WO2010104534A1 - Thermal interface materials and mehtods for their preparation and use - Google Patents
Thermal interface materials and mehtods for their preparation and use Download PDFInfo
- Publication number
- WO2010104534A1 WO2010104534A1 PCT/US2009/066204 US2009066204W WO2010104534A1 WO 2010104534 A1 WO2010104534 A1 WO 2010104534A1 US 2009066204 W US2009066204 W US 2009066204W WO 2010104534 A1 WO2010104534 A1 WO 2010104534A1
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- WIPO (PCT)
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- interface material
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980157904.2A CN102341459B (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and methods for their preparation and use |
US13/144,096 US8440312B2 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and methods for their preparation and use |
JP2011554032A JP5640021B2 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and methods for their preparation and use |
EP09768271A EP2406321A1 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and methods for their preparation and use |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15956909P | 2009-03-12 | 2009-03-12 | |
US61/159,569 | 2009-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010104534A1 true WO2010104534A1 (en) | 2010-09-16 |
Family
ID=41490482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/066204 WO2010104534A1 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and mehtods for their preparation and use |
Country Status (7)
Country | Link |
---|---|
US (1) | US8440312B2 (en) |
EP (1) | EP2406321A1 (en) |
JP (1) | JP5640021B2 (en) |
KR (1) | KR20110133608A (en) |
CN (1) | CN102341459B (en) |
TW (1) | TW201035247A (en) |
WO (1) | WO2010104534A1 (en) |
Cited By (13)
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US20110308730A1 (en) * | 2010-06-21 | 2011-12-22 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticizer in adhesives and sealants |
WO2011161037A1 (en) * | 2010-06-21 | 2011-12-29 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticisers in adhesives or sealants |
WO2012128875A1 (en) * | 2011-03-22 | 2012-09-27 | Dow Corning Corporation | Thermal management within an led assembly |
US20130248163A1 (en) * | 2011-01-26 | 2013-09-26 | Dorab Bhagwagar | High Temperature Stable Thermally Conductive Materials |
WO2013191279A1 (en) * | 2012-06-22 | 2013-12-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Two pack type curable polyorganosiloxane composition and use of same |
JP2014005354A (en) * | 2012-06-22 | 2014-01-16 | Momentive Performance Materials Inc | Two-agent type curable polyorganosiloxane composition and use thereof |
WO2015050251A1 (en) * | 2013-10-04 | 2015-04-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Cured product of curable polyorganosiloxane composition, bonded body produced using curable polyorganosiloxane composition, method for producing bonded body using curable polyorganosiloxane composition, and use of said bonded body |
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US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
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US20100328895A1 (en) * | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
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US20210189188A1 (en) * | 2019-12-18 | 2021-06-24 | Fuji Polymer Industries Co., Ltd. | Thermally conductive composition, thermally conductive sheet and method for producing the same |
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JPWO2021246397A1 (en) * | 2020-06-05 | 2021-12-09 | ||
WO2022129299A1 (en) | 2020-12-17 | 2022-06-23 | Zephyros, Inc. | Thermally conductive electrically resistive low density adhesive |
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US11733154B2 (en) | 2021-08-16 | 2023-08-22 | International Business Machines Corporation | Thermal interface material detection through compression |
WO2024086553A1 (en) * | 2022-10-18 | 2024-04-25 | Dow Silicones Corporation | Silane modified polymer-based thermally conductive composition |
CN116102890A (en) * | 2023-02-09 | 2023-05-12 | 广州回天新材料有限公司 | Organic silicon rubber composition and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2938007A (en) * | 1957-06-17 | 1960-05-24 | Gen Electric | Compositions comprising an organopolysiloxane, silica and a dicarboxylic acid ester plasticizer and the heat cured product thereof |
US20020014692A1 (en) * | 2000-06-23 | 2002-02-07 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
US20050181213A1 (en) * | 2002-05-31 | 2005-08-18 | Hiroki Ishikawa | Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition |
Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3205283A (en) | 1965-09-07 | Solventless liquid organopolysiloxane encapsulating compositions | ||
US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
US3296291A (en) | 1962-07-02 | 1967-01-03 | Gen Electric | Reaction of silanes with unsaturated olefinic compounds |
US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
NL131800C (en) | 1965-05-17 | |||
NL129346C (en) | 1966-06-23 | |||
US3516946A (en) | 1967-09-29 | 1970-06-23 | Gen Electric | Platinum catalyst composition for hydrosilation reactions |
US3814730A (en) | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
US3989667A (en) | 1974-12-02 | 1976-11-02 | Dow Corning Corporation | Olefinic siloxanes as platinum inhibitors |
US3989668A (en) | 1975-07-14 | 1976-11-02 | Dow Corning Corporation | Method of making a silicone elastomer and the elastomer prepared thereby |
US4087585A (en) | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
US4370358A (en) | 1980-09-22 | 1983-01-25 | General Electric Company | Ultraviolet curable silicone adhesives |
US4544696A (en) * | 1984-10-29 | 1985-10-01 | Sws Silicones Corporation | Silicone elastomers having thermally conductive properties |
US4591622A (en) | 1984-10-29 | 1986-05-27 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product thereof |
US4584355A (en) | 1984-10-29 | 1986-04-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I |
US4585836A (en) | 1984-10-29 | 1986-04-29 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-II |
JPS61195129A (en) | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | Production of organosilicon polymer |
US4584361A (en) | 1985-06-03 | 1986-04-22 | Dow Corning Corporation | Storage stable, one part polyorganosiloxane compositions |
US4766176A (en) | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
US4774281A (en) | 1987-09-04 | 1988-09-27 | Dow Corning Corporation | Low compression set silicone rubber |
JPH0214244A (en) | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | Thermosetting organopolysiloxane composition |
US5036117A (en) | 1989-11-03 | 1991-07-30 | Dow Corning Corporation | Heat-curable silicone compositions having improved bath life |
JP3029680B2 (en) | 1991-01-29 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | Organopentasiloxane and method for producing the same |
JP2511348B2 (en) | 1991-10-17 | 1996-06-26 | 東レ・ダウコーニング・シリコーン株式会社 | Organopolysiloxane and method for producing the same |
US6197859B1 (en) | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
JPH10130504A (en) * | 1996-10-29 | 1998-05-19 | Toray Dow Corning Silicone Co Ltd | Silicone rubber composition |
JP3413718B2 (en) * | 1997-05-21 | 2003-06-09 | 信越化学工業株式会社 | Method for producing silicone rubber composition |
US6020387A (en) | 1997-09-22 | 2000-02-01 | Caschem, Inc. | Low density polymers and methods of making and using same |
JP3444199B2 (en) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | Thermal conductive silicone rubber composition and method for producing the same |
DE19832687B4 (en) | 1998-07-21 | 2007-04-26 | Compact Technology Gmbh | Kit for the preparation of fast-curing, acetoxysilane-crosslinking silicone compositions, process for its preparation and its use |
DE19832688A1 (en) | 1998-07-21 | 2000-02-03 | Heidelberger Bauchemie Gmbh | Fast-curing silicone compounds with good adhesive properties |
WO2000005652A1 (en) | 1998-07-24 | 2000-02-03 | Sun Microsystems, Inc. | Method and apparatus for achieving deterministic memory allocation response in a computer system |
US6399209B1 (en) | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
KR100540583B1 (en) | 1999-07-12 | 2006-01-10 | 제일모직주식회사 | Flame retardant hermoplastic resin composition |
WO2001004194A1 (en) | 1999-07-14 | 2001-01-18 | Fibre Optic Lamp Company Limited | Method of, and material for, improving thermal conductivity |
FR2809406B1 (en) | 2000-05-29 | 2006-02-17 | Von Roll Isola France S A | FLEXIBLE, INSULATING AND THERMALLY STABLE COMPOSITE MATERIALS COMPRISING A SUPPORT IMPREGNATED WITH AN ACRYLIC RESIN |
US6573328B2 (en) * | 2001-01-03 | 2003-06-03 | Loctite Corporation | Low temperature, fast curing silicone compositions |
US7118693B2 (en) | 2001-07-27 | 2006-10-10 | Eikos, Inc. | Conformal coatings comprising carbon nanotubes |
US20050127329A1 (en) | 2001-08-17 | 2005-06-16 | Chyi-Shan Wang | Method of forming nanocomposite materials |
FR2836922B1 (en) | 2002-03-08 | 2004-05-21 | Commissariat Energie Atomique | POLY (ETHYNYLENE PHENYLENE ETHYNYLENE SILYLENE) COMPOSITIONS |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
US6791839B2 (en) | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
JP5165892B2 (en) * | 2003-10-03 | 2013-03-21 | ヘンペル エイ/エス | Tie-coat composition containing at least two types of functional polysiloxane compounds and methods of using the composition to form a coating on a support |
ATE534686T1 (en) | 2003-10-10 | 2011-12-15 | Dow Corning | URETHANE COMPOSITIONS CONTAINING CARBINOL FUNCTIONAL SILICONE RESINS |
JP4557136B2 (en) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | Thermally conductive silicone rubber composition and molded product |
JP4855403B2 (en) | 2004-06-11 | 2012-01-18 | エルジー・ケム・リミテッド | Adhesive sheets including hollow portions and methods for producing the same |
WO2006007243A1 (en) | 2004-06-30 | 2006-01-19 | Dow Corning Corporation | Fluorocarbon elastomer silicone vulcanizates |
DE102004041379A1 (en) | 2004-08-26 | 2006-03-02 | Wacker-Chemie Gmbh | Crosslinkable siloxane-urea copolymers |
WO2006106095A1 (en) * | 2005-04-06 | 2006-10-12 | Dow Corning Corporation | Organosiloxane compositions |
JP5154010B2 (en) * | 2005-10-27 | 2013-02-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermally conductive silicone rubber composition |
DE102005057460A1 (en) | 2005-12-01 | 2007-06-06 | Wacker Chemie Ag | Crosslinkable to high-strength elastomers ionically and / or organometallic functionalized silicone polymers |
DE102005061248B4 (en) | 2005-12-20 | 2007-09-20 | Infineon Technologies Ag | System carrier with surfaces to be embedded in plastic compound, method for producing a system carrier and use of a layer as a primer layer |
WO2007086443A1 (en) * | 2006-01-26 | 2007-08-02 | Momentive Performance Materials Japan Llc | Heat dissipating member and semiconductor device using same |
US20070228331A1 (en) | 2006-03-28 | 2007-10-04 | Haitko Deborah A | Q silicone-containing composition, optoelectronic encapsulant thereof and device thereof |
US20080001140A1 (en) | 2006-06-28 | 2008-01-03 | Gelcore Llc | Optoelectronic device |
US20080160317A1 (en) | 2006-12-29 | 2008-07-03 | Deborah Ann Haitko | Optoelectronic device |
EP2115065B1 (en) | 2007-02-20 | 2016-05-11 | Dow Corning Corporation | Filler treating agents based on hydrogen bonding polyorganosiloxanes |
JP2008239719A (en) * | 2007-03-26 | 2008-10-09 | Dow Corning Toray Co Ltd | Silicone elastomer composition and silicone elastomer |
JP5233325B2 (en) * | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | Thermally conductive cured product and method for producing the same |
CN102105537B (en) * | 2008-07-22 | 2013-04-10 | 电气化学工业株式会社 | Resin composition |
-
2009
- 2009-12-01 US US13/144,096 patent/US8440312B2/en not_active Expired - Fee Related
- 2009-12-01 WO PCT/US2009/066204 patent/WO2010104534A1/en active Application Filing
- 2009-12-01 KR KR1020117023991A patent/KR20110133608A/en not_active Application Discontinuation
- 2009-12-01 JP JP2011554032A patent/JP5640021B2/en not_active Expired - Fee Related
- 2009-12-01 CN CN200980157904.2A patent/CN102341459B/en not_active Expired - Fee Related
- 2009-12-01 EP EP09768271A patent/EP2406321A1/en not_active Withdrawn
- 2009-12-11 TW TW98142597A patent/TW201035247A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2938007A (en) * | 1957-06-17 | 1960-05-24 | Gen Electric | Compositions comprising an organopolysiloxane, silica and a dicarboxylic acid ester plasticizer and the heat cured product thereof |
US20020014692A1 (en) * | 2000-06-23 | 2002-02-07 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone composition and semiconductor device |
US20050181213A1 (en) * | 2002-05-31 | 2005-08-18 | Hiroki Ishikawa | Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011161037A1 (en) * | 2010-06-21 | 2011-12-29 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticisers in adhesives or sealants |
US8791185B2 (en) | 2010-06-21 | 2014-07-29 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticizer in adhesives and sealants |
US20110308730A1 (en) * | 2010-06-21 | 2011-12-22 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticizer in adhesives and sealants |
US9598575B2 (en) * | 2011-01-26 | 2017-03-21 | Dow Corning Corporation | High temperature stable thermally conductive materials |
US20130248163A1 (en) * | 2011-01-26 | 2013-09-26 | Dorab Bhagwagar | High Temperature Stable Thermally Conductive Materials |
US10000680B2 (en) | 2011-01-26 | 2018-06-19 | Dow Silicones Corporation | High temperature stable thermally conductive materials |
WO2012128875A1 (en) * | 2011-03-22 | 2012-09-27 | Dow Corning Corporation | Thermal management within an led assembly |
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WO2013191279A1 (en) * | 2012-06-22 | 2013-12-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Two pack type curable polyorganosiloxane composition and use of same |
JP2014005354A (en) * | 2012-06-22 | 2014-01-16 | Momentive Performance Materials Inc | Two-agent type curable polyorganosiloxane composition and use thereof |
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WO2015050251A1 (en) * | 2013-10-04 | 2015-04-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Cured product of curable polyorganosiloxane composition, bonded body produced using curable polyorganosiloxane composition, method for producing bonded body using curable polyorganosiloxane composition, and use of said bonded body |
US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
WO2018022288A3 (en) * | 2016-07-26 | 2018-07-26 | Honeywell International Inc. | Gel-type thermal interface material |
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US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
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Also Published As
Publication number | Publication date |
---|---|
US20110311767A1 (en) | 2011-12-22 |
US8440312B2 (en) | 2013-05-14 |
CN102341459A (en) | 2012-02-01 |
TW201035247A (en) | 2010-10-01 |
JP5640021B2 (en) | 2014-12-10 |
EP2406321A1 (en) | 2012-01-18 |
CN102341459B (en) | 2014-01-01 |
KR20110133608A (en) | 2011-12-13 |
JP2012520375A (en) | 2012-09-06 |
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