WO2010120491A3 - Self-cleaning wiresaw apparatus and method - Google Patents
Self-cleaning wiresaw apparatus and method Download PDFInfo
- Publication number
- WO2010120491A3 WO2010120491A3 PCT/US2010/029144 US2010029144W WO2010120491A3 WO 2010120491 A3 WO2010120491 A3 WO 2010120491A3 US 2010029144 W US2010029144 W US 2010029144W WO 2010120491 A3 WO2010120491 A3 WO 2010120491A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiresaw
- cleaning
- self
- cutting
- wiresaw apparatus
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/242—With means to clean work or tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20100764843 EP2415070A4 (en) | 2009-04-01 | 2010-03-30 | Self-cleaning wiresaw apparatus and method |
JP2012503590A JP5540072B2 (en) | 2009-04-01 | 2010-03-30 | Self-cleaning wire saw device and method |
US13/258,112 US8851059B2 (en) | 2009-04-01 | 2010-03-30 | Self-cleaning wiresaw apparatus and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21159209P | 2009-04-01 | 2009-04-01 | |
US61/211,592 | 2009-04-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010120491A2 WO2010120491A2 (en) | 2010-10-21 |
WO2010120491A3 true WO2010120491A3 (en) | 2011-01-13 |
Family
ID=42983067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/029144 WO2010120491A2 (en) | 2009-04-01 | 2010-03-30 | Self-cleaning wiresaw apparatus and method |
Country Status (5)
Country | Link |
---|---|
US (1) | US8851059B2 (en) |
EP (1) | EP2415070A4 (en) |
JP (1) | JP5540072B2 (en) |
TW (1) | TWI368563B (en) |
WO (1) | WO2010120491A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102107465A (en) * | 2010-11-30 | 2011-06-29 | 西安隆基硅材料股份有限公司 | Method and device for reducing cutting line mark of solar silicon slice |
DE102013219468B4 (en) * | 2013-09-26 | 2015-04-23 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a workpiece |
JP5865436B2 (en) * | 2014-06-19 | 2016-02-17 | 株式会社アマダホールディングス | Vibration suppression method and vibration suppression device for band saw blade in band saw machine |
KR20160015068A (en) * | 2014-07-30 | 2016-02-12 | 두산중공업 주식회사 | Treatment device for waste steam generator, and installation method thereof |
JP6304118B2 (en) * | 2015-05-01 | 2018-04-04 | 信越半導体株式会社 | Wire saw equipment |
CN107538632A (en) * | 2016-06-24 | 2018-01-05 | 上海新昇半导体科技有限公司 | A kind of linear cutting mortar supply system and method |
CN110883955B (en) * | 2019-11-28 | 2021-11-02 | 西安奕斯伟材料科技有限公司 | Wire cutting cleaning device and wire cutting system |
CN114434664A (en) * | 2022-03-07 | 2022-05-06 | 广东高景太阳能科技有限公司 | Device for reducing wire jumper rate of silicon rod cutting and cutting method |
Citations (3)
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JP2000087059A (en) * | 1998-09-16 | 2000-03-28 | Hisafuku Yamaguchi | Cutting liquid and cutting of work |
KR20000022567A (en) * | 1998-09-01 | 2000-04-25 | 오카모토 유지 | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
US20030170948A1 (en) * | 2002-03-07 | 2003-09-11 | Memc Electronic Materials, Inc. | Method and apparatus for slicing semiconductor wafers |
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US3831576A (en) * | 1971-11-22 | 1974-08-27 | Motorola Inc | Machine and method for cutting brittle materials using a reciprocating cutting wire |
JPS58211829A (en) * | 1982-06-03 | 1983-12-09 | Inoue Japax Res Inc | Wire cut electric machining device |
JP2666436B2 (en) * | 1988-11-29 | 1997-10-22 | 住友金属工業株式会社 | Cutting method with wire saw |
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JP2622069B2 (en) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | Dressing equipment for polishing cloth |
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DE19841492A1 (en) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Method and device for separating a large number of disks from a brittle hard workpiece |
JP2000202755A (en) * | 1999-01-12 | 2000-07-25 | Super Silicon Kenkyusho:Kk | Wire washing device |
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US6837778B2 (en) * | 2000-11-24 | 2005-01-04 | Neomax Co., Ltd | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
JP2003191158A (en) * | 2000-11-24 | 2003-07-08 | Sumitomo Special Metals Co Ltd | Method for cutting rare earth metal alloy, method for manufacturing rare earth metal magnet and wire saw device |
JP2002292347A (en) * | 2001-03-30 | 2002-10-08 | Sumitomo Bakelite Co Ltd | Method and apparatus for cleaning and drying optical plastic film |
US6881131B2 (en) * | 2001-05-03 | 2005-04-19 | The Trustees Of Princeton University | Method and apparatus for diamond wire cutting of metal structures |
DE10122628B4 (en) * | 2001-05-10 | 2007-10-11 | Siltronic Ag | Method for separating slices from a workpiece |
CN1203966C (en) * | 2001-10-17 | 2005-06-01 | 株式会社新王磁材 | Cutting method using wire saw, wire saw device, and method of mfg. rareearth magnet |
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US7288165B2 (en) * | 2003-10-24 | 2007-10-30 | Applied Materials, Inc. | Pad conditioning head for CMP process |
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-
2010
- 2010-03-30 WO PCT/US2010/029144 patent/WO2010120491A2/en active Application Filing
- 2010-03-30 EP EP20100764843 patent/EP2415070A4/en not_active Withdrawn
- 2010-03-30 JP JP2012503590A patent/JP5540072B2/en not_active Expired - Fee Related
- 2010-03-30 US US13/258,112 patent/US8851059B2/en not_active Expired - Fee Related
- 2010-04-01 TW TW099110160A patent/TWI368563B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000022567A (en) * | 1998-09-01 | 2000-04-25 | 오카모토 유지 | Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
JP2000087059A (en) * | 1998-09-16 | 2000-03-28 | Hisafuku Yamaguchi | Cutting liquid and cutting of work |
US20030170948A1 (en) * | 2002-03-07 | 2003-09-11 | Memc Electronic Materials, Inc. | Method and apparatus for slicing semiconductor wafers |
Also Published As
Publication number | Publication date |
---|---|
JP5540072B2 (en) | 2014-07-02 |
EP2415070A2 (en) | 2012-02-08 |
EP2415070A4 (en) | 2012-09-26 |
WO2010120491A2 (en) | 2010-10-21 |
US8851059B2 (en) | 2014-10-07 |
TWI368563B (en) | 2012-07-21 |
US20120006312A1 (en) | 2012-01-12 |
TW201043422A (en) | 2010-12-16 |
JP2012522655A (en) | 2012-09-27 |
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