WO2010057682A1

WO2010057682A1 - Ready-to-connect led module body

Info

Publication number: WO2010057682A1
Application number: PCT/EP2009/054181
Authority: WO
Inventors: Uwe Fischer; Sergio Drawert
Original assignee: Rzb Rudolf Zimmermann, Bamberg Gmbh; Neumüller Elektronik GmbH
Priority date: 2008-11-21
Filing date: 2009-04-08
Publication date: 2010-05-27
Also published as: ATE515797T1; DE102008058494A1; EP2206150B1; EP2206150A1

Abstract

The invention relates to a ready-to-connect LED module body, comprising at least one light-emitting diode chip, which is arranged on a flat circuit board, wherein the at least one diode chip is covered with an electrically insulating, transparent, elastic or plastic capsule material. In addition, there are terminal fields on the circuit board that are electrically connected to the diode chip. According to the invention, the terminal fields are contacted with a flexible or rigid external terminal means. At least one current-controlling or current-limiting element for the at least one diode chip is arranged on the circuit board, in order to enable direct operation on a conventional electric grid via the connection means. In addition, a cast or injection-molded block is provided, which in one embodiment leaves the bottom side of the circuit board and a top side section having the capsule material free, but otherwise completely surrounds the circuit board to integrate a section of the terminal means. The cast or injection-molded block may also have, in addition to the flat circuit board, at least one means for fastening, wherein the free bottom side of the circuit board forms a cooling surface and/or the bottom side is designed as a thermal coupling surface.

Description

Ready-to-connect LED module body

description

The invention relates to a ready-to-connect LED (light-emitting diodes) module body comprising at least one light emitting diode chip, which is arranged on a planar Wirrdu ngsträger, wherein the at least one diode chip is covered with an electrically insulating, translucent, elastic or plastic capsule material, as well as on the wiring substrate located connector fields, which are in electrical connection with the diode chip, according to the preamble of patent claim 1.

From DE 20 2008 009 797 U l a LED-based lighting fixture is already known, which consists of at least one module having an optical system and a light transparent cover. The optical system comprises at least one LED and a reflector with special facets spanning the light exit cone of the LED, which extend at a specific angle to one another in such a way that the light emitted by the LED is deflected substantially over the facets of the reflector to the light utility plane.

This prior art LED-based lighting fixture is designed for both the illumination and the illumination of interiors as well as for outdoor applications. To avoid dirt deposits and signs of aging, the module constructed from the optical system and the light-transparent cover is encapsulated. Several modules can be used within an LED-based lighting fixture. These are then preferably arranged in a matrix-like manner in columns and rows to one another and interconnected accordingly. An existing rear side of a carrier board has a heat conduction layer in the form of a copper or aluminum conductive foil provided for the purpose of improved heat dissipation. If such an LED arrangement is to be operated directly at the mains, care must be taken to ensure sufficient protection against contact, taking into account other protection class provisions. An operation on Niederspannu ngsnetz, z. B. in the range 220 V to 400 V, requires one Series connection of a large number of modules, each with bypass diodes, in order to ensure functional integrity in the event of a module failure.

In the power LED module according to DE 20 2005 012 652 U l at least one power LED is arranged on a circuit board. In addition, a provided for cooling the LED heat sink made of metal is present. The board is provided in a lying under the LED area with a through hole, in which the heat sink is fitted to the back contact surface of the LED fitting. In this solution, it is therefore necessary to provide a special recess in the board in order to produce a heat-conductive contact between the heat sink and the actual light-emitting diode. In particular, in the case of ceramic wiring substrates or circuit boards, such a hole can be introduced only in the so-called green state of the ceramic. However, due to the sintering process, dimensioning changes occur during the firing or sintering of the ceramic, with the result that difficulties in exact positioning occur when inserting the heat sink into the corresponding through-holes.

In the LED module according to DE 20 2007 007 581 U l, a voluminous heat sink is present which has an upper recess in an upper side, a groove in the upper recess and a plurality of mounting through holes which pass through the upper and lower sides in the heat sink introduced, in particular drilled. In the groove of the heat sink is a light emitting diode chip. Furthermore, a plurality of printed circuit boards made of metal, which are attached to the heat sink at the bottom. The circuit boards have an upright pin which is fixed to the mounting through holes of the heat sink, respectively. These bolts then take over the electrical contact. The assembly described above is encapsulated with a translucent resin at least in the region of the groove where the diode chip is located. In addition, it is possible to fix a lens-shaped cover with a corresponding snap holder on the module. Even with this presented embodiment of an LED module, it is not possible to ensure the necessary degree of protection, in particular when operating on low-voltage networks without further and additional measures. From the foregoing, it is therefore an object of the invention to provide a further developed, ready-to-connect LED module body, comprising at least one light-emitting diode chip, which is arranged on a sheet-shaped wiring substrate, which consists of a few parts, which are easily attached to a lamp or can be integrated in this and has the necessary contact protection and thus is directly suitable for operation on a low-voltage network.

The object of the invention is achieved by a ready-connection LED module body according to the combination of features according to claim 1, wherein the dependent claims represent at least expedient refinements and developments.

Accordingly, it is assumed that a ready-to-connect LED module body comprises at least one light-emitting diode chip which is arranged on a planar wiring carrier. The at least one diode chip is optionally at least partially surrounded by a reflector and is covered with an electrically insulating, translucent, elastic or plastic capsule material. On the wiring substrate are also Anschl ussfelder that are in electrical connection with the diode chip. This electrical connection can z. B. be realized by so-called chip bonding.

According to the connection pads are contacted with a flexible or rigid, external connection means. This contact can z. B. done by a soldering process.

In addition, at least one current-controlling or current-limiting element, eg. B. a series resistor for the at least one diode chip in order to enable via the connection means an immediate operation on a conventional electrical low-voltage network.

Furthermore, a potting or Verspritzblock is formed, which in one embodiment, the underside of the wiring substrate as a thermal Coupling surface and a top-side section with the capsule material leaves free. Otherwise, the casting or injection block encloses the wiring carrier completely with the involvement of a portion of the connection means. As a result, the desired contact protection, in particular in the field of connection fields is ensured. At the same time, the potting or injection block effects a kink protection and a strain relief with regard to the external connection means.

Furthermore, the casting or injection block has at least one means for fixing outside the area-shaped wiring carrier, wherein a free underside of the wiring carrier forms a cooling surface.

From the above it can be seen that the potting or Verspritzblock a bottom, designed as a thermally conductive plate, free or free surfaces u masst. In this way, optimal heat radiation or coupling to a heat sink can take place and there is no disadvantageous overheating of the semiconducting-pn junction in the diode chip. In a preferred embodiment, the material of the potting or Verspritzblocks is slightly elastic and can be molded or conform to the surface to which the module body by z. As screws or rivets is attached. Preferably, the surface that comes into contact with the free underside of the wiring substrate, good heat conducting. This heat-conducting surface can, for. B. be a metallic component of a lamp body or even a separate heat sink.

To ensure the desired contact protection, the potting or Verspritzblockmaterial consists of an electrically insulating substance or mixture.

In the area of the capsule material, the potting or injection block may have a concave section, as it were in the form of a funnel. This concave section can form an additional reflector. For this purpose, z. B. a potting or Verspritzblockmaterial be used, which already has radiation-reflecting properties. Also, a corresponding coating is conceivable at least in the concave section. The potting block may have a shape or shape that deviates from the surface shape of the wiring substrate. It is thus possible, despite the pronounced surface shape of the wiring substrate without mechanical measures on the wiring substrate itself to create a module body that is adaptable to different applications and applications. In the end, I only have to take care of a good heat transfer between the back of the wiring back, which is exposed, and the environment. In one embodiment of a luminaire, the ready-to-connect LED module body is fastened to a luminaire base plate by screwing. This luminaire base plate consists of a metallic or thermally conductive material of relatively large surface area and is therefore best suited as a good heat conductor and as a heat sink. A standard luminaire cover, which is attached to the luminaire body, then completes the lamp. This results in a further advantage, the overall very flat construction arrangement.

The fastening means may be designed as apertures or holes for receiving screws or rivets or the like means.

In the area of the apertures, in one embodiment of the invention, columnar reinforcing inserts of a material are present, which may have a greater hardness than is the case with the material of the actual casting or injection block.

There is further ausgestaltend the ability to attach to the potting or Verspritzblock an attachment with L lichtbündelnder or light scattering effect. This attachment part can be a cap which can be fixed by means of a snap-in lock on the potting or injection block, exchangeable.

As already stated, the potting or Verspritzblock be part of a lamp body, the z. B. consists mainly of a plastic material and which has a heat sink.

The invention will be explained below with reference to an embodiment and with the aid of figures. Hereby show:

Fig. 1 shows a sectional view through a ready-to-connect LED module body;

Fig. FIG. 2 is a plan view of a module body with a circular potting or injection block and. FIG

Fig. 3 shows a bottom view of the module body according to FIG. 2 with a recognizable free rear side of the sheet-like wiring carrier.

The LED module body according to the exemplary embodiment is based on a wiring carrier 1. The wiring substrate 1 is designed, for example, as a ceramic plate.

On the wiring substrate 1 are connection fields 2, the z. B. were produced by screen printing. Between the pads 2 and the diode chip 3 is an electrical connection, which is not shown in detail.

The at least one diode chip 3 is located on a carrier 4, which has a reflector surface 5.

Above the reflector surface 5, the carrier 4 and thus also the diode chip 3 is covered with an electrically insulating, translucent, elastic or plastic capsule material 6.

The assembly described above further comprises arranged on the wiring substrate 1 current limiting elements, for. B. series resistors 7 for the at least one diode chip to allow connection means 8 via an immediate network operation. The series resistors 7 may be formed as chip resistors.

The described device now further comprises a casting or injection block 9. This casting or injection block 9 leaves the underside of the wiring substrate 1 free. Likewise, an upper-side portion in the region of the capsule material 6 is not mitvergspritzt or mitverspritzt. Here is defined distance or annular gap between the injection block 9 and 6 capsule material.

Otherwise, however, encloses the potting or Verspritzblock 9, the arrangement, with the involvement of a section 8.1 of the connection means 8, the z. B. can be performed as a flexible cable or as a rigid conductor. By this enclosing the connection means 8, but also the other electrical components of the necessary contact protection is given and the desired degree of protection of the device can be achieved.

Outside the sheet-shaped wiring substrate 1 in the illustrated embodiment, the potting or squirting block 9 z. B. provided with openings 10. These apertures 10 serve to receive in each case a fastening screw 11 in order to fasten the ready-to-connect LED module body to a luminaire plate 12 which consists of a metal material.

From the above explanations it follows that the material of the casting or injection block 9 is electrically insulating.

In the area of the capsule material 6, the casting or injection block 9 may have a concave section 9.1.

This concave section 9.1 can represent an additional reflector.

In the area of the apertures 10 in the casting or injection block 9 can each have a reinforcing insert 10.1, z. B. be in the form of a sleeve. It is thereby possible to provide the material of the potting or Verspritzblocks 9 with a certain elasticity or plasticity, but can be done by the reinforcing insert 10.1 a secure fixing of the overall arrangement without damaging the block 9. In addition, z. B. via a snap-in connection, a transparent attachment 13 are attached to the block 9.

This attachment part 13 can comprise selected light-bundling or light-scattering means or produce such an effect, so that the possible applications of the module body expand. In addition, a protection against moisture or pollution is given.

The invention mod ul body with potting or Verspritzblock may be part of a lamp body, z. B. in a lamp body integ ration.

From the plan view of FIG. 2 it can be seen that the casting or injection block 9 z. B. can be formed annular. Of course, deviating geometric shapes are also conceivable here.

The rear side view of the module body according to FIG. 3 makes the exposed rear side of the planar wiring substrate 1 clear. The circumscribing circular shape of the potting or injection molding block 9 is selected so that sufficient surface remains for the recesses 10 or for other fastening means.

About the exposed, flush-mounted back with wiring substrate 1 is a good contact with a heat sink, for. B. in part 12 of FIG. 1 can be produced.

It is within the meaning of the invention to arrange a plurality of ready-to-connect LED module body according to the exemplary embodiment on a common support member 12, in order to then integrate this support member 12, which serves as a common heat sink, into a luminaire.

Due to the lack of ballast electronics, in particular a power supply for generating a low voltage, the LED module body is especially for frequently switching lighting means, unmitelbar the AC mains in the Niederspannu ngsverteilung in the range of 50 V to 400 V used. It can therefore be a simple replacement based on existing bulbs be made in terms of energy saving and increasing the life.

Claims

claims

1. Ready-to-connect LED module body, comprising at least one light-emitting diode chip (3) which is arranged on a sheet-shaped wiring substrate (1), wherein the at least one diode chip (3) covered with an electrically insulating, translucent, elastic or plastic capsule material (6) is, as well as with on the wiring support (1) located connection fields (2) which are in electrical connection with the diode chip (3), characterized in that the connection pads (2) are contacted with a flexible or rigid external connection means (8), at least one current-controlling or current-limiting element (7) for the at least one diode chip (3) is arranged on the wiring carrier (1) in order to enable direct operation on a conventional electrical network via the connection means (8), furthermore a casting or injection block (9) is formed, which has an upper-side portion with the capsule material (6) leaves free as well as the underside of the wiring substrate (1) is thermally coupled to the environment, the wiring substrate (1) otherwise completely enclosing a portion (8.1) of the connection means (8), the potting or squirting block (9) outside of the sheet-like wiring substrate (1) at least one means (10) for attachment receives or has, wherein the underside of the wiring substrate (1) is part of the thermal coupling surface for cooling purposes.

2. Ready-to-connect LED module body according to claim 1, characterized in that the casting or injection block (9) consists of an electrically insulating material and the diode chip (3) by a reflector (5) is at least partially surrounded.

3. Ready-to-connect LED module body according to claim 1 or 2, characterized in that in the region of the capsule material (6) of the casting or injection molding block (9) has a concave portion (9.1).

4. Ready-to-connect LED module body according to claim 3, characterized in that at least the concave portion (9.1) forms an additional reflector.

5. Ready-to-connect LED module body according to one of the preceding claims, characterized in that the casting or injection molding block (9) has a shape which differs from the surface shape of the wiring substrate.

6. Ready-to-connect LED module body according to one of the preceding claims, characterized in that the fastening means are designed as apertures (10) for receiving screws or rivets (11).

7. Ready-to-connect LED module body according to claim 6, characterized in that in the region of the openings (10) each have a reinforcing insert (10.1) arranged u nd embedded in the casting or Verspritzblock (9).

8. Ready-to-connect LED module body according to one of the preceding claims, characterized in that on the potting or Verspritzblock (9) an attachment part (13) can be fastened with lichtbündelnder or l lichtstreuender effect.

9. Ready-to-connect LED module body according to one of the preceding claims, characterized in that it is integrated in a lamp body.

10. Ready-to-connect LED module body according to claim 9, characterized in that the casting or injection block (9) is part of a lamp body.

11. Ready-to-connect LED module body according to one of the preceding claims, characterized in that as current-controlling element series resistors, zener diodes or the like

Components are used.

12. Ready-to-connect LED module body according to one of the preceding claims, characterized in that the underside of the wiring substrate (1) of capsule material (6) is released.

13. Ready-to-connect LED module body according to one of claims 1 to 8 or 11 and 12, characterized by the use as a lighting means of a lamp, which directly on a

AC low voltage network is operable.