WO2010069066A1

WO2010069066A1 - Soldering apparatus and method

Info

Publication number: WO2010069066A1
Application number: PCT/CA2009/001849
Authority: WO
Inventors: Marc HALLÉE; Luc Cadorette
Original assignee: Halberg Design Inc.
Priority date: 2008-12-19
Filing date: 2009-12-18
Publication date: 2010-06-24

Abstract

There is provided a method for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening defined in the circuit board. The method comprises preheating a lower end of the connector pin, applying flux on the lower end of the connector pin, heating a predetermined amount of soldering filler in a solid state over a cavity until it melts and inserting the lower end of the connector pin in the cavity containing the molten soldering filler, thereby soldering the electronic component to the circuit board. The predetermined amount of soldering filler may comprise a soldering filler bead. There is further provided an apparatus for soldering an electronic component to a circuit board. The apparatus comprise a board holder for holding the circuit board, a preheating assembly, a soldering filler dispensing assembly and a soldering assembly.

Description

SOLDERING APPARATUS AND METHOD

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefits of US provisional patent application No. 61/139,177 filed on December 19, 2008, the specification of which is hereby 5 incorporated by reference.

TECHNICAL FIELD

The invention relates to soldering. More precisely, the invention pertains to a method and an apparatus for soldering.

BACKGROUND

10 Soldering is a process in which two or more metal items are joined together using a filler metal. This process generally comprises three steps. The metal items are first heated to a certain temperature. A chemical cleaning agent, or flux, is then applied to parts to be soldered to remove oxidation from their surface. Finally, a metal filler, or soldering filler, is melted and flowed into the joint between the

15 metal items. Control of the temperature of the metal items and the soldering filler, as well as control of the quantity of soldering filler applied, contributes to the quality of the solders.

Soldering is mainly used to affix electronic components to a circuit board. Such electronic components are usually provided with a connector pin, which is 20 inserted through a through hole, or via, of the circuit board. A plurality of electronic components is usually affixed to a single circuit board. The quality of the solder may affect the lifespan of the components-fitted circuit board.

Currently, industrial soldering methods used for the manufacturing of circuit boards are limited to a few technologies. A feature common to all of those is that 25 the circuit board is prepared beforehand by inserting the connector pin of the electronic components into the through holes of the circuit board, in a separate operation.

DM MTL/278415-00003/2164965 2 A first soldering method widely used is wave soldering. The underside of the circuit board is first prepared by masking the areas which do not require soldering, leaving the connectors to be soldered exposed. Electronic components are then inserted into the circuit board such that the connector pins protrude from 5 underneath the circuit board. The protruding connector pins are then passed through a wave or waterfall of molten soldering filler.

This method requires the use of a great amount of soldering filler, usually stored in a tank in the form of a molten soldering filler fluid. Furthermore, as it is well known in the art, maintaining a fluid in a tank at a uniform temperature is an 10 arduous task. Therefore, the temperature of the solder during the soldering operation may not correspond to an ideal soldering temperature, resulting in poor quality solders.

Further, as the soldering operation is performed in or in the vicinity of the soldering filler source, i.e. the tank containing soldering filler, the soldering filler 15 source may become contaminated by different by-products originating from the soldering process, namely metal oxides. Contamination of the soldering filler source may also originate from flux previously applied on the parts to be soldered. Such contamination may result in poor quality soldering in subsequent soldering operations.

20 Industrial soldering may also be achieved by a process called selective dip soldering. This process involves the circuit board being mounted on a frame, while soldering filler dispensing nozzles are positioned underneath the connector pins protruding downwardly from the circuit board. An amount of molten soldering filler is then pumped upwards through the nozzle while the connector pins are

25 lowered into the nozzle openings, thereby soldering the electronic components to the circuit board.

This method does not enable a user to control the quantity of soldering filler used during soldering. When an amount of soldering filler is pumped upwardly, the soldering filler pumping system used must counter the force of gravity exerted on

DM MTL/278415-00003/2164965 2 the amount of soldering filler. A precise tuning of this mechanism is difficult to achieve, and therefore a user may not be able to determine the exact amount of soldering filler used in each soldering operation.

There is therefore a need for a method that would overcome at least one of the 5 above mentioned drawbacks.

Features of the invention will be apparent from review of the disclosure, drawings and description of the invention below.

BRIEF SUMMARY

There is provided a method for soldering an electronic component to a circuit 10 board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening defined in the circuit board. The method comprises positioning the circuit board substantially horizontally such that a lower portion of the connector pin extends downwardly from the circuit board; heating the lower portion of the connector pin to a first predetermined 15 temperature; applying flux onto the connector pin, the flux being at the first predetermined temperature; providing a predetermined amount of soldering filler in a solid state on a soldering cavity sidewall extending below an upper surface of a body, the soldering cavity sidewall defining a soldering cavity; heating the predetermined amount of soldering filler to a second predetermined temperature 20 greater than the melting temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler; and inserting the lower portion of the connector pin in the soldering cavity to thereby solder the electronic component to the circuit board.

One skilled in the art will appreciate that since a predetermined amount of 25 soldering filler is used, waste of soldering filler is substantially reduced and/or essentially eliminated, which is of great advantage. Furthermore, this configuration advantageously enables the use of the exact quantity of soldering filler required to obtain a solder of substantially high quality.

DM MTL/278415-00003/2164965 2 - A -

The skilled addressee will also appreciate that since the soldering filler is applied directly on the lower end of the connector pin, this method substantially reduces and/or essentially eliminates the need for masking areas of the circuit board which do not require soldering, which is also of great advantage.

5 The skilled addressee will further appreciate that, since a substantially small quantity of soldering filler is used to solder the connector pin, the temperature of the soldering filler may be controlled with a substantially high degree of precision, which advantageously produces solders of substantially high quality.

It will further be appreciated that this method may also be automated. In one

10 embodiment and under some circumstances, the soldering of multiple series of connector pins may be accomplished in about 12 seconds, or about 10 times faster than a soldering apparatus of the prior art. In another embodiment, the soldering of multiple series of connector pins may be accomplished in about 4 seconds. This advantageously results in a substantial improvement in the

15 productivity of circuit board assembly lines.

In one embodiment, the heating of the predetermined amount of soldering filler further comprises heating the soldering cavity sidewall to the second predetermined temperature.

In another embodiment, the predetermined amount of soldering filler in a solid 20 state comprises a soldering filler bead.

The skilled addressee will appreciate that the quantity of soldering filler in a soldering filler bead may be determined substantially easily, which is of great advantage. The skilled addressee will further appreciate that the soldering filler bead is substantially easy to store and to convey, through conduits for instance, 25 which is of great advantage.

In yet another embodiment, the providing of a predetermined amount of soldering filler further comprising delivering the soldering filler bead from a bead reservoir

DM MTL/278415-00003/2164965 2 to the soldering cavity sidewall using a bead delivery assembly mounted to the frame and movable relative to the body.

In yet another embodiment, the soldering cavity sidewall defines a cavity rim at an upper end thereof; and the providing of a predetermined amount of soldering 5 filler in a solid state further comprises placing the soldering filler bead on the cavity rim.

In yet another embodiment, the cavity rim is circular; and the diameter of the soldering filler bead is greater than the diameter of the cavity in order to enable the soldering filler bead to rest onto the cavity rim.

10 In yet another embodiment, the cavity rim comprises a bead receiving surface tapering from the upper surface inwardly into the body, the bead receiving surface defining a bead receiving recess sized and shaped to receive at least part of the soldering filler bead therein.

In yet another embodiment, the soldering filler bead has a diameter of about 1.27 15 mm.

In yet another embodiment, the soldering filler bead comprises a bead of SAC305 soldering alloy.

One skilled in the art will appreciate that the bead of SAC305 soldering alloy is essentially free of lead, which is of great advantage for soldering circuit boards 20 manufactured in or destined to be sold and/or distributed and/or used in countries and/or regions in which the use of lead in soldering is prohibited or restricted, such as in the European Union.

In yet another embodiment, the upper surface comprises a plurality of soldering cavity sidewalls extending therebelow defining a plurality of soldering cavities, 25 each adapted to receive the lower portion of one of a plurality of connector pins therein; and the providing of a predetermined amount of soldering filler further comprises placing a soldering filler bead on at least one of the soldering cavity sidewalls.

DM MTL/278415-00003/2164965 2 The skilled addressee will appreciate that in this configuration, each soldering filler bead does not come in contact with the other soldering filler beads, thereby advantageously preventing contamination of soldering filler by oxides produced during soldering.

5 In yet another embodiment, the electronic components are positioned on the circuit board such that the connector pins are disposed in a first predetermined pattern; and the providing of a predetermined amount of soldering filler further comprises selecting a number of soldering cavities from the plurality of soldering cavities, the selected soldering cavities being disposed in a second 10 predetermined pattern similar to the first predetermined pattern; and providing a soldering filler bead on the soldering cavity sidewall of each selected soldering cavity.

In yet another embodiment, the applying of flux onto the connector pin further comprises heating flux from an initial flux temperature lower than the first 15 predetermined temperature to the first predetermined temperature.

In yet another embodiment, the applying of flux onto the connector pin further comprises conveying flux from a flux reservoir to the connecting pin using a pump operatively connected to the flux reservoir.

In yet another embodiment, the applying of flux onto the connector pin further 20 comprises conveying used flux back to the flux reservoir using the pump.

In yet another embodiment, the pump comprises a peristaltic pump.

In yet another embodiment, the method further comprises conveying the circuit board towards a preheating assembly configured for heating the connector pin to the first predetermined temperature; conveying the circuit board from the heating 25 assembly towards a flux dispensing assembly configured for applying flux onto the connector pin; and conveying the circuit board from the flux dispensing assembly towards the body.

DM MTL/278415-00003/2164965 2 In yet another embodiment, the inserting of the lower end of said connector pin in the soldering cavity further comprises positioning the circuit board such that the connector pin is located above the soldering cavity; and lowering the circuit board, and thereby the lower portion of the connector pin, into the soldering 5 cavity.

According to another aspect, there is further provided an apparatus for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening of the circuit board. The apparatus comprises a frame; a board holder mounted to the frame

10 for holding the circuit board in a substantially horizontal position such that a lower portion of the connector pin extends downwardly from the circuit board; a preheating assembly mounted to the frame for heating the lower portion of the connector pin to a first predetermined temperature, the preheating mechanism being movable relative to the board holder for location proximal to the connector

15 pin; a flux dispensing assembly mounted to the frame for dispensing flux on the lower portion of the connector pin, the flux dispensing mechanism being movable relative to the board holder for location proximal to the connector pin; a soldering assembly mounted to the frame, the soldering assembly being movable relative to the circuit board holder, the soldering assembly comprising a first body having

20 a first upper surface and a soldering cavity sidewall extending therebelow, the soldering cavity sidewall defining a soldering cavity for receiving the lower portion of the connector pin therein, the soldering cavity sidewall being configured for receiving a predetermined amount of soldering filler in a solid state thereon, and a first heating mechanism thermally connected to the soldering cavity sidewall for

25 heating the predetermined amount of soldering filler to a second predetermined temperature greater than the melting temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler; and an actuator operatively connected to one of the board holder and the soldering assembly for moving the board holder and the soldering assembly

30 towards each other to insert the lower portion of the connector pin into the

DM MTL/278415-00003/2164965 2 soldering cavity containing molten soldering filler, thereby soldering the electronic component to the circuit board.

In yet another embodiment, the apparatus further comprises positioning means operatively connected to the board holder for selectively positioning the board 5 holder in an operative position with the preheating assembly, with the flux dispensing assembly and with the soldering assembly.

In yet another embodiment, the preheating mechanism comprises a preheating body securely mounted to the frame, the preheating body having a second upper surface and a preheating cavity sidewall extending therebelow to define a 10 preheating cavity for receiving the lower portion of the connector pin therein; and a second heating mechanism thermally connected to the second cavity sidewall for heating the lower portion of the connector pin received in the preheating cavity to the first predetermined temperature.

In yet another embodiment, the flux dispensing mechanism comprises a flux

15 dispensing body securely mounted to the frame, the flux dispensing body having a third upper surface and a flux dispensing cavity sidewall extending therebelow to define a flux dispensing cavity for receiving the lower portion of the connector pin; and an inlet port in fluid communication with the flux dispensing cavity, the inlet port being connectable to a flux source for providing flux to the

20 lower end of the connector pin engaged in the flux dispensing cavity.

In yet another embodiment, the flux dispensing body further comprises an outlet port in fluid communication with the flux dispensing cavity for removing used flux from the flux dispensing cavity.

In yet another embodiment, the apparatus further comprises a flux circulation unit 25 operatively connected to the inlet port and the outlet port of the flux dispensing body, the flux circulation unit comprising a flux reservoir provided with flux therein; and a pump operatively coupled to the flux reservoir for urging movement of flux from the flux reservoir to the inlet port and from the outlet port to the flux reservoir.

DM MTL/278415-00003/2164965 2 In yet another embodiment, the flux circulation unit further comprises a third heating mechanism thermally connected to the flux reservoir for heating the flux to the first predetermined temperature.

In yet another embodiment, the predetermined amount of soldering filler in a solid 5 state comprises a soldering filler bead.

In yet another embodiment, the apparatus further comprises a bead delivery assembly mounted to the frame, the bead delivery assembly comprising a bead reservoir provided with a plurality of soldering filler beads therein, the plurality of soldering filler beads comprising the soldering filler bead; and a bead outlet 10 assembly in communication with the bead reservoir, the bead outlet assembly being movable relative to the first body and positionable over the soldering cavity being for placing the soldering filler bead onto the soldering cavity sidewall.

In yet another embodiment, the soldering cavity sidewall defines a cavity rim having a circular configuration, the diameter of the soldering filler bead being 15 greater than the diameter of the cavity rim in order to enable the soldering filler bead to rest onto the cavity rim.

In yet another embodiment, the cavity rim comprises a bead receiving surface tapering from the upper surface inwardly into the first body to define a bead receiving recess sized and shaped to receive at least part of the soldering filler 20 bead therein.

In yet another embodiment, the soldering filler bead has a diameter of about 1.27 mm.

25 BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a drawing showing a perspective view of a soldering apparatus in accordance with one embodiment.

DM MTL/278415-00003/2164965 2 Fig. 2 is a drawing showing a perspective view of a soldering apparatus table for the soldering apparatus shown in Fig. 1.

Fig. 3A is a drawing showing a top elevation view of the soldering apparatus table shown in Fig. 2.

5 Fig. 3B is a drawing showing a front elevation view of the soldering apparatus table shown in Fig. 2.

Fig. 4 is a drawing showing a perspective view of a preheating assembly, a flux dispensing assembly and a soldering assembly for the soldering apparatus shown in Fig. 1 , with the front preheating assembly leg, the front flux dispensing 10 assembly leg and the front soldering assembly leg removed.

Fig. 5A is a drawing showing an enlarged, top perspective view of the soldering apparatus table shown in Fig. 2, to better show the details of the soldering filler delivery assembly.

Fig. 5B is a drawing showing an enlarged, bottom perspective view of the 15 soldering apparatus table shown in Fig. 2, to better show the details of the soldering filler delivery assembly.

Fig. 6 is a drawing showing a perspective view of a flux circulation unit for the soldering apparatus shown in Fig. 1.

Fig. 7A is a drawing showing a front elevation view of a preheating assembly, a 20 flux dispensing assembly, a soldering assembly and a circuit board with electronic components to be soldered thereto for the soldering apparatus shown in Fig. 1 , to better show the preheating of the connector pins.

Fig. 7B is a drawing showing a cross-section view, taken along cross-section line B-B of Fig. 7A, of the preheating assembly shown in Fig. 7A, with connector pins 25 inserted therein.

Fig. 7C is a drawing showing an enlarged view of the preheating assembly shown in Fig. 7B, with connector pins inserted therein.

DM MTL/278415-00003/2164965 2 Fig. 7D is a drawing showing another enlarged view of the preheating assembly shown in Fig. 7B, with the connector pin removed from the preheating cavity.

Fig. 8A is a drawing showing a front elevation view of a preheating assembly, a flux dispensing assembly, a soldering assembly and a circuit board with 5 electronic components to be soldered thereto for the soldering apparatus shown in Fig. 1 , to better show the step of applying flux to the connector pins.

Fig. 8B is a drawing showing a cross-section view, taken along cross-section line A-A of Fig. 8A, of the flux dispensing assembly shown in Fig. 8A, with connector pins inserted therein.

10 Fig. 8C is a drawing showing an enlarged view of the flux dispensing assembly shown in Fig. 8B, with connector pins inserted therein.

Fig. 9A is a drawing showing a front elevation view of a preheating assembly, a flux dispensing assembly, a soldering assembly and a circuit board with electronic components to be soldered thereto for the soldering apparatus shown 15 in Fig. 1 , to better show the inserting of the lower end of the connector pins in the soldering cavities provided with soldering filler.

Fig. 9B is a drawing showing a cross-section view, taken along cross-section line A-A of Fig. 9A, of the soldering assembly shown in Fig. 9A, with connector pins inserted therein.

20 Fig. 9C is a drawing showing an enlarged view of the soldering assembly shown in Fig. 9B, with connector pins positioned above a plurality of soldering cavities and soldering filler beads sitting on a plurality of soldering cavity sidewalls.

Fig. 9D is a drawing showing an enlarged view of the soldering assembly shown in Fig. 9B, with connector pins inserted in the soldering cavities.

25 Fig. 9E is a drawing showing an enlarged view of the soldering assembly shown in Fig. 9C.

DM MTL/278415-00003/21649652 Fig. 10 is a flowchart showing the sequence of operations for the soldering apparatus shown in Fig. 1 , in accordance with one embodiment.

Fig. 11 is a schematic drawing showing a top elevation view of a soldering apparatus, in accordance with an alternative embodiment.

5 Fig. 12 is a schematic drawing showing a cross-sectioned view of a bead conveyor for the soldering apparatus shown in Fig. 11.

Fig. 13A is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11 , of the soldering apparatus shown in Fig. 11, with the first circuit board positioned above the preheating assembly.

10 Fig. 13B is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11, of the soldering apparatus shown in Fig. 11, with the first circuit board in operative position with the preheating assembly.

Fig. 14A is a schematic drawing showing a side cut-view of the soldering apparatus shown in Fig. 11 , with the first circuit board positioned above the fluid 15 dispensing assembly.

Fig. 14B is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11, of the soldering apparatus shown in Fig. 11, with the first circuit board in operative position with the fluid dispensing assembly.

Fig. 15A is a schematic drawing showing a cross-sectioned view, taken along 20 cross-section line A-A of Fig. 11, of the soldering apparatus shown in Fig. 11 , with the first circuit board positioned above the soldering assembly.

Fig. 15B is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11 , of the soldering apparatus shown in Fig. 11 , with the first circuit board in operative position with the soldering assembly.

25 Fig. 16A is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11 , of the soldering apparatus shown in Fig. 11, after soldering has been performed.

DM_MTL/278415-00003/2164965.2 Fig. 16B is a schematic drawing showing a cross-sectioned view, taken along cross-section line A-A of Fig. 11, of the soldering apparatus shown in Fig. 11 , with the first circuit board being repositioned on the board conveyor.

Further details of the invention and its advantages will be apparent from the 5 detailed description included below.

DETAILED DESCRIPTION

In the following description of the embodiments, references to the accompanying drawings are by way of illustration of an example by which the invention may be practiced. It will be understood that other embodiments may be made without 10 departing from the scope of the invention disclosed.

Now referring to Figs. 1 and 9E, there is shown a soldering apparatus 100 for soldering one or more electronic components 152 to a circuit board 150, in accordance with one embodiment.

In the illustrated embodiment, the circuit board 150 is fitted with a plurality of the 15 electronic components 152, as best shown in Figs. 7A to 9E. Each of the electronic components 152 comprises one or more connector pins 750, each of which are loosely engaged, initially, in a pin receiving opening 950 of the circuit board 150.

The skilled addressee will appreciate that the electronic components 152, and 20 thus the connector pins 750, may be disposed on the circuit board 150 according to various patterns.

Still referring to Figs. 1 and 9E, the soldering apparatus 100 comprises a soldering apparatus frame 102 and a board holder 106 mounted to the soldering apparatus frame 102.

25 The board holder 106 is for holding the circuit board 150 in a substantially horizontal position such that a lower portion 752 of each connector pin 750 extends downwardly from the circuit board 150. The board holder 106 comprises

DM MTL/278415-00003/2164965 2 a board holder frame 118 adapted for securely receiving the circuit board 150 therein to prevent the circuit board 150 from moving relative to the board holder 106 during soldering.

In the embodiment shown in Fig. 1 , the board holder 106 further comprises a

5 frame cover 120 hingedly connected to the board holder frame 118. The frame cover 120 may be closed during soldering to prevent the plurality of electronic components 152 from moving upwardly relative to the circuit board 150.

Additionally, the frame cover 120 may further contact and/or abut the plurality of electronic components 152 to further prevent movement of the plurality of

10 electronic components 152 relative to the circuit board 150 during soldering.

The soldering apparatus 100 further comprises a preheating assembly 108 for heating the lower portion 752 of the connector pin 750 to a first predetermined temperature, or preheating temperature. The soldering apparatus 100 further comprises a flux dispensing assembly 110 for dispensing flux on the lower 15 portion 752 of the connector pin 750 and a soldering filler dispensing assembly, or soldering assembly 112, for applying soldering filler in a molten state on the lower portion 752 of the connector pin 750, as it will become apparent below.

Each of the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 is mounted to the soldering apparatus frame 102 and is 20 movable relative to the board holder 106. These assemblies will be further detailed below.

In the embodiment illustrated in Fig. 1, the soldering apparatus 100 further comprises a soldering apparatus table 104, via which the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 are 25 mounted to the soldering apparatus frame 102. More specifically, the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 are securely mounted to the soldering apparatus table 104, and the soldering apparatus table 104 is mounted to the soldering apparatus frame 102 and movable relative to the board holder 106. It will be appreciated that this

DM MTL/278415-00003/2164965 2 configuration enables the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 to be moved relative to the board holder 106 for location proximal to the connector pins 750, as it will become apparent below.

The soldering assembly 100 further comprises an actuator 130 operatively 5 connected to one of the board holder 106 and the soldering assembly 112. The actuator 130 is configured for moving the board holder 106 and the soldering assembly 112 towards each other, as it will become apparent below.

In the embodiment shown in Fig. 1 , the soldering apparatus table 104 is located below the board holder 106. In this embodiment, the actuator 130 comprises

10 table actuating means 132 operatively connected to the soldering apparatus table 104 for urging vertical movement of the soldering apparatus table 104 relative to the soldering apparatus frame 102. It will be appreciated that this vertical movement of the soldering apparatus table 104 enables the soldering assembly 112, securely mounted to the soldering apparatus table 104, to be selectively

15 moved towards and away from the circuit board 150 mounted in the board holder 106 and thus towards and away from the connector pins 750 of the electronic components 152 fitted in the circuit board 150, as it will become apparent below.

In the illustrated embodiment, the table actuating means 132 comprise a table actuating motor, not shown, driving a chain operatively coupled to a plurality of

20 substantially vertical threaded shafts. The threaded shafts are operatively connected to the soldering apparatus table 104 and are configured such that rotation of the table actuating motor in a first direction moves the soldering apparatus table upwardly and rotation of the table actuating motor in a second direction opposed to the first direction moves the soldering apparatus table 104

25 downwardly. Alternatively, the table actuating means 132 may comprise any actuation means known to the skilled addressee such as a pneumatic actuator, a hydraulic actuator or the like.

In an alternative embodiment, the soldering apparatus 100 does not comprise a soldering apparatus table 104. In this embodiment, the preheating assembly 108,

DM MTL/278415-00003/2164965 2 the flux dispensing assembly 110 and the soldering assembly 112 are instead mounted directly to the soldering apparatus frame 102. In yet another embodiment, the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 are mounted to the soldering apparatus frame 5 102 via the board holder 106, to which they are securely connected.

The skilled addressee will appreciate that the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112 may be mounted to the soldering apparatus frame 102 according to various configurations, as long as the preheating assembly 108, the flux dispensing assembly 110 and the soldering 10 assembly 112 are movable relative to the board holder for location proximal to the connector pins 750.

In one embodiment, the soldering apparatus 100 further comprises positioning means 140 operatively connected to the board holder 106 for selectively positioning the board holder 106 in an operative position with the preheating 15 assembly 108, with the flux dispensing assembly 110 and with the soldering assembly 112.

In the embodiment shown in Fig. 1 , the positioning means 140 comprise a board holder actuator 142 operatively connected to the board holder 106 for urging substantially horizontal movement of the board holder 106 relative to the 20 soldering apparatus frame 102. One skilled in the art will appreciate that the substantially horizontal movement of the board holder 106 enables the circuit board 150, mounted to the board holder 106, to be selectively located proximal to the preheating assembly 108, to the flux dispensing assembly 110 and to the soldering assembly 112.

25 In the illustrated embodiment, the board holder actuator 142 comprises a board actuating motor operatively coupled to a substantially horizontal threaded rod. The substantially horizontal threaded rod is operatively connected to the board holder 106 and is configured such that rotation of the board actuating motor in a first direction moves the board holder 106 in a first substantially horizontal

DM MTL/278415-00003/2164965 2 direction and rotation of the board actuating motor in a second direction opposed to the first direction moves the soldering apparatus table 104 in a second substantially horizontal direction opposed to the first substantially horizontal direction.

5 Alternatively, the board holder actuator 142 may comprise any actuator known to the skilled addressee such as a pneumatic actuator, a hydraulic actuator or the like.

In an alternative embodiment, the soldering apparatus table 104 is not movably mounted to the soldering apparatus frame 102. Instead, the soldering apparatus 10 table 104 is securely mounted to the soldering apparatus frame 102 and the board holder 106 is movably mounted to the soldering apparatus frame 102 such that it may selectively be moved in substantially vertical and horizontal direction. In this embodiment, the actuator 130 therefore comprises the board holder actuator 142.

15 In yet another embodiment, the board holder 106 is securely mounted to the soldering apparatus frame 102 and the soldering apparatus table 104 is movably mounted to the soldering apparatus frame 102 such that it may selectively be moved in substantially vertical and horizontal direction. In this embodiment, the positioning means 140 therefore comprises the table actuating means 132.

20 Still referring to Fig. 1 , the soldering apparatus 100 further comprises a soldering filler delivery assembly 114 for delivering soldering filler to the soldering assembly 112, as it will become apparent below.

Still referring to Fig. 1, the soldering apparatus 100 further comprises a flux circulation unit 116 for heating and circulating flux through the flux dispensing 25 assembly 110, as it will become apparent below. It will be appreciated that the flux circulation unit 116 is provided with flux therein.

DM MTL/278415-00003/2164965 2 Now referring to Figs. 2, 3A and 3B, the soldering apparatus table 104 comprises a flat table top plate 200 on which are securely mounted the preheating assembly 108, the flux dispensing assembly 110 and the soldering assembly 112.

More specifically, the soldering assembly 112 comprises a pair of substantially 5 horizontal soldering bar front and back legs 214 and 216, each extending vertically and upwardly from the table top plate 200. Extending substantially horizontally between the upper ends of the soldering bar front and back legs 214 and 216 is a first body, or soldering bar 218, which will be described in greater details below.

10 Similarly to the soldering assembly 112, the preheating assembly 108 comprises a preheating body, or preheating bar 206, extending substantially horizontally between a pair of preheating bar front and back legs 202 and 204. One skilled in the art will appreciate that in this configuration, the preheating bar front and back front and back legs 202 and 204 are used to securely mount the preheating bar

15 206 to the soldering apparatus table 104, and thus to the soldering apparatus frame 102 via the soldering apparatus table 104.

Similarly to the soldering assembly 112 and the preheating assembly 108, the flux dispensing assembly 110 comprises a pair of flux dispensing bar front and back legs 208 and 210 between which substantially horizontally extends a flux 20 dispensing body, or flux dispensing bar 212. One skilled in the art will appreciate that in this configuration, the flux dispensing bar front and back legs 208 and 210 are used to securely mount the flux dispensing bar 212 to the soldering apparatus table 104, and thus to the soldering apparatus frame 102 via the soldering apparatus table 104.

25 Still referring to Figs. 2, 3A and 3B, the table top plate 200 further comprises a pair of soldering filler delivery conveyor tracks 220 and 222 extending parallel to the length of the table top plate 200, as best shown in Fig. 3A. The soldering filler delivery conveyor tracks 220 and 222 are designed to guide a soldering filler

DM MTL/278415-00003/2164965 2 delivery conveyor 224 in a direction parallel to the length of the table top plate 200, as it will become apparent below.

In the illustrated embodiment, the soldering apparatus table 104 further comprises soldering filler delivery conveyor actuation means 300 operatively 5 connected to the soldering filler delivery conveyor 224 for urging movement of the soldering filler delivery conveyor 224 from a soldering filler container 302 towards the soldering assembly 112, as it will become apparent below.

In the embodiment shown in Figs. 3A and 3B, the soldering filler delivery conveyor actuation means 300 comprise a shaft operatively connected to a

10 pneumatic actuator. In an alternative embodiment, the soldering filler delivery conveyor actuation means 300 comprise a threaded shaft operatively connected to a motor. This configuration would provide great precision in the positioning of the soldering filler delivery conveyor 224. In yet another embodiment, the soldering filler conveyor actuation means 300 comprise a chain driven by a

15 motor. It will be appreciated that the soldering filler conveyor actuation means 300 may comprise any actuations means known to the skilled addressee which would enable the soldering filler delivery conveyor 224 to be urged from the soldering filler container 302 towards the soldering assembly 112.

Now turning to Fig. 4, there are shown the preheating bar 206, the flux 20 dispensing bar 212 and the soldering bar 218 with the preheating bar front leg 202, the flux dispensing bar front leg 208 and the soldering bar front leg 214 removed to show the details of each bar.

In the illustrated embodiment, the soldering bar 218 comprises a central gas diffusing bar 420 sandwiched between a pair of left and right soldering filler 25 receiving bars 422 and 424. The left and right soldering filler receiving bars 422 and 424 each comprise a first upper surface, or soldering bar upper surface 425.

Now referring to Fig. 9E, each of the left and right soldering filler receiving bars 422 and 424 further comprises at least one soldering cavity sidewall 900 extending below the soldering bar upper surface 425. Each soldering cavity

DM MTL/278415-00003/2164965 2 sidewall 900 defines a soldering cavity 426 for receiving the lower portion 752 of one of the connector pins 750 therein, as it will become apparent below.

Still in the illustrated embodiment, the soldering cavity 426 has an open end 904 and a closed end 906. More specifically, the soldering cavity sidewall 900 further 5 comprises a bottom end portion 908 and a side portion 910 extending between the open end 904 and the closed end 906 of the soldering cavity 426.

In an alternative embodiment, the soldering cavity 426 instead extends all the way through the left and right soldering filler receiving bars 422 and 424 and has two opposed open ends. In this embodiment, the skilled addressee will 10 appreciate that the soldering cavity sidewall 900 does not comprise the bottom end portion 908.

Each soldering cavity sidewall 900 is further configured for receiving a predetermined amount of soldering filler in a solid state thereon. In the present embodiment, the predetermined amount of soldering filler in a solid state 15 comprises a soldering filler bead 912, which is manufactured beforehand in a separate operation. As the size of the soldering filler bead 912 is known to a user of the soldering apparatus 100, the amount of soldering filler contained within the soldering filler bead 912 is known as well.

In one embodiment, the soldering filler bead 912 comprises a bead of SAC305 20 soldering alloy. Alternatively, the soldering filler bead 912 may comprise a bead manufactured from any soldering material deemed suitable by the skilled addressee for soldering the electronic component 152 to the circuit board 150.

A person skilled in the art will appreciate that this configuration advantageously enables a user to use a predetermined amount of soldering filler for a soldering 25 operation using the soldering apparatus 100 herein described. Furthermore, in the present embodiment, a single soldering filler bead is used for the soldering of a single connector pin. The skilled addressee will further appreciate that the size of the soldering filler beads 912 may vary according to the size of the connector pins 750.

DM MTL/278415-00003/2164965 2 In the illustrated embodiment, the soldering cavity sidewall 900 further defines a cavity rim 914 which has a circular configuration. In order to enable the soldering filler bead 912 to rest on the cavity rim 914, the diameter of the soldering filler bead 912 is greater than the diameter of the cavity rim 914.

5 More specifically, the cavity rim 914 comprises a bead receiving surface 916 tapering from the soldering bar upper surface 425 inwardly into the soldering bar 218. The bead receiving surface 916 defines a bead receiving recess 918 sized and shaped to receive at least part of the soldering filler bead 912 therein.

In an alternative embodiment, the diameter of the soldering filler bead 912 is 10 smaller than the diameter of the cavity rim 914 and the soldering filler bead 912 is instead placed directly inside the soldering cavity 426, on the bottom end portion 908 of the soldering cavity sidewall 900.

In one embodiment, the soldering filler bead 912 has a diameter of about 1.27 mm. The skilled addressee will appreciate that the soldering filler bead 912 may 15 have a different diameter, as long as the soldering filler bead 912 contains an amount of soldering filler suitable for soldering the connector pin 750 to the circuit board 150.

In yet another embodiment, the predetermined amount of soldering filler does not comprise the soldering filler bead 912, but instead comprises a soldering filler

20 disc having a diameter greater than the diameter of the cavity rim 914. In this embodiment, the cavity sidewall 900 comprises a flange extending away from the cavity rim 914 such that the soldering filler disc may rest on the flange. The flange may form an integral structure with the soldering bar 218 or, alternatively, the flange may rest over an area of the soldering bar upper surface 425

25 surrounding the cavity rim 914.

The skilled addressee will appreciate that the predetermined amount of soldering filler in a solid state may be provided in any other shape and size that the skilled addressee may deem fit for soldering the connector pin 750 to the circuit board 150.

DM MTL/278415-00003/2164965 2 Now referring back to Fig. 4, it will further be appreciated by the skilled addressee that the soldering cavities 426 are arranged according to a pattern corresponding to a pattern of the connector pins 152 engaged in the circuit board 150.

The soldering assembly 112 further comprises a first heating mechanism 5 thermally connected to the soldering cavity sidewall 900. The first heating mechanism is for heating the predetermined amount of soldering filler to a predetermined temperature greater than the melting temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler.

10 In the embodiment shown in Fig. 4, the first heating mechanism comprises a pair of left and right heat providing bars 428 and 430, between which the central gas diffusing bar 420 and the left and right soldering filler receiving bars 422 and 424 are sandwiched. The first heating mechanism further comprises heating means, not shown, operatively connected to the left and right heat providing bars 428 and

15 430 for providing heat to the predetermined amount of soldering filler received on the soldering cavity sidewalls 900. In the illustrated embodiment, the heat is provided by conduction to the left and right soldering filler receiving bars 422 and 424, as it will become apparent below.

The soldering cavities 426 are also in fluid communication with a gas source, not 20 shown, for pushing upwardly on the soldering filler bead 912 resting on the soldering cavity sidewall 900, as it will become apparent below.

Alternatively, the soldering bar 218 may not comprise comprises a central gas diffusing bar 420, a pair of left and right soldering filler receiving bars 422 and 424 and a pair of left and right heat providing bars 428 and 430. In such an 25 embodiment, the central gas diffusing bar 420, the pair of left and right soldering filler receiving bars 422 and 424 and the pair of left and right heat providing bars 428 and 430 are instead provided as a single bar operatively connected to the heating means, not shown.

DM MTL/278415-00003/2164965 2 In yet another embodiment, the soldering assembly 112 does not comprise a soldering bar 218. In this embodiment, the soldering assembly 112 instead comprises a plate or any other kind of structure known to the skilled addressee on which cavities may be defined in accordance with a desired pattern.

5 Still referring to Fig. 4, the preheating bar 206 comprises a central support bar 400 sandwiched between a pair of left and right pin receiving bars 402 and 404. The left and right pin receiving bars 402 and 404 each comprises a second upper surface, or preheating bar surface 405.

Now referring to Fig. 7D, each of the pair of left and right pin receiving bars 402 10 and 404 comprises at least one preheating cavity sidewall 760 extending below the preheating bar surface 405. Each preheating cavity sidewall 760 defines a preheating cavity 406 for receiving the lower portion 752 of one of the connector pins 750 therein, as it will become apparent below.

Referring back to Fig. 4, it will be appreciated by the skilled addressee that in the 15 present embodiment, the preheating cavities 406 are arranged according to a pattern corresponding to the pattern of the connector pins 152.

The preheating assembly 108 further comprises a second heating mechanism thermally connected to each preheating cavity sidewall 760. The second heating mechanism is for heating the lower portion 752 of the connector pin 750 engaged 20 in the preheating cavity 406 to the preheating temperature.

In the embodiment shown in Fig. 4, the second heating mechanism comprises a pair of left and right heat providing bars 408 and 410, between which are sandwiched the central support bar 400 and the left and right pin receiving bars 402 and 404. The second heating mechanism further comprises preheating 25 means, not shown, operatively connected to the left and right heat providing bars 408 and 410 for providing heat to the connector pins 750 through conduction to the left and right pin receiving bars 402 and 404 and through the plurality of preheating cavities 406, as it will become apparent below.

DM MTL/278415-00003/2164965 2 In an alternative embodiment, the left pin receiving bar 402 and the left heat providing bar 408 are provided as a single left bar and the right pin receiving bar 404 and the right heat providing bar 410 are provided as a single right bar.

In yet another embodiment, the preheating bar 206 does not comprise the central 5 support bar 400, the pair of left and right pin receiving bars 402 and 404 and the pair of left and right heat providing bars 408 and 410. In such an embodiment, the central support bar 400, the left and right heat diffusing bars 402 and 404 and the left and right heat providing bars 408 and 410 are instead provided as a single bar operatively connected to preheating means, not shown.

10 In yet another embodiment, the preheating assembly 108 does not comprise a preheating bar 206. In this embodiment, the preheating assembly 108 instead comprises a plate or any other kind of structure known to the skilled addressee on which cavities may be defined in accordance with a desired pattern.

Still referring to Fig. 4, the flux dispensing bar 212 comprises a central flux

15 diffusing bar 412 sandwiched between a pair of left and right pin receiving bars

414 and 416. Similarly to the left and right pin receiving bars 402 and 404 of the preheating bar 206, the left and right pin receiving bars 414 and 416 each comprise a third upper surface, or flux dispensing bar upper surface 417, and at least one flux dispensing cavity sidewall, not shown, extending below the flux

20 dispensing bar upper surface 417. Each flux dispensing cavity sidewall defines a flux dispensing cavity 418 for receiving the lower portion 752 of the connector pin

750.

Similarly to the preheating cavities 406, it will be appreciated by the skilled addressee that the flux dispensing cavities 418 are arranged according to a 25 pattern corresponding to the pattern of the connector pins 152.

Alternatively, the flux dispensing bar 212 may not comprise a central flux diffusing bar 412 and a pair of left and right pin receiving bars 414 and 416. In such an embodiment, the central flux diffusing bar 412 and the left and right pin receiving

DM MTL/278415-00003/2164965 2 bars 414 and 416 are instead provided as a single bar operatively connected to the flux circulation unit 116, not shown.

In yet another embodiment, the flux dispensing assembly 110 does not comprise a flux dispensing bar 212. In this embodiment, the flux dispensing assembly 110 5 instead comprises a plate or any other kind of structure known to the skilled addressee on which cavities may be defined in accordance with a desired pattern.

Now referring to Figs. 3A and 4, the flux dispensing cavities 418 are in fluid communication with the flux diffusing bar 412 which, in turn, is in fluid 10 communication with the flux circulation unit 116, not shown in Figs. 3A and 4.

More specifically, the flux dispensing bar 212 further comprises an inlet port, not shown, in fluid communication with the flux dispensing cavities 418. The inlet port is connectable to a flux source for providing flux to the lower end 752 of the connector pins 750 engaged in the flux dispensing cavities 418. The flux 15 dispensing bar 212 further comprises an outlet port, also not shown, in fluid communication with the fluid dispensing cavities 418 for removing used flux from the flux dispensing cavities 418. In one embodiment, the inlet port and the outlet port are both operatively connected to the flux circulation unit 116, as it will become apparent below.

20 Now referring to Figs. 5A and 5B, there is shown the soldering filler delivery assembly, or bead delivery assembly 114, in accordance with one embodiment. The bead delivery assembly 114 comprises the soldering filler container, or bead reservoir 302, provided with a plurality of soldering filler beads therein.

In the illustrated embodiment, the bead reservoir 302 further comprises a 25 soldering filler platform 502, which is operatively coupled to soldering filler platform actuation means, not shown, for selectively raising and lowering the soldering filler platform 502. The soldering filler platform 502 comprises a top platform surface 503 provided with a plurality of upward-facing soldering filler lower receptacles 504, each of the soldering filler lower receptacles 504 being

DM MTL/278415-00003/2164965 2 adapted to receive a single soldering filler bead. More specifically, the soldering filler lower receptacles 504 are arranged in a pattern corresponding to the pattern of the connector pins, not shown in Figs. 5A and 5B.

The bead delivery assembly 114 further comprises a bead outlet assembly 550 in 5 communication with the bead reservoir 302. The bead outlet assembly 550 is movable relative to the soldering bar 218, not shown in Figs. 5A and 5B, and is positionable over the soldering cavities 426 for placing a single soldering filler bead 912 on each of the soldering cavity sidewalls 900.

In the illustrated embodiment, the bead outlet assembly 550 comprises the 10 soldering filler delivery conveyor 224. More specifically, the soldering filler delivery conveyor 224 is provided with a plurality of downward-facing soldering filler upper receptacles 506, each of the soldering filler lower receptacles 504 being adapted to receive a single soldering filler bead 912 thereon, as it will become apparent below. Similarly to the soldering filler lower receptacles 504, 15 the soldering filler upper receptacles 506 are arranged in a pattern corresponding to the pattern of the connector pins 750 and positioned such that the downward- facing soldering filler upper receptacles 506 are vertically aligned with the upward-facing soldering filler upper receptacles 504, not shown in Fig. 5B.

In one embodiment, the soldering filler upper receptacles 506 are in fluid 20 communication with a first vacuum source, not shown, operatively coupled to the soldering filler delivery conveyor 224, as it will become apparent below.

The soldering filler delivery conveyor 224 is further provided with soldering filler delivery conveyor vertical side brackets 508 and 510, as best shown in Fig. 5A, adapted to slidingly engage the soldering filler delivery conveyor tracks 220 and 25 222. Additionally, the soldering filler delivery conveyor 224 is operatively connected to the soldering filler delivery conveyor means, not shown in Figs. 5A and 5B, to enable linear horizontal movement of the soldering filler delivery conveyor 224.

DM MTL/278415-00003/2164965 2 The skilled addressee will appreciate that this configuration restricts the movement of the soldering filler delivery conveyor 224 to a linear horizontal movement along the soldering filler delivery conveyor tracks 220 and 222.

The operation of delivering soldering filler from the soldering filler container 500 5 to the soldering filler dispensing assembly 112, not shown in Figs. 5A and 5B will now be described.

Soldering filler beads 912 are first provided into the bead reservoir 302 until the amount of soldering filler beads inside the soldering filler container 302 reaches a given level, hereafter referred to as the soldering filler beads level. The soldering 10 filler platform 502 is then lowered using the soldering filler platform actuation means, not shown, until the top platform surface 503 is positioned below the soldering filler beads level.

The skilled addressee will appreciate that the lowering of the platform top surface 503 below the soldering filler beads level creates a depression in the amount of 15 soldering filler beads present inside the bead reservoir 302, thereby urging the soldering beads located above the platform top surface 503 to move towards the platform top surface 503 and the soldering filler lower receptacles 504 by gravity.

In one embodiment, the soldering filler platform 502 is further coupled to a second vacuum source, not shown, the soldering filler lower receptacles 504 20 being in fluid communication with the second vacuum source. It will be appreciated by the skilled addressee that this configuration further contributes to the soldering beads located above the platform top surface 503 being urged towards the soldering filler lower receptacles 504.

The soldering filler platform 502 is then raised using the soldering platform 25 actuation means, not shown. The skilled addressee will appreciate that when the top platform surface 503 is moved above the soldering filler beads height, a single bead sits on each of the soldering filler lower receptacles 504. The skilled addressee will further appreciate that this configuration is made possible by the

DM MTL/278415-00003/2164965 2 fact that each of the soldering filler lower receptacles 504 has a circular shape and a diameter lesser than a single soldering filler bead.

The soldering filler platform 502 is raised until the vertical distance between the soldering filler beads sitting on the soldering filler lower receptacles 504 and the 5 soldering filler upper receptacles 506 is such that the force of the first vacuum source, being activated, is sufficient for the soldering filler beads sitting on the soldering filler lower receptacles 504 to move upwardly and rest on the soldering filler upper receptacles 506.

The skilled addressee will appreciate that, similarly to the soldering filler beads 10 resting on each of the soldering filler lower receptacles 504, this configuration is made possible by the fact that each of the soldering filler upper receptacles 506 has a circular shape and a diameter lesser than a single soldering filler bead.

The skilled addressee will further appreciate that the force exerted by the vacuum on the soldering filler beads is sufficient to counter the effect of gravity thereon.

15 The soldering filler conveyor 224 is then moved along the soldering filler conveyor tracks using the soldering filler conveyor actuation means 300 until the soldering filler upper receptacles 506 are vertically aligned with the plurality of soldering cavities 426, not shown in Figs. 5A and 5B. It will be appreciated that, the first vacuum source still being activated, the soldering filler beads are

20 prevented from moving in reference to the soldering filler conveyor 224 during this operation.

The soldering apparatus table 104 is then raised such that the soldering filler beads resting on each of the soldering filler upper receptacles 506 may be deposited onto the soldering cavities 426, not shown in Figs. 5A and 5B. The first 25 vacuum source is then deactivated such that the soldering filler beads resting on each of the soldering filler upper receptacles 506 are deposited onto the soldering cavities 426, not shown in Figs. 5A and 5B, by gravity.

DM MTL/278415-00003/2164965 2 The skilled addressee will further appreciate that the purpose of the soldering filler delivery conveyor 224 is to deliver soldering filler from the bead reservoir 302 to the soldering assembly 112, not shown in Figs. 5A and 5B. Therefore, the soldering filler delivery conveyor tracks 220 and 222 are designed to have a 5 sufficient length such that the soldering filler delivery conveyor 224 may horizontally travel from a first position whereat the soldering filler upper receptacles 506 are vertically aligned with the soldering filler lower receptacles 504 to a second position whereat the soldering filler upper receptacles 506 are aligned with soldering filler dispensing cavities, not shown in Figs. 5A and 5B, 10 provided with the soldering assembly 112, not shown in Figs. 5A and 5B, as it will become apparent below.

In an alternative embodiment, the soldering apparatus 100 does not comprise the bead delivery assembly 114. Soldering filler may instead be delivered to the soldering assembly 112 using a hand of an operator, tweezers or other means of 15 delivery a person skilled in the art may deem appropriate.

Now turning to Fig. 6, there is shown a flux circulation unit 116. The flux circulation unit 116 comprises a flux reservoir 650 in which flux is provided. The flux reservoir 650 comprises a fluid circulation unit outlet 600 operatively connected to the inlet port of the flux dispensing bar 212 by means of a hose, not 20 shown.

The flux circulation unit 116 further comprises a flux circulation pump 602 operatively coupled to the flux reservoir 650. The flux circulation pump 602 is for urging movement of flux from the flux reservoir to the inlet port and from the outlet port to the flux reservoir 650, thereby forming a closed flux circulation 25 circuit.

In one embodiment, the flux circulation pump 602 may be a peristaltic pump. In this embodiment, flux is circulated through a tube which is cyclically compressed by a rotating member, the rotating member being actuated by actuation means such as a motor. Flux is thereby substantially isolated from the rotating member

DM MTL/278415-00003/2164965 2 and actuation means, and contamination of flux is therefore prevented. This advantageously enhances the quality of the soldering performed with the soldering apparatus 100, as one skilled in the art will appreciate.

In one embodiment, the flux circulation unit 116 further comprises a third heating

5 mechanism, or flux heating means 604, thermally connected to the flux reservoir

650 for heating the flux to the preheating temperature. The skilled addressee will appreciate that this also advantageously enhances the quality of the soldering performed with the soldering apparatus 100. More specifically, the flux heating means 604 may heat the flux from an initial flux temperature lower than the

10 preheating temperature to the preheating temperature and/or maintain the flux at the preheating temperature.

In the embodiment shown in Fig. 6, the flux circulation unit 116 comprises a band heater 606. It will however be appreciated that any heating means known to the skilled addressee may be used to heat the flux to the preheating temperature.

15 Having described the components of the soldering apparatus 100 in accordance with one embodiment, a preferred mode of operation will now be described, with references to Figs. 7A to 10.

The circuit board 150 fitted with the plurality of electronic components 152 mounted thereon is first provided. The connector pins of the plurality of electronic 20 components 152 are loosely engaged in the pin receiving openings beforehand manually or, alternatively, using a device known to the skilled addressee such as an electronic component insertion machine or the like.

The plurality of electronic components 152 are further mounted on the circuit board 150 in series, as shown in Figs. 7A to 9D. In the embodiment shown in 25 Figs. 7A to 9D, all series having the same pattern. More specifically, the series of electronic components 152 comprise parallel rows of electronic components 152, as best shown in Fig. 1.

DM MTL/278415-00003/2164965 2 According to step 1000, the circuit board 150 is then positioned substantially horizontally such that the lower portion 752 of the connector pins 750 extends downwardly from the circuit board 150. In the illustrated embodiment, this step is performed by placing the circuit board 150 into the circuit board holder frame 118, 5 not shown in Figs. 7A to 9D. The circuit board holder frame cover 120 is then closed.

Now referring to Figs. 7A to 7C, the circuit board 150 is conveyed towards the preheating assembly 108. The board holder 106, not shown in Figs. 7A to 7C, is positioned using the board holder actuator 142 such that a first series 700 of 10 connector pins 750 is vertically aligned with the corresponding preheating cavities 406 of the preheating bar 206.

According to step 1002, the lower portion 752 of the connector pins 750 of the first series 700 is then heated to the preheating temperature. In the illustrated embodiment, the preheating bar 206 is heated to the preheating temperature 15 using the second heating mechanism, not shown. The soldering apparatus table 104 is then raised vertically until the lower ends of the first series 700 of connector pins 750 are inserted into the corresponding preheating cavities 406, thereby heating the first series 700 of connector pins 750 to the preheating temperature.

20 In one embodiment, the preheating temperature is about 100⁰C. The skilled addressee will appreciate that, alternatively, the preheating temperature may be any temperature suitable for heating the lower portion 752 of the connector pins 750 prior to soldering.

In one embodiment shown in Fig. 7C, the first series 700 of connector pins 750 25 do not contact the preheating bar 206 when the soldering apparatus table 104 is raised, the heat being transmitted from the preheating bar 206 to the first series 700 of connector pins 750 by convection.

In an alternative embodiment, the first series 700 of connector pins 750 contact the bottom of the corresponding preheating cavities 406, the heat being

DM MTL/278415-00003/2164965 2 transmitted from the preheating bar 206 to the first series 700 of connector pins 750 by conduction.

In yet another embodiment, the soldering apparatus 100 does not comprise a preheating assembly 108. The lower portions 752 of each of the connector pins 5 750 are instead preheated manually using tools known to the skilled addressee such as a soldering iron or the like.

The soldering apparatus table 104, not shown in Figs. 7A to 7C, is then lowered until the first series 700 of connector pins 750 is positioned above the corresponding preheating cavities 406. The circuit board 150 is then conveyed 10 from the preheating assembly 108 towards the flux dispensing assembly 110. More specifically, the board holder 106, not shown in Figs. 7A to 7C, is moved using the board holder actuator, not shown, until the first series 700 of connector pins 750 is vertically aligned with the corresponding flux dispensing cavities 418, best shown in Figs. 8A to 8C.

15 According to step 1004, flux is then applied on the lower portion 752 of the connector pin 750. More specifically, the soldering apparatus table 104 is raised vertically until the lower ends 752 of the first series 700 of connector pins 750 are inserted into the corresponding flux dispensing cavities 418, as shown in Figs. 8A to 8C. Flux is provided to the flux dispensing bar 218 by means of the flux

20 circulating unit 116 and is applied to the first series 700 of connector pins 750 through the flux dispensing cavities 418.

The skilled addressee will appreciate that the flux being heated to the predetermined temperature by means of the flux circulation unit 116, the first series 700 of connector pins 750 are maintained at the predetermined 25 temperature by the application of flux thereon. Therefore, the flux dispensing bar 212 does not comprise heating means. In an alternative embodiment, the flux dispensing bar 212 comprises heating means for heating the first series 700 of connector pins 750 to the predetermined temperature.

DM MTL/278415-00003/2164965 2 In one embodiment, the flux circulation pump 602 provides a continuous circulation of flux between the flux circulation unit 116 and the flux dispensing assembly 110.

In an alternative embodiment, the soldering apparatus 100 does not comprise a 5 flux dispensing assembly 110. The flux is instead applied to the lower end 752 of the connector pins 750 manually using apparatuses known to the skilled addressee such as a bristle brush, a flux pen, a bottle with a needle-shaped applicator or the like.

According to step 1006, the predetermined amount of soldering filler in a solid 10 state is then provided on the soldering cavity sidewall. In the illustrated embodiment, soldering filler beads 912 are delivered from the bead reservoir 302 to the soldering cavity sidewall 900 using the bead delivery assembly 114 in the manner described here above.

In one embodiment, the electronic components 152 are positioned on the circuit

15 board 150 such that the connector pins 750 are disposed in a first predetermined pattern. A number of soldering cavities 426 from the plurality of soldering cavities

426 are selected, the selected soldering cavities 426 being disposed in a second predetermined pattern similar to the first predetermined pattern. One soldering bead 912 is then provided on the cavity sidewall 900 of each of the selected

20 soldering cavities 426. The number of soldering cavities 426 may be selected manually. Alternatively, the number of soldering cavities 426 may be selected automatically by electronic control means, such as a computer for instance, according to the type of circuit board 150 to be used with the soldering apparatus

100. The skilled addressee will appreciate that this advantageously enables a

25 user to save time and to reduce production costs when soldering electronic components to a large quantity of circuit boards having various designs.

The soldering apparatus table 104 is then lowered until the first series 700 of connector pins 750 is positioned above the corresponding flux dispensing cavities 418. The board holder 106 is then moved towards the soldering assembly 112

DM MTL/278415-00003/2164965 2 using the board holder actuator 142 until the first series of connector pins 700 is vertically aligned with the corresponding soldering cavities 426.

According to step 1008, the predetermined amount of soldering filler is then heated to the second predetermined temperature greater than the melting 5 temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler. In the illustrated embodiment, the first heating mechanism, not shown, of the soldering assembly 112 is activated to heat the soldering bar 218 to a second predetermined temperature equal to or greater than the melting temperature of the soldering filler, causing the soldering 10 filler beads 912 to melt, as shown in Figs. 9A to 9C. More specifically, the soldering filler beads 912 resting on the soldering cavity sidewalls 900 are heated by heat transmitted from the left and right soldering filler receiving bars 422 and 424 through the soldering cavities 426.

It will be appreciated that the molten soldering filler is urged downwardly by 15 gravity. To counteract this effect, the gas source, not shown, operatively coupled to the soldering cavities 426 is activated and gas provided by the gas source pushes upwardly on the molten soldering filler.

According to step 1010, the lower portion 752 of each of the connector pins 750 is then inserted in a respective one of the soldering cavities 426 to thereby solder

20 the electronic component 152 to the circuit board 150. In the illustrated embodiment, the soldering apparatus table 104 is raised vertically until the lower ends of the first series 700 of connector pins 750 are inserted into the corresponding soldering cavities 426 containing molten soldering filler. The molten soldering filler is urged upwardly towards the first series 700 of connector

25 pins 750 by the gas source, not shown, until the molten soldering filler contacts the first series 700 of connector pins 752 and the underside of the circuit board 150, effectively soldering the first series 700 of connector pins 750 to the circuit board 150.

DM MTL/278415-00003/2164965 2 In one embodiment, the gas source, not shown, provides an inert gas such as argon of the like to the soldering cavities 426 to prevent the formation of oxides during the soldering process. In an alternative embodiment, the gas source, not shown, provides air to the soldering cavities 426.

5 In one embodiment, the molten soldering filler may further move up from the lower end 752 of the connector pin 750 towards the circuit board 150 by capillarity, which is well known in the art. This further enhances the quality of the soldering performed using the soldering apparatus 100, which is of great advantage.

10 It will be appreciated that in this embodiment, the heating of the predetermined amount of soldering filler and the inserting of the lower portion 752 of the connector pins 750 in the soldering cavities 426 are performed substantially simultaneously. This enables the soldering cavities 426 to extend all the way through the soldering bar 218, which may advantageously prevent unwanted

15 accumulation of molten soldering filler in the soldering cavities 426 and facilitate cleaning of the soldering cavities 426.

In an alternative embodiment, the heating of the predetermined amount of soldering filler may be performed prior to the inserting of the lower portion 752 of the connector pins 750 in the soldering cavities 426. For instance, in an 20 embodiment in which the soldering cavities 426 do not extend all the way through the soldering bar 218, the predetermined amount of soldering filler may first be melted and received in each of the soldering cavities 426, and the lower portion 752 of the connector pins 750 may subsequently be inserted in the soldering cavities 426 containing molten soldering filler.

25 In an alternative embodiment, the providing of the predetermined amount of soldering filler in a solid state may be performed at a different time. In one embodiment, the soldering filler beads 912 are placed on the soldering cavity sidewalls 900 prior to the heating of the lower portion 752of the connector pins 750 to prevent interference between the soldering filler delivery conveyor 224 and

DM MTL/278415-00003/2164965.2 the board holder 106. It will be appreciated that the soldering filler beads 912 may be placed on the soldering cavity sidewalls 900 at any time deemed suitable by the skilled addressee, as long as the soldering filler beads 912 are placed on the soldering cavity sidewalls 900 prior to the heating of the predetermined amount of 5 soldering filler.

With references to Figs. 11 to 16B, a soldering apparatus 1100 according to an alternative embodiment will now be described.

The soldering apparatus 1100 is substantially similar to the soldering apparatus 100 described in Figs. 1 to 9E. The soldering apparatus 1100 comprises a board 10 holder 1102 for holding a first circuit board 1150 in a substantially horizontal position and positioning means 1104 for selectively positioning the board holder 1102 in an operative position with a preheating assembly 1106, with a flux dispensing assembly 1108 and with a soldering assembly 1110.

In the embodiment shown in Figs. 11 to 16B, the positioning means 1104 15 comprise a first conveyor, or board conveyor 1112, adapted for conveying a plurality of circuit boards towards a soldering apparatus table 1114 on which are securely mounted the preheating assembly 1106, the flux dispensing assembly 1108 and the soldering assembly 1110.

In one embodiment, the board conveyor 1112 comprises a belt conveyor on 20 which a plurality of circuit boards are placed. It will be appreciated that the board conveyor 1112 may comprise any type of conveyor deemed suitable by the skilled addressee for conveying circuit boards.

Still referring to Figs. 11 to 16B, the positioning means 1104 further comprise stopping means 1116 adapted to abut the first circuit board 1150 such that the 25 first circuit board 1150 is substantially aligned with the preheating assembly 1106, the flux dispensing assembly 1108 and the soldering assembly 1110. In the illustrated embodiment, the stopping means 1116 comprise a pair of stopping arms 1118 positionable over the board conveyor 1112 to hold the first circuit board 1150 in alignment with the preheating assembly 1106, the flux dispensing

DM MTL/278415-00003/2164965 2 assembly 1108 and the soldering assembly 1110. Alternatively, the stopping means 1116 may comprise any other means deemed suitable by the skilled addressee for stopping the first circuit board 1150 conveyed on the board conveyor 1112.

5 In the embodiment shown in Figs. 11 to 16B₁ the board holder 1102 further comprises lifting means 1120 engageable with the first circuit board 1150 for lifting the first circuit board 1150 from the board conveyor 1112. The lifting means 1120 may further be used for carrying the first circuit board 1150 towards the soldering apparatus table 1114. The lifting means 1120 may comprise suction 10 cups, a vacuum assembly comprising nozzles adapted to contact the first circuit board 1150 or any other lifting means known to the skilled addressee which may be suitable for lifting circuit boards 1150.

In the embodiment shown in Figs. 11 to 16B, the soldering apparatus 1100 further comprises a bead conveyor 1200 for conveying soldering filler beads 912

15 to the soldering assembly 1110. The bead conveyor 1200 comprises a bead reservoir 1202 located over a bead outlet assembly 1204. More specifically, the bead outlet assembly 1204 comprises a first outlet body, or bottom plate 1206, in which a first opening, or bottom opening 1208, sized and shaped to enable the passage of one soldering filler bead 912 is defined. The bead conveyor 1200

20 further comprises a second body, or top plate 1210, located above the bottom plate 1206 and a third body, or middle plate 1212, sandwiched between the bottom plate 1206 and the top plate 1210. The top plate 1210 comprises a second opening, or top opening 1214, in communication with the bead reservoir 1202. A bead delivery passageway 1216 enables the soldering filler beads 912 to

25 travel from the bead reservoir 1202 to the top opening 1214.

Still in the embodiment shown in Figs. 11 to 16B, the middle plate 1212 comprises a third opening, or central opening 1218, sized and shaped to receive a single soldering bead. The middle plate 1212 is movable relative to the top plate 1210 and the bottom plate 1206 such that the central opening 1218 may 30 selectively be registered with the top opening 1214 and the bottom opening 1208.

DM MTL/278415-00003/2164965 2 The skilled addressee will appreciate that this configuration enables the bead conveyor 1200 to place the single soldering filler bead 912 on the soldering cavity sidewalls 900 one at a time. In this embodiment, the bead conveyor 1200 may further be movable relative to the soldering assembly 1110 such that the 5 soldering filler beads 912 may be disposed on the soldering assembly 1110 according to a desired pattern.

In this embodiment, the first circuit board 1150 is first placed on the board conveyor 1112. A plurality of other circuit boards 1152 may also be placed on the board conveyor 1112 in spaced-apart relation with each other. The first circuit

10 board 1150 is then conveyed on the board conveyor 1112 until the first circuit board 1150 is substantially aligned with the preheating assembly 1106, the flux dispensing assembly 1108 and the soldering assembly 1110. The stopping means 1116 are then activated and the first circuit board 1150 is stopped. The lifting means 1120 then engage the first circuit board 1150 and lift the first circuit

15 board 1150 from the board conveyor 1112.

The soldering apparatus table 1114 is then moved until the preheating assembly 1106 is positioned below the first circuit board 1150. The operation of soldering may now be performed, according to the method as described hereabove. In this embodiment, the lifting means 1120 successively lifts and lowers the first circuit 20 board 1150 while the soldering apparatus table 1114 moves underneath the lifted first circuit board 1150 to successively position the preheating assembly 1106, the flux dispensing assembly 1108 and the soldering assembly 1110 below the first circuit board 1150.

When soldering is completed, the lifting means 1120 lowers the first circuit board 25 1150 back onto the board conveyor 1112 and disengages the first circuit board 1150. The stopping means 1118 are then deactivated and the first circuit board 1150 is conveyed away from the soldering apparatus table 1114 by the board conveyor 1112. The process may now start over with a second circuit board 1154.

DM MTL/278415-00003/2164965 2 The skilled addressee will appreciate that the alignment of the preheating assembly, the flux dispensing assembly and the soldering assembly facilitates the automation of the soldering operation by limiting the quantity, length and nature of movements needed from the components of the soldering apparatus 5 during operation of the soldering apparatus. Therefore, in the embodiments shown in Figs. 1 to 16B, the preheating assembly, the flux dispensing assembly and the soldering assembly are positioned parallel to one another on a common horizontal plane.

Furthermore, in the embodiments shown in Figs. 1 to 16B, the flux dispensing 10 assembly is positioned next to the preheating assembly at a first given distance and the soldering assembly is positioned next to the flux dispensing assembly at a second given distance equal to the first given distance.

The skilled addressee will appreciate that this configuration enables soldering of a circuit board comprising a plurality of series of connector pins positioned next to 15 each other and at a third given distance from each other, the third given distance being equal to the first and second equal given distance.

For instance, with references to Figs. 8A and 9A, during application of flux on a first series of connector pins 700, a second series of connector pins 702 located at the third given distance on the left side of the first series of connector pins may 20 be preheated. Similarly, during application of soldering filler on the first series of connector pins 700, flux may be applied to the second series of connector pins 702 located at the third given distance on the left side of the first series of connector pins 700.

It will be appreciated that this configuration enables a plurality of electronic 25 components to be soldered to a circuit board without requiring the steps of removing the circuit board from the board holder or of manually providing soldering filler in between soldering of multiple connector pins or multiple series thereof. This configuration thereby provides a user with a gain of time when soldering using the present invention. In one embodiment and under certain

DM MTL/278415-00003/2164965 2 circumstances, the soldering of multiple series of connector pins may be accomplished in about 12 seconds, or about 10 times faster than a soldering apparatus of the prior art.

Furthermore, as the predetermined amount of soldering filler, in the embodiments 5 shown, is provided as beads, the molten soldering filler used for the soldering of a first connector pin does not come in contact with the molten soldering filler used for the soldering of a second connector pin. This configuration therefore prevents contamination of soldering filler by oxides produced during a soldering operation, giving it great advantage over soldering methods of the prior art.

10 It will be appreciated that the predetermination of the quantity of soldering filler used in a soldering operation and the fact that the connector pin is inserted in the soldering cavity both contribute to providing a substantially thorough application of soldering filler on a connector pin. Such substantially thorough application of soldering filler on the connector pin may provide more durable solders than

15 solders produced by one of the methods of the prior art.

It will also be appreciated that such substantially thorough application of soldering filler on a connector pin further provides soldering of greater quality than a soldering method according to prior art. This may result into a significant reduction of circuit boards being discarded due to poor quality of soldering 20 compared to the soldering methods of the prior art, giving the present invention an appreciable cost advantage over methods and apparatuses of the prior art.

Although the above description relates to a specific preferred embodiment as presently contemplated by the inventor, it will be understood that the invention in its broad aspect includes mechanical and functional equivalents of the elements 25 described herein.

DM MTL/278415-00003/2164965 2

Claims

CLAIMS:

1. A method for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening defined in the circuit board, the method comprising:

- positioning the circuit board substantially horizontally such that a lower portion of the connector pin extends downwardly from the circuit board;

- heating the lower portion of the connector pin to a first predetermined temperature;

- applying flux onto the connector pin, the flux being at the first predetermined temperature;

- providing a predetermined amount of soldering filler in a solid state on a soldering cavity sidewall extending below an upper surface of a body, the soldering cavity sidewall defining a soldering cavity;

- heating the predetermined amount of soldering filler to a second predetermined temperature greater than the melting temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler; and

- inserting the lower portion of the connector pin in the soldering cavity to thereby solder the electronic component to the circuit board.

2. The method as claimed in claim 1, wherein the heating of the predetermined amount of soldering filler further comprises heating the soldering cavity sidewall to the second predetermined temperature.

3. The method as claimed in any one of claims 1 and 2, wherein the predetermined amount of soldering filler in a solid state comprises a soldering filler bead.

4. The method as claimed in claim 3, wherein the providing of a predetermined amount of soldering filler further comprising delivering the

DM MTL/278415-00003/2164965 2 soldering filler bead from a bead reservoir to the soldering cavity sidewall using a bead delivery assembly mounted to the frame and movable relative to the body.

5. The method as claimed in any one of claims 3 and 4, wherein the soldering cavity sidewall defines a cavity rim at an upper end thereof; further wherein the providing of a predetermined amount of soldering filler in a solid state comprises placing the soldering filler bead on the cavity rim.

6. The method as claimed in claim 5, wherein the cavity rim is circular; and further wherein the diameter of the soldering filler bead is greater than the diameter of the cavity in order to enable the soldering filler bead to rest onto the cavity rim.

7. The method as claimed in claim 6, wherein the cavity rim comprises a bead receiving surface tapering from the upper surface inwardly into the body, the bead receiving surface defining a bead receiving recess sized and shaped to receive at least part of the soldering filler bead therein.

8. The method as claimed in any one of claims 3 to 7, wherein the soldering filler bead has a diameter of about 1.27 mm.

9. The method as claimed in any one of claims 3 to 8, wherein the soldering filler bead comprises a bead of SAC305 soldering alloy.

10. The method as claimed in any one of claims 1 to 9, wherein the upper surface comprises a plurality of soldering cavity sidewalls extending therebelow defining a plurality of soldering cavities, each adapted to receive the lower portion of one of a plurality of connector pins therein; further wherein the providing of a predetermined amount of soldering filler comprises placing a soldering filler bead on at least one of the soldering cavity sidewalls.

11. The method as claimed in claim 10, wherein the electronic components are positioned on the circuit board such that the connector pins are disposed in a first predetermined pattern; further wherein the providing of a predetermined amount of soldering filler comprises:

DM_MTL/278415-00003/2l649652 - selecting a number of cavities from the plurality of soldering cavities, the selected cavities being disposed in a second predetermined pattern similar to the first predetermined pattern; and

- providing a soldering filler bead on the cavity sidewall of each selected cavity.

12. The method as claimed in any one of claims 1 to 11, wherein the applying of flux onto the connector pin further comprises heating flux from an initial flux temperature lower than the first predetermined temperature to the first predetermined temperature.

13. The method as claimed in any one of claims 1 to 12, wherein the applying of flux onto the connector pin further comprises conveying flux from a flux reservoir to the connecting pin using a flux conveying conduit operatively coupled to a pump.

14. The method as claimed in claim 13, wherein the applying of flux onto the connector pin further comprises conveying used flux back to the flux reservoir using a flux return conduit operatively coupled to the pump.

15. The method as claimed in claim 14, wherein the pump comprises a peristaltic pump.

16. The method as claimed in anyone of claims 1 to 15 further comprising:

- conveying the circuit board towards a preheating assembly configured for heating the connector pin to the first predetermined temperature;

- conveying the circuit board from the heating assembly towards a flux dispensing assembly configured for applying flux onto the connector pin;

- conveying the circuit board from the flux dispensing assembly towards the body.

17. The method as claimed in any one of claims 1 to 16, wherein the inserting of the lower end of said connector pin in the soldering cavity further comprises:

DM MTL/278415-00003/2164965 2 - positioning the circuit board such that the connector pin is located above the soldering cavity; and

- lowering the circuit board, and thereby the lower portion of the connector pin, into the soldering cavity.

18. An apparatus for soldering an electronic component to a circuit board, the electronic component having a connector pin initially loosely engaged in a pin receiving opening of the circuit board, the apparatus comprising:

- a frame;

- a board holder mounted to the frame for holding the circuit board in a substantially horizontal position such that a lower portion of the connector pin extends downwardly from the circuit board;

- a preheating assembly mounted to the frame for heating the lower portion of the connector pin to a first predetermined temperature, the preheating mechanism being movable relative to the board holder for location proximal to the connector pin;

- a flux dispensing assembly mounted to the frame for dispensing flux on the lower portion of the connector pin, the flux dispensing mechanism being movable relative to the board holder for location proximal to the connector pin;

- a soldering assembly mounted to the frame, the soldering assembly being movable relative to the circuit board holder, the soldering assembly comprising: a first body having a first upper surface and a soldering cavity sidewall extending therebelow, the soldering cavity sidewall defining a soldering cavity for receiving the lower portion of the connector pin therein, the soldering cavity sidewall being configured for receiving a predetermined amount of soldering filler in a solid state thereon, and a first heating mechanism thermally connected to the soldering cavity sidewall for heating the predetermined amount of soldering

DM MTL/278415-00003/2164965 2 filler to a second predetermined temperature greater than the melting temperature of the predetermined amount of soldering filler to thereby melt the predetermined amount of soldering filler; and

- an actuator operatively connected to one of the board holder and the soldering assembly for moving the board holder and the soldering assembly towards each other to insert the lower portion of the connector pin into the soldering cavity containing molten soldering filler, thereby soldering the electronic component to the circuit board.

19. The apparatus as claimed in claim 18 further comprising positioning means operatively connected to the board holder for selectively positioning the board holder in an operative position with the preheating assembly, with the flux dispensing assembly and with the soldering assembly.

20. The apparatus as claimed in any one of claims 18 and 19, wherein the preheating mechanism comprises:

- a preheating body securely mounted to the frame, the preheating body having a second upper surface and a preheating cavity sidewall extending therebelow to define a preheating cavity for receiving the lower portion of the connector pin therein; and

- a second heating mechanism thermally connected to the second cavity sidewall for heating the lower portion of the connector pin received in the preheating cavity to the first predetermined temperature.

21. The apparatus as claimed in any one of claims 18 to 20, wherein the flux dispensing mechanism comprises a flux dispensing body securely mounted to the frame, the flux dispensing body having:

- a third upper surface and a flux dispensing cavity sidewall extending therebelow to define a flux dispensing cavity for receiving the lower portion of the connector pin; and

DM MTL/278415-00003/2164965 2 - an inlet port in fluid communication with the flux dispensing cavity, the inlet port being connectable to a flux source for providing flux to the lower end of the connector pin engaged in the flux dispensing cavity.

22. The apparatus as claimed in claim 21 , wherein the flux dispensing body further comprises an outlet port in fluid communication with the flux dispensing cavity for removing used flux from the flux dispensing cavity.

23. The apparatus as claimed in claim 22 further comprising a flux circulation unit operatively connected to the inlet port and the outlet port of the flux dispensing body, the flux circulation unit comprising:

- a flux reservoir provided with flux therein; and

- a pump operatively coupled to the flux reservoir for urging movement of flux from the flux reservoir to the inlet port and from the outlet port to the flux reservoir.

24. The apparatus as claimed in claim 23, wherein the flux circulation unit further comprises a third heating mechanism thermally connected to the flux reservoir for heating the flux to the first predetermined temperature.

25. The apparatus as claimed in any one of claims 18 to 24, wherein the predetermined amount of soldering filler in a solid state comprises a soldering filler bead.

26. The apparatus as claimed in claim 25 further comprising a bead delivery assembly mounted to the frame, the bead delivery assembly comprising:

- a bead reservoir provided with a plurality of soldering filler beads therein, the plurality of soldering filler beads comprising the soldering filler bead; and

- a bead outlet assembly in communication with the bead reservoir, the bead outlet assembly being movable relative to the first body and positionable over the soldering cavity being for placing the soldering filler bead onto the soldering cavity sidewalk

DM MTL/278415-00003/2164965 2

27. The apparatus as claimed in any one of claims 25 and 26, wherein the soldering cavity sidewall defines a cavity rim having a circular configuration, the diameter of the soldering filler bead being greater than the diameter of the cavity rim in order to enable the soldering filler bead to rest onto the cavity rim.

28. The apparatus as claimed in claim 27, wherein the cavity rim comprises a bead receiving surface tapering from the upper surface inwardly into the first body to define a bead receiving recess sized and shaped to receive at least part of the soldering filler bead therein.

29. The apparatus as claimed in any one of claims 25 to 28, wherein the soldering filler bead has a diameter of about 1.27 mm.

30. The apparatus as claimed in any one of claims 25 to 29, wherein the soldering filler bead comprises a bead of SAC305 soldering alloy.

DM MTL/278415-00003/21649652