WO2010066097A1 - 基于soc芯片的电磁炉电路 - Google Patents

基于soc芯片的电磁炉电路 Download PDF

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Publication number
WO2010066097A1
WO2010066097A1 PCT/CN2009/001365 CN2009001365W WO2010066097A1 WO 2010066097 A1 WO2010066097 A1 WO 2010066097A1 CN 2009001365 W CN2009001365 W CN 2009001365W WO 2010066097 A1 WO2010066097 A1 WO 2010066097A1
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circuit
igbt
control module
comparator
drive control
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PCT/CN2009/001365
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English (en)
French (fr)
Inventor
丘守庆
许申生
刘春光
李鹏
陈劲峰
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深圳市鑫汇科科技有限公司
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Application filed by 深圳市鑫汇科科技有限公司 filed Critical 深圳市鑫汇科科技有限公司
Priority to EP09831374A priority Critical patent/EP2375855A1/en
Priority to US12/992,944 priority patent/US20110226758A1/en
Priority to JP2011513850A priority patent/JP5102394B2/ja
Publication of WO2010066097A1 publication Critical patent/WO2010066097A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/06Control, e.g. of temperature, of power

Definitions

  • the invention belongs to the technical field of induction cooker heated by electric energy, in particular to an electromagnetic oven circuit based on SoC (System on a Chip) chip.
  • SoC System on a Chip
  • the mainstream household induction cooker application circuit generally uses four comparators or dual comparators and a number of discrete components such as resistors, capacitors, diodes, and triodes.
  • the book constitutes circuits for synchronization, resonance, drive, current surge protection, etc., in conjunction with MCU control. Realize the main resonant circuit and various basic protection functions.
  • the disadvantages of the existing circuit are: a large number of components, many failure points, difficulty in production and maintenance, and high overall cost.
  • the present invention provides an induction cooker circuit based on a SoC chip, which integrates a CPU, a plurality of comparators, an operational amplifier, and an IGBT drive control module controlled by a CPU, and is configured in a SoC chip.
  • the optimized protection circuit is designed to improve the reliability of the induction cooker and reduce the production cost.
  • the SoC chip-based induction cooker circuit of the present invention comprises a rectifier bridge, a filter, a power inverter circuit composed of an IGBT and an LC resonance circuit, and a control unit, and is characterized in that:
  • the control unit adopts a CHK-S008 SoC chip, which integrates a CPU, a plurality of comparators respectively connected to respective inputs of the CPU, an operational amplifier, an A/D converter, and
  • a feedback-excited IGBT driver including an IGBT drive control module in the SoC chip, a first comparator, an external drive circuit, and an output of the IGBT drive control module output in phase with the first comparator
  • An external feedback circuit between the terminals, the output end of the first comparator is connected to the feedback end of the IGBT drive control module, and the external drive circuit is connected between the output end of the IGBT drive control module and the input end of the power inverter circuit Amplifying the output pulse signal of the IGBT drive control module to drive the power inverter circuit;
  • the synchronization signal detection circuit includes a first comparator in the SoC chip, a synchronization signal sampling circuit connected to the input end of the first comparator, and an output terminal connected to the IGBT drive control module
  • the external feedback circuit between the non-inverting input of the comparator, the external feedback circuit feeding back the pulse signal output by the IGBT drive control module to the non-inverting input terminal of the first comparator.
  • the CHK-S008 type SoC chip has a built-in memory, and a section of the memory stores current calibration parameters for calibrating the power of the induction cooker when the CPU runs the calibration procedure.
  • the induction cooker circuit of the invention adopts the SoC chip technology, and the SoC chip has built-in CPU core control technology, which exerts the advantages of frequency stable and active output power tube control signals, and is not susceptible to external interference; high chip integration degree, simple peripheral application circuit, greatly reduced Production and maintenance difficulty and cost.
  • the utility model adopts a feedback excitation type IGBT driving circuit composed of an IGBT driving control module, an external driving circuit and an external feedback circuit in the SoC chip chip, and an output pulse signal of the IGBT driving control module is fed back to the chip through an external feedback circuit to perform an IGBT driving waveform. Correction, optimize the pulse signal waveform, improve the working efficiency; At the same time, the external feedback circuit can stimulate the weak signal of the synchronization signal to avoid the synchronization signal failure when the utility power is low.
  • Figure 1 is a schematic block diagram of the present invention
  • Figure 2 is a circuit diagram of an embodiment thereof
  • FIG. 3 is an internal circuit diagram of a CHK-008 type SoC chip used in the embodiment of FIG. 2.
  • FIG. detailed description is an internal circuit diagram of a CHK-008 type SoC chip used in the embodiment of FIG. 2.
  • the induction cooker circuit mainly includes: a rectifier bridge 1, a filter 2, a power inverter circuit 4 composed of an IGBT and an LC resonance circuit, and a control unit 8.
  • a current sampling circuit 3 a voltage detecting circuit 9 for detecting a voltage signal input to the alternating current power source, a synchronous sampling circuit 5, an external driving circuit 6, an external feedback circuit 7, and the like are provided outside the control unit 8.
  • the control unit 8 adopts the CHK-S008 type SoC chip shown in FIG. 3, and the SoC chip is integrated in the chip.
  • the CHK-S008 SoC chip also integrates a data communication module, memory, etc. for communication with its MCU or display driver chip.
  • a section of the memory in the CHK-S008 SoC chip stores a current calibration parameter for calibrating the power of the induction cooker when the CPU runs the calibration procedure.
  • the storage area is provided with a storage area for storing product information, and the storage area can store information about the induction cooker products, such as: product barcode, manufacturer number, serial number, date of manufacture, and the like.
  • the IGBT drive control module in the SoC chip, the comparator CP0, the external drive circuit 6, and the external feedback circuit 7 connected between the non-inverting input of the comparator CP0 and the output of the IGBT drive control module constitute a feedback-excited IGBT driver
  • the output end of the comparator CP0 is connected to the feedback end of the IGBT drive control module
  • the external drive circuit 6 is connected between the output end of the IGBT pre-driver module and the input end of the power inverter circuit 4 (ie, the gate of the IGBT) Amplifying the output pulse signal of the IGBT pre-driver module to drive the power inverter circuit to work.
  • Comparator CP0, synchronous sampling circuit 5 and external feedback circuit 7 in the SoC chip Forming a synchronous signal detecting circuit
  • the external feedback circuit ⁇ is connected between the non-inverting input terminal of the comparator CP0 and the output end of the IGBT driving control module, and the external feedback circuit feeds back the pulse signal output by the IGBT driving control module to the in-phase of the comparator CP0 Input.
  • the rectifier bridge 1, the filter 2 and the power inverter circuit 4 can adopt a conventional circuit.
  • the power inverter circuit 4 is composed of an IGBT1 and an LC resonance circuit, and the LC resonance circuit is connected to the source and the filter of the IGBT.
  • the resonant inductor is disposed in the heating plate of the induction cooker, and a high-frequency alternating magnetic field is generated on the resonant coil during operation, and the high-frequency alternating magnetic field is converted into thermal energy by the eddy current generated by the iron cookware.
  • the feedback excitation IGBT driver includes: an IGBT drive control module in the CHK-S008 type SoC chip, a comparator CP0, an external drive circuit 6, and an external feedback circuit 7 composed of a resistor R9 and a capacitor C9 connected in series, and the external feedback circuit 7 is connected
  • the output end of the IGBT drive control module (3 Pin ) and the non-inverting input terminal (15 Pin) of the comparator CP0, the output end of the comparator CP0 is connected to the feedback end of the IGBT drive control module, and the pulse signal output by the IGBT drive control module passes through the external
  • the feedback circuit 7 and the comparator CP0 are fed back to the IGBT drive control module to correct the IGBT drive waveform, optimize the pulse signal waveform, and improve the working efficiency.
  • the external driving circuit 6 is connected between the output end of the IGBT driving control module and the IGBT gate of the power inverter circuit 4, and amplifies the output pulse signal of the IGBT pre-drive module to
  • the external driving circuit 6 is composed of transistors Ql, Q2, Q3, and resistors R13, R14.
  • the collector of Q1 is connected to the positive terminal of the power supply through R14, the base is connected to the positive terminal of the power supply through R13, and the base of Q2 and Q3 is connected to the collector of Q4, Q2.
  • the collector is connected to the positive terminal of the power supply, the collector of Q3 and the emitter of Q1 are grounded, and the emitter of Q2 and Q3 is connected as an output terminal.
  • the output terminal is connected to the gate of the IGBT transistor through a current limiting R16, and the base of Q4 is connected to the SoC.
  • the output of the IGBT driver module in the chip is 3 Pin. ;
  • the synchronization signal detecting circuit includes a comparator CP0 in the SoC chip, a synchronous sampling circuit 5 connected to the comparator CP0, and an external feedback circuit 7 composed of a resistor R9 and a capacitor C9 connected in series, and the external feedback circuit is connected to the comparator CP0. Between the non-inverting input and the output of the IGBT drive control module.
  • the synchronous sampling circuit 5 includes a series branch of resistors R4, R5, and R6.
  • the series branch is connected to the 1GBT source for collecting the IGBT source voltage; and the resistor R4 and R5 are connected in series, and the series branch is used.
  • the synchronous sampling signal enters the comparator CP0 to generate a synchronization signal to be supplied to the CPU.
  • the comparator CP0 When the voltage is low, the signals of the two inputs of the comparator CP0 are weak, because the comparator has an Offset, which is likely to cause the comparator to not be present.
  • Diodes D1, D2, a conventional voltage detecting circuit 9 composed of voltage dividing resistors R17 and R18 connected to the negative electrodes D1 and D2, and a capacitor C22, and diodes D1 and D2 are respectively connected to the rectifier bridge AC input line, and the voltage detecting circuit 9 outputs Connect to the input terminal 7Pin of the SoC chip.
  • a constant current circuit RK1 and a resistor R8 connected in series between the rectifier bridge and the IGBT drain constitute a current sampling circuit 3
  • the current sampling circuit 3 outputs an input terminal 13Pin connected to the SoC chip
  • the operational amplifier OP in the SoC chip constitutes a current detecting circuit.
  • the current signal output from the current detecting circuit and the voltage detecting signal output from the voltage detecting circuit 9 are converted by the on-chip A/D converter and input to the CPU to calculate the power.
  • the R5 and R6 series branches form a conventional IGBT recoil high voltage limiting circuit.
  • the common terminals of the resistors R5 and R6 are connected to the 14Pin of the SoC chip through the resistor R7 to the non-inverting input terminal of the comparator CP1 connected to the CPU. Moderately reduce the output power when setting.
  • the comparator CP2 and the external surge voltage sampling circuit in the SoC chip may constitute a voltage surge detecting circuit, and the comparator CP3 and the external inrush current sampling circuit in the SoC chip may constitute a current surge detection.
  • the circuit provides voltage or current surge protection to the induction cooker system via the CPU and/or IGBT drive control module.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inverter Devices (AREA)
  • Induction Heating Cooking Devices (AREA)
  • General Induction Heating (AREA)

Description

基于 SoC芯片的电磁炉电路 技术领域
本发明属于用电能加热的电磁炉技术领域, 尤其是一种基于 SoC (System on a Chip)芯片的电磁炉电路。
背景技术
目前, 主流家用电磁炉应用电路, 一般是采用四比较器或双比较器以及诸 多电阻、 电容、 二极管、 三极管等分立元件,书构成同步、 谐振、 驱动、 电流浪 涌保护等电路, 配合 MCU控制, 实现主谐振电路和各种基本保护功能。 现有 这种电路的缺点是: 元件数量多, 故障点多, 生产、 维修难度大, 整体成本高。
多数电磁炉均通过采样 LC谐振回路两端的 IGBT源极电压和直流电压由一 个比较器比较处理产生系统同步信号, 但当市电电压较低时, 采样信号很微弱, 容易导致比较器不翻转, 同步失效。 发明内容
为避免现有电磁炉技术存在的上述缺陷, 本发明提供一种基于 SoC芯片的 电磁炉电路, 其 SoC芯片内集成了 CPU、 若干比较器、 运算放大器以及由 CPU 控制的 IGBT驱动控制模块, 并配置多种优化设计的保护电路, 以使电磁炉工 作可靠性提高, 生产成本降低。 本发明的基于 SoC芯片的电磁炉电路, 包括整流桥、 滤波器、 由 IGBT和 LC谐振回路组成的功率逆变电路 以及控制单元, 其特征是:
控制单元采用 CHK-S008型 SoC芯片, 该 SoC芯片片内集成有 CPU、分别 与 CPU的相应输入端连接的若干比较器、 一个运算放大器、 A/D转换器、 以及
确 认 本 连接于 CPU的一输出端的 IGBT驱动控制模块;
进一步包括:
一反馈激励式 IGBT驱动器,该 IGBT驱动器包含所述 SoC芯片片内的 IGBT 驱动控制模块、 第一比较器、 外部驱动电路、 以及接于所述 IGBT驱动控制模 块输出端与第一比较器同相输入端之间的外部反馈电路, 第一比较器的输出端 接 IGBT驱动控制模块的反馈端,所述外部驱动电路连接于所述 IGBT驱动控制 模块的输出端与功率逆变电路的输入端之间, 将 IGBT驱动控制模块的输出脉 冲信号放大推动功率逆变电路工作; 以及,
一同步信号检测电路, 该同步信号检测电路包含所述 SoC芯片片内的第一 比较器、连接于第一比较器输入端的同步信号采样电路、 以及连接于所述 IGBT 驱动控制模块输出端与第一比较器同相输入端之间的所述外部反馈电路, 该外 部反馈电路反馈所述 IGBT驱动控制模块输出的脉冲信号至第一比较器的同相 输入端。
所述 CHK-S008型 SoC芯片片内内置一存储器, 该存储器内一区间存储有 电流校准参数, 用于 CPU运行校准程序时校准电磁炉的功率。 本发明电磁炉电路采用 SoC芯片技术, 该 SoC芯片内置了 CPU内核控制 技术, 发挥了频率稳定、 主动输出功率管控制信号, 不易受到外部干扰的优点; 芯片集成度高, 外围应用电路简单, 大大降低了生产、 维修难度与成本。
其采用由 SoC芯片片内的 IGBT驱动控制模块、 外部驱动电路以及外部反 馈电路等组成的反馈激励式 IGBT驱动电路, IGBT驱动控制模块输出脉冲信号 经外部反馈电路反馈回芯片内部对 IGBT驱动波形进行修正, 优化脉冲信号波 形, 提高工作效率; 同时通过外部反馈电路能够对同步信号微弱情况产生激励 作用, 避免同步信号在市电较低时失效。 附图说明
图 1为本发明的原理框图; 图 2为其实施例电路图;
图 3为图 2实施例采用的 CHK-008型 SoC芯片内部电路图。 具体实施方式
以下结合实施例对本发明进一步说明
参照图 1-3, 电磁炉电路主要包括: 整流桥 1, 滤波器 2, 由 IGBT和 LC 谐振回路组成的功率逆变电路 4以及控制单元 8。 在控制单元 8外部还设置有 电流采样电路 3, 检测输入交流电源的电压信号的电压检测电路 9, 同步采样电 路 5, 外部驱动电路 6以及外部反馈电路 7等等。
控制单元 8采用图 3所示 CHK-S008型 SoC芯片, 该 SoC芯片片内集成有
CPU, 分别与 CPU的相应输入端连接的四个比较器 CP0-CP3 , 运算放大器 OP, A/D转换器、 以及连接于 CPU 的 PPG 信号输出端的 IGBT 驱动控制模块。 CHK-S008型 SoC芯片片内还集成一个用于与 ^它 MCU或显示驱动芯片通讯 数据通讯模块、 及存储器等。
其中, CHK-S008型 SoC芯片片内的存储器内一区间存储有电流校准参数, 用于 CPU运行校准程序时校准电磁炉的功率。所述存储器内配置有用于存储产 品信息的存储区, 该存储区内可存储电磁炉产品信息, 如: 产品条形码、 厂商 编号、 流水号、 生产日期等信息。 通过按键操作, 在数码管或者 LED上显示产 品信息, 可以增强信息保密效果, 大大增加产品仿冒的难度。 CHK-S008型 SoC 芯片采用 16 PIN封装。
所述 SoC芯片片内的 IGBT驱动控制模块、.比较器 CP0、 外部驱动电路 6 以及连接于比较器 CP0同相输入端和 IGBT驱动控制模块输出端之间的外部反 馈电路 7组成反馈激励式 IGBT驱动器, 比较器 CP0的输出端接 IGBT驱动控 制模块的反馈端, 外部驱动电路 6连接于所述 IGBT前置驱动模块的输出端与 功率逆变电路 4的输入端(即 IGBT的栅极)之间, 将 IGBT前置驱动模块的输 出脉冲信号放大以推动功率逆变电路工作。
所述 SoC芯片片内的比较器 CP0、 同步采样电路 5以及外部的反馈电路 7 组成同步信号检测电路, 该外部反馈电路 Ί 连接比较器 CP0 的同相输入端和 IGBT驱动控制模块输出端之间, 该外部反馈电路反馈所述 IGBT驱动控制模块 输出的脉冲信号至比较器 CP0的同相输入端。 实施例图 2中, 整流桥 1、 滤波器 2及功率逆变电路 4可采用常规电路, 功率逆变电路 4由 IGBT1和 LC谐振回路组成, LC谐振回路连接在 IGBT的源 极与滤波器的输出端之间, 谐振电感设置在电磁炉的加热板内, 工作时在谐振 线圈上产生高频交变磁场,该高频交变磁场通过铁质炊具产生涡流转换为热能。
反馈激励式 IGBT驱动器包括: CHK-S008型 SoC芯片片内的 IGBT驱动控 制模块、 比较器 CP0、 外部驱动电路 6以及由电阻 R9和电容 C9串联组成的外 部反馈电路 7, 外部反馈电路 7连接在 IGBT驱动控制模块输出端(3 Pin )和比 较器 CP0的同相输入端 (15 Pin) 之间, 比较器 CP0的输出端接 IGBT驱动控 制模块的反馈端, IGBT驱动控制模块输出的脉冲信号通过外部反馈电路 7和比 较器 CP0反馈回 IGBT驱动控制模块内部对 IGBT驱动波形进行修正, 优化脉 冲信号波形, 提高工作效率。 外部驱动电路 6连接于所述 IGBT驱动控制模块 的输出端与功率逆变电路 4的 IGBT栅极之间,将 IGBT前置驱动模块的输出脉 冲信号放大以推动功率逆变电路工作。
外部驱动电路 6由三极管 Ql、 Q2、 Q3 , 及电阻 R13、 R14组成, Q1集电 极通过 R14接电源正端, 基极通过 R13接电源正端, Q2、 Q3的基极接 Q4集 电极, Q2集电极接电源正端, Q3的集电极和 Q1的发射极接地, Q2、 Q3的发 射极连接作为输出端, 该输出端通过限流 R16接 IGBT管栅极, Q4的基极接所 述 SoC芯片片内的 IGBT驱动模块输出端 3 Pin。; . ,
同步信号检测电路包含所述 SoC芯片片内的比较器 CP0、 与比较器 CP0连 接的同步采样电路 5以及由电阻 R9和电容 C9串联组成的外部反馈电路 7, 该 外部反馈电路连接比较器 CP0的同相输入端和 IGBT驱动控制模块输出端之间。
同步采样电路 5包括电阻 R4、 R5、 R6 串联支路, 该串联支路接于 1GBT 源极, 用来采集 IGBT源极电压; 以及, 电阻 R4、 R5串联支路, 该串联支路用 来采集 LC 谐振回路前端的直流电压作为基准。 电磁加热时, 同步采样信号进 入比较器 CP0比较产生同步信号提供给 CPU, 当巿电电压较低时, 比较器 CP0 两输入端信号很微弱, 因比较器存在 Offset, 此时容易导致比较器不翻转, 同步 失效, 而所述 SoC芯片的片内 IGBT驱动控制模块产生的信号较强, 经过 R9、 C9反馈作用至比较器 CP0 同相输入端, 可以对同步信号微弱情况产生激励作 用, 避免同步信号在市电较低时失效。
二极管 Dl、 D2, 与二极管 D1和 D2负极连接的分压电阻 R17 、 R18, 以 及电容 C22等组成的常规电压检测电路 9, 二极管 Dl、 D2正极分别接整流桥 交流输入线, 电压检测电路 9输出接 SoC芯片的输入端 7Pin。
串联在整流桥与 IGBT漏极之间的康铜丝电阻 RK1、以及电阻 R8等构成电 流采样电路 3, 电流采样电路 3输出接所述 SoC芯片的输入端 13Pin, 该电流采 样电路 3和所述 SoC芯片内的运算放大器 OP组成电流检测电路。 电流检测电 路输出的电流信号和电压检测电路 9输出的电压检测信号经片内 A/D转换器变 换后输入 CPU计算功率。
所述 SoC芯片片内的比较器 CP1和上述作为同步采样电路 5的电阻 R4、
R5、 R6串联支路组成一常规 IGBT反冲高压限制电路, 电阻 R5、 R6公共端通 过电阻 R7接 SoC芯片的 14Pin至与 CPU连接的比较器 CP1同相输入端, 当测 得反冲高压超过设定值时适度调低输出功率。
所述 SoC芯片片内的比较器 CP2和外部的浪涌电压采样电路可以组成电压 浪涌检测电路, 所述 SoC芯片片内的比较器 CP3和外部的浪涌电流采样电路 可以组成电流浪涌检测电路,进而通过 CPU和 /或 IGBT驱动控制模块对电磁炉 系统提供电压或电流浪涌保护。

Claims

权 利 要 求 书
1、 一种基于 SoC芯片的电磁炉电路, 包括整流桥、 滤波器、 由 IGBT和 LC谐振回路组成的功率逆变电路 以及控制单元, 其特征是:
控制单元采用 CHK-S008型 SoC芯片,该 SoC芯片片内集成有 CPU、分别 与 CPU的相应输入端连接的若干比较器、 一个运算放大器、 A/D转换器、 以及 连接于 CPU的一输出端的 IGBT驱动控制模块;
进一步包括:
一反馈激励式 IGBT驱动器,该 IGBT驱动器包含所述 SoC芯片片内的 IGBT 驱动控制模块、 第一比较器、 外部驱动电路、 以及接于所述 IGBT驱动控制模 块输出端与第一比较器同相输入端之间的外部反馈电路, 第一比较器的输出端 接 IGBT驱动控制模块的反馈端,所述外部驱动电路连接于所述 IGBT驱动控制 模块的输出端与功率逆变电路的输入端之间, 以推动功率逆变电路工作; 以及, —同步信号检测电路, 该同步信号检测电路包含所述 SoC芯片片内的第一 比较器、连接于第一比较器输入端的同步信号采样电路、 以及连接于所述 IGBT 驱动控制模块输出端与第一比较器同相输入端之间的所述外部反馈电路, 该外 部反馈电路反馈所述 IGBT驱动控制模块输出的脉冲信号至第一比较器的同相 输入端。
2、根据权利要求 1的电路电磁炉, 其特征是: 所述 CHK-S008型 SoC芯片 内置一存储器, 该存储器内一区间存储有电流校准参数, 用于 CPU运行校准 程序时校准电磁炉的功率。
3、 根据权利要求 2的电磁炉电路, 其特征是: 所述存储器内的产品信息存 储区存储有电磁炉产品信息。
4、 根据权利要求 1或 2的电磁炉电路, 其特征是: 所述 CHK-008型 SoC 芯片片内还集成一通讯模块, 用于与其它 CPU或显示驱动芯片交换数据。
5、 根据权利要求 1或 2的电磁炉电路, 其特征是进一步包括: 所述外部驱 动电路由三极管 Ql、 Q2、 Q3 , 及电阻 R13、 R14组成, 三极管 Q1集电极通过 R14接电源正端, 基极通过 R13接电源正端, 三极管 Q2、 Q3的基极接三极管 Q4集电极, 三极管 Q2集电极接电源正端, 三极管 Q3 的集电极和三极管 Q1 的发射极接地, 三极管 Q2、 Q3 的发射极连接作为输出端, 该输出端接 1GBT 栅极, 三极管 Q4的基极接所述 SoC芯片片内的 IGBT前置驱动模块输出端。
6、 根据权利要求 1或 2的电磁炉电路, 其特征是: 所述外部反馈电路由电 阻 R9和电容 C9串联组成。
7、 根据权利要求 1或 2的电磁炉电路, 其特征是: 所述 CHK-S008型 SoC 芯片采用 16 PIN封装。 .
PCT/CN2009/001365 2008-12-12 2009-12-04 基于soc芯片的电磁炉电路 WO2010066097A1 (zh)

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