WO2010094178A1 - Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme - Google Patents

Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme Download PDF

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Publication number
WO2010094178A1
WO2010094178A1 PCT/CN2009/070500 CN2009070500W WO2010094178A1 WO 2010094178 A1 WO2010094178 A1 WO 2010094178A1 CN 2009070500 W CN2009070500 W CN 2009070500W WO 2010094178 A1 WO2010094178 A1 WO 2010094178A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
dissipation plates
dissipation
lighting assembly
light emitting
Prior art date
Application number
PCT/CN2009/070500
Other languages
English (en)
Inventor
Ming Lu
Kai Chiu Wu
Original Assignee
Hong Kong Applied Science and Technology Research Institue Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Kong Applied Science and Technology Research Institue Co., Ltd. filed Critical Hong Kong Applied Science and Technology Research Institue Co., Ltd.
Priority to CN2009800000047A priority Critical patent/CN101855494B/zh
Priority to PCT/CN2009/070500 priority patent/WO2010094178A1/fr
Publication of WO2010094178A1 publication Critical patent/WO2010094178A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Definitions

  • the present invention relates to a lighting assembly, and more particularly, to a lighting assembly for uniform heat dissipation in lighting devices.
  • LED Light emitting diode
  • LED in lighting applications is attractive for a number of reasons, including the ability to provide higher levels of illumination, a longer life cycle, minimum maintenance requirements, energy efficient, and flexibility in terms of coloring and beam control.
  • LED generates a generally high level of heat during operation. It is also known that changes in the temperature of the p-n junction of an LED ("the junction temperature”) can affect the performance of the LED, especially in color applications. This can be especially problematic when an LED lighting device is used in different orientations, since some orientations result in operation of the LED at higher temperatures. Efforts to control the temperature of LED have been made. However, previous efforts have failed to address certain applications or configurations. Accordingly, there is a need for a lighting assembly and a heat exchange apparatus that addresses these and other shortcomings of LED lighting.
  • a heat exchange apparatus includes one or more dissipation plates, each of the one or more dissipation plates having a plurality of upstanding fins disposed from the dissipation plate at a predetermined angle, and wherein each of the one or more dissipation plates defines a plurality of slots configured to permit airflow longitudinally through the housing; and a housing configured to receive the one or more dissipation plates, the housing defining at least one opening to permit an inlet of air into the housing.
  • a lighting assembly includes a housing having at least one opening to permit the inlet of air into the housing; one or more dissipation plates positioned within the housing, each of the plurality of dissipation plates having a plurality of fins disposed from each of the plurality of dissipation plates at a predetermined angle, one or more dissipation plates axially aligned within the housing; a substrate positioned within the housing; and one or more light emitting device bonded on the substrate, wherein the substrate provides an electrical connection for receiving power and transmitting power to the one or more light emitting devices.
  • a lighting assembly is disclosed.
  • the lighting assembly includes a housing having at least one opening to permit the inlet of air into the housing; light emitting means for generating light, the light emitting means positioned within the housing; dissipation means for dissipating heat caused by the light emitting means during operation of the lighting assembly, the dissipation means positioned within the housing, the dissipation means includes a first plurality of surfaces lying in a lateral plane and a second plurality of surface lying in one or more longitudinal planes, and where the dissipation means defines openings for the passage of air within the housing in both the lateral and the longitudinal directions; and connection means for providing current to the light emitting means.
  • FIG. 1 is a front perspective view of a lighting assembly 100, in accordance with an embodiment of the present invention.
  • FIG. 2 is a rear perspective view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • FIG. 3 is a side view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • FIG. 4 is a side cross sectional view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • FIG. 5 is an exploded view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • FIG. 6 is a perspective view of the dissipation plates, in accordance with an embodiment of the present invention.
  • FIG. 7 is a side cross sectional view of a lighting assembly, in accordance with a second embodiment of the present invention.
  • FIG. 8 is an exploded view of the lighting assembly shown in FIG. 7, in accordance with an embodiment of the present invention.
  • FIG. 9 is a side cross sectional view of a lighting assembly, in accordance with a third embodiment of the present invention.
  • FIG. 10 is an exploded view of the lighting assembly shown in FIG. 9, in accordance with an embodiment of the present invention.
  • embodiments of the present invention are directed to a lighting assembly that provides for temperature management and uniform heat dissipation in a plurality of different orientations.
  • the flow of air in and through the lighting assembly and dissipation of heat from the lighting assembly into the air is permitted at generally the same rate, regardless of the orientation of the lighting assembly. Therefore, a generally consistent convective heat transfer rate can be achieved while the lighting assembly is positioned at different orientations.
  • embodiments of the present invention ensure that the average temperature of the lighting assembly, and therefore the LED junction temperature, is generally maintained at a consistent level, or within a predetermined range, so that the heat dissipation of the lighting assembly is generally uniform regardless of the positioning of the lighting assembly, and the overall performance of the LED may be generally more consistent.
  • FIG. 1 is a front perspective view of a lighting assembly, in accordance with an embodiment of the present invention.
  • the lighting assembly 100 includes a housing 102, a plurality of dissipation plates 104, optics 106, a fitting 108, and an electrical connector 109.
  • the lighting assembly 100 also includes a light emitting diode (“LED") 110 (shown in FIG. 5) and an LED substrate 112 (shown in FIG. 5).
  • the housing 102 may include one or more openings 105 defined in the housing 102 to permit the inlet of air into the lighting assembly 100.
  • Each of the dissipation plates 104 includes a plurality of fins 120.
  • FIG. 2 is a rear perspective view of the lighting assembly shown in FIG. 1
  • FIG. 3 is a side view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • the housing 102, the plurality of dissipation plates 104, the one or more openings 105, the fitting 108, and the electrical connector 109 may be seen.
  • the plurality of dissipation plates 104 may be seen through the one or more openings 105 in the housing 102.
  • the one or more openings 105 may be any suitable size depending on the size and configuration of the housing 102. However, the one or more openings 105 should be of a sufficient size to act as an inlet for air to pass into the housing.
  • one suitable opening may have a diameter of between approximately two (2) and three (3) millimeters. However, smaller or larger openings may be used. Also, while one opening may be sufficient, a plurality of openings is used to increase the airflow into the housing 102. There is also a relationship between the number and size of the openings. For example, a greater number of smaller openings may be used to achieve performance similar to that of a fewer number of larger openings. Accordingly, embodiments of the present invention are not limited to the opening configuration illustrated in the figures.
  • the one or more openings 105 may also be of any suitable shape, such as round or elongated, as illustrated in the example embodiments.
  • the lamp housing may be made from any suitable materials and may be made using any suitable production methods such as, for example, metal drawing, metal punching, die-casting, or sintering.
  • the lighting assembly may generally be separated into a lighting module, a heat dissipation module, and an electrical module.
  • the lighting module includes the optics 106, the LED 110, and the substrate
  • the heat dissipation module includes at least one of the dissipation plates 104 and the housing 102
  • the electrical module includes the electrical connector 109 and any connection for powering the lighting apparatus.
  • Each of the modules may include either greater or fewer components. However, a discrete identification of separate modules is provided for illustration purposes.
  • FIG. 4 is a side cross sectional view of the lighting assembly shown in FIG. 1
  • FIG. 5 is an exploded view of the lighting assembly shown in FIG. 1 , in accordance with an embodiment of the present invention.
  • the housing 102 a plurality of dissipation plates 104, the optics 106, the fitting 108, the electrical connector 109, the LED 110, and the LED substrate 112 one shown.
  • the plurality of fins 120 on each of the plurality of dissipation plates 104 are also shown.
  • the order and position of the different components of the lighting assembly 100 can be seen in FIGS. 4 and 5.
  • the LED 110 and the substrate 112 are positioned within the housing proximate to the fitting end of the housing 102.
  • the plurality of dissipation plates 104 are positioned within the housing 102 generally axially aligned so that the optics 106 may be positioned at the longitudinal center of the housing 102 through central openings of each of the dissipation plates, if the optics is included in the embodiment.
  • the plurality of dissipation plates 104 are generally parallel to each other and are spaced apart from each other a predetermined distance. The spacing of the dissipation plates 104 may be achieved by stepped supports 502 (shown in FIG.
  • stepped supports 502 may be included. The spacing permits and facilitates airflow within the housing 102 and between the dissipation plates 104.
  • Any suitable fitting 108 and electrical connector 109 may be used to provide power to the substrate 112 and the LED 110.
  • One example fitting 108 and electrical connector 109 are included and described for the purpose of illustration. However, any suitable configuration of the fitting 108 and the electrical connector 109 may be used depending on the device or lighting system that will receive the lighting assembly
  • Variation of temperature in the lighting assembly 100 and therefore the junction temperature of the light emitting diode 110 or LED chip package being used in the lighting assembly, is directly related to airflow and the surface area of heat dissipation components of the lighting assembly 100.
  • A surface area of the dissipation plate, or other heat dissipation components
  • T 1 the junction temperature
  • T amb the ambient temperature
  • temperature variation has direct relationship with the airflow constant h and the surface area for heat dissipation A.
  • the airflow constant can change substantially depending on the orientation of the lighting assembly. For example, a downward oriented lighting assembly generally results in substantially reduced airflow.
  • Embodiments of the present invention reduce the variation of the airflow constant as the lighting assembly is positioned in different orientations, thereby reducing variation of the temperature of the lighting assembly 100 positioned in different orientations.
  • one or more features of the present invention operate together to reduce the air flow resistance of the lighting assembly 100 and reduce the variation in the airflow constant. Accordingly, the air flow resistance stays generally constant during operation of the lighting apparatus in multiple orientations.
  • the junction temperature of an LED may be reduced by either increasing the surface area of the object in contact with the air or increasing the airflow constant.
  • airflow within the housing 102 is increased by the positioning and configuration of the dissipation plates.
  • the spacing of the dissipation plates permits increased airflow laterally between the dissipation plates, and a plurality slots permit increased airflow longitudinally thought the dissipation plates and within the housing 102.
  • FIG. 6 a perspective view of the dissipation plates is shown, in accordance with an embodiment of the present invention.
  • a first dissipation plate 602, a second dissipation plate 604, and a third dissipation plate 606 are shown for the purposes of illustration.
  • Each of the dissipation plates 104 are generally ring shaped, defining an opening in the axial center of each of the dissipation plates. The openings are configured to permit airflow longitudinally through the dissipation plates 104 and through the housing 102 when included in the lighting assembly 100. In some embodiments, the openings permit light from the LED 110 to pass through the dissipation plates 104.
  • Each of the dissipation plates 104 includes a plurality of upstanding fins 120 formed contiguously with the lateral surfaces of the dissipation plate 104.
  • the dissipation plates 104 may be made from any suitable material that dissipates heat, such as metal or ceramic materials.
  • the dissipation plates 104 may be made from aluminum or copper.
  • the dissipation plates may be made according to any suitable method such as, for example, mechanical punching, die-casting, or sintering. According to one embodiment of the present invention, each of the dissipation plates 104 is punched from a generally flat disk of metal material.
  • Dissipation plates 104 made according to this method result in a dissipation plate 104 that has approximately the same surface area as the flat disk, therefore requiring no additional material than a flat dissipation plate.
  • the configuration of the dissipation plate permits increased airflow through the slots 610 of the dissipation plate and also permits heat transfer in the lateral direction, generally parallel to the dissipation plate, and in the longitudinal direction, generally parallel to the axis of the dissipation plate, along the surface of the fins 120. While illustrated with reference to the first dissipation plate 602, the other illustrated dissipation plates 104 have a similar configuration.
  • Each of the plurality of dissipation plates 104 may have a different size and configuration in order to accommodate the housing of a particular lighting assembly.
  • the first dissipation plate 602 has a greater diameter than the second dissipation plate 604, and the second dissipation plate 604 has a greater diameter than the third dissipation plate 606.
  • four dissipation plates are illustrated in FIGS. 1 to 5, two of the dissipation plates included in the example embodiment illustrated in FIGS. 1 to 5 are similar to the second dissipation plate 604.
  • the dissipation plates are provided for the purpose of illustration and embodiments of the present invention are not limited to these specific shapes and configurations.
  • the upstanding fins 120 are a certain size, fins of a greater or smaller size may be used depending on the size of the dissipation plates 104 and the size of the housing 102. Also, while the fins 120 are shown being configured at approximately a ninety degree angle, relative to the plane of the dissipation plate 104, other angles may be used. For example, according to one embodiment, the angle of incidence of the fins 120 is approximately 90 degrees. According to another embodiment, the angle of incidence of the fins 120 is within a range of between 30 degrees and 150 degrees. According to another embodiment, the angle of incidence of the fins 120 is within a range of between 60 degrees and 120 degrees.
  • the angle of incidence of the fins 120 is within a range of between 85 degrees and 95 degrees. Also, any number of fins, and of any suitable size, may be used. The angle of incidence of fins may also vary on any one of the dissipation plates 104. The angle of incidence of the fins 120 may also vary so that not all have the same angle of incidence.
  • the lighting apparatus 100 includes at least one dissipation plate.
  • a greater number of dissipation plates may be used as the greater number of dissipation plates provides a greater dissipation surface area within the housing 100 that, when combining the surface area of the separate dissipation plates, may results in greater heat transfer.
  • multiple dissipation plates 104 are positioned a predetermined distance apart from each other in order to permit air flow between and through the dissipation plates 104.
  • the predetermined distance may be any suitable distance that permits and/or increases airflow through and within the housing.
  • the dissipation plates 104 are at least approximately three (3) millimeters from each other. According to another embodiment, the dissipation plates 104 are at least approximately one (1 ) millimeter from each other.
  • the predetermined distance may be also be greater if the size of the housing 102 and/or the size of the dissipation plate 104 is larger. If the dissipation plates 104 are too close together, the air flow between or through the dissipation plates may be reduced.
  • FIG. 7 is a side cross sectional view of a lighting assembly, in accordance with a second embodiment of the present invention.
  • the lighting assembly 700 includes a housing 702, a plurality of dissipation plates 704, a lens 706, a fitting 708, an electrical connector 709, a LED 710, and an LED substrate 712.
  • the housing 702 may include one or more openings 705 defined in the housing 702 to permit the inlet of air into the lighting assembly 700.
  • Each of the dissipation plates 704 (partially shown) includes a plurality of fins 720. Referring now to FIG. 8, an exploded view of the lighting assembly shown in FIG. 7, the order and position of the different components of the lighting assembly 700 can be seen.
  • FIG. 9 is a side cross sectional view of a lighting assembly, in accordance with a third embodiment of the present invention.
  • the lighting assembly 900 includes a housing 902, a plurality of dissipation plates 904, a lens 906, a fitting 908, an electrical connector 909, a LED 910, and an LED substrate 912.
  • the housing 902 may include one or more openings 905 defined in the housing 902 to permit the inlet of air into the lighting assembly 900.
  • Each of the dissipation plates 904 (partially shown) includes a plurality of fins 920.
  • FIG. 10 an exploded view of the lighting assembly shown in FIG. 9, the order and position of the different components of the lighting assembly 900 can be seen.
  • the overall configuration and operation of the third embodiment illustrated in FIGS. 9 and 10 is similar to the embodiment illustrated and described with reference to FIGS. 1 to 6.
  • the positioning of the components is similar to that shown and described with reference to FIGS.
  • the substrate 912 is a metal core printed circuit board (“PCB”) and the substrate is configured to one of the dissipation plates.
  • PCB metal core printed circuit board
  • housings and dissipation plates may also incorporate conventional lighting assembly components as required.
  • embodiments of the present invention may also incorporate conventional lighting assembly components as required.
  • optics and lenses are illustrated, other optical modules and components may be used as required by the specific implementation.
  • any type of LED or other light emitting devices may be used.
  • a light emitting device may be bonded directly onto the substrate as chip-on-board package.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention porte sur un appareil d'échange de chaleur, qui comprend une ou plusieurs plaques de dissipation (104), chacune des plaques de dissipation (104) ayant une pluralité d'ailettes dressées (120) disposées à partir des plaques de dissipation (104) à un angle prédéterminé. Chacune des plaques de dissipation (104) définit une fente dans le centre axial, et les fentes sont configurées pour permettre un écoulement d'air longitudinalement à travers un boîtier (102). Le boîtier (102) reçoit les plaques de dissipation (104), et définit au moins une ouverture (105) pour permettre une entrée d'air dans le boîtier (102). La configuration des plaques de dissipation (104) et du boîtier (102) permet à l'air de se déplacer à l'intérieur du boîtier (102) dans une pluralité de directions, permettant à la chaleur d'être dissipée lorsque le boîtier est positionné dans différentes orientations. L'invention porte également sur un appareil d'éclairage avec l'appareil d'échange de chaleur pour une dissipation de chaleur uniforme.
PCT/CN2009/070500 2009-02-23 2009-02-23 Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme WO2010094178A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009800000047A CN101855494B (zh) 2009-02-23 2009-02-23 均匀散热的照明组件
PCT/CN2009/070500 WO2010094178A1 (fr) 2009-02-23 2009-02-23 Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2009/070500 WO2010094178A1 (fr) 2009-02-23 2009-02-23 Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme

Publications (1)

Publication Number Publication Date
WO2010094178A1 true WO2010094178A1 (fr) 2010-08-26

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PCT/CN2009/070500 WO2010094178A1 (fr) 2009-02-23 2009-02-23 Ensemble d'éclairage et appareil d'échange de chaleur pour dissipation de chaleur uniforme

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Country Link
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WO (1) WO2010094178A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8534875B1 (en) * 2012-05-03 2013-09-17 Shiyong Zhang Customizable heat sink formed of sheet material for a lamp
DE202019100275U1 (de) * 2019-01-18 2020-04-23 Zumtobel Lighting Gmbh Leuchte mit umfangsseitig geschlossenem Kühlkörper

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080175019A1 (en) * 2006-11-24 2008-07-24 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Illumination unit comprising an LED light source
US20080192436A1 (en) * 2007-02-09 2008-08-14 Cooler Master Co., Ltd. Light emitting device
CN201116709Y (zh) * 2007-08-22 2008-09-17 鹤山丽得电子实业有限公司 一种大功率led灯散热器
CN201155716Y (zh) * 2008-01-02 2008-11-26 张守仁 发光二极管照明器
WO2008148360A1 (fr) * 2007-06-07 2008-12-11 Dejun Fu Lampe led à haute puissance

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080175019A1 (en) * 2006-11-24 2008-07-24 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Illumination unit comprising an LED light source
US20080192436A1 (en) * 2007-02-09 2008-08-14 Cooler Master Co., Ltd. Light emitting device
WO2008148360A1 (fr) * 2007-06-07 2008-12-11 Dejun Fu Lampe led à haute puissance
CN201116709Y (zh) * 2007-08-22 2008-09-17 鹤山丽得电子实业有限公司 一种大功率led灯散热器
CN201155716Y (zh) * 2008-01-02 2008-11-26 张守仁 发光二极管照明器

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Publication number Publication date
CN101855494A (zh) 2010-10-06
CN101855494B (zh) 2013-10-23

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