WO2010057933A1 - Integrated circuit device equipped with different connection means - Google Patents

Integrated circuit device equipped with different connection means Download PDF

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Publication number
WO2010057933A1
WO2010057933A1 PCT/EP2009/065416 EP2009065416W WO2010057933A1 WO 2010057933 A1 WO2010057933 A1 WO 2010057933A1 EP 2009065416 W EP2009065416 W EP 2009065416W WO 2010057933 A1 WO2010057933 A1 WO 2010057933A1
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WO
WIPO (PCT)
Prior art keywords
type
series
bonding pads
surface coating
integrated circuit
Prior art date
Application number
PCT/EP2009/065416
Other languages
French (fr)
Inventor
Benoit Arnal
Michel Thill
Marc Parra
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of WO2010057933A1 publication Critical patent/WO2010057933A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Definitions

  • the invention relates to an integrated circuit device equipped with a means of connection.
  • the integrated circuits, or chips are electronic circuits that are etched into a substrate, such as for example silicone. Bare chips are relatively fragile and must be handled in a clean environment. These circuits must generally be protected by a package for their final application. This package is adapted to the future purpose of the integrated circuit and one package may contain one or several chips.
  • packages that are intended to be used as removable devices. This type of package is generally known as chip card (bank card, SIM card or 3G plug) or memory card (SD card, MMC or others). Normally, these packages can be handled manually in all kinds of environments and they have bonding pads enabling a great number of connections and disconnections without premature wear and tear.
  • SIM cards which are intended to be integrated into equipment to provide machine-to- machine communication. It is planned to embed the SIM card into the equipment to which it is connected while at the same time minimising mass production and miniaturisation costs.
  • SD card type memory in an on-board system without needing to integrate a card reader.
  • a first solution is to use a card reader into which the card is glued, thus preventing it from being detached from the reader.
  • a second solution consists in soldering the SIM card.
  • the contacts of the SIM card do not enable high quality soldered seams as the exterior contacts are generally made from or covered by a material which ensures good electrical contact but is not suitable for soldering.
  • SIM card circuits in packages which are better suited for soldering.
  • SIM cards are personalized, this means individual cards differ both in their content and with respect to external markings on their package.
  • the chip card industry uses form factors which are very different from conventional packages and the tools are not suitable for personalising this type of package. Besides, it would be preferable to use only one form factor for the same type of product to enable greater flexibility within the chain of production.
  • the invention solves all of the problems mentioned hereinbefore by using a unique form factor whose bonding pads are divided into two parts to enable two applications of this form factor.
  • a first series of bonding pads is intended to be soldered onto a printed circuit and a second series of bonding pads is intended to be used for multiple connections / disconnections .
  • the invention is a device comprising a package which houses at least one integrated circuit with a series of bonding pads.
  • the package comprises a first and a second series of bonding pads on one side.
  • the first series of bonding pads is coated with a surface coating of a first type and the second series of bonding pads is coated with a surface coating of a second type which differs from the surface coating of the first type.
  • One bonding pad of the first series is electrically connected to a bonding pad of the second series and a contact terminal of the integrated circuit.
  • an electronic chip device is equipped with two series of bonding pads providing the same functionalities.
  • each series of bonding pads is dedicated to a particular use.
  • a first series of bonding pads is intended to be soldered.
  • a second series of bonding pads is intended to be used with a connector by way of a simple electric contact.
  • Each series of bonding pads is covered with a surface coating suitable for its respective type of application.
  • the first series of bonding pads has a surface coating of a first type and the second series of bonding pads has a surface coating of a second type.
  • the bonding pads of the second series may have a greater surface than the surface of the bonding pads of the first series to ensure a contact connection via the greatest possible surface while a smaller surface can be used for the soldering seams.
  • the surface coating of the second type can be more conductive than the surface coating of the first type since the contact connection requires a very high conductivity at the contact point.
  • the surface coating of the second type may be harder than the surface coating of the first type to limit the wear and tear resulting from a great number of connections / disconnections.
  • the surface coating of the first type can have a stronger adhesion power with respect to the soldering seam than the surface coating of the second type to obtain the best quality soldering seam possible.
  • the surface coating of the first type could be composed of gold, silver or tin or a nickel/ palladium/ gold, nickel/ palladium/ silver or nickel/ tin alloy.
  • the surface coating of the second type could, for example, be composed of copper, a gold/ nickel alloy or a copper/ gold/ nickel alloy.
  • Figures Ia and Ib show a first embodiment of a device according to the invention.
  • Figure Ib refers to the same device as the one shown in figure Ia according to section A-A, the same references are used for designating the same elements.
  • the device comprises an isolating substrate 10 which is equipped with first bonding pads 11 and second bonding pads 12 on a second side. These first and second bonding pads 11 and 12 are glued onto the substrate 10 and are made from different materials.
  • the first pads are made from tinned copper, that means copper coated with tin and the second pads are made from a copper/ gold/ nickel alloy.
  • the substrate 10 is equipped with a metal covered hole 13 to provide an electric connection between a first bonding pad 11 and a respective second bonding pad 12 by way of a metal conductor 14, which could, for example, be made from copper and glued onto the second side of substrate 10.
  • An integrated circuit 15 is glued onto the second face of substrate
  • each terminal of the integrated circuit 15 is connected to a first bonding pad 11 and a second bonding pad 12.
  • a resin coating is then moulded over the integrated circuit 15 and the entire second side of the substrate to obtain a complete package.
  • the number of contact terminals on the integrated circuit may differ from the number of first bonding pads or second bonding pads.
  • particular terminals of the integrated circuit 15 may only be useful for one type of application of the soldered or removable connection type. Accordingly, within the scope of this invention as defined in the claims it is also possible to have a first pad 11 which is not connected to a second pad 12 while being connected to a terminal of the integrated circuit 15. Also, only part of the first bonding pads 11 can be connected to part of the second bonding pads and the terminals of the integrated circuit 15.
  • This first embodiment is particularly well- suited for memory cards since they dispose of a certain amount of space on the package next to their electric contacts. Besides, the fact to have first and second bonding pads 11 and 12 which do not have direct contact but contact provided by the conductors 14 via an isolating layer consisting of the substrate 10 prevents a thermal bridge between the two materials which can, in certain cases, impair the soldering conditions.
  • the SIM cards can have the format of a credit card and comprise a removable part which can be reduced to the size of the connector. This format is known under the name "3G plug".
  • Figures 2a and 2b show a 3G plug manufactured according to the invention.
  • Figure 2 a shows a chip card connector that could appear to be a conventional connector.
  • the contacts defined for a card according to standard ISO 7816 are smaller than the size of the connector. Therefore, according to the invention, each contact of the connector is divided into two bonding pads.
  • an isolating substrate 20 comprises on a first side conductors 24, for example made from copper, which form the connector as it is known in the art.
  • this connector is subject to a first plating of its exterior portion with a first material to form the first bonding pads 21 and a second plating with a second material to form the second bonding pads 22.
  • the second bonding pads 22 are, amongst others, in conformity with standards ISO 7816.
  • these platings can be realized by masking one part of the connector and than applying the desired plating by electrolysis.
  • each first bonding pad 21 is electrically connected with one of the second bonding pads 22 via the conductor 24 which was plated.
  • An integrated circuit 25 is glued onto the second side of the substrate 20.
  • Jumper wires 26 are added to establish electric contact between the terminals of the integrated circuit 25 and the conductor 24 via holes 23 which are made in the substrate 20.
  • a resin 27 is then applied to the chip 25 and the jumper wires to form a chip card module.
  • the module which is formed in this way, is then glued into a previously produced chip card housing 28.
  • a person skilled in the art is able to realize this embodiment using all chip card production techniques.
  • a metal layer can be applied on the second side and communicate with the conductors 24.
  • Several chips can be connected together. Not all conductors 24 must be necessarily used, i.e. connected to the chip 25.
  • the chip can be mounted as "flip-chip", that means turned around and soldered onto a metal layer. Different chip plating techniques can be used. Besides, in the described example two platings are realized while it is possible to perform only one plating, if the material for the conductors 24 enables the fulfilment of the function of the first pads 21 or the second pads 22. If two platings are realized it is possible to perform only one masking process before the electrolysis: a first plating is realized, then the corresponding pads of this plating are masked and afterwards the second plating is realized.
  • the second embodiment enables the production of SIM cards according to the invention which can be used in all current telephones while they can be soldered directly onto printed cards ensuring a high quality soldering seam.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

This invention presents an integrated circuit device whose bonding pads 11 and 12 are divided to enable two applications. A first series of bonding pads 11 is intended to be soldered onto a printed circuit and a second series of bonding pads 12 is intended to be used for multiple connections/disconnections. A bonding pad 11 of the first series is electrically connected to a bonding pad 12 of the second series and a contact terminal of the integrated circuit 15.

Description

INTEGRATED CIRCUIT DEVICE EQUIPPED WITH DIFFERENT CONNECTION MEANS
The invention relates to an integrated circuit device equipped with a means of connection.
The integrated circuits, or chips, are electronic circuits that are etched into a substrate, such as for example silicone. Bare chips are relatively fragile and must be handled in a clean environment. These circuits must generally be protected by a package for their final application. This package is adapted to the future purpose of the integrated circuit and one package may contain one or several chips.
There are packages that are intended to be mounted on integrated circuits by soldering. These packages can be easily handled by industrial equipment and are intended to be soldered. Multiple form factors are used.
There are packages that are intended to be used as removable devices. This type of package is generally known as chip card (bank card, SIM card or 3G plug) or memory card (SD card, MMC or others). Normally, these packages can be handled manually in all kinds of environments and they have bonding pads enabling a great number of connections and disconnections without premature wear and tear.
Currently, certain types of integrated circuits which are very widely used with chip card type packages are now required for use in more industrial environments. This is, for example, the case with SIM cards which are intended to be integrated into equipment to provide machine-to- machine communication. It is planned to embed the SIM card into the equipment to which it is connected while at the same time minimising mass production and miniaturisation costs. Another possible application is the use of an SD card type memory in an on-board system without needing to integrate a card reader. In the case of the example of a SIM card, a first solution is to use a card reader into which the card is glued, thus preventing it from being detached from the reader. A second solution consists in soldering the SIM card. However, the contacts of the SIM card do not enable high quality soldered seams as the exterior contacts are generally made from or covered by a material which ensures good electrical contact but is not suitable for soldering.
A third solution consists in using SIM card circuits in packages which are better suited for soldering. However, in this case another problem must be faced; SIM cards are personalized, this means individual cards differ both in their content and with respect to external markings on their package. The chip card industry uses form factors which are very different from conventional packages and the tools are not suitable for personalising this type of package. Besides, it would be preferable to use only one form factor for the same type of product to enable greater flexibility within the chain of production.
The invention solves all of the problems mentioned hereinbefore by using a unique form factor whose bonding pads are divided into two parts to enable two applications of this form factor. A first series of bonding pads is intended to be soldered onto a printed circuit and a second series of bonding pads is intended to be used for multiple connections / disconnections . More specifically, the invention is a device comprising a package which houses at least one integrated circuit with a series of bonding pads. The package comprises a first and a second series of bonding pads on one side. The first series of bonding pads is coated with a surface coating of a first type and the second series of bonding pads is coated with a surface coating of a second type which differs from the surface coating of the first type. One bonding pad of the first series is electrically connected to a bonding pad of the second series and a contact terminal of the integrated circuit.
The invention will be better understood when consideration is given to the following description. This description makes reference to the annexed drawings wherein:
- figures Ia and Ib show a first embodiment of the invention, and
- figures 2a and 2b show a second embodiment of the invention.
According to the invention, an electronic chip device is equipped with two series of bonding pads providing the same functionalities. However, each series of bonding pads is dedicated to a particular use. A first series of bonding pads is intended to be soldered. A second series of bonding pads is intended to be used with a connector by way of a simple electric contact. Each series of bonding pads is covered with a surface coating suitable for its respective type of application. The first series of bonding pads has a surface coating of a first type and the second series of bonding pads has a surface coating of a second type.
Thus, forms of bonding pads and materials which are suitable for the application are chosen. The bonding pads of the second series may have a greater surface than the surface of the bonding pads of the first series to ensure a contact connection via the greatest possible surface while a smaller surface can be used for the soldering seams. The surface coating of the second type can be more conductive than the surface coating of the first type since the contact connection requires a very high conductivity at the contact point. The surface coating of the second type may be harder than the surface coating of the first type to limit the wear and tear resulting from a great number of connections / disconnections. The surface coating of the first type can have a stronger adhesion power with respect to the soldering seam than the surface coating of the second type to obtain the best quality soldering seam possible. Of course, compromises can be made with respect to the materials and it is not necessary to meet all specifications indicated above at the same time. Preferably, the most suitable materials and forms for the intended purpose would be chosen, since a compromise can result in failures regarding one of the two applications. For example, the surface coating of the first type could be composed of gold, silver or tin or a nickel/ palladium/ gold, nickel/ palladium/ silver or nickel/ tin alloy. The surface coating of the second type could, for example, be composed of copper, a gold/ nickel alloy or a copper/ gold/ nickel alloy.
Figures Ia and Ib show a first embodiment of a device according to the invention. Figure Ib refers to the same device as the one shown in figure Ia according to section A-A, the same references are used for designating the same elements. The device comprises an isolating substrate 10 which is equipped with first bonding pads 11 and second bonding pads 12 on a second side. These first and second bonding pads 11 and 12 are glued onto the substrate 10 and are made from different materials. By way of example, the first pads are made from tinned copper, that means copper coated with tin and the second pads are made from a copper/ gold/ nickel alloy. The substrate 10 is equipped with a metal covered hole 13 to provide an electric connection between a first bonding pad 11 and a respective second bonding pad 12 by way of a metal conductor 14, which could, for example, be made from copper and glued onto the second side of substrate 10. An integrated circuit 15 is glued onto the second face of substrate
10 and jumper wires 16 are added according to a known technique to ensure the electric connection between the contact terminals of the integrated circuit 15 and the metal conductors 14. Thus, each terminal of the integrated circuit 15 is connected to a first bonding pad 11 and a second bonding pad 12. A resin coating is then moulded over the integrated circuit 15 and the entire second side of the substrate to obtain a complete package.
It will be obvious to a person skilled in the art that variants are possible. Particularly, the number of contact terminals on the integrated circuit may differ from the number of first bonding pads or second bonding pads. Also, particular terminals of the integrated circuit 15 may only be useful for one type of application of the soldered or removable connection type. Accordingly, within the scope of this invention as defined in the claims it is also possible to have a first pad 11 which is not connected to a second pad 12 while being connected to a terminal of the integrated circuit 15. Also, only part of the first bonding pads 11 can be connected to part of the second bonding pads and the terminals of the integrated circuit 15.
This first embodiment is particularly well- suited for memory cards since they dispose of a certain amount of space on the package next to their electric contacts. Besides, the fact to have first and second bonding pads 11 and 12 which do not have direct contact but contact provided by the conductors 14 via an isolating layer consisting of the substrate 10 prevents a thermal bridge between the two materials which can, in certain cases, impair the soldering conditions.
If, on the contrary, a form factor close to the factor of chip cards is wanted for reasons of compatibility with existing standards, the second embodiment which is based on a connector in compliance with the standard ISO 7816 should be taken into consideration. The SIM cards can have the format of a credit card and comprise a removable part which can be reduced to the size of the connector. This format is known under the name "3G plug". Figures 2a and 2b show a 3G plug manufactured according to the invention. Figure 2 a shows a chip card connector that could appear to be a conventional connector. However, it will be apparent to a person skilled in the art that the contacts defined for a card according to standard ISO 7816 are smaller than the size of the connector. Therefore, according to the invention, each contact of the connector is divided into two bonding pads. As generally known, an isolating substrate 20 comprises on a first side conductors 24, for example made from copper, which form the connector as it is known in the art. However, this connector is subject to a first plating of its exterior portion with a first material to form the first bonding pads 21 and a second plating with a second material to form the second bonding pads 22. The second bonding pads 22 are, amongst others, in conformity with standards ISO 7816. By way of example, these platings can be realized by masking one part of the connector and than applying the desired plating by electrolysis. With this embodiment each first bonding pad 21 is electrically connected with one of the second bonding pads 22 via the conductor 24 which was plated.
An integrated circuit 25 is glued onto the second side of the substrate 20. Jumper wires 26 are added to establish electric contact between the terminals of the integrated circuit 25 and the conductor 24 via holes 23 which are made in the substrate 20. A resin 27 is then applied to the chip 25 and the jumper wires to form a chip card module. The module which is formed in this way, is then glued into a previously produced chip card housing 28.
A person skilled in the art is able to realize this embodiment using all chip card production techniques. In particular, a metal layer can be applied on the second side and communicate with the conductors 24. Several chips can be connected together. Not all conductors 24 must be necessarily used, i.e. connected to the chip 25. The chip can be mounted as "flip-chip", that means turned around and soldered onto a metal layer. Different chip plating techniques can be used. Besides, in the described example two platings are realized while it is possible to perform only one plating, if the material for the conductors 24 enables the fulfilment of the function of the first pads 21 or the second pads 22. If two platings are realized it is possible to perform only one masking process before the electrolysis: a first plating is realized, then the corresponding pads of this plating are masked and afterwards the second plating is realized.
It will be obvious to a person skilled in the art that the second embodiment enables the production of SIM cards according to the invention which can be used in all current telephones while they can be soldered directly onto printed cards ensuring a high quality soldering seam.

Claims

1. Device comprising a package housing at least one integrated circuit (15, 25) disposing of a series of contact terminals, with the package comprising on one side:
- a first series of bonding pads (1 1 , 21), with such bonding pads (1 1 , 21) being coated with a surface coating of a first type,
- a second series of bonding pads (12, 22), with such bonding pads (12, 22) being coated with a surface coating of a second type which is different from the surface coating of the first type, in which a bonding pad (1 1 , 21) of the first series is electrically connected to a bonding pad (12, 22) of the second series and a contact terminal of the integrated circuit (15, 25).
2. Device according to claim 1 , wherein the surface coating of the first type is intended to be soldered and the surface coating of the second type is intended to ensure an electric contact by way of simple contact.
3. Device according to claim 1 , wherein the bonding pads (12, 22) of the second series have a larger surface than the bonding pads (1 1 , 21) of the first series.
4. Device according to claim 1 , wherein the surface coating of the second type is more conductive than the surface coating of the first type.
5. Device according to claim 1 , wherein the surface coating of the second type is harder than the surface coating of the first type.
6. Device according to claim 1 , wherein the surface coating of the first type has a stronger adhesion power with respect to the soldering seam than the surface coating of the second type.
7. Device according to claim 1 , wherein the surface coating of the first type consists of a material chosen from: - gold,
- silver,
- tin,
- a nickel/ palladium/ gold alloy,
- a nickel/ palladium/ silver alloy, - or nickel / tin.
8. Device according to claim 1 , wherein the surface coating of the second type consists of a material chosen from:
- copper, - a gold/ nickel alloy,
- a copper/ gold/ nickel alloy.
9. Device according to claim 1 , wherein the second series of bonding pads (22) is arranged in conformity with standard ISO 7816.
10. Device according to claim 1 , wherein the bonding pads (21 , 22) of the first and second series are realized on the same conductor (24) and wherein the first and second types of coatings differ at least in one plating of different materials.
1 1. Device according to claim 1 , wherein the bonding pads (1 1 , 12) of the first and second series have electric contact via a conductor (14) separated by such bonding pads (1 1 , 12) by at least one isolating layer (10) equipped with metal coated holes (13).
PCT/EP2009/065416 2008-11-21 2009-11-18 Integrated circuit device equipped with different connection means WO2010057933A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08305818.0 2008-11-21
EP08305818A EP2189928A1 (en) 2008-11-21 2008-11-21 Device with integrated circuit equipped with different connection means

Publications (1)

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WO2010057933A1 true WO2010057933A1 (en) 2010-05-27

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WO (1) WO2010057933A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2786009A1 (en) * 1998-11-16 2000-05-19 Gemplus Card Int METHOD FOR MANUFACTURING A HYBRID CHIP CARD BY DOUBLE-SIDED PRINTING
US6326683B1 (en) * 1996-05-17 2001-12-04 Siemens Aktiengesellschaft Carrier element for a semiconductor chip
WO2002013021A2 (en) * 2000-08-04 2002-02-14 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
US20070138301A1 (en) * 2005-10-14 2007-06-21 Infineon Technologies Ag Smart card module
ES2288137A1 (en) * 2006-03-09 2007-12-16 Microelectronica Española S.A.U. Smartcard and method for manufacturing said card

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326683B1 (en) * 1996-05-17 2001-12-04 Siemens Aktiengesellschaft Carrier element for a semiconductor chip
FR2786009A1 (en) * 1998-11-16 2000-05-19 Gemplus Card Int METHOD FOR MANUFACTURING A HYBRID CHIP CARD BY DOUBLE-SIDED PRINTING
WO2002013021A2 (en) * 2000-08-04 2002-02-14 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
US20070138301A1 (en) * 2005-10-14 2007-06-21 Infineon Technologies Ag Smart card module
ES2288137A1 (en) * 2006-03-09 2007-12-16 Microelectronica Española S.A.U. Smartcard and method for manufacturing said card

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