WO2011011954A1 - Apparatus with nested support pin assemblies - Google Patents

Apparatus with nested support pin assemblies Download PDF

Info

Publication number
WO2011011954A1
WO2011011954A1 PCT/CN2009/076050 CN2009076050W WO2011011954A1 WO 2011011954 A1 WO2011011954 A1 WO 2011011954A1 CN 2009076050 W CN2009076050 W CN 2009076050W WO 2011011954 A1 WO2011011954 A1 WO 2011011954A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixing plate
column
positioning
top column
nested
Prior art date
Application number
PCT/CN2009/076050
Other languages
French (fr)
Chinese (zh)
Inventor
杨明生
范继良
王银果
王曼媛
王勇
Original Assignee
东莞宏威数码机械有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞宏威数码机械有限公司 filed Critical 东莞宏威数码机械有限公司
Publication of WO2011011954A1 publication Critical patent/WO2011011954A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces

Definitions

  • This invention relates to a nested top column apparatus, and more particularly to a nested top column apparatus for separating, positioning and overlapping substrates stacked in a thin plate-like substrate process. Background technique
  • OLED display is a new product in digital products
  • OLED is Organic Light-Emitting Diode, also known as Organic Electroluminesence Display (OELD), because it is light, power-saving, etc.
  • OELD Organic Electroluminesence Display
  • OLED display screen and traditional TFT-LCD display screen Different, it does not require a backlight, uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light, and the OLED display screen can be made lighter and thinner, and the viewing angle is more Large, and can significantly save power; accordingly, the OLED display screen is manufactured Some devices must ensure the accuracy requirements of the OLED display screen.
  • the substrate plays an important role. The substrate material of the OLED is very thin and fragile glass. In the substrate fabrication process and subsequent processes of the OLED, it is often necessary to separate and position the stacked substrates. Stacking; In order to ensure the quality and precision of the OLED, the automation of the substrate processing is becoming more and more high during the processing, and the nesting column device for the separation, positioning and stacking of the substrate is also proposed to be higher. Claim.
  • the control is complicated and the processing efficiency of the board is low. Secondly, the separation of each layer of substrate is required. Positioning, processing cycle is longer; Again, due to the large number of top columns and drive systems, the overall structure of the nested top column equipment is complicated and costly; in addition, because the nested top column equipment does not have effective damping during the positioning process The mechanism repeats the action when the substrate is separated and positioned, so the vibration is large, and the performance is unstable, thereby affecting the quality of the substrate.
  • the object of the present invention is to provide a nested top column device which has a small number of top columns and driving devices, compact structure, synchronous feeding of the driving device and effective shock absorption.
  • the technical solution of the present invention is: providing a nested top column device, comprising at least three nested top pillar assemblies, a top pillar fixing plate assembly, a positioning mechanism assembly and a driving device, wherein the positioning mechanism component is located Above the top pillar fixing plate assembly, the nesting top pillar assembly is located between the positioning mechanism assembly and the top pillar fixing plate assembly, and the nesting top pillar assembly includes at least two movable joints a top pillar fixing plate assembly comprising a top pillar fixing plate corresponding to the top pillar and parallel to each other and connected, the positioning mechanism assembly including a positioning plate corresponding to the top pillar and parallel to each other,
  • the maximum height difference between the top pillar fixing plates is greater than or equal to a maximum height difference between the positioning plates, and the top pillars are respectively fixedly connected to the corresponding top pillar fixing plates, and the driving device is located at the bottom
  • the top pillar fixing plate is fixedly connected, and the driving device drives the top pillar fixing plate to perform linear reciprocating motion
  • the nesting top column device further includes a connecting mechanism, the connecting mechanism includes a connecting post and an elastic member, the connecting post passes through a top pillar fixing plate constituting the top pillar fixing plate assembly, and the Even The lower end of the connecting post is fixedly connected with the top pillar fixing plate located at the bottom, the upper end of the connecting post is engaged with the top pillar fixing plate located at the top, and the elastic component is compressed and sleeved on the adjacent top pillar.
  • the connecting column between the plates due to the installation of elastic elements between the top column fixing plates, in the process of positioning the separated objects, the vibration caused by the collision is effectively reduced, so that the performance of the nesting top column device is better. stable.
  • the top pillars constituting the nested top pillar assembly are gradually shortened from the inside to the outside, so that the top pillars of different lengths form different height planes, and one end of the same length of the top pillars is connected with the corresponding pillar pillar fixing plates. The other end forms a plane of height against the substrate.
  • the top pillars in the same height plane are sequentially jacked up by the corresponding fixedly connected top pillar fixing plates to form a plurality of height planes.
  • Separating the laminated substrate; the nested top column assembly is sequentially nested with a plurality of top pillars to realize separation of the multi-layer substrate.
  • the nested top pillar assembly requires only three to define a plane, and the nested top pillar The number of components is greatly reduced, making the structure of the nested top column device simple and cost-effective.
  • the nesting top column assembly comprises two top columns, wherein the two top columns are a first stage top column and a second stage top column in a hollow structure, and the length of the second stage top column is greater than one stage.
  • the length of the top column, the secondary top column is movably sleeved in the first stage top column, and the second stage top column of the same length is fixedly connected with a top column fixing plate, and the first stage top column of the same length and another
  • the top column fixing plate is fixedly connected, and the first stage top column in the same height plane and the second stage top column in the other height plane are sequentially jacked up, so that the separation of the two stacked substrates is realized.
  • the top pillar fixing plate assembly comprises two top pillar fixing plates, and the two top pillar fixing plates are respectively a first top column fixing plate and a second top column fixing plate, and the first column fixing column is fixed.
  • the plate is located above the secondary top column fixing plate, the first stage top column fixing plate is fixedly connected with the lower end of the first stage top column, and the second stage top column fixing plate is fixed to the lower end of the second stage top column connection.
  • a driving device can sequentially drive the movement of the top column fixing plates of each stage, and there is no problem of synchronous feeding of multiple driving devices, so that the driving difficulty of the nesting top column device is reduced, thereby improving the processing efficiency of the substrate.
  • the positioning mechanism assembly includes two positioning plates, and the two positioning plates are respectively a first positioning plate and a second positioning plate, and the second positioning plate is located above the first positioning plate.
  • Both the primary positioning plate and the secondary positioning plate have a hollow structure, and the hollow structure forms a separation cavity, and the separation cavity The positioning plate is inserted, and the separation cavity of the primary positioning plate is larger than the separation cavity of the secondary positioning plate.
  • the upper substrate can be separated by the separation chamber of the positioning plate, and the lower substrate is positioned by the positioning plate to realize separation and positioning of the multilayer laminated substrate.
  • the nesting top column device further comprises a bottom object pad, the bottom object pad is located between the positioning mechanism assembly and the nested top column assembly, and the bottom object pad and the bottom plate
  • the positioning plate is parallel to each other, the bottom object pad has a hollow structure, the hollow structure penetrates the bottom object pad; the bottom object pad is used to carry the laminated substrate to be separated, the first stage top column and The secondary top column passes through the hollow structure of the bottom object pad to withstand the laminated substrate to be separated.
  • the nesting top column device of the present invention comprises at least three nested top column assemblies, a top column fixing plate assembly, a positioning mechanism assembly and a driving device, and the positioning mechanism assembly is fixed on the top column.
  • the nested top post assembly is located between the positioning mechanism assembly and the top post fixing plate assembly, and the nesting top post assembly includes at least two top pillars that are movably nested with each other.
  • the top pillar fixing plate assembly includes a top pillar fixing plate corresponding to the top pillars and connected to each other and connected to each other, and the positioning mechanism assembly includes positioning plates corresponding to the top pillars and parallel to each other, and the top pillars are fixed
  • the maximum height difference between the plates is greater than or equal to the maximum height difference between the positioning plates
  • the top columns are respectively fixedly connected to the corresponding top column fixing plates
  • the top column fixing plate synchronously drives the top column to move; according to the order from the outside to the inside, the same height
  • the top pillars of the plane are sequentially jacked up to form a plurality of height planes, so that the separation of the laminated substrates is achieved.
  • the three top pillars can define a substrate plane, only three nested top pillar assemblies are required to realize the multilayer substrate. Separation, the number of nested top column components is greatly reduced, so that the structure of the nested top column device is simple and the cost is reduced; the top column is fixedly connected to the corresponding top column fixing plate, and the driving device and the top column are located at the bottom.
  • the fixing plate is fixedly connected, and when the driving device drives the top column fixing plate, the top column fixing plate drives the top column linear motion fixedly connected thereto, and only needs one driving device to drive the movement of the top column fixing plate of each stage, there is no more
  • the synchronous feeding problem of the driving device reduces the driving difficulty of the entire nesting top column device, thereby improving the processing efficiency of the substrate; the top column fixing plates are parallel and connected with each other, effectively reducing the separated objects
  • the vibration caused by the collision during the positioning process makes the performance of the nested top column device relatively stable.
  • FIG. 1 is a schematic cross-sectional structural view of a nested top column apparatus of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing the state in which the first substrate of the nested column device of the present invention is positioned.
  • FIG 3 is a schematic cross-sectional view showing a state in which a second substrate is positioned in the nested column device of the present invention.
  • Fig. 4 is a cross-sectional view showing the state in which the first substrate and the second substrate are overlapped in the nested column device of the present invention. detailed description
  • the nesting top column apparatus 1 of the present invention comprises four nested top pillar assemblies 12, a top pillar fixing plate assembly 13, a positioning mechanism assembly 11 and a driving device 14, and the positioning mechanism assembly 11 is located at the top.
  • the nesting top column assembly 12 is located between the positioning mechanism assembly 11 and the top column fixing plate assembly 13, and the nesting top column assembly 12 includes two first stage top posts 121 that are movably coupled to each other and The second top column 122
  • the top column fixing plate assembly 13 includes a first stage column fixing plate 131 and a second stage column fixing plate 132 corresponding to the first stage column 121 and the second stage column 122 and connected to each other
  • positioning The mechanism assembly 11 includes a primary positioning plate 111 and a secondary positioning plate 112 corresponding to the primary top column 121 and the secondary top column 122 and parallel to each other, and the primary top column fixing plate 131 and the secondary top column fixing plate 132
  • the height difference between the first positioning plate 111 and the second positioning plate 112 is greater than or
  • the top pillar fixing plate 132 is fixedly connected, and the driving device and the second-stage top pillar located at the bottom
  • the fixed plate 132 is fixedly connected, and the driving device drives the first-stage top column fixing plate 131 and the second-stage top column fixing plate 132 to perform linear reciprocating motion, and the first-stage top column fixing plate 131 and the second-stage top column fixing plate 132 respectively drive the first stage synchronously.
  • the top post 121 and the secondary top post 122 move.
  • the nesting top column apparatus 1 of the present invention further includes a connecting mechanism 15 and a bottom object pad 16 disposed between the positioning mechanism assembly 11 and the nested top post assembly 12, and the bottom object pad 16 and the positioning mechanism assembly
  • the positioning plates of 11 are parallel to each other, and the bottom object pad 16 has a hollow structure, the hollow structure penetrates the bottom object pad 16 , and the bottom object pad 16 is used to carry the laminated substrate to be separated;
  • the connecting mechanism 15 is connected to the top column fixing plate Between the primary top pillar fixing plate 131 and the secondary top pillar fixing plate 132 of the assembly 13;
  • the primary positioning plate 111, the secondary positioning plate 112 and the bottom object pad 16 in the nesting top column device 1 of the present invention are all fixedly connected to the outside according to the actual height.
  • the positioning mechanism assembly 11 includes two positioning plates arranged in parallel, and the two positioning plates are respectively a first positioning plate 111 and a second positioning plate 112.
  • the second positioning plate 112 is disposed above the first positioning plate 111.
  • the first positioning plate 111 and the second positioning plate 112 are both hollow structures, the hollow structure forms a separation cavity, the separation cavity penetrates the positioning plate, and the separation cavity of the primary positioning plate 111 is larger than the separation cavity of the secondary positioning plate 112;
  • the backing plate 16 is located above the primary top column 121 and the second stage top column 122, and parallel to the primary positioning plate 111 and the secondary positioning plate 112, and the first-stage top column 121 and the second-stage top column 122 that are movably coupled to each other pass through.
  • the hollow structure of the bottom object pad 16 is in turn against the laminated substrate to be separated.
  • the primary top column 121 and the second stage top column 122 of the nested top column assembly 12 have a hollow structure, the length of the secondary top column 122 is greater than the length of the first stage top 121, and the secondary top column 122 is movably sleeved to one.
  • the top column fixing plate 131 of the top column fixing plate 13 is disposed in parallel above the second stage top column fixing plate 132, and the first stage top column fixing plate 131 corresponds to the position of the four nesting top column assemblies 12.
  • a through hole is disposed at the time of installation, when the four sets of nested top column assemblies 12 pass through the corresponding through holes, the primary top pillars 121 are fixed on the primary top pillar fixing plate 131, and the secondary top pillars 122 are fixed to A connection mechanism 15 is connected between the first stage top fixing plate 131 and the second stage top fixing plate 132.
  • the connecting mechanism 15 includes a connecting column 151 and an elastic member.
  • the elastic member is here.
  • the spring 152 is connected to the primary column fixing plate 131 and the secondary top column fixing plate 132 constituting the top column fixing plate assembly 13, and the lower end of the connecting column 151 is fixed to the lower secondary column.
  • the plate fixing 132 is connected, and the upper end of the connecting post 151 is engaged with the first-stage top pillar fixing plate 131 located above, and the bullet is
  • the spring 152 is sleeved in a compression manner at a connecting post 151 between the adjacent primary column fixing plate 131 and the secondary top column fixing plate 132.
  • the driving device is a cylinder assembly 14, and the secondary assembly is driven by the cylinder assembly 14.
  • the column fixing plate 132 is configured to simultaneously move the secondary top column fixing plate 132 and the first stage top column fixing plate 131, and synchronously drive the first stage top column 121 fixed on the first stage top column fixing plate 131 and fixed to the second stage top column.
  • the secondary top pillar 122 on the fixed plate 132 moves.
  • the primary top pillar fixing plate 131 stops moving; the secondary top pillar fixing plate 132 continues to move, and the synchronous driving is fixed to the second.
  • the secondary top column 122 on the stage top column fixing plate 132 moves, and the spring 152 between the first stage column fixing plate 131 and the second stage column fixing plate 132 is further compressed, and the connecting column 151 passes through the first stage column fixing plate.
  • 131 moves upward, and the secondary top post 122 lifts up the upper substrate to pass through the first stage positioning
  • the separation chamber of the plate 111 continues to move until the upper substrate is positioned to achieve separation and positioning of the laminated substrate. As shown in FIG. 1, FIG. 2, FIG. 3 and FIG. 4, the process of separating, positioning, and overlapping the two stacked substrates 17 using the nested top column apparatus 1 of the present invention will be described in detail.
  • the nested top column apparatus 1 of the present invention includes four nested top pillar assemblies 12, each nested top pillar assembly 12 including a primary top pillar 121 and a secondary top pillar 122 for effecting the stacking of substrates 17 Separation, positioning.
  • a substrate 171 and a two-layer substrate 172 to be separated are placed on the bottom substrate pad 16 in an overlapping manner, and the two-layer substrate 172 is placed on a substrate 171.
  • the bottom object pad 16 has a hollow structure.
  • the hollow structure penetrates the bottom object pad 16 , and the first top pillar 121 and the second top pillar 122 of the nested top pillar assembly 12 pass through the hollow structure to thereby interfere with the substrate 17 to be separated;
  • the top post assembly 12 is positioned with a through hole through which the secondary top post 122 of the nested top post assembly 12 can pass, with the primary top post 121 snapped into the through hole; when the cylinder assembly 14 is lowered from the lower position When moving, the cylinder assembly 14 drives the secondary top column fixing plate 132.
  • the first stage top The column fixing plate 131 and the secondary column fixing plate 132 move upward at the same time, and the first column fixing plate 131 synchronously drives the four primary column 121 fixedly connected thereto to rise, and the secondary column fixing plate 132 is also synchronized.
  • Drive fixed The four secondary top pillars 122 connected thereto rise, and when the primary top pillars 121 are in contact with a layer of the substrate 171 stacked on the bottom substrate pad 16, a substrate 171 and a second layer are formed under the force The substrate 172 is simultaneously raised.
  • the primary column 121 stops rising, because the primary column 121 is fixedly connected to the primary column fixing plate 131. Therefore, the primary top column fixing plate 131 stops rising; under the driving of the cylinder assembly 14, the secondary top column fixing plate 132 continues to rise, and the secondary top column fixing plate 132 simultaneously drives the four secondary top columns 122 to continue to rise,
  • the stage top pillar 122 penetrates the two-layer substrate 172 through a through hole in a substrate 171, and the second stage top pillar 122 lifts up the two-layer substrate 172, so that the two-layer substrate 172 passes through the separation cavity on the primary positioning plate 111. A layer of the substrate 171 is separated.
  • the spring 152 connected between the first stage column fixing plate 131 and the second stage column fixing plate 132 is further compressed, and the connecting column 151 of the first stage column fixing plate 131 is upward. Movement, when the two-layer substrate 172 After warming two positioning plate 112 and is positioned, the cylinder assembly 14 moves to the upper, - the substrate layer 171 and the substrate 172 separated from the second floor, the positioning is completed.
  • the cylinder assembly 14 When the separated and positioned two-layer substrate 17 is to be overlapped, the cylinder assembly 14 is lowered from the upper position.
  • the two-stage top post fixing plate 132 is moved downward, and the four second-stage top posts 122 fixed on the second-stage top post fixing plate 132 are synchronously lowered, so that the two-layer substrate 172 is lowered from the second positioning plate 112.
  • the two-layer substrate 172 is overlapped on the one-layer substrate 171 through the separation cavity on the first-level positioning plate 111, the two-layer substrate 172 and the one-layer substrate 171 are simultaneously lowered, and the first-stage top pillar 121 and the second-stage top pillar 122 are followed.
  • the two-stage top pillar fixing plate assembly 13 When the two-stage top pillar fixing plate assembly 13 is lowered and the two-layer substrate 17 is overlapped on the bottom object pad 16, the two-layer substrate is stacked, the cylinder assembly 14 is moved to the lower position, and the two-layer substrate 17 is completed. Separate, locate, and overlap one cycle, waiting for the next separation, positioning, and overlap.
  • the nesting top column apparatus 1 of the present invention comprises four nested top pillar assemblies 12, a top pillar fixing plate assembly 13, a positioning mechanism assembly 11 and a driving device 14, and the positioning mechanism assembly 11 is located above the top pillar fixing plate assembly 13.
  • the nested top post assembly 12 is located between the positioning mechanism assembly 11 and the top post mounting plate assembly, and the nesting top post assembly 12 includes a first top post 121 and a secondary top post 122 that are movably coupled to each other.
  • the top pillar fixing plate assembly 13 includes a first-stage top pillar fixing plate 131 and a second-stage top pillar fixing plate 132 corresponding to the first-stage top pillar 121 and the second-stage top pillar 122 and connected to each other, and the positioning mechanism assembly 11 includes The height difference between the primary positioning plate 111 and the secondary positioning plate 112 corresponding to the primary top column 121 and the secondary top column 122 and parallel to each other, the primary top column fixing plate 131 and the secondary top column fixing plate 132 is greater than or Equal to the height difference between the primary positioning plate 111 and the secondary positioning plate 112, the primary top column 121 and the secondary top column 122 are respectively fixed to their corresponding primary column fixing plate 131 and secondary top column fixing plate 132.
  • cylinder assembly 14 is fixed to the lowermost secondary top post mounting plate 132, the cylinder assembly 14 drives the primary positioning plate 111 and the secondary positioning plate 112.
  • the linear positioning reciprocating motion, the primary positioning plate 111 and the secondary positioning plate 112 respectively drive the primary top column 121 and the secondary top column 122.
  • the top pillars of the same height plane are sequentially jacked up in order from the outside to the inside, forming a plurality of height planes, thereby realizing separation of the laminated substrate, since one of the three top pillars can define one substrate plane, only three nestings are required
  • the top column assembly 12 can realize the separation of the multi-layer substrate, and the number of the nested top column assemblies 12 is greatly reduced, so that the structure of the nested top column device 1 is simple and the cost is reduced; the first stage column 121 and the second stage column 122
  • the first stage top column fixing plate 131 and the second stage top column fixing plate 132 are respectively fixedly connected to each other, the first stage top column fixing plate 131 and the second stage top column fixing plate 132 are connected to each other, and the cylinder assembly 14 drives the top column fixing plate.
  • the top pillar fixing plate drives the linear movement of the top column fixedly connected thereto, and since only one cylinder assembly 14 is required, the movement of the top pillar fixing plates can be driven, and there is no synchronous feeding problem of the plurality of cylinder assemblies 14 Nested top column 1 decreases the difficulty of the driving device, Further, the processing efficiency of the substrate is improved; the top pillar fixing plates are connected to each other, and the vibration generated by the collision during the positioning of the separated object is effectively reduced, so that the performance of the nesting top column device 1 is relatively stable.
  • the two-stage nesting top column device 1 having two mutually nested top posts separates, positions, and overlaps the two stacked substrate 17 , but is not limited to the embodiment, and the nesting top of the present invention
  • the column device 1 can also increase the number of nested top pillars according to actual needs, and realize separation, positioning and overlapping of the multi-layer stacking substrate.
  • the nesting top column device 1 having three mutually nested top pillars can complete three Separation, positioning, and overlapping of stacked substrates.
  • the nested top column device of the present invention is also not limited to the separation, positioning and overlapping of the overlapping substrates, and can also be used for separation, positioning and overlapping between similar stacked objects according to actual needs.
  • the driving device 14 and the principle of the nesting top column device of the present invention are well known to those skilled in the art and will not be described in detail herein.

Abstract

An apparatus with nested support pin assemblies (12) is provided. The apparatus comprises at least three nested support pin assemblies (12), a support pin fixing plate assembly (13), a positioning mechanism (11), and a driving device (14), wherein the positioning mechanism (11) is positioned above the support pin fixing plate assembly (13); each of the nested support pin assemblies (12), which is between the positioning mechanism (11) and the support pin fixing plate assembly (13), comprises at least two support pins (121, 122) which are movably nested within each other; the support pin fixing plate assembly (13) comprises support pin fixing plates (131, 132) which are connected with each other parallelly and correspond to the support pins (121, 122); the positioning mechanism (11) comprises parallel positioning plates (111, 112) which correspond to the support pins (121, 122); the maximum height difference among the support pin fixing plates (131, 132) is greater than or equal to the maximum height difference among the positioning plates (111, 112), and the support pins (121, 122) are connected to the corresponding support pin fixing plates (131, 132) respectively. The apparatus can enhance the efficiency of processing stacked substrates (171, 172).

Description

具有嵌套顶柱组件的装置 技术领域  Device with nested top column assembly
本发明涉及一种嵌套顶柱设备， 尤其涉及一种适用于薄板状的基板处理过 程中将多层叠放的基板分离、 定位及重叠的嵌套顶柱设备。 背景技术  BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a nested top column apparatus, and more particularly to a nested top column apparatus for separating, positioning and overlapping substrates stacked in a thin plate-like substrate process. Background technique
随着经济的不断发展、 科技的不断进步和世界能源的日益减少， 人们在生 产中越来越重视能源的节约及利用效率， 使得人与自然和谐发展以满足中国新 型的工业化道路要求。  With the continuous development of the economy, the continuous advancement of science and technology, and the decreasing energy of the world, people pay more and more attention to energy conservation and utilization efficiency in production, which makes people and nature develop harmoniously to meet the requirements of China's new industrialization road.
例如， 在数码产品的显示产业中， 企业为了节约能源、 降低生产成本， 都 加大投资研发力度， 不断地追求节能的新产品。 其中， OLED显示屏就是数码产 品中的一种新产品， OLED即有机发光二极管（ Organic Light-Emitting Diode ), 又称为有机电激光显示 ( Organic Electroluminesence Display, OELD )， 因为 具备轻薄、 省电等特性， 因此在数码产品的显示屏上得到了广泛应用， 并且 具有较大的市场潜力， 目前世界上对 OLED的应用都聚焦在平板显示器上， 因为 OLED是唯一在应用上能和 TFT-LCD相提并论的技术， 且是目前所有 显示技术中， 唯一可制作大尺寸、 高亮度、 高分辨率软屏的显示技术， 可以 做成和紙张一样的厚度； 但 OLED显示屏幕与传统的 TFT-LCD显示屏幕并 不同， 其无需背光灯， 釆用非常薄的有机材料涂层和玻璃基板， 当有电流通 过时， 这些有机材料就会发光， 而且 OLED 显示屏幕可以做得更轻更薄， 可视角度更大， 并且能够显著节省电能； 相应地， 制造 OLED 显示屏幕的 所有设备必须要保证 OLED显示屏幕的精度要求。 在 OLED的制造中， 基 板起着举足轻重的作用， OLED的基板材料为非常薄且易碎的玻璃，在 OLED 的基板制作工序及后续工艺中，常常需要将多层叠放的基板进行分离、定位、 叠放； 为了保证 OLED 的质量和精度， 加工过程中对基板处理的自动化要求 越来越高的同时， 对用于基板的分离、 定位、 叠放的嵌套顶柱设备也提出了更 高的要求。  For example, in the display industry of digital products, in order to save energy and reduce production costs, enterprises have increased investment in research and development and are constantly pursuing new products that are energy-saving. Among them, OLED display is a new product in digital products, OLED is Organic Light-Emitting Diode, also known as Organic Electroluminesence Display (OELD), because it is light, power-saving, etc. Features, so it has been widely used in the display of digital products, and has a large market potential. At present, the application of OLED in the world is focused on flat panel displays, because OLED is the only application that can be compared with TFT-LCD. Technology, and currently the only display technology that can produce large size, high brightness, high resolution soft screen, can be made to the same thickness as paper; but OLED display screen and traditional TFT-LCD display screen Different, it does not require a backlight, uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light, and the OLED display screen can be made lighter and thinner, and the viewing angle is more Large, and can significantly save power; accordingly, the OLED display screen is manufactured Some devices must ensure the accuracy requirements of the OLED display screen. In the manufacture of OLEDs, the substrate plays an important role. The substrate material of the OLED is very thin and fragile glass. In the substrate fabrication process and subsequent processes of the OLED, it is often necessary to separate and position the stacked substrates. Stacking; In order to ensure the quality and precision of the OLED, the automation of the substrate processing is becoming more and more high during the processing, and the nesting column device for the separation, positioning and stacking of the substrate is also proposed to be higher. Claim.
现有的用于对多层叠放的基板进行分离、 定位、 叠放的嵌套顶柱设备中， 不仅需要多层顶柱及多个驱动系统， 每层顶柱还至少需要三个顶柱； 在完成基 板的分离时， 分离每层基板都需要三个以上的顶柱及一个驱动系统； 完成多层 基板的分离， 则需要多层顶柱及多个驱动系统， 多个驱动系统依次驱动每层顶 柱来完成由高到低层叠的基板的分离； 这种传统的嵌套顶柱设备， 存在诸多缺 点： 首先， 在多层基板的分离过程中， 多个系统需要同步进给， 依次分步完成 每层基板的分离， 控制复杂， 板的处理效率低； 其次， 每层基板的分离都 需要定位， 处理周期较长； 再次， 由于顶柱及驱动系统数量较多， 使嵌套顶柱 设备整体结构复杂， 成本较高； 另外， 由于嵌套顶柱设备在定位过程中没有有 效的减震机构， 在基板分离、 定位时， 反复动作， 因此震动较大， 使其性能不 稳定， 进而影响基板的质量。 Existing nested column equipment for separating, positioning, and stacking substrates stacked in multiple layers, Not only a multi-layer top column and multiple drive systems are required, but also at least three top columns are required for each top column; when separating the substrates, more than three top columns and one drive system are required to separate each substrate; Separation of the layer substrate requires a multi-layer top column and a plurality of drive systems, and a plurality of drive systems sequentially drive each of the top columns to complete the separation of the high-to-low stacking substrates; such a conventional nested top column device exists Many disadvantages: First, in the separation process of multi-layer substrates, multiple systems need to be fed synchronously, and the separation of each layer of substrates is completed step by step. The control is complicated and the processing efficiency of the board is low. Secondly, the separation of each layer of substrate is required. Positioning, processing cycle is longer; Again, due to the large number of top columns and drive systems, the overall structure of the nested top column equipment is complicated and costly; in addition, because the nested top column equipment does not have effective damping during the positioning process The mechanism repeats the action when the substrate is separated and positioned, so the vibration is large, and the performance is unstable, thereby affecting the quality of the substrate.
因此， 急需一种顶柱及驱动装置数量少， 结构紧凑， 驱动装置同步进给且 能有效减震的嵌套顶柱设备。 发明内容  Therefore, there is an urgent need for a nested top column device which has a small number of top columns and driving devices, a compact structure, synchronous feed of the driving device, and effective shock absorption. Summary of the invention
本发明的目的在于提供一种顶柱及驱动装置数量少， 结构紧凑， 驱动装置 同步进给且能有效减震的嵌套顶柱设备。  The object of the present invention is to provide a nested top column device which has a small number of top columns and driving devices, compact structure, synchronous feeding of the driving device and effective shock absorption.
为实现上述目的， 本发明的技术方案为： 提供一种嵌套顶柱设备， 包括至 少三个嵌套顶柱组件、 顶柱固定板组件、 定位机构组件及驱动装置， 所述定位 机构组件位于所述顶柱固定板组件上方， 所述嵌套顶柱组件位于所述定位机构 组件与所述顶柱固定板组件之间， 所述嵌套顶柱组件包括至少两根可活动地相 互套接的顶柱， 所述顶柱固定板组件包括与所述顶柱对应的且相互平行并连接 的顶柱固定板， 所述定位机构组件包括与所述顶柱对应的且相互平行的定位板, 所述顶柱固定板之间的最大高度差大于或等于所述定位板之间的最大高度差， 所述顶柱分别与其相对应的顶柱固定板固定连接， 所述驱动装置与位于最下方 的顶柱固定板固定连接， 所述驱动装置驱动所述顶柱固定板做直线往复运动， 所述顶柱固定板同步的带动所述顶柱运动。  In order to achieve the above object, the technical solution of the present invention is: providing a nested top column device, comprising at least three nested top pillar assemblies, a top pillar fixing plate assembly, a positioning mechanism assembly and a driving device, wherein the positioning mechanism component is located Above the top pillar fixing plate assembly, the nesting top pillar assembly is located between the positioning mechanism assembly and the top pillar fixing plate assembly, and the nesting top pillar assembly includes at least two movable joints a top pillar fixing plate assembly comprising a top pillar fixing plate corresponding to the top pillar and parallel to each other and connected, the positioning mechanism assembly including a positioning plate corresponding to the top pillar and parallel to each other, The maximum height difference between the top pillar fixing plates is greater than or equal to a maximum height difference between the positioning plates, and the top pillars are respectively fixedly connected to the corresponding top pillar fixing plates, and the driving device is located at the bottom The top pillar fixing plate is fixedly connected, and the driving device drives the top pillar fixing plate to perform linear reciprocating motion, and the top pillar fixing plate synchronously drives the top pillar to move.
较佳地， 所述嵌套顶柱设备还包括连接机构， 所述连接机构包括连接柱及 弹性元件， 所述连接柱穿过构成所述顶柱固定板组件的顶柱固定板， 且所述连 接柱的下端与位于最下方的顶柱固定板固定连接， 所述连接柱的上端与位于最 上方的顶柱固定板卡接， 所述弹性元件呈压缩状的套设于相邻顶柱固定板之间 的连接柱处， 由于顶柱固定板之间安装有弹性元件， 在对分离后的物体定位的 过程中， 有效的减小由于碰撞产生的震动， 使嵌套顶柱设备的性能较稳定。 Preferably, the nesting top column device further includes a connecting mechanism, the connecting mechanism includes a connecting post and an elastic member, the connecting post passes through a top pillar fixing plate constituting the top pillar fixing plate assembly, and the Even The lower end of the connecting post is fixedly connected with the top pillar fixing plate located at the bottom, the upper end of the connecting post is engaged with the top pillar fixing plate located at the top, and the elastic component is compressed and sleeved on the adjacent top pillar. At the connecting column between the plates, due to the installation of elastic elements between the top column fixing plates, in the process of positioning the separated objects, the vibration caused by the collision is effectively reduced, so that the performance of the nesting top column device is better. stable.
较佳地， 构成所述嵌套顶柱组件的顶柱从内至外逐步变短， 因此不同长度 的顶柱形成不同的高度平面， 长度相同的顶柱一端与对应的顶柱固定板连接， 另一端形成一个抵触基板的高度平面， 在驱动装置的驱动下， 按照由外到内的 顺序， 处于同一高度平面的顶柱依次被相应固定连接的顶柱固定板顶起， 形成 多个高度平面， 实现层叠基板的分离； 嵌套顶柱组件依次嵌套的多跟顶柱， 实 现多层叠放基板的分离， 这种嵌套顶柱组件只需三个就可确定一平面， 嵌套顶 柱组件数量大为减少， 使得嵌套顶柱设备的结构简单， 成本降低。  Preferably, the top pillars constituting the nested top pillar assembly are gradually shortened from the inside to the outside, so that the top pillars of different lengths form different height planes, and one end of the same length of the top pillars is connected with the corresponding pillar pillar fixing plates. The other end forms a plane of height against the substrate. Under the driving of the driving device, in the order from the outside to the inside, the top pillars in the same height plane are sequentially jacked up by the corresponding fixedly connected top pillar fixing plates to form a plurality of height planes. Separating the laminated substrate; the nested top column assembly is sequentially nested with a plurality of top pillars to realize separation of the multi-layer substrate. The nested top pillar assembly requires only three to define a plane, and the nested top pillar The number of components is greatly reduced, making the structure of the nested top column device simple and cost-effective.
较佳地， 所述嵌套顶柱组件包括两根顶柱， 所述两根顶柱分别为呈中空结 构的一级顶柱和二级顶柱， 所述二级顶柱的长度大于一级顶柱的长度， 所述二 级顶柱活动地套接于所述一级顶柱内， 长度相同的二级顶柱与一顶柱固定板固 定连接， 长度相同的一级顶柱与另一顶柱固定板固定连接， 处于同一高度平面 的一级顶柱和处于另一高度平面的二级顶柱依次被顶起， 实现两层叠放基板的 分离。  Preferably, the nesting top column assembly comprises two top columns, wherein the two top columns are a first stage top column and a second stage top column in a hollow structure, and the length of the second stage top column is greater than one stage. The length of the top column, the secondary top column is movably sleeved in the first stage top column, and the second stage top column of the same length is fixedly connected with a top column fixing plate, and the first stage top column of the same length and another The top column fixing plate is fixedly connected, and the first stage top column in the same height plane and the second stage top column in the other height plane are sequentially jacked up, so that the separation of the two stacked substrates is realized.
较佳地， 所述顶柱固定板组件包括两个顶柱固定板， 所述两个顶柱固定板 分别为一级顶柱固定板和二级顶柱固定板， 所述一级顶柱固定板位于所述二级 顶柱固定板上方， 所述一级顶柱固定板与所述一级顶柱的下端固定连接， 所述 二级顶柱固定板与所述二级顶柱的下端固定连接。 驱动装置驱动顶柱固定板组 件时， 一级顶柱固定板同步带动固定连接于其上的一级顶柱直线运动， 二级顶 柱固定板同步带动固定连接于其上的二级顶柱直线运动， 一个驱动装置就可依 次带动各级顶柱固定板运动， 不存在多个驱动装置同步进给的问题， 使嵌套顶 柱设备的驱动难度降低， 进而提高基板的处理效率。  Preferably, the top pillar fixing plate assembly comprises two top pillar fixing plates, and the two top pillar fixing plates are respectively a first top column fixing plate and a second top column fixing plate, and the first column fixing column is fixed. The plate is located above the secondary top column fixing plate, the first stage top column fixing plate is fixedly connected with the lower end of the first stage top column, and the second stage top column fixing plate is fixed to the lower end of the second stage top column connection. When the driving device drives the top column fixing plate assembly, the first-stage top column fixing plate synchronously drives the linear movement of the first-stage top column fixedly connected thereto, and the secondary top column fixing plate synchronously drives the secondary top column straight line fixedly connected thereto Movement, a driving device can sequentially drive the movement of the top column fixing plates of each stage, and there is no problem of synchronous feeding of multiple driving devices, so that the driving difficulty of the nesting top column device is reduced, thereby improving the processing efficiency of the substrate.
较佳地， 所述定位机构组件包括两个定位板， 所述两个定位板分别为一级 定位板和二级定位板， 所述二级定位板位于所述一级定位板的上方， 所述一级 定位板和二级定位板均呈中空结构， 所述中空结构形成分离腔， 所述分离腔贯 穿所述定位板， 所述一级定位板的分离腔大于所述二级定位板的分离腔。 使层 叠放置的基板在分离过程中上层基板能通过定位板的分离腔被分离出去， 下层 的基板则通过定位板定位， 实现多层层叠基板的分离、 定位。 Preferably, the positioning mechanism assembly includes two positioning plates, and the two positioning plates are respectively a first positioning plate and a second positioning plate, and the second positioning plate is located above the first positioning plate. Both the primary positioning plate and the secondary positioning plate have a hollow structure, and the hollow structure forms a separation cavity, and the separation cavity The positioning plate is inserted, and the separation cavity of the primary positioning plate is larger than the separation cavity of the secondary positioning plate. In the separation process, the upper substrate can be separated by the separation chamber of the positioning plate, and the lower substrate is positioned by the positioning plate to realize separation and positioning of the multilayer laminated substrate.
较佳地， 所述嵌套顶柱设备还包括底层物体垫板， 所述底层物体垫板位于 所述定位机构组件与所述嵌套顶柱组件之间， 且所述底层物体垫板与所述定位 板相互平行， 所述底层物体垫板呈中空结构， 所述中空结构贯穿所述底层物体 垫板； 所述底层物体垫板用于承载待分离的层叠基板， 所述一级顶柱及二级顶 柱穿过所述底层物体垫板的中空结构， 顶住所述待分离的层叠基板。  Preferably, the nesting top column device further comprises a bottom object pad, the bottom object pad is located between the positioning mechanism assembly and the nested top column assembly, and the bottom object pad and the bottom plate The positioning plate is parallel to each other, the bottom object pad has a hollow structure, the hollow structure penetrates the bottom object pad; the bottom object pad is used to carry the laminated substrate to be separated, the first stage top column and The secondary top column passes through the hollow structure of the bottom object pad to withstand the laminated substrate to be separated.
与现有技术相比， 由于本发明嵌套顶柱设备， 包括至少三个嵌套顶柱组件、 顶柱固定板组件、 定位机构组件及驱动装置， 所述定位机构组件位于所述顶柱 固定板组件上方， 所述嵌套顶柱组件位于所述定位机构组件与所述顶柱固定板 组件之间， 所述嵌套顶柱组件包括至少两根可活动地相互套接的顶柱， 所述顶 柱固定板组件包括与所述顶柱对应的且相互平行并连接的顶柱固定板， 所述定 位机构组件包括与所述顶柱对应的且相互平行的定位板， 所述顶柱固定板之间 的最大高度差大于或等于所述定位板之间的最大高度差， 所述顶柱分别与其相 对应的顶柱固定板固定连接， 所述驱动装置与位于最下方的顶柱固定板固定连 接， 所述驱动装置驱动所述顶柱固定板做直线往复运动， 所述顶柱固定板同步 的带动所述顶柱运动； 按照由外到内的顺序， 同一高度平面的顶柱依次被顶起, 形成多个高度平面， 实现层叠基板的分离， 由于三根顶柱就可以确定一个基板 平面， 因此只需要三个嵌套顶柱组件就可实现多层基板的分离， 嵌套顶柱组件 数量大为减少， 使得嵌套顶柱设备的结构简单， 成本降低； 所述顶柱分别与其 相对应的顶柱固定板固定连接， 驱动装置与位于最下方的顶柱固定板固定连接, 驱动装置驱动顶柱固定板时， 顶柱固定板带动固定连接于其上的顶柱直线运动 , 由于只需要一个驱动装置就可驱动各级顶柱固定板运动， 不存在多个驱动装置 的同步进给问题， 使整个嵌套顶柱设备的驱动难度降低， 进而提高基板的处理 效率； 所述顶柱固定板之间相互平行并连接， 有效的减小对分离后的物体定位 过程中由于碰撞而产生的震动， 使嵌套顶柱设备的性能较稳定。 附图说明 Compared with the prior art, the nesting top column device of the present invention comprises at least three nested top column assemblies, a top column fixing plate assembly, a positioning mechanism assembly and a driving device, and the positioning mechanism assembly is fixed on the top column. Above the plate assembly, the nested top post assembly is located between the positioning mechanism assembly and the top post fixing plate assembly, and the nesting top post assembly includes at least two top pillars that are movably nested with each other. The top pillar fixing plate assembly includes a top pillar fixing plate corresponding to the top pillars and connected to each other and connected to each other, and the positioning mechanism assembly includes positioning plates corresponding to the top pillars and parallel to each other, and the top pillars are fixed The maximum height difference between the plates is greater than or equal to the maximum height difference between the positioning plates, the top columns are respectively fixedly connected to the corresponding top column fixing plates, and the driving device and the top column fixing plate located at the bottom Fixedly connecting, the driving device drives the top column fixing plate to perform linear reciprocating motion, and the top column fixing plate synchronously drives the top column to move; according to the order from the outside to the inside, the same height The top pillars of the plane are sequentially jacked up to form a plurality of height planes, so that the separation of the laminated substrates is achieved. Since the three top pillars can define a substrate plane, only three nested top pillar assemblies are required to realize the multilayer substrate. Separation, the number of nested top column components is greatly reduced, so that the structure of the nested top column device is simple and the cost is reduced; the top column is fixedly connected to the corresponding top column fixing plate, and the driving device and the top column are located at the bottom. The fixing plate is fixedly connected, and when the driving device drives the top column fixing plate, the top column fixing plate drives the top column linear motion fixedly connected thereto, and only needs one driving device to drive the movement of the top column fixing plate of each stage, there is no more The synchronous feeding problem of the driving device reduces the driving difficulty of the entire nesting top column device, thereby improving the processing efficiency of the substrate; the top column fixing plates are parallel and connected with each other, effectively reducing the separated objects The vibration caused by the collision during the positioning process makes the performance of the nested top column device relatively stable. DRAWINGS
图 1是本发明嵌套顶柱设备的剖面结构示意图。  1 is a schematic cross-sectional structural view of a nested top column apparatus of the present invention.
图 2是本发明嵌套顶柱设备中第一层基板被定位的剖面状态示意图。  2 is a schematic cross-sectional view showing the state in which the first substrate of the nested column device of the present invention is positioned.
图 3是本发明嵌套顶柱设备中第二层基板被定位的剖面状态示意图。  3 is a schematic cross-sectional view showing a state in which a second substrate is positioned in the nested column device of the present invention.
图 4 是本发明嵌套顶柱设备中第一层基板与第二层基板重叠的剖面状态示 意图。 具体实施方式  Fig. 4 is a cross-sectional view showing the state in which the first substrate and the second substrate are overlapped in the nested column device of the present invention. detailed description
现在参考附图描述本发明的实施例， 附图中类似的元件标号代表类似的元 件。  Embodiments of the present invention will now be described with reference to the drawings, in which like reference numerals represent like elements.
如图 1所示， 本发明嵌套顶柱设备 1 , 包括四个嵌套顶柱组件 12、 一个顶 柱固定板组件 13、 一个定位机构组件 11及一个驱动装置 14, 定位机构组件 11 位于顶柱固定板组件 13上方， 嵌套顶柱组件 12位于定位机构组件 11与顶柱固 定板组件 13之间，嵌套顶柱组件 12包括两根可活动地相互套接的一级顶柱 121 和二级顶柱 122, 顶柱固定板组件 13包括与一级顶柱 121和二级顶柱 122对应 的且相互平行并连接的一级顶柱固定板 131和二级顶柱固定板 132,定位机构组 件 11包括与一级顶柱 121和二级顶柱 122对应的且相互平行的一级定位板 111 和二级定位板 112,一级顶柱固定板 131和二级顶柱固定板 132之间的高度差大 于或等于一级定位板 111和二级定位板 112之间的高度差 , 一级顶柱 121和二 级顶柱 122分别与其相对应的一级顶柱固定板 131和二级顶柱固定板 132固定 连接， 驱动装置与位于最下方的二级顶柱固定板 132固定连接， 驱动装置驱动 一级顶柱固定板 131和二级顶柱固定板 132做直线往复运动 , 一级顶柱固定板 131和二级顶柱固定板 132分别同步的带动一级顶柱 121和二级顶柱 122运动。 本发明嵌套顶柱设备 1还包括连接机构 15及底层物体垫板 16, 底层物体垫板 16位于定位机构组件 11与嵌套顶柱组件 12之间，且底层物体垫板 16与定位机 构组件 11的定位板相互平行， 底层物体垫板 16呈中空结构， 所述中空结构贯 穿底层物体垫板 16, 底层物体垫板 16用于承载待分离的层叠基板； 连接机构 15连接于顶柱固定板组件 13的一级顶柱固定板 131和二级顶柱固定板 132之间； 本发明嵌套顶柱设备 1中的一级定位板 111、 二级定位板 112和底层物体垫板 16均根据实际高度的需要与外界固定连接。 As shown in FIG. 1, the nesting top column apparatus 1 of the present invention comprises four nested top pillar assemblies 12, a top pillar fixing plate assembly 13, a positioning mechanism assembly 11 and a driving device 14, and the positioning mechanism assembly 11 is located at the top. Above the column fixing plate assembly 13, the nesting top column assembly 12 is located between the positioning mechanism assembly 11 and the top column fixing plate assembly 13, and the nesting top column assembly 12 includes two first stage top posts 121 that are movably coupled to each other and The second top column 122, the top column fixing plate assembly 13 includes a first stage column fixing plate 131 and a second stage column fixing plate 132 corresponding to the first stage column 121 and the second stage column 122 and connected to each other, and positioning The mechanism assembly 11 includes a primary positioning plate 111 and a secondary positioning plate 112 corresponding to the primary top column 121 and the secondary top column 122 and parallel to each other, and the primary top column fixing plate 131 and the secondary top column fixing plate 132 The height difference between the first positioning plate 111 and the second positioning plate 112 is greater than or equal to the height difference between the first positioning plate 111 and the second positioning plate 112, and the first stage top column 121 and the second stage top column 122 respectively correspond to the first stage top column fixing plate 131 and the second stage. The top pillar fixing plate 132 is fixedly connected, and the driving device and the second-stage top pillar located at the bottom The fixed plate 132 is fixedly connected, and the driving device drives the first-stage top column fixing plate 131 and the second-stage top column fixing plate 132 to perform linear reciprocating motion, and the first-stage top column fixing plate 131 and the second-stage top column fixing plate 132 respectively drive the first stage synchronously. The top post 121 and the secondary top post 122 move. The nesting top column apparatus 1 of the present invention further includes a connecting mechanism 15 and a bottom object pad 16 disposed between the positioning mechanism assembly 11 and the nested top post assembly 12, and the bottom object pad 16 and the positioning mechanism assembly The positioning plates of 11 are parallel to each other, and the bottom object pad 16 has a hollow structure, the hollow structure penetrates the bottom object pad 16 , and the bottom object pad 16 is used to carry the laminated substrate to be separated; the connecting mechanism 15 is connected to the top column fixing plate Between the primary top pillar fixing plate 131 and the secondary top pillar fixing plate 132 of the assembly 13; The primary positioning plate 111, the secondary positioning plate 112 and the bottom object pad 16 in the nesting top column device 1 of the present invention are all fixedly connected to the outside according to the actual height.
具体地， 定位机构组件 11包括两个平行设置的定位板， 所述两个定位板分 别是一级定位板 111及二级定位板 112, 二级定位板 112设置于一级定位板 111 的上方， 一级定位板 111及二级定位板 112均呈中空结构， 中空结构形成分离 腔， 分离腔贯穿定位板， 且一级定位板 111的分离腔大于二级定位板 112的分 离腔； 底层物体垫板 16位于一级顶柱 121和二级顶柱 122上方， 且平行于一级 定位板 111和二级定位板 112,相互活动套接的一级顶柱 121和二级顶柱 122穿 过底层物体垫板 16的中空结构， 进而顶住所述待分离的层叠基板。 嵌套顶柱组 件 12的一级顶柱 121及二级顶柱 122均呈中空结构， 二级顶柱 122的长度大于 一级顶柱 121的长度， 二级顶柱 122活动地套接于一级顶柱 121内； 顶柱固定 板 13的一级顶柱固定板 131平行设置于二级顶柱固定板 132上方， 且一级顶柱 固定板 131对应四个嵌套顶柱组件 12的位置处设置有通孔， 安装时， 四组嵌套 顶柱组件 12穿过对应的通孔使其一级顶柱 121均固定于一级顶柱固定板 131上， 二级顶柱 122均固定于二级顶柱固定板 132上； 在一级顶柱固定板 131与二级 顶柱固定板 132之间连接有连接机构 15 ,该连接机构 15包括连接柱 151及弹性 元件， 弹性元件在此处优选的为弹簧 152, 连接柱 151穿过构成顶柱固定板组件 13的一级顶柱固定板 131和二级顶柱固定板 132, 且连接柱 151的下端与位于 下方的二级顶柱固定板固定 132连接， 连接柱 151的上端与位于上方的一级顶 柱固定板 131卡接， 弹簧 152呈压缩状的套设于相邻的一级顶柱固定板 131和 二级顶柱固定板 132之间的连接柱 151处； 驱动装置为汽缸组件 14, 通过汽缸 组件 14驱动二级顶柱固定板 132, 使得二级顶柱固定板 132及一级顶柱固定板 131同时运动，同步的带动固定于一级顶柱固定板 131上的一级顶柱 121及固定 于二级顶柱固定板 132上的二级顶柱 122运动 , 当下层基板被一级定位板 111 定位时 , 一级顶柱固定板 131停止运动； 二级顶柱固定板 132继续运动 , 同步 的带动固定于二级顶柱固定板 132上的二级顶柱 122运动，一级顶柱固定板 131 与二级顶柱固定板 132之间的弹簧 152进一步受到压缩， 连接柱 151穿过一级 顶柱固定板 131向上运动， 二级顶柱 122向上顶起上层基板使其穿过一级定位 板 111的分离腔继续运动， 直到上层基板被定位， 实现层叠基板的分离及定位。 如图 1、 图 2、 图 3及图 4所示， 对使用本发明嵌套顶柱设备 1实现两层叠 放基板 17的分离、 定位、 重叠的过程进行详细说明。 Specifically, the positioning mechanism assembly 11 includes two positioning plates arranged in parallel, and the two positioning plates are respectively a first positioning plate 111 and a second positioning plate 112. The second positioning plate 112 is disposed above the first positioning plate 111. The first positioning plate 111 and the second positioning plate 112 are both hollow structures, the hollow structure forms a separation cavity, the separation cavity penetrates the positioning plate, and the separation cavity of the primary positioning plate 111 is larger than the separation cavity of the secondary positioning plate 112; The backing plate 16 is located above the primary top column 121 and the second stage top column 122, and parallel to the primary positioning plate 111 and the secondary positioning plate 112, and the first-stage top column 121 and the second-stage top column 122 that are movably coupled to each other pass through. The hollow structure of the bottom object pad 16 is in turn against the laminated substrate to be separated. The primary top column 121 and the second stage top column 122 of the nested top column assembly 12 have a hollow structure, the length of the secondary top column 122 is greater than the length of the first stage top 121, and the secondary top column 122 is movably sleeved to one. The top column fixing plate 131 of the top column fixing plate 13 is disposed in parallel above the second stage top column fixing plate 132, and the first stage top column fixing plate 131 corresponds to the position of the four nesting top column assemblies 12. A through hole is disposed at the time of installation, when the four sets of nested top column assemblies 12 pass through the corresponding through holes, the primary top pillars 121 are fixed on the primary top pillar fixing plate 131, and the secondary top pillars 122 are fixed to A connection mechanism 15 is connected between the first stage top fixing plate 131 and the second stage top fixing plate 132. The connecting mechanism 15 includes a connecting column 151 and an elastic member. The elastic member is here. Preferably, the spring 152 is connected to the primary column fixing plate 131 and the secondary top column fixing plate 132 constituting the top column fixing plate assembly 13, and the lower end of the connecting column 151 is fixed to the lower secondary column. The plate fixing 132 is connected, and the upper end of the connecting post 151 is engaged with the first-stage top pillar fixing plate 131 located above, and the bullet is The spring 152 is sleeved in a compression manner at a connecting post 151 between the adjacent primary column fixing plate 131 and the secondary top column fixing plate 132. The driving device is a cylinder assembly 14, and the secondary assembly is driven by the cylinder assembly 14. The column fixing plate 132 is configured to simultaneously move the secondary top column fixing plate 132 and the first stage top column fixing plate 131, and synchronously drive the first stage top column 121 fixed on the first stage top column fixing plate 131 and fixed to the second stage top column. The secondary top pillar 122 on the fixed plate 132 moves. When the lower substrate is positioned by the primary positioning plate 111, the primary top pillar fixing plate 131 stops moving; the secondary top pillar fixing plate 132 continues to move, and the synchronous driving is fixed to the second. The secondary top column 122 on the stage top column fixing plate 132 moves, and the spring 152 between the first stage column fixing plate 131 and the second stage column fixing plate 132 is further compressed, and the connecting column 151 passes through the first stage column fixing plate. 131 moves upward, and the secondary top post 122 lifts up the upper substrate to pass through the first stage positioning The separation chamber of the plate 111 continues to move until the upper substrate is positioned to achieve separation and positioning of the laminated substrate. As shown in FIG. 1, FIG. 2, FIG. 3 and FIG. 4, the process of separating, positioning, and overlapping the two stacked substrates 17 using the nested top column apparatus 1 of the present invention will be described in detail.
本发明嵌套顶柱设备 1包括四个嵌套顶柱组件 12,每个嵌套顶柱组件 12包 括一级顶柱 121和二级顶柱 122, 用于实现对两层叠放的基板 17进行分离、 定 位。 初始状态下， 待分离的一层基板 171及二层基板 172重叠放置于底层物体 垫板 16上， 且二层基板 172置于一层基板 171上方， 所述底层物体垫板 16呈 中空结构， 所述中空结构贯穿底层物体垫板 16, 所述嵌套顶柱组件 12的一级顶 柱 121及二级顶柱 122穿过所述中空结构进而抵触待分离基板 17;一层基板 171 对应嵌套顶柱组件 12的位置具有通孔， 嵌套顶柱组件 12的二级顶柱 122可贯 穿该通孔，而一级顶柱 121卡于该通孔处； 当汽缸组件 14由下位向上位运动时， 汽缸组件 14驱动二级顶柱固定板 132, 由于一级顶柱固定板 131与二级顶柱固 定板 132之间的连接柱 151上的弹簧 152处于被压缩状态， 因此一级顶柱固定 板 131与二级顶柱固定板 132同时向上运动， 一级顶柱固定板 131同步带动固 定连接于其上的四根一级顶柱 121上升， 同时二级顶柱固定板 132也同步的带 动固定连接于其上的四根二级顶柱 122上升， 当一级顶柱 121抵触叠放在底层 基板垫板 16上的一层基板 171时，在力的作用下，一层基板 171及二层基板 172 同时上升， 当一层基板 171抵触一级定位板 111并被一级定位板 111固定后， 一级顶柱 121停止上升， 由于一级顶柱 121与一级顶柱固定板 131固定连接， 所以一级顶柱固定板 131停止上升； 在汽缸组件 14的驱动下， 二级顶柱固定板 132继续上升， 二级顶柱固定板 132同步带动四根二级顶柱 122继续上升， 二级 顶柱 122穿过一层基板 171上的通孔抵触二层基板 172,二级顶柱 122顶起二层 基板 172, 使得二层基板 172穿过一级定位板 111上的分离腔而与一层基板 171 分开 , 在此过程中 , 连接于一级顶柱固定板 131与二级顶柱固定板 132之间的 弹簧 152进一步受压缩， 贯穿一级顶柱固定板 131的连接柱 151向上运动， 当 二层基板 172上升至二级定位板 112并被定位后， 汽缸组件 14运动至上位， ― 层基板 171与二层基板 172分离、 定位完成。  The nested top column apparatus 1 of the present invention includes four nested top pillar assemblies 12, each nested top pillar assembly 12 including a primary top pillar 121 and a secondary top pillar 122 for effecting the stacking of substrates 17 Separation, positioning. In an initial state, a substrate 171 and a two-layer substrate 172 to be separated are placed on the bottom substrate pad 16 in an overlapping manner, and the two-layer substrate 172 is placed on a substrate 171. The bottom object pad 16 has a hollow structure. The hollow structure penetrates the bottom object pad 16 , and the first top pillar 121 and the second top pillar 122 of the nested top pillar assembly 12 pass through the hollow structure to thereby interfere with the substrate 17 to be separated; The top post assembly 12 is positioned with a through hole through which the secondary top post 122 of the nested top post assembly 12 can pass, with the primary top post 121 snapped into the through hole; when the cylinder assembly 14 is lowered from the lower position When moving, the cylinder assembly 14 drives the secondary top column fixing plate 132. Since the spring 152 on the connecting post 151 between the primary top column fixing plate 131 and the secondary top column fixing plate 132 is in a compressed state, the first stage top The column fixing plate 131 and the secondary column fixing plate 132 move upward at the same time, and the first column fixing plate 131 synchronously drives the four primary column 121 fixedly connected thereto to rise, and the secondary column fixing plate 132 is also synchronized. Drive fixed The four secondary top pillars 122 connected thereto rise, and when the primary top pillars 121 are in contact with a layer of the substrate 171 stacked on the bottom substrate pad 16, a substrate 171 and a second layer are formed under the force The substrate 172 is simultaneously raised. When a substrate 171 is in contact with the primary positioning plate 111 and is fixed by the primary positioning plate 111, the primary column 121 stops rising, because the primary column 121 is fixedly connected to the primary column fixing plate 131. Therefore, the primary top column fixing plate 131 stops rising; under the driving of the cylinder assembly 14, the secondary top column fixing plate 132 continues to rise, and the secondary top column fixing plate 132 simultaneously drives the four secondary top columns 122 to continue to rise, The stage top pillar 122 penetrates the two-layer substrate 172 through a through hole in a substrate 171, and the second stage top pillar 122 lifts up the two-layer substrate 172, so that the two-layer substrate 172 passes through the separation cavity on the primary positioning plate 111. A layer of the substrate 171 is separated. During this process, the spring 152 connected between the first stage column fixing plate 131 and the second stage column fixing plate 132 is further compressed, and the connecting column 151 of the first stage column fixing plate 131 is upward. Movement, when the two-layer substrate 172 After warming two positioning plate 112 and is positioned, the cylinder assembly 14 moves to the upper, - the substrate layer 171 and the substrate 172 separated from the second floor, the positioning is completed.
当要将上述分离、 定位后的两层基板 17重叠时， 汽缸组件 14由上位向下 位运动 , 二级顶柱固定板 132随之向下运动 , 固定于二级顶柱固定板 132上的 四根二级顶柱 122同步下降， 使得二层基板 172离开二级定位板 112下降， 当 二层基板 172穿过一级定位板 111上的分离腔重叠于一层基板 171上时， 二层 基板 172与一层基板 171同时下降， 一级顶柱 121和二级顶柱 122随之下降， 同时两级的顶柱固定板组件 13下降，两层基板 17重叠于底层物体垫板 16上时， 完成两层基板的叠放， 汽缸组件 14运动至下位， 完成对两层基板 17进行分离、 定位、 重叠的一个周期， 等待下一次分离、 定位、 重叠。 When the separated and positioned two-layer substrate 17 is to be overlapped, the cylinder assembly 14 is lowered from the upper position. The two-stage top post fixing plate 132 is moved downward, and the four second-stage top posts 122 fixed on the second-stage top post fixing plate 132 are synchronously lowered, so that the two-layer substrate 172 is lowered from the second positioning plate 112. When the two-layer substrate 172 is overlapped on the one-layer substrate 171 through the separation cavity on the first-level positioning plate 111, the two-layer substrate 172 and the one-layer substrate 171 are simultaneously lowered, and the first-stage top pillar 121 and the second-stage top pillar 122 are followed. When the two-stage top pillar fixing plate assembly 13 is lowered and the two-layer substrate 17 is overlapped on the bottom object pad 16, the two-layer substrate is stacked, the cylinder assembly 14 is moved to the lower position, and the two-layer substrate 17 is completed. Separate, locate, and overlap one cycle, waiting for the next separation, positioning, and overlap.
本发明嵌套顶柱设备 1 , 包括四个嵌套顶柱组件 12、 一个顶柱固定板组件 13、 一个定位机构组件 11及一个驱动装置 14, 定位机构组件 11位于顶柱固定 板组件 13上方，嵌套顶柱组件 12位于定位机构组件 11与顶柱固定板组件之间， 嵌套顶柱组件 12包括两才艮可活动地相互套接的一级顶柱 121和二级顶柱 122, 顶柱固定板组件 13包括与一级顶柱 121和二级顶柱 122对应的且相互平行并连 接的一级顶柱固定板 131和二级顶柱固定板 132, 定位机构组件 11包括与一级 顶柱 121和二级顶柱 122对应的且相互平行的一级定位板 111和二级定位板 112, 一级顶柱固定板 131和二级顶柱固定板 132之间的高度差大于或等于一级定位 板 111和二级定位板 112之间的高度差 , 一级顶柱 121和二级顶柱 122分别与 其相对应的一级顶柱固定板 131和二级顶柱固定板 132固定连接， 汽缸组件 14 与位于最下方的二级顶柱固定板固定 132连接，汽缸组件 14驱动一级定位板 111 和二级定位板 112 #支直线往复运动 , 一级定位板 111和二级定位板 112分别同 步的带动一级顶柱 121和二级顶柱 122运动； 按照由外到内的顺序相同高度平 面的顶柱依次被顶起， 形成多个高度平面， 实现层叠基板的分离， 由于三根顶 柱就可以确定一个基板平面， 因此只需要三个嵌套顶柱组件 12就可实现多层基 板的分离， 嵌套顶柱组件 12数量大为减少， 使得嵌套顶柱设备 1的结构简单， 成本降氐；一级顶柱 121和二级顶柱 122分别与其相对应的一级顶柱固定板 131 和二级顶柱固定板 132固定连接 , 一级顶柱固定板 131和二级顶柱固定板 132 互相连接， 汽缸组件 14驱动顶柱固定板， 顶柱固定板带动固定连接于其上的顶 柱直线运动， 由于只需要一个汽缸组件 14就可驱动各级顶柱固定板运动， 不存 在多个汽缸组件 14的同步进给问题， 使整个嵌套顶柱设备 1的驱动难度降低， 进而提高基板的处理效率； 顶柱固定板之间相互连接， 有效的减小对分离后的 物体定位过程中由于碰撞而产生的震动， 使嵌套顶柱设备 1的性能较稳定。 The nesting top column apparatus 1 of the present invention comprises four nested top pillar assemblies 12, a top pillar fixing plate assembly 13, a positioning mechanism assembly 11 and a driving device 14, and the positioning mechanism assembly 11 is located above the top pillar fixing plate assembly 13. The nested top post assembly 12 is located between the positioning mechanism assembly 11 and the top post mounting plate assembly, and the nesting top post assembly 12 includes a first top post 121 and a secondary top post 122 that are movably coupled to each other. The top pillar fixing plate assembly 13 includes a first-stage top pillar fixing plate 131 and a second-stage top pillar fixing plate 132 corresponding to the first-stage top pillar 121 and the second-stage top pillar 122 and connected to each other, and the positioning mechanism assembly 11 includes The height difference between the primary positioning plate 111 and the secondary positioning plate 112 corresponding to the primary top column 121 and the secondary top column 122 and parallel to each other, the primary top column fixing plate 131 and the secondary top column fixing plate 132 is greater than or Equal to the height difference between the primary positioning plate 111 and the secondary positioning plate 112, the primary top column 121 and the secondary top column 122 are respectively fixed to their corresponding primary column fixing plate 131 and secondary top column fixing plate 132. Connection, cylinder assembly 14 is fixed to the lowermost secondary top post mounting plate 132, the cylinder assembly 14 drives the primary positioning plate 111 and the secondary positioning plate 112. The linear positioning reciprocating motion, the primary positioning plate 111 and the secondary positioning plate 112 respectively drive the primary top column 121 and the secondary top column 122. Movement; the top pillars of the same height plane are sequentially jacked up in order from the outside to the inside, forming a plurality of height planes, thereby realizing separation of the laminated substrate, since one of the three top pillars can define one substrate plane, only three nestings are required The top column assembly 12 can realize the separation of the multi-layer substrate, and the number of the nested top column assemblies 12 is greatly reduced, so that the structure of the nested top column device 1 is simple and the cost is reduced; the first stage column 121 and the second stage column 122 The first stage top column fixing plate 131 and the second stage top column fixing plate 132 are respectively fixedly connected to each other, the first stage top column fixing plate 131 and the second stage top column fixing plate 132 are connected to each other, and the cylinder assembly 14 drives the top column fixing plate. The top pillar fixing plate drives the linear movement of the top column fixedly connected thereto, and since only one cylinder assembly 14 is required, the movement of the top pillar fixing plates can be driven, and there is no synchronous feeding problem of the plurality of cylinder assemblies 14 Nested top column 1 decreases the difficulty of the driving device, Further, the processing efficiency of the substrate is improved; the top pillar fixing plates are connected to each other, and the vibration generated by the collision during the positioning of the separated object is effectively reduced, so that the performance of the nesting top column device 1 is relatively stable.
以上仅对具有两根相互套接的顶柱的级嵌套顶柱设备 1对两层叠放基板 17 进行分离、 定位、 重叠的实施例进行描述， 但不限于该实施例， 本发明嵌套顶 柱设备 1还可根据实际需要， 增加相互套接的顶柱的数量， 实现多层叠放基板 的分离、 定位及重叠， 例如具有三根相互套接的顶柱的嵌套顶柱设备 1可完成 三层叠放基板的分离、 定位、 重叠。  The above describes only the embodiment in which the two-stage nesting top column device 1 having two mutually nested top posts separates, positions, and overlaps the two stacked substrate 17 , but is not limited to the embodiment, and the nesting top of the present invention The column device 1 can also increase the number of nested top pillars according to actual needs, and realize separation, positioning and overlapping of the multi-layer stacking substrate. For example, the nesting top column device 1 having three mutually nested top pillars can complete three Separation, positioning, and overlapping of stacked substrates.
本发明嵌套顶柱设备也不限于对重叠基板的分离、 定位及重叠， 还可根据 实际需要， 用于相类似的层叠物体之间的分离、 定位及重叠。  The nested top column device of the present invention is also not limited to the separation, positioning and overlapping of the overlapping substrates, and can also be used for separation, positioning and overlapping between similar stacked objects according to actual needs.
本发明嵌套顶柱设备的驱动装置 14及原理等均为本领域普通技术人员所熟 知， 在此不再做详细的说明。  The driving device 14 and the principle of the nesting top column device of the present invention are well known to those skilled in the art and will not be described in detail herein.
以上所揭露的仅为本发明的优选实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明申请专利范围所作的等同变化， 仍属本发明所涵盖 的范围。  The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes made by the scope of the present invention remain within the scope of the present invention.

Claims

权 利 要 求 Rights request
1.一种嵌套顶柱设备，适用于对薄板状的多层叠放的基板进行重复的分离定 位重叠， 其特征在于： 所述嵌套顶柱设备包括至少三个嵌套顶柱组件、 顶柱固 定板组件、 定位机构组件及驱动装置， 所述定位机构组件位于所述顶柱固定板 组件上方， 所述嵌套顶柱组件位于所述定位机构组件与所述顶柱固定板组件之 间， 所述嵌套顶柱组件包括至少两根可活动地相互套接的顶柱， 所述顶柱固定 板组件包括与所述顶柱对应的且相互平行并连接的顶柱固定板， 所述定位机构 组件包括与所述顶柱对应的且相互平行的定位板， 所述顶柱固定板之间的最大 高度差大于或等于所述定位板之间的最大高度差， 所述顶柱分别与其相对应的 顶柱固定板固定连接， 所述驱动装置与位于最下方的顶柱固定板固定连接， 所 述驱动装置驱动所述顶柱固定板做直线往复运动， 所述顶柱固定板同步的带动 所述顶柱运动。 A nested top column apparatus adapted to perform repeated separation and positioning overlap on a thin plate-shaped multi-layered substrate, wherein: the nested top column device comprises at least three nested top column assemblies, and a top a column fixing plate assembly, a positioning mechanism assembly and a driving device, the positioning mechanism assembly being located above the top column fixing plate assembly, the nesting top column assembly being located between the positioning mechanism assembly and the top column fixing plate assembly The nesting top column assembly includes at least two top pillars movably coupled to each other, the top pillar fixing plate assembly including a top pillar fixing plate corresponding to the top pillars and connected to each other and connected to each other, The positioning mechanism assembly includes positioning plates corresponding to the top pillars and parallel to each other, and a maximum height difference between the top pillar fixing plates is greater than or equal to a maximum height difference between the positioning plates, and the top pillars respectively Corresponding top pillar fixing plates are fixedly connected, the driving device is fixedly connected with the bottom pillar fixing plate located at the bottom, and the driving device drives the top pillar fixing plate to perform linear reciprocating motion The top pillar fixing plate driven synchronous movement of said top posts.
2. 如权利要求 1所述的嵌套顶柱设备， 其特征在于： 所述嵌套顶柱设备还 包括连接机构， 所述连接机构包括连接柱及弹性元件， 所述连接柱穿过构成所 述顶柱固定板组件的顶柱固定板， 且所述连接柱的下端与位于最下方的顶柱固 定板固定连接， 所述连接柱的上端与位于最上方的顶柱固定板卡接， 所述弹性 元件呈压缩状的套设于相邻顶柱固定板之间的连接柱处。 2. The nested top column apparatus according to claim 1, wherein: said nesting top column device further comprises a connecting mechanism, said connecting mechanism comprising a connecting post and an elastic member, said connecting post passing through the constitution a top pillar fixing plate of the top pillar fixing plate assembly, wherein a lower end of the connecting post is fixedly connected with a top pillar fixing plate located at a lowermost portion, and an upper end of the connecting post is engaged with a top pillar fixing plate located at an uppermost portion thereof, The elastic member is compressed and sleeved at a connecting post between adjacent top pillar fixing plates.
3. 如权利要求 1所述的嵌套顶柱设备， 其特征在于： 构成所述嵌套顶柱组 件的顶柱从内至外逐步变短。 3. The nested top column apparatus according to claim 1, wherein: the top pillar constituting the nested top pillar assembly is gradually shortened from the inside to the outside.
4. 如权利要求 3所述的嵌套顶柱设备， 其特征在于： 所述嵌套顶柱组件包 括两根顶柱， 所述两根顶柱分别为呈中空结构的一级顶柱和二级顶柱， 所述二 级顶柱的长度大于所述一级顶柱的长度， 所述二级顶柱活动地套接于所述一级 顶柱内。 4. The nested top column apparatus according to claim 3, wherein: the nested top column assembly comprises two top pillars, and the two top pillars are respectively a first stage top pillar and a hollow structure The stage top column, the length of the second stage top column is greater than the length of the first stage top column, and the second stage top column is movably sleeved in the first stage top column.
5. 如权利要求 4所述的嵌套顶柱设备， 其特征在于： 所述顶柱固定板组件 包括两个顶柱固定板， 所述两个顶柱固定板分别为一级顶柱固定板和二级顶柱 固定板， 所述一级顶柱固定板位于所述二级顶柱固定板上方， 所述一级顶柱固 定板与所述一级顶柱的下端固定连接， 所述二级顶柱固定板与所述二及顶柱的 下端固定连接。 5. The nested top column apparatus according to claim 4, wherein: the top pillar fixing plate assembly comprises two top pillar fixing plates, and the two top pillar fixing plates are respectively a first top pillar fixing plate And secondary top column a fixing plate, the first stage top column fixing plate is located above the second stage top column fixing plate, the first stage top column fixing plate is fixedly connected with the lower end of the first stage top column, and the second stage top column fixing plate is fixedly connected It is fixedly connected to the lower ends of the two top pillars.
6. 如权利要求 5所述的嵌套顶柱设备， 其特征在于： 所述定位机构组件包 括两个定位板， 所述两个定位板分别为一级定位板和二级定位板， 所述二级定 位板位于所述一级定位板的上方， 所述一级定位板和二级定位板均呈中空结构， 所述中空结构形成分离腔， 所述分离腔贯穿所述定位板， 所述一级定位板的分 离腔大于所述二级定位板的分离腔。 The nesting top column device according to claim 5, wherein: the positioning mechanism assembly comprises two positioning plates, wherein the two positioning plates are a first positioning plate and a second positioning plate, respectively, The second positioning plate is located above the first positioning plate, and the first positioning plate and the second positioning plate are both hollow structures, the hollow structure forms a separation cavity, and the separation cavity runs through the positioning plate, The separation chamber of the primary positioning plate is larger than the separation chamber of the secondary positioning plate.
7. 如权利要求 1所述的嵌套顶柱设备， 其特征在于： 所述嵌套顶柱设备还 包括底层物体垫板， 所述底层物体垫板位于所述定位机构组件与所述嵌套顶柱 组件之间， 且所述底层物体垫板与所述定位板相互平行， 所述底层物体垫板呈 中空结构， 所述中空结构贯穿所述底层物体垫板。 7. The nested top column apparatus of claim 1 wherein: said nested top post apparatus further comprises a bottom object pad, said bottom object pad being located in said positioning mechanism assembly and said nesting Between the top column assemblies, and the bottom object pad and the positioning plate are parallel to each other, the bottom object pad has a hollow structure, and the hollow structure penetrates the bottom object pad.
PCT/CN2009/076050 2009-07-29 2009-12-25 Apparatus with nested support pin assemblies WO2011011954A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910041513.6 2009-07-29
CN2009100415136A CN101656222B (en) 2009-07-29 2009-07-29 Nested support pillar equipment

Publications (1)

Publication Number Publication Date
WO2011011954A1 true WO2011011954A1 (en) 2011-02-03

Family

ID=41710433

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2009/076050 WO2011011954A1 (en) 2009-07-29 2009-12-25 Apparatus with nested support pin assemblies

Country Status (2)

Country Link
CN (1) CN101656222B (en)
WO (1) WO2011011954A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7116550B2 (en) * 2018-02-08 2022-08-10 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN110525978A (en) * 2019-09-20 2019-12-03 深圳市信濠光电科技股份有限公司 A kind of glass cover-plate changes rack device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031700A1 (en) * 1999-10-27 2001-05-03 Applied Materials Inc. Wafer holder and epitaxial growth device
CN1504396A (en) * 2002-11-29 2004-06-16 ������������ʽ���� Chip delivery device , method of taking out chip and holding chip
CN1810625A (en) * 2006-02-20 2006-08-02 广辉电子股份有限公司 Base plate elevating apparatus and its fulcrum mechanism
CN1922087A (en) * 2004-03-01 2007-02-28 平田机工株式会社 Base plate output-input device and base plate output-input method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031700A1 (en) * 1999-10-27 2001-05-03 Applied Materials Inc. Wafer holder and epitaxial growth device
CN1504396A (en) * 2002-11-29 2004-06-16 ������������ʽ���� Chip delivery device , method of taking out chip and holding chip
CN1922087A (en) * 2004-03-01 2007-02-28 平田机工株式会社 Base plate output-input device and base plate output-input method
CN1810625A (en) * 2006-02-20 2006-08-02 广辉电子股份有限公司 Base plate elevating apparatus and its fulcrum mechanism

Also Published As

Publication number Publication date
CN101656222B (en) 2011-07-27
CN101656222A (en) 2010-02-24

Similar Documents

Publication Publication Date Title
JP6602438B2 (en) Curved surface bonding apparatus and method of bonding
US10573543B2 (en) Apparatus and methods for mass transfer of electronic die
KR102038158B1 (en) Production apparatus and method of bonded device
US20160279917A1 (en) Vacuum laminating device
WO2016082341A1 (en) Organic electroluminescence device, preparation method and display device thereof
CN104009134B (en) A kind of LED-baseplate and lens bonding, hot pressing and injecting glue integration apparatus
CN108644628B (en) High-yield low-cost large-area flexible OLED (organic light emitting diode) lighting module
CN103456662B (en) Substrate separator and use the base plate separation method of this device
CN1339240A (en) Large EL panel and production method therefor
JP3219402U (en) Bonding device that can bond curved objects
CN1752800A (en) Double side liquid crystal display
WO2011011954A1 (en) Apparatus with nested support pin assemblies
TW201334961A (en) Bonding device and bonding method
TW201931987A (en) Micro device transfer head
CN1800437A (en) Apparatus for transferring a tray
CN201990257U (en) Positioning device with lead screws
WO2019010939A1 (en) Manufacturing mechanism for bubble light-guide plate
CN110182715B (en) Supporting device and detection equipment
CN201490233U (en) Top column device
KR101411284B1 (en) Ceramic Sheet Peering Apparatus
CN210940067U (en) Sheet material taking device with shaking and stretching stripping functions
CN210940068U (en) Keep away empty formula of stirring sheet stock storage device
KR20220157225A (en) Display device manufacturing system
CN102136525A (en) Laminating method for solar battery component panel manufacturing process
KR100819936B1 (en) A complex stage

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09847740

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09847740

Country of ref document: EP

Kind code of ref document: A1