CN107699206A

CN107699206A - Thermal interfacial material component and the system and method for controllably changing its surface viscosity

Info

Publication number: CN107699206A
Application number: CN201610647223.6A
Authority: CN
Inventors: 申景博; 冯梦凰; 赵敬棋
Original assignee: Tianjin Laird Technologies Co Ltd
Current assignee: Tianjin Laird Technologies Co Ltd
Priority date: 2016-08-09
Filing date: 2016-08-09
Publication date: 2018-02-16

Abstract

Thermal interfacial material component and the system and method for controllably changing its surface viscosity.Disclose for controllably change (for example, weaken, strengthen, eliminate, increase, customization, change etc.) surface viscosity of thermal interfacial material system and method illustrative embodiments.The illustrative embodiments of thermal interfacial material component are also disclosed, the thermal interfacial material component includes the coating for being configured as changing the surface viscosity of thermal interfacial material.

Description

Thermal interfacial material component and the system and method for controllably changing its surface viscosity

Technical field

This disclosure relates to for controllably change (for example, weaken, strengthen, eliminate, increase, customization, change etc.) hot interface The system and method for the surface viscosity of material.The disclosure further relates to include to be configured as the surface viscosity for changing thermal interfacial material The thermal interfacial material component of coating.

Background technology

This part provides background information related to the disclosure but being not necessarily prior art.

Electronic unit (semiconductor, integrated circuit package, transistor etc.) generally has the temperature being pre-designed, at this One temperature, electronic unit are run with optimum state.Under ideal conditions, the temperature of the temperature that is pre-designed close to surrounding air.So And the work of electronic unit produces heat.If not removing heat, electronic unit may be to be significantly higher than its normal or desired work Make the temperature operation of temperature.So too high temperature can be brought to the operation of the working characteristics and associated equipment of electronic unit Adverse effect.

To avoid or at least reducing the unfavorable working characteristics brought due to heat, heat should be removed, for example, by by heat from The electronic unit of work is transmitted to fin.Then it can cool down fin by traditional convection current and/or radiotechnology. In conductive process, heat can contact by the direct surface between electronic unit and fin and/or electronic unit and fin every The contact of intermediate medium or thermal interfacial material and be transmitted to fin from the electronic unit in work.Thermal interfacial material can be used To fill the gap between heating surface, to improve heat transfer compared with the gap filled with air (relatively bad heat carrier) Efficiency.

The content of the invention

According to an aspect of the invention, there is provided a kind of thermal interfacial material component, the thermal interfacial material component includes heat Boundary material, the first liner and between the first surface of the thermal interfacial material and the inner surface of first liner One coating, wherein, the first coating includes single-component silane and/or two component silane, and thus the first coating is configured For the first surface after first liner is removed from the thermal interfacial material component along the thermal interfacial material Retain, so as to change the surface viscosity of the first surface of the thermal interfacial material.

According to an aspect of the invention, there is provided a kind of thermal interfacial material component, the thermal interfacial material component includes tool There is a first coating of the thermal interfacial material of first surface and the first surface along the thermal interfacial material, described first Surface has surface viscosity, and the first coating includes single-component silane and/or two component silane, and thus the first coating increases The surface viscosity of the first surface that is big or reducing the thermal interfacial material.

According to an aspect of the invention, there is provided a kind of system for the surface viscosity for controllably changing thermal interfacial material, The system includes：For applying the device of first coating along the inner surface of the first liner；And for being served as a contrast along described first Piece applies thermal interfacial material so that the first coating is in the first surface of the thermal interfacial material and the institute of first liner The device between inner surface is stated, wherein, the first coating includes single-component silane and/or two component silane, and thus described One coating is configured as after first liner is removed from the thermal interfacial material along described in the thermal interfacial material First surface retains, so as to change the surface viscosity of the first surface of the thermal interfacial material.

According to an aspect of the invention, there is provided a kind of method for the surface viscosity for controllably changing thermal interfacial material, This method comprises the following steps：Apply first coating along the inner surface of the first liner；And apply along first liner Thermal interfacial material so that the first coating is in the first surface of the thermal interfacial material and the interior table of first liner Between face, wherein, the first coating includes single-component silane and/or two component silane, and thus the first coating is configured Retain for the first surface along the thermal interfacial material after first liner is removed from the thermal interfacial material, So as to change the surface viscosity of the first surface of the thermal interfacial material.

Brief description of the drawings

Accompanying drawing as described herein only for illustrating selected embodiment rather than all possible embodiment, and Be not intended to limit scope of the present disclosure.

Fig. 1 is the diagram for representing the example system according to illustrative embodiments, and it includes being used to controllably change heat The surface viscosity and/or reinforcement surface mechanically performance of boundary material improve the coating work of the materials application performance of thermal interfacial material Skill；

Fig. 2 is the cross section using the illustrative embodiments of thermal interfacial material component made of the system shown in Fig. 1 Figure, wherein the thermal interfacial material component includes being disposed along the first painting of the inner surface of corresponding first liner and the second liner Thermal interfacial material between layer and second coating (for example, mixture of siloxanes or silicone compounds etc.)；And

Fig. 3 be show for the cated thermal interfacial material of tool according to illustrative embodiments 100mil samples and The 100mil samples for not having cated thermal interfacial material for comparative purposes, flexure percentage is to 5 pound per square inches (psi) To the exemplary graph of 100psi pressure.

Embodiment

Example embodiment is more fully described now with reference to accompanying drawing.

When preparing thermal interfacial material (for example, thermal conductive gap filling sheet material etc.), by being formulated regulation in materials application It can be weighed between material function performance.For example, sacrifice thermal conductive gap filling sheet material sometimes for by being formulated to adjust Hot property (for example, reduce thermal conductivity etc.) is to improve navigability and/or to realize more preferable applying performance (for example, making it more Easily manipulation, application, assembling, reprocessing, transport etc.).Recognize it is above-mentioned it is true after, inventor's exploitation and herein Disclose for controllably change (for example, weaken, strengthen, eliminate, increase, customization, change etc.) surface of thermal interfacial material glues The system and method for property.In addition disclose thermal interfacial material and the surface viscosity including being configured as changing thermal interfacial material The illustrative embodiments of the thermal interfacial material component of coating.

Referring to the drawings, Fig. 1 represents the illustrative embodiments according to specific implementation one or more various aspects of the disclosure Example system 100.As shown in figure 1, system 100 includes coating process 104 before formation and curing process 108.

During coating process 104, coating 112 (for example, mixture of siloxanes or silicone compounds etc.) is wet Method is applied to and (in a broad aspect, is applied to) the first liner or lower liner 120 (for example, polyethylene terephthalate (PET) carries Body and/or release liner, embossing polyethylene liner etc.) thermal interfacial material (TIM) 124 will be set (for example, thermal conductive gap is filled Sheet material etc.) inner surface or upper surface 116 on.Coating 112 is arranged on the inner surface 116 and TIM's 124 of the first liner 120 Between lower surface.

As disclosed herein, coating 112 is formulated or is configured as controllably to change (for example, weakening, strengthening, disappearing Remove, increase, customize, change) TIM 124 surface viscosity and/or strengthen the material that surface mechanically performance improves TIM124 Application performance.Coating 112 may include the mixture of siloxanes or silicone compounds, and it includes one or more of otherization Product or other functional stuffings are to provide material specific function performance.

Coating 112 can be by the inner surface 116 of wet coating to (in a broad aspect, being applied to) first liner 120.For example, Roller 128 can be used to supply the first liner 120 from coiled strip source or be delivered to manually or automatically spray gun or nozzle (broadly Say, applicator or sprayer) following position.Then coating 112 can be sprayed on the inner surface 116 of the first liner 120. In illustrative embodiments, the whole inner surface 116 of the first liner 120 is coated with coating 112.Alternatively, coating 112 can be along The inner surface 116 of first liner 120 applies according to predetermined pattern, candy strip, dot pattern etc..For example, served as a contrast along first The coating 112 of the inner surface 116 of piece 120 can have the thickness less than about 76 microns.Or for example, along the first liner 120 The coating 112 of inner surface 116 can be in the range of about 8 microns to about 76 microns.In an illustrative embodiments, There is about 25 microns of thickness along the coating 112 of the inner surface 116 of the first liner 120.In alternative embodiment, coating Thickness can it is different (for example, more than 76 microns, less than 8 microns, higher or lower than 25 microns etc.), and/or coating can pass through spraying Other means or method in addition apply (for example, dip-coating etc.), and/or other means beyond roller 128 can be used to supply First liner 120.

Coating 112 can also be by wet coating to (in a broad aspect, being applied to) the second liner or upper liner 136 (for example, poly- pair PET (PET) carrier and/or release liner, embossing polyethylene liner etc.) TIM 124 interior table will be set On face or lower surface 132.Coating 112 is arranged between the inner surface 132 of the second liner 136 and TIM 124 upper surface.Example Such as, the position that the second liner 136 can be supplied to below manually or automatically spray gun or nozzle by roller 128 from coiled strip source.Then, can incite somebody to action Coating 112 is sprayed on the inner surface 132 of the second liner 136.In the exemplary embodiment, the second liner 136 is whole interior Surface 132 is coated with coating 112.Alternatively, coating 112 can be applied along the inner surface 132 of the second liner 136 according to predetermined pattern Add, candy strip, dot pattern etc..It is less than greatly for example, can have along the coating 112 of the inner surface 132 of the second liner 136 About 76 microns of thickness.Such as the coating 112 of the inner surface 132 along the second liner 136 can be at about 8 microns to big In the range of about 76 microns.In an illustrative embodiments, the coating 112 along the inner surface 132 of the second liner 136 has There is about 25 microns of thickness.In alternative embodiment, coating layer thickness can it is different (for example, more than 76 microns, less than 8 microns, Higher or lower than 25 microns etc.), and/or coating can be applied by the other means or method (for example, dip-coating etc.) beyond spraying Add, and/or other means beyond roller 128 can be used to supply the second liner 136.

Formed with during curing process 108, TIM 124 is set or be applied to the inner surface along the first liner 120 Above 116 coating 112.For example, TIM 124 may include to be sucked, distribute or be otherwise applied to the first liner 120 On the uncured product mixtures compound (for example, uncured thermal conductive gap filling sheet material etc.) on coating 112.So Afterwards, the second liner 136 can be applied on TIM 124, so as to cover and protect TIM124 upper surface.Therefore, the first liner 120 and second liner 136 set respectively along TIM 124 opposite downside and upside or upper and lower surface, such as Fig. 2 institutes Show.TIM 124 be set or be clipped in along the first coating of the inner surface 116 of the first liner 120 or lower coating 112A with along Between the second coating of the inner surface 132 of second liner 136 or upper coating 112B.TIM 124, the first liner 120 and the second lining Piece 136 and coating 112A, 112B may be collectively referred to herein as thermal interfacial material component 144 herein.

Then thermal interfacial material component 144 can be compressed using roller 140 (Fig. 1) etc..For example, thermal interfacial material component 144 compression makes sheet material of TIM 124 thickness such as being decreased to about 2.5mm from the original depth of about 4 millimeters (mm) Thickness.In alternative embodiment, in addition to roller 140, other means can be used to compress TIM 124.

Then, TIM 124 can undergo curing process.During curing process, the first liner is arranged in TIM 124 120 and second between liner 136 while thermal interfacial material component 144 is heated.For example, using heater by TIM 124 are heated approximately at the solidification temperature in the range of 100 degrees Celsius (DEG C) to about 150 DEG C, so that TIM 124 solidifies.

(for example, in electronic installation etc.) serves as a contrast using or using before TIM 124 by first in final use or application The liner 136 of piece 120 and second removes (for example, stripping etc.) from TIM 124.After liner 120,136 is removed, previously applied To corresponding liner 120,136 coating 112A, 112B be transferred to TIM 124 respective lower and upper surface and/or along TIM 124 respective lower and upper surface retain, thus coating 112A, 112B change TIM 124 respective lower and on The surface viscosity on surface.

For example, liner 120,136 may include to be used for convenient removal liner and convenient manipulation (for example, need not such as scrape The instrument of knife etc.) turning tongue (corner tab).In some illustrative embodiments, can configure wet coating (for example, Wet coating chemicals etc. may be selected) to participate in thermal compound cross-linking reaction.For example, coating 112 may include polysiloxanes, and Silicon hydrogen functional group and vinyl-functional may be present in chemical constitution.

In the exemplary embodiment, can have and edge along the first coating 112A of the inner surface 116 of the first liner 120 The second coating 112B identicals formula of the inner surface 132 of the second liner 136 (for example, identical siloxanes or siloxanes Mixture of compound etc.) and coating layer thickness.In alternative embodiment, first coating 112A can have and second coating 112B Different formulas and/or different thickness.In other embodiments, thermal interfacial material component 144 (Fig. 2) can be along the first lining The liner 136 of piece 120 or second includes coating 112, rather than as shown in Figure 2 along two liners.

In the exemplary embodiment, coating 112 has the different formulations for including different silicones for according to use Controllably surface viscosity is varied or adjusted to different level (inviscid, low or weak surfaces for which formula and which kind of silicones Viscosity, the sticky and high surface viscosity of medium surface).It was recognized by the inventor that can be by using different silane mixtures, regulationization Mixture molecular weight distribution is learned, and adjusts vinyl and silicon-hydrogen than realizing different surface viscosity performances, to obtain design table Face performance.

In the exemplary embodiment, coating 112 includes silicones, and it includes low viscosity low molecule amount Two-component liquid silicon Alkane.When using this coating formula for including low viscosity low molecule amount Two-component liquid silane, there is the hot interface material of this coating The gained surface viscosity of material can be inviscid, low or weak surface viscosity or medium surface viscosity.

In another exemplary embodiment, coating 112 includes silicones, and it includes low viscosity low molecule amount single group liquid separation Body silane.When using this coating formula for including low viscosity low molecule amount mono-component liquid silane, there is the hot boundary of this coating The gained surface viscosity of plane materiel material can be inviscid, low or weak surface viscosity or medium surface viscosity.

In another exemplary embodiment, coating 112 includes silicones, and it includes two groups of medium-viscosity intermediate molecular weight Divide liquid silane.When using this coating formula for including medium-viscosity intermediate molecular weight Two-component liquid silane, there is this painting The gained surface viscosity of the thermal interfacial material of layer can be that inviscid, low or weak surface viscosity, medium surface are sticky or high surface is glued Property.

In another exemplary embodiment, coating 112 includes silicones, and it includes medium-viscosity intermediate molecular weight single group Divide liquid silane.When using this coating formula for including medium-viscosity intermediate molecular weight mono-component liquid silane, there is this painting The gained surface viscosity of the thermal interfacial material of layer can be that inviscid, low or weak surface viscosity, medium surface are sticky or high surface is glued Property.

In another exemplary embodiment, coating 112 includes silicones, and it includes the component liquid of high viscosity HMW two Body silane.When using this coating formula for including high viscosity HMW Two-component liquid silane, there is the hot boundary of this coating The gained surface viscosity of plane materiel material generally can be high surface viscosity.But it can also realize other surfaces after amount of functional groups regulation Levels of adhesion (for example, inviscid, low or weak surface viscosity, medium surface viscosity etc.).

In another exemplary embodiment, coating 112 includes silicones, and it includes high viscosity HMW single group liquid separation Body silane.When using this coating formula for including high viscosity HMW mono-component liquid silane, there is the hot boundary of this coating The gained surface viscosity of plane materiel material can be that inviscid, low or weak surface viscosity, medium surface be sticky or high surface viscosity.

In other examples embodiment, two or more that can be used in above-mentioned different coating formula are realized Different surface viscosities is horizontal.For example, coating may include low viscosity low molecule amount and medium-viscosity intermediate molecular weight silane mixture Thing is to realize low surface viscosity.Alternative embodiment may include the other of two or more in above-mentioned different coating formula Combination, for example, low viscosity low molecule amount Two-component liquid silane, and/or low viscosity low molecule amount mono-component liquid silane, and/or Medium-viscosity intermediate molecular weight Two-component liquid silane, and/or medium-viscosity intermediate molecular weight mono-component liquid silane, and/or High viscosity HMW Two-component liquid silane, and/or high viscosity HMW mono-component liquid silane etc..

In above-mentioned example embodiment, low viscosity can be defined as 100 centipoises (cp) to 400cp, medium-viscosity can It is defined as 400cp to 2000cp, high viscosity can be defined as being more than 2000cp.In addition, in above-mentioned example embodiment, Low molecule amount can be defined as the number-average molecular weight (Mn) less than 10000, intermediate molecular weight can be defined as from 10000 to 30000 Mn, HMW can be defined as the Mn more than 30000.In addition, above-mentioned example embodiment includes ethylene methacrylic Base silane and platinum catalyst.Alternative embodiment may include other silane types or other silane reactions.In addition, exemplary In embodiment, coating may also include one or more of additives, coupling agent, silicon-hydrogen crosslinking agent etc..

Also disclose and controllably change (for example, weaken, strengthen, eliminating, increase, customization, change etc.) thermal interfacial material The illustrative embodiments of the method for surface viscosity.In the exemplary embodiment, before the formation of backing material and curing process, Methods described is generally included in silane mixture wet coating as disclosed herein to the first liner.This method may also include TIM product mixtures compound is distributed, aspirated or is otherwise applied to along on the wet-process coating of the first liner.Can The second liner with and without the wet-process coating of silane mixture is arranged on TIM product mixtures so that it thus by Second liner covers.Then, TIM product mixtures can be compressed to predetermined sheet thickness (such as about 2.5mm sheet thickness Deng).Then using heater such as making TIM sheet materials under the solidification temperature in the range of about 100 DEG C to about 150 DEG C Solidification.Then solidification TIM sheet materials application or final use before, can be by the first liner and the second liner from solidification TIM sheet materials remove (for example, stripping etc.).In illustrative embodiments kind, wet coating is can configure (for example, chemicals may be selected Deng) to participate in thermal compound cross-linking reaction.

In the illustrative embodiments of product are filled for temperature gap, pet vector liner is used in the both sides of TIM materials To protect TIM materials before using TIM during being formed with curing process and after formation and curing process.In this example In, the coating for including silane can be utilized as disclosed herein before the formation of product and curing process are filled for temperature gap Wet coating is carried out to the inner surface of two pet vector liners.

Fig. 3 be show for the cated thermal interfacial material of tool according to illustrative embodiments 100mil samples and Do not have the 100mil samples of cated thermal interfacial material, pressure of the flexure percentage to 5 pound per square inches (psi) to 100psi Exemplary graph.For having cated thermal interfacial material, by upper and lower polyethylene terephthalate (PET) every Removed from liner (release liner) from thermal interfacial material so that the whole coating for being previously applied to PET release liners is turned The upper and lower surface for moving on to thermal interfacial material is tested afterwards.Thermal interfacial material is protected to exempt from using PET release liners It is contaminated, while maneuvering performance is provided.PET release liners are peelled off before performance flexure test.For two kinds of samples, hot boundary Plane materiel material is that have 100mil thickness, 5W/mK thermal conductivity, 55shore 00 (1-5mm) or (0.5- of 66Shore 00 Hardness (3 seconds) and the ceramic filler siloxanes gap-filler of 3.3 proportion 0.75mm).In addition, for two kinds of samples, apply Layer is (for example, viscosity is the silane of about 450 centipoises (cp) and viscosity is about with two kinds of medium-viscosity silane 650cp another silane, viscosity are about 400cp to 600cp silane and viscosity is about 1500cp to about 2000cp another silane etc.) moderate tack coating.As indicated, two kinds of samples have similar flexural property.Therefore, apply Layer does not significantly reduce or influenceed the flexural property of thermal interfacial material.The curve map and result therein merely for illustrating purpose and There is provided, other embodiment can be configured differently (for example, different thermal interfacial materials, another coating disclosed herein etc.) And there is different flexural properties.

In the exemplary embodiment, temperature gap filler surface viscosity can by 180 DEG C of release liner peel test forces with And gap-filler is defined or described from 90 DEG C of peel tests of stainless steel plate.For example, inviscid be defined as being less than 10 grams Peeling force, low surface viscosity can be defined as the peeling force between 10 grams and 20 grams, and medium surface viscosity can be defined For the peeling force between 20 grams to 50 grams, high surface viscosity can be defined as the peeling force more than 50 grams.

As shown in following table, determined by gap-filler from 90 DEG C of peel tests of stainless steel plate, surface viscosity can be From less than 5 grams up in 100 grams of so high scopes.For example, the result in table 1 illustrates how that to include low viscosity low by applying The non-stick coating layer of molecular weight mono-component liquid silane reduces the surface viscosity of thermal interfacial material.In this example, hot interface Material is the conformal temperature gap filler made of the filling silicone elastomer on silicone dielectric carrier liner.Thermal interfacial material Thermal conductivity with 1.2W/mK, 13 hardness (shore 00), -40 DEG C to 200 DEG C of operating temperature, more than 10000VAC (volt Special alternating current) breakdown voltage, faint yellow and UL 94V-0 flammability ratings.

Result in table 2 illustrates how to glue thermal interfacial material surface by applying one in four different coatings Property reduce.In this example, thermal interfacial material is the conformal temperature gap filler made of ceramic filler silicone elastomer, is had 1.1W/mK thermal conductivity, 45 hardness (shore 00), -45 DEG C to 160 DEG C of operating temperature, the breakdown potential more than 27kVAC Pressure, light gray, UL 94V-0 flammability ratings and 48psi tensile strength.The coating 1 of moderate tack includes two kinds of Medium-viscosity intermediate molecular weight Two-component liquid silane is (for example, the intermediate molecular weight Two-component liquid silicon that viscosity is about 450cp The intermediate molecular weight Two-component liquid silane that alkane and viscosity are about 650cp etc.).The coating 2 of moderate tack includes medium-viscosity Intermediate molecular weight Two-component liquid silane and high viscosity HMW Two-component liquid silane.The coating 3 of moderate tack includes two The medium-viscosity intermediate molecular weight Two-component liquid silane of type is (for example, viscosity is about 400cp into about 600cp The intermediate molecular weight Two-component liquid silicon that equimolecular quantity Two-component liquid silane and viscosity are about 1500cp to about 2000cp Alkane etc.).The coating of high viscosity includes two kinds of high viscosity HMW Two-component liquid silane (for example, viscosity is about 4000cp to about 5000cp HMW Two-component liquid silane and viscosity is height of the about 8000cp to about 10000cp Molecular weight Two-component liquid silane etc.).

As shown in the example in table 3, coating only has very limited amount of influence to following TIM hot property.For example, table 3 show for the thermal interfacial material comprising silicones, heat filling, mill base and additive and including two kinds of medium viscous The coating of intermediate molecular weight Two-component liquid silane is spent, the thermal resistance at 60mil and 50 DEG C is only slightly from 0.51 DEG C of in²/ W (does not have Coating) increase to 0.522 DEG C of in²/ W (has coating).

Table 1 reduces surface viscosity coating

Peeling force	180 DEG C of PET liner peeling forces	90 DEG C of steel sheet peeling off power	Annotation
				Do not have cated TIM	45.7 grams	51.4 grams	High viscosity is original
TIM with non-stick coating layer	0.5 gram	4.8 gram	It is inviscid

Table 2 increases surface viscosity coating

The hot property of table 3

Table above and result therein provide merely for purpose is illustrated.Other embodiment may include that other coatings are matched somebody with somebody Square and/or other thermal interfacial materials so that surface viscosity and/or other materials property are different from shown in table.

Illustrative embodiments disclose thermal interfacial material component, and it includes thermal interfacial material, the first liner and in heat First coating between the inner surface of the first surface of boundary material and the first liner.First coating include single-component silane and/ Or two component silane.First coating is configured as after the first liner is removed from thermal interfacial material component along hot interface material The first surface of material retains, so as to change the surface viscosity of the first surface of thermal interfacial material.

First coating may include：Two component silicon of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000 Alkane；And/or the single-component silane of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or with 400 Centipoise is to the viscosity of 2000 centipoises and two component silane of 10000 to 30000 number-average molecular weight；And/or with 400 centipoises extremely The single-component silane of the viscosity of 2000 centipoises and 10000 to 30000 number-average molecular weight；And/or with more than 2000 centipoises Two component silane of viscosity and number-average molecular weight more than 30000；And/or with the viscosity for being more than 2000 centipoises and it is more than The single-component silane of 30000 number-average molecular weight.

First coating may include ethylene methacrylic base silane and platinum catalyst.First coating may include coupling agent and/or silicon-hydrogen Crosslinking agent.First liner may include polyethylene terephthalate liner.First coating may include to have about 8 microns to big The wet-process coating of thickness in the range of about 76 microns.Thermal interfacial material may include the thermal conductive gap filler piece with first surface Material, the first surface have the surface viscosity for increasing by first coating or reducing.

Thermal interfacial material component may also include the second liner and the second surface and second liner in thermal interfacial material Second coating between inner surface.Second coating may include single-component silane and/or two component silane.Second coating can be configured To be retained in the second liner by the second surface along thermal interfacial material after the removal of thermal interfacial material component, so as to change heat The surface viscosity of the second surface of boundary material.

Second coating can have the formula identical formula with first coating.Second coating may include：With less than 400 lis Two component silane of the viscosity of pool and number-average molecular weight less than 10000；And/or with the viscosity for being less than 400 centipoises and it is less than The single-component silane of 10000 number-average molecular weight；And/or the viscosity and 10000 to 30000 with 400 centipoises to 2000 centipoises Number-average molecular weight two component silane；And/or have the viscosity of 400 centipoises to 2000 centipoises and 10000 to 30000 number equal The single-component silane of molecular weight；And/or two components of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000 Silane；And/or the single-component silane of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000.

Second coating may include ethylene methacrylic base silane and platinum catalyst.Second liner may include poly terephthalic acid second two Alcohol ester liner.Second coating may include the wet-process coating with the thickness in the range of about 8 microns to about 76 microns.Heat Boundary material may include the thermal conductive gap filling sheet material with second surface, and the second surface has to be increased by second coating Or the surface viscosity reduced.

The illustrative embodiments of thermal interfacial material component are also disclosed, it includes thermal interfacial material and along hot interface The first coating of the first surface of material.First coating may include single-component silane and/or two component silane.First coating can increase The surface viscosity of first surface that is big or reducing thermal interfacial material.

First coating may include ethylene methacrylic base silane and platinum catalyst.First coating may include coupling agent and/or silicon-hydrogen Crosslinking agent.Thermal interfacial material may include the thermal conductive gap filling sheet material with first surface, and the first surface, which has, passes through first Coating and the surface viscosity for increasing or reducing.

Thermal interfacial material component may also include the second coating along the second surface of thermal interfacial material.Second coating can wrap Include single-component silane and/or two component silane.Glue on the surface that second coating can increase or reduce the second surface of thermal interfacial material Property.

The system that illustrative embodiments disclose the surface viscosity for controllably changing thermal interfacial material.In exemplary implementation In mode, a kind of system includes：For applying the device of first coating along the inner surface of the first liner；And for along One liner applies thermal interfacial material so that first coating is between the first surface of thermal interfacial material and the inner surface of the first liner Device.First coating may include single-component silane and/or two component silane.First coating can be configured as in the first liner quilt Retain after thermal interfacial material removal along the first surface of thermal interfacial material, so as to change the first surface of thermal interfacial material Surface viscosity.

The system may also include：For forming the device of thermal interfacial material；And in the interior table along the first liner The device that face applies first coating afterwards and solidifies thermal interfacial material after thermal interfacial material is applied along the first liner. Device for formation may include one or more rollers, and it is used to compress thermal interfacial material so as to reduce the thickness of thermal interfacial material Degree.Device for solidification may include heater, and it is used to thermal interfacial material being heated to solidification temperature.First coating can wrap Include：Two component silane of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or with less than 400 The single-component silane of the viscosity of centipoise and number-average molecular weight less than 10000；It is and/or viscous with 400 centipoises to 2000 centipoises Two component silane of degree and 10000 to 30000 number-average molecular weight；And/or with 400 centipoises to 2000 centipoises viscosity and The single-component silane of 10000 to 30000 number-average molecular weight；And/or with the viscosity for being more than 2000 centipoises and more than 30000 Two component silane of number-average molecular weight；And/or the list of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000 Component silane.First coating may include ethylene methacrylic base silane and platinum catalyst.First coating may include coupling agent and/or silicon- Hydrogen crosslinking agent.

The system may also include：For applying the device of second coating along the inner surface of the second liner；And for Apply the second liner on the second surface of thermal interfacial material so that second coating serves as a contrast in the second surface of thermal interfacial material and second Device between the inner surface of piece.Second coating may include single-component silane and/or two component silane.Second coating can be configured Retain for the second surface after being removed in the second liner from thermal interfacial material along thermal interfacial material, so as to change hot interface The surface viscosity of the second surface of material.Second coating can have the formula identical formula with first coating.Second coating can Including：Two component silane of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or have and be less than The single-component silane of the viscosity of 400 centipoises and number-average molecular weight less than 10000；And/or there are 400 centipoises to 2000 centipoises Two component silane of viscosity and 10000 to 30000 number-average molecular weight；And/or have 400 centipoises to 2000 centipoises viscosity and The single-component silane of 10000 to 30000 number-average molecular weight；And/or with the viscosity for being more than 2000 centipoises and more than 30000 Two component silane of number-average molecular weight；And/or the list of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000 Component silane.

The method for also disclosing the surface viscosity for controllably changing thermal interfacial material.In the exemplary embodiment, it is a kind of Method includes：Apply first coating along the inner surface of the first liner；And apply thermal interfacial material along the first liner so that First coating is between the first surface of thermal interfacial material and the inner surface of the first liner.First coating may include single-component silane And/or two component silane.First coating can be configured as after the first liner is removed from thermal interfacial material along hot interface The first surface of material retains, so as to change the surface viscosity of the first surface of thermal interfacial material.

This method may also include：After first coating is applied and by thermal interfacial material be applied to the first liner it Afterwards, form and solidify thermal interfacial material.The step of applying first coating may include the inner surface wet coating along the first liner First coating.The step of forming thermal interfacial material may include to compress thermal interfacial material so as to reduce the thickness of thermal interfacial material.Make The step of thermal interfacial material solidifies may include thermal interfacial material being heated to solidification temperature.

First coating may include two component silicon of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000 Alkane；And/or the single-component silane of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or with 400 Centipoise is to the viscosity of 2000 centipoises and two component silane of 10000 to 30000 number-average molecular weight；And/or with 400 centipoises extremely The single-component silane of the viscosity of 2000 centipoises and 10000 to 30000 number-average molecular weight；And/or with more than 2000 centipoises Two component silane of viscosity and number-average molecular weight more than 30000；And/or with the viscosity for being more than 2000 centipoises and it is more than The single-component silane of 30000 number-average molecular weight.First coating may include ethylene methacrylic base silane and platinum catalyst.First coating It may include coupling agent and/or silicon-hydrogen crosslinking agent.

This method may also include：Apply second coating along the inner surface of the second liner；In the second table of thermal interfacial material Apply the second liner on face so that second coating is between the second surface of thermal interfacial material and the inner surface of the second liner；With And thermal interfacial material is formed and solidified while thermal interfacial material is between the first liner and the second liner.Second coating can wrap Include single-component silane and/or two component silane.

This method may also include the first liner and the second liner from the corresponding first surface of thermal interfacial material and second Surface removes.First coating and second coating can be along the phases of thermal interfacial material after the first liner and the second liner are removed The first surface and second surface answered retain, and are glued so as to change the surface of the corresponding first surface and second surface of thermal interfacial material Property.Second coating can have the formula identical formula with first coating.Second coating may include：With less than 400 centipoises Two component silane of viscosity and number-average molecular weight less than 10000；And/or with the viscosity for being less than 400 centipoises and less than 10000 Number-average molecular weight single-component silane；And/or have the viscosity of 400 centipoises to 2000 centipoises and 10000 to 30000 number equal Two component silane of molecular weight；And/or viscosity and 10000 to 30000 number-average molecular weight with 400 centipoises to 2000 centipoises Single-component silane；And/or two component silane of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000； And/or the single-component silane of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000.

Diversified thermal interfacial material can be used for the thermal interfacial material shown in Fig. 1 and Fig. 2 in the exemplary embodiment (TIM)124.For example, TIM 124 may include thermal conductivity about 5W/mK metal-free temperature gap filler.Temperature gap filler can It is not leaded, and including siloxanes (silicone) elastomer and fiberglass backings or carrier.As another example, TIM 124 may include thermal conductivity for 1.2W/mK and by the filling on silicone dielectric carrier liner (for example, ceramics and/or nitridation Boron filling etc.) conformal temperature gap filler made of silicone elastomer.As another example, TIM 124 may include that thermal conductivity is 1.1W/mK and the conformal temperature gap filler made of ceramic filler silicone elastomer.

Workable example thermal interfacial material includes temperature gap filler, heat conduction EMI absorbents, mixed in illustrative embodiments Close heat/EMI absorbents, heat pad etc..Example embodiment may include one or more of hot interfaces of laird company (Laird) Material, such as Tflex^TMSeries of gaps filler is (for example, Tflex^TM300 series of heat gap-fillers, Tflex^TMBetween 600 series of heat Gap filler, Tflex^TM700 series of heat gap-fillers etc.), Tpli^TMSeries of gaps filler is (for example, Tpli^TM200 series of gaps Filler etc.), IceKap^TMSerial thermal interfacial material and/or CoolZorb^TMSerial heat conduction microwave absorption agent material (for example, CoolZorb^TM400 serial heat conduction microwave absorption agent materials, CoolZorb^TM500 serial heat conduction microwave absorption agent materials, CoolZorb^TM600 serial heat conduction microwave absorption agent materials etc.) etc. any of or more kind.In some exemplary embodiment party In formula, thermal interfacial material may include the conformal temperature gap filler with high heat conductance.

For example, thermal interfacial material may include the thermal interfacial material of laird company, such as Tflex^TM 200、Tflex^TM HR200、Tflex^TM 300、Tflex^TM 300TG、Tflex^TM HR400、Tflex^TM 500、Tflex^TM 600、Tflex^TM HR600、Tflex^TM SF600、Tflex^TM 700、Tflex^TM SF800、Tflex^TM HD700、Tflex^TMHW100 (has TG)、Tflex^TM 2100V0、Tflex^TMThe one or more of 530FG temperature gap filler kinds.

In some illustrative embodiments, thermal interfacial material includes the thermal conductivity with the 5W/mK, (1- of 55shore 00 5mm) or 66Shore 00 (0.5-0.75mm) hardness (3 seconds) and the ceramic filler siloxanes gap-filler of 3.3 proportion. In other examples embodiment kind, thermal interfacial material includes self-supporting ceramic filler silicone elastomer gap-filler, and it has Have 1.1W/mK thermal conductivity, 45 hardness (shore 00), -45 DEG C to 160 DEG C of operating temperature range, more than 27kVAC's Breakdown voltage, light gray, UL 94V-0 flammability ratings and 48psi tensile strength.In other illustrative embodiments Kind, thermal interfacial material includes the conformal temperature gap made of the filling silicone elastomer on silicone dielectric carrier liner and filled out Material, wherein thermal interfacial material have 1.2W/mK thermal conductivity, 13 hardness (shore 00), 2.3 proportion, are more than 10000VAC (volts AC) breakdown voltage, faint yellow and UL 94V-0 flammability ratings.In other exemplary reality Mode kind is applied, thermal interfacial material includes filling silicone elastomer gap-filler, and it has 2.8W/mK thermal conductivity, 40shore 00 hardness (3 seconds), the density of 3 grams (g/cc) per cubic centimeter, UL 94V-0 flammability ratings, -50 DEG C to 200 DEG C of work Temperature range and light blue.

Thermal interfacial material may include elastomer and/or ceramic particle, metallic particles, ferrite EMI/RFI absorbing particles, base In the metal of rubber, gel or wax or glass fiber mesh etc..Thermal interfacial material may include conformal or conformal siloxanes pad, non-silicon Oxyalkyl material (for example, non-silicone base gap-filler, thermoplasticity and/or thermosetting polymer, elastomeric material etc.), heat conduction Additive etc..Thermal interfacial material can be configured with enough conformabilities, conformal performance and/or pliability (for instance, it is not necessary to undergo Phase transformation or backflow etc.) to be adjusted under low temperature (for example, 20 DEG C to 25 DEG C room temperature etc.) by flexure for tolerance or gap Section and/or permission thermal interfacial material are being arranged to and matching surface (matching surface for including non-flat forms, bending or injustice) Matching surface is closely conformed to during contact (for example, extruding etc.) (for example, in the way of being relatively closely bonded and encapsulating Deng).

Thermal interfacial material may include to be formed by elastomer and at least one heat-conducting metal, boron nitride and/or ceramic packing Soft thermal interfacial material so that the soft thermal interfacial material even if do not suffer from phase transformation or backflow also can be conformal.It is exemplary at some Embodiment kind, thermal interfacial material may include ceramic filler silicone elastomer, boron nitride filling silicone elastomer, glass fibers Dimension strengthens gap-filler or includes the hot phase-change material of substantially non-strengthening membrane.Thermal interfacial material can have relatively low Young mould Amount and Shore hardnes figure (for example, 25,40,60,70,75, less than 100, less than 25, more than 75, between 25 and 75 The hardness of Shore 00 of the grades of Shore 00).

According to the loading percentage of specific material and heat filling (if present) for preparing thermal interfacial material Than illustrative embodiments may include with high heat conductance (for example, 1W/mK (Watt per meter Kelvin), 1.1W/mK, 1.2W/ MK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7W/mK, 5W/mK, 5.4W/mK, 6W/mK etc.) hot interface Material.These thermal conductivities are only examples, and other embodiment may include have higher than 6W/mK, less than 1W/mK or between 1 and The thermal interfacial material of the thermal conductivity of other values between 6W/mk.Therefore, each side of the disclosure should not necessarily be limited by using any specific Thermal interfacial material, illustrative embodiments may include diversified thermal interfacial material.

Diversified liner can be used for the liner 120,136 shown in Fig. 1 and Fig. 2 in the exemplary embodiment. In illustrative embodiments kind, liner 120,136 includes polyethylene terephthalate (PET) carrier/release liner.It is alternative Embodiment may include the other liners for being embossed polyethylene liner etc..

In the exemplary embodiment, thermal interfacial material disclosed herein can be used for limiting or provide from thermal source to row A part for the thermally conductive pathways of heat/radiator structure or part.For example, thermal interfacial material can be used for for example helping away from electronic installation Thermal source (for example, one or more heat generating components, CPU (CPU), chip, semiconductor devices etc.) conduction heat energy (for example, heat etc.).Thermal interfacial material can be generally disposed at thermal source and heat extraction/radiator structure or part (for example, radiator, dissipating Backing, heat conducting pipe, crust of the device or housing etc.) between with establish can from thermal source to heat extraction/radiator structure or part transfer (example Such as, conduct) heat hot joint, interface, path or thermally conductive pathways.During operation, then thermal interfacial material can be used for allowing By heat along thermally conductive pathways from thermal source transfer (for example, conduction heat etc.) to heat extraction/radiator structure or part.

In example embodiment kind, thermal interfacial material disclosed herein can be used for diversified thermal source, electronic installation And/or heat extraction/radiator structure or part (for example, radiator, fin, heat conducting pipe, crust of the device or housing etc.).For example, Thermal source may include one or more heat generating components or device (for example, chip, semiconductor devices, upside-down mounting core in CPU, primer Sheet devices, graphics processing unit (GPU), digital signal processor (DSP), multicomputer system, integrated circuit, polycaryon processor Deng).Generally, thermal source may include that temperature provides or heat of transfer higher than thermal interfacial material or otherwise to thermal interfacial material Any part or device, it is to be generated by thermal source or only shifted by or via thermal source but regardless of the heat.Therefore, the disclosure Each side should not necessarily be limited by using thermal source of any single type, electronic installation, heat extraction/radiator structure etc..

Illustrative embodiments can provide in following features or advantage it is one or more (but may not any or institute Have), such as change surface viscosity preferably to meet the surface viscosity requirement of customer, while also strengthen hot material ability.Show Example property embodiment can help to solve to conflict or be better balanced between the application performance of thermal interfacial material and functional performance Balance.Illustrative embodiments can help to solve between platform product and the different materials surface viscosity requirement of different customers sometimes Existing conflict.For example, traditional thermal interfacial material may have the uncontrollable and undetectable stripping problem by protection liner Caused material is extracted out or spallation problems.Very soft or conformal thermal interfacial material can have too high surface viscosity.It is exemplary Embodiment can allow for the platform product of the material surface viscosity with tailored levels.Illustrative embodiments can pass through tool The face coat for having difference in functionality chemicals realizes specific function performance.By illustrative embodiments, existing thermal interfacial material Surface viscosity can be customized (for example, increase, reduce, increase, eliminate etc.) preferably to meet customer's application requirement.It is exemplary Embodiment can allow temperature gap filler productivity ratio to improve and/or can help to solve between some tradition heat compared with traditional handicraft The instability problem of gap filler product association.For example, due to realizing more stable and uniform production using illustrative embodiments Product surface viscosity, temperature gap filler productivity ratio can improve and product rejection rate can reduce, so as to cause to extract out or peel off quality Problem is reduced.

There is provided example embodiment is intended to make the disclosure will will pass on thoroughly and fully this public affairs to those skilled in the art The scope opened.Many details (for example, particular elements, example of apparatus and method) are illustrated to provide the implementation to the disclosure The thorough understanding of mode.It will be apparent to the person skilled in the art that without using the detail, example Embodiment can be implemented in many different forms, be not necessarily to be construed as limiting the scope of the present disclosure.It is real in some examples Apply in mode, be not described in known processing, apparatus structure and technology.In addition, pass through the one or more of the disclosure The advantages of illustrative embodiments can be realized and improvement provide only for explanation, are not intended to limit the scope of the present disclosure, because Illustrative embodiments disclosed herein can provide all above-mentioned advantages and improvements or not provide above-mentioned advantages and improvements, and still fall Enter in the scope of the present disclosure.

What specific size, specific material and/or concrete shape disclosed herein were exemplary in nature, it is not intended to limit this public affairs The scope opened.The disclosure of particular value and specific range of values herein for given parameters is not excluded for disclosed herein one or more Useful other values or value scope in individual example.Moreover, it is foreseeable that any two of design parameter as described herein is specifically worth The end points of the value scope that may be adapted to given parameters can be limited, and (that is, the disclosure of the first value and second value for given parameters can It is interpreted to disclose any value that can be also used between the first value of given parameters and second value).If for example, herein Parameter X is exemplified as having value A, and is also exemplified as having value Z, then it is foreseeable that parameter X can have from about A to about Z Value scope.Similarly, it is foreseeable that the disclosure of two or more value scopes of parameter (no matter whether these scopes nested, hand over It is folded or completely different) it is possible to combine comprising the value scope for utilizing the end points of disclosed scope to be claimed.For example, If parameter X herein is exemplified as having the value in 1-10 or 2-9 or 3-8 scope, it is also foreseen that parameter X can have bag Include other value scopes including 1-9,1-8,1-3,1-2,2-10,2-8,2-3,3-10 and 3-9.

Terms used herein is intended merely to describe specific example embodiment, it is not intended that is limited.As herein Used, unless the context clearly, the otherwise description of singulative can be intended to include plural form.Term " comprising ", "comprising" and " having " only refer to containing, therefore show described feature, important document, step, operation, element and/or part be present, but One or more further features, important document, step, operation, element, part and/or its combination are not precluded the presence or addition of.Herein Method and step, processing and the operation of description are not necessarily intended to perform according to particular order that is described herein or showing, except non-specific Indicate execution sequence.It will be further understood that additional or alternative step can be used.

When element or layer be referred to as " ... on ", " being joined to ", " being connected to " or " being couple to " another element or layer When, it can engage directly on another element or layer or directly, be connected or coupled to another element or layer, or Intermediary element or layer also may be present in person.On the contrary, when element be referred to as " on directly existing ... ", " being directly joined to ", " be directly connected to To " or when " being directly coupled to " another element or layer, intermediary element or layer may not be present.For describing the relation between element Other words should also be construed in that manner (for example, " between " and " between directly existing ... ", " adjacent " and " direct neighbor ") etc..Such as Used herein, term "and/or" includes any one or more relevant entry and its all combinations.

Term " about " represents to calculate when applied to value or some small inexactnesies of measurement permissible value (are worth close Accurately；About approximate or reasonable approximation；Almost).If as some reasons, the inexactness provided by " about " is in ability Do not understood in domain with common meaning otherwise, then " about " as used herein represents may by common survey method Cause or utilize at least variable caused by these parameters.For example, term " substantially ", " about " and " substantially " is available herein To represent in manufacturing tolerance.Regardless of whether being modified by term " about ", claim includes the equivalence of amount.

Although may be described herein using term first, second, third, etc. various elements, part, region, layer and/ Or part, these elements, part, region, layer and/or part should not be limited by these terms.These terms can only be used for distinguishing One element, part, region, layer or part and another region, layer or part.Unless context clearly indicates, otherwise this paper institutes The term of such as " first ", " second " and other numerical terms that use does not imply that order or order.Therefore, show not departing from In the case of the teaching of example embodiment, alternatively referred to as second yuan of the first element, part, region, layer or part discussed below Part, part, region, layer or part.

For ease of description, herein may use space relative terms such as " interior ", " outer ", " following ", " lower section ", " under Portion ", " above ", " top " etc. describe an element shown in figure or feature and another element or the relation of feature.Except Outside orientation described in figure, space relative terms can be intended to the different orientation of device in use or operation.For example, such as Device upset in fruit figure, then being described as be in other elements or the element of feature " lower section " or " following " will be oriented as in institute State other elements or feature " above ".Therefore, exemplary term " lower section " can cover above and below two orientation.Device also can be another Row orientation (be rotated by 90 ° or other orientations), then respective explanations are also wanted in the relative description in space used herein.

It is to illustrate and describe to provide embodiment described above.It is not intended to limit or the limitation disclosure.It is special Determine each element of embodiment or feature is typically not limited to the particular implementation, but under applicable circumstances can be mutual Change, and can be used in selected embodiment (even if being not shown or described in detail).These embodiments can also be according to Many modes change.These changes are not construed as departing from the disclosure, and all such modifications are intended to the model for being included in the disclosure In enclosing.

Claims

1. a kind of thermal interfacial material component, the thermal interfacial material component includes thermal interfacial material, the first liner and in the heat First coating between the inner surface of the first surface of boundary material and first liner, wherein, the first coating includes Single-component silane and/or two component silane, thus the first coating be configured as from the thermal interfacial material component remove Retain after first liner along the first surface of the thermal interfacial material, so as to change the thermal interfacial material The surface viscosity of the first surface.

2. thermal interfacial material component according to claim 1, wherein, the first coating includes one in llowing group of materials Or more：

Two component silane of the viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or

The single-component silane of viscosity with less than 400 centipoises and the number-average molecular weight less than 10000；And/or

Two component silane of viscosity and 10000 to 30000 number-average molecular weight with 400 centipoises to 2000 centipoises；And/or

The single-component silane of viscosity and 10000 to 30000 number-average molecular weight with 400 centipoises to 2000 centipoises；And/or

Two component silane of the viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000；And/or

The single-component silane of viscosity with more than 2000 centipoises and the number-average molecular weight more than 30000.

3. thermal interfacial material component according to claim 1, wherein, the first coating includes：

The Two-component liquid silane of viscosity and 10000 to 30000 number-average molecular weight with 450 centipoises and with 650 lis The Two-component liquid silane of the viscosity of pool and 10000 to 30000 number-average molecular weight；Or

The Two-component liquid silane of viscosity and 10000 to 30000 number-average molecular weight with 400 centipoises to 600 centipoises and The Two-component liquid silane of viscosity and 10000 to 30000 number-average molecular weight with about 1500 centipoises to 2000 centipoises；Or

Two-component liquid silane and tool with viscosity of 4000 centipoises to 5000 centipoises and the number-average molecular weight more than 30000 There is the Two-component liquid silane of about 8000 viscosity of the centipoise to 10000 centipoises and the number-average molecular weight more than 30000.

4. thermal interfacial material component according to claim 1, wherein：

First liner includes polyethylene terephthalate liner；And/or

The first coating includes the wet-process coating with the thickness in the range of 8 microns to 76 microns；And/or

The thermal interfacial material includes the thermal conductive gap filling sheet material with the first surface, and the first surface, which has, to be passed through The first coating and the surface viscosity for increasing or reducing.

5. the thermal interfacial material component according to any one of Claims 1-4, the thermal interfacial material component also includes the Two liners and the second coating between the second surface of the thermal interfacial material and the inner surface of second liner, its In, the second coating includes single-component silane and/or two component silane, and thus the second coating is configured as from described Thermal interfacial material component retains after removing second liner along the second surface of the thermal interfacial material, so as to change Become the surface viscosity of the second surface of the thermal interfacial material.

6. thermal interfacial material component according to claim 5, wherein：

The second coating has the formula identical formula with the first coating；And/or

The second coating includes one or more in llowing group of materials：

7. thermal interfacial material component according to claim 5, wherein：

The first coating and the second coating include ethylene methacrylic base silane and platinum catalyst；And/or

Second liner includes polyethylene terephthalate liner；And/or

The second coating includes wet-process coating thickness in the range of 8 microns to 76 microns；And/or

The thermal interfacial material includes the thermal conductive gap filling sheet material with the second surface, and the second surface, which has, to be passed through The second coating and the surface viscosity for increasing or reducing.

8. a kind of thermal interfacial material component, the thermal interfacial material component include thermal interfacial material with first surface and along The first coating of the first surface of the thermal interfacial material, the first surface have surface viscosity, the first coating Including single-component silane and/or two component silane, thus the first coating increase or reduce the described of the thermal interfacial material The surface viscosity of first surface.

9. thermal interfacial material component according to claim 8, the thermal interfacial material component also includes the with inner surface One liner, wherein, the first coating is in the first surface of the thermal interfacial material with the described of first liner Between surface, thus the first coating is configured as the edge after first liner is removed from the thermal interfacial material component The first surface for the thermal interfacial material retains, so as to change the described of the first surface of the thermal interfacial material Surface viscosity.

10. thermal interfacial material component according to claim 8, wherein, the first coating includes one in llowing group of materials Individual or more：

11. thermal interfacial material component according to claim 8,

Wherein, the thermal interfacial material includes the thermal conductive gap filling sheet material with the first surface, the first surface tool Have by the first coating the surface viscosity that increases or reduce；And

Wherein, the first coating includes：

12. the thermal interfacial material component according to any one of claim 8 to 11, the thermal interfacial material component also includes Along the second coating of the second surface of the thermal interfacial material, the second coating includes single-component silane and/or two components Silane, the thus surface viscosity of second coating increase or the second surface for reducing the thermal interfacial material.

13. thermal interfacial material component according to claim 12, wherein：

The second coating includes one or more in llowing group of materials：

14. thermal interfacial material component according to claim 12, the thermal interfacial material component is also included with inner surface Second liner, wherein, the second coating is described in the second surface of the thermal interfacial material and second liner Between inner surface, thus the second coating is configured as after second liner is removed from the thermal interfacial material component Retain along the second surface of the thermal interfacial material, so as to change the institute of the second surface of the thermal interfacial material State surface viscosity.

15. a kind of system for the surface viscosity for controllably changing thermal interfacial material, the system include：

For applying the device of first coating along the inner surface of the first liner；And

For along first liner apply thermal interfacial material so that the first coating in the thermal interfacial material first Device between the inner surface of surface and first liner；

Wherein, the first coating includes single-component silane and/or two component silane, and thus the first coating is configured as Retain after thermal interfacial material removal first liner along the first surface of the thermal interfacial material, so as to Change the surface viscosity of the first surface of the thermal interfacial material.

16. system according to claim 15, the system also includes：For forming the device of the thermal interfacial material；With And for being served as a contrast after applying the first coating in the inner surface along first liner and along described first Piece applies the device for solidifying the thermal interfacial material after the thermal interfacial material.

17. system according to claim 16, wherein,

Described device for forming the thermal interfacial material includes one or more rollers, for compressing the hot interface material Expect so as to reduce the thickness of the thermal interfacial material；And

For making the described device of the thermal interfacial material solidification include heater, for the thermal interfacial material is heated to Solidification temperature.

18. system according to claim 15, wherein, the first coating includes one or more in llowing group of materials It is individual：

19. system according to claim 15, wherein, the first coating includes：

20. the system according to any one of claim 15 to 19, the system also includes：

For applying the device of second coating along the inner surface of the second liner；

For applying second liner on the second surface of the thermal interfacial material so that the second coating is in the heat Device between the inner surface of the second surface of boundary material and second liner；

Wherein, the second coating includes single-component silane and/or two component silane, and thus the second coating is configured as Retain after thermal interfacial material removal second liner along the second surface of the thermal interfacial material, so as to Change the surface viscosity of the second surface of the thermal interfacial material.

21. system according to claim 20, wherein：

The second coating includes one or more in llowing group of materials：

22. a kind of method for the surface viscosity for controllably changing thermal interfacial material, this method comprise the following steps：

Apply first coating along the inner surface of the first liner；And

Apply thermal interfacial material along first liner so that first surface of the first coating in the thermal interfacial material Between the inner surface of first liner；

Apply 23. according to the method for claim 22, this method is additionally included in after the first coating and by institute State after thermal interfacial material is applied to first liner and form and solidify the thermal interfacial material.

24. the method according to claim 11, wherein：

The step of applying the first coating applies including described in the inner surface wet coating along first liner first Layer；

The step of forming the thermal interfacial material is including compressing the thermal interfacial material so as to reducing the thickness of the thermal interfacial material Degree；And

The step of solidifying the thermal interfacial material, includes the thermal interfacial material being heated to solidification temperature.

25. according to the method for claim 22, wherein, the first coating includes one or more in llowing group of materials It is individual：

26. according to the method for claim 22, wherein, the first coating includes：

27. the method according to any one of claim 22 to 26, this method are further comprising the steps of：

Apply second coating along the inner surface of the second liner；

Apply second liner on the second surface of the thermal interfacial material so that the second coating is at the hot interface Between the inner surface of the second surface of material and second liner, wherein, the second coating includes one pack system Silane and/or two component silane；And

The hot boundary is formed and solidified while the thermal interfacial material is between first liner and second liner Plane materiel material.

28. the method according to claim 11, wherein：

Methods described also includes corresponding described the from the thermal interfacial material by first liner and second liner One surface and the second surface remove, and thus the first coating and the second coating are removing first liner and institute State the second liner afterwards along the corresponding first surface of the thermal interfacial material and the second surface to retain, so as to change Become the corresponding first surface of the thermal interfacial material and the surface viscosity of the second surface；And/or

The second coating includes one or more in llowing group of materials：