WO2010072164A1 - High power led bulb - Google Patents

High power led bulb Download PDF

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Publication number
WO2010072164A1
WO2010072164A1 PCT/CN2009/075991 CN2009075991W WO2010072164A1 WO 2010072164 A1 WO2010072164 A1 WO 2010072164A1 CN 2009075991 W CN2009075991 W CN 2009075991W WO 2010072164 A1 WO2010072164 A1 WO 2010072164A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
central
heat radiating
aluminum substrate
lamp
Prior art date
Application number
PCT/CN2009/075991
Other languages
French (fr)
Chinese (zh)
Inventor
陈鸿蛟
Original Assignee
Hongjiao Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongjiao Chen filed Critical Hongjiao Chen
Publication of WO2010072164A1 publication Critical patent/WO2010072164A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the technical problem to be solved by the present invention is to provide a high power with high power, high heat dissipation and low processing cost.
  • a high-power LED bulb includes a lamp cap 1 and a heat sink.
  • the heat sink includes a peripheral heat sink 2 mounted to the lamp cap 1, and a peripheral lamp body 2 is provided with a lamp cover 3
  • the inner bottom surface of the outer surface of the heat sink body 2 is provided with an LED lamp 5 through the aluminum substrate 4, and the LED lamp 5 is mounted on the aluminum substrate 4 and corresponds one-to-one with the aluminum substrate 4, and the LED lamp 5 is covered with a corresponding lens 6
  • the lamp cover 3 is provided with a hole 7 matching the size of the lens 6.
  • the bottom surface of the peripheral heat sink 2 is provided with a base 15 for mounting an aluminum substrate, and the heat sink further includes a central heat sink 8 attached to the peripheral heat sink 2.
  • a driving circuit 17 is mounted in an electric cavity between the peripheral heat radiating body 2 and the base 1, and an air hole 18 in the bottom surface of the peripheral heat radiating body 2 for facilitating air circulation and a heat dissipating hole in the lamp cover 3 are provided. 19, all of which are well known to those skilled in the art, and will not be described in detail herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A high power LED bulb comprises a lamp head (1) and a heat radiating body. The heat radiating body comprises a peripheral heat radiating body (2) engaged to the lamp head (1) and a central heat radiating body (8) engaged to the peripheral heat radiating body (2). A lamp cover (3) is engaged to the peripheral heat radiating body (2). LED lamps (5) are mounted on the inner bottom of the peripheral heat radiating body (2) via aluminum base boards (4). Each LED lamp (5) is provided corresponding to an aluminum base board (4) and covered with a corresponding lens (6). The lamp cover (3) is provided with a plurality of holes that fit the lenses (6). The central heat radiating body (8) is provided with a plurality of through holes or through grooves (9) with a section of U arc for inserting the aluminum base boards (4) and LED lamps (5), and a plurality of blind holes or blind grooves (10) for mounting the LED lamps (5). The LED bulb is provided with a plurality of LED lamps (5) to increase power and brightness of the bulb, and provided with a peripheral heat radiating body (2) and a central heat radiating body (8) to enlarge heat radiating area, so as to increase the heat radiating performance.

Description

说明书  Instruction manual
Title of Invention:一种大功率 LED灯泡 Title of Invention: A high power LED bulb
[1] 技术领域  [1] Technical field
[2] 本发明涉及一种 LED灯泡， 尤其是指一种大功率的 LED灯泡。  [2] The present invention relates to an LED light bulb, and more particularly to a high power LED light bulb.
[3] 背景技术  [3] Background Art
[4] LED灯与传统白炽灯或日光灯相比， 具有寿命长、 功耗低、 节能环保等优点， 因此， LED灯作为照明灯泡已经得到越来越广泛的使用。 现有技术中， LED灯泡 内的散热体通常只有一个， 而且 LED及透镜都集中于散热体内， 散热体空间不大 ， 散热性较差， 灯泡总体功率不高， 无法得到较高的亮度。 如常用的型号为 150 WPAR38及 300WPAR56的传统灯泡， 现有的 LED灯泡的亮度只能达到其一半左 右， 还不能代替它。 现有 LED灯泡散热体一般有两种生产工艺， 一为铝合金压铸 ， 二是铝合金挤压后车削加工。 铝合金压铸工艺加工的散热体散热面积小， 散 热效率低； 铝合金挤压后车削加工的散热体， 散热面积大， 但此种方式加工的 散热体与铝基板的接触面积小， 热量不能及时顺利的从铝基板传到散热体， 传 热效率差， 并且车削加工费用昂贵。  [4] Compared with traditional incandescent or fluorescent lamps, LED lamps have the advantages of long life, low power consumption, energy saving and environmental protection. Therefore, LED lamps have been used more and more widely as lighting bulbs. In the prior art, there is usually only one heat sink in the LED bulb, and the LED and the lens are concentrated in the heat sink body, the heat sink body is not large, the heat dissipation is poor, and the overall power of the bulb is not high, and high brightness cannot be obtained. For conventional light bulbs of the commonly used models 150 WPAR38 and 300WPAR56, the existing LED bulbs can only be half the brightness and cannot replace it. The existing LED bulb heat sink generally has two production processes, one is aluminum alloy die-casting, and the other is aluminum alloy extrusion and turning. The heat sink of the aluminum alloy die-casting process has a small heat dissipation area and low heat dissipation efficiency; the heat sink of the aluminum alloy after the extrusion process has a large heat dissipation area, but the contact area of the heat sink and the aluminum substrate processed in this manner is small, and the heat cannot be timely. Smooth transfer from the aluminum substrate to the heat sink, poor heat transfer efficiency, and expensive turning.
[5] 发明内容  [5] Summary of the invention
[6] 本发明要解决的技术问题是提供一种功率高、 散热性强、 加工成本低的大功率 [6] The technical problem to be solved by the present invention is to provide a high power with high power, high heat dissipation and low processing cost.
LED灯泡。 LED bulbs.
[7] 为了解决上述技术问题， 本发明采取以下技术方案：  [7] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[8] 一种大功率 LED灯泡， 包括灯头及散热体， 该散热体包括与灯头安装连接的外 围散热体， 该外围散热体上装有灯盖， 外围散热体内底面通过铝基板装有 LED 灯， 该 LED灯装于铝基板上且与该铝基板一一对应， LED灯上罩有一一对应的 透镜， 灯盖上幵有与透镜大小相匹配的孔， 所述散热体还包括与外围散热体装 接的中心散热体， 该中心散热体上开有用于穿插铝基板及 LED灯的通孔或截面为 优弧形的通槽， 以及用于安装 LED灯的盲孔或盲槽。  [8] A high-power LED bulb comprising a lamp cap and a heat sink, the heat sink comprising a peripheral heat sink mounted to the lamp head, the peripheral heat sink having a lamp cover mounted thereon, the bottom surface of the peripheral heat sink being mounted with an LED lamp through the aluminum substrate, The LED lamp is mounted on the aluminum substrate and has a one-to-one correspondence with the aluminum substrate. The LED lamp has a corresponding lens on the upper cover, and the lamp cover has a hole matching the size of the lens, and the heat sink further includes heat dissipation from the periphery. The central heat sink of the body is mounted with a through hole for inserting an aluminum substrate and an LED lamp or a through-hole having a superior arc shape, and a blind hole or a blind groove for mounting the LED lamp.
[9] 所述盲槽包括设于中心散热体侧壁上的截面为优弧形的盲槽， 以及设于中心散 热体中心部位的截面为优弧形的盲槽。 [10] 进一步， 在中心散热体的几何中心位置开有穿孔， 设于中心散热体中心部位的 盲槽设于该穿孔的孔壁上， 该盲槽内装有中心铝基板， 该中心铝基板上装有罩 有一一对应的透镜的 LED灯。 [9] The blind slot includes a blind groove having a superior arc shape disposed on a sidewall of the central heat sink body, and a blind groove having a superior arc shape at a central portion of the central heat dissipation body. [10] Further, a hole is formed in the geometric center of the central heat sink, and a blind groove disposed at a central portion of the central heat sink is disposed on the hole wall of the hole, and the blind groove is provided with a central aluminum substrate, and the central aluminum substrate is mounted thereon. There is a LED lamp with a corresponding lens.
[11] 为了更好的散热， 在装有所述中心散热体的外围散热体的内底面设有穿插过穿 孔， 且与中心铝基板相接触的突台。 为了更进一步提高中心散热体的散热能力 ， 中心散热体上还设有散热片。 [11] For better heat dissipation, a projection that is inserted through the through hole and in contact with the center aluminum substrate is provided on the inner bottom surface of the peripheral heat sink in which the central heat sink is mounted. In order to further improve the heat dissipation capability of the central heat sink, a heat sink is further disposed on the central heat sink.
[12] 在外围散热体的内底面设有用于安装铝基板的基座。  [12] A susceptor for mounting an aluminum substrate is provided on the inner bottom surface of the peripheral heat sink.
[13] 本发明结构布局合理， 在原有散热体的基础上增加了中心散热体， 中心散热体 对灯泡的大部分热量进行散热， 大大加强了灯泡的散热性， 使灯泡的散热效果 更好， 有效提高灯泡的功率， 使灯泡的亮度更高。 由于散热体的散热效率高， 相同热量的情况下， 所需的散热体的重量大大减少， 从而使得灯泡的整体重量 较轻。 另外， 本发明利用压铸铝合金工艺加工散热体， 减少了车削加工费用， 制造成本较低。  [13] The structure of the invention is reasonable, and the central heat sink is added on the basis of the original heat sink, and the central heat sink dissipates heat of most of the heat of the bulb, thereby greatly enhancing the heat dissipation of the bulb and making the heat dissipation effect of the bulb better. Effectively increase the power of the bulb to make the bulb brighter. Due to the high heat dissipation efficiency of the heat sink, the weight of the required heat sink is greatly reduced under the same heat, so that the overall weight of the bulb is light. In addition, the invention utilizes the die-casting aluminum alloy process to process the heat sink, reduces the turning processing cost, and has low manufacturing cost.
[14] 附图说明  [14] BRIEF DESCRIPTION OF THE DRAWINGS
[15] 附图 1为本发明组装后结构示意； 附图 2为本发明分解状态结构示意图。  BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of the present invention after assembly; FIG. 2 is a schematic structural view of an exploded state of the present invention.
[16] 具体实施方式 [16] Detailed implementation
[17] 为了便于本领域技术人员的理解， 下面结合附图对本发明作进一步的描述。  [17] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the accompanying drawings.
[18] 如附图 1、 2所示， 一种大功率 LED灯泡， 包括灯头 1及散热体， 该散热体包括 与灯头 1安装连接的外围散热体 2， 外围散热体 2上装有灯盖 3， 夕卜围散热体 2内底 面通过铝基板 4装有 LED灯 5 , 该 LED灯 5装于铝基板 4上且与铝基板 4一一对应， LED灯 5上罩有一一对应的透镜 6 , 灯盖 3上开有与透镜 6大小相匹配的孔 7， 外围 散热体 2内底面设有用于安装铝基板的基座 15 , 散热体还包括与外围散热体 2装 接的中心散热体 8 , 该中心散热体 8上开有用于穿插铝基板及 LED灯的通孔或截面 为优弧形的通槽 9 , 中心散热体 8上还开有用于安装 LED灯的盲孔或盲槽 10, 该盲 槽 10包括设于中心散热体 8侧壁的截面为优弧形的盲槽 101， 以及设于中心散热 体 8中心部位的截面为优弧形的盲槽 102。 为了更好的散热， 在中心散热体 8的几 何中心位置开有穿孔 11， 设于中心散热体 8中心部位的截面为优弧形的盲槽 102 设于穿孔 11的孔壁上， 盲槽 102内装有中心铝基板 12， 该中心铝基板 12上装有罩 有一一对应的透镜的 LED灯。 为了进一步提高中心散热体 8和外围散热体 2的散热 能力， 在外围散热体 2的内底面设有穿插过穿孔 11 , 且与中心铝基板 12相接触的 突台 13。 当中心散热体 8的热量大于外围散热体 2的热量吋， 中心散热体 8上的热 量通过中心铝基板 12传递到突台 13， 突台 13把热量传递到外围散热体 2上进行散 热； 同样， 当外围散热体 2上的热量大于中心散热体 8上的热量时， 外围散热体 2 上的热量通过突台 13传递到中心散热体 8进行散热。 为了提高中心散热体 8本身 的散热能力， 在中心散热体 8上设有散热片 14。 [18] As shown in Figures 1 and 2, a high-power LED bulb includes a lamp cap 1 and a heat sink. The heat sink includes a peripheral heat sink 2 mounted to the lamp cap 1, and a peripheral lamp body 2 is provided with a lamp cover 3 The inner bottom surface of the outer surface of the heat sink body 2 is provided with an LED lamp 5 through the aluminum substrate 4, and the LED lamp 5 is mounted on the aluminum substrate 4 and corresponds one-to-one with the aluminum substrate 4, and the LED lamp 5 is covered with a corresponding lens 6 The lamp cover 3 is provided with a hole 7 matching the size of the lens 6. The bottom surface of the peripheral heat sink 2 is provided with a base 15 for mounting an aluminum substrate, and the heat sink further includes a central heat sink 8 attached to the peripheral heat sink 2. The central heat dissipating body 8 is provided with a through hole for inserting an aluminum substrate and an LED lamp or a through-hole 9 having a superior arc shape, and the central heat dissipating body 8 is further provided with a blind hole or a blind slot 10 for mounting the LED lamp. The blind slot 10 includes a blind groove 101 having a superior arc shape in a side wall of the central heat sink 8, and a blind groove 102 having a superior arc shape at a central portion of the central heat sink 8. For better heat dissipation, a through hole 11 is formed in the geometric center of the central heat sink 8, and a blind groove 102 having a superior arc shape at a central portion of the central heat sink 8 is disposed on the hole wall of the through hole 11, and the blind groove 102 A central aluminum substrate 12 is mounted therein, and the central aluminum substrate 12 is provided with a cover There is a corresponding LED lamp for the lens. In order to further improve the heat dissipation capability of the central heat sink 8 and the peripheral heat sink 2, a projection 13 that is inserted through the through hole 11 and is in contact with the center aluminum substrate 12 is provided on the inner bottom surface of the peripheral heat sink 2. When the heat of the central heat sink 8 is greater than the heat of the peripheral heat sink 2, the heat on the central heat sink 8 is transmitted to the ledge 13 through the central aluminum substrate 12, and the bump 13 transfers heat to the peripheral heat sink 2 for heat dissipation; When the heat on the peripheral heat sink 2 is greater than the heat on the center heat sink 8, the heat on the peripheral heat sink 2 is transmitted to the center heat sink 8 through the bump 13 for heat dissipation. In order to improve the heat dissipation capability of the center heat sink 8, the heat sink 14 is provided on the center heat sink 8.
[19] 另外， 在外围散热体 2与灯头 1之间的电器腔中安装驱动电路 17， 以及在外围散 热体 2内底面幵有利于空气流通的气孔 18和在灯盖 3上幵有散热孔 19， 均属于本 领域技术人员所公知的技术， 在此不再作详细赘述。  [19] In addition, a driving circuit 17 is mounted in an electric cavity between the peripheral heat radiating body 2 and the base 1, and an air hole 18 in the bottom surface of the peripheral heat radiating body 2 for facilitating air circulation and a heat dissipating hole in the lamp cover 3 are provided. 19, all of which are well known to those skilled in the art, and will not be described in detail herein.
[20] 本发明在原有外围散热体的基础上增加了中心散热体， 使得本发明灯泡的散热 体为两个， 充分利用外围散热体的空间， 提高了散热性能， 使本发明的 LED灯泡 的功率远比现有的 LED灯泡的功率要大。 现有的型号为 PAR30的 LED灯泡可承受 7〜17W的功率， 能承受的最大功率也只是 17W, 再高则会因散热性能不足导致 损坏或严重光衰， 而本发明同类型号的 LED灯泡最高可承受 22W的功率； 现有的 型号为 PAR38的 LED灯泡可承受 12〜27W的功率， 能承受的最大功率为 27W, 而 本发明的同型号的 LED灯泡最高可承受 37W的功率； 现有的型号为 PAR56的 LED 灯泡可承受 18〜36W的功率， 能承受的最高功率为 36W, 而本发明的同型号的 L ED灯泡最高可承受 54W的功率， 灯泡的体积越大， 功率提高的越明显。 由上述 可看出， 采用本发明结构的 LED灯泡后， 同型号灯泡的功率与现有的相比有显著 的提高及进步， 有些对亮度要求较高的场所， 现有的 LED灯泡并不能取代传统的 灯泡， 而本发明的 LED灯泡则可以代替传统灯泡使用， 达到所需亮度。 另外， 由 于本发明的 LED灯泡与现有 LED灯泡相比散热效率更高， 因此， 在同等热量的情 况下， 本发明所需的散热体的重量大大减少， 使得灯泡的重量与现有的相比较 轻， 节省了生产成本。 比如本发明型号为 PAR38功率为 37W的 LED灯泡， 重量可 在 0.7KG左右， 而现有的型号为 PAR38功率最高为 27W的 LED灯泡重量则为 0.8K G左右， 可看出， 本发明在同型号的 LED灯泡， 不仅功率有了很大的提高， 而且 整个灯泡的重量也较轻。 [21] 上述实施例为本发明较佳的实施方案之一， 在上述实施例中， 盲槽的数量并非 是限定， 在满足散热能力的情况下， 盲槽的数量可根据实际所需亮度进行设置[20] The invention adds a central heat sink to the original peripheral heat sink, so that the heat sink of the bulb of the invention has two, fully utilizes the space of the peripheral heat sink, improves the heat dissipation performance, and makes the LED bulb of the invention The power is much larger than the power of existing LED bulbs. The existing model PAR30 LED bulb can withstand 7~17W power, and the maximum power that can be withstood is only 17W. If it is high, it will cause damage or severe light decay due to insufficient heat dissipation performance, and the same type of LED bulb of the present invention has the highest Can withstand 22W of power; the existing model PAR38 LED bulb can withstand 12~27W power, the maximum power that can withstand is 27W, and the same type of LED bulb of the invention can withstand up to 37W power; existing The PAR56 LED bulb can withstand 18~36W and can withstand a maximum power of 36W. The same type of L ED bulb of the present invention can withstand up to 54W. The larger the bulb, the more obvious the power is. . It can be seen from the above that after using the LED bulb of the structure of the invention, the power of the same type of bulb is significantly improved and improved compared with the existing ones, and in some places where the brightness is high, the existing LED bulb cannot replace Conventional light bulbs, while the LED bulbs of the present invention can be used in place of conventional light bulbs to achieve the desired brightness. In addition, since the LED bulb of the present invention has higher heat dissipation efficiency than the existing LED bulb, the weight of the heat sink required by the present invention is greatly reduced under the same heat, so that the weight of the bulb is different from the existing phase. It is lighter and saves production costs. For example, the model of the invention is a PAR38 power 37W LED bulb, the weight can be about 0.7KG, and the existing model PAR38 power up to 27W LED bulb weight is about 0.8KG, it can be seen that the invention is in the same model The LED bulbs not only have a great increase in power, but the weight of the entire bulb is also light. [21] The above embodiment is one of the preferred embodiments of the present invention. In the above embodiment, the number of blind slots is not limited. In the case that the heat dissipation capability is satisfied, the number of blind slots can be performed according to actual required brightness. Setting
。 另外， 中心散热体可全部装于外围散热体内， 也可部分装于外围散热体内； 中心散热体与外围散热体间采用螺纹旋接或釆用螺栓固定的方式上下连接。 不 脱离本发明的发明构思的前提下任何显而易见的替换或改变均在本发明的保护 范围之内。 . In addition, the central heat dissipating body may be completely installed in the peripheral heat dissipating body, or may be partially installed in the peripheral heat dissipating body; the central heat dissipating body and the peripheral heat dissipating body are connected by screwing or bolting. Any obvious substitutions or modifications may be made without departing from the spirit and scope of the invention.

Claims

权利要求书 Claim
[Claim 1] 1.一种大功率 LED灯泡， 包括灯头 （1) 及散热体， 该散热体包括 与灯头安装连接的外围散热体 （2) , 该外围散热体上装有灯盖 （ 3) , 外围散热体内底面通过铝基板 （4) 装有 LED灯 （5) , 该 LE D灯装于铝基板上且与该铝基板一一对应 , LED灯上罩有一一对 应的透镜 （6) , 灯盖上开有与透镜大小相匹配的孔 （7) , 其特 征在于： 所述散热体还包括与外围散热体装接的中心散热体 （8) [Claim 1] 1. A high-power LED bulb comprising a lamp cap (1) and a heat sink, the heat sink comprising a peripheral heat sink (2) mounted to the lamp cap, the peripheral heat sink having a lamp cover (3) The bottom surface of the external heat dissipation body is provided with an LED lamp (5) through an aluminum substrate (4), and the LE D lamp is mounted on the aluminum substrate and corresponds to the aluminum substrate one by one, and the LED lamp cover has a corresponding lens (6). The lamp cover is provided with a hole (7) matching the size of the lens, wherein: the heat sink further comprises a central heat sink (8) attached to the peripheral heat sink.
, 该中心散热体上开有用于穿插铝基板及 LED灯的通孔或截面为 优弧形的通槽 （9) , 以及用于安装 LED灯的盲孔或盲槽 （10) 。 The center heat sink has a through hole for inserting an aluminum substrate and an LED lamp or a channel (9) having a superior arc shape, and a blind hole or a blind groove (10) for mounting the LED lamp.
[Claim 2] 2.根据权利要求 1所述的大功率 LED灯泡， 其特征在于： 所述盲槽  [Claim 2] 2. The high power LED light bulb according to claim 1, wherein: the blind slot
(10) 包括设于中心散热体侧壁上的截面为优弧形的盲槽 （101) (10) Includes a blind groove with a curved section on the side wall of the central heat sink (101)
, 以及设于中心散热体中心部位的截面为优弧形的盲槽 （102) 。 And a blind groove (102) having a superior arc shape at the center of the central heat sink.
[Claim 3] 3.根据权利要求 2所述的大功率 LED灯泡， 其特征在于:所述中心散 热体的几何中心位置幵有穿孔 （11) , 设于中心散热体中心部位 的盲槽 （102) 设于该穿孔的孔壁上， 该盲槽内装有中心铝基板 （ 12) , 该中心铝基板上装有罩有一一对应的透镜的 LED灯。  [Claim 3] 3. The high-power LED light bulb according to claim 2, wherein the central heat dissipating body has a geometric center position with a perforation (11) and a blind groove (102) disposed at a central portion of the central heat dissipating body. The hole is disposed on the wall of the perforation, and the blind groove is provided with a central aluminum substrate (12), and the central aluminum substrate is provided with an LED lamp with a corresponding lens.
[Claim 4] 4.根据权利要求 3所述的大功率 LED灯泡， 其特征在于： 装有所述 中心散热体的外围散热体的内底面设有穿插过穿孔， 且与中心铝 基板相接触的突台 （13) 。  [Claim 4] 4. The high-power LED light bulb according to claim 3, wherein: the inner bottom surface of the peripheral heat sink on which the central heat sink is mounted is provided with a through-hole and is in contact with the central aluminum substrate. Stand out (13).
[Claim 5] 5.根据权利要求 4所述的大功率 LED灯泡， 其特征在于： 所述中心 散热体上设有散热片 （14) 。  [Claim 5] The high-power LED light bulb according to claim 4, wherein the central heat sink is provided with a heat sink (14).
[Claim 6] 6.根据权利要求 1〜5中任一项所述的大功率 LED灯泡， 其特征在于 ： 装有所述中心散热体的外围散热体的内底面设有安装铝基板的 基座 (15) [Claim 6] The high-power LED light bulb according to any one of claims 1 to 5, characterized in that: the inner bottom surface of the peripheral heat sink on which the central heat sink is mounted is provided with a base on which an aluminum substrate is mounted (15)
PCT/CN2009/075991 2008-12-25 2009-12-24 High power led bulb WO2010072164A1 (en)

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CN102759025A (en) * 2011-04-28 2012-10-31 东莞勤上光电股份有限公司 Cup-shaped LED lamp and radiating structure thereof

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