WO2010068962A1 - Dispositif à micromiroirs numérique - Google Patents

Dispositif à micromiroirs numérique Download PDF

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Publication number
WO2010068962A1
WO2010068962A1 PCT/AU2008/001849 AU2008001849W WO2010068962A1 WO 2010068962 A1 WO2010068962 A1 WO 2010068962A1 AU 2008001849 W AU2008001849 W AU 2008001849W WO 2010068962 A1 WO2010068962 A1 WO 2010068962A1
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WO
WIPO (PCT)
Prior art keywords
mirror
digital micro
mirror device
stem
micro
Prior art date
Application number
PCT/AU2008/001849
Other languages
English (en)
Inventor
Gregory John Mcavoy
Ronan Padraig Sean O'reilly
Vincent Patrick Lawlor
Kia Silverbrook
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Priority to JP2011538793A priority Critical patent/JP2012511163A/ja
Priority to CN2008801321924A priority patent/CN102239436A/zh
Priority to AU2008365366A priority patent/AU2008365366B2/en
Priority to KR1020117011188A priority patent/KR20110070925A/ko
Priority to CA2742310A priority patent/CA2742310A1/fr
Priority to PCT/AU2008/001849 priority patent/WO2010068962A1/fr
Priority to EP08878822A priority patent/EP2359177A4/fr
Publication of WO2010068962A1 publication Critical patent/WO2010068962A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/28—Reflectors in projection beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors

Definitions

  • the present invention relates to a digital mirror device (DMD). It has been developed primarily to provide an improved device, which may be fabricated using straightforward MEMS fabrication steps.
  • DMDs Digital micromirror devices
  • DMDs Digital micromirror devices
  • an image is created by microscopically small mirrors laid out in a matrix on a semiconductor chip (DMD).
  • Each mirror represents one or more pixels in the projected image.
  • the number of mirrors corresponds to the resolution of the projected image.
  • DMD technology was developed by Texas Instruments in the 1980s (see, for example, US 4,956,619; US 4,662,746 and related patents).
  • a DMD chip has on its surface several hundred thousand microscopic mirrors arranged in a rectangular array which correspond to the pixels in the image to be displayed.
  • the mirrors can be individually rotated ⁇ 10-12°, to an on or off state.
  • the on state light from the projector bulb is reflected into a lens making the pixel appear bright on the screen.
  • the off state the light is directed elsewhere (usually onto a heatsink), making the pixel appear dark.
  • the mirror is toggled on and off very quickly, and the ratio of on time to off time determines the shade produced (binary pulse-width modulation).
  • Contemporary DMD chips can produce up to 1024 shades of gray.
  • the mirrors themselves are made out of aluminium and are usually around 16 micrometres square.
  • Each mirror is mounted on a yoke via a rigid stem extending from a lower surface of the mirror.
  • the yoke is supported by a compliant torsion hinge, which allows movement of the yoke (and thereby the mirror) between its on and off positions.
  • the torsion hinges are relatively resistant to fatigue and vibration shock. Electrodes control the position of the mirror by electrostatic attraction/repulsion.
  • a pair of electrodes is positioned on each side of the hinge, one acting on the yoke and the other acting directly on the aluminium mirror.
  • a bias potential of about 20-30 volts is applied to the mirror and yoke, whilst the electrodes are addressed using 5 volt CMOS. Hence, when the electrodes on one side to the mirror are driven to +5V, the mirror tilts
  • DMDs such as those described above, reference is made to David Armitage et al, Introduction to Microdisplays , John Wiley and Sons, 2006.
  • DMDs had been relatively unchanged for the past decade or so. However, their relatively complex design, with several moving parts in each mirror assembly, requires a correspondingly complex MEMS fabrication process. This complexity increases fabrication costs and potentially impacts on the extent to which each mirror assembly can be miniaturized. It would be desirable to provide a DMD, which has a relatively simple design compared to known DMDs.
  • a digital micro-mirror device comprising an array of micro-mirror assemblies positioned on a substrate, each micro-mirror assembly comprising: a mirror spaced apart from the substrate, the mirror having an upper reflective surface and a lower support surface; a stem supporting the mirror, the stem extending from the substrate to the lower support surface, the stem defining a tilt axis for the mirror; a first electrode and a second electrode, the first and second electrodes being positioned on either side of the stem, each electrode being individually addressable via electronic circuitry in the substrate, wherein the stem is comprised of a resiliently flexible material, such that the mirror can tilt either towards the first electrode or towards the second electrode by an electrostatic force.
  • the present invention obviates the yoke and torsion hinge arrangement in convention DMDs. This vastly simplifies the overall design of the DMD, as well as its fabrication.
  • the stem is comprised of a polymer, such as polydimethylsiloxane
  • PDMS PDMS
  • Young's modulus less than 1000 MPa
  • the Applicant has previously demonstrated the utility of PDMS in MEMS devices, and its facile incorporation into MEMS fabrication processes.
  • the mirror comprises a metal plate, the metal plate defining the upper reflective surface.
  • the metal plate is an aluminium plate.
  • the mirror further comprises a support platform for the metal plate, the support platform defining the lower support surface.
  • the mirror is typically an integrated two-part construction comprising an upper metal plate and lower support platform for the metal plate.
  • the support platform is substantially coextensive with the metal plate.
  • the support platform and the stem are comprised of the same material.
  • the stem and support platform are co-formed in a single deposition step.
  • deposition of PDMS may co-form the stem and support platform.
  • the first and second electrodes define first and second landing pads for the mirror.
  • the mirror has first and second contact points for contacting respective first and second landing pads, and wherein the first and second contact points are comprised of a polymer. Since the contact points are comprised of a polymer (e.g. PDMS), the tendency for the mirror to become stuck on the either electrode is minimized.
  • a polymer e.g. PDMS
  • the support platform defines the first and second contact points. Hence, no additional features are required to address potential stiction problems.
  • the support platform performs the dual functions of supporting an upper aluminium reflective plate and minimizing stiction between the mirror and the electrodes.
  • the mirror is electrically connected to a biasing potential.
  • the biasing potential typically maintains the mirror at a high potential so that the mirror is tiltable via electrodes controlled by CMOS voltages (usually 5V).
  • the stem may be comprised of a conducting polymer, so that the stem provides electrical connection to the biasing potential.
  • the stem may be comprised of PDMS implanted with metal ions.
  • a plurality of mirrors may be coupled together in rows, with each row being electrically connected at one end to the biasing potential.
  • the biasing potential may be applied to a whole row of mirrors via a common contact.
  • each row of mirrors has a common tilt axis.
  • adjacent mirrors in a row are coupled together via a linkage, the linkage being aligned along the common tilt axis.
  • the substrate is a silicon substrate including one or more CMOS layers, the CMOS layers comprising the electronic circuitry.
  • CMOS layers comprising the electronic circuitry.
  • a projector comprising the digital mirror device as described above. Projectors and projector systems employing DMDs will be well-known to the skilled person.
  • a method of fabricating a micro-mirror assembly comprising the steps of: (a) forming a pair of electrodes spaced apart on a surface of a substrate, the electrodes being connected to underlying electronic circuitry in the substrate;
  • the method according to the third aspect provides a simple and effective means of fabricating DMDs, using a minimal number of fabrication steps.
  • the resiliently flexible material is comprised of polydimethylsiloxane (PDMS).
  • PDMS polydimethylsiloxane
  • the sacrificial material is photoresist.
  • the metal layer is comprised of aluminium.
  • an array of micro-mirrors are fabricated simultaneously on the substrate, the array defining a digital micro-mirror device.
  • the substrate is a silicon substrate including one or more CMOS layers, the CMOS layers comprising the electronic circuitry.
  • a micro-mirror assembly comprising a tiltable mirror supported by a stem, wherein the stem is comprised of a resiliently flexible material.
  • the tiltable mirror comprises a metal layer having an upper reflective surface.
  • the tiltable mirror further comprises a support platform onto which the metal layer is mounted, the support platform being comprised of the resiliently flexible material.
  • the resiliently flexible material is comprised of polydimethylsiloxane (PDMS).
  • PDMS polydimethylsiloxane
  • the mirror is tiltable by an electrostatic force.
  • a pair of electrodes are positioned on either side of the stem, the electrodes providing, at least part of the electrostatic force.
  • Figure 1 is schematic sectional view of a DMD according to the present invention
  • Figure 2 is the DMD of Figure 1 in a tilted position
  • Figure 3 is a plan of the DMD shown in Figure 1;
  • Figure 4 shows a first stage of MEMS fabrication in which electrodes are formed
  • Figure 5 shows a second stage of MEMS fabrication in which a sacrificial scaffold is formed
  • Figure 6 shows a third stage of MEMS fabrication in which mirror layers and a stem are deposited
  • Figure 7 shows a fourth stage of MEMS fabrication in which individual micro- mirrors are defined.
  • Figure 8 shows a data projector employing a DMD according to the present invention.
  • PDMS polydimethylsiloxane
  • the DMD comprises a plurality of micro-mirror assemblies 1 arranged in a matrix on a surface of a substrate 2.
  • each micro-mirror assembly 1 is separated from adjacent micro-mirror assemblies by less than 5 microns (e.g. 2 microns).
  • the micro-mirror assembly comprises a mirror 5, which is spaced apart from the substrate 1.
  • Each mirror is typically square and has a length of in the range of about 10 to 20 microns.
  • the mirror 5 comprises an aluminium plate 7, which defines an upper reflective surface 8 of the mirror.
  • the mirror 5 further comprises a support platform 10, which defines a lower support surface 11 of the mirror.
  • the aluminium plate 7 is fused to the support platform 10 during MEMS fabrication of the DMD.
  • the upper reflective surface 8 of the mirror 5 can be made planar across its entire extent. This advantageously provides excellent optical definition.
  • prior art DMDs typically have an indentation in the reflective surface where a support post is joined to the mirror.
  • the mirror 5 is supported by a resiliently flexible stem 13, which extends from the substrate 2 to the lower support surface 11. Both the stem 13 and the support platform 10 form an integrated structure comprised of the same flexible material.
  • the stem 13 and support platform 10 are comprised of a polymer having a Young's modulus of less than 1000 MPa.
  • a preferred material for forming the stem 13 is polydimethylsiloxane, which has a Young's modulus of about 600 MPa.
  • the stem 13 defines a tilt axis for the mirror 5. As can be seen most clearly in Figure 2, the mirror 5 is able to tilt about the tilt axis at angles of up to about ⁇ 15 degrees, typically ⁇ 7 to 10 degrees.
  • the resiliently flexible stem 13 should be contrasted with prior art DMDs, whereby a rigid stem is hinged at its base to allow tilting of the mirror.
  • the stem 13 may be in the form of a support post attached to a centroid of the mirror 5. Alternatively, the stem 13 may extend at least partially along the tilt axis. Typically, the stem 13 takes the form of a supporting wall extending along the tilt axis, and co-extensive with the mirror 5.
  • a first electrode 15 and a second electrode 16 are positioned on either side of the stem 13.
  • the first and second electrodes are individually addressable by electronic circuitry in the silicon substrate 1, which enables the mirror 5 to tilt by electrostatic attraction. A typical operation of the DMD will be described in more detail below.
  • the electronic circuitry is contained in CMOS layers 18, which are included in an upper part of the substrate.
  • the first and second electrodes define landing pads for the mirror 5 when it is tilted.
  • One of the problems of prior art DMDs is stiction forces between the mirror/yoke and the landing pads. Stiction forces may cause the mirror to become permanently stuck to one landing pad, resulting in a mirror becoming non- operational.
  • the support platform 10 defines first and second contact points for contacting the landing pads. Since the support platform 10 is advantageously comprised of PDMS, any stiction forces are minimal.
  • the DMD of the present invention functions most effectively if the mirror 5 is maintained at a relatively high potential (e.g. 20 to 50 volts) by a biasing potential. This maximizes the requisite electrostatic forces when either the first or second electrodes are switched on or off by the underlying 5 volt CMOS circuitry.
  • a relatively high potential e.g. 20 to 50 volts
  • the biasing potential may be applied to the aluminium plate 7 via the support stem 13.
  • polymeric materials such as PDMS are usually electrically-insulating, it is possible to make such materials conductive by implanting metal ions, such as titanium ions (see, for example, Dubois et al, Sensors and Actuators A, 130-131 (2006), 147-154, the contents of which is herein incorporated by reference).
  • metal ions such as titanium ions
  • the biasing potential may be applied to the aluminium plate 7 by coupling the plates together, as shown in Figure 3, and applying the biasing potential to a row of mirrors from a voltage source at one end of the row.
  • Adjacent plates 7 are daisy- chained together via linkages 20 extending along the tilt axis of the mirrors.
  • the linkages are positioned along the tilt axis so as to minimize their impedance to mirror tilting.
  • linkages 20 Although the linkages 20 inevitably experience a small torsional force during mirror tilting, these linkages generally do not fatigue from this torsional force. This is due to the microscopic scale of the coupling members, which allows immediate relief of any crystal dislocations. The torsional hinges in traditional DMDs do not fatigue for the same reason.
  • MMJ008 9-PCT Referring now to Figure 2, there is shown a micro-mirror assembly 1 in a tilted position.
  • the first electrode 15 is set to +5 V and the second electrode is set to OV by the CMOS circuitry 18. Since the aluminium plate is biased to a potential of about +45V, the mirror 5 experiences an electrostatic repulsion force from the first electrode and tilts towards the second electrode. Of course, reversal of the electrode polarities will cause the mirror 5 to tilt in the opposite direction.
  • both electrodes may be set to +5V or OV.
  • FIG. 4 to 7 there is shown a simplified MEMS fabrication process for fabricating the DMD shown in Figure 1.
  • the CMOS layers 18 are not shown.
  • the electrodes are formed by a depositing 1 micron layer of aluminum onto the CMOS substrate 1, and etching to define the individual first and second electrodes 15 and 16.
  • the aluminium electrodes connect with an upper metal layer in the underlying CMOS so that each electrode is individually controllable.
  • a layer of photoresist 22 is spun onto the electrodes and patterned to define stem openings 23.
  • This layer of photoresist 22 functions as a sacrificial scaffold for subsequent deposition of PDMS and aluminium.
  • a PDMS layer is deposited onto the photoresist layer 22 followed by deposition of an aluminium layer.
  • the PDMS layer comprises the stems 13 and support platforms of 10 of each micro-mirror assembly.
  • the aluminium layer comprises the plates 7 having the upper reflective surfaces 8.
  • a fourth step shown in Figure 7 the PDMS and aluminium layers are etched to define individual mirrors 5.
  • This etch step uses a suitably patterned photoresist mask (not shown) and may require different etch chemistries for etching through the different layers.
  • the sacrificial photoresist 22 is removed by exposing to an oxidizing plasma (e.g. O 2 plasma).
  • an oxidizing plasma e.g. O 2 plasma.
  • FIG. 8 shows a typical data projector 100 (e.g. image projector or video projector) employing a DMD as described above.
  • Any data projector incorporating a known DMD may, alternatively, incorporate the DMD according to the present invention.
  • US 6,966,659 the contents of which is herein incorporated by reference,
  • the projector may additionally comprise a printhead for printing images received from a computer system 101.
  • printouts 102 may be ejected from a rear of the projector 100 as shown in Figure 8.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un dispositif à micromiroirs numérique comprenant un réseau d'ensembles micromiroirs positionnés sur un substrat. Chaque ensemble micromiroir comprend : un miroir éloigné du substrat ; une tige supportant le miroir ; et des première et seconde électrodes positionnées des deux côtés de la tige. La tige est composée d'un matériau souple élastiquement, de façon que le miroir puisse s'incliner soit vers la première électrode, soit vers la seconde électrode, par l'application d'une force électrostatique. Le dispositif de micromiroirs numérique peut être utilisé dans des projecteurs de données et analogues.
PCT/AU2008/001849 2008-12-17 2008-12-17 Dispositif à micromiroirs numérique WO2010068962A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011538793A JP2012511163A (ja) 2008-12-17 2008-12-17 デジタルマイクロミラーデバイス
CN2008801321924A CN102239436A (zh) 2008-12-17 2008-12-17 数字微镜器件
AU2008365366A AU2008365366B2 (en) 2008-12-17 2008-12-17 Digital micro-mirror device
KR1020117011188A KR20110070925A (ko) 2008-12-17 2008-12-17 디지털 마이크로미러 장치
CA2742310A CA2742310A1 (fr) 2008-12-17 2008-12-17 Dispositif a micromiroirs numerique
PCT/AU2008/001849 WO2010068962A1 (fr) 2008-12-17 2008-12-17 Dispositif à micromiroirs numérique
EP08878822A EP2359177A4 (fr) 2008-12-17 2008-12-17 Dispositif à micromiroirs numérique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/AU2008/001849 WO2010068962A1 (fr) 2008-12-17 2008-12-17 Dispositif à micromiroirs numérique

Publications (1)

Publication Number Publication Date
WO2010068962A1 true WO2010068962A1 (fr) 2010-06-24

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PCT/AU2008/001849 WO2010068962A1 (fr) 2008-12-17 2008-12-17 Dispositif à micromiroirs numérique

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EP (1) EP2359177A4 (fr)
JP (1) JP2012511163A (fr)
KR (1) KR20110070925A (fr)
CN (1) CN102239436A (fr)
AU (1) AU2008365366B2 (fr)
CA (1) CA2742310A1 (fr)
WO (1) WO2010068962A1 (fr)

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DE102011104843A1 (de) * 2011-05-05 2012-11-08 Technische Universität Darmstadt Mikrospiegelbauteil, Mikrospiegelvorrichtung mit wenigstens einem Mikrospiegelbauteil sowie Verfahren zur Herstellung eines Mikrospiegelbauteils

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CN102608875A (zh) * 2012-03-27 2012-07-25 深圳市华星光电技术有限公司 基于修补机台的玻璃基板补刻号方法及玻璃基板补刻号装置
CN103543526B (zh) * 2013-09-29 2016-04-13 华中科技大学 一种阵列式激光扫描器
JP6492893B2 (ja) * 2015-04-01 2019-04-03 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
CN109991730B (zh) * 2019-03-12 2021-06-15 上海集成电路研发中心有限公司 一种微镜结构
CN112711163A (zh) * 2019-10-25 2021-04-27 台达电子工业股份有限公司 投影装置
CN111338076B (zh) * 2020-03-31 2022-06-14 吉林省广播电视研究所(吉林省广播电视局科技信息中心) 微机电纵深成像集成电路及成像方法
CN114660880A (zh) * 2022-04-11 2022-06-24 长沙沃默科技有限公司 一种反射式投影成像装置及其设计方法

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Publication number Priority date Publication date Assignee Title
DE102011104843A1 (de) * 2011-05-05 2012-11-08 Technische Universität Darmstadt Mikrospiegelbauteil, Mikrospiegelvorrichtung mit wenigstens einem Mikrospiegelbauteil sowie Verfahren zur Herstellung eines Mikrospiegelbauteils
DE102011104843B4 (de) * 2011-05-05 2013-02-07 Technische Universität Darmstadt Mikrospiegelbauteil mit linienförmiger Biegefeder sowie Verfahren zu dessen Herstellung

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CN102239436A (zh) 2011-11-09
CA2742310A1 (fr) 2010-06-24
KR20110070925A (ko) 2011-06-24
AU2008365366B2 (en) 2012-04-19
JP2012511163A (ja) 2012-05-17
EP2359177A4 (fr) 2012-06-06
EP2359177A1 (fr) 2011-08-24
AU2008365366A1 (en) 2010-06-24

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