WO2010071378A2 - Inorganic artificial marble and composition for inorganic artificial marble - Google Patents
Inorganic artificial marble and composition for inorganic artificial marble Download PDFInfo
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- WO2010071378A2 WO2010071378A2 PCT/KR2009/007584 KR2009007584W WO2010071378A2 WO 2010071378 A2 WO2010071378 A2 WO 2010071378A2 KR 2009007584 W KR2009007584 W KR 2009007584W WO 2010071378 A2 WO2010071378 A2 WO 2010071378A2
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- Prior art keywords
- inorganic
- artificial marble
- weight
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- 239000002928 artificial marble Substances 0.000 title claims abstract description 89
- 239000000203 mixture Substances 0.000 title claims description 26
- 239000004575 stone Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
- 239000012190 activator Substances 0.000 claims description 31
- 239000011159 matrix material Substances 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 10
- 229910052915 alkaline earth metal silicate Inorganic materials 0.000 claims description 9
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 239000011147 inorganic material Substances 0.000 claims description 8
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000005995 Aluminium silicate Substances 0.000 claims description 6
- 235000012211 aluminium silicate Nutrition 0.000 claims description 6
- 229910052599 brucite Inorganic materials 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 229920006305 unsaturated polyester Polymers 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- 229920000592 inorganic polymer Polymers 0.000 claims description 5
- GWXQFXAKWAMRSM-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)O.C(C)OOC(C=C)=O Chemical class C(C=C)(=O)O.C(C=C)(=O)O.C(C)OOC(C=C)=O GWXQFXAKWAMRSM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical class C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 3
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- 239000002002 slurry Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 238000004040 coloring Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 150000004760 silicates Chemical class 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011439 engineered stone Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004111 Potassium silicate Substances 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052913 potassium silicate Inorganic materials 0.000 description 2
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/006—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing mineral polymers, e.g. geopolymers of the Davidovits type
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00034—Physico-chemical characteristics of the mixtures
- C04B2111/00206—Compositions defined by their elemental analysis
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/54—Substitutes for natural stone, artistic materials or the like
- C04B2111/542—Artificial natural stone
- C04B2111/545—Artificial marble
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/10—Production of cement, e.g. improving or optimising the production methods; Cement grinding
Definitions
- the present invention relates to an inorganic artificial marble and a composition for an inorganic artificial marble.
- artificial marble has an appearance that is similar to natural stone.
- the base resin which includes an organic material.
- conventional engineered stone has poor weather resistance because it includes an organic binder, and general cement stone may have poor chemical resistance, such as susceptibility to acidic rain, because it has a high surface pH.
- the present invention provides an inorganic artificial marble which can have excellent mechanical strength and weather resistance.
- the present invention further provides an inorganic artificial marble which can have excellent coloring resistance and durability.
- the present invention further provides an inorganic artificial marble which can be environmentally friendly, can be a substitute for natural stone and can be used as an exterior finishing material.
- the present invention further provides a method for preparing an inorganic artificial marble which can embody a pattern resembling natural stone.
- the present invention further provides a composition for preparing the inorganic artificial marble.
- the inorganic artificial marble comprises an inorganic matrix.
- the inorganic matrix may comprise an inorganic powder and an activator.
- the inorganic matrix may comprise about 5 to about 95 % by weight of the inorganic powder and about 5 to about 95 % by weight of the activator.
- the inorganic powder may include Al, Si, O, alkali metal and/or alkaline earth metal as an essential component, for example kaolin, brucite or a combination thereof.
- the inorganic powder can further comprise an alkali metal hydroxide powder, alkaline earth metal hydroxide powder, or a combination thereof.
- the size of the inorganic powder may be about 1 to about 100 ⁇ m.
- the activator may include an alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof.
- the inorganic material when the amount of inorganic material in the inorganic matrix is analyzed by IPC-OES, comprises about 20 to about 40 % by weight of Al and Si and about 60 to about 80 % by weight of alkali metal and/or alkaline earth metal.
- the inorganic matrix may further comprise an inorganic polymer such as poly(sialate), poly(sialate-siloxo), poly(sialate-disiloxo), or a combination thereof.
- the inorganic matrix may have an amount of about 1 to about 50 % by weight.
- the inorganic artificial marble may further include a chip component distributed in the inorganic matrix.
- the chip component may have size of about 0.5 to about 30 mm and may comprise organic chips, inorganic chips or a combination thereof.
- the organic chips may include unsaturated polyester chips, acrylic chips, halogenated epoxy acrylate chips, halogenated urethane acrylate chips, halogenated ethoxy acrylate diacrylate chips or a combination thereof.
- the inorganic chips may include quartz, quartz-silica chips, silicate stone powder, quartz glass, synthetic quartz, silica (silicon dioxide), silica glass, mirror or a combination thereof
- the inorganic artificial marble may include the inorganic matrix in an amount of about 1 to about 50 % by weight and the chip component in an amount of about 50 to about 99 % by weight.
- the present invention further provides a composition for an inorganic artificial marble comprising about 1 to about 50 % by weight of an inorganic matrix including about 5 to about 95 % by weight of an inorganic powder (a) including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O, and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
- an inorganic powder including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O, and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
- the activator may comprise an alkali metal silicate compound, alkaline earth metal silicate compound, or a combination thereof.
- the alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof may be in the form of an aqueous solution phase having a solid content of about 1 to about 80 % by weight.
- the activator may include an acidic activator.
- composition for an inorganic artificial marble of the present invention may be further include one or more additives such as a colorant, coupling agent, ultraviolet absorber, antistatic agent, inorganic filler and the like and combinations thereof.
- the composition for an inorganic artificial marble can be hardened to form the inorganic artificial marble.
- the inorganic artificial marble can have a pH of about 6 to about 8 measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder from the artificial marble after one hour and then measuring the pH of the filtered solution.
- FIG 1 is a picture representing a product of the inorganic artificial marble prepared according to Example 1 of the present invention.
- FIG 2 is a picture representing a product of the inorganic artificial marble prepared according to Example 2 of the present invention.
- the present invention provides an inorganic artificial marble which may have a surface pH of about 6 to about 8.
- the inorganic artificial marble of the invention includes an inorganic matrix, which comprises an inorganic powder and an activator.
- the inorganic matrix may comprise about 5 to about 95 % by weight of the inorganic powder and about 5 to about 95 % by weight of the activator.
- the inorganic powder may comprise one or more compounds including Al, Si, and/or O as an essential component, such as but not limited to aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, iron oxide, manganese oxide and the like and combinations thereof.
- the inorganic powder can include one or more kinds of oxides comprising about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, and about 20 to about 86.7 % by weight of O as an essential component.
- the inorganic powder may comprise kaolin, brucite or a combination thereof.
- the inorganic powder may be prepared by baking kaolin, brucite, or a combination thereof at a temperature of at least about 300 °C, or higher than about 350 °C.
- Exemplary inorganic powders may further comprise without limitation alkali metal oxide powder, such as potassium hydroxide or sodium hydroxide, alkaline earth metal powder, and the like, and combinations thereof.
- alkali metal oxide powder such as potassium hydroxide or sodium hydroxide, alkaline earth metal powder, and the like, and combinations thereof.
- the inorganic powder may have a size of about 1 to about 100 ⁇ m, for example about 5 to about 50 ⁇ m.
- Exemplary activators included in the inorganic matrix may comprise without limitation alkali metal silicate compounds, alkaline earth metal silicate compounds, and combinations thereof.
- the inorganic material when the amount of the inorganic material in the inorganic matrix is analyzed by IPC-OES, comprises about 20 to about 40 % by weight of Al and Si, and about 60 to about 80 % by weight of alkali metal and/or alkaline earth metal.
- the inorganic artificial marble may further comprise an inorganic polymer such as poly(sialate), poly(sialate-siloxo), poly(sialate-disiloxo), or a combination thereof.
- the inorganic artificial marble may include an inorganic polymer having a structure represented by the following Chemical Formula 1 or Chemical Formula 2 or a combination thereof.
- each M is independently a Group I, II or VIII element of the Periodic Table or a combination thereof, and each n represents the number of repeat units and independently can range from 1 to 100.
- the inorganic artificial marble includes the inorganic matrix in an amount of about 1 to about 50 % by weight and the chip component in an amount of about 50 to about 99 % by weight.
- the chip component may have size of about 0.5 to about 30 mm. Moreover, the chip component may have an irregular shape for embodying a natural pattern. Examples of the irregular shape may include without limitation an irregular particle shape and needle-like structure.
- the chip may include an inorganic chip, an organic chip or a combination thereof.
- the organic chip may include without limitation unsaturated polyester chip, acrylic chip, halogenated epoxy acrylate chip, halogenated urethane acrylate chip, halogenated ethoxy acrylate diacrylate chip or a combination thereof.
- Exemplary acrylic chips may include without limitation an acrylic artificial marble powder, an acrylic light guide plate powder and the like, and combinations thereof.
- the acrylic artificial marble powder may prepared by hardening about 100 parts by weight of an acrylic resin, about 100 to about 300 parts by weight of an inorganic filler, about 0.1 to about 10 parts by weight of a polymerization initiator and about 0 to about 200 parts by weight of a marble chip and pulverizing the hardened material.
- the chip may be transparent, semi-transparent or opaque.
- the chips which have a relatively small size may be prepared, thereby chip having double layer or triple layer can be formed.
- layers of two or more kinds of colors can be prepared.
- Exemplary inorganic chips may comprise without limitation broken stone chip, quartz, quartz-silica chip, silica stone powder, quartz glass, synthetic quartz, silica silicon dioxide, silica glass, mirror and the like, and combinations thereof.
- the present invention further provides a composition for an inorganic artificial marble comprising about 1 to about 50 % by weight of an inorganic matrix including about 5 to about 95 % by weight of an inorganic powder (a) including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
- an inorganic powder including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
- An inorganic artificial marble can be prepared from the composition for inorganic artificial marble described above.
- the inorganic matrix comprising the inorganic powder (a) and the activator (b) is the same as the inorganic matrix of the inorganic artificial marble described above.
- Exemplary activators may comprise without limitation alkali metal silicate compounds, alkaline earth metal silicate compounds, and the like, and combinations thereof.
- the alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof may be in the form of an aqueous solution phase having a solid content of about 1 to about 80 % by weight.
- the activator may alternatively be a colloidal solution having an alkali metal silicate and/or alkali earth metal silicate solid content of about 1 to about 80 % by weight, for example about 30 to about 70 % by weight, and as another example, about 50 to about 60 % by weight.
- the activator may further comprise a pH control agent.
- the pH control agent can be an acidic pH control agent.
- acidic pH control agent may include without limitation sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid, acetic acid, formic acid and the like, and combinations thereof.
- the activator which can include the acidic pH control agent may have a pH about 0.1 to about 6, for example, a pH about 1 to about 2.
- the composition for inorganic artificial marble may further include conventional additives such as a colorant, coupling agent, ultraviolet absorber, antistatic agent, inorganic filler and the like and combinations thereof.
- the colorant can be used in an amount of about 0.1 to about 5 parts by weight, for example about 0.3 to about 2 parts by weight, based on about 100 parts by weight of the composition.
- the inorganic filler may be used in an amount of about 0.1 about 35 parts by weight, for example about 1 to about 30 parts by weight, based on about 100 parts by weight of the composition.
- the inorganic artificial marble of the present invention may be prepared by hardening the composition for an inorganic artificial marble described herein and can have a surface pH of about 6 to about 8.
- the surface pH can be measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder from the artificial marble after one hour and then measuring the pH of the filtered solution.
- the inorganic artificial marble may be prepared by mixing the inorganic powder and chip component (for forming a pattern) as described herein and adding a colloid solution of the acidic activator having a pH of about 0.1 to about 6 into the mixture to form a slurry. Then, the slurry can be sprayed into a molding cell, and a plate may be prepared on a flat board by vibration compression and vacuum treatment as known in the art, and cured by hardening the slurry at a temperature of about 50 to about 100 °C for about 0.5 to about 10 hours. The surface of resultant inorganic artificial marble may be polished to form a final product.
- the inorganic powder may be used in an amount of about 5 to about 85 % by weight and the colloid solution of the acidic activator may be used in an amount of about 15 to about 95 % by weight.
- the artificial marble slurry may have pH of about 6 to about 8.
- the artificial marble slurry may be hardened at a temperature of about 20 to about 100 °C, for example about 60 to about 90 °C.
- the surface pH of the inorganic artificial marble can be measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder of the artificial marble after one hour and then measuring the pH of the filtered solution.
- the surface pH may be about 6.5 to about 7.5. Accordingly, the prepared inorganic artificial marble may not suffer surface corrosion after being exposed to acid rain and can have excellent durability without deterioration.
- the inorganic artificial marble can have a pH of about 6 to about 8 because it includes an inorganic mixture, and not a resin or general cement material. Accordingly, the prepared inorganic artificial marble can replace natural stone and be used as an exterior finishing material due to its excellent impact strength, coloring resistance, weather resistance and durability.
- An inorganic powder is prepared by baking kaolin and brucite at 350 °C and thereafter pulverizing the baked kaolin and brucite.
- An inorganic artificial marble slurry is prepared by mixing 90 parts by weight of quartz-silica chip and 10 parts by weight of the inorganic powder and 30 parts by weight of an acidic activator with a pH of 1 is added to the mixture.
- the acidic activator is prepared by adding hydrochloric acid to an aqueous solution including a solid content of 55 % by weight of sodium silicate and potassium silicate to adjust the pH of the aqueous solution to 1.
- the artificial marble slurry is sprayed into a molding cell, and a plate is prepared on a flat board by vibration compression and vacuum treatment, and cured by hardening at 70 °C for 3 hours. Then, the final inorganic artificial marble product is prepared by polishing the surface.
- the surface is represented by Fig 1.
- the surface pH is measured by filtering an aqueous solution which comprises 50 % by weight of a sanding residue powder of the artificial marble after one hour, and the surface pH is 7. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion does not appear.
- ⁇ E is measured using a colorimeter (Minolta Co., Ltd., CM-370) after irradiating the sample with ultraviolet rays for 24 hours using a uvcon device (Atlas Electrical Devices Co.).
- the value of ⁇ E is 0.42, and the coloring resistance and weather resistance are excellent.
- Example 2 is prepared in the same manner as Example 1 except that quartz-silica chip is replaced with broken stone chip.
- the surface pH is 7.
- a picture of the surface of the prepared artificial marble is represented by Fig 2. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion does not appear.
- the value of ⁇ E is 0.41, and the coloring resistance and weather resistance are excellent as in Example 1.
- Comparative Example 1 is prepared in the same manner as Example 1 except that an activator which does not include hydrochloric acid is used after the aqueous solution which comprises a sodium silicate and potassium silicate solid content of 55 % by weight is prepared.
- the surface pH is 13. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion appears.
- Organic engineered stone (E-stone) (Hanwha L&C Corporation, Khanstone) is prepared by using 10 % by weight of silica chip and 90 % by weight of unsaturated polyester organic binder.
- the value of ⁇ E of the organic engineered stone is 3.0, and the coloring resistance and weather resistance are relatively poor.
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- Ceramic Engineering (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides an inorganic artificial marble having excellent impact strength and weather resistance. The inorganic artificial marble can be a substitute for natural stone and used as an exterior finishing material.
Description
The present invention relates to an inorganic artificial marble and a composition for an inorganic artificial marble.
Artificial marble used as architectural materials may be classified into two groups according to the base resin material. One group represents acrylic artificial marble, and the other group represents unsaturated polyester artificial marble. Acrylic artificial marble has found wide utilization as a material for kitchen countertops, wash basins, dressing tables, bathtubs, various table surfaces, wall materials, interior articles, and the like, because it has an excellent appearance, high-gloss texture, and good weather resistance, as compared to unsaturated polyester artificial marble. Generally, acrylic artificial marble is prepared by mixing inorganic filler and initiator and adding marble chips of various colors to provide a natural stone texture.
Various patterns can be developed so that artificial marble has an appearance that is similar to natural stone. However, it can be difficult to use artificial marble as exterior finishing materials because of gloss and low weather resistance imparted thereto by the base resin, which includes an organic material. For example, conventional engineered stone has poor weather resistance because it includes an organic binder, and general cement stone may have poor chemical resistance, such as susceptibility to acidic rain, because it has a high surface pH.
The present invention provides an inorganic artificial marble which can have excellent mechanical strength and weather resistance. The present invention further provides an inorganic artificial marble which can have excellent coloring resistance and durability. The present invention further provides an inorganic artificial marble which can be environmentally friendly, can be a substitute for natural stone and can be used as an exterior finishing material.
The present invention further provides a method for preparing an inorganic artificial marble which can embody a pattern resembling natural stone.
The present invention further provides a composition for preparing the inorganic artificial marble.
In exemplary embodiments of the present invention, the inorganic artificial marble comprises an inorganic matrix. The inorganic matrix may comprise an inorganic powder and an activator. In one embodiment of the present invention, the inorganic matrix may comprise about 5 to about 95 % by weight of the inorganic powder and about 5 to about 95 % by weight of the activator.
The inorganic powder may include Al, Si, O, alkali metal and/or alkaline earth metal as an essential component, for example kaolin, brucite or a combination thereof. The inorganic powder can further comprise an alkali metal hydroxide powder, alkaline earth metal hydroxide powder, or a combination thereof. The size of the inorganic powder may be about 1 to about 100 μm.
The activator may include an alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof.
In another embodiment of the present invention, when the amount of inorganic material in the inorganic matrix is analyzed by IPC-OES, the inorganic material comprises about 20 to about 40 % by weight of Al and Si and about 60 to about 80 % by weight of alkali metal and/or alkaline earth metal.
The inorganic matrix may further comprise an inorganic polymer such as poly(sialate), poly(sialate-siloxo), poly(sialate-disiloxo), or a combination thereof. The inorganic matrix may have an amount of about 1 to about 50 % by weight.
The inorganic artificial marble may further include a chip component distributed in the inorganic matrix. The chip component may have size of about 0.5 to about 30 mm and may comprise organic chips, inorganic chips or a combination thereof. The organic chips may include unsaturated polyester chips, acrylic chips, halogenated epoxy acrylate chips, halogenated urethane acrylate chips, halogenated ethoxy acrylate diacrylate chips or a combination thereof. The inorganic chips may include quartz, quartz-silica chips, silicate stone powder, quartz glass, synthetic quartz, silica (silicon dioxide), silica glass, mirror or a combination thereofIn exemplary embodiments of the present invention, the inorganic artificial marble may include the inorganic matrix in an amount of about 1 to about 50 % by weight and the chip component in an amount of about 50 to about 99 % by weight.
The present invention further provides a composition for an inorganic artificial marble comprising about 1 to about 50 % by weight of an inorganic matrix including about 5 to about 95 % by weight of an inorganic powder (a) including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O, and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
The activator may comprise an alkali metal silicate compound, alkaline earth metal silicate compound, or a combination thereof. The alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof may be in the form of an aqueous solution phase having a solid content of about 1 to about 80 % by weight. The activator may include an acidic activator.
The composition for an inorganic artificial marble of the present invention may be further include one or more additives such as a colorant, coupling agent, ultraviolet absorber, antistatic agent, inorganic filler and the like and combinations thereof.
The composition for an inorganic artificial marble can be hardened to form the inorganic artificial marble. The inorganic artificial marble can have a pH of about 6 to about 8 measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder from the artificial marble after one hour and then measuring the pH of the filtered solution.
The present invention now will be described more fully hereinafter in the following detailed description of the invention.
FIG 1 is a picture representing a product of the inorganic artificial marble prepared according to Example 1 of the present invention.
FIG 2 is a picture representing a product of the inorganic artificial marble prepared according to Example 2 of the present invention.
The present invention provides an inorganic artificial marble which may have a surface pH of about 6 to about 8. The inorganic artificial marble of the invention includes an inorganic matrix, which comprises an inorganic powder and an activator. In one embodiment of the present invention, the inorganic matrix may comprise about 5 to about 95 % by weight of the inorganic powder and about 5 to about 95 % by weight of the activator.
The inorganic powder may comprise one or more compounds including Al, Si, and/or O as an essential component, such as but not limited to aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, iron oxide, manganese oxide and the like and combinations thereof.
In another embodiment of the present invention, the inorganic powder can include one or more kinds of oxides comprising about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, and about 20 to about 86.7 % by weight of O as an essential component. For example, the inorganic powder may comprise kaolin, brucite or a combination thereof. The inorganic powder may be prepared by baking kaolin, brucite, or a combination thereof at a temperature of at least about 300 ℃, or higher than about 350 ℃.
Exemplary inorganic powders may further comprise without limitation alkali metal oxide powder, such as potassium hydroxide or sodium hydroxide, alkaline earth metal powder, and the like, and combinations thereof.
The inorganic powder may have a size of about 1 to about 100 μm, for example about 5 to about 50 μm.
Exemplary activators included in the inorganic matrix may comprise without limitation alkali metal silicate compounds, alkaline earth metal silicate compounds, and combinations thereof.
In an embodiment of the present invention, when the amount of the inorganic material in the inorganic matrix is analyzed by IPC-OES, the inorganic material comprises about 20 to about 40 % by weight of Al and Si, and about 60 to about 80 % by weight of alkali metal and/or alkaline earth metal.
The inorganic artificial marble may further comprise an inorganic polymer such as poly(sialate), poly(sialate-siloxo), poly(sialate-disiloxo), or a combination thereof. For example, the inorganic artificial marble may include an inorganic polymer having a structure represented by the following Chemical Formula 1 or Chemical Formula 2 or a combination thereof.
[Chemical Formula 1]
[Chemical Formula 2]
wherein in both of Chemical Formula 1 and Chemical Formula 2, each M is independently a Group I, II or VIII element of the Periodic Table or a combination thereof, and each n represents the number of repeat units and independently can range from 1 to 100.
In another embodiment of the present invention, the inorganic artificial marble includes the inorganic matrix in an amount of about 1 to about 50 % by weight and the chip component in an amount of about 50 to about 99 % by weight.
The chip component may have size of about 0.5 to about 30 mm. Moreover, the chip component may have an irregular shape for embodying a natural pattern. Examples of the irregular shape may include without limitation an irregular particle shape and needle-like structure.
The chip may include an inorganic chip, an organic chip or a combination thereof. The organic chip may include without limitation unsaturated polyester chip, acrylic chip, halogenated epoxy acrylate chip, halogenated urethane acrylate chip, halogenated ethoxy acrylate diacrylate chip or a combination thereof. Exemplary acrylic chips may include without limitation an acrylic artificial marble powder, an acrylic light guide plate powder and the like, and combinations thereof. In an exemplary embodiment of the present invention, the acrylic artificial marble powder may prepared by hardening about 100 parts by weight of an acrylic resin, about 100 to about 300 parts by weight of an inorganic filler, about 0.1 to about 10 parts by weight of a polymerization initiator and about 0 to about 200 parts by weight of a marble chip and pulverizing the hardened material. The chip may be transparent, semi-transparent or opaque.
When the chip includes a marble chip, the chips which have a relatively small size may be prepared, thereby chip having double layer or triple layer can be formed. In another embodiment of the present invention, layers of two or more kinds of colors can be prepared.
Exemplary inorganic chips may comprise without limitation broken stone chip, quartz, quartz-silica chip, silica stone powder, quartz glass, synthetic quartz, silica silicon dioxide, silica glass, mirror and the like, and combinations thereof.
The present invention further provides a composition for an inorganic artificial marble comprising about 1 to about 50 % by weight of an inorganic matrix including about 5 to about 95 % by weight of an inorganic powder (a) including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si, about 20 to about 86.7 % by weight of O and about 5 to about 95 % by weight of activator (b), and about 50 to about 90 % by weight of a chip component.
An inorganic artificial marble can be prepared from the composition for inorganic artificial marble described above.
The inorganic matrix comprising the inorganic powder (a) and the activator (b) is the same as the inorganic matrix of the inorganic artificial marble described above.
Exemplary activators may comprise without limitation alkali metal silicate compounds, alkaline earth metal silicate compounds, and the like, and combinations thereof. The alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof may be in the form of an aqueous solution phase having a solid content of about 1 to about 80 % by weight.
The activator may alternatively be a colloidal solution having an alkali metal silicate and/or alkali earth metal silicate solid content of about 1 to about 80 % by weight, for example about 30 to about 70 % by weight, and as another example, about 50 to about 60 % by weight.
The activator may further comprise a pH control agent. For example, the pH control agent can be an acidic pH control agent. Examples of acidic pH control agent may include without limitation sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid, acetic acid, formic acid and the like, and combinations thereof. The activator which can include the acidic pH control agent may have a pH about 0.1 to about 6, for example, a pH about 1 to about 2.
The composition for inorganic artificial marble may further include conventional additives such as a colorant, coupling agent, ultraviolet absorber, antistatic agent, inorganic filler and the like and combinations thereof. In an exemplary embodiment of the present invention, the colorant can be used in an amount of about 0.1 to about 5 parts by weight, for example about 0.3 to about 2 parts by weight, based on about 100 parts by weight of the composition. The inorganic filler may be used in an amount of about 0.1 about 35 parts by weight, for example about 1 to about 30 parts by weight, based on about 100 parts by weight of the composition.
The inorganic artificial marble of the present invention may be prepared by hardening the composition for an inorganic artificial marble described herein and can have a surface pH of about 6 to about 8. The surface pH can be measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder from the artificial marble after one hour and then measuring the pH of the filtered solution.
In another exemplary embodiment of the present invention, the inorganic artificial marble may be prepared by mixing the inorganic powder and chip component (for forming a pattern) as described herein and adding a colloid solution of the acidic activator having a pH of about 0.1 to about 6 into the mixture to form a slurry. Then, the slurry can be sprayed into a molding cell, and a plate may be prepared on a flat board by vibration compression and vacuum treatment as known in the art, and cured by hardening the slurry at a temperature of about 50 to about 100 ℃ for about 0.5 to about 10 hours. The surface of resultant inorganic artificial marble may be polished to form a final product.
In another exemplary embodiment of the present invention, the inorganic powder may be used in an amount of about 5 to about 85 % by weight and the colloid solution of the acidic activator may be used in an amount of about 15 to about 95 % by weight.
The artificial marble slurry may have pH of about 6 to about 8. The artificial marble slurry may be hardened at a temperature of about 20 to about 100 ℃, for example about 60 to about 90 ℃.
The surface pH of the inorganic artificial marble can be measured by filtering an aqueous solution which comprises about 50 % by weight of a sanding residue powder of the artificial marble after one hour and then measuring the pH of the filtered solution. For example, the surface pH may be about 6.5 to about 7.5. Accordingly, the prepared inorganic artificial marble may not suffer surface corrosion after being exposed to acid rain and can have excellent durability without deterioration.
As discussed herein, the inorganic artificial marble can have a pH of about 6 to about 8 because it includes an inorganic mixture, and not a resin or general cement material. Accordingly, the prepared inorganic artificial marble can replace natural stone and be used as an exterior finishing material due to its excellent impact strength, coloring resistance, weather resistance and durability.
The invention may be better understood by reference to the following examples which are intended for the purpose of illustration and are not to be construed as in any way limiting the scope of the present invention, which is defined in the claims appended hereto.
Example 1
An inorganic powder is prepared by baking kaolin and brucite at 350 ℃ and thereafter pulverizing the baked kaolin and brucite. An inorganic artificial marble slurry is prepared by mixing 90 parts by weight of quartz-silica chip and 10 parts by weight of the inorganic powder and 30 parts by weight of an acidic activator with a pH of 1 is added to the mixture. The acidic activator is prepared by adding hydrochloric acid to an aqueous solution including a solid content of 55 % by weight of sodium silicate and potassium silicate to adjust the pH of the aqueous solution to 1.
The artificial marble slurry is sprayed into a molding cell, and a plate is prepared on a flat board by vibration compression and vacuum treatment, and cured by hardening at 70 ℃ for 3 hours. Then, the final inorganic artificial marble product is prepared by polishing the surface. The surface is represented by Fig 1.
The surface pH is measured by filtering an aqueous solution which comprises 50 % by weight of a sanding residue powder of the artificial marble after one hour, and the surface pH is 7. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion does not appear.
To test weather resistance, a Q-UV test is conducted and the value of △E is measured using a colorimeter (Minolta Co., Ltd., CM-370) after irradiating the sample with ultraviolet rays for 24 hours using a uvcon device (Atlas Electrical Devices Co.). The value of △E is 0.42, and the coloring resistance and weather resistance are excellent.
Example 2
Example 2 is prepared in the same manner as Example 1 except that quartz-silica chip is replaced with broken stone chip. The surface pH is 7. A picture of the surface of the prepared artificial marble is represented by Fig 2. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion does not appear. The value of △E is 0.41, and the coloring resistance and weather resistance are excellent as in Example 1.
Comparative Example 1
Comparative Example 1 is prepared in the same manner as Example 1 except that an activator which does not include hydrochloric acid is used after the aqueous solution which comprises a sodium silicate and potassium silicate solid content of 55 % by weight is prepared. The surface pH is 13. 3 g of hydrochloric acid is dropped onto the surface of the prepared artificial marble, the surface is wiped, and surface corrosion appears.
Comparative Example 2
Organic engineered stone (E-stone) (Hanwha L&C Corporation, Khanstone) is prepared by using 10 % by weight of silica chip and 90 % by weight of unsaturated polyester organic binder. The value of △E of the organic engineered stone is 3.0, and the coloring resistance and weather resistance are relatively poor.
Many modifications and other embodiments of the invention will come to mind to one skilled in the art to which this invention pertains having the benefit of the teachings presented in the foregoing descriptions. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the invention being defined in the claims.
Claims (28)
- An inorganic artificial marble comprising an inorganic matrix.
- The inorganic artificial marble of Clam 1, wherein said inorganic artificial marble has a surface pH of about 6 to about 8.
- The inorganic artificial marble of Clam 1, wherein said inorganic matrix comprises an inorganic powder and an activator.
- The inorganic artificial marble of Clam 2, wherein said activator comprises an alkali metal silicate, an alkaline earth metal silicate or a combination thereof.
- The inorganic artificial marble of Clam 3, wherein said inorganic powder comprises Al, Si and O.
- The inorganic artificial marble of Clam 3, wherein said inorganic powder comprises kaolin, brucite or a combination thereof.
- The inorganic artificial marble of Clam 6, wherein said inorganic powder comprises alkali metal oxide powder, alkaline earth metal powder or a combination thereof.
- The inorganic artificial marble of Clam 3, wherein said inorganic powder has a size of about 1 to about 100 μm.
- The inorganic artificial marble of Clam 1, wherein an inorganic material in the inorganic matrix comprises about 20 to about 40 % by weight of Al and Si and about 60 to about 80 % by weight of an alkali metal, alkaline earth metal, or a combination thereof when the inorganic material is analyzed by IPC-OES.
- The inorganic artificial marble of Clam 1, further comprising an inorganic polymer comprising poly(sialate), poly(sialate-siloxo), poly(sialate-disiloxo), or a combination thereof.
- The inorganic artificial marble of Clam 1, wherein said inorganic polymer comprises a structure represented by the following Chemical Formula 1 or Chemical Formula 2 or a combination thereof:[Chemical Formula 1][Chemical Formula 2]wherein in both of Chemical Formula 1 and Chemical Formula 2, each M comprises a Group I, II, or VII element of the Periodic Table, or a combination thereof and each n represents the number of repeat units.
- The inorganic artificial marble of Clam 1, further comprising a chip component.
- The inorganic artificial marble of Clam 12, wherein said chip component has size of about 0.5 to about 30 mm.
- The inorganic artificial marble of Clam 12, wherein said chip component comprises organic chips, inorganic chips or a combination thereof.
- The inorganic artificial marble of Clam 14, wherein said organic chip comprises unsaturated polyester chip, acrylic chip, halogenated epoxy acrylate chip, halogenated urethane acrylate chip, halogenated ethoxy acrylate diacrylate chip or a combination thereof.
- The inorganic artificial marble of Clam 14, wherein said inorganic chip comprises broken stone chip, quartz, quartz-silica chip, silica stone powder, quartz glass, synthetic quartz, silica silicon dioxide, silica glass, mirror or a combination thereof.
- The inorganic artificial marble of Clam 12, comprising the inorganic matrix in an amount of about 1 to about 50 % by weight and the chip component in an amount of about 50 to about 99 % by weight.
- An inorganic matrix comprising:(a) about 5 to about 95 % by weight of an inorganic powder including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si and about 20 to about 86.7 % by weight of O; and(b) about 5 to about 95 % by weight of an activator.
- A composition for an inorganic artificial marble comprising:about 1 to about 50 % by weight of an inorganic matrix, the inorganic matrix comprising (a) about 5 to about 95 % by weight of an inorganic powder including about 1 to about 67.7 % by weight of Al, about 3 to about 69.7 % by weight of Si and about 20 to about 86.7 % by weight of O, and (b) about 5 to about 95 % by weight of activator, andabout 50 to about 90 % by weight of a chip component.
- The composition of Claim 19, wherein said activator comprises an alkali metal silicate compound, an alkaline earth metal silicate compound or a combination thereof.
- The composition of Claim 20, wherein said alkali metal silicate compound, alkaline earth metal silicate compound or a combination thereof is in the form of an aqueous solution phase having a solids content of about 1 to about 80 % by weight.
- The composition of Claim 19, wherein said activator comprises an acidic activator.
- The composition of Claim 22, wherein said activator further comprises a pH control agent.
- The composition of Claim 22, wherein the pH of the activator is about 0.1 to about 6.
- The composition of Claim 22, wherein the pH of the activator is about 1 to about 2.
- The composition of Claim 19, wherein said composition for inorganic artificial marble of the present invention further comprise an additive comprising a colorant, coupling agent, ultraviolet absorber, antistatic agent, inorganic filler or a combination thereof.
- An inorganic artificial marble prepared by hardening the composition for inorganic artificial marble of Claim 19, and having a surface pH of about 6 to about 8 measured by filtering an aqueous solution comprising about 50 % by weight of a sanding residue powder of the artificial marble after one hour.
- The inorganic artificial marble of Claim 27, wherein said inorganic artificial marble comprises an inorganic matrix comprising an inorganic material comprising about 20 to about 40 % by weight of Al and Si and about 60 to about 80 % by weight of alkali metal, alkaline earth metal, or a combination thereof when the inorganic material is analyzed by IPC-OES.
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Cited By (3)
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US8636842B2 (en) * | 2011-01-13 | 2014-01-28 | Lg Hausys, Ltd. | Artificial stone and manufacturing method thereof |
CN107805003A (en) * | 2017-11-06 | 2018-03-16 | 佛山市欧泊石业有限公司 | A kind of high-performance artificial quartz stone plate |
CN111516105A (en) * | 2020-04-29 | 2020-08-11 | 广东传奇岗石有限公司 | Preparation process of 1.5-meter high-square-material artificial marble |
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RU2479498C1 (en) * | 2011-12-14 | 2013-04-20 | Юлия Алексеевна Щепочкина | Crude mixture for making artificial stone |
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US6028127A (en) * | 1994-10-14 | 2000-02-22 | Mitsubishi Rayon Co., Ltd. | Artificial marble and method for preparing it |
US20060293449A1 (en) * | 2005-06-23 | 2006-12-28 | Weberg Rolf T | Solid filler containing polymerizable compositions, articles formed thereby and methods of formation |
KR100815472B1 (en) * | 2006-07-05 | 2008-03-20 | 제일모직주식회사 | Antibacterial Artificial Marble Composition Having Good Sanding Property |
KR100975380B1 (en) * | 2007-01-09 | 2010-08-11 | (주)엘지하우시스 | Artificial marble and preparation method thereof |
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Cited By (3)
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US8636842B2 (en) * | 2011-01-13 | 2014-01-28 | Lg Hausys, Ltd. | Artificial stone and manufacturing method thereof |
CN107805003A (en) * | 2017-11-06 | 2018-03-16 | 佛山市欧泊石业有限公司 | A kind of high-performance artificial quartz stone plate |
CN111516105A (en) * | 2020-04-29 | 2020-08-11 | 广东传奇岗石有限公司 | Preparation process of 1.5-meter high-square-material artificial marble |
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