WO2010104250A1 - Diaphragm for microspeaker and manufacturing method thereof - Google Patents

Diaphragm for microspeaker and manufacturing method thereof Download PDF

Info

Publication number
WO2010104250A1
WO2010104250A1 PCT/KR2009/004874 KR2009004874W WO2010104250A1 WO 2010104250 A1 WO2010104250 A1 WO 2010104250A1 KR 2009004874 W KR2009004874 W KR 2009004874W WO 2010104250 A1 WO2010104250 A1 WO 2010104250A1
Authority
WO
WIPO (PCT)
Prior art keywords
diaphragm
micro
speaker
inner portion
manufacturing
Prior art date
Application number
PCT/KR2009/004874
Other languages
French (fr)
Korean (ko)
Inventor
이한량
김창원
도성환
이상호
권철영
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Publication of WO2010104250A1 publication Critical patent/WO2010104250A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04Plane diaphragms
    • H04R7/06Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025Diaphragms comprising polymeric materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to a diaphragm for a microspeaker and a method for manufacturing the same.
  • a diaphragm for a microspeaker and a method for manufacturing the diaphragm can be formed at a desired position. will be.
  • a speaker is a device that converts an electrical signal into a voice signal.
  • Speakers include medium-to-large speakers that are connected to audio or amplifiers and used to amplify the volume, and are small portable devices such as mobile phones, laptops, MP3 players, and earphones. There are also small speakers for sound equipment. Such a compact speaker is commonly referred to as a micro speaker, and the present invention relates to a diaphragm used in such a micro speaker.
  • the conventional micro speaker diaphragm has to be small in size, and thus, a thin, diaphragm diaphragm having light weight and flexibility is used.
  • a thin, diaphragm diaphragm having light weight and flexibility is used.
  • the thin-film diaphragm is smaller in size than the diaphragm used in the medium and large size speakers, it is difficult to faithfully reproduce a desired sound band such as a high band and a low band.
  • a thin film-like film is provided with several layers, each molded into a desired shape and size, and then bonded to each other to be used as a diaphragm.
  • a method of using an adhesive or applying heat and pressure has been mainly used.
  • the adhesive since the adhesive has some fluidity and requires time to cure, it is difficult to join a plurality of layers in the desired precise position and there is a problem in that it requires time to wait for the next fixing.
  • An object of the present invention in the diaphragm composed of a plurality of layers, by bonding the plurality of layers to each other by the ultrasonic fusion method, the bonding is precisely performed at a desired position, the thickness variation in the bonded portion can be minimized
  • the present invention provides a diaphragm for a micro speaker and a method of manufacturing the same, which can reduce variation in product characteristics and obtain high quality acoustic characteristics.
  • the diaphragm is formed by stacking a plurality of members in the form of a thin film made of a polymer compound, and the attachment between the plurality of members is made by an ultrasonic fusion method. It is characterized by.
  • the plurality of members includes a first member located at the bottom and a second member located at an upper portion thereof, and the first member is divided into an inner portion which is a center portion and an outer portion positioned outside of the inner portion.
  • the second member has a size corresponding to an inner portion of the first member, is located on the inner portion, and at least a portion of an outer circumferential portion of the second member is attached to the first member.
  • the entire outer circumferential portion of the second member is attached to the first member, and a gas layer is formed between the first member and the second member.
  • At least one additional member is provided between the first member and the second member.
  • a method of manufacturing a diaphragm for a micro speaker is a method of manufacturing a diaphragm, which is used in a micro speaker and is formed by combining a plurality of thin film-like members made of a polymer compound, and preparing a mold for preparing a mold. ; A first member molding step of placing the first member, which is located at the bottom of the plurality of members, on the molding mold and shaping it into a desired shape; A second member disposing step of placing a second member on the molded first member; And an ultrasonic fusion step of attaching portions of the first member and the second member to be attached to each other by an ultrasonic fusion method.
  • the first member is preferably fixed to the molding die by a vacuum suction method.
  • the second member disposing step it is preferable to include positioning at least one additional member between the first member and the second member.
  • the molded first member is divided into an inner portion which is a central portion and an outer portion located outside of the inner portion, the second member has a size corresponding to the inner portion of the first member, the first member Located above, the ultrasonic welding step, it is preferable to bond the entire outer peripheral portion of the second member to the first member.
  • the entire outer circumferential portion of the second member is bonded to the first member, and the bonding is performed such that a gas layer is formed between the first member and the second member.
  • the diaphragm for micro-speakers and the manufacturing method thereof according to the present invention it is possible to obtain the effect that the thickness of the portion where the plurality of layers are joined can be made uniform.
  • FIG. 1 is a schematic perspective view of a diaphragm for a micro speaker of one embodiment according to the present invention
  • FIG. 2 is a schematic cross-sectional view of the micro speaker equipped with the diaphragm of FIG. 1;
  • FIG. 3 is a cross-sectional view of the diaphragm for the micro speaker of FIG.
  • FIG. 4 is a schematic cross-sectional view of a diaphragm for a micro speaker of another embodiment according to the present invention.
  • FIG. 5 and 6 are views for explaining a method of manufacturing a diaphragm for a micro speaker of the present invention
  • FIG. 7 is a flow chart of a microphone assembly manufacturing method of an embodiment according to the present invention.
  • FIG. 1 is a perspective view of a diaphragm 1 of one embodiment according to the present invention
  • FIG. 2 is a diagram illustrating, as a cross-sectional view, a micro speaker 100 having a general configuration in which the diaphragm 1 of FIG. 1 is employed.
  • 3 is a schematic cross-sectional view of the diaphragm of FIG. 1.
  • the diaphragm 1 for a micro speaker of the present embodiment is a diaphragm used for a micro speaker of a small acoustic device such as a mobile phone, earphone, MP3, or the like, and is composed of a plurality of thin film-like members made of a polymer compound.
  • the diaphragm 1 for micro speakers is generally small in size, in order to obtain desired acoustical characteristics, it is comprised with several thin film members with a different shape and material.
  • the diaphragm may be formed of one film, but the diaphragm of the present invention is configured by stacking at least two or more films in order to form a desired acoustic characteristic.
  • Figure 2 is illustrated in a phantom perspective that the general micro-speaker 100 to which the diaphragm 1 for the micro-speaker of this embodiment is applied is cut in half.
  • the micro speaker 100 includes a frame 101, a yoke 102, a permanent magnet 103, a plate 104, and a base coil 105.
  • a cover (not shown) is usually fixed to the upper portion of the frame 101.
  • the outer peripheral part 12 is fixed to the frame 101.
  • the upper end of the base coil 105 is fixed to the lower surface of the junction portion 30 of the diaphragm 1.
  • the first member 10 and the second member 20 are stacked.
  • the first member 10 and the second member 20 is a polymer film of a thin film form.
  • the polymer compound includes polyethylene, polyurethane, and the like.
  • the first member 10 and the second member 20 are each selected from various polymer compound films in consideration of physical and chemical properties such as stiffness, softness, melting point, etc. of each material to obtain desired acoustic properties. It is done.
  • the first member 10 and the second member 20 may be made of the same material as needed, or may be made of different materials.
  • the diaphragm 1 for a micro speaker of this embodiment consists of a dome part which is a slightly convex part of the upper part, and the edge part surrounding the dome part, as shown in FIG.
  • the edge 12 of the edge portion is formed flat and fixed to the frame 101 of the micro speaker 100.
  • bonds a dome part and an edge part mutually is called the junction part 30.
  • FIG. 2 the upper end of the voice coil 105 (refer to FIG. 2) is coupled to the lower surface of the junction part 30.
  • the first member 10 is divided into an inner portion corresponding to a dome portion and an outer portion corresponding to an edge portion located outside the inner portion.
  • the second member 20 has a size corresponding to the inner portion of the first member 10 and is located above the inner portion.
  • the dome portion is composed of a plurality of layers in which the second member 20 is stacked on the first member 10, and the edge portion is composed of a single layer of the first member 20.
  • the dome and edge sections each have a different range of reproduction, and thus are configured to have different physical characteristics.
  • the bonding portion 30 is a portion where the outer circumferential portion of the second member 20 and the corresponding portion of the first member 10 are joined to each other by an ultrasonic fusion method.
  • Ultrasonic welding is generally a method of bonding processing of secondary polymer compounds, and is a method of bonding polymer compounds using vibration of sound waves.
  • the power of 50 / 60Hz is made into electric energy of 15KHz ⁇ 20KHz through the oscillator, and then converted into mechanical vibration energy through the converter and the booster, and then transmitted to the workpiece through the tool horn, The frictional heat is generated, and the joining surface of the workpiece is dissolved and bonded to form a molecular bond.
  • the entire outer peripheral portion of the second member 20 is joined to the first member 10 by an ultrasonic fusion method.
  • the present invention is not limited thereto, that is, the first member and the second member may be intermittently bonded to each other along the outer circumferential portion instead of the entire outer circumferential portion of the second member.
  • the diaphragm 1 for the micro speaker is circular, but the present invention is not limited thereto.
  • the present invention is a structure in which a diaphragm is formed by stacking films of two or more polymer compounds, and the bonding between the films is performed by ultrasonic fusion method. Similarly, it can be applied to a shape in which both sides of the quadrangle are arcs.
  • a gas layer 40 in which gas is formed is formed between the first member 10 and the second member 20 positioned in the dome portion.
  • the gas layer 40 is filled with general air. Since the entire outer circumferential portion of the second member 20 is attached to the first member 10, such a gas layer 40 is trapped in a space formed between the first member 10 and the second member 20. Will be.
  • FIG. 4 illustrates a diaphragm 1a for a micro speaker of another embodiment according to the present invention.
  • the micro speaker diaphragm 1a further includes an additional member 22a between the first member 10a and the second member 20a.
  • the additional member 22a may be a film made of a polymer compound like the first and second members, or may be made of various materials different from this.
  • the additional member 22a may be made of a material that cannot be applied to the ultrasonic welding method.
  • the additional member is made of a polymer compound, it is also possible to position the outer peripheral portion of the additional member between the first and second members, and then attach them all by an ultrasonic fusion method.
  • the addition member 22a for example, but is provided with one, two or more may be provided depending on the embodiment.
  • the diaphragm for a microspeaker of the present invention since the bonding between the first member and the second member is made by an ultrasonic fusion method, there is an advantage that the thickness of the bonding portion is almost constant. As a result, the acoustic characteristics of the product are uniform and the defect rate is low.
  • the method of manufacturing a diaphragm for a micro speaker is a method of manufacturing a diaphragm formed by combining a plurality of thin film-like members made of a polymer compound, and preparing a mold (S1) and forming a first member. (S2), the second member arrangement step (S3) and ultrasonic welding step (S4) is made.
  • the mold preparation step S1 is a step of preparing a mold 40 having a shape corresponding to the shape of the first member 10 in order to form the first member 10 in a desired shape.
  • the first member forming step (S2) is a step of placing the first member 10, which is located at the bottom of the plurality of members, on the molding die 40 and molding to a desired shape. That is, the first member 10 is molded by using another mold (not shown) that puts a film of a polymer compound material on the mold 40 and exerts a force from top to bottom.
  • the second member arranging step S3 is a step of placing the second member on the molded first member 10. After positioning the second member 20 at a desired position of the first member 10, the ultrasonic welding step (S4) of the next step is performed.
  • the first member 10 is divided into an inner portion which is a central portion and an outer portion located outside of the inner portion, and the second member 20 corresponds to the inner portion of the first member 10. It is sized to be positioned on the first member.
  • the ultrasonic welding step S4 is a step of attaching the portions to be attached to the first member 10 and the second member 20 to each other by an ultrasonic welding method.
  • the tool horn 42 for ultrasonic welding is ultrasonically applied to a portion 30 to be bonded to each other. Performing fusion is illustratively shown. General description of the ultrasonic welding method is as described above.
  • the manufacturing method of this embodiment is for manufacturing the diaphragm 1 for the micro speaker of the first embodiment described above. Therefore, in the ultrasonic welding step S4, the entire outer peripheral portion of the second member 20 is bonded to the first member 10.
  • the present invention is not limited thereto. That is, depending on the embodiment, it is also possible to join only a part of the second member 20 instead of the entire outer peripheral part. It is also possible to intermittently join in the circumferential direction along the outer circumference, and also form a joining portion spaced apart along the outer circumference, and the joining direction of each joining portion may be in the radial direction. In the form of umbrellas, the joints are made only to a part of the length close to the outer shell, not the entire length of the umbrellas. On the other hand, according to the embodiment, the shape of the diaphragm may be in various shapes such as square, square, oval, track, and the like, rather than circular.
  • the ultrasonic welding step (S4) is bonded to form a gas layer 40 (see Fig. 3) between the first member 10 and the second member 20. That is, the second member 20 is in contact with the first member 10 only in the junction portion 30, and the remaining portion except for this is spaced apart from the first member 10 to form a gas layer 40 therebetween.
  • the first member 10 is fixed to the molding die 40 by a vacuum suction method.
  • the first member 10 when the first member 10 is formed in a desired shape and then the molded first member 10 is placed on the mold 40, the first member 10 adheres closely to the mold by a vacuum adsorption method. The combined state will be maintained.
  • the first member 10 When the first member 10 is maintained at a predetermined position on the mold in this state, it is possible to accurately position the second member 20 at the desired position on the first member 10. In addition, since the position of the first member 10 does not change even after the ultrasonic fusion step is performed, ultrasonic fusion can be accurately performed at a desired point.
  • the second member 20 is lifted up in a vacuum suction state in succession, and ultrasonic welding is performed, thereby improving workability.
  • the second member arrangement step S3 in the second member arrangement step S3, at least one additional member 22a is disposed between the first member 10a and the second member 20a. Positioning is included.
  • the ultrasonic welding step (the next step) is performed. S4) is performed.
  • the description regarding the additional member 22a is applied as it is with respect to the diaphragm 1a.
  • the method of manufacturing a diaphragm for a micro speaker of the present invention since the first member and the second member constituting the diaphragm are joined by the ultrasonic welding method, there is an advantage that the thickness variation of the joining portion can be minimized.
  • the position of the first member can be fixed accurately, and the joining position with the second member can be precisely controlled and the work efficiency is improved. It is effective.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a diaphragm for a microspeaker. The diaphragm for the microspeaker of the invention is characterized by laminating multiple thin film-shaped members made of high molecular compounds, wherein the adhesion between the members is carried out by ultrasonic welding.

Description

마이크로 스피커용 진동판 및 그 제조방법Diaphragm for micro speaker and manufacturing method thereof
본 발명은 마이크로 스피커용 진동판 및 그 제조방법에 관한 것으로, 특히 박막의 복수 층으로 이루어진 진동판에 있어서, 복수의 층 상호간의 결합이 원하는 위치에서 정확하게 이루어지는 것이 가능한 마이크로 스피커용 진동판 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diaphragm for a microspeaker and a method for manufacturing the same. In particular, in a diaphragm composed of a plurality of layers of a thin film, a diaphragm for a microspeaker and a method for manufacturing the diaphragm can be formed at a desired position. will be.
일반적으로 스피커는, 전기적인 신호를 음성신호로 전환시키는 장치이다.Generally, a speaker is a device that converts an electrical signal into a voice signal.
스피커에는, 오디오 또는 앰프에 연결되어 음량을 대폭 증폭시키는 용도로 사용되는 중대형 스피커도 있고, 크기가 작은 음향기기, 이를 테면, 휴대폰, 노트북, MP3플레이어, 이어폰 등, 근래에 수요가 크게 늘고 있는 휴대용 음향기기를 위한 소형의 스피커도 있다. 이러한 소형의 스피커를 보통 마이크로 스피커라고 칭하며, 본 발명은 이러한 마이크로 스피커에 내장되어 사용되는 진동판에 관한 것이다.Speakers include medium-to-large speakers that are connected to audio or amplifiers and used to amplify the volume, and are small portable devices such as mobile phones, laptops, MP3 players, and earphones. There are also small speakers for sound equipment. Such a compact speaker is commonly referred to as a micro speaker, and the present invention relates to a diaphragm used in such a micro speaker.
종래의 마이크로 스피커용 진동판은, 그 사이즈가 작아야 하기 때문에, 진동판의 효율을 높이기 위해 가벼우면서도 유연성을 가지는 박막형 진동판을 사용하였다. 그러나 이러한 박막형 진동판은, 중대형의 스피커에서 사용하는 진동판에 비해 크기가 작기 때문에, 고음대역과 저음대역 등 원하는 음역대를 충실히 재생하는 데 데 어려움이 있다.In order to increase the efficiency of the diaphragm, the conventional micro speaker diaphragm has to be small in size, and thus, a thin, diaphragm diaphragm having light weight and flexibility is used. However, since the thin-film diaphragm is smaller in size than the diaphragm used in the medium and large size speakers, it is difficult to faithfully reproduce a desired sound band such as a high band and a low band.
종래에는, 이러한 어려움을 극복하기 위해, 얇은 막 형태의 필름을 여러 층 구비하고 각각 원하는 모양과 크기로 성형한 후, 이들을 접합하여 진동판으로 사용하고 있다. 이때, 복수의 필름들을 상호 접합하기 위해서는, 주로 접착제를 사용하거나, 혹은 열과 압력을 가하는 방법이 사용되어 오고 있다.Conventionally, in order to overcome this difficulty, a thin film-like film is provided with several layers, each molded into a desired shape and size, and then bonded to each other to be used as a diaphragm. At this time, in order to bond a plurality of films to each other, a method of using an adhesive or applying heat and pressure has been mainly used.
하지만, 복수의 필름을 접착제로 상호 접합하는 경우, 접착제를 접합하고자하는 면 전체에 균일하게 도포하는 것이 어렵다는 문제점이 있다. 이로 인해 접합면의 두께편차가 발생하게 되는 문제가 발생하게 된다.However, when a plurality of films are bonded to each other with an adhesive, there is a problem that it is difficult to uniformly apply the adhesive to the entire surface to be bonded. This causes a problem that the thickness deviation of the joint surface occurs.
또한, 접착제가 어느 정도의 유동성을 가지고 있으며 경화되는데 시간이 필요하기 때문에, 복수의 층을 원하는 정확한 위치에서 접합시키는 것이 어려우며 다음 고정을 위해 대기해야 하는 시간이 필요하다는 문제점이 있다.In addition, since the adhesive has some fluidity and requires time to cure, it is difficult to join a plurality of layers in the desired precise position and there is a problem in that it requires time to wait for the next fixing.
그리고, 복수의 층의 원하는 부분을 상호 접합하기 위하여 열과 압력을 가하는 방법을 사용하는 것도, 직접적으로 열과 압력이 성형 금형에 가해져야 하므로 접착 위치의 편차가 발생된다는 문제점이 있다.In addition, the use of a method of applying heat and pressure to mutually join the desired portions of the plurality of layers also has a problem in that a variation in bonding position occurs because heat and pressure must be applied directly to the molding die.
또한, 스피커의 음향특성을 위해 서로 다른 재질의 복수의 층을 접합해야 하는 경우, 재질에 따라서는 사용되는 접착제와 화학반응을 일으킬 수도 있다는 문제점이 있다.In addition, when it is necessary to bond a plurality of layers of different materials for the acoustic characteristics of the speaker, there is a problem that depending on the material may cause a chemical reaction with the adhesive used.
본 발명의 목적은, 복수 층으로 이루어진 진동판에 있어서, 상기 복수의 층 상호간의 접합이 초음파 융착방법에 의해 이루어지도록 함으로써, 원하는 위치에 정확하게 접합이 이루어지고, 접합된 부분에서 두께 편차를 최소할 수 있으며, 이로 인해 제품의 특성 편차 감소와 고음질의 음향특성을 얻는 것이 가능한 마이크로 스피커용 진동판 및 그 제조방법을 제공하는 데 있다.An object of the present invention, in the diaphragm composed of a plurality of layers, by bonding the plurality of layers to each other by the ultrasonic fusion method, the bonding is precisely performed at a desired position, the thickness variation in the bonded portion can be minimized The present invention provides a diaphragm for a micro speaker and a method of manufacturing the same, which can reduce variation in product characteristics and obtain high quality acoustic characteristics.
상기와 같은 목적을 달성하기 위해 본 발명의 마이크로 스피커용 진동판은, 상기 진동판은 고분자화합물로 이루어진 얇은 막 형태의 부재가 복수 개 적층되어 이루어지고, 상기 복수 개의 부재 간의 부착은 초음파 융착방법에 의해 이루어진 것을 특징으로 한다.In order to achieve the above object, in the diaphragm for micro speaker of the present invention, the diaphragm is formed by stacking a plurality of members in the form of a thin film made of a polymer compound, and the attachment between the plurality of members is made by an ultrasonic fusion method. It is characterized by.
한편, 상기 복수개의 부재는 가장 아래에 위치한 제1부재와, 그 상부에 위치한 제2부재를 포함하고, 상기 제1부재는 그 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 외측부분으로 나뉘고, 상기 제2부재는 상기 제1부재의 내측부분에 대응하는 크기를 가지고, 그 내측부분의 위에 위치하고, 상기 제2부재의 외주부 중 적어도 일부분이 상기 제1부재와 부착되어 있는 것이 바람직하다.On the other hand, the plurality of members includes a first member located at the bottom and a second member located at an upper portion thereof, and the first member is divided into an inner portion which is a center portion and an outer portion positioned outside of the inner portion. Preferably, the second member has a size corresponding to an inner portion of the first member, is located on the inner portion, and at least a portion of an outer circumferential portion of the second member is attached to the first member.
그리고 상기 제2부재의 외주부 전체가 상기 제1부재와 부착되어 있고, 상기 제1부재와 제2부재의 사이에는 기체층이 형성된 것이 바람직하다.The entire outer circumferential portion of the second member is attached to the first member, and a gas layer is formed between the first member and the second member.
한편, 상기 제1부재와 제2부재의 사이에는 추가부재가 적어도 하나 구비되어 있는 것이 바람직하다.On the other hand, it is preferable that at least one additional member is provided between the first member and the second member.
본 발명의 다른 측면에 따른 마이크로 스피커용 진동판의 제조방법은, 마이크로 스피커에 사용되고, 고분자화합물로 이루어진 얇은 막 형태의 부재가 복수 개 결합되어 이루어진 진동판을 제조하는 방법으로서, 금형을 준비하는 금형준비단계; 상기 복수의 부재들 중에 가장 아래에 위치하는 제1부재를 상기 성형금형에 올려놓고 원하는 형상으로 성형하는 제1부재 성형단계; 상기 성형된 제1부재의 상부에, 제2부재를 위치시키는 제2부재 배치단계; 및 상기 제1부재와 제2부재의 상호 부착되어야 할 부분을 초음파융착방법에 의해 상호 부착시키는 초음파융착단계를 포함하여 이루어진 것을 특징으로 한다.According to another aspect of the present invention, a method of manufacturing a diaphragm for a micro speaker is a method of manufacturing a diaphragm, which is used in a micro speaker and is formed by combining a plurality of thin film-like members made of a polymer compound, and preparing a mold for preparing a mold. ; A first member molding step of placing the first member, which is located at the bottom of the plurality of members, on the molding mold and shaping it into a desired shape; A second member disposing step of placing a second member on the molded first member; And an ultrasonic fusion step of attaching portions of the first member and the second member to be attached to each other by an ultrasonic fusion method.
한편, 상기 제1부재는 상기 성형금형에 진공흡착방법에 의해 고정되는 것이 바람직하다.On the other hand, the first member is preferably fixed to the molding die by a vacuum suction method.
또한, 상기 제2부재 배치단계는, 상기 제1부재와 제2부재의 사이에 적어도 하나의 추가부재를 위치시키는 것을 포함하는 것이 바람직하다.In addition, the second member disposing step, it is preferable to include positioning at least one additional member between the first member and the second member.
한편, 상기 성형된 제1부재는 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 외측부분으로 나뉘고, 상기 제2부재는 상기 제1부재의 내측부분에 대응하는 크기를 가지고, 그 제1부재의 위에 위치하고, 상기 초음파융착단계는, 상기 제1부재에 상기 제2부재의 외주부 전체를 접합시키는 것이 바람직하다.On the other hand, the molded first member is divided into an inner portion which is a central portion and an outer portion located outside of the inner portion, the second member has a size corresponding to the inner portion of the first member, the first member Located above, the ultrasonic welding step, it is preferable to bond the entire outer peripheral portion of the second member to the first member.
그리고, 상기 초음파융착단계는, 상기 제1부재에 상기 제2부재의 외주부 전체를 접합시키되, 상기 제1부재와 제2부재의 사이에 기체층이 형성되도록 접합시키는 것이 바람직하다.In the ultrasonic fusion step, the entire outer circumferential portion of the second member is bonded to the first member, and the bonding is performed such that a gas layer is formed between the first member and the second member.
본 발명에 따른 마이크로 스피커용 진동판 및 그의 제조방법에 의하면, 복수의 층이 접합된 부분의 두께가 균일하게 이루어지는 것이 가능하다는 효과를 얻을 수 있다.According to the diaphragm for micro-speakers and the manufacturing method thereof according to the present invention, it is possible to obtain the effect that the thickness of the portion where the plurality of layers are joined can be made uniform.
또한, 복수의 층 상호간의 접합이 원하는 위치에 정확하게 이루어지는 것이 가능하므로 각 층의 정밀한 성형이 가능하다는 효과를 얻을 수 있다.In addition, since the joining of a plurality of layers can be made precisely at a desired position, the effect of precise molding of each layer can be obtained.
또한, 종래기술과 같이 접착제를 사용하지 않음으로써, 제조상 불량 감소 및 수율의 향상을 도모할 수 있고 생산의 자동화도 가능하다는 효과를 얻을 수 있다.In addition, by not using an adhesive as in the prior art, it is possible to reduce manufacturing defects and to improve yield, and to obtain an effect of automation of production.
도 1은, 본 발명에 따른 일실시예의 마이크로 스피커용 진동판의 개략적 사시도,1 is a schematic perspective view of a diaphragm for a micro speaker of one embodiment according to the present invention;
도 2는 도 1의 진동판이 장착된 마이크로 스피커의 개략적 단면도,FIG. 2 is a schematic cross-sectional view of the micro speaker equipped with the diaphragm of FIG. 1;
도 3은 도 1의 마이크로 스피커용 진동판의 단면도,3 is a cross-sectional view of the diaphragm for the micro speaker of FIG.
도 4와 본 발명에 따른 다른 실시예의 마이크로 스피커용 진동판의 개략적 단면도, 4 is a schematic cross-sectional view of a diaphragm for a micro speaker of another embodiment according to the present invention;
도 5와 도 6은, 본 발명의 마이크로 스피커용 진동판의 제조방법을 설명하기 위한 도면들, 5 and 6 are views for explaining a method of manufacturing a diaphragm for a micro speaker of the present invention,
도 7은 본 발명에 따른 일실시예의 마이크로폰 조립체 제조방법의 순서도.7 is a flow chart of a microphone assembly manufacturing method of an embodiment according to the present invention.
본 발명에 따른 일 실시예의 마이크로 스피커용 진동판을 첨부된 도 1 내지 3을 참조하며 상세히 설명한다.1 to 3 attached to the diaphragm for a micro speaker of an embodiment of the present invention will be described in detail.
도 1은, 본 발명에 따른 일 실시예의 진동판(1)의 사시도이고, 도 2는 도 1의 진동판(1)이 채용된 일반적 구성을 가지는 마이크로 스피커(100)를 단면도로서 예시한 도면이고, 도 3은 도 1의 진동판의 개략적 단면도이다.1 is a perspective view of a diaphragm 1 of one embodiment according to the present invention, and FIG. 2 is a diagram illustrating, as a cross-sectional view, a micro speaker 100 having a general configuration in which the diaphragm 1 of FIG. 1 is employed. 3 is a schematic cross-sectional view of the diaphragm of FIG. 1.
본 실시예의 마이크로 스피커용 진동판(1)은, 휴대폰이나, 이어폰, MP3 등과 같은 소형음향기기의 마이크로 스피커에 사용되는 진동판으로서, 고분자 화합물로 이루어진 얇은 막 형태의 부재가 복수 개 적층되어 이루어져 있다.The diaphragm 1 for a micro speaker of the present embodiment is a diaphragm used for a micro speaker of a small acoustic device such as a mobile phone, earphone, MP3, or the like, and is composed of a plurality of thin film-like members made of a polymer compound.
마이크로 스피커용 진동판(1)은, 일반적으로 그 크기가 소형이기 때문에, 원하는 음향 특성을 얻기 위해서는, 서로 다른 형상과 재질을 가진 복수의 박막 부재을 가지고 구성하게 된다. 하나의 필름으로 진동판이 형성될 수도 있으나, 본 발명의 진동판은 원하는 음향특성을 구형하기 위해, 적어도 2개 이상의 필름이 적층되어 구성된다.Since the diaphragm 1 for micro speakers is generally small in size, in order to obtain desired acoustical characteristics, it is comprised with several thin film members with a different shape and material. The diaphragm may be formed of one film, but the diaphragm of the present invention is configured by stacking at least two or more films in order to form a desired acoustic characteristic.
한편, 도 2에는 본 실시예의 마이크로 스피커용 진동판(1)이 적용된 일반적인 마이크로 스피커(100)가 반으로 절단된 것을 가상한 사시도로 예시되어 있다.On the other hand, Figure 2 is illustrated in a phantom perspective that the general micro-speaker 100 to which the diaphragm 1 for the micro-speaker of this embodiment is applied is cut in half.
마이크로 스피커(100)는, 프레임(101), 요크(102), 영구자석(103), 플레이트(104) 및 베이스 코일(105)을 포함하여 이루어진다. 프레임(101)의 상부에는 통상 커버(미도시)가 고정된다. 이때, 본 실시예의 진동판(1)은, 그 외주부(12)가 프레임(101)에 고정된다. 그리고, 진동판(1)의 접합부(30)의 하면에는 베이스 코일(105)의 상단부가 고정되어 있다. The micro speaker 100 includes a frame 101, a yoke 102, a permanent magnet 103, a plate 104, and a base coil 105. A cover (not shown) is usually fixed to the upper portion of the frame 101. At this time, in the diaphragm 1 of this embodiment, the outer peripheral part 12 is fixed to the frame 101. As shown in FIG. The upper end of the base coil 105 is fixed to the lower surface of the junction portion 30 of the diaphragm 1.
본 실시예의 마이크로 스피커용 진동판(1)은, 제1부재(10)와 제2부재(20)가 적층되어 이루어져 있다.In the micro speaker diaphragm 1 of the present embodiment, the first member 10 and the second member 20 are stacked.
상기 제1부재(10)와 제2부재(20)는, 얇은 막 형태의 고분자화합물 필름이다. 고분자화합물에는, 폴리에틸렌, 폴리우레탄 등이 포함된다. 제1부재(10)와 제2부재(20)는 각각 여러 가지의 고분자화합물 필름 중에서, 원하는 음향특성을 얻기 위해, 각 소재의 강성, 부드러운 정도, 녹는점 등과 같은 물리적, 화학적 특성을 고려하여 선택되어 진다. 제1부재(10)와 제2부재(20)는 필요에 따라 같은 재질로 구성 될 수도 있고, 서로 다른 재질로 구성될 수도 있다.The first member 10 and the second member 20 is a polymer film of a thin film form. The polymer compound includes polyethylene, polyurethane, and the like. The first member 10 and the second member 20 are each selected from various polymer compound films in consideration of physical and chemical properties such as stiffness, softness, melting point, etc. of each material to obtain desired acoustic properties. It is done. The first member 10 and the second member 20 may be made of the same material as needed, or may be made of different materials.
한편, 본 실시예의 마이크로 스피커용 진동판(1)은, 도 1에 도시된 바와 같이, 가운데의 위로 약간 볼록한 부분인 돔부분과, 그 돔부분을 둘러싸고 있는 에지부로 이루어져 있다. 에지부의 가장자리(12)는 평평하게 성형되어 있으며, 마이크로 스피커(100)의 프레임(101)에 고정되는 부분이다.On the other hand, the diaphragm 1 for a micro speaker of this embodiment consists of a dome part which is a slightly convex part of the upper part, and the edge part surrounding the dome part, as shown in FIG. The edge 12 of the edge portion is formed flat and fixed to the frame 101 of the micro speaker 100.
그리고, 돔부분과 에지부를 상호 결합하는 부분은 접합부(30)라고 칭한다. 접합부(30)의 하면에는 상술한 바와 같이 통상 보이스코일(105, 도 2참조)의 상단부가 결합되어 있다.In addition, the part which couple | bonds a dome part and an edge part mutually is called the junction part 30. FIG. As described above, the upper end of the voice coil 105 (refer to FIG. 2) is coupled to the lower surface of the junction part 30.
본 실시예의 경우, 제1부재(10)는, 돔부분에 해당하는 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 에지부에 해당하는 외측부분으로 나뉜다. 제2부재(20)는 제1부재(10)의 내측부분에 대응하는 크기를 가지고, 그 내측부분의 위에 위치한다.In the present embodiment, the first member 10 is divided into an inner portion corresponding to a dome portion and an outer portion corresponding to an edge portion located outside the inner portion. The second member 20 has a size corresponding to the inner portion of the first member 10 and is located above the inner portion.
따라서, 돔부분은 제1부재(10)의 위에 제2부재(20)가 적층되어 있는 복층으로 구성되어 있고, 에지부는 제1부재(20)가 단층으로 구성되어 있다. 돔부분과 에지부분은 각각 주로 재생하는 음역대가 다르며 따라서 서로 다른 물리적 특성을 가지도록 구성된다.Therefore, the dome portion is composed of a plurality of layers in which the second member 20 is stacked on the first member 10, and the edge portion is composed of a single layer of the first member 20. The dome and edge sections each have a different range of reproduction, and thus are configured to have different physical characteristics.
상기 접합부(30)는, 제2부재(20)의 외주부분과 여기에 제1부재(10)의 대응되는 부분이 초음파 융착방법에 의해 상호 접합되어 있는 부분이다.The bonding portion 30 is a portion where the outer circumferential portion of the second member 20 and the corresponding portion of the first member 10 are joined to each other by an ultrasonic fusion method.
초음파 용착방법이란 일반적으로 고분자화합물의 2차가공 중 접합가공의 한 분야로서 음파의 진동을 이용하여 고분자화합물을 접착하는 방법이다. 통상, 50/60Hz의 전원을 발진기를 통하여 15KHz ~ 20 KHz의 전기적인 에너지로 만든 후 다시 콘버터와 부스터를 통해 기계적인 진동에너지로 변환한 후 공구혼을 통하여 가공물에 전달시켜 순간적으로 강력한 진동에 의한 마찰열을 발생시켜 가공물의 접합면이 용해, 접착되어 분자적 결합이 이루어지는 방법이다.Ultrasonic welding is generally a method of bonding processing of secondary polymer compounds, and is a method of bonding polymer compounds using vibration of sound waves. In general, the power of 50 / 60Hz is made into electric energy of 15KHz ~ 20KHz through the oscillator, and then converted into mechanical vibration energy through the converter and the booster, and then transmitted to the workpiece through the tool horn, The frictional heat is generated, and the joining surface of the workpiece is dissolved and bonded to form a molecular bond.
한편, 본 실시예의 경우, 제2부재(20)는, 그 외주부 전체가 제1부재(10)에 초음파 융착방법에 의해 접합되어 있다. 하지만, 본 발명이 이에 한정되는 것은 아니다, 즉, 제1부재와 제2부재는 필요에 따라 제2부재의 외주부의 전체가 아닌 외주부를 따라 단속적으로 상호 접합될 수도 있다.On the other hand, in the present embodiment, the entire outer peripheral portion of the second member 20 is joined to the first member 10 by an ultrasonic fusion method. However, the present invention is not limited thereto, that is, the first member and the second member may be intermittently bonded to each other along the outer circumferential portion instead of the entire outer circumferential portion of the second member.
또한, 본 실시예의 경우, 마이크로 스피커용 진동판(1)이 원형인 것으로 예를 들었으나, 본 발명이 이에 한정되는 것은 아니다. 즉, 본 발명은, 진동판이 2개 이상의 고분자화합물로 되어 있는 필름이 적층되어 이루어진 구조이고, 이들 필름 상호간의 접합이 초음파 융착방법이 의해 이루어지기만 하면, 원형이외에도 사각형이나, 타원형, 혹은 운동장 트랙과 같이 사각형의 양측변이 원호로 되어 있는 형상 등에도 적용이 가능하다.In addition, in the case of the present embodiment, it is exemplified that the diaphragm 1 for the micro speaker is circular, but the present invention is not limited thereto. In other words, the present invention is a structure in which a diaphragm is formed by stacking films of two or more polymer compounds, and the bonding between the films is performed by ultrasonic fusion method. Similarly, it can be applied to a shape in which both sides of the quadrangle are arcs.
한편, 본 실시예의 경우, 도 3을 참조하면, 돔부분에 위치한 제1부재(10)와 제2부재(20)의 사이에는 기체가 들어있는 기체층(40)이 형성되어 있다. 기체층(40)에는 일반적인 공기가 채워져 있다. 이러한 기체층(40)은, 제2부재(20)의 외주부 전체가 제1부재(10)에 부착되어 있기 때문에, 제1부재(10)와 제2부재(20)의 사이에 형성된 공간에 갇혀있게 된다.Meanwhile, in the present exemplary embodiment, referring to FIG. 3, a gas layer 40 in which gas is formed is formed between the first member 10 and the second member 20 positioned in the dome portion. The gas layer 40 is filled with general air. Since the entire outer circumferential portion of the second member 20 is attached to the first member 10, such a gas layer 40 is trapped in a space formed between the first member 10 and the second member 20. Will be.
도 4에는 본 발명에 따른 다른 실시예의 마이크로 스피커용 진동판(1a)이 예시되어 있다.4 illustrates a diaphragm 1a for a micro speaker of another embodiment according to the present invention.
상기 마이크로 스피커용 진동판(1a)은, 제1부재(10a)와 제2부재(20a)의 사이에 추가부재(22a)가 더 구비되어 있다. 추가부재(22a)는, 제1, 2부재와 같이 고분자화합물로 된 필름일 수도 있고, 이와는 다른 다양한 소재로 될 수도 있다.The micro speaker diaphragm 1a further includes an additional member 22a between the first member 10a and the second member 20a. The additional member 22a may be a film made of a polymer compound like the first and second members, or may be made of various materials different from this.
추가부재(22a)는 제1부재(10a)와 제2부재(20a) 사이에 형성된 공간에 위치하기 때문에, 초음파융착방법에 적용할 수 없는 소재로 될 수도 있다. 또한, 추가부재가 고분자화합물로 구비된 경우, 추가부재의 외주부를 제1,2부재의 사이에 위치시킨 후, 이들을 모두 초음파융착방법에 의해 부착시키는 것도 가능하다.Since the additional member 22a is located in the space formed between the first member 10a and the second member 20a, the additional member 22a may be made of a material that cannot be applied to the ultrasonic welding method. In addition, when the additional member is made of a polymer compound, it is also possible to position the outer peripheral portion of the additional member between the first and second members, and then attach them all by an ultrasonic fusion method.
한편, 본 실시예의 경우, 추가부재(22a)는, 하나가 구비된 것으로 예를 들었으나, 실시예에 따라서는 2개 이상이 구비될 수도 있다.On the other hand, in the present embodiment, the addition member 22a, for example, but is provided with one, two or more may be provided depending on the embodiment.
본 발명에 마이크로 스피커용 진동판에 의하면, 제1부재와 제2부재 사이의 접합이 초음파 융착방법에 의해 이루어져 있기 때문에, 접합부분의 두께가 거의 일정하다는 장점이 있다. 이로 인해 제품의 음향특성이 균일하고 불량률이 적게 된다.According to the diaphragm for a microspeaker of the present invention, since the bonding between the first member and the second member is made by an ultrasonic fusion method, there is an advantage that the thickness of the bonding portion is almost constant. As a result, the acoustic characteristics of the product are uniform and the defect rate is low.
또한, 제1부재와 제2부재 간의 접합이 원하는 위치에 정확하게 이루어지는 것이 가능하다는 효과가 있다.In addition, there is an effect that the bonding between the first member and the second member can be made precisely at a desired position.
또한, 제1부재와 제2부재 사이에 기체층을 형성하는 것이 가능하여 원하는 진동판의 특성을 얻을 수 있다는 효과가 있다. 그리고, 기체층에 하나 이상의 추가부재를 삽입하는 것도 가능하여, 진동판의 두께를 조절하거나, 음향특성을 조절하는 것이 가능하다는 효과를 얻을 수 있다.In addition, it is possible to form a gas layer between the first member and the second member, there is an effect that can obtain the characteristics of the desired diaphragm. In addition, it is also possible to insert one or more additional members into the gas layer, thereby achieving the effect of controlling the thickness of the diaphragm or adjusting the acoustic characteristics.
한편, 본 발명의 다른 측면으로서, 상술한 마이크로 스피커용 진동판을 제조하기에 적합한 제조방법에 관하여 개시한다.On the other hand, as another aspect of the present invention, a manufacturing method suitable for producing the above-mentioned diaphragm for a micro speaker is disclosed.
본 발명에 따른 일 실시예의 마이크로 스피커용 진동판의 제조방법은, 고분자화합물로 이루어진 얇은 막 형태의 부재가 복수 개 결합되어 이루어진 진동판을 제조하는 방법이며, 금형준비단계(S1), 제1부재 성형단계(S2), 제2부재 배치단계(S3) 및 초음파융착단계(S4)를 포함하여 이루어진다.The method of manufacturing a diaphragm for a micro speaker according to an embodiment of the present invention is a method of manufacturing a diaphragm formed by combining a plurality of thin film-like members made of a polymer compound, and preparing a mold (S1) and forming a first member. (S2), the second member arrangement step (S3) and ultrasonic welding step (S4) is made.
상기 금형준비단계(S1)는, 제1부재(10)를 원하는 형상으로 형성하기 위해, 제1부재(10)의 형상에 대응하는 형상을 가진 금형(40)을 준비하는 단계이다.The mold preparation step S1 is a step of preparing a mold 40 having a shape corresponding to the shape of the first member 10 in order to form the first member 10 in a desired shape.
상기 제1부재 성형단계(S2)는, 복수의 부재들 중에 가장 아래에 위치하는 제1부재(10)를 성형 금형(40)에 올려놓고 원하는 형상으로 성형하는 단계이다. 즉, 고분자화합물 소재의 필름을 금형(40)에 올려놓고 위에서 아래로 힘을 가할 수 있는 다른 금형(미도시)을 이용하여, 제1부재(10)를 성형하는 것이다.The first member forming step (S2) is a step of placing the first member 10, which is located at the bottom of the plurality of members, on the molding die 40 and molding to a desired shape. That is, the first member 10 is molded by using another mold (not shown) that puts a film of a polymer compound material on the mold 40 and exerts a force from top to bottom.
다음 단계로, 제2부재 배치단계(S3)는, 성형된 제1부재(10)의 상부에, 제2부재를 위치시키는 단계이다. 제2부재(20)를 제1부재(10)의 원하는 위치에 위치시킨 후, 다음 단계인 초음파융착단계(S4)가 수행된다.In the next step, the second member arranging step S3 is a step of placing the second member on the molded first member 10. After positioning the second member 20 at a desired position of the first member 10, the ultrasonic welding step (S4) of the next step is performed.
한편, 본 실시예의 경우, 제1부재(10)는 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 외측부분으로 나뉘고, 제2부재(20)는 제1부재(10)의 내측부분에 대응하는 크기를 가지고, 그 제1부재의 위에 위치하게 된다.On the other hand, in the present embodiment, the first member 10 is divided into an inner portion which is a central portion and an outer portion located outside of the inner portion, and the second member 20 corresponds to the inner portion of the first member 10. It is sized to be positioned on the first member.
초음파융착단계(S4)는, 제1부재(10)와 제2부재(20)의 상호 부착되어야 할 부분을 초음파융착방법에 의해 상호 부착시키는 단계이다.The ultrasonic welding step S4 is a step of attaching the portions to be attached to the first member 10 and the second member 20 to each other by an ultrasonic welding method.
도 5를 참조하면, 금형(40)의 위에 제1부재(10)가 놓여지고, 그 위로 제2부재가 놓여진 후, 초음파융착을 위한 공구혼(42)이 상호 접착될 부위(30)에 초음파 융착을 실시하는 것이 예시적으로 도시되어 있다. 초음파융착방법에 관한 일반적인 설명은 상술한 바와 같다.Referring to FIG. 5, after the first member 10 is placed on the mold 40 and the second member is placed on the mold 40, the tool horn 42 for ultrasonic welding is ultrasonically applied to a portion 30 to be bonded to each other. Performing fusion is illustratively shown. General description of the ultrasonic welding method is as described above.
본 실시예의 제조방법은 위에서 상술한 첫 번째 실시예의 마이크로 스피커용 진동판(1)을 제조하기 위한 것이다. 따라서, 초음파융착단계(S4)는, 제1부재(10)에 제2부재(20)의 외주부 전체를 접합시키게 된다.The manufacturing method of this embodiment is for manufacturing the diaphragm 1 for the micro speaker of the first embodiment described above. Therefore, in the ultrasonic welding step S4, the entire outer peripheral portion of the second member 20 is bonded to the first member 10.
다만, 본 발명이 이에 한정되는 것은 아니다. 즉, 실시예에 따라서는, 제2부재(20)의 외주부 전체가 아닌 일부분만을 접합하는 것도 가능하다. 외주부를 따라 원주방향으로 단속적으로 접합이 이루어지도록 하는 것도 가능하고, 또한 외주부를 따라 이격된 접합부분을 형성하되, 각 접합부분의 접합방향을 방사방향으로 할 수도 있다, 후자의 경우, 마치 우산의 우산살과 같은 형태에 있어서 우산살의 전체길이가 아닌 외각에 근접한 일부 길이부분에만 접합이 이루어지도록 되는 것이다. 한편, 실시예에 따라서는 진동판의 형상은 원형이 아닌 정방형, 사각형, 계란형(oval), 트랙(track)형 등 다양한 형상으로 가능하다.However, the present invention is not limited thereto. That is, depending on the embodiment, it is also possible to join only a part of the second member 20 instead of the entire outer peripheral part. It is also possible to intermittently join in the circumferential direction along the outer circumference, and also form a joining portion spaced apart along the outer circumference, and the joining direction of each joining portion may be in the radial direction. In the form of umbrellas, the joints are made only to a part of the length close to the outer shell, not the entire length of the umbrellas. On the other hand, according to the embodiment, the shape of the diaphragm may be in various shapes such as square, square, oval, track, and the like, rather than circular.
그리고, 본 실시예의 경우, 초음파융착단계(S4)는, 제1부재(10)와 제2부재(20)의 사이에 기체층(40, 도 3 참조)이 형성되도록 접합시킨다. 즉, 제2부재(20)는 접합부(30)에서만 제1부재(10)와 접촉되고 이를 제외한 나머지 부분에서는 제1부재(10)와 이격되어서 그 사이에 기체층(40)이 형성되게 된다.And, in the present embodiment, the ultrasonic welding step (S4) is bonded to form a gas layer 40 (see Fig. 3) between the first member 10 and the second member 20. That is, the second member 20 is in contact with the first member 10 only in the junction portion 30, and the remaining portion except for this is spaced apart from the first member 10 to form a gas layer 40 therebetween.
한편, 본 실시예의 경우, 제1부재(10)는 성형금형(40)에 진공흡착방법에 의해 고정되도록 되어 있다.On the other hand, in the present embodiment, the first member 10 is fixed to the molding die 40 by a vacuum suction method.
즉, 제1부재(10)를 원하는 형상으로 형성한 후, 성형된 제1부재(10)를 금형(40)에 위에 위치시키게 되면, 진공 흡착방법에 의해 제1부재(10)는 금형에 밀착결합된 상태가 유지되게 된다.That is, when the first member 10 is formed in a desired shape and then the molded first member 10 is placed on the mold 40, the first member 10 adheres closely to the mold by a vacuum adsorption method. The combined state will be maintained.
이러한 상태로 제1부재(10)가 금형 상의 소정의 위치에 유지되게 되면, 제2부재(20)를 제1부재(10)의 상의 원하는 위치에 정확하게 배치하는 것이 가능하다. 또한, 이후 초음파융착단계의 수행중에도 제1부재(10)의 위치가 변하지 않게 되어 원하는 지점에 정확하게 초음파융착이 이루어질 수 있게 된다.When the first member 10 is maintained at a predetermined position on the mold in this state, it is possible to accurately position the second member 20 at the desired position on the first member 10. In addition, since the position of the first member 10 does not change even after the ultrasonic fusion step is performed, ultrasonic fusion can be accurately performed at a desired point.
또한, 제1부재(10)가 성형된 후, 연달아 진공흡착된 상태에서 제2부재(20)가 올려지고, 초음파융착이 이루어지게 되므로, 작업성이 향상될 수 있다.In addition, after the first member 10 is molded, the second member 20 is lifted up in a vacuum suction state in succession, and ultrasonic welding is performed, thereby improving workability.
한편, 다른 실시예의 마이크로 스피커용 진동판의 제조방법의 경우, 제2부재 배치단계(S3)에는, 제1부재(10a)와 제2부재(20a)의 사이에 적어도 하나의 추가부재(22a)를 위치시키는 것이 포함된다.On the other hand, in the method of manufacturing a diaphragm for a micro speaker of another embodiment, in the second member arrangement step S3, at least one additional member 22a is disposed between the first member 10a and the second member 20a. Positioning is included.
도 6을 참조하면, 제2부재(20a)를 배치함에 있어서, 제1부재(10a)와 제2부(20a)의 사이에 추가부재(22a)를 위치시킨 후, 다음 단계인 초음파융착단계(S4)가 실시된다. 추가부재(22a)에 관한 설명은 진동판(1a)에 관하여 상술한 것이 그대로 적용된다.Referring to FIG. 6, in arranging the second member 20a, after the additional member 22a is positioned between the first member 10a and the second portion 20a, the ultrasonic welding step (the next step) is performed. S4) is performed. The description regarding the additional member 22a is applied as it is with respect to the diaphragm 1a.
본 발명의 마이크로 스피커용 진동판 제조방법에 의하면, 초음파융착방법에 의하여 진동판을 이루는 제1부재와 제2부재를 접합하기 때문에 접합부위의 두께 편차가 최소화될 수 있다는 장점이 있다.According to the method of manufacturing a diaphragm for a micro speaker of the present invention, since the first member and the second member constituting the diaphragm are joined by the ultrasonic welding method, there is an advantage that the thickness variation of the joining portion can be minimized.
또한, 초음파융착방법에 의하기 때문에, 종래 접착제로 필름부재를 결합하는 경우 제1, 2부재 및 추가부재와 접착제 간의 화학반응이 일어날 수도 있는 단점이 있으나, 본 발명의 경우 이러한 단점이 없게 된다.In addition, because of the ultrasonic fusion method, when combining the film member with the conventional adhesive, there is a disadvantage that the chemical reaction between the first and second members and the additional member and the adhesive may occur, but in the case of the present invention there is no such disadvantage.
그리고, 진공흡착에 의해 제1부재를 성형금형에 고정시키는 구성이 구비하는 경우, 제1부재의 위치를 정확히 고정시키는 것이 가능하여, 제2부재와의 접합위치도 정확하게 제어되고, 작업능률도 향상된다는 효과가 있다.When the first member is fixed to the molding die by vacuum suction, the position of the first member can be fixed accurately, and the joining position with the second member can be precisely controlled and the work efficiency is improved. It is effective.

Claims (9)

  1. 마이크로 스피커에 사용되는 진동판으로서,As a diaphragm used for micro speakers,
    상기 진동판은 고분자화합물로 이루어진 얇은 막 형태의 부재가 복수 개 적층되어 이루어지고,The diaphragm is formed by stacking a plurality of members in the form of a thin film made of a polymer compound,
    상기 복수 개의 부재 간의 부착은 초음파 융착방법에 의해 이루어진 것을 특징으로 하는 마이크로 스피커용 진동판.Attachment between the plurality of members is a diaphragm for a micro speaker, characterized in that made by the ultrasonic welding method.
  2. 제1항에 있어서,The method of claim 1,
    상기 복수개의 부재는 가장 아래에 위치한 제1부재와, 그 상부에 위치한 제2부재를 포함하고,The plurality of members includes a first member positioned at the bottom and a second member positioned at an upper portion thereof.
    상기 제1부재는 그 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 외측부분으로 나뉘고,The first member is divided into an inner portion which is a central portion thereof and an outer portion located outside of the inner portion,
    상기 제2부재는 상기 제1부재의 내측부분에 대응하는 크기를 가지고, 그 내측부분의 위에 위치하고,The second member has a size corresponding to an inner portion of the first member and is located above the inner portion;
    상기 제2부재의 외주부 중 적어도 일부분이 상기 제1부재와 부착되어 있는 것을 특징으로 하는 마이크로 스피커용 진동판.And at least a portion of an outer circumferential portion of the second member is attached to the first member.
  3. 제2항에 있어서,The method of claim 2,
    상기 제2부재의 외주부 전체가 상기 제1부재와 부착되어 있고,The entire outer periphery of the second member is attached to the first member,
    상기 제1부재와 제2부재의 사이에는 기체층이 형성된 것을 특징으로 하는 마이크로 스피커용 진동판.Diaphragm for a micro-speaker, characterized in that the gas layer is formed between the first member and the second member.
  4. 제2항에 있어서,The method of claim 2,
    상기 제1부재와 제2부재의 사이에는 추가부재가 적어도 하나 구비되어 있는 것을 특징으로 하는 마이크로 스피커용 진동판.At least one additional member is provided between the first member and the second member, the diaphragm for a micro speaker.
  5. 마이크로 스피커에 사용되고, 고분자화합물로 이루어진 얇은 막 형태의 부재가 복수 개 결합되어 이루어진 진동판을 제조하는 방법으로서,A method for manufacturing a diaphragm which is used in a micro speaker and is formed by combining a plurality of thin film-like members made of a polymer compound,
    금형을 준비하는 금형준비단계;A mold preparation step of preparing a mold;
    상기 복수의 부재들 중에 가장 아래에 위치하는 제1부재를 상기 성형금형에 올려놓고 원하는 형상으로 성형하는 제1부재 성형단계;A first member molding step of placing the first member, which is located at the bottom of the plurality of members, on the molding mold and shaping it into a desired shape;
    상기 성형된 제1부재의 상부에, 제2부재를 위치시키는 제2부재 배치단계; 및A second member disposing step of placing a second member on the molded first member; And
    상기 제1부재와 제2부재의 상호 부착되어야 할 부분을 초음파융착방법에 의해 상호 부착시키는 초음파융착단계를 포함하여 이루어진 것을 특징으로 하는 마이크로 스피커용 진동판의 제조방법.Ultrasonic welding step of attaching to the mutually attached portions of the first member and the second member to be mutually bonded by an ultrasonic welding method comprising the diaphragm for a micro speaker.
  6. 제5항에 있어서,The method of claim 5,
    상기 제1부재는 상기 성형금형에 진공흡착방법에 의해 고정되는 것을 특징으로 하는 마이크로 스피커용 진동판의 제조방법.The first member is a manufacturing method of the micro-speaker diaphragm, characterized in that fixed to the molding die by a vacuum suction method.
  7. 제5항에 있어서,The method of claim 5,
    상기 제2부재 배치단계는, 상기 제1부재와 제2부재의 사이에 적어도 하나의 추가부재를 위치시키는 것을 포함하는 것을 특징으로 하는 마이크로 스피커용 진동판의 제조방법.The second member disposing step, the method of manufacturing a diaphragm for a micro speaker, characterized in that to include at least one additional member between the first member and the second member.
  8. 제5항에 있어서,The method of claim 5,
    상기 성형된 제1부재는 가운데 부분인 내측부분과 이러한 내측부분의 바깥쪽에 위치한 외측부분으로 나뉘고,The molded first member is divided into an inner portion which is a center portion and an outer portion located outside of the inner portion,
    상기 제2부재는 상기 제1부재의 내측부분에 대응하는 크기를 가지고, 그 제1부재의 위에 위치하고,The second member has a size corresponding to an inner portion of the first member, and is located above the first member,
    상기 초음파융착단계는, 상기 제1부재에 상기 제2부재의 외주부 전체를 접합시키는 것을 특징으로 하는 마이크로 스피커용 진동판의 제조방법.The ultrasonic welding step, the manufacturing method of the micro-speaker diaphragm, characterized in that for bonding the entire outer peripheral portion of the second member to the first member.
  9. 제8항에 있어서,The method of claim 8,
    상기 초음파융착단계는, 상기 제1부재에 상기 제2부재의 외주부 전체를 접합시키되, 상기 제1부재와 제2부재의 사이에 기체층이 형성되도록 접합시키는 것을 특징으로 하는 마이크로 스피커용 진동판의 제조방법.In the ultrasonic welding step, the entire outer circumference of the second member is bonded to the first member, and the micro-speaker diaphragm is manufactured such that a gas layer is formed between the first member and the second member. Way.
PCT/KR2009/004874 2009-03-10 2009-08-31 Diaphragm for microspeaker and manufacturing method thereof WO2010104250A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0020364 2009-03-10
KR1020090020364A KR20100101921A (en) 2009-03-10 2009-03-10 Diaphragm for micro-speaker and method of manufacturing method of the diaphragm

Publications (1)

Publication Number Publication Date
WO2010104250A1 true WO2010104250A1 (en) 2010-09-16

Family

ID=42718970

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004874 WO2010104250A1 (en) 2009-03-10 2009-08-31 Diaphragm for microspeaker and manufacturing method thereof

Country Status (4)

Country Link
KR (1) KR20100101921A (en)
CN (2) CN201623843U (en)
TW (1) TWM385182U (en)
WO (1) WO2010104250A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150075900A1 (en) * 2011-11-03 2015-03-19 Shunming Yuen Loudspeaker diaphragm and loudspeaker using same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101538635B1 (en) * 2014-04-04 2015-07-23 주식회사 이엠텍 Waterproof microspeaker

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916495A (en) * 1982-07-19 1984-01-27 Sanyo Electric Co Ltd Joining method of speaker diaphragm and edge
KR880001169B1 (en) * 1981-09-30 1988-07-02 넬슨 스톤 Digital tester local memory data storage system
KR20050079266A (en) * 2004-02-05 2005-08-10 에스텍 주식회사 Adhesion method of frame and edge for speaker
KR20050100852A (en) * 2004-04-16 2005-10-20 학교법인 성균관대학 A vibration plate of micro-speaker
KR20060093412A (en) * 2005-02-21 2006-08-25 주식회사 비에스이 Double diaphragm micro speaker
KR20060107310A (en) * 2005-04-05 2006-10-13 소니 가부시끼 가이샤 Acoustic vibratory plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880001169B1 (en) * 1981-09-30 1988-07-02 넬슨 스톤 Digital tester local memory data storage system
JPS5916495A (en) * 1982-07-19 1984-01-27 Sanyo Electric Co Ltd Joining method of speaker diaphragm and edge
KR20050079266A (en) * 2004-02-05 2005-08-10 에스텍 주식회사 Adhesion method of frame and edge for speaker
KR20050100852A (en) * 2004-04-16 2005-10-20 학교법인 성균관대학 A vibration plate of micro-speaker
KR20060093412A (en) * 2005-02-21 2006-08-25 주식회사 비에스이 Double diaphragm micro speaker
KR20060107310A (en) * 2005-04-05 2006-10-13 소니 가부시끼 가이샤 Acoustic vibratory plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150075900A1 (en) * 2011-11-03 2015-03-19 Shunming Yuen Loudspeaker diaphragm and loudspeaker using same
US9324315B2 (en) * 2011-11-03 2016-04-26 Innovation Sound Technology Co., Ltd. Loudspeaker diaphragm and loudspeaker using same

Also Published As

Publication number Publication date
KR20100101921A (en) 2010-09-20
CN101835073A (en) 2010-09-15
TWM385182U (en) 2010-07-21
CN201623843U (en) 2010-11-03

Similar Documents

Publication Publication Date Title
CN101600134B (en) Dome-shaped diaphragm and loudspeaker using the same
CN102065357B (en) Electromagnetic loudspeaker
WO2012070729A1 (en) Micro-speaker
CN104125528A (en) Bonding structure of diaphragm for microspeaker
CN209526876U (en) A kind of loudspeaker
US11997467B2 (en) Multi-input-driving small loudspeaker and mid-treble loudspeaker
CN102307324A (en) Insert molded surround with mechanical support
WO2010044526A1 (en) Integrated vibration plate for micro-speaker, manufacturing method thereof, and micro-speaker including the vibration plate
WO2011021745A1 (en) Multifunctional micro speaker
WO2010104250A1 (en) Diaphragm for microspeaker and manufacturing method thereof
WO2004103017A1 (en) Speaker
WO2011055929A2 (en) Microspeaker
CN213485164U (en) Sound production device
CN212851007U (en) Sound production device
JPWO2003010997A1 (en) Fully driven flat speaker
CN209390326U (en) Loudspeaker mould group
WO2011083961A2 (en) Multifunctional microspeaker
KR20130126084A (en) A diaphragm for speaker made of one polymer film with different stiffness
WO2021093114A1 (en) Vibrating diaphragm and sound production device
CN106851520A (en) Silica gel vibrating diaphragm forming method and the silica gel vibrating diaphragm prepared using the method
JP2009164866A (en) Method of manufacturing diaphragm for micro speaker, diaphragm for micro speaker manufactured with the manufacturing method, micro speaker using the diaphragm and cellular phone using the micro-speaker
CN220234952U (en) Concave paper cover of loudspeaker
CN218473373U (en) Loudspeaker
CN213342683U (en) Sound production device
KR20100004441A (en) Manufacturing method of micro speaker diaphragm

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09841563

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09841563

Country of ref document: EP

Kind code of ref document: A1