of freedom of expansion and contraction in the reflecting member.

(18) The attachment portion is disposed on the center side of the main body portion, whereas the contact portion is disposed on an outer edge portion of the main body portion. If it does in this way, a board | substrate holding member can be stably hold | maintained with respect to a chassis by arranging an attaching part in the center side in a main-body part. In addition, by arranging the contact portion on the outer edge portion of the main body portion, it is possible to secure the maximum distance between the mounting portion and the contact portion, and to make the main body portion more easily elastically deformed. Become. Thereby, the absorption width of the dimensional error produced when manufacturing a board | substrate holding member can be raised, and, thereby, the freedom degree of expansion / contraction in a reflection member can be ensured more stably.

(19) At least one pair of the contact portions is arranged at a position sandwiching the attachment portion in the main body portion. If it does in this way, pressing force can be made to act with sufficient balance to a reflective member, and it becomes possible to hold a reflective member appropriately, raising the flexibility of expansion and contraction of a reflective member. Further, the main body portion can be elastically deformed into an arcuate shape between the pair of contact portions.

(20) The contact portion is arranged at a symmetrical position with the attachment portion as a center. In this way, the pressing force can be applied to the reflecting member in a more balanced manner.

(21) The sandwiching portion has a cantilever shape extending along the moving direction of the substrate holding member and is elastically deformable. In this way, as the substrate holding member is moved, at least the chassis is clamped between the main body portion and the clamping portion of the mounting portion, so that the clamping portion can be elastically deformed. It is possible to hold the chassis elastically while being excellent in performance.

(22) The chassis and the sandwiching portion are each provided with a locking structure that locks the substrate holding member to restrict movement of the substrate holding member in the direction along the plate surface of the chassis. In this way, the substrate holding member is prevented from being moved inadvertently, so that the holding state with respect to the light source substrate can be stably maintained. Moreover, since the clamping part can be elastically deformed, the operation of locking the locking structure or releasing the locked state can be easily performed, and the workability is excellent.

(23) The locking structure includes: a locking hole formed in the chassis; and a locking protrusion that protrudes from the clamping portion toward the chassis and can be locked to a hole edge of the locking hole. It is composed of If it does in this way, the movement of a board | substrate holding member can be controlled by making the latching protrusion by the side of a clamping part approach in the latching hole by the side of a chassis, and making it latch to a hole edge.

(24) The mounting portion is formed so as to be smaller than the mounting hole in a plan view. If it does in this way, the operation | work which inserts / extracts an attachment part with respect to an attachment hole can be performed easily, and it is excellent in workability | operativity.

(25) The main body is provided with a protrusion that protrudes on the opposite side of the chassis. In this way, when attaching / detaching the substrate holding member to / from the chassis, the operator can perform attachment / detachment work by grasping the protrusion protruding from the main body portion to the side opposite to the chassis side. . Thereby, workability | operativity at the time of attaching or detaching a board | substrate holding member can be improved further.

(26) The protrusion is disposed at a position overlapping the attachment portion when seen in a plane. In this way, when the worker performs the mounting operation of the substrate holding member while gripping the protrusion, the position of the mounting portion can be easily grasped, so that the workability is excellent.

(27) The protrusion is arranged at a position that is concentric with the attachment portion. In this way, workability can be further improved.

(28) The chassis is provided with an optical member arranged to cover the opening so as to face the light source substrate, while an opening for emitting light from the light source is provided. The protrusion is capable of supporting the optical member. If it does in this way, it can control that an optical member deforms so that it may approach the light source side by supporting an optical member with a projection.

(29) A plurality of the substrate holding members are arranged in a distributed manner at positions sandwiching a reference line crossing substantially the center of the chassis in the chassis, and the substrate disposed at a position sandwiching the reference line The holding member is set so that the moving directions accompanying the attachment to the chassis are opposite to each other. In this way, when performing the work of attaching the board holding member to the chassis, the work of attaching the work to each area in the chassis is shared with the reference line as a boundary, and the work instruction content to each worker is shared. It is possible to make it. Thereby, the working efficiency can be improved.

(30) The light source is an LED. In this way, high brightness and low power consumption can be achieved.

Next, in order to solve the above problem, a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.

According to such a display device, the illuminating device that supplies light to the display panel is excellent in workability when the light source substrate is attached and detached, so that it is possible to reduce the manufacturing cost. .

A liquid crystal panel can be exemplified as the display panel. Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.

(The invention's effect)
According to the present invention, workability can be improved.

1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention. The exploded perspective view which shows schematic structure of the liquid crystal display device with which a television receiver is equipped The top view which shows the arrangement configuration of the LED board and board | substrate holding member in the chassis with which a liquid crystal display device is equipped. Sectional view taken along line iv-iv in FIG. 3 in the liquid crystal display device 3 is a cross-sectional view taken along the line vv in FIG. The top view which shows the detailed arrangement structure of a LED board and a board | substrate holding member Vii-vii sectional view of FIG. Viii-viii sectional view of FIG. Sectional view taken along line ix-ix in FIG. Plan view of LED board The top view which shows the state (light source unit) which attached the reflective sheet for substrates, and the diffusion lens to the LED substrate Plan view of substrate holding member Bottom view of substrate holding member FIG. 6 is a sectional view taken along the line vii-vii in FIG. 6 showing a state before the board holding member is attached to the chassis. FIG. 6 is a cross-sectional view taken along the line vii-vii in FIG. FIG. 6 is a cross-sectional view taken along the line vii-vii in FIG. The bottom view which shows the board | substrate holding member which concerns on the modification 1 of Embodiment 1. FIG. Sectional drawing which shows the state before attaching a board | substrate holding member to a chassis The top view which shows arrangement | positioning in the chassis of the board | substrate holding member which concerns on Embodiment 2 of this invention. Xx-xx line sectional view of FIG. Sectional drawing which shows the state which attached the board | substrate holding member which concerns on the modification 1 of Embodiment 2 to the chassis. The top view which shows arrangement | positioning in the chassis of the board | substrate holding member which concerns on the modification 2 of Embodiment 2. FIG. Xxiii-xxiii sectional view of FIG. The top view which shows the arrangement configuration of the LED board in the chassis which concerns on the modification 3 of Embodiment 2, and a board | substrate holding member. The top view which shows the detailed arrangement structure of a LED board and a board | substrate holding member

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the liquid crystal display device 10 is illustrated. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing. Moreover, let the upper side shown in FIG.4 and FIG.5 be a front side, and let the lower side of the figure be a back side.

As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, a tuner T, And a stand S. The liquid crystal display device (display device) 10 has a horizontally long rectangular shape (rectangular shape) as a whole and is accommodated in a vertically placed state. As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device (illumination device) 12 that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained. In this embodiment, the screen size is 42 inches and the aspect ratio is 16: 9.

Next, the liquid crystal panel 11 and the backlight device 12 constituting the liquid crystal display device 10 will be described sequentially. Among these, the liquid crystal panel (display panel) 11 has a rectangular shape in plan view, and a pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is said. One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. The substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film. A polarizing plate is disposed on the outside of both substrates.

Subsequently, the backlight device 12 will be described in detail. As shown in FIG. 2, the backlight device 12 covers the chassis 14 having a substantially box shape having an opening 14 b on the light emitting surface side (the liquid crystal panel 11 side), and the opening 14 b of the chassis 14. A group of optical members 15 (diffusion plate (light diffusion member) 15a and a plurality of optical sheets 15b arranged between the diffusion plate 15a and the liquid crystal panel 11), and an optical member disposed along the outer edge of the chassis 14. And a frame 16 that holds the outer edge portion of the group of members 15 between the chassis 14 and the chassis 14. Further, in the chassis 14, as shown in FIGS. 3 to 5, an LED 17 (Light ある Emitting Diode) as a light source, an LED board 18 on which the LED 17 is mounted, and the LED board 18 corresponding to the LED 17. And a diffusing lens 19 attached to the position. In addition, the chassis 14 includes a board holding member 20 that can hold the LED board 18 between the chassis 14 and a reflection sheet 21 that reflects the light in the chassis 14 toward the optical member 15. It is done. In the backlight device 12, the optical member 15 side is the light emission side from the LED 17. Below, each component of the backlight apparatus 12 is demonstrated in detail.

The chassis 14 is made of metal and, as shown in FIGS. 3 to 5, has a rectangular bottom plate 14a similar to the liquid crystal panel 11, a side plate 14c rising from an outer end of each side of the bottom plate 14a, and each side plate 14c. And a receiving plate 14d projecting outward from the rising edge, and as a whole, has a shallow substantially box shape (substantially shallow dish shape) opened toward the front side. The long side direction of the chassis 14 coincides with the X-axis direction (horizontal direction), and the short side direction coincides with the Y-axis direction (vertical direction). A frame 16 and an optical member 15 to be described below can be placed on each receiving plate 14d in the chassis 14 from the front side. A frame 16 is screwed to each receiving plate 14d. An attachment hole 14e for attaching the substrate holding member 20 is provided in the bottom plate 14a of the chassis 14 so as to open. A plurality of mounting holes 14e are dispersedly arranged corresponding to the mounting position of the substrate holding member 20 on the bottom plate 14a. The detailed shape of the mounting hole 14e will be described later.

As shown in FIG. 2, the optical member 15 has a horizontally long rectangular shape (rectangular shape) in a plan view, like the liquid crystal panel 11 and the chassis 14. As shown in FIGS. 4 and 5, the optical member 15 has its outer edge portion placed on the receiving plate 14 d so as to cover the opening 14 b of the chassis 14 and be interposed between the liquid crystal panel 11 and the LED 17. Arranged. The optical member 15 includes a diffusion plate 15a disposed on the back side (the side opposite to the LED 17 side and the light emitting side) and an optical sheet 15b disposed on the front side (the liquid crystal panel 11 side and the light emitting side). . The diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a substantially transparent resin base material having a predetermined thickness, and has a function of diffusing transmitted light. The optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and two optical sheets 15b are stacked (FIGS. 7 to 9). Specific types of the optical sheet 15b include, for example, a diffusion sheet, a lens sheet, a reflective polarizing sheet, and the like, which can be appropriately selected and used.

As shown in FIG. 2, the frame 16 has a frame shape along the outer peripheral edge portions of the liquid crystal panel 11 and the optical member 15. An outer edge portion of the optical member 15 can be sandwiched between the frame 16 and each receiving plate 14d (FIGS. 4 and 5). The frame 16 can receive the outer edge portion of the liquid crystal panel 11 from the back side, and can sandwich the outer edge portion of the liquid crystal panel 11 with the bezel 13 disposed on the front side (FIGS. 4 and 5). ).

Next, the LED 17 and the LED board 18 on which the LED 17 is mounted will be described in detail. As shown in FIGS. 7, 8, and 10, the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 18. The LED chip mounted on the substrate unit has one main emission wavelength, and specifically, one that emits blue light in a single color is used. On the other hand, a phosphor that converts blue light emitted from the LED chip into white light is dispersed and blended in the resin material for sealing the LED chip. As a result, the LED 17 can emit white light. The LED 17 is a so-called top type in which a surface opposite to the mounting surface with respect to the LED substrate 18 is a light emitting surface. The optical axis LA of the LED 17 is set to substantially coincide with the Z-axis direction (direction orthogonal to the main plate surfaces of the liquid crystal panel 11 and the optical member 15). Note that the light emitted from the LED 17 spreads radially to some extent within a predetermined angle range around the optical axis LA, but its directivity is higher than that of a cold cathode tube or the like. In other words, the light emission intensity of the LED 17 shows an angular distribution in which the direction along the optical axis LA is remarkably high and decreases rapidly as the tilt angle with respect to the optical axis LA increases.

As shown in FIG. 10, the LED substrate 18 has a base material that has a rectangular shape (longitudinal shape) in plan view, the long side direction coincides with the X axis direction, and the short side direction corresponds to the Y axis direction. Are accommodated in the chassis 14 while extending along the bottom plate 14a (FIG. 3). The base material of the LED substrate 18 is made of a metal such as an aluminum material same as that of the chassis 14, and a wiring pattern WP made of a metal film such as a copper foil is formed on the surface of the base material via an insulating layer. In addition, as a material used for the base material of LED board 18, insulating materials, such as a ceramic, can also be used. Of the plate surfaces of the base material of the LED substrate 18, the surface facing the front side (the surface facing the optical member 15 side) has the above-described configuration as shown in FIGS. The LED 17 is surface mounted. A plurality of the LEDs 17 are linearly arranged in parallel along the long side direction (X-axis direction) of the LED substrate 18, and are connected in series by a wiring pattern WP formed on the LED substrate 18. The arrangement pitch of the LEDs 17 is substantially constant, that is, it can be said that the LEDs 17 are arranged at equal intervals. The wiring pattern WP is configured to extend along the X-axis direction on the LED substrate 18, that is, along the long side direction of the LED substrate 18 and the arrangement direction of the LEDs 17. A pair of wiring patterns WP are arranged in parallel with each other at a predetermined interval corresponding to the anode and the cathode in the LED chip of the LED 17. Moreover, the connector part 18a connected to the both ends of the wiring pattern WP is provided in the both ends of the long side direction in the LED board 18. As shown in FIG.

As shown in FIG. 3, the LED substrate 18 having the above-described configuration is arranged in parallel in the chassis 14 in a state where the long side direction and the short side direction are aligned with each other in the X-axis direction and the Y-axis direction. ing. That is, the LED board 18 and the LED 17 mounted thereon are both set in the X-axis direction (the long side direction of the chassis 14 and the LED board 18) in the chassis 14 and in the Y-axis direction (of the chassis 14 and the LED board 18). Matrix arrangement (arranged in a matrix) with the short side direction as the column direction. Specifically, a total of 27 LED substrates 18 are arranged in parallel in the chassis 14, three in the X-axis direction and nine in the Y-axis direction. In the present embodiment, two types of LED substrates 18 having different long side dimensions and the number of mounted LEDs 17 are used. Specifically, as the LED substrate 18, six LEDs 17 are mounted, and the long side dimension is a relatively long six-part mounting type and the five LEDs 17 are mounted, and the long side dimension is relatively long. The short five-mount type is used, one for the six-mount type at the X-axis direction end position of the chassis 14 and one for the five-mount type at the central position in the same direction. , Each is arranged. As described above, the LED boards 18 that form one row along the X-axis direction are electrically connected to each other by fitting and connecting the adjacent connector portions 18a to each other. Connector portions 18a corresponding to both ends in the X-axis direction are electrically connected to external control circuits (not shown). As a result, the LEDs 17 arranged on the LED boards 18 in one row are connected in series, and the lighting / extinction of a large number of LEDs 17 included in the row is collectively controlled by a single control circuit. Therefore, it is possible to reduce the cost. In addition, even if it is a kind of LED board 18 from which the long side dimension and the number of LED17 mounted differ, the short side dimension and the arrangement pitch of LED17 are made substantially the same.

In this way, by preparing a plurality of types of LED substrates 18 having different long side dimensions and the number of LEDs 17 to be mounted, and employing a method of appropriately combining and using these different types of LED substrates 18, the following effects can be obtained. Obtainable. That is, when manufacturing various types of liquid crystal display devices 10 having different screen sizes, it is easy to change the appropriateness of the use of each type of LED board 18 and the number of LED boards 18 used for each type according to each screen size. Compared to the case where a specially designed LED board having a long side dimension equivalent to the long side dimension of the chassis 14 is prepared for each screen size, the number of types of LED boards 18 required is greatly reduced. Therefore, the manufacturing cost can be reduced. Specifically, in addition to the above-described two types of LED boards 18 (5 mounted type and 6 mounted type), an 8 mounted type mounted with 8 LEDs 17 is added. By using various types of LED substrates 18 in an appropriate combination, each liquid crystal display device 10 having a screen size of, for example, 26 inches, 32 inches, 37 inches, 40 inches, 42 inches, 46 inches, 52 inches, and 65 inches is used. Therefore, it is possible to easily cope with the manufacture at a low cost.

The diffusing lens 19 is made of a synthetic resin material (for example, polycarbonate or acrylic) that is almost transparent (having high translucency) and has a refractive index higher than that of air. As shown in FIGS. 7, 8, and 11, the diffusing lens 19 has a predetermined thickness and is formed in a substantially circular shape when seen in a plan view, and each LED 17 is individually connected to the LED substrate 18 from the front side. So as to cover each LED 17 in a plan view. The diffusing lens 19 can emit light having strong directivity emitted from the LED 17 while diffusing. That is, the directivity of the light emitted from the LED 17 is relaxed through the diffusing lens 19, so that even if the interval between the adjacent LEDs 17 is wide, the region between them is difficult to be visually recognized as a dark part. Thereby, it is possible to reduce the number of installed LEDs 17. The diffusing lens 19 is disposed at a position that is substantially concentric with the LED 17 in a plan view. The diffuser lens 19 is sufficiently larger in both the X-axis direction and the Y-axis direction than the LED 17. On the other hand, the diffusing lens 19 has a smaller dimension in the X-axis direction than the LED board 18 but a larger dimension in the Y-axis direction than the LED board 18. Accordingly, both end portions of the diffusing lens 19 in the Y-axis direction protrude outward from the LED substrate 18 by a predetermined dimension in the Y-axis direction.

Of the diffusing lens 19, the surface facing the back side and facing the LED substrate 18 is a light incident surface 19 a on which light from the LED 17 is incident, whereas the surface facing the front side and facing the optical member 15 is the surface facing the optical member 15. The light exit surface 19b emits light. Among these, as shown in FIGS. 7 and 8, the light incident surface 19 a is formed in parallel with the plate surface (X-axis direction and Y-axis direction) of the LED substrate 18 as a whole. The light incident side concave portion 19c is formed in a region overlapping with the LED 17 when viewed, thereby having an inclined surface. The light incident side concave portion 19c has a substantially conical shape and is disposed at a substantially concentric position in the diffusing lens 19, and is open toward the back side, that is, the LED 17 side. The light incident side concave portion 19c has an opening end portion facing the LED 17 side having the largest diameter dimension and larger than the diameter dimension of the LED 17, and the diameter dimension gradually and gradually increases from there to the front side. It becomes smaller and is minimized at the front end. The light incident side concave portion 19c has a substantially inverted V-shaped cross section, and its peripheral surface is an inclined surface inclined with respect to the Z-axis direction. The inclined surface is inclined so that the front end thereof intersects the optical axis LA of the LED 17. Therefore, the light emitted from the LED 17 and entering the light incident side concave portion 19c enters the diffusion lens 19 through the inclined surface, but at that time, the amount of the inclination angle of the inclined surface with respect to the optical axis LA is as follows. The light is refracted in a direction away from the center, that is, a wide angle, and enters the diffusing lens 19.

Of the light incident surface 19a of the diffusing lens 19, the light projecting surface 19a protrudes toward the LED substrate 18 at a position radially outward from the light incident side concave portion 19c, and has a structure for attaching the diffusing lens 19 to the LED substrate 18. A mounting leg portion 19d is provided. Three attachment legs 19d are arranged in the diffuser lens 19 at positions closer to the outer peripheral end than the light incident side recess 19c, and the lines connecting the attachments form a substantially equilateral triangle when viewed in a plane. Arranged in position. Each attachment leg 19d can fix the diffusing lens 19 to the LED substrate 18 in an attached state by fixing the tip of the attachment leg 19d to the LED substrate 18 with an adhesive or the like. The diffusing lens 19 is fixed to the LED substrate 18 via the mounting leg portion 19d, so that a predetermined gap is formed between the light incident surface 19a and the LED substrate 18. In this gap, incidence of light from a space outside the diffusion lens 19 in a plan view is allowed. Further, in the attached state, the projecting tip portion of the LED 17 from the LED substrate 18 enters the light incident side recess 19c.

The light exit surface 19b of the diffusion lens 19 is formed in a flat and substantially spherical shape. As a result, the light emitted from the diffusion lens 19 can be emitted while being refracted in a direction away from the center at the interface with the external air layer, that is, a wide angle. A light emitting side recess 19e is formed in a region of the light emitting surface 19b that overlaps the LED 17 when seen in a plan view. The light emitting side concave portion 19e has a substantially bowl shape, and is formed in a flat and substantially spherical shape with a peripheral surface having a downward slope toward the center. Further, the angle formed by the tangent of the peripheral surface of the light exit side recess 19e with respect to the optical axis LA of the LED 17 is relatively larger than the angle formed by the inclined surface of the light incident side recess 19c with respect to the optical axis LA. It is said. The region of the light exit surface 19b that overlaps with the LED 17 when seen in a plane is a region where the amount of light from the LED 17 is extremely large compared to other regions, and the brightness tends to be locally high, but there By forming the light emitting side recess 19e, most of the light from the LED 17 can be emitted while being refracted at a wide angle, or a part of the light from the LED 17 can be reflected to the LED substrate 18 side. Thereby, it can suppress that the brightness | luminance of the area | region which overlaps with LED17 among the light-projection surfaces 19b becomes high locally, and becomes suitable for prevention of a brightness nonuniformity.

Next, the reflection sheet 21 will be described. The reflection sheet 21 includes a chassis reflection sheet 22 having a size covering the entire inner surface of the chassis 14 and a substrate reflection sheet 23 having a size covering each LED substrate 18 individually. Both the

reflection sheets

22 and 23 are made of a synthetic resin, and the surfaces thereof are white with excellent light reflectivity. Both the

reflection sheets

22 and 23 are assumed to extend along the bottom plate 14 a (LED substrate 18) in the chassis 14.

First, the chassis reflection sheet 22 will be described. As shown in FIG. 3, a main part of the chassis reflection sheet 22 on the center side extending along the bottom plate 14 a of the chassis 14 is a main body 22 a. The main body portion 22a is formed with a lens insertion hole 22b through which each diffusion lens 19 covering each LED 17 can be inserted together with each LED 17 arranged in the chassis 14. A plurality of lens insertion holes 22b are arranged in parallel at positions overlapping the respective LEDs 17 and the respective diffusion lenses 19 in a plan view in the main body portion 22a, and are arranged in a matrix. As shown in FIG. 6, the lens insertion hole 22 b has a circular shape when seen in a plan view, and the diameter thereof is set to be larger than that of the diffusing lens 19. As a result, when the chassis reflection sheet 22 is laid in the chassis 14, each diffusion lens 19 can be reliably passed through each lens insertion hole 22 b regardless of the occurrence of dimensional errors. As shown in FIG. 3, the chassis reflection sheet 22 covers the area between the adjacent diffusion lenses 19 and the outer peripheral area in the chassis 14, so that light directed to these areas is directed to the optical member 15 side. Can be reflected. As shown in FIGS. 4 and 5, the outer peripheral side portion of the chassis reflection sheet 22 rises so as to cover the side plate 14 c and the receiving plate 14 d of the chassis 14, and the portion placed on the receiving plate 14 d is the chassis 14. And the optical member 15. Moreover, the part which connects the main-body part 22a and the part mounted in the receiving plate 14d among the reflective sheets 22 for chassis has comprised the inclined shape.

On the other hand, as shown in FIG. 11, the board reflection sheet 23 is formed in a rectangular shape when viewed in plan view, which is substantially the same outer shape as the LED board 18. As shown in FIGS. 7 and 8, the board reflection sheet 23 is disposed so as to overlap the front side surface of the LED board 18 and is opposed to the diffusion lens 19. That is, the board reflection sheet 23 is interposed between the diffusion lens 19 and the LED board 18. Therefore, about the light returned from the diffusion lens 19 side to the LED substrate 18 side, or the light entering the space between the diffusion lens 19 and the LED substrate 18 from the space outside the diffusion lens 19 in a plan view, It can be reflected again to the diffuser lens 19 side by the substrate reflection sheet 23. As a result, the light utilization efficiency can be increased, and the luminance can be improved. In other words, sufficient brightness can be obtained even when the number of LEDs 17 is reduced to reduce the cost.

As shown in FIG. 11, the board reflection sheet 23 has a long side dimension substantially the same as that of the LED board 18, whereas a short side dimension is larger than that of the LED board 18. Furthermore, the short side dimension of the board reflection sheet 23 is larger than the diameter dimension of the lens insertion hole 22b of the diffusion lens 19 and the chassis reflection sheet 22, as shown in FIGS. Therefore, it is possible to arrange the edge of the lens insertion hole 22b in the chassis reflection sheet 22 so as to overlap the front side with respect to the board reflection sheet 23. As a result, the chassis reflection sheet 22 and the board reflection sheet 23 are continuously arranged in the chassis 14 without being interrupted when viewed in plan, and the chassis 14 or the LED board 18 is moved from the lens insertion hole 22b to the front side. There is almost no exposure. Therefore, the light in the chassis 14 can be efficiently reflected toward the optical member 15, which is extremely suitable for improving the luminance. The board reflection sheet 23 has an LED insertion hole 23a through which each LED 17 passes, and a leg insertion hole 23b through which each attachment leg 19d of each diffusing lens 19 passes through at a position where they overlap with each other in plan view. Is formed.

Subsequently, the substrate holding member 20 will be described in detail. The substrate holding member 20 according to the present embodiment has a support function for supporting the optical member 15 in addition to the substrate holding function for holding the LED substrate 18. As shown in FIG. 3, the substrate holding member 20 is attached to the chassis 14 for each LED substrate 18 disposed therein. Specifically, a plurality (specifically, a total of 27) of substrate holding members 20 are intermittently arranged in a zigzag shape on the bottom plate 14 a of the chassis 14. That is, the substrate holding members 20 corresponding to the LED substrates 18 adjacent in the Y-axis direction are arranged at positions that are shifted (offset) from each other in the X-axis direction. By arranging each substrate holding member 20 as described above, even if the light reflectance of the surface of each substrate holding member 20 is lower than the light reflectance of the chassis reflection sheet 22, each substrate holding member 20 It becomes difficult to be visually recognized as a dark part. In addition, since each substrate holding member 20 has a function of supporting the optical member 15, the optical member 15 is appropriately supported without deviation in the plane of the plate surface by being distributed as described above. can do. Each board | substrate holding member 20 is distribute | arranged to the position between the adjacent diffuser lenses 19 (LED17) in the position superimposed on each LED board 18 seeing in a plane. The mounting holes 14e in the chassis 14 are respectively arranged at positions corresponding to the installation positions of the substrate holding members 20 described above.

Subsequently, a specific configuration of the substrate holding member 20 will be described. The substrate holding member 20 is made of a synthetic resin such as polycarbonate, and has a white surface with excellent light reflectivity. The board | substrate holding member 20 has comprised the substantially circular shape seeing in a plane as a whole. As shown in FIGS. 7 and 9, the substrate holding member 20 protrudes from the main body portion 24 along the bottom surface 14 a of the chassis 14 and the plate surface of the LED substrate 18 and toward the back side (chassis 14 side) from the main body portion 24. A mounting portion 25 inserted into the mounting hole 14e of the chassis 14 and a support portion 26 that protrudes from the main body portion 24 toward the front side (the side opposite to the chassis 14 side) and can support the optical member 15 from the back side. . And the board | substrate holding member 20 which concerns on this embodiment can be moved to the direction along the plate surface with respect to the chassis 14, A board | substrate holding member 20 is hold | maintained with respect to the chassis 14 with the movement, A chassis 14 can be released. In the present embodiment, the X-axis direction shown in each drawing coincides with the moving direction in the substrate holding member 20.

As shown in FIGS. 12 and 13, the main body 24 has a substantially rectangular shape in plan view, the long side direction matches the X-axis direction, and the short side direction matches the Y-axis direction. . That is, it can be said that the main body 24 has a longitudinal shape parallel to the long side direction of the LED substrate 18. The main body 24 is formed in a substantially straight plate shape along the X-axis direction and the Y-axis direction. And this main-body part 24 can be hold | maintained in the state which pinched | interposed the LED board 18 between the bottom boards 14a of the chassis 14 by attaching to the position which overlaps with the LED board 18 seeing in a plane. Is done. Since the main body 24 is attached in a state where the

reflection sheets

22 and 23 are arranged in advance on the front side of the LED substrate 18, it is possible to sandwich the

reflection sheets

22 and 23 together with the LED substrate 18 (FIG. 7 and FIG. 9).

As shown in FIG. 6, the main body 24 is arranged in a region between adjacent diffusion lenses 19 (LEDs 17) in the LED substrate 18 in a plan view. Specifically, since the main body portion 24 is disposed at an intermediate position between the adjacent diffusion lenses 19, the distances from the main body portion 24 to the adjacent diffusion lenses 19 are substantially equal to each other. The long side dimension in the main body 24 is smaller than the interval between the adjacent diffusion lenses 19, and the value obtained by dividing the difference by 2 is larger than the moving distance associated with the attachment / detachment of the substrate holding member 20. The On the other hand, the main body portion 24 has a short side dimension smaller than the short side dimension of the LED substrate 18. In addition, the main body portion 24 is arranged at a position where the center position in the short side direction coincides with the center position in the short side direction of the LED substrate 18. That is, the main body 24 is arranged concentrically with the LED substrate 18 in the Y-axis direction. As described above, the main body 24 overlaps the LED substrate 18 in plan view over the entire region, and can sandwich the central side portion of the LED substrate 18 in the short side direction with the chassis 14. The main body 24 is arranged in a region between the diffusion lenses 19 adjacent to each other in the X-axis direction in the LED substrate 18, that is, a non-light emitting portion in the LED substrate 18. There is no overlap. That is, it is possible to avoid the main body 24 from obstructing light emission from the LED 17. In the present embodiment, since the distance between the LEDs 17 is sufficiently wide by using the diffusing lens 19 as described above, the substrate holding member 20 is arranged using the space and the substrate holding member is used. The LED board 18 is fixed by 20.

The support part 26 has a conical shape as a whole as shown in FIGS. Specifically, the support portion 26 is formed in a tapered shape so that the cross-sectional shape cut along the plate surface of the main body portion 24 is a circular shape, and the diameter dimension gradually decreases from the protruding proximal end side to the protruding distal end side. ing. The support portion 26 can be brought into contact with the diffusion plate 15a disposed on the backmost side (the LED 17 side) of the optical member 15, thereby supporting the diffusion plate 15a at a predetermined position. That is, the support portion 26 can regulate the positional relationship between the optical member 15 and the LED 17 in the Z-axis direction (a direction perpendicular to the surface of the optical member 15) to a constant state.

The outer diameter dimension of the protruding proximal end portion of the support portion 26 is smaller than both the short side dimension of the main body 24 and the short side dimension of the LED substrate 18. That is, it can be said that the support portion 26 has a point shape when viewed in a plane, whereas the main body portion 24 has a surface shape covering a wider range when viewed in a plane than the support portion 26. The projecting dimension of the support portion 26 is substantially equal to the distance from the front surface of the main body 24 to the back surface of the diffusion plate 15a that is substantially straight along the X-axis direction and the Y-axis direction. . Accordingly, the support portion 26 comes into contact with the diffusion plate 15a in a substantially straight state. Of the support portion 26, the protruding tip portion that is a contact portion with the diffusion plate 15a is rounded. Since this support portion 26 is the only portion of the substrate holding member 20 that protrudes from the main body portion 24 to the front side, when performing the work of attaching the substrate holding member 20 to the chassis 14, the operator Can be used as an operation unit (gripping unit). Thereby, the attachment / detachment workability of the substrate holding member 20 can be improved.

The support part 26 is arranged at a substantially central position in the main body part 24 as shown in FIGS. That is, the support portion 26 is disposed at a position overlapping the mounting portion 25 described later in plan view. More specifically, the support portion 26 and the attachment portion 25 are disposed at positions that are substantially concentric when viewed from above. With such an arrangement, when the operator uses the support portion 26 as an operation portion when performing the work of attaching the substrate holding member 20 to the chassis 14, the support portion 26 exposed to the front side is visually observed. The position of the mounting portion 25 hidden behind the back can be easily grasped. Therefore, workability when inserting the attachment portion 25 into the attachment hole 14e can be improved.

Subsequently, the mounting structure of the substrate holding member 20 to the chassis 14, which is a characteristic configuration in the present embodiment, will be described in detail. As shown in FIG. 7, the attachment structure includes an attachment portion 25 in the substrate holding member 20 and an attachment hole 14 e in the chassis 14. The attachment portion 25 is roughly along the plate surface of the main body portion 24. In contrast to the hook shape, the mounting hole 14e has a longitudinal shape along the moving direction of the substrate holding member 20, that is, the X-axis direction. When mounting, the substrate holding member 20 is moved (slid) along the long side direction of the mounting hole 14e from the state in which the mounting portion 25 is inserted into the mounting hole 14e. The edge of the mounting hole 14e in the chassis 14 can be held between the two. On the other hand, when removing the board holding member 20, it is possible to remove the mounting part 25 from the mounting hole 14 e after moving the holding state of the chassis 14 by the mounting part 25 by moving the board holding member 20 in the opposite direction. (FIG. 15). Thus, the board holding member 20 has two positions: a holding position where the chassis 14 is held by the mounting portion 25 (FIG. 7), and a release position where the holding state of the mounting portion 25 with respect to the chassis 14 is released (FIG. 15). It is possible to move (slide) along the X-axis direction. 7, 14, and 15 in which the X-axis direction is the left-right direction, the left side in the drawing is the mounting direction of the substrate holding member 20, and the opposite right side is the removal direction of the substrate holding member 20.

As shown in FIGS. 7 and 13, the attachment portion 25 has a substantially rectangular shape when viewed from above, and the long side direction matches the X-axis direction and the short side direction matches the Y-axis direction. . That is, it can be said that the attachment portion 25 has a longitudinal shape parallel to the long side direction of the LED substrate 18. On the other hand, as shown in FIG. 6, the mounting hole 14 e has a substantially rectangular shape when seen in a plane like the mounting portion 25, and the long side direction is the X-axis direction, that is, the LED substrate 18 and the mounting portion 25. It has a longitudinal shape that matches the long side direction. Thereby, it is possible to move (slide) the substrate holding member 20 along the X-axis direction in a state where the mounting portion 25 is inserted into the mounting hole 14e. The attachment part 25 has a slightly smaller long side dimension and shorter side dimension than the attachment hole 14e, so that it can be easily inserted into and removed from the attachment hole 14e. The mounting hole 14e is sized so that the main body 24 overlaps the entire area in a plan view with the substrate holding member 20 in the holding position (FIG. 6).

The structure of the mounting portion 25 will be described in detail. The attachment portion 25 includes a base portion 25a that protrudes from the back surface (the surface facing the chassis 14) of the main body portion 24 to the back side, and a sandwiching portion 25b that extends from the base portion 25a along the plate surface of the main body portion 24 in parallel. And is generally L-shaped as viewed from the side. The base 25a is disposed at a substantially central position in the main body 24, and is disposed at a position overlapping the above-described support 26 in plan view. The base portion 25a has a substantially block shape. On the other hand, the sandwiching portion 25b has a cantilever shape extending from the protruding tip portion of the base portion 25a along the X-axis direction toward the left side shown in FIG. 7, that is, the mounting direction of the substrate holding member 20. The clamping portion 25b can be elastically deformed with the connection position with the base portion 25a as a base end, and in the Z-axis direction, that is, a direction intersecting the moving direction of the substrate holding member 20 (with the chassis 14 and the main body portion 24). It is possible to displace in the direction of approaching and separating. The sandwiching portion 25 b has a substantially flat plate shape parallel to the plate surface of the main body portion 24 and can sandwich the chassis 14 with the main body portion 24. The sandwiching portion 25b has a substantially rectangular shape when viewed from above, and the long side direction coincides with the X-axis direction, and the short side direction coincides with the Y-axis direction. That is, it can be said that the sandwiching portion 25 b has a longitudinal shape parallel to the long side direction of the LED substrate 18.

When the substrate holding member 20 is disposed at the holding position described above with respect to the chassis 14, as shown in FIG. 7, the clamping portion 25 b overlaps with the hole edge of the mounting hole 14 e in the chassis 14 in a plan view. The hole edge of the attachment hole 14e is sandwiched between the main body portion 24 and the body portion 24. Specifically, in the holding position, the clamping portion 25b is flat on the left side shown in FIG. 7 with respect to the mounting hole 14e, that is, on the mounting direction side of the board holding member 20 among the hole edges of the mounting hole 14e in the chassis 14. And the hole edge is sandwiched between the body portion 24 and the hole portion. Thereby, the board | substrate holding member 20 is hold | maintained substantially immovably with respect to the chassis 14 about the Z-axis direction. On the other hand, when the substrate holding member 20 is disposed at the release position described above with respect to the chassis 14, the clamping portion 25b overlaps with the hole edge of the mounting hole 14e in the chassis 14 as seen in a plan view, as shown in FIG. Instead, it is arranged in the mounting hole 14e over the entire area in a plan view, and the holding state of the mounting hole 14e with respect to the hole edge is released. Accordingly, the substrate holding member 20 is allowed to move to the front side along the Z-axis direction with respect to the chassis 14, and thus can be detached from the chassis 14.

The mounting portion 25 is disposed at a position overlapping with the LED substrate 18 when seen in a plan view. Therefore, the LED substrate 18 is formed with a through hole 18b through which the mounting portion 25 is passed. As shown in FIG. 10, the through-hole 18b is arranged at a position on the LED board 18 between the adjacent LEDs 17 (diffuse lens 19), that is, a position where the LED 17 (diffuse lens 19) does not overlap with the LED 17 (diffuse lens 19). Has been. The through hole 18b is substantially the same in plan shape and size as the mounting hole 14e described above, and communicates with the mounting hole 14e. That is, the through hole 18b has a longitudinal shape parallel to the X-axis direction, that is, the long side direction of the LED substrate 18 and the extending direction of the wiring pattern WP. Therefore, it is possible to keep the short side dimension of the LED substrate 18 small while arranging the pair of wiring patterns WP on the LED substrate 18 at a position straddling the through hole 18b in the Y-axis direction.

Among the hole edges of the through hole 18b in the LED board 18, the left side shown in FIG. 7 with respect to the through hole 18b, that is, the hole edge on the attachment direction side of the board holding member 20, is the clamping part in the attachment part 25 in the attachment state. 25b is superimposed on the plane. Accordingly, the LED board 18 is sandwiched together with the chassis 14 between the main body portion 24 and the sandwiching portion 25b. Furthermore, when the attachment portion 25 is inserted into the through hole 14b, the outer edge in the Y-axis direction of the base portion 25a can be brought into contact with the hole edge of the through hole 14b as shown in FIG. Thereby, the LED board 18 can be positioned in the Y-axis direction by the mounting portion 25. Further, in each of the

reflection sheets

22 and 23 sandwiched between the main body portion 24 and the LED substrate 18, the position overlapping with the through hole 18 b in a plan view is shown in FIGS. 7, 9, and 11. As shown,

communication holes

22c and 23c are formed, which communicate with the through hole 18b and allow the attachment portion 25 to pass therethrough.

A locking protrusion 25c that protrudes toward the main body 24 is provided at the extended tip of the clamping part 25b. On the other hand, the above-described locking is provided at a position at a predetermined interval (about the long side dimension of the clamping portion 25b) on the left side shown in FIG. A locking hole 14f through which the protrusion 25c can enter is provided. When the substrate holding member 20 is disposed at the holding position, the locking projection 25c enters the locking hole 14f and is locked to the edge of the hole. As a result, a situation in which the substrate holding member 20 is inadvertently moved from the holding position to the release position side (removal direction) is avoided. The right side surface shown in FIG. 7 in the locking projection 25c is a locking surface for the hole edge of the locking hole 14f. On the other hand, the left side surface shown in FIG. 7 of the locking projection 25c is formed in a taper shape, whereby the clamping portion 25b is elastically deformed when the substrate holding member 20 is moved from the release position to the holding position. It is easy.

Further, as shown in FIGS. 7 and 9, the main body portion 25 protrudes to the back side, that is, the reflection sheet 21 side (the LED board 18 side and the chassis 14 side) and comes into contact with the reflection sheet 21. A portion 27 is provided. The contact portion 27 contacts the chassis reflection sheet 22 of the reflection sheet 21 and directly presses the chassis reflection sheet 22 from the front side, and the board reflection sheet 23 and the LED via the chassis reflection sheet 22. It is possible to indirectly hold the substrate 18 from the front side. Since the abutment portion 27 has a form that partially protrudes from the back surface of the main body 24 (the surface facing the chassis reflection sheet 22), the entire area of the back surface of the main body is assumed to be the chassis reflection sheet. Compared with the case where it contacts 22, the contact area with respect to the chassis reflection sheet 22 is small. When the contact portion 27 is in contact with the chassis reflection sheet 22, the back side surface of the main body portion 24 floats from the chassis reflection sheet 22 and is kept in a non-contact state, and the back side of the main body portion 24. A gap C corresponding to the protruding dimension of the abutting portion 27 is held between this surface and the surface on the front side of the chassis reflection sheet 22.

As shown in FIGS. 12 and 13, the abutting portion 27 is disposed at a position away from the mounting portion 25 (the sandwiching portion 25 b) in a plan view, specifically, an outer edge portion of the main body portion 24. That is, it can be said that the contact portion 27 is disposed at a position farthest from the attachment portion 25 disposed on the center side of the main body portion 24. And the main-body part 24 which concerns on this embodiment has the predetermined elasticity from the base 25a of the attaching part 25 to the contact part 27, and can be elastically deformed according to the stress which acts. . A total of four abutting portions 27 are provided in pairs at positions where the mounting portion 25 is sandwiched in the main body portion 24. Specifically, each contact portion 27 is disposed at four corner positions in the rectangular main body portion 24. That is, each contact portion 27 is disposed at a position that is symmetrical about the base portion 25 a of the attachment portion 25 in the main body portion 24. Accordingly, the distance from the base portion 25a to each contact portion 27 in the mounting portion 25 is the same. Further, it can be said that each contact portion 27 has a dot shape when the plate surface of the main body portion 24 is viewed in a plane. As described above, the contact points of the board holding member 20 with respect to the chassis reflection sheet 22 are distributed and arranged in a well-balanced manner in the plane of the plate surface of the main body portion 24. It can be supported stably without causing rattling (FIG. 6).

As shown in FIGS. 7 and 9, each contact portion 27 has a substantially hemispherical shape as a whole, and its peripheral surface (contact surface with respect to the chassis reflection sheet 22) is formed of a spherical surface. Therefore, each contact portion 27 is in point contact with the chassis reflection sheet 22. Thereby, the contact area of each contact part 27 with respect to the reflection sheet 22 for chassis is made into the minimum.

This embodiment has the structure as described above, and its operation will be described next. The liquid crystal panel 11 and the backlight device 12 are separately manufactured and assembled to each other using the bezel 13 or the like, whereby the liquid crystal display device 10 shown in FIGS. 4 and 5 is manufactured. Among these, the assembly work at the time of manufacturing the backlight device 12 will be described in detail.

In the present embodiment, prior to the assembly of each component to the chassis 14, an operation of attaching the LED 17, the board reflection sheet 23, and the diffusion lens 19 to the LED board 18 is performed. Specifically, first, as shown in FIG. 10, the LED 17 is mounted on a predetermined position on the LED board 18, and then the board reflection sheet 23 is put on the front side. At this time, each LED 17 of the board reflection sheet 23 is passed through each LED insertion hole 23a. Thereafter, as shown in FIG. 11, a diffusion lens 19 is attached to the LED substrate 18 so as to cover each LED 17. At this time, each mounting leg 19 d of the diffusing lens 19 is fixed to the LED substrate 18 by an adhesive through the leg insertion hole 23 b of the board reflection sheet 23. Thus, the light source unit U, in which the LED 17, the board reflection sheet 23, and the diffusing lens 19 are integrated with the LED board 18, is produced.

Subsequently, the assembly work of each component to the chassis 14 will be described. The above-described light source unit U is housed inside from the front side of the chassis 14 through the opening 14b, and each light source unit U is arranged at a predetermined mounting position with respect to the bottom plate 14a. At this time, the through holes 18b of the LED substrate 18 in the light source units U are aligned with the mounting holes 14e of the chassis 14 so as to communicate with each other. Here, the LED boards 18 adjacent to each other in the X-axis direction can be connected to each other by fitting the adjacent connector portions 18a to each other. The connection work between the LED boards 18 arranged in the X-axis direction is not necessarily performed in the chassis 14 and may be performed outside the chassis 14. When the arrangement of all the light source units U is completed, the operation of arranging the chassis reflection sheet 22 in the chassis 14 is subsequently performed. At this time, each lens insertion hole 22b in the chassis reflection sheet 22 is aligned with each diffusion lens 19 in the light source unit U, and each diffusion lens 19 is passed through each lens insertion hole 22b (FIG. 3). . When the chassis reflection sheet 22 is attached, the chassis reflection sheet 22 is superposed on almost all portions of the substrate reflection sheet 23 other than the portion overlapping the diffuser lens 19 in plan view (see FIG. 7 and FIG. 8). In particular, the edge portion of the lens insertion hole 22b in the chassis reflection sheet 22 is overlapped on the front side of the board reflection sheet 23 over the entire area. Further, as shown in FIG. 14, the communication holes 22 c of the chassis reflection sheet 22 are aligned with the communication holes 23 c of the board reflection sheet 23, the through holes 18 b of the LED board 18, and the mounting holes 14 e of the chassis 14. Communicated. Thereafter, the substrate holding member 20 is attached.

When attaching the substrate holding member 20 to the chassis 14, it is possible to use the support portion 26 that is a portion protruding from the main body portion 24 to the front side as an operation portion. In this way, when attaching the substrate holding member 20, the operator can operate the substrate holding member 20 while holding the support portion 26. From the state shown in FIG. 14, the board holding member 20 is accommodated inside through the opening 14b from the front side of the chassis 14, and the mounting portions 25 hidden in the back side through the main body 24 are connected to the

corresponding communication holes

22c, 23c. Then, it is inserted while being aligned (aligned) with respect to the through hole 18b and the mounting hole 14e. At this time, since the support portion 26 and the attachment portion 25 are arranged at positions that overlap each other and are concentric when viewed in a plane, the operator can easily grasp the position of the attachment portion 25. Therefore, it is possible to smoothly perform the operation of inserting the attachment portion 25 while aligning it with the

holes

14e, 18b, 22c, and 23c.

When the mounting portion 25 is inserted into the mounting hole 14e to a predetermined depth, as shown in FIG. 15, the contact portions 27 are brought into contact with the chassis reflection sheet 22, thereby further exceeding the board holding member 20. Intrusion is regulated. When the substrate holding member 20 reaches the release position shown in FIG. 15, the substrate holding member 20 is subsequently moved (slid) along the X-axis direction toward the left side shown in FIG. In the release position shown in FIG. 15, the base portion 25a of the mounting portion 25 is arranged at the right end of each of the

holes

14e, 18b, 22c, and 23c, and is predetermined between the left-side hole edge (clamped portion). Possesses a gap. This gap is set to a size corresponding to the movement stroke when the substrate holding member 20 is moved from the release position to the holding position. In the process of moving the substrate holding member 20, the holding projection 25 c on the mounting portion 25 rides on the hole edge of the mounting hole 14 e, so that the holding portion 25 b is elastically deformed in the Z-axis direction so as to be separated from the chassis 14.

When the substrate holding member 20 reaches the holding position shown in FIG. 7, the clamping portion 25b is elastically restored, and the locking projection 25c enters the locking hole 14f and is locked to the hole edge. The This prevents the substrate holding member 20 from being inadvertently moved from the holding position to the right side shown in FIG. 7, that is, the removal direction. In this holding position, the base portion 25a of the mounting portion 25 is arranged at the left end of the

hole

14e, 18b, 22c, 23c in the figure, and the clamping portion 25b is a hole edge on the left side of the

holes

14e, 18b, 22c, 23c. And in plan view. Thereby, the hole edge of the attachment hole 14f in the chassis 14 and the hole edge of the through hole 18b in the LED board 18 are both held between the main body part 24 and the holding part 25b of the attachment part 25. Is prevented from being inadvertently moved to the front side or the back side in the Z-axis direction. As described above, the substrate holding member 20 is held substantially immovable from the holding position. The LED board 18 is held in a state of being sandwiched between the main body 24 and the chassis 14 in the board holding member 20 that is substantially immovable, and thus is maintained in an attached state with respect to the chassis 14. . In addition, the hole edges of the communication holes 22c and 23c in the

reflection sheets

22 and 23 are also sandwiched between the main body portion 24 and the sandwiching portion 25b.

In the mounting state described above, the main body portion 24 and the sandwiching portion 25b that sandwich the chassis 14 and the LED substrate 18 are both aligned with the LED substrate 18 in the long side direction, and in addition to the LED substrate 18 in the short side direction. Since they are arranged at concentric positions (FIG. 6), the LED substrate 18 can be stably held. In addition, as shown in FIG. 9, the outer edge in the Y-axis direction of the base portion 25a of the mounting portion 25 can be brought into contact with the hole edges of the

holes

14e, 18b, 22c, and 23c. Accordingly, the LED substrate 18 and the

reflection sheets

22 and 23 are positioned with respect to the substrate holding member 20 in the Y-axis direction.

In this attached state, as shown in FIGS. 7 and 9, each contact portion 27 is brought into contact with the front surface of the chassis reflection sheet 22. Therefore, in the mounted state, the spherical surface of each contact portion 27 is in point contact with the chassis reflection sheet 22, while the back surface of the main body portion 24 (with the chassis reflection sheet 22 and the like). Are opposed to the chassis reflection sheet 22 and kept in a non-contact state, and a contact portion is provided between the back surface of the main body 24 and the front surface of the chassis reflection sheet 22. A gap C corresponding to 27 projecting dimensions is retained. Therefore, the contact area of the substrate holding member 20 with respect to the chassis reflection sheet 22 is very small, and is smaller than the case where the entire area of the back side surface of the main body is brought into contact. In other words, the area of the portion of the chassis reflection sheet 22 that is not in contact with the substrate holding member 20 (the portion that cannot be pressed by the substrate holding member 20) is increased. The chassis reflection sheet 22 is directly pressed by the contact portion 27, whereas the board reflection sheet 23 and the LED substrate 18 are indirectly pressed by the contact portion 27 via the chassis reflection sheet 22. ing.

After each substrate holding member 20 is attached to the chassis 14 as described above, the optical member 15 is attached to the chassis 14 so as to cover the opening 14b. The specific mounting order of the optical member 15 is that the diffusion plate 15a is first and then the optical sheet 15b. As shown in FIGS. 4 and 5, the outer peripheral edge of the optical member 15 is received by the receiving plate 14 d of the chassis 14, and the center side portion is supported by the support portion 26 of each substrate holding member 20. It has become. Then, when the frame 16 is attached to the chassis 14, the outer peripheral edge of the optical member 15 is sandwiched between the frame 16 and the receiving plate 14d. Thereby, the manufacture of the backlight device 12 is completed. When assembling the manufactured backlight device 12 and the liquid crystal panel 11, the liquid crystal panel 11 is placed on the frame 16, and then the bezel 13 is put on the front side and screwed. As a result, the liquid crystal panel 11 is sandwiched between the frame 16 and the bezel 13 and the liquid crystal panel 11 is integrated with the backlight device 12, thereby completing the manufacture of the liquid crystal display device 10.

When the liquid crystal display device 10 manufactured as described above is used, each LED 17 provided in the backlight device 12 is turned on and an image signal is supplied to the liquid crystal panel 11, thereby A predetermined image is displayed on the display surface of the liquid crystal panel 11. As shown in FIGS. 7 and 8, the light emitted when each LED 17 is turned on first enters the light incident surface 19 a of the diffusion lens 19. At this time, most of the light is incident on the inclined surface of the light incident side recess 19c in the light incident surface 19a, so that the light enters the diffusing lens 19 while being refracted at a wide angle according to the inclination angle. The incident light propagates through the diffusing lens 19 and then exits from the light exit surface 19b. Since the light exit surface 19b has a flat, substantially spherical shape, an external air layer is formed. Light is emitted while being refracted at a wider angle at the interface. In addition, in the light emitting surface 19b, in the region where the amount of light from the LED 17 is the largest, the light emitting side concave portion 19e having a substantially bowl shape is formed, and the peripheral surface has a flat and substantially spherical shape. Light can be emitted while being refracted at a wide angle on the peripheral surface of the light emitting side recess 19e, or reflected to the LED substrate 18 side. Of these, the light returned to the LED substrate 18 side is effectively utilized by being reflected by the substrate reflection sheet 23 toward the diffusion lens 19 side and entering the diffusion lens 19 again, so that high luminance is obtained.

As described above, the light having strong directivity emitted from the LED 17 can be diffused at a wide angle by the diffusing lens 19, so that the in-plane distribution of the optical member 15 in the light reaching the optical member 15 is uniform. It can be. In other words, since the region between the adjacent LEDs 17 becomes difficult to be visually recognized as a dark part by using the diffusing lens 19, it becomes possible to widen the interval between the LEDs 17, and thus the number of the LEDs 17 arranged while suppressing the luminance unevenness. Reduction can be achieved. By reducing the number of LEDs 17 installed, the interval between the adjacent LEDs 17 can be widened, so that the substrate holding member 20 can be arranged using the widened region, and the substrate holding The LED board 18 can be fixed by the member 20.

Incidentally, each LED 17 generates heat as it is turned on. Most of the heat generated from each LED 17 is propagated to the chassis 14 via the mounted LED substrate 18 and then dissipated to the air outside the liquid crystal display device 10. Considering the heat dissipation efficiency at this time, the higher the degree of close contact between the LED board 18 and the chassis 14, the higher the heat transfer efficiency between them, so the heat release efficiency increases, and conversely, the close contact degree between the LED board 18 and the chassis 14. The lower the is, the lower the heat transfer properties of both, and thus the lower the heat dissipation efficiency. In the present embodiment, the LED substrate 18 is fixed to the chassis 14 by the substrate holding member 20 and the following configuration is adopted to improve the heat dissipation efficiency. That is, the main body portion 24 and the sandwiching portion 25b of the substrate holding member 20 are arranged at positions that are substantially concentric with the LED substrate 18 in the short side direction in addition to the long side direction being coincident with the LED substrate 18. Therefore, the LED board 18 can be stably held, and thereby the closeness of the LED board 18 to the chassis 14 can be maintained at a high level. Moreover, since the attachment portion 25 is arranged on the center side of the main body portion 24 and each contact portion 27 is arranged on the outer edge portion, the LED substrate 18 is pressed by the center attachment portion 25 from the back side, By being pressed by the respective abutting portions 27 of the outer edge portion from the front side, it is stably held with good balance. Furthermore, since each contact part 27 is distribute | arranged to the four corner positions in the main-body part 24, the LED board 18 can be pressed down more stably with sufficient balance. Thus, since the LED board 18 is stably fixed in close contact with the chassis 14 by the board holding member 20, the heat transfer to the chassis 14 is extremely high, thereby enabling efficient heat dissipation. It can be done. Therefore, since the inside of the backlight device 12 is unlikely to become a high temperature, it is possible to suppress a decrease in the light emission efficiency of each LED 17 and to stably obtain a high luminance.

When the liquid crystal display device 10 is used as described above, each LED 17 in the backlight device 12 is turned on or off, so that a change occurs in the internal temperature environment, and accordingly each configuration of the liquid crystal display device 10. Parts can expand or contract thermally. Among the component parts, when the chassis reflection sheet 22 and the board reflection sheet 23 are thermally expanded or contracted, if local deformation such as wrinkles or deflection occurs, unevenness occurs in the reflected light. As a result, luminance unevenness occurs in the light emitted from the backlight device 12, and the display quality may be adversely affected. Of each component, if the LED substrate 18 is thermally expanded or contracted, if a local deformation such as warping or bending occurs, contact failure occurs in the connector portion 18a, and lighting control of the LED 17 is performed. There is a possibility that a malfunction will occur. Such local deformation that can occur in each of the

reflection sheets

22 and 23 and the LED substrate 18 occurs in proportion to the magnitude of the pressing force acting from the chassis 14 and the substrate holding member 20 and the acting area (contact area). In order to suppress local deformation, it is preferable to reduce the pressing force or to reduce the area of the portion to be pressed.

Therefore, in this embodiment, as shown in FIGS. 7 and 9, the substrate holding member 20 is provided with an abutting portion 27, and the abutting portion 27 of the substrate holding member 20 is located with respect to the chassis reflection sheet 22. By making point contact, the contact area with respect to the chassis reflection sheet 22 is reduced. When the contact area is reduced, in each of the

reflection sheets

22 and 23 and the LED substrate 18, a portion pressed by the substrate holding member 20 (a portion overlapping with the contact of the contact portion 27 in a plan view) is reduced. The area of a portion that is not pressed by the substrate holding member 20 (a portion that does not overlap with the contact point of the contact portion 27 in a plan view) increases. While the portion held by the substrate holding member 20 is relatively easily restricted from expansion and contraction due to thermal expansion or contraction (the degree of freedom of expansion and contraction is low), the portion not pressed by the substrate holding member 20 is relatively In particular, the expansion and contraction associated with thermal expansion or contraction is easily allowed (the degree of freedom of expansion and contraction is high). In the present embodiment, since the area of the unpressed portion is increased, each of the

reflection sheets

22 and 23 and the LED substrate 18 is easily expanded and contracted due to thermal expansion or thermal contraction as a whole. Therefore, the flatness as a whole is maintained, so that the

reflection sheets

22 and 23 and the LED substrate 18 are locally bent and warped. It is suppressed to become.

In addition, the contact portion 27 is arranged in the main body portion 24 at a position away from the clamping portion 25b of the attachment portion 25 as viewed in a plane. The abutment portion 27 is a portion that applies a pressing force from the front side (the main body portion 24 side) to each of the

reflection sheets

22 and 23 and the LED substrate 18, whereas the sandwiching portion 25 b 23 and the LED board 18 are portions that apply pressing force from the back side (chassis 14 side). Accordingly, as described above, the contact portion 27 and the sandwiching portion 25b are arranged so as to be shifted (offset) from each other in plan view, so that the pressing force is applied from the front side in each of the

reflection sheets

22 and 23 and the LED substrate 18. The position where the position (the position of the contact portion 27) acts and the position where the pressing force acts from the back side (the position of the clamping portion 25b) are similarly shifted. Therefore, it is possible to avoid the stress acting from the front side and the back side from being concentrated on the

reflection sheets

22 and 23 and the LED substrate 18. Thereby, since it can prevent that the pressing force which acts on each

reflection sheet

22,23 and LED board 18 becomes large locally, the freedom degree of the expansion-contraction in the part hold | suppressed by the board | substrate holding member 20 becomes extremely low. Such a situation can be avoided, and thus the degree of freedom of expansion and contraction of the reflecting

sheets

22 and 23 and the entire LED board 18 can be increased.

Moreover, the following actions and effects can be obtained by disposing the contact portion 27 in the main body portion 24 at a position away from the holding portion 25b in a plan view. That is, when a dimensional error occurs in manufacturing the substrate holding member 20, for example, the projecting dimension of the contact part 27 from the main body part 24 becomes larger than a set value, or the length dimension of the mounting part 25 is set. If it becomes shorter than the value, the pressing force acting on each of the

reflection sheets

22 and 23 and the LED substrate 18 may be excessively increased (more than necessary). Therefore, in the present embodiment, a certain degree of elasticity is imparted to the portion of the main body portion 24 from the base portion 25a to the abutting portion 27 of the main body portion 24, so that as shown in FIG. By elastically deforming the portion of the portion 24 from the mounting portion 25 to the contact portion 27, it is possible to absorb an increasing pressing force. Thereby, it is possible to prevent an excessive pressing force from acting on the

reflection sheets

22 and 23 and the LED substrate 18 from the contact portion 27. Therefore, the degree of freedom of expansion and contraction in each of the

reflection sheets

22 and 23 and the LED substrate 18 can be ensured.

By the way, in the lighting inspection performed in the process of manufacturing the liquid crystal display device 10 (backlight device 12), if a defect has occurred in the LED substrate 18 or any of the LEDs 17, the LED substrate 18 in which the defect has occurred. Must be removed from the chassis 14 and replaced or repaired. In addition, when the liquid crystal display device 10 is used, the LED substrate 18 or the LED 17 may fail or the product life may be discarded. 14 need to be removed. In such a case, various components are removed from the liquid crystal display device 10 by a procedure reverse to the assembly procedure at the time of manufacture described above, and after the removal of the optical member 15 is completed, the LED board 18 is removed from the chassis 14. Do work. The operator grasps the supporting portion 26 while releasing the locking state of the locking projection 25c with respect to the locking hole 14f by elastically deforming the holding portion 25b of the mounting portion 25 of the substrate holding member 20, and FIG. Move (slide) from the holding position shown to the right in the figure. When the substrate holding member 20 reaches the release position shown in FIG. 15, the entire holding portion 25b is disposed in the

holes

14e, 18b, 22c, and 23c, and the holding state with respect to the chassis 14 and the LED substrate 18 is released. The substrate holding member 20 is removed by pulling up the substrate holding member 20 to the front side along the Z-axis direction. Thereafter, the LED board 18 may be removed from the chassis.

As described above, the backlight device 12 of the present embodiment includes the LED 17 that is a light source, the LED board 18 on which the LED 17 is mounted, the chassis 14 that houses the LED board 18 and has the mounting hole 14e, and the chassis 14. And a substrate holding member 20 having an attachment portion 25 that protrudes from the body portion 24 toward the chassis 14 and is inserted into the attachment hole 14e. The portion 25 is clamped so that at least the chassis 14 can be clamped with the main body portion 24 as the substrate holding member 20 is moved in the direction along the plate surface of the chassis 14 while being inserted into the mounting hole 14e. It has a portion 25b.

In this way, in order to attach the LED board 18 to the chassis 14, the mounting part 25 of the board holding member 20 is inserted into the mounting hole 14 e of the chassis 14 while the LED board 18 is accommodated in the chassis 14. When the substrate holding member 20 is moved in the direction along the plate surface of the chassis 14 (X-axis direction), at least the chassis 14 is held between the main body 24 and the holding portion 25b of the mounting portion 25, thereby holding the substrate. The member 20 is held attached to the chassis 14. In this state, the LED board 18 is held in an attached state with respect to the chassis 14 by being sandwiched between the main body 24 and the chassis 14. On the other hand, when the LED board 18 is removed from the chassis 14, the board holding member 20 is moved in the direction along the plate surface of the chassis 14 and in the opposite direction to that at the time of attachment. The substrate holding member 20 is removed from the chassis 14 while releasing the state. Thereby, since the holding state of the LED board 18 by the board | substrate holding member 20 is cancelled | released, the LED board 18 can be removed from the chassis 14. FIG.

Conventionally, since the LED board 18 has been screwed, the workability of the work itself for attaching and detaching the screw tended to be deteriorated for reasons such as poor workability. By performing the operation of moving the member 20 in the direction along the plate surface of the chassis 14, the LED substrate 18 can be easily held or released by the substrate holding member 20. Workability when attaching and detaching is assumed to be good.

By the way, since the board | substrate holding member 20 which concerns on this embodiment is holding | maintaining the LED board 18 on both sides with the chassis 14, the defect has arisen in LED17 mounted in the LED board 18, for example, and LED board When replacement or repair of 18 is necessary, it is necessary to remove the board holding member 20 and the LED board 18 from the chassis 14 respectively. For example, in a lamp clip that holds a cold cathode tube, only the cold cathode tube is removed. Compared to good, the frequency of removing the substrate holding member 20 tends to increase. Further, since the LED board 18 tends to increase in use as the backlight device 12 increases in size, the use of the substrate holding member 20 and the number of attachment / detachment operations increase in accordance with the increase in size. Tend to be. From the above circumstances, the workability when repairing the backlight device 12 and the size of the backlight device 12 are increased by improving the workability at the time of attaching and detaching the substrate holding member 20 that holds the LED substrate 18. In this case, workability can be remarkably improved.

In addition, the LED substrate 18 has a longitudinal shape and a plurality of LEDs 17 are mounted along the long side direction, whereas the mounting hole 14e has a longitudinal shape parallel to the long side direction of the LED substrate 18. However, the moving direction in the board | substrate holding member 20 corresponds with the long side direction in the LED board 18 and the attachment hole 14e. If it does in this way, the LED board 18 can be hold | maintained or a holding | maintenance state can be cancelled | released by moving the board | substrate holding member 20 along the long side direction in the LED board 18 and the attachment hole 14e.

Further, the sandwiching portion 25b can sandwich the LED board 18 together with the chassis 14 between the body portion 24 and the sandwiching portion 25b. In this way, since the LED board 18 is sandwiched with the chassis 14 between the main body 24 and the clamping part 25b, the LED board 18 can be held more stably. If the holding state on the LED board 18 is stabilized, for example, heat transfer from the LED board 18 to the chassis 14 can be improved and heat dissipation characteristics can be improved, and thus the light emission efficiency of the LED 17 can be maintained at a high level. It becomes.

The mounting portion 25 is disposed at a position overlapping the LED substrate 18 in plan view, whereas the LED substrate 18 has a through hole 18b that communicates with the mounting hole 14e and through which the mounting portion 25 passes. The edge portion of the through hole 18b is sandwiched with the chassis 14 between the main body portion 24 and the sandwiching portion 25b. In this way, the edge portion of the through hole 18b in the LED substrate 18 together with the chassis 14 is sandwiched between the main body portion 24 and the sandwiching portion 25b, so that the LED substrate 18 can be held more stably.

In addition, the wiring pattern WP for connecting the LEDs 17 to each other is formed on the LED board 18 so as to extend along the long side direction, whereas the through-hole 18b is a long side of the LED board 18 and the mounting hole 14e. It has a longitudinal shape parallel to the direction. In this way, since the through hole 18b has a longitudinal shape parallel to the long side direction of the LED substrate 18 and the mounting hole 14e, that is, the extending direction of the wiring pattern WP, the through hole temporarily extends the wiring pattern WP. Compared with the case where the longitudinal direction is orthogonal to the current direction, the short side dimension of the LED substrate 18 can be reduced in forming the through holes 18b and the wiring pattern WP in the LED substrate 18. Thereby, the material cost in the LED board 18 can be reduced, and the arrangement space of the LED board 18 in the chassis 14 can be reduced.

Further, the mounting portion 25 can be brought into contact with the edge portion of the through hole 18b. If it does in this way, the LED board 18 can be positioned with respect to the board | substrate holding member 20 by making the attachment part 25 contact | abut to the edge of the through-hole 18b.

Further, the main body 24 has a longitudinal shape parallel to the long side direction of the LED substrate 18. In this way, the main body 24 that holds the LED board 18 between the holding part 25b and the holding part 25b is formed in a longitudinal shape parallel to the long side direction of the LED board 18, so that the LED board 18 is more stable. Can be held.

The main body 24 is arranged at a position that is concentric with respect to the LED board 18 in the short side direction. In this way, the main body 24 that holds the LED board 18 with the holding part 25b is disposed concentrically with respect to the LED board 18 in the short side direction. Can be held more stably.

Further, the sandwiching portion 25 b has a longitudinal shape parallel to the long side direction of the LED substrate 18. In this way, the holding part 25b that holds the chassis 14 and the LED board 18 between the main body part 24 and the main body part 24 has a longitudinal shape parallel to the long side direction of the LED board 18, so that the LED board 18 is more stable. Can be held in.

Further, the main body 24 is arranged in a region between the adjacent LEDs 17 in the LED substrate 18 in a plan view. If it does in this way, the field between LED17 which adjoins among LED boards 18 can be used effectively.

Further, the main body 24 is arranged at an intermediate position between the adjacent LEDs 17 in the LED substrate 18 in a plan view. In this way, since the distance to each LED 17 adjacent to the main body portion 24 becomes substantially equal, the optical influence of the main body portion 24 on the light emitted from each LED 17 can be made substantially equal. Thereby, unevenness is less likely to occur in the emitted light in the illumination device.

In addition, a reflection sheet 21 that reflects light is interposed between the main body 24 and the LED substrate 18. The main body 24 faces the reflection sheet 21 on the surface facing the reflection sheet 21, and is reflected by the reflection sheet 21. An abutment portion 27 that abuts against the sheet 21 is provided. In this way, the reflective sheet 21 can be held together with the LED substrate 18. The contact portion 27 that is in contact with the reflection sheet 21 protrudes from the main body portion 24 toward the reflection sheet 21, so that the surface facing the reflection sheet 21 in the main body portion is entirely opposed to the reflection sheet 21. The contact area of the substrate holding member 20 with respect to the reflection sheet 21 can be reduced compared to the case where the contact is made. In other words, in the reflection sheet 21, the area of the portion that is not in contact with the substrate holding member 20 and cannot be pressed by the substrate holding member 20 increases. This unpressed portion is more easily expanded and contracted when thermal expansion or contraction occurs due to a change in the thermal environment, compared to the portion pressed by contact with the substrate holding member 20. And if the area of this part which cannot be suppressed becomes large, since the freedom degree of expansion / contraction will increase as the reflection sheet 21 whole, it suppresses that deformation | transformation, such as bending and curvature accompanying expansion / contraction, becomes localized. be able to.

Further, the abutting portion 27 is arranged at a position away from the mounting portion 25 in the main body portion 24. In this way, when a dimensional error occurs in manufacturing the substrate holding member 20, for example, when the projecting dimension of the contact part 27 from the main body part 24 becomes larger than a set value, the reflective sheet 21 is not affected. There is a possibility that the pressing force that acts is excessively large. Even in such a case, since the contact portion 27 is arranged at a position away from the attachment portion 25 in the main body portion 24, the portion of the main body portion 24 from the attachment portion 25 to the contact portion 27 is elastically deformed. It becomes possible to absorb the pressing force that can be increased. Thereby, it is possible to prevent an excessive pressing force from acting on the reflection sheet 21 from the abutting portion 27, thereby ensuring the degree of freedom of expansion and contraction in the reflection sheet 21.

Further, the attachment portion 25 is disposed on the center side of the main body portion 24, whereas the contact portion 27 is disposed on the outer edge portion of the main body portion 24. In this case, the board holding member 20 can be stably held with respect to the chassis 14 by arranging the attachment portion 25 on the center side of the main body portion 24. In addition, by disposing the contact portion 27 on the outer edge portion of the main body portion 24, the distance between the mounting portion 25 and the contact portion 27 can be secured to the maximum, and the main body portion 24 is more easily elastically deformed. It becomes possible to do. Thereby, the absorption width | variety of the dimensional error which arises in manufacturing the board | substrate holding member 20 can be raised, and, thereby, the freedom degree of expansion / contraction in the reflective sheet 21 can be ensured more stably.

Further, at least a pair of the contact portions 27 are arranged at positions where the attachment portion 25 is sandwiched in the main body portion 24. If it does in this way, pressing force can be made to act with sufficient balance to reflective sheet 21, and it becomes possible to hold reflective sheet 21 appropriately, raising the degree of freedom of expansion and contraction of reflective sheet 21. Further, the main body portion 24 can be elastically deformed into an arcuate shape between the pair of contact portions 27.

Further, the contact portion 27 is arranged at a symmetrical position with the attachment portion 25 as the center. In this way, the pressing force can be applied to the reflective sheet 21 in a more balanced manner.

Further, the sandwiching portion 25b has a cantilever shape extending along the moving direction of the substrate holding member 20 and is elastically deformable. In this way, as the substrate holding member 20 is moved, at least the chassis 14 is clamped between the main body 24 and the clamping part 25b of the mounting part 25, the clamping part 25b can be elastically deformed. Therefore, the workability is excellent and the chassis 14 can be elastically sandwiched.

In addition, the chassis 14 and the sandwiching portion 25b are each provided with a locking structure that controls the movement of the substrate holding member 20 in the direction along the plate surface of the chassis 14 by locking each other. In this way, since the substrate holding member 20 is prevented from moving carelessly, the holding state with respect to the LED substrate 18 can be stably maintained. Moreover, since the clamping part 25b can be elastically deformed, the operation of locking the locking structure or releasing the locked state can be easily performed, and the workability is excellent.

The locking structure includes a locking hole 14f formed in the chassis 14, and a locking protrusion 25c that protrudes from the clamping portion 25b toward the chassis 14 and can be locked to the edge of the locking hole 14f. It is composed of In this way, the movement of the substrate holding member 20 can be restricted by entering the locking projection 25c on the clamping portion 25b side into the locking hole 14f on the chassis 14 side and locking it to the hole edge. it can.

Further, the mounting portion 25 is formed so as to be smaller than the mounting hole 14e in a plan view. If it does in this way, the operation | work which inserts / extracts the attachment part 25 with respect to the attachment hole 14e can be performed easily, and it is excellent in workability | operativity.

Further, the main body portion 24 is provided with a support portion 26 as a protrusion protruding to the side opposite to the chassis 14 side. According to this configuration, when attaching / detaching the substrate holding member 20 to / from the chassis 14, the operator holds the support portion 26 that protrudes from the main body portion 24 to the opposite side of the chassis 14 and performs the attachment / detachment operation. Is possible. Thereby, workability | operativity at the time of attaching / detaching the board | substrate holding member 20 can be improved further.

Further, the support portion 26 is disposed at a position overlapping the mounting portion 25 when viewed in plan. In this way, when the operator performs the mounting operation of the substrate holding member 20 while holding the support portion 26, the position of the mounting portion 25 can be easily grasped, so that the workability is excellent.

Further, the support portion 26 is disposed at a position that is concentric with the attachment portion 25. In this way, workability can be further improved.

The chassis 14 is provided with an optical member 15 disposed so as to cover the opening 14b so as to face the LED substrate 18 while an opening 14b for emitting light from the LED 17 is provided. The support portion 26 can support the optical member 15. If it does in this way, it can control that an optical member deforms so that it may approach to LED17 side by supporting optical member 15 by support part 26.

Further, the light source is the LED 17. In this way, high brightness and low power consumption can be achieved.

As mentioned above, although Embodiment 1 of this invention was shown, this invention is not restricted to the said embodiment, For example, the following modifications can also be included. In the following modifications, members similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and illustration and description thereof may be omitted.

[Modification 1 of Embodiment 1]
Modification 1 of Embodiment 1 is demonstrated using FIG. 17 or FIG. Here, what changed the shape of the contact part 27-1 is shown.

As shown in FIGS. 17 and 18, the contact portion 27-1 is formed in an annular shape so as to surround the attachment portion 25 on the center side in the main body portion 24. Specifically, the contact portion 27-1 has a rectangular endless annular shape (frame shape) when seen in a plan view and extends along the outer edge portion of the main body portion 24. Further, the contact portion 27-1 has a semicircular cross section, and the contact surface with respect to the chassis reflection sheet 22 is a spherical surface. When the substrate holding member 20 is attached to the chassis 14 from the state shown in FIG. 18, the annular contact portion 27-1 holds the gap C held between the main body portion 24 and the chassis reflection sheet 22 over the entire circumference. Since it surrounds, the gap C is avoided from opening into the chassis 14 (see FIG. 7). Therefore, the light in the chassis 14 is prevented from leaking into the gap C, whereby the chassis 14 is opened from the gap slightly held between the mounting portion 25 and the mounting hole 14e of the chassis 14 via the gap C. It is possible to prevent light from leaking outside.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. 19 or FIG. In this Embodiment 2, what changed the moving direction of the board | substrate holding member 120 accompanying attachment / detachment is shown. In addition, the overlapping description about the same structure, effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIGS. 19 and 20, the main body portion 124 and the attachment portion 125 forming the substrate holding member 120 are both substantially rectangular (longitudinal) when viewed in plan, and the long side direction thereof is the Y-axis direction ( The short side direction of the LED substrate 18) and the short side direction are made to coincide with the X-axis direction (long side direction of the LED substrate 18). On the other hand, the attachment hole 114e has a longitudinal shape similar to that of the main body portion 124 and the attachment portion 125. The substrate holding member 120 is disposed at a substantially intermediate position between the diffusion lenses 19 (LEDs 17) adjacent to each other in the X-axis direction, and the moving direction associated with the attachment / detachment of the substrate holding member 120 with respect to the chassis 114 is the attachment portion 125 and It is set to coincide with the Y-axis direction which is the long side direction of the mounting hole 114e. Therefore, in setting the movement stroke of the substrate holding member 120, it is not necessary to consider the distance between the diffusion lenses 19 adjacent in the X-axis direction, thereby setting a larger movement stroke as compared with the first embodiment. It becomes possible. By adopting such a design, it becomes possible to increase the clamping area of the clamping part 125b with respect to the chassis 114, so that the board holding member 120 can be held on the chassis 114 more stably. In other words, even when the distance between the diffusing lenses 19 adjacent in the X-axis direction is narrow, the substrate holding member 120 can be arranged by setting the short side dimension of the main body 124 accordingly. In addition, when the substrate holding member 120 is attached / detached, the substrate holding member 120 is less likely to interfere with the diffusing lens 19 and the workability during attachment / detachment is excellent. The left side shown in FIG. 20 (upper side shown in FIG. 19) is the mounting direction of the substrate holding member 120, and the opposite right side (lower side shown in FIG. 19) is the removal direction.

The mounting hole 114e and the mounting portion 125 are disposed in a region between the LED substrates 18 adjacent to each other in the Y-axis direction, and are disposed at positions that do not overlap with the LED substrate 18 in a plan view. Therefore, it is not necessary to form the through hole 18b as in the first embodiment in the LED substrate 18. The main body portion 124 has a long side dimension that is twice the short side dimension of the LED substrate 18 and a distance between the LED substrates 18 adjacent in the Y-axis direction. In the state where the substrate holding member 120 is in the holding position, the main body portion 124 is disposed across the two LED substrates 18 adjacent in the Y-axis direction, and both the LED substrates 18 are collectively connected to the chassis 114. Hold. As shown in FIG. 19, two of the substrate holding members 120 are disposed at positions spaced apart from the LED substrate 18 in the X-axis direction (specifically, positions where the two diffusion lenses 19 are sandwiched). In the mounted state, the mounting portion 125 is disposed at a position that does not overlap with the LED substrate 18 in a plan view. As shown in FIG. 20, a chassis is interposed between the sandwiching portion 125b and the main body portion 124. Although the LED 114 is interposed, the LED substrate 18 is not interposed.

As described above, according to the present embodiment, the LED substrate 18 has a longitudinal shape and a plurality of LEDs 17 are mounted along the long side direction, whereas the mounting hole 114e has the LED substrate 18 mounted thereon. The movement direction of the substrate holding member 120 coincides with the short side direction of the LED substrate 18. In this way, the LED substrate 18 can be held or released by moving the substrate holding member 120 along the short side direction of the LED substrate 18.

Further, the main body 124 is arranged in a region between the adjacent LEDs 17 in the LED substrate 18 in a plan view. If it does in this way, the field between LED17 which adjoins among LED boards 18 can be used effectively. Here, since the moving direction of the substrate holding member 120 is the short side direction of the LED substrate 18, that is, the direction orthogonal to the arrangement direction of the LEDs 17, the region between the adjacent LEDs 17 is at least as large as the size of the main body portion 124. If it is ensured, the substrate holding member 120 can be attached. That is, it is suitable when the arrangement pitch of the LEDs 17 is narrow.

In addition, a plurality of LED substrates 18 are arranged in parallel in the short side direction of the LED substrate 18 in the chassis 114, whereas the attachment holes 114e and the attachment portions 125 are the same as the LED substrate 18 in a plan view. It is arranged at a position where it does not overlap. In this way, since it is not necessary to form a hole through which the attachment portion 125 is passed through the LED substrate 18, the manufacturing cost of the LED substrate 18 can be reduced. Further, it is advantageous in forming a wiring pattern WP for connecting the LEDs 17 on the LED substrate 18.

The plurality of LED boards 18 are arranged in parallel in the short side direction of the LED board 18 in the chassis 114, whereas the main body 124 is arranged to straddle the plurality of LED boards 18. In this way, a plurality of LED boards 18 can be held together by a single board holding member 120. As compared with the case where each LED board 18 is individually held by a board holding member, the number of use of the board holding member 120 and the number of attaching / detaching operations thereof can be reduced, so that the workability can be further improved. .

As mentioned above, although Embodiment 2 of this invention was shown, this invention is not restricted to the said embodiment, For example, the following modifications can also be included. In the following modifications, members similar to those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and illustration and description thereof may be omitted.

[Modification 1 of Embodiment 2]
A first modification of the second embodiment will be described with reference to FIG. Here, what changed the installation number etc. of the attaching part 125-1 is shown.

As shown in FIG. 21, the body portion 124 is provided with a pair of attachment portions 125-1. Among the attachment portions 125-1, the first attachment portion 125A on the right side shown in FIG. 21 has the same configuration as the

attachment portions

25 and 125 shown in the first and second embodiments, whereas FIG. The second attachment portion 125B on the left side is different from the first attachment portion 125A in that it does not have a locking structure for the chassis 114. The second attachment portion 125B includes a base portion 125Ba that protrudes from the main body portion 124 toward the back side, and a sandwiching portion 125Bb that extends in a cantilever direction from the base portion 125Ba toward the attachment direction of the substrate holding member 120 along the Y-axis direction. It is composed of. The extending tip portion of the sandwiching portion 125Bb is bent away from the chassis 114 as it goes to the tip side, and this is a guide portion 125Bc that exhibits a guide function when attached. Thereby, the attaching / detaching work of the substrate holding member 120 can be further improved. The second mounting portion 125B is disposed at a position where the second mounting portion 125B does not overlap with the LED substrate 18 when viewed in a plane, whereas the first mounting portion 125A is disposed at a position where a portion thereof overlaps with the LED substrate 18 when viewed in a plane. Has been. Accordingly, the LED substrate 18 is sandwiched together with the chassis 114 between the sandwiching portion 125Ab and the main body portion 124 in the first attachment portion 125A. Thus, by providing a pair of attachment portions 125-1, the substrate holding member 120 can be more stably held with respect to the chassis 114. Further, the support portion 126 is disposed at a position overlapping the first attachment portion 125A when viewed in plan. In this modification, the contact portion is omitted.

As described above, according to the present modification, the holding portion 125Ab can hold the LED board 18 together with the chassis 114 between the main body portion 124 and the holding portion 125Ab. In this way, since the LED board 18 is clamped together with the chassis 114 between the main body 124 and the clamping part 125Ab, the LED board 18 can be held more stably. If the holding state on the LED board 18 is stabilized, for example, heat transfer from the LED board 18 to the chassis 114 can be improved and heat dissipation characteristics can be improved, and thus the luminous efficiency of the LED 17 can be maintained at a high level. It becomes.

[Modification 2 of Embodiment 2]
A second modification of the second embodiment will be described with reference to FIG. 22 or FIG. Here, the main body 124-2 is changed in size.

As shown in FIGS. 22 and 23, a pair of substrate holding members 120-2 are attached to each LED substrate 18. The main body portion 124-2 has a long side dimension slightly longer than the short side dimension of the LED substrate 18, and each LED substrate 18 is individually separated without straddling between the LED substrates 18 adjacent to each other in the Y-axis direction. Hold on. In addition, the pair of substrate holding members 120-2 attached to each LED substrate 18 are respectively arranged at positions spaced apart from each other by a predetermined dimension (an interval of about two diffusion lenses 19 minutes) in the X-axis direction. As described above, the long side dimension of the main body portion 124-2 is made shorter than that of the second embodiment and the modified example 1, so that the diffusing lens 19 is attached when the substrate holding member 120-2 is attached to or detached from the chassis 114. In contrast, the substrate holding member 120-2 is less likely to interfere with each other, thereby improving workability during attachment / detachment.

[Modification 3 of Embodiment 2]
A third modification of the second embodiment will be described with reference to FIG. 24 or FIG. Here, an arrangement of the substrate holding member 120-3 in the chassis 114 is shown.

In the chassis 114, as shown in FIG. 24, eight LED boards 18 are arranged in parallel in the Y-axis direction. On the other hand, the substrate holding members 120-3 are arranged in pairs at positions separated from each LED substrate 18 in the X-axis direction, and collectively two adjacent LED substrates 18 in the Y-axis direction. In the chassis 114, a plurality (specifically, a total of 24) are intermittently arranged in a zigzag shape. Each board holding member 120-3 passes through the center position of the chassis 114 in the short side direction (Y-axis direction) and extends along the long side direction (X-axis direction) as a boundary. It is arranged so that the mounting direction with respect to is opposite. Specifically, the area in the chassis 114 can be divided into a first area A1 on the upper side shown in FIG. 24 with respect to the reference line L and a second area A2 on the lower side in the figure. Each substrate holding member 120-3 arranged in the direction of attachment to the chassis 114 is the direction of arrow Y1 shown in FIG. 24, whereas each substrate holding member 120-3 arranged in the second region A2 3, the mounting direction with respect to the chassis 114 is opposite to the direction of the arrow Y2 shown in FIG. 24, that is, the direction of the arrow Y1.

More specifically, as shown in FIG. 25, the substrate holding member 120-3 disposed in the first region A1 is protruded from the base 125a-3 in the mounting portion 125-3. Is attached to the chassis 114 so as to coincide with the direction of the arrow line Y1. On the other hand, the substrate holding member 120-3 disposed in the second region A2 is arranged so that the protruding direction of the clamping part 125b-3 from the base part 125a-3 in the attachment part 125-3 coincides with the direction of the arrow line Y2. Attached to the chassis 114. Further, the arrangement of the mounting holes (not shown) in the chassis 114 is also changed so as to be adapted to the arrangement of the respective mounting portions 125-3. The removal direction of the substrate holding member 120-3 arranged in the first area A1 coincides with the direction of the arrow Y2, whereas the substrate holding member 120- arranged in the second area A2 is used. The removal direction of 3 coincides with the direction of the arrow line Y1. In addition, the mounting directions of the substrate holding members 120-3 in the regions A1 and A2 are both directions away from the reference line L, while the removal directions are both directions close to the reference line L.

In the case of adopting the above configuration, in the manufacturing process, when performing the work of attaching each substrate holding member 120-3 to the chassis 114, the worker in charge of attachment to the first area A1 and the attachment to the second area A2 It is preferable to share the work with the worker in charge. The workers in charge of each of the areas A1 and A2 are arranged at positions where the chassis 114 is sandwiched in the Y-axis direction, and each worker has a common “the mounting direction of the substrate holding member 120-3 is the front side”. Therefore, it is difficult for each worker to misunderstand the work method, and the work efficiency can be improved. The same effect can be obtained when the substrate holding member 120-3 is removed from the chassis 114.

As described above, according to this modification, a plurality of the substrate holding members 120-3 are arranged in a distributed manner at positions sandwiching the reference line L across the approximate center of the chassis 114 in the chassis 114. The substrate holding members 120-3 arranged at positions sandwiching the line L are set so that the moving directions accompanying the attachment to the chassis 114 are opposite to each other. In this way, when performing the work of attaching the substrate holding member 120-3 to the chassis 114, the work for attaching the areas A1 and A2 in the chassis 114 with the reference line L as a boundary is shared by the operator. It is possible to share the contents of work instructions to workers. Thereby, the working efficiency can be improved.
In addition, the attachment direction and removal direction of each board | substrate holding member 120-3 in each area | region A1, A2 can be changed suitably, for example, the attachment direction of each board | substrate holding member 120-3 in each area | region A1, A2. Can be the direction approaching the reference line L, and the removal direction can be the direction moving away from the reference line L.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the first embodiment described above, the substrate holding member moves along the long side direction of the LED substrate, and the LED substrate is formed with a through hole. However, the through hole is omitted from the LED substrate. It is also possible. Specifically, the main body portion may be extended to a position where it does not overlap with the LED substrate in plan view, and the attachment portion may be provided at a portion that does not overlap with the LED substrate.

(2) In the first embodiment, the short side dimension of the main body can be made substantially the same as the short side dimension of the LED substrate, or can be made larger than the short side dimension of the LED substrate.

(3) In the second embodiment described above, the substrate holding member moves along the short side direction of the LED substrate, and the LED substrate is not formed with a through hole. It is also possible to provide a through-hole in the LED substrate while arranging it to overlap.

(4) In each of the above-described embodiments, the main body is formed in a rectangular shape (longitudinal shape) when viewed in plan, but the planar shape of the main body can be changed as appropriate. The shape of the main body may be, for example, a circle, an ellipse, a square, or a triangle when viewed in plan. Similarly, the planar shape of the mounting portion can be changed as appropriate.

(5) In each of the above-described embodiments, the attachment portion has a cantilever-shaped sandwiching portion. However, the sandwiching portion can be a double-supported shape. In addition to this, for example, the present invention includes a sandwiching portion having a shape that expands in a flange shape from the protruding end of the base portion.

(6) In each of the above-described embodiments, the substrate holding member and the chassis have the locking structure (the locking protrusion and the locking hole). However, the structure in which the locking structure is omitted is also included in the present invention. . Specifically, only the second mounting portion that does not have the locking protrusion shown in Modification 1 of Embodiment 2 is provided on the substrate holding member as the mounting portion, and the locking hole is omitted from the chassis. That's fine. In that case, it is preferable from the viewpoint of securing the holding force to elastically clamp the chassis (LED substrate) by elastically deforming the clamping portion in the attached state.

(7) In each of the above-described embodiments, the locking structure has been provided with a locking projection on the clamping portion side and a locking hole on the chassis side, but on the contrary, the locking projection on the chassis side, A structure in which a locking hole is provided on the holding part side is also included in the present invention.

(8) In each of the above-described embodiments, the attachment hole is larger than the attachment portion when seen in a plane, but the attachment hole is smaller than the attachment portion when seen in a plane is also included in the present invention. Specifically, the long side dimension of the mounting hole (the dimension in the moving direction of the substrate holding member) may be smaller than the long side dimension of the mounting portion. In that case, when the substrate holding member is attached, the attachment portion can be inserted into the attachment hole by tilting the substrate holding member.

(9) In each of the embodiments described above, the movement direction of the substrate holding member accompanying attachment / detachment is the same as the long side direction or the short side direction of the LED substrate, but the movement direction is the long side direction of the LED substrate and Those that coincide with the direction (diagonal direction) intersecting both of the short side directions are also included in the present invention.

(10) In addition to the above-described embodiments, the number and arrangement of the substrate holding members on the chassis or LED substrate can be changed as appropriate. Specifically, two or more substrate holding members can be attached to one LED substrate. It is also possible to arrange the substrate holding members in a grid in the chassis.

(11) In each of the above-described embodiments, the substrate holding member is shown in which the support portion and the base portion of the attachment portion are arranged concentrically, but the support portion and the base portion of the attachment portion overlap in plan view. However, arrangements that are not concentric are also included in the present invention. Further, the present invention includes an arrangement in which the support portion and the base portion of the attachment portion do not overlap in plan view.

(12) In each of the above-described embodiments, the substrate holding member has the support portion that can support the optical member. However, the support portion may be omitted. Further, instead of the support portion, it is also possible to provide a protrusion that does not have a support function for the optical member in the main body, and to perform the attaching / detaching operation of the substrate holding member using the protrusion.

(13) In each of the above-described embodiments, the one using a diffusion lens that diffuses the light from the LED is shown. However, one using an optical lens other than the diffusion lens (for example, a condensing lens) is also included in the present invention. It is. Moreover, what abbreviate | omitted the diffuser lens is also contained in this invention, and it is also possible to abbreviate | omit the board | substrate reflective sheet in that case with abbreviate | omitting a diffuser lens.

(14) In addition to the above-described embodiments, the specific shape, arrangement, number of installations, and the like of the contact portion can be changed as appropriate. Specifically, the present invention includes those in which the contact portion has a cylindrical shape, a prismatic shape, a conical shape, a pyramid shape, or the like, and those in which the cross-sectional shape in the contact portion is a mountain shape (triangle) or an elliptical shape included. It is also possible to arrange the contact part at a position other than the outer edge part in the main body part. It is also possible to install three or less or five or more abutting portions with respect to the main body portion.

(15) In each of the above-described embodiments, the portion of the main body portion between the base portion of the mounting portion and the contact portion is made elastic. However, the main body portion needs to be elastic. However, the present invention also includes a configuration in which the main body is set to be hardly or not elastically deformed. Even in such a case, the positions where the pressing force acts on the respective reflective sheets from the front side and the back side are shifted from each other when viewed in a plane, so that the stress concentration on each reflective sheet can be preferably alleviated. The effect of increasing the degree of freedom of expansion and contraction can be obtained.

(16) Contrary to the above (15), in order to give elasticity to a portion of the main body portion between the base portion of the mounting portion and the abutting portion, for example, the abutting portion is designed to positively bend easily. It is of course possible to make the main body elastically deformed even when there is no dimensional error by increasing the projecting dimension from the main body.

(17) In the modifications of the second embodiment described above, the contact portion is omitted. However, it is of course possible to provide the contact portion in these modifications. On the contrary, in the first and second embodiments, the contact portion can be omitted.

(18) In each of the above-described embodiments, the surface of the substrate holding member is exemplified as white. However, the surface of the substrate holding member may be milky white or silver, for example. Moreover, it is possible to set the surface color by applying a desired color paint to the surface of the substrate holding member.

(19) In each of the above-described embodiments, it has been described that the LED board is used in an appropriate combination of the five-mounting type, the six-mounting type, and the eight-mounting type, but other than five, six, and eight. What used the LED board which mounted the number of LED is also contained in this invention.

(20) In each of the above-described embodiments, the case where an LED chip that emits blue light in a single color and an LED that emits white light using a phosphor is used has been described. However, an LED chip that emits ultraviolet light in a single color is shown. A built-in LED that emits white light with a phosphor is also included in the present invention.

(21) In each of the above-described embodiments, the case where an LED chip that emits blue light in a single color and that emits white light with a phosphor is used has been shown. However, R, G, and B emit light in a single color. Those using three types of LED chips that incorporate LED chips are also included in the present invention. In addition, the present invention includes an LED using a type of LED in which three types of LED chips each emitting C (cyan), M (magenta), and Y (yellow) are monochromatic.

(22) In the above-described embodiments, the LED using white light emitting LED is shown. However, the red light emitting LED, the blue light emitting LED, and the green light emitting LED are used in appropriate combination. May be.

(23) In each of the above-described embodiments, an example in which an LED is used as a light source is illustrated. However, an example in which a point light source other than an LED is used is also included in the present invention.

(24) Besides the above-described embodiments, the screen size and the aspect ratio of the liquid crystal display device can be changed as appropriate.

(25) In each of the above-described embodiments, the liquid crystal panel and the chassis are vertically placed with the short side direction aligned with the vertical direction. However, the liquid crystal panel and the chassis have the long side direction in the vertical direction. Those that are in a vertically placed state matched with are also included in the present invention.

(26) In each of the embodiments described above, a TFT is used as a switching element of a liquid crystal display device. However, the present invention can be applied to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)), and color In addition to the liquid crystal display device for display, the present invention can also be applied to a liquid crystal display device for monochrome display.

(27) In each of the above-described embodiments, the liquid crystal display device using the liquid crystal panel as the display panel has been exemplified. However, the present invention can also be applied to display devices using other types of display panels.

(28) In each of the above-described embodiments, the television receiver provided with the tuner is exemplified, but the present invention is also applicable to a display device not provided with the tuner.

(29) The technical contents of Modification 3 of Embodiment 2 described above can be applied to those using a substrate holding member of the type shown in Embodiment 1. That is, a reference line is set along the Y-axis direction through the center in the long side direction in the chassis shown in the first embodiment, and the movement direction accompanying the attachment in each substrate holding member arranged in each region sandwiching the reference line May be opposite to each other.

DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Backlight device (illumination device), 14, 114 ... Chassis, 14b ... Opening part, 14e, 114e ... Mounting hole, 14f ... Stop hole, 15 ... optical member, 17 ... LED (light source), 18 ... LED substrate (light source substrate), 20, 120 ... substrate holding member, 21 ... reflective sheet (reflective member), 22 ... reflective sheet for chassis (reflective member) ), 23... Reflective sheet (reflective member), 24, 124... Body part, 25, 125... Mounting part, 25 b, 125 b .. clamping part, 25 c. 27: Contact portion, C: Gap, TV: Television receiver, WP: Wiring pattern

Claims

A light source, a light source substrate on which the light source is mounted, a chassis that houses the light source substrate and has a mounting hole, a main body that can be held between the chassis and the light source substrate, and the main body A board holding member having a mounting portion that protrudes from the chassis side and is inserted into the mounting hole.
The mounting portion can sandwich at least the chassis with the main body portion as the substrate holding member is moved in a direction along the plate surface of the chassis while being inserted into the mounting hole. A lighting device having a sandwiching portion.
The light source substrate has a longitudinal shape and a plurality of the light sources are mounted side by side along the long side direction, whereas the mounting hole has a longitudinal shape parallel to the long side direction of the light source substrate. The lighting device according to claim 1, wherein a moving direction of the substrate holding member coincides with a long side direction of the light source substrate and the mounting hole.
The lighting device according to claim 2, wherein the clamping unit can clamp the light source substrate together with the chassis between the body unit and the body unit.
The mounting portion is disposed at a position overlapping the light source substrate in a plan view, whereas the light source substrate is provided with a through hole that communicates with the mounting hole and through which the mounting portion passes. The lighting device according to claim 3, wherein an edge portion of the through hole is clamped together with the chassis between the main body portion and the clamping portion.
In the light source substrate, a wiring pattern for connecting the light sources is formed extending along the long side direction, whereas the through hole is formed in the long side direction of the light source substrate and the mounting hole. The illuminating device of Claim 4 which has comprised the parallel longitudinal shape.
The lighting device according to claim 4 or 5, wherein the mounting portion can be brought into contact with an edge portion of the through hole.
The lighting device according to any one of claims 3 to 6, wherein the main body has a longitudinal shape parallel to a long side direction of the light source substrate.
The lighting device according to any one of claims 3 to 7, wherein the main body portion is arranged at a position that is concentric with respect to the light source substrate in a short side direction.
The lighting device according to any one of claims 3 to 8, wherein the clamping portion has a longitudinal shape parallel to a long side direction of the light source substrate.
The lighting device according to any one of claims 2 to 9, wherein the main body portion is disposed in a region between the adjacent light sources in the light source substrate in a plan view.
The lighting device according to claim 10, wherein the main body is disposed at an intermediate position between the light sources adjacent to each other in the light source substrate when viewed in a plan view.
The light source substrate has a longitudinal shape and a plurality of the light sources are mounted side by side along the long side direction, whereas the mounting hole has a longitudinal shape parallel to the short side direction of the light source substrate. The lighting device according to claim 1, wherein a moving direction of the substrate holding member coincides with a short side direction of the light source substrate.
The lighting device according to claim 12, wherein the main body portion is disposed in a region between the light sources adjacent to each other in the light source substrate in a plan view.
A plurality of the light source boards are arranged in parallel in the short side direction of the light source board in the chassis, whereas the mounting holes and the mounting portions do not overlap the light source board in a plan view. The lighting device according to claim 12 or 13, which is arranged at a position.
The plurality of light source boards are arranged in parallel in the short side direction of the light source board in the chassis, while the main body is arranged to straddle the plurality of light source boards. The lighting device according to any one of claims 14 to 14.
The lighting device according to any one of claims 12 to 15, wherein the clamping unit is capable of clamping the light source substrate together with the chassis between the body unit and the body unit.
A reflection member that reflects light is interposed between the main body portion and the light source substrate, and the main body portion protrudes toward the reflection member on a surface facing the reflection member, and is disposed on the reflection member. The lighting device according to any one of claims 1 to 16, wherein a contact portion that is in contact with the lighting device is provided.
The lighting device according to claim 17, wherein the contact portion is disposed at a position away from the attachment portion in the main body portion.
The lighting device according to claim 18, wherein the attachment portion is disposed on a central side of the main body portion, whereas the contact portion is disposed on an outer edge portion of the main body portion.
The lighting device according to claim 18 or 19, wherein at least a pair of the contact portions are arranged at a position sandwiching the attachment portion in the main body portion.
The lighting device according to claim 20, wherein the contact portion is arranged at a symmetrical position with the attachment portion as a center.
The lighting device according to any one of claims 1 to 21, wherein the holding portion has a cantilever shape extending along a moving direction of the substrate holding member and is elastically deformable.
23. The illumination according to claim 22, wherein the chassis and the sandwiching portion are each provided with a locking structure that locks the substrate holding member to restrict movement of the substrate holding member in a direction along a plate surface of the chassis. apparatus.
The locking structure includes a locking hole formed in the chassis, and a locking protrusion that protrudes from the clamping portion toward the chassis and can be locked to a hole edge of the locking hole. The lighting device according to claim 23.
The lighting device according to any one of claims 1 to 24, wherein the mounting portion is formed to be smaller than the mounting hole in a plan view.
The lighting device according to any one of claims 1 to 25, wherein the main body portion is provided with a protrusion that protrudes on a side opposite to the chassis side.
27. The lighting device according to claim 26, wherein the protrusion is arranged at a position overlapping the mounting portion when seen in a plan view.
The lighting device according to claim 27, wherein the protrusion is disposed at a position concentric with the mounting portion.
The chassis is provided with an optical member arranged to cover the opening so as to face the light source substrate, whereas an opening for emitting light from the light source is provided. The lighting device according to any one of claims 26 to 28, wherein the protrusion is capable of supporting the optical member.
A plurality of the substrate holding members are arranged in a distributed manner at positions sandwiching a reference line crossing substantially the center of the chassis in the chassis, and each substrate holding member disposed at a position sandwiching the reference line The lighting device according to any one of claims 1 to 29, wherein movement directions associated with attachment to the chassis are set to be opposite to each other.
The lighting device according to any one of claims 1 to 30, wherein the light source is an LED.
A display device comprising: the illumination device according to any one of claims 1 to 31; and a display panel that performs display using light from the illumination device.
The display device according to claim 32, wherein the display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates.
A television receiver comprising the display device according to claim 32 or claim 33.