WO2010066099A1 - Computer keypad and molding process - Google Patents

Computer keypad and molding process Download PDF

Info

Publication number
WO2010066099A1
WO2010066099A1 PCT/CN2009/001389 CN2009001389W WO2010066099A1 WO 2010066099 A1 WO2010066099 A1 WO 2010066099A1 CN 2009001389 W CN2009001389 W CN 2009001389W WO 2010066099 A1 WO2010066099 A1 WO 2010066099A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
layer
film
conductive
key cap
Prior art date
Application number
PCT/CN2009/001389
Other languages
French (fr)
Chinese (zh)
Other versions
WO2010066099A8 (en
Inventor
杨新川
Original Assignee
嘉兴淳祥电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 嘉兴淳祥电子科技有限公司 filed Critical 嘉兴淳祥电子科技有限公司
Publication of WO2010066099A1 publication Critical patent/WO2010066099A1/en
Publication of WO2010066099A8 publication Critical patent/WO2010066099A8/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G06F3/0202Constructional details or processes of manufacture of the input device

Definitions

  • the invention relates to a computer keyboard and a molding process. Background technique
  • the existing computer keyboard is composed of a substrate, a film line, a cross bracket, a silicone rubber, and a keycap.
  • the film circuit is first placed on the substrate, then the silicone rubber is placed, and the cross brackets are inserted into the substrate one by one. Finally, the key caps are respectively stuck on the corresponding brackets.
  • the entire assembly process is too complicated and requires a lot of manpower to complete, and it is impossible to mechanize production, resulting in low production efficiency. Summary of the invention
  • the invention provides a computer keyboard and a molding process, aiming at solving the prior art problems, and provides a computer keyboard and a production process which are simple in structure, convenient to install, can be mechanized to improve production efficiency.
  • the keyboard structure of the computer keyboard has a substrate, a film line, a key cap, and the film circuit is disposed on the substrate, and the film circuit is composed of an upper line and a lower line, wherein the key cap layer is provided with a metal elastic layer under each of the keycap layers. There is a corresponding metal shrapnel under the key caps.
  • the keycap layer is integrally molded by ultraviolet light curing.
  • the film lines are disposed under the metal shrapnel layer, and each of the metal shrapnels correspondingly has a conductive dot printed on the film line.
  • a light guide plate is further disposed between the key cap layer and the metal dome layer, and a light source is disposed on a side of the light guide plate.
  • the light source is an LED light.
  • the film line is a film line having a co-directional structure, and conductive dots on the upper circuit board and the lower circuit board are printed on the upper surface thereof.
  • the upper circuit board is provided with a plurality of through holes, and the outer side of each of the through holes is printed with a conductive point; the conductive points of the lower circuit board correspond to the through holes of the upper circuit board, and the conductive points are located within the circumference of the through hole After the upper and lower circuit boards are combined, the conductive points are located in the through holes.
  • the key cap layer is formed by ultraviolet light curing once;
  • the ultraviolet curing molding glue is injected into the key cap mold, the mold is filled, the surface of the mold is covered with a film, and the coated mold is cured under ultraviolet light, and the ultraviolet light energy is 700-100 mJ, the ultraviolet The light energy is preferably 800 mJ; the key cap layer is demolded and molded, and the characters are printed on the back side of the key cap layer, that is, the key cap is punched.
  • Upper circuit board Several through holes are opened in the upper circuit board, and then conductive dots are printed on the upper surface thereof, and conductive dots are located on the outer side of each through hole.
  • Lower circuit board Conductive dots are printed on the surface of the lower circuit board. The position of the conductive dots corresponds to the position of the through hole of the upper circuit board, and the conductive dots are located within the circumference of each through hole.
  • the invention has the advantages that the computer keyboard is simple, the structure of the cross bracket and the silicone rubber are not included in the structure, and the key cap is integrally formed, thereby eliminating the process of installing one by one, saving time.
  • the layers of the keyboard structure can be mechanized only by sticking to each other, thereby improving production efficiency.
  • Figure 1 is a schematic view of the structure of the present invention
  • FIG. 2 is a schematic structural view of a single button of the present invention
  • Figure 3 is a schematic view of the structure of the film line
  • FIG. 4 is a layout view of a light source on a side of a light guide plate.
  • the keyboard structure of the computer keyboard has a substrate 50.
  • the keycap layer 10 formed by the keycap 1 is integrally formed by ultraviolet curing, and a metal elastic layer 30 is disposed under the keycap layer 10.
  • Each of the keycaps 1 has a corresponding metal dome 3 corresponding thereto.
  • a thin film line 40 is disposed under the metal shrapnel layer 30.
  • the film line 40 is composed of an upper line 41 and a lower line 42.
  • Each of the metal domes 3 correspondingly has a conductive point 4, 5 printed on the upper circuit board 41 and the lower circuit board 42, and the film line 40 is placed on the substrate 50. . Since there is no cross bracket and silicone rubber in the structure, space is saved, so different devices can be placed under the keycap 1 according to actual needs to facilitate the user. As shown in FIG. 1 and FIG.
  • the light guide plate 20 is disposed under the keycap 1, and the LED light 2 as a light source is disposed on the side of the light guide plate 20, so that the keyboard can be illuminated, which is convenient for the user to use in a dark environment;
  • the light guide plate 20 is replaced with a capacitance sensor, and the key cap 1 can be used to perform circumferential, vertical sliding, and handwriting operations on the surface of the keycap 1.
  • the film line 40 is a film line having the same structure, and the conductive dots 4 and the lower circuit board 42 of the upper circuit board 41.
  • the conductive dots 5 are printed on the upper surface of the wiring board.
  • a plurality of through holes 6 are formed in the upper circuit board 41, and conductive dots 4 are printed on the outer side of the through holes 6.
  • the metal domes 3 are in contact with the conductive dots 4; the conductive dots 5 of the lower circuit board 42 and the upper circuit boards 41 are through holes.
  • the conductive dots 5 are located within the circumference of the through hole 6. After the upper and lower circuit boards 41, 42 are combined, the conductive dots 5 are placed in the through holes 6.
  • the keycap layer 10 is molded by ultraviolet light once, the material used has excellent flexibility, and the keycap 1 does not affect the keycap 1 during operation.
  • the keycap 1 is pressed, and the metal dome 3 is pressed to be in contact with the conductive dots 5 of the lower circuit board 42, since the metal domes 3 are also in contact with the conductive dots 4 of the upper circuit board 41, thereby The upper and lower lines 41, 42 are turned on.
  • the key cap layer is formed by ultraviolet light curing once;
  • a polyurethane film is used.
  • the film after curing is cured under ultraviolet light, and the ultraviolet light energy is 700-100 mJ; the key cap layer is demoulded and demolded, and characters are printed on the back side of the key cap layer, that is, one side of the cover film; .
  • the ultraviolet light energy is preferably 800 mJ.
  • Upper circuit board Several through holes are opened in the upper circuit board, and then conductive dots are printed on the upper surface thereof, and conductive dots are located on the outer side of each through hole.
  • Lower circuit board Conductive dots are printed on the surface of the lower circuit board. The position of the conductive dots corresponds to the position of the through hole of the upper circuit board, and the conductive dots are located within the circumference of each through hole.
  • the metal shrapnel is placed in the mold, and is formed according to the position of the button, and the single-sided adhesive sheet is attached to the finished metal shrapnel so that the two are attached to each other.
  • the keyboard of the computer keyboard has a simple structure, and the structure has no cross bracket and silicone rubber, and the key cap is integrally formed, which saves time by installing the one by one.
  • the layers of the keyboard structure can be pasted only by sticking to each other, and the entire assembly process can realize mechanized production and improve production efficiency.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Push-Button Switches (AREA)
  • Input From Keyboards Or The Like (AREA)

Abstract

A keystoke structure of a computer keypad, includes: a thin film circuitry placed on a substrate, the thin film circuitry formed by an upper circuitry and a lower circuitry, wherein: a metallic elastic piece layer is arranged under a key cap layer comprised by the key caps, a corresponding metallic elastic piece is accordingly below each key cap. There is a layer of a light guide plate between the key cap layer and the metallic elastic piece layer, the side of the light guide board is provided with a light source. The thin film circuitry is arranged under the metallic elastic piece layer, and each metallic elastic piece accordingly has a corresponding conduction point printed on the thin film circuitry. The key cap layer is integrally formed by UV light curing. The thin film circuitry is a thin film circuitry having the same direction structure. The production process of the computer keyboard includes: adopting the integrally formed mode of the UV light to produce the key caps, producing the thin film circuitry having the same direction, arranging the metallic elastic piece, and attaching the key caps, the metallic elastic piece and the thin film circuitry together in turn.

Description

电脑键盘及成型工艺  Computer keyboard and molding process
技术领域 Technical field
本发明涉及一种电脑键盘及成型工艺。 背景技术  The invention relates to a computer keyboard and a molding process. Background technique
现有的电脑键盘由基板、 薄膜线路、 交叉支架、 硅橡胶、 键帽共同构成, 组装时要先将薄膜线路放在基板上, 再放上硅橡胶, 将交叉支架一个一个卡入 基板内, 最后将键帽分别卡在相应的支架上。 整个组装过程过于复杂, 需要很 多人力才能完成, 不能进行机械化生产, 导致生产效率比较低。 发明内容  The existing computer keyboard is composed of a substrate, a film line, a cross bracket, a silicone rubber, and a keycap. When assembling, the film circuit is first placed on the substrate, then the silicone rubber is placed, and the cross brackets are inserted into the substrate one by one. Finally, the key caps are respectively stuck on the corresponding brackets. The entire assembly process is too complicated and requires a lot of manpower to complete, and it is impossible to mechanize production, resulting in low production efficiency. Summary of the invention
本发明提供一种电脑键盘及成型工艺, 目的是解决现有技术问题, 提供一 种结构简单, 方便安装, 可以进行机械化生产提高生产效率的电脑键盘及生产 工艺。  The invention provides a computer keyboard and a molding process, aiming at solving the prior art problems, and provides a computer keyboard and a production process which are simple in structure, convenient to install, can be mechanized to improve production efficiency.
本发明解决问题采用的技术方案是:  The technical solution adopted by the present invention to solve the problem is:
电脑键盘按键结构,具有基板、 薄膜线路、 键帽, 薄膜线路置于基板上, 薄 膜线路由上线路和下线路构成, 其特征在于: 键帽构成的键帽层下方设有金属 弹片层, 每个键帽下方均相应的对应有一个金属弹片。 所述键帽层釆用紫外光 固化一体成型。 薄膜线路设于金属弹片层下方, 且每个金属弹片均相应的对应 有印刷在薄膜线路上的导电点。  The keyboard structure of the computer keyboard has a substrate, a film line, a key cap, and the film circuit is disposed on the substrate, and the film circuit is composed of an upper line and a lower line, wherein the key cap layer is provided with a metal elastic layer under each of the keycap layers. There is a corresponding metal shrapnel under the key caps. The keycap layer is integrally molded by ultraviolet light curing. The film lines are disposed under the metal shrapnel layer, and each of the metal shrapnels correspondingly has a conductive dot printed on the film line.
在键帽层与金属弹片层之间还设有一层导光板, 导光板侧面设有光源。  A light guide plate is further disposed between the key cap layer and the metal dome layer, and a light source is disposed on a side of the light guide plate.
1  1
替换页 (细则第 26条) 所述光源为 L E D灯。 Replacement page (Article 26) The light source is an LED light.
所述薄膜线路为具有同向结构的薄膜线路, 上线路板和下线路板上的导电 点均印刷在其上表面。  The film line is a film line having a co-directional structure, and conductive dots on the upper circuit board and the lower circuit board are printed on the upper surface thereof.
上线路板开设有数个通孔, 且每个通孔的外侧一周均印刷有导电点; 下线 路板的导电点与上线路板通孔一一相对应, 且该导电点位于通孔圆周范围内, 将上下线路板组合后, 该导电点位于通孔内。  The upper circuit board is provided with a plurality of through holes, and the outer side of each of the through holes is printed with a conductive point; the conductive points of the lower circuit board correspond to the through holes of the upper circuit board, and the conductive points are located within the circumference of the through hole After the upper and lower circuit boards are combined, the conductive points are located in the through holes.
所述的电脑键盘的生产工艺:  The production process of the computer keyboard:
一、 键帽层采用紫外光固化一次成型; 1. The key cap layer is formed by ultraviolet light curing once;
将紫外光固化成型胶注入键帽模具中, 将模具填满, 在模具表面覆盖一 层薄膜, 将覆膜后的模具在紫外线光照下进行固化, 其紫外光能量为 700— lOOOmJ, 所述紫外光能量最好为 800 mJ; 键帽层固化成型后脱模, 在键帽层 的背面即覆膜一面印刷字符, 键帽进行冲形。  The ultraviolet curing molding glue is injected into the key cap mold, the mold is filled, the surface of the mold is covered with a film, and the coated mold is cured under ultraviolet light, and the ultraviolet light energy is 700-100 mJ, the ultraviolet The light energy is preferably 800 mJ; the key cap layer is demolded and molded, and the characters are printed on the back side of the key cap layer, that is, the key cap is punched.
二、 生产薄膜线路; Second, the production of film lines;
( 1 ) 上线路板: 在上线路板开设数个通孔, 然后在其上表面印刷导电点, 导电点位于每个通孔的外侧一周。  (1) Upper circuit board: Several through holes are opened in the upper circuit board, and then conductive dots are printed on the upper surface thereof, and conductive dots are located on the outer side of each through hole.
(2) 下线路板: 在下线路板上表面印刷导电点, 该导电点的位置同上线路 板通孔的位置一一相对应, 且导电点位于每个通孔圆周范围内。  (2) Lower circuit board: Conductive dots are printed on the surface of the lower circuit board. The position of the conductive dots corresponds to the position of the through hole of the upper circuit board, and the conductive dots are located within the circumference of each through hole.
(3 ) 将上下线路板组合在一起, 其两个线路板上的导电点为同向。  (3) Combine the upper and lower circuit boards, and the conductive points on the two circuit boards are in the same direction.
(4) 组合好的薄膜线路用模具冲外形。  (4) The combined film line is punched with a mold.
三、 贴合金属弹片: Third, the fit metal shrapnel:
将金属弹片放在模具中, 根据按键的位置摆放成形, 将冲形好的单面胶 四、 印刷导光板, 然后冲外形。 Place the metal shrapnel in the mold, and place it according to the position of the button. Fourth, print the light guide plate, and then punch the shape.
五、 将冲形好的薄膜线路和整理好的金属弹片、 导光板依次组合在一起, 在键 帽层印刷有字符的一面印刷紫外光粘胶, 将键帽层粘贴在导光板上, 同导光板 结合在一起。 5. Combine the well-formed film line and the finished metal shrapnel and light guide plate in turn, print the ultraviolet light adhesive on the side of the key cap layer printed with characters, and paste the key cap layer on the light guide plate. The light panels are combined.
本发明的有益效果: 该电脑键盘简单, 结构中没有了交叉支架、 硅橡胶这 两个部件, 而且键帽采用一体成型的方式, 这样省去了将其一个一个安装的过 程, 节约了时间。 该键盘结构各层之间仅通过相互粘贴即可, 可以进行机械化 生产, 提高生产效率。 附图说明  The invention has the advantages that the computer keyboard is simple, the structure of the cross bracket and the silicone rubber are not included in the structure, and the key cap is integrally formed, thereby eliminating the process of installing one by one, saving time. The layers of the keyboard structure can be mechanized only by sticking to each other, thereby improving production efficiency. DRAWINGS
图 1是本实用新型的结构示意图  Figure 1 is a schematic view of the structure of the present invention
图 2是本实用新型单个按键的结构示意图  2 is a schematic structural view of a single button of the present invention
图 3是薄膜线路的结构示意图  Figure 3 is a schematic view of the structure of the film line
图 4是光源在导光板侧面的布置图 具体实施方式  4 is a layout view of a light source on a side of a light guide plate.
以下结合附图和具体实施例对本发明作进一步说明。  The invention is further described below in conjunction with the drawings and specific embodiments.
如图 1、 图 2、 图 3所示, 电脑键盘按键结构,具有基板 50。 键帽 1构成的键帽 层 10釆用紫外光固化一体成型, 键帽层 10下方设有金属弹片层 30, 每个键帽 1的下方均相应的对应有一个金属弹片 3。金属弹片层 30下方设有薄膜线路 40, As shown in Fig. 1, Fig. 2, and Fig. 3, the keyboard structure of the computer keyboard has a substrate 50. The keycap layer 10 formed by the keycap 1 is integrally formed by ultraviolet curing, and a metal elastic layer 30 is disposed under the keycap layer 10. Each of the keycaps 1 has a corresponding metal dome 3 corresponding thereto. A thin film line 40 is disposed under the metal shrapnel layer 30.
3  3
替换页(细则第 26条) 薄膜线路 40由上线路 41和下线路 42构成, 每个金属弹片 3均相应的对应有一 个印刷在上线路板 41和下线路板 42的导电点 4、 5, 薄膜线路 40置于基板 50 上。 由于该结构中没有了交叉支架和硅橡胶, 因此节省了空间, 所以可以根据 实际需要在键帽 1下安置不同的装置以方便用户。 如图 1、 图 4所示,在键帽 1 下安置导光板 20, 导光板 20的侧面安置有作为光源的 LED灯 2, 从而可以使 键盘发光, 方便用户在黑暗的环境中使用; 也可将导光板 20换成电容传感器, 在键帽 1作用的同时能够在键帽 1表面做圆周、 上下滑动及手写动作。 Replacement page (Article 26) The film line 40 is composed of an upper line 41 and a lower line 42. Each of the metal domes 3 correspondingly has a conductive point 4, 5 printed on the upper circuit board 41 and the lower circuit board 42, and the film line 40 is placed on the substrate 50. . Since there is no cross bracket and silicone rubber in the structure, space is saved, so different devices can be placed under the keycap 1 according to actual needs to facilitate the user. As shown in FIG. 1 and FIG. 4, the light guide plate 20 is disposed under the keycap 1, and the LED light 2 as a light source is disposed on the side of the light guide plate 20, so that the keyboard can be illuminated, which is convenient for the user to use in a dark environment; The light guide plate 20 is replaced with a capacitance sensor, and the key cap 1 can be used to perform circumferential, vertical sliding, and handwriting operations on the surface of the keycap 1.
本实施例中, 由于采用金属弹片 3 代替硅橡胶, 为使键盘的按压力达到规 定值, 薄膜线路 40为具有同向结构的薄膜线路, 其上线路板 41的导电点 4和 下线路板 42的导电点 5均印刷在线路板的上表面。 在上线路板 41开设有数个 通孔 6, 通孔 6的外侧一周均印刷有导电点 4, 金属弹片 3同导电点 4相接触; 下线路板 42的导电点 5与上线路板 41通孔 6—一相对应, 且该导电点 5位于 通孔 6圆周范围内。 将上下线路板 41、 42组合后, 导电点 5置于通孔 6内。  In this embodiment, since the metal dome 3 is used instead of the silicone rubber, in order to bring the pressing force of the keyboard to a predetermined value, the film line 40 is a film line having the same structure, and the conductive dots 4 and the lower circuit board 42 of the upper circuit board 41. The conductive dots 5 are printed on the upper surface of the wiring board. A plurality of through holes 6 are formed in the upper circuit board 41, and conductive dots 4 are printed on the outer side of the through holes 6. The metal domes 3 are in contact with the conductive dots 4; the conductive dots 5 of the lower circuit board 42 and the upper circuit boards 41 are through holes. Correspondingly, the conductive dots 5 are located within the circumference of the through hole 6. After the upper and lower circuit boards 41, 42 are combined, the conductive dots 5 are placed in the through holes 6.
尽管键帽层 10采用紫外光固化一次成型,但采用的材料具有很好的柔软性, 操作时键帽 1同键帽 1之间不会产生影响。使用键盘时, 按压键帽 1, 金属弹片 3被压下, 使其同下线路板 42的导电点 5相接触, 由于金属弹片 3同时也和上 线路板 41的导电点 4相接触, 因此使上下线路 41、 42相接通。  Although the keycap layer 10 is molded by ultraviolet light once, the material used has excellent flexibility, and the keycap 1 does not affect the keycap 1 during operation. When the keyboard is used, the keycap 1 is pressed, and the metal dome 3 is pressed to be in contact with the conductive dots 5 of the lower circuit board 42, since the metal domes 3 are also in contact with the conductive dots 4 of the upper circuit board 41, thereby The upper and lower lines 41, 42 are turned on.
上述电脑键盘的生产工艺如下:  The production process of the above computer keyboard is as follows:
一、 键帽层采用紫外光固化一次成型; 1. The key cap layer is formed by ultraviolet light curing once;
将紫外光固化成型胶注入键帽模具中, 将模具填满, 在模具表面覆盖一 层薄膜, 该薄膜可根据需要进行选择, 采用聚氨酯薄膜或聚碳酸酯薄膜, 本  Injecting the UV curable molding glue into the key cap mold, filling the mold, and covering the surface of the mold with a film, which can be selected according to requirements, using a polyurethane film or a polycarbonate film,
4  4
替换页(细则第 26条) 实施例中为使成型后的按键具有良好的柔软性, 因此采用聚氨酯薄膜。 将覆 膜后的模具在紫外线光照下进行固化, 其紫外光能量为 700— lOOOmJ; 键帽 层固化成型后脱模, 在键帽层的背面即覆膜一面印刷字符; 键帽层进行冲形。 所述紫外光能量最好为 800 mJ。 Replacement page (Article 26) In the embodiment, in order to make the formed button have good flexibility, a polyurethane film is used. The film after curing is cured under ultraviolet light, and the ultraviolet light energy is 700-100 mJ; the key cap layer is demoulded and demolded, and characters are printed on the back side of the key cap layer, that is, one side of the cover film; . The ultraviolet light energy is preferably 800 mJ.
二、 生产薄膜线路; Second, the production of film lines;
( 1 ) 上线路板: 在上线路板开设数个通孔, 然后在其上表面印刷导电点, 导电点位于每个通孔的外侧一周。  (1) Upper circuit board: Several through holes are opened in the upper circuit board, and then conductive dots are printed on the upper surface thereof, and conductive dots are located on the outer side of each through hole.
(2) 下线路板: 在下线路板上表面印刷导电点, 该导电点的位置同上线路 板通孔的位置一一相对应, 且导电点位于每个通孔圆周范围内。  (2) Lower circuit board: Conductive dots are printed on the surface of the lower circuit board. The position of the conductive dots corresponds to the position of the through hole of the upper circuit board, and the conductive dots are located within the circumference of each through hole.
(3 ) 将上下线路板组合在一起, 其两个线路板上的导电点为同向。  (3) Combine the upper and lower circuit boards, and the conductive points on the two circuit boards are in the same direction.
(4) 组合好的薄膜线路用模具冲外形。  (4) The combined film line is punched with a mold.
三、 贴合金属弹片: Third, the fit metal shrapnel:
将金属弹片放在模具中, 根据按键的位置摆放成形, 将冲形好的单面胶整片 贴合在整理好的金属弹片上, 使两者相互贴合在一起。  The metal shrapnel is placed in the mold, and is formed according to the position of the button, and the single-sided adhesive sheet is attached to the finished metal shrapnel so that the two are attached to each other.
四、 印刷导光板, 然后冲外形。 Fourth, print the light guide plate, and then punch the shape.
五、 将冲形好的薄膜线路和整理好的金属弹片、 导光板依次组合在一起, 在键 帽层印刷有字符的一面印刷紫外光粘胶, 将键帽层粘贴在导光板上, 同导光板 结合在一起。 5. Combine the well-formed film line and the finished metal shrapnel and light guide plate in turn, print the ultraviolet light adhesive on the side of the key cap layer printed with characters, and paste the key cap layer on the light guide plate. The light panels are combined.
该电脑键盘按键结构简单, 结构中没有了交叉支架、 硅橡胶这两个部件, 而且键帽釆用一体成型的方式, 这样省去了将其一个一个安装的过程, 节约了 时间。 该键盘结构各层之间仅通过相互粘贴即可, 整个装配过程可以实现机械 化生产, 提高生产效率。 替换页(细则第 26条)  The keyboard of the computer keyboard has a simple structure, and the structure has no cross bracket and silicone rubber, and the key cap is integrally formed, which saves time by installing the one by one. The layers of the keyboard structure can be pasted only by sticking to each other, and the entire assembly process can realize mechanized production and improve production efficiency. Replacement page (Article 26)

Claims

权 利 要 求 书 Claim
1. 电脑键盘按键结构,具有基板、 薄膜线路、 键帽, 薄膜线路置于基板上, 薄膜 线路由上线路和下线路构成, 其特征在于: 键帽构成的键帽层下方设有金属 弹片层, 每个键帽下方均相应的对应有一个金属弹片, 所述键帽层采用紫外 光固化一体成型; 薄膜线路设于金属弹片层下方, 且每个金属弹片均相应的 对应有印刷在薄膜线路上的导电点。  1. The keyboard structure of the computer keyboard has a substrate, a film line, a key cap, and the film line is placed on the substrate, and the film circuit is composed of an upper line and a lower line, and is characterized in that: a metal dome layer is arranged under the keycap layer formed by the key cap There is a corresponding metal shrapnel under each of the key caps, and the key cap layer is integrally formed by ultraviolet curing; the film lines are disposed under the metal shrapnel layer, and each metal shrapnel is correspondingly printed on the film line. Conductive points on.
2. 如权利要求 1所述的电脑键盘按键结构,其特征在于: 在键帽层与金属弹片层 之间还设有一层导光板, 导光板侧面设有光源。  2. The computer keyboard key structure according to claim 1, wherein: a light guide plate is further disposed between the key cap layer and the metal dome layer, and a light source is disposed on a side of the light guide plate.
3. 如权利要求 2所述的电脑键盘按键结构,其特征在于: 所述光源为 L E D灯。 3. The computer keyboard key structure according to claim 2, wherein: the light source is a L E D lamp.
4. 如权利要求 1所述的电脑键盘按键结构,其特征在于: 所述薄膜线路为具有同 向结构的薄膜线路, 上线路板和下线路板上的导电点均印刷在其上表面。4. The computer keyboard key structure according to claim 1, wherein: said film line is a film line having a co-directional structure, and conductive dots on the upper circuit board and the lower circuit board are printed on the upper surface thereof.
5. 如权利要求 4所述的电脑键盘按键结构,其特征在于: 上线路板开设有数个通 孔, 且每个通孔的外侧一周均印刷有导电点; 下线路板的导电点与上线路板 通孔一一相对应, 且该导电点位于通孔圆周范围内, 将上下线路板组合后, 该导电点位于通孔内。 5. The computer keyboard key structure according to claim 4, wherein: the upper circuit board is provided with a plurality of through holes, and the outer side of each of the through holes is printed with a conductive point; the conductive point of the lower circuit board and the upper line The through holes of the plates are corresponding one by one, and the conductive points are located in the circumferential range of the through holes, and after the upper and lower circuit boards are combined, the conductive points are located in the through holes.
6. 如权利要求 1所述的电脑键盘的生产工艺, 其特征在于:  6. The process for producing a computer keyboard according to claim 1, wherein:
一、 生产键帽层, 所述键帽层生产采用紫外光固化一次成型:  First, the production of the keycap layer, the production of the keycap layer is formed by ultraviolet curing:
将紫外光固化成型胶注入键帽模具中, 将模具填满, 在模具表面覆盖一 层薄膜, 将覆膜后的模具在紫外线光照下进行固化, 其紫外光能量为 700— lOOOmJ; 键帽层固化成型后脱模, 在键帽层的背面即覆膜一面印刷字符; 键 帽层冲形后, 在键帽层印刷有字符的一面印刷紫外光粘胶, 将键帽层粘贴在 固定金属弹片的单面胶上, 同金属弹片结合在一起。 The ultraviolet curing molding glue is injected into the key cap mold, the mold is filled, the surface of the mold is covered with a film, and the coated mold is cured under ultraviolet light, and the ultraviolet light energy is 700-100 mJ; the key cap layer After solidification molding, the mold is released, and characters are printed on the back side of the keycap layer, that is, on the side of the cover film; after the keycap layer is punched, the ultraviolet light adhesive is printed on the side of the keycap layer printed with characters, and the keycap layer is pasted on the keycap layer. The metal shingles of the fixed metal shrapnel are combined with the metal shrapnel.
二、 生产薄膜线路; Second, the production of film lines;
( 1 ) 上线路板及下线路板上印刷导电点;  (1) printing conductive dots on the upper circuit board and the lower circuit board;
(2) 将上下线路板组合在一起, 组合好的薄膜线路用模具冲外形; 三、 贴合金属弹片:  (2) Combine the upper and lower circuit boards together, and combine the film lines with the mold to punch the shape; 3. Fit the metal shrapnel:
将金属弹片放在模具中, 根据按键的位置摆放成形, 将冲形好的单面胶 整片贴合在整理好的金属弹片上, 使两者相互贴合在一起;  The metal shrapnel is placed in the mold, and is formed according to the position of the button, and the single-sided adhesive sheet is attached to the finished metal shrapnel so that the two are attached to each other;
四、 印刷导光板, 然后冲外形; Fourth, printing the light guide plate, and then punching the shape;
五、 将冲形好的薄膜线路和整理好的金属弹片、 导光板、 键帽依次组合在一起。5. Combine the well-formed film lines and the finished metal shrapnel, light guide plate and keycap.
7.如权利要求 6所述的电脑键盘的生产工艺, 其特征在于: 所述薄膜线路的过程 还包括; The process of producing a computer keyboard according to claim 6, wherein: the process of the film circuit further comprises:
( la) 上线路板: 在上线路板开设数个通孔, 导电点印刷在线路板上表面, 且导电点位于每个通孔的外侧一周;  ( la) upper circuit board: several through holes are opened in the upper circuit board, conductive dots are printed on the surface of the circuit board, and conductive points are located on the outer side of each through hole;
( lb) 下线路板: 在下线路板上表面印刷导电点, 该导电点的位置同上线路 板通孔的位置一一相对应, 且导电点位于每个通孔圆周范围内, 将上下线路 板组合在一起, 其两个线路板上的导电点为同向。  ( lb) Lower circuit board: Print conductive points on the surface of the lower circuit board. The position of the conductive points corresponds to the position of the through hole of the circuit board, and the conductive points are located within the circumference of each through hole, and the upper and lower circuit boards are combined. Together, the conductive points on the two boards are in the same direction.
8.如权利要求 6 所述的电脑键盘的生产工艺, 其特征在于: 所述紫外光能量为 800 mJ。  The process for producing a computer keyboard according to claim 6, wherein the ultraviolet light energy is 800 mJ.
PCT/CN2009/001389 2008-12-09 2009-12-08 Computer keypad and molding process WO2010066099A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810182493.X 2008-12-09
CN200810182493XA CN101414518B (en) 2008-12-09 2008-12-09 Computer keyboard and molding technique

Publications (2)

Publication Number Publication Date
WO2010066099A1 true WO2010066099A1 (en) 2010-06-17
WO2010066099A8 WO2010066099A8 (en) 2010-09-30

Family

ID=40594993

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2009/001389 WO2010066099A1 (en) 2008-12-09 2009-12-08 Computer keypad and molding process

Country Status (2)

Country Link
CN (1) CN101414518B (en)
WO (1) WO2010066099A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469170B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469168B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469171B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469169B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469165B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469167B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI489498B (en) * 2010-09-16 2015-06-21 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101414518B (en) * 2008-12-09 2012-02-29 嘉兴淳祥电子科技有限公司 Computer keyboard and molding technique
CN102034628B (en) * 2009-09-28 2014-04-09 纬创资通股份有限公司 Key structure with light transmission and relevant electronic device thereof
US10032592B2 (en) 2013-08-23 2018-07-24 Apple Inc. Force sensing switch
AU2014308618B2 (en) 2013-08-23 2017-06-22 Apple Inc. Remote control device
CN106412190B (en) * 2016-10-14 2022-09-09 西安易朴通讯技术有限公司 Terminal
CN106653571B (en) * 2016-12-22 2019-04-02 重庆淳祥电子科技有限公司 Keyboard circuit production technology
CN109767945B (en) * 2019-01-18 2020-07-24 上海欧力雅实业有限公司 Thin film switch and processing method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532674A (en) * 2003-03-20 2004-09-29 达方电子股份有限公司 Keyboard structure
CN2870125Y (en) * 2006-01-10 2007-02-14 嘉兴淳祥电子科技有限公司 Novel button-spot electrode structure
CN101093757A (en) * 2006-06-22 2007-12-26 毅嘉科技股份有限公司 Structure of thin-formed push button key, and fabricating method
CN201084101Y (en) * 2007-02-13 2008-07-09 英华达股份有限公司 Touch control input device
US20080185281A1 (en) * 2007-02-06 2008-08-07 Inventec Appliances Corp. Touch input device
CN101414518A (en) * 2008-12-09 2009-04-22 嘉兴淳祥电子科技有限公司 Computer keyboard and molding technique
CN201298477Y (en) * 2008-12-09 2009-08-26 嘉兴淳祥电子科技有限公司 Push-button structure of computer keyboard

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2546992Y (en) * 2002-04-27 2003-04-23 闳晖实业股份有限公司 Push switch structure
KR100606081B1 (en) * 2005-05-19 2006-07-28 삼성전자주식회사 Light guide panel, keypad and keypad assembly
CN2824263Y (en) * 2005-08-01 2006-10-04 达方电子股份有限公司 Key structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532674A (en) * 2003-03-20 2004-09-29 达方电子股份有限公司 Keyboard structure
CN2870125Y (en) * 2006-01-10 2007-02-14 嘉兴淳祥电子科技有限公司 Novel button-spot electrode structure
CN101093757A (en) * 2006-06-22 2007-12-26 毅嘉科技股份有限公司 Structure of thin-formed push button key, and fabricating method
US20080185281A1 (en) * 2007-02-06 2008-08-07 Inventec Appliances Corp. Touch input device
CN201084101Y (en) * 2007-02-13 2008-07-09 英华达股份有限公司 Touch control input device
CN101414518A (en) * 2008-12-09 2009-04-22 嘉兴淳祥电子科技有限公司 Computer keyboard and molding technique
CN201298477Y (en) * 2008-12-09 2009-08-26 嘉兴淳祥电子科技有限公司 Push-button structure of computer keyboard

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469170B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469171B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469167B (en) * 2010-08-31 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469168B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469169B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI469165B (en) * 2010-09-16 2015-01-11 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same
TWI489498B (en) * 2010-09-16 2015-06-21 Hon Hai Prec Ind Co Ltd Keypad assembly and electronic device using the same

Also Published As

Publication number Publication date
WO2010066099A8 (en) 2010-09-30
CN101414518B (en) 2012-02-29
CN101414518A (en) 2009-04-22

Similar Documents

Publication Publication Date Title
WO2010066099A1 (en) Computer keypad and molding process
JP3810237B2 (en) Method for manufacturing key top member for pushbutton switch
CN102148103A (en) Membrane switch and manufacturing method thereof
CN201910028U (en) Waterproof computer keyboard and laptop
CN201478173U (en) Ultra-thin computer key structure
CN101093757B (en) Fabricating method of structure of thin-formed push button key
CN202025291U (en) Thin computer keyboard
CN201117494Y (en) Electronic product light-guiding press key panel
CN102087927A (en) Single-layer waterproof membrane switch
CN202172038U (en) Button structure
JP2000113762A (en) Illuminated push-button switch
CN201655611U (en) Computer keyboard
US20110219964A1 (en) Method of making a keycap structure having a UV-cured resin and method of making a keyboard including keycap structures having a UV-cured resin
JP2011243555A (en) Keypad plunger structure and method of manufacturing the same
TW201101357A (en) Keypad structure, keypad semi-structure, and method of making a keypad structure
CN203746714U (en) Lever for keyboard and mechanical lever type METAL DOME ultrathin keyboard
CN201430618Y (en) Key panel
CN201122543Y (en) Thinned press key panel structure
CN202034282U (en) Computer keyboard structure
CN201188379Y (en) Non-backlight type panel and key-press module thereof
CN202084461U (en) Light-guiding plate forming guide post and forming method
JP2004063155A (en) Film key sheet and its manufacturing method
CN102568900A (en) Structure of computer keyboard
CN101777452A (en) Thin-type keycap structure, key structure containing same and manufacturing method thereof
CN203631379U (en) Computer membrane switch luminescence keyboard

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09831376

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09831376

Country of ref document: EP

Kind code of ref document: A1