WO2010072221A3 - Cooling device with bended flat tube and related manufacturing method - Google Patents

Cooling device with bended flat tube and related manufacturing method Download PDF

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Publication number
WO2010072221A3
WO2010072221A3 PCT/DK2009/000263 DK2009000263W WO2010072221A3 WO 2010072221 A3 WO2010072221 A3 WO 2010072221A3 DK 2009000263 W DK2009000263 W DK 2009000263W WO 2010072221 A3 WO2010072221 A3 WO 2010072221A3
Authority
WO
WIPO (PCT)
Prior art keywords
flat tube
cooling device
axis
related manufacturing
bended
Prior art date
Application number
PCT/DK2009/000263
Other languages
French (fr)
Other versions
WO2010072221A2 (en
Inventor
Henrik Olsen
Original Assignee
Noise Limit Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noise Limit Aps filed Critical Noise Limit Aps
Publication of WO2010072221A2 publication Critical patent/WO2010072221A2/en
Publication of WO2010072221A3 publication Critical patent/WO2010072221A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling device is disclosed, the cooling device comprising a flat tube having a first side surface and a second side surface and extending from a first end to a second end, the cooling device further comprising a first heat receiving part, wherein the flat tube comprises a first part extending along a first axis and a second part extending along a second axis, the flat tube further comprising a first bending between the first part and the second part such that the first side surface of the first part faces the first side surface of the second part and the first angle between the first axis and the second axis is in the range from about 20° to about 160°. Further, the flat tube comprises a third part extending along a third axis, and a second bending between the second part and the third part such that the second angle between the second axis and the third axis is in the range from 0° to about 160°.
PCT/DK2009/000263 2008-12-23 2009-12-22 Cooling device with bended flat tube and related manufacturing method WO2010072221A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA200801840 2008-12-23
DKPA200801840 2008-12-23

Publications (2)

Publication Number Publication Date
WO2010072221A2 WO2010072221A2 (en) 2010-07-01
WO2010072221A3 true WO2010072221A3 (en) 2011-01-13

Family

ID=40642365

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK2009/000263 WO2010072221A2 (en) 2008-12-23 2009-12-22 Cooling device with bended flat tube and related manufacturing method

Country Status (1)

Country Link
WO (1) WO2010072221A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105579792A (en) * 2014-09-02 2016-05-11 阿威德热合金有限公司 Evaporator and condenser section structure for thermosiphon
CN106461347B (en) 2014-09-15 2019-05-10 阿威德热合金有限公司 Thermal siphon with bend pipe section

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04187990A (en) * 1990-11-22 1992-07-06 Showa Alum Corp Heat exchanging device
DE10306848A1 (en) * 2003-02-18 2004-08-26 Behr Gmbh & Co. Kg Flat tube with bend section forming heat exchanger for gas cooler or evaporator has bent over section with main bend axis parallel to flat tube plane and at definable angle to pipe length
US20070177353A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
DE202007008908U1 (en) * 2007-02-13 2007-09-13 Bothhand Enterprise Inc. cooling module
US20080156464A1 (en) * 2006-12-27 2008-07-03 Cheng Home Electronics Co., Ltd. Heat pipe structure with sectional heat conducting capability

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04187990A (en) * 1990-11-22 1992-07-06 Showa Alum Corp Heat exchanging device
DE10306848A1 (en) * 2003-02-18 2004-08-26 Behr Gmbh & Co. Kg Flat tube with bend section forming heat exchanger for gas cooler or evaporator has bent over section with main bend axis parallel to flat tube plane and at definable angle to pipe length
US20070177353A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Mechanism for connecting loop heat pipe and method therefor
US20080156464A1 (en) * 2006-12-27 2008-07-03 Cheng Home Electronics Co., Ltd. Heat pipe structure with sectional heat conducting capability
DE202007008908U1 (en) * 2007-02-13 2007-09-13 Bothhand Enterprise Inc. cooling module

Also Published As

Publication number Publication date
WO2010072221A2 (en) 2010-07-01

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