WO2010065335A1 - Procédé de fabrication d'une bande support de composants - Google Patents

Procédé de fabrication d'une bande support de composants Download PDF

Info

Publication number
WO2010065335A1
WO2010065335A1 PCT/US2009/065255 US2009065255W WO2010065335A1 WO 2010065335 A1 WO2010065335 A1 WO 2010065335A1 US 2009065255 W US2009065255 W US 2009065255W WO 2010065335 A1 WO2010065335 A1 WO 2010065335A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier tape
cutting tool
pockets
side wall
pocket
Prior art date
Application number
PCT/US2009/065255
Other languages
English (en)
Inventor
Shiow Shya Ling
Kam Poi Chia
. Anthonius
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2010065335A1 publication Critical patent/WO2010065335A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Definitions

  • This invention relates generally to carrier tapes for transporting components from a component manufacturer to a different manufacturer that assembles the components into new products.
  • carrier tapes for transporting components from a component manufacturer to a different manufacturer that assembles the components into new products are well known.
  • electronic components are often transferred from a source of such components to a specific location on a circuit board for attachment thereto.
  • Carrier tapes are often manufactured in a thermoforming operation in which a web of thermoplastic polymer is delivered to a mold that forms the component pockets. The thermoformed web is usually cooled to ambient temperature. There is a tendency for components to flip or jump out of the pocket, thus a vacuum hole is incorporated in the bottom of the pocket. This vacuum hole is used to hold down the components while the carrier tape is being indexed by applying a negative pressure to the hole, which holds the component against the bottom of the pocket.
  • the conventional method of producing this vacuum hole is by mechanically punching through the base of the carrier tape.
  • the existing punching method faces its manufacturability limitation.
  • punching creates waste (slugs) and dust that may contaminate the components, which can be of special concern when manufacturing precision electronic parts.
  • the thermoplastic web may be a tough, resilient material that can be difficult to punch. As a result, the punches wear out or break and have to be frequently replaced. Precision punches are expensive and replacing them is a time consuming process that requires delicate realignment and retiming of the new punch.
  • One aspect of the present invention relates to a method of making a flexible carrier tape for storage and delivery of components, the carrier tape comprising a plurality of pockets for carrying the components, the method comprising: (a) providing a web of a flexible thermoplastic polymer formed into the shape of a carrier tape having multiple pockets; (b) exposing the bottom wall of each pocket to a cutting tool to form a vacuum slit in the bottom wall.
  • a carrier tape comprising a series of pockets, each pocket having at least a front side wall, a back side wall, and a bottom wall, wherein the bottom wall contains a vacuum slit.
  • An advantage of at least one embodiment of the present invention is that it provides carrier tapes that can accommodate small components while also allowing for high vacuum pulling power on the components due to the high aspect ratios and large total areas of the vacuum openings.
  • An advantage of at least one embodiment of the present invention is that it provides precisely formed vacuum openings in carrier tapes.
  • An advantage of at least one embodiment of the present invention is that it allows for increased productivity in the carrier tape manufacturing process.
  • An advantage of at least one embodiment of the present invention is that it provides a process for forming vacuum openings in carrier tapes that is easy to set up, easy to maintain, and creates less debris than some prior art processes.
  • vacuum hole means an opening in the bottom wall of a carrier tape pocket having a 1 : 1 aspect ratio.
  • vacuum slit means an opening having greater than a
  • FIG. IA is a fragmentary top perspective view of a prior art carrier tape with a cover thereof having been partially removed to show components stored within the carrier tape;
  • FIG. IB is a fragmentary bottom perspective view of the carrier tape of FIG. IA;
  • FIGS. 2A-2C are fragmentary bottom perspective views of various embodiments of a carrier tape of the present invention.
  • FIG.3 is an illustration of a method of the present invention.
  • FIGS. IA and IB illustrate a prior art carrier tape with a vacuum hole 118.
  • the illustrated carrier tape 100 has a strip portion 102 defining a top surface and a bottom surface opposite the top surface.
  • Strip portion 102 includes longitudinal edge surfaces 104 and 106, and a row of aligned advancement structures 108 and 110 formed in and extending along one, and preferably both, edge surfaces.
  • Advancement structures 108 and 110 provide a means for engagingly receiving an advancement mechanism.
  • a series of pockets 112 is formed in and spaced along strip portion 102, as shown in FIG. IA, the pockets opening through the top surface of the strip portion.
  • each pocket includes four side walls 114, each at generally right angles with respect to each adjacent wall. Side walls 114 adjoin and extend downwardly from the top surface of the strip portion and adjoin bottom wall 116 to form pocket 112.
  • Bottom wall 116 is generally planar and parallel to the plane of strip portion 102. As shown in FIG. IB, bottom wall 116 includes a vacuum hole 118 which is used in applying a vacuum to the pocket to permit more efficient loading of the pockets with components.
  • pockets 112 are designed to conform to the size and shape of the components that they are intended to receive. Although not specifically illustrated, the pockets may have more or less side walls than the four that are shown in the preferred embodiment.
  • each pocket includes at least one side wall that adjoins and extends downwardly from strip portion 102, and a bottom wall that adjoins the side wall to form the pocket.
  • the pockets may be circular, oval, triangular, pentagonal, or have other shapes in outline.
  • Each side wall may also be formed with a slight draft (i.e., a 2° to
  • the depth of the pocket can also vary depending on the component that the pocket is intended to receive.
  • the interior of the pocket may be formed with ledges, ribs, pedestals, bars, mils, appurtenances, and other similar structural features to better accommodate or support particular components.
  • Strip portion 102 may be formed of any polymeric material that has a sufficient gauge and flexibility to permit it to be wound about the hub of a storage reel.
  • polymeric materials may be used including, but not limited to, polyester (e.g., glycol- modified polyethylene terephthalate), polycarbonate, polypropylene, polystyrene, polyvinyl chloride, and acrylonitrile-butadiene-styrene.
  • Strip portion 102 may be optically clear, pigmented or modified to be electrically dissipative.
  • the strip may include an electrically conductive material, such as carbon black or vanadium pentoxide, that is either interspersed within the polymeric material or is subsequently coated onto the strip.
  • the electrically conductive material allows an electric charge to dissipate throughout the carrier tape and preferably to the ground. This feature may prevent damage to components contained within the carrier tape due to an accumulated static electric charge.
  • Carrier tape 100 typically further includes an elongate cover 120, although its inclusion is optional.
  • Cover 120 is applied over the pockets of the carrier tape to retain the components therein.
  • cover 120 is flexible, overlies part or, more preferably, all of pockets 112, and is disposed between the rows of advancement structures 108 and 110 along the length of strip portion 102.
  • Cover 120 is releasably secured to the top surface of strip portion 102 so that it can be subsequently removed to access the stored components.
  • cover 120 includes parallel longitudinal bonding portions 122 and 124 that are bonded to longitudinal edge surfaces 104 and 106, respectively, of strip portion 102.
  • a pressure sensitive adhesive such as an acrylate material, or a heat-activated adhesive such as an ethylene vinyl acetate copolymer, may be used to adhere the cover to edge surfaces 104 and 106.
  • FIG. 2 A illustrates an embodiment of the present invention in the form of carrier tape 200. It is similar to prior art carrier tape 100 except that instead of vacuum holes 118 in the bottom walls 116 of pockets 112, carrier tape 200 of the present invention comprises vacuum slits 228 in the bottom 216 of pockets 212. Although the vacuum slits in FIG. 2A extend the full length (front to back) of pockets 212 and also extend partway into front and back side walls 214, in other embodiments, vacuum slits 228 may be smaller such that they only extend over a portion of the length of pocket 212.
  • FIGS. 2B and 2C show examples of embodiments of the present invention having partial vacuum slits. In FIG.
  • vacuum slit 228 extends through part of bottom wall 216 and through one side wall 214 (either the front or back side wall could include vacuum slit 228).
  • vacuum slit 228 extends only through part of bottom wall 216 and does not extend through either the front or back side wall 214.
  • vacuum slits 228 may be oriented in any direction on the bottom wall 216 of the pockets 212.
  • slits oriented in the longitudinal direction of the carrier tape 100 are typically preferred.
  • a punching tool is used to mechanically punch out vacuum holes 118 in the bottom walls 116 of the carrier tapes 100.
  • the punching tool has a series of adjacent punching pins that punch holes in several adjacent pockets at once.
  • the punching pins must be precisely spaced apart so that each pin punctures the bottom wall 116 of a pocket 112 at an appropriate location. Manual alignment of each punching pin is done to ensure proper alignment to the critical feature of the carrier tape. Regular maintenance and refurbishing are required to ensure the sharpness of tool to provide cleanly punched hole.
  • a single rotating or stationary tool can be used to continuously create openings in the pocket bottoms of a carrier tape.
  • the method allows faster set up and also consistency of the formed openings. Minimal maintenance and refurbishing are required due to the better properties of the cutting tool.
  • the method of the present invention includes aligning a cutting tool with the bottom of the carrier tape pockets and bringing the cutting tool into contact with each successive pocket bottom on a continuous basis. This can be done in a number of ways.
  • the cutting tool may be linear or round and may be stationary or movable. The cutting tool may be moved while the tape stays stationary; the tape may be moved while the cutting tool stays stationary; or both the cutting tool and the tape may be moved.
  • Vacuum openings may be formed in the bottom walls of carrier tape pockets in a batch process, i.e., vacuum openings are formed in a group of adjacent pockets at the same time, then the continuous carrier tape web is advanced and vacuum openings are formed in a second group of adjacent pockets at the same time, and so on.
  • vacuum opening are formed in one pocket bottom after another on a continuous basis, i.e., the continuous carrier tape web (or the cutting tool) continuously moves at a constant speed as each subsequent pocket bottom is brought into contact with the cutting tool.
  • a linear blade such as a knife blade
  • a rotary cutting tool having a circular moving blade such as a tool used to dice semiconductor wafers
  • a suitable rotary cutting tool is a dicing saw such as the one available under the trade designation DFD6340 from DISCO Corporation, Japan.
  • the carrier tape When the pockets are brought into contact with the cutting tool, the carrier tape may be held flat or may be held in a curved position. If the carrier tape is held in a curved position, the bottom surface 216 of the individual pockets will be spaced further apart from each other than when the carrier tape is held in a flat position.
  • the arc of the curved position, as well as the size and shape of the cutting tool, will partially determine how many pockets are simultaneously in contact with the cutting tool. If the arc is large, many pockets may contact the cutting tool at the same time. If the arc is small, it may be possible to bring a single pocket at a time into contact with the cutting tool. To achieve the partial vacuum slits shown in FIGS.
  • the partial vacuum slits of FIGS. 2B and 2C may also be achieved if the cutting tool is a rotary tool 500 having an arc substantially smaller than the arc of the carrier tape 200, as is illustrated in FIG. 3.
  • a benefit of the partial vacuum slits is that the pocket retains a substantial amount of structural support while also providing a vacuum feature.
  • the carrier tapes of the invention are particularly useful in the electronics industry for transporting and delivering electronic components such as memory chips, integrated circuit chips, resistors, connectors, dual in-line processors, capacitors, gate arrays, capacitors, etc.
  • the carrier tapes of the invention may also be used to transport other small components that are typically delivered to precision placement machines such as watch springs, small screws, surface mount electric component shields, and the like.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

La présente invention concerne une bande support flexible présentant de multiples poches destinées à stocker et distribuer des composants, la bande support étant fabriquée en fournissant une toile de polymère thermoplastique flexible façonnée de manière à avoir la forme d'une bande support présentant de multiples poches et exposant la paroi inférieure de chaque poche à un outil de coupe pour former une fente de vide dans la paroi inférieure.
PCT/US2009/065255 2008-12-03 2009-11-20 Procédé de fabrication d'une bande support de composants WO2010065335A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11957808P 2008-12-03 2008-12-03
US61/119,578 2008-12-03

Publications (1)

Publication Number Publication Date
WO2010065335A1 true WO2010065335A1 (fr) 2010-06-10

Family

ID=42233556

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/065255 WO2010065335A1 (fr) 2008-12-03 2009-11-20 Procédé de fabrication d'une bande support de composants

Country Status (2)

Country Link
TW (1) TW201028351A (fr)
WO (1) WO2010065335A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717003A (zh) * 2012-09-28 2014-04-09 保力马科技(日本)株式会社 导电性橡胶构件包装体及导电性橡胶构件的供给方法
CN106686968A (zh) * 2015-11-05 2017-05-17 Juki株式会社 安装装置及部件退还方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478297B (zh) * 2011-04-25 2015-03-21 Lextar Electronics Corp 電子元件之封合帶

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729963A (en) * 1995-07-11 1998-03-24 Minnesota Mining And Manufacturing Company Component carrier tape
US5846621A (en) * 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
JPH1159725A (ja) * 1997-08-15 1999-03-02 Hitachi Ltd 電子部品搬送テープおよび電子部品の収容方法
US20040011700A1 (en) * 2002-05-01 2004-01-22 Samuil Brahmbhatt Carrier tape for electronic components
JP2007145365A (ja) * 2005-11-28 2007-06-14 Ueno Seiki Kk テーピング装置及びその制御方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729963A (en) * 1995-07-11 1998-03-24 Minnesota Mining And Manufacturing Company Component carrier tape
US5846621A (en) * 1995-09-15 1998-12-08 Minnesota Mining And Manufacturing Company Component carrier tape having static dissipative properties
JPH1159725A (ja) * 1997-08-15 1999-03-02 Hitachi Ltd 電子部品搬送テープおよび電子部品の収容方法
US20040011700A1 (en) * 2002-05-01 2004-01-22 Samuil Brahmbhatt Carrier tape for electronic components
JP2007145365A (ja) * 2005-11-28 2007-06-14 Ueno Seiki Kk テーピング装置及びその制御方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717003A (zh) * 2012-09-28 2014-04-09 保力马科技(日本)株式会社 导电性橡胶构件包装体及导电性橡胶构件的供给方法
CN106686968A (zh) * 2015-11-05 2017-05-17 Juki株式会社 安装装置及部件退还方法

Also Published As

Publication number Publication date
TW201028351A (en) 2010-08-01

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