WO2010086578A1

WO2010086578A1 - Method of applying items to a substrate

Info

Publication number: WO2010086578A1
Application number: PCT/GB2009/001516
Authority: WO
Inventors: Mark Jeffrey Robinson
Original assignee: Charterhouse Holdings Plc
Priority date: 2009-01-31
Filing date: 2009-06-15
Publication date: 2010-08-05
Also published as: IT1399184B1; GB2467365B; GB2467365A; ITMI20100129A1; GB0901620D0

Abstract

A method of applying items (32) to a substrate (48) the method including the steps of forming holes in a stencil (22), locating the items (32) in the holes (26), transferring the items (32) to the substrate (48), and fixing the items (32) to the substrate (48).

Description

Method of applying items to a substrate

The present invention relates to a method of applying items to a substrate, particularly but not exclusively decorative items such as rhinestones to a textile.

It is known to decorate substrates such as textiles with items such as rhinestones. The rhinestones can be sewn into place, or can be held in place by adhesive. It is known to provide rhinestones with a layer of hot melt adhesive. However the placement of the rhinestones, which are relatively small, is fiddly and time consuming, and it can be difficult to ensure consistency and accuracy of placement.

According to a first aspect of the present invention, there is provided a method of applying items to a substrate, the method including the steps of forming holes in a stencil, locating the items in the holes, transferring the items to a substrate, and fixing the items to the substrate.

Possibly, only one item is located in each hole.

Possibly, the holes are through holes, and may be formed by cutting, and may be formed by a movable cutter, which may be in the form of a blade. Possibly, the cutter is controlled by a programmable controller, which may be programmable with a set of instructions, which may include movement instructions, which control the movement of the cutter.

Possibly the items are applied to the substrate in a predetermined pattern. Possibly the method includes a step of designing the pattern. Possibly the method includes a step of converting the pattern into the movement instructions. Possibly, the stencil is mounted to a support layer for support during cutting. Possibly, following cutting, the stencil is demounted from the support layer.

Possibly, the stencil is formed of a plastics material, and may be formed of poly vinyl chloride. Possibly the stencil has a thickness of between 0.5 mm and 1.5 mm. Possibly the- thickness is approximately 1.0 mm.

In the locating step, the stencil may be located on a substantially planar surface, and may be located within a container. A plurality of the items may be spread across the stencil, and may be spread by a spreader, which may be in the form of a brush or sponge.

Possibly, in the locating step, the items are located in a predetermined orientation within the holes, and may be arranged to locate themselves substantially automatically during spreading in the predetermined orientation. ' Possibly each item is shaped so that its centre of gravity is closer to one surface than another, opposite surface. Possibly each item includes a substantially planar surface and a substantially convex surface. Possibly, the planar surface is the one surface. Possibly, in the predetermined orientation, the planar surface is located within the hole. Possibly, in the predetermined orientation, the convex surface projects at least partially out of the hole, and may be in use in the locating step the uppermost surface.

Possibly, each hole corresponds in plan shape with a shape of at least one item, and may correspond with a plan shape of the planar surface of at least one item. Possibly, the plan shape of each of the holes may be slightly larger than the shape of the corresponding items, and may be slightly larger than the plan shape of the corresponding items.

The largest dimension of the shape of the items may be between 1 and 6mm, and may be between 2 and 5mm. The corresponding dimension of the plan shape of the holes may be between 0.1 mm and 0.3mm larger than the shape of the items, and may be approximately 0.2mm larger than the shape of the items.

Possibly, in the transferring step, a transfer medium is located over the items in the holes. Possibly, the transfer medium includes transfer adhesive, which may adhere the items to the transfer medium, and which may be arranged so that as the transfer medium is moved away from the stencil, the items are lifted out of the holes. Possibly, the transferring adhesive contacts the convex surface of each of the items.

Possibly, in the transferring step, the transfer medium with the items is located on the substrate.

Possibly, in the fixing step, the items are fixed to the substrate by fixing adhesive. Possibly, the adhesive is applied to the planar surface of each of the items. Possibly, the items include fixing adhesive which is located on the planar surface. Possibly, the fixing adhesive is a hot melt adhesive. Possibly, in the fixing step, heat is applied to melt the hot melt adhesive. Possibly, in the fixing step, the substrate is located in a heating apparatus. Possibly, the heating apparatus includes a pair of plates, and in the fixing step the substrate is located between the plates. Possibly, at least one of the plates is heated. Possibly, pressure is applied to the substrate and the transfer medium through the plates during the fixing step. Possibly, following the fixing step, the transfer medium is separated from the items and the substrate.

The items may all be substantially similar in shape to each other, and may all be substantially identical in shape to each other. The items may be decorative items for decorating textiles. Possibly, the items are rhinestones.

The substrate may be a textile, and may be a garment, and may be a t- shirt. ' An embodiment of the present invention will now be described, by way of example only, and with reference to the accompanying drawings, in which:

Figs 1A to 1 E show in schematic form steps in a method for applying items to a substrate;

Figure 2 is an enlarged perspective view of an item;

Figure 3 is a plan view of a stencil with holes formed;

Figure 4 is a front view of a substrate to which the items have been applied; and

Figure 5 is a process flow block diagram of the method of applying items to substrate.

Referring to the figures, the invention provides a method of applying items 32 to a substrate 48, the method including the steps of forming holes 26 in a stencil 22, locating the items 32 in the holes 26, transferring the items 32 to the substrate 48 and fixing the items 32 to the substrate 48.

Referring to Fig 5, the method includes, in process flow sequence, a pattern design step 60, a pattern conversion step 70, a hole forming step 62, a demounting step 72, a locating step 64, a transferring step 66, and a fixing step 68.

Figs 1A to 1 E show steps in the method of applying the items 32 to the substrate 48.

In the pattern design step 60, a pattern 50 is designed. The pattern 50 could be designed on a computer 10, or alternatively could be imported as an image file into the computer 10, having been created on a remote computer (not shown).

As shown in Fig 1A, cutting apparatus 78 includes a movable cutter 16, which in the example shown is in the form of a blade. The cutting apparatus 78 includes a programmable controller 74, which is programmable with a set of instructions 80. The set of instructions 80 includes a conversion routine 82 and movement instructions 76. The conversion routine 82 could, alternatively, be stored on the computer 10. The computer 10 communicates with the controller 74 by means of a communication link 12, which could be in the form of a cable, wireless or optical link, or of any other suitable form.

In the pattern conversion step 70, the conversion routine 82 converts the pattern 50 into the movement instructions 76 which control the movement of the cutter 16.

In the hole forming step 62, a stencil 22 which is supported on a support layer 24 is placed into the cutting apparatus 78 underneath the cutter 16 and the cutter 16 forms holes 26 in the stencil 22, the cutter 60 moving in accordance with the movement instructions 76. The stencil 22 is then removed from the cutting apparatus 78.

The stencil could be formed of a plastics material, and could be formed of poly vinyl chloride. The stencil could have a thickness of between 0.5mm and 1.5mm and in one example, could have a thickness of approximately 1.0mm.

In the demounting step 72, the stencil 22 is demounted from the support layer 24.

In the locating step 64, the items 32 are located in the holes 26. The stencil 22 is located on a substantially planar surface 84 within a container 28. The container 28 includes side walls 86 which extend upwardly from the planar surface 84 to contain a plurality of the items 32 within the container 28. In the locating step, the items 32 are spread across the stencil 22 by means of a spreader 38, which could be in the form of a brush or sponge.

Figure 2 shows an enlarged view of one of the items 32. The items 32 could all be substantially similar in shape to each other, and could all be substantially identical in shape to each other. As shown in figure 2, the item 32 includes a substantially planar surface 52 and a substantially convex surface 34. The item 32 is shaped so that its centre of gravity is closer to the substantially planar surface 52 than to the substantially convex surface 34. In the example shown in figure 2, the item 32 includes a layer of hot melt fixing adhesive 42 which is located on the planar surface 52.

In the locating step, the items 32 are spread across the stencil 22 by the spreader 38, so that the items 32 locate in a predetermined orientation within the holes 26. In the predetermined orientation, the planar surface 52 is located within the hole 26, and the convex surface 34 projects at least partially out of the hole 26, forming the uppermost surface in use. As the items 32 are spread by the spreader 30, the shape of the items 32, and in particular the substantially planar surface 52 and the relative closeness of the centre of gravity of the item 32 to the substantially planar surface 53 means that as the items 32 are moved by the spreader 38 they will automatically adopt the most stable orientation, which is the predetermined orientation within the holes 26, with only one item 32 being located in each hole 26. As used here, "automatically" means "without individual manipulation". Thus, the items 32 will, over a time period, adopt the predetermined orientation as a result of the general spreading movement, without requiring specific individual manipulation. The time period can be reduced if an excess of items 32 is used relative to the number of holes 26. The container side walls 86 contain the left over unused items 32. The holes 26 correspond in plan shape with a shape of the items, and in the example shown correspond with the plan shape of the planar surface 52. The plan shape of each of the holes 26 is arranged to be slightly larger than the plan shape of the planar surface 52 of each of the items 32.

In one example, the largest dimension of the planar surface 52 of the items could be between 1 and 6mm, and could be between 2 and 5mm. The corresponding dimension of the plan shape of the holes 26 could be between 0.1mm and 0.3mm larger than the shape of the items 32, and could be approximately 0.2mm larger than the shape of the items 32.

In one example, the items 32 have a planar surface 52 which is circular in plan shape, having a diameter of approximately 3mm, and the corresponding diameter of the holes 26 is 3.2mm. In another example, the items 32 have a planar surface 42 with circular plan shape which is approximately 4mm in diameter, and the corresponding diameter of the circular holes is approximately 4.2mm.

In the transferring step 66, the items 32 are transferred from the stencil 22 to the substrate 48. As shown in Figure 1C, in the transferring step 66, a transfer medium 40 in the form of a substantially planar sheet including a layer of transfer adhesive 36 is located over and lowered onto the items 32 located within the holes 26 of the stencil 22, so that the layer of transfer adhesive 36 contacts the upper, convex surface 34 of each of the items 32, adhering the items 32 to the transfer medium 40 in the form of the pattern 50. The transfer medium 40 is then moved away from the stencil 22, lifting the items 32 out of the holes 26.

In the fixing step 68, the items 32 are fixed to the substrate 48. In the example shown, heat is applied to melt the hot melt fixing adhesive layer 42 of each of the items 32. The substrate 48, which could be a textile, and could be a garment, which could be in the form of a t-shirt as shown in Figure 4, is located in a heating apparatus 44. The heating apparatus 44 includes a pair of plates 46A, 46B, the upper plate 46B being heated. With the plates 46A, 46B in a spaced apart condition, the substrate 48 is located between the plates 46A, 46B, supported by the lower plate 46A. The transfer medium 40, carrying the items 32, is positioned onto the substrate 48, and the upper plate 46B is lowered towards the lower plate 46A, applying pressure to the transfer medium 40 and the substrate 48. The heated upper plate 46B melts the layer of hot melt adhesive 42, fixing the items 32 to the substrate 48.

Following the application of heat and pressure to the transfer medium 40 and the substrate 48, the plates 46A and 46B are moved apart from each other, and the transfer medium 40 is peeled away from the substrate 48. The fixing adhesive 42 is arranged to be a stronger adhesive than the transfer adhesive 36, so that as the transfer medium 40 is peeled away from the substrate 48, the transfer medium 40 is separated from the items 32, leaving the items 32 fixed to the substrate 48 in the form of the pattern 50. Figure 4 shows the substrate 48 in the form of a t-shirt, to which the pattern 50 has been applied, the pattern 50 being formed of items 32.

In one example, the items 32 could be rhinestones, which could be of any colour and could be of any suitable shape. Alternatively, the items could be other decorative items for decorating textiles.

Various other modifications could be made without departing from the scope of the invention. The pattern could be of any suitable size and shape. The items could be of any suitable size and shape, and formed of any suitable material. The cutting apparatus could be of any suitable form. The cutter could be of any suitable form. For example, the cutter could be in the form of a punch, a die or a drill bit. The stencil could be of any suitable size, shape, and thickness, and formed of any suitable material. In one example, the stencil could be provided without a support layer. The support layer could be formed of any suitable material. The holes formed in the stencil could be blind holes, which could be deep enough to capture the items in the locating step. The blind holes could be formed by any suitable means.

The transfer medium 40 could be of any suitable size, shape and thickness, and formed of any suitable material. The transfer adhesive and the fixing adhesive could be formed of any suitable adhesive material. The heating apparatus could be of any suitable size, shape and configuration. In one example, the heating apparatus could comprise a hand held iron.

In the fixing step, the fixing adhesive could be applied to the items.

The items could be of different sizes and shapes, and the holes formed could be of corresponding different sizes and shapes, with sequential location of different sizes of the items in the locating step, starting with the largest.

The invention thus provides a method in which a plurality of relatively small, fiddly items are arranged in a predetermined orientation, in a predetermined pattern, which could be computer generated, and are then applied to a textile substrate such as a t-shirt for decorative effect. The method is relatively simple, and can be undertaken by relatively unskilled and relatively inexperienced personnel. The method permits patterns to be consistently reproduced over a batch and consistently reproduced after a time delay with accuracy of placement of the items. The same stencil can be reused. The method can be used in conjunction with other textile decoration methods, such as those using heat transfers. The method is particularly suitable for relatively small batches of between 1 and several hundred units, which do not justify investment in highly automated machinery, but for which conventional item application methods would produce inconsistent, inaccurate results, or require a high degree of skill and would be very time consuming. Whilst endeavouring in the foregoing specification to draw attention to those features of the invention believed to be of particular importance it should be understood that the Applicant claims protection in respect of any patentable feature or combination of features hereinbefore referred to and/or shown in the drawings whether or not particular emphasis has been placed thereon.

Claims

1. A method of applying items to a substrate, the method including the steps of forming holes in a stencil, locating the items in the holes, transferring the items to a substrate, and fixing the items to the substrate.

2. A method according to claim 1, in which only one item is located in ' each hole.

3. A method according to claims 1 or 2, in which the holes are through holes.

4. A method according to any of the preceding claims, in which the holes are formed by cutting.

5. A method according to claim 4, in which the holes are formed by a movable cutter.

6. A method according to claim 5, in which the movable cutter is in the form of a blade.

7. A method according to claim 5 or 6, in which the cutter is controlled by a programmable controller which is programmable with a set of instructions.

8. A method according to claim 7, in which the set of instructions includes movement instructions, which control the movement of the cutter.

9. A method according to any of the preceding claims, in which the items are applied to the substrate in a predetermined pattern.

10. A method according to claim 9, in which the method includes a step of designing the pattern.

11. A method according to claim 10, in which the method includes a step of converting the pattern into the movement instructions.

12. A method according to claim 4^' or any claim dependent thereon, in which the stencil is mounted to a support layer for support during cutting.

13. A method according to claim 12, in which following cutting, the stencil is demounted from the support layer.

14. A method according to any of the preceding claims, in which the stencil is formed of a plastics material.

15. A method according to claim 14, in which the stencil is formed of polyvinyl chloride.

16. A method according to any of the preceding claims, in which the stencil has a thickness of between 0.5 mm and 1.5 mm.

17. A method according to claim 16, in which the thickness is approximately 1.0 mm.

18. A method according to any of the preceding claims, in which in the locating step, the stencil is located on a substantially planar surface.

19. A method according to any of the preceding claims, in which in the locating step, the stencil is located within a container.

20. A method according to any of the preceding claims, in which a plurality of the items are spread across the stencil.

21. A method according to claim 20, in which the items are spread by a spreader.

22. A method according to claim 21 , in which the spreader is in the form of a brush or sponge.

23. A method according to any of the preceding claims, in which in the locating step, the items are located in a predetermined orientation within the holes.

24. A method according to claim 23 when dependent on any of claims 20 to 22, in which the items are arranged to locate themselves substantially automatically during spreading in the predetermined orientation.

25. A method according to any of the preceding claims, in which each item is shaped so that its centre of gravity is closer to one surface than another, opposite surface.

26. A method according to any of the preceding claims, in which each item includes a substantially planar surface and a substantially convex surface.

27. A method according to claim 26 when dependent on claim 25, in which the planar surface is the one surface.

28. A method according to claim 26 or 27 when dependent on claim 23 or any claim dependent thereon, in which in the predetermined orientation, the planar surface is located within the hole.

29. A method according to claim 28, in which in the predetermined orientation, the convex surface projects at least partially out of the hole, and is in use in the locating step the uppermost surface.

30. A method according to any of the preceding claims, in which each hole corresponds in plan shape with a shape of at least one item.

31. A method according to claim 30, in which each hole corresponds with a plan shape of the planar surface of at least one item.

32. A method according to claim 30 or 31 , in which the plan shape of each of the holes is slightly larger than the shape of the corresponding items.

33. A method according to claim 32, in which the plan shape of each of the holes is slightly larger than the plan shape of the corresponding items.

34. A method according to any of claims 30 to 33, in which the largest dimension of the shape of the items is between 1 and 6mm.

35. A method according to claim 34, in which the largest dimension of the shape of the items is between 2 and 5mm.

36. A method according to any of claims 30 to 35, in which the corresponding dimension of the plan shape of the holes is between 0.1mm and 0.3mm larger than the shape of the items.

37. A method according to claim 36, in which the corresponding dimension of the plan shape of the holes is approximately 0.2mm larger than the shape of the items.

38. A method according to any of the preceding claims, in which in the transferring step, a transfer medium is located over the items in the holes.

39. A method according to claim 38, in which the transfer medium includes transfer adhesive, which adheres the items to the transfer medium.

40. A method according to claim 39, in which the transfer adhesive is arranged so that as the transfer medium is moved away from the stencil, the items are lifted out of the holes.

41. A method according to claims 39 or 40 when dependent on claim 26 or any claim dependent thereon, in which the transferring adhesive contacts the convex surface of each of the items.

42. A method according to any of claims 38 to 41 , in which in the transferring step, the transfer medium with the items is located on the substrate.

43. A method according to any of the preceding claims, in which in the fixing step, the items are fixed to the substrate by fixing adhesive.

44. A method according to claim 43 when dependent on claim 26 or any claim dependent thereon, in which the adhesive is applied to the planar surface of each of the items.

45. A method according to claim 43 when dependent on claim 26 or any claim dependent thereon, in which the items include fixing adhesive which is located on the planar surface.

46. A method according to any of claims 43 to 45, in which the fixing adhesive is a hot melt adhesive.

47. A method according to claim 46, in which in the fixing step, heat is applied to melt the hot melt adhesive.

48. A method according to any of the preceding claims, in which in the fixing step, the substrate is located in a heating apparatus.

49. A method according to claim 48, in which the heating apparatus includes a pair of plates, and in the fixing step the substrate is located between the plates.

50. A method according to claim 49, in which at least one of the plates is heated.

51. A method according to claim 49 or 50 when dependent on claim 38 or any claim dependent thereon, in which pressure is applied to the substrate and the transfer medium through the plates during the fixing step.

52. A method according to claim 38 or any claim dependent thereon, in which following the fixing step, the transfer medium is separated from the items and the substrate.

53. A method according to any of the preceding claims, in which the items are all substantially similar in shape to each other.

54. A method according to any of the preceding claims, in which the items are all substantially identical in shape to each other.

55. A method according to any of the preceding claims, in which the items are decorative items for decorating textiles.

56. A method according to any of the preceding claims, in which the items are rhinestones.

57. A method according to any of the preceding claims, in which the substrate is a textile.

58. A method according to claim 57, in which the substrate is a garment.

59. A method according to claim 58, in which the substrate is a t-shirt.

60. A method substantially as hereinbefore described and with reference to Figs. 1 to 5 of the accompanying drawings.

61. Any novel subject matter or combination including novel subject matter disclosed herein, whether or not within the scope of or relating to the same invention as any of the preceding claims.