WO2010055983A1 - Module d’éclairage à del - Google Patents

Module d’éclairage à del Download PDF

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Publication number
WO2010055983A1
WO2010055983A1 PCT/KR2009/003070 KR2009003070W WO2010055983A1 WO 2010055983 A1 WO2010055983 A1 WO 2010055983A1 KR 2009003070 W KR2009003070 W KR 2009003070W WO 2010055983 A1 WO2010055983 A1 WO 2010055983A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting module
led lighting
heat sink
led
led package
Prior art date
Application number
PCT/KR2009/003070
Other languages
English (en)
Korean (ko)
Inventor
양상훈
오수남
Original Assignee
에프씨반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에프씨반도체 주식회사 filed Critical 에프씨반도체 주식회사
Publication of WO2010055983A1 publication Critical patent/WO2010055983A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp, and more particularly, to minimize the power consumption and heat generation, and to an LED lighting module that can be mounted as it is an existing frame.
  • Illumination lamps include general lighting such as incandescent or fluorescent lamps, and various lightings depending on the use purpose and location.
  • the street lamp illuminates a wide area by using various lamps such as sodium lamp and mercury lamp, and the sodium lamp and mercury lamp have a high power factor, and thus the lamp is turned on according to sunrise and sunset time. Afterwards, the street is gradually illuminated by the brightness of the illuminance.
  • various lamps such as sodium lamp and mercury lamp, and the sodium lamp and mercury lamp have a high power factor, and thus the lamp is turned on according to sunrise and sunset time. Afterwards, the street is gradually illuminated by the brightness of the illuminance.
  • the present invention is to solve the problems and problems as described above, the present invention provides a lamp using the LED as a light source, and efficiently dissipates the heat generated, can be mounted on a frame such as a conventional housing and stable
  • An object of the present invention is to provide an LED lighting module that can be powered.
  • the LED package is mounted, the circuit board is printed, the primary heat sink that is in contact with the bottom surface of the substrate conducts heat generated from the LED package,
  • One side is provided with an LED lighting module comprising a secondary heat sink in contact with the primary heat sink, a plurality of heat dissipation fins for radiating heat transferred to the other surface, a bracket for coupling the primary heat sink to a frame such as a light.
  • vent holes may be formed in the heat radiation fins of the secondary heat sink.
  • the bracket is fixed to one side of the primary heat sink, the other side is fixed to the frame of the lamp, the portion coupled to the frame of the lamp may be made to form a fixing hole of the long hole shape to adjust the fixed position.
  • a transparent cover disposed on the upper surface of the substrate may be further provided.
  • the transparent cover may be formed with a plurality of lenses for collecting or spectroscopic light emitted from the LED package.
  • the substrate may include an electrolytic capacitor for boosting a voltage transmitted from a power supply unit, first to third resistors for adjusting a current value required by the LED package, and PWM corresponding to the first to third resistors. Width modulation) may be provided with a control unit for controlling the output current amount, the coil connected to the output terminal and the LED package of the control unit.
  • LED lighting module of the present invention has the following effects.
  • the heat dissipation plate is provided as a double heat dissipation plate and a second heat dissipation plate, the heat dissipation plate can effectively dissipate heat generated from the LEDs, and thus, deterioration of peripheral parts can be suppressed and life can be improved.
  • the LED lighting module is fixed to a frame such as a housing as a bracket for adjusting a fixed position
  • the conventional frame can be utilized to the maximum, thereby minimizing production cost and resource waste.
  • the substrate is provided with a control unit for controlling the electrolytic capacitor, resistance, and PWM, stable power can be supplied to the LED package, and it can easily cope with the LED lighting having different uses and required light amounts.
  • FIG. 1 is a perspective view of an LED lighting module according to a first embodiment of the present invention
  • FIG. 2 is an exploded perspective view of the LED lighting module according to the first embodiment of the present invention.
  • FIG. 3 is a side view of the LED lighting module according to the first embodiment of the present invention.
  • FIG. 4 is a perspective view of an LED lighting module according to a second embodiment of the present invention.
  • FIG. 5 is an exploded perspective view of the LED lighting module according to the second embodiment of the present invention.
  • FIG. 6 is a side view of the LED lighting module according to the second embodiment of the present invention.
  • FIG. 7 is a perspective view showing another form of the reflector of FIG. 6; FIG.
  • FIG. 8 is a perspective view of an LED lighting module according to a third embodiment of the present invention.
  • FIG. 9 is a perspective view of an LED lighting module according to a fourth embodiment of the present invention.
  • FIG. 10 is a perspective view showing a case where a plurality of LED lighting module according to the first embodiment of the present invention is applied;
  • FIG. 11 is a perspective view of a case where the LED lighting module according to the first embodiment of the present invention is applied to a street light frame;
  • FIG. 12 is a circuit diagram of an LED lighting module according to an embodiment of the present invention.
  • 13 is a circuit diagram when two LED lighting modules are connected using a harness.
  • the substrate 12 PCB: Printed Circuit Board
  • the primary heat sink 14 the secondary heat sink 16
  • the bracket It can be made, including (13).
  • the substrate 12 is mounted on the LED package 11 and the circuit is printed.
  • the primary heat sink 14 is a component in which one surface is provided to be in contact with the bottom surface of the substrate 12 to conduct heat generated from the LED package 11. At this time, the primary heat sink 14 may be provided in close contact with the bottom surface of the substrate 12 so that heat conduction occurs more smoothly.
  • the secondary heat sink 16 is a component that is in contact with the other surface of the primary heat sink 14 so that the heat conducted to the primary heat sink 14 is released.
  • a plurality of heat dissipation fins 15 for dissipating heat into the air may be formed on the rear surface of the second heat dissipation plate 16 in contact with the first heat dissipation plate 14.
  • a ventilation hole 15a may be formed in the heat dissipation fin 15 to increase the contact area and provide more smooth ventilation.
  • the bracket 13 is a component that fixes the LED lighting module 1 including the substrate 12, the primary heat sink 14, and the secondary heat sink 16 to a frame such as a housing.
  • the bracket 13 is bent in an approximately L-shape to form a hole for coupling to the secondary heat sink 16 on one side, the fixing hole 13a for coupling to the frame on the other side This can be formed.
  • the fixing hole (13a) for coupling to the frame is preferably made in the form of a long hole formed in one side lengthwise so as to adjust the position coupled to the frame. That is, since the fixing hole 13a is formed as a long hole, even if the fixing position where the screws for fixing to the frame are coupled is different for each type, the fixing hole 13a may correspond to the width of the long hole.
  • the long hole as described above may be formed long in one direction, it may be formed long in the other direction perpendicular to the one direction. Of course, it is also possible to form a combination of the long hole in one direction and the other direction.
  • the bracket 13 is not limited to the L-shape as shown in the drawings, and may be bent more than right angles and less than right angles depending on the angle of the fixing position of the frame to which the LED lighting module 1 is coupled. Can be bent. That is, the bending angle of the bracket 13 may vary according to the angle between the LED lighting module 1 and the fixed position of the frame, and the operator can adjust the angle in the field or variously in various shapes and sizes during manufacture. It may be manufactured.
  • the LED lighting module 1 may further include a transparent cover 18.
  • the transparent cover 18 is a component provided on the upper side of the substrate 12 to allow the light emitted from the LED package 11 to pass while preventing foreign substances such as dust from passing through.
  • the transparent cover 18 is formed such that at least one lens 18a is formed at a portion corresponding to the LED package 11 so as to condense, spectroscopic or refracting light emitted from the LED package 11.
  • the transparent cover 18, the substrate, and the primary heat sink 14 and the secondary heat sink 16 are preferably penetrated by the column screw 19 to be coupled.
  • the LED lighting body of the present embodiment may include a substrate 12, a primary heat sink 14, a secondary heat sink 16, a transparent cover 18, and a bracket 13. have.
  • the substrate 12, the primary heat sink 14, the secondary heat sink 16, the transparent cover 18 and the bracket 13 are substantially the same components as the above-described embodiment, the same reference numerals are given. The detailed description will be replaced with the description of the above-described embodiment.
  • the LED lighting body 2 further includes a reflector 17.
  • the reflector 17 is provided between the substrate 12 and the transparent cover 18 and is a component that directs the light emitted from the LED package 11 of the substrate 12 at a set angle.
  • the reflecting surface is formed on the inner circumferential surface thereof, and may be formed as a cone having a substantially conical shape formed in plural to correspond to the LED packages 11.
  • the transparent cover 18, the reflector 17, the substrate 12, the primary heat sink 14, and the secondary heat sink 16 are penetrated by the column screw 19.
  • the reflector 170 may be formed in an octagonal shape instead of a cone shape.
  • the octagonal reflector may be formed of a synthetic resin injection molding made of high-gloss nickel-chromium plating on the surface to reflect light.
  • the inner center portion is formed with an opening 172 in which the LED package is located, the inner surface is formed with an octagonal reflecting surface 174, the bottom surface has four legs 176 for separating the distance from the substrate by a predetermined distance It may be formed by projecting.
  • the lens 18a formed on the transparent cover 18 may be removed and the plate-shaped transparent member may be applied as the transparent cover 18b in the above-described configuration.
  • the LED lighting module may be configured to remove the transparent cover 18.
  • the LED lighting module of the present invention may be combined in plurality as shown in FIG. As such, when the plurality of LED lighting modules form one unit, the primary heat sink 14 or the secondary heat sink 16 may be formed as one unit.
  • the primary heat sink 14 when the primary heat sink 14 is integrally formed, the primary heat sink 14 may be easily manufactured to correspond to the shape of the existing street lamp frame, and thus the brightness may be adjusted by arbitrarily adjusting the number of substrates on which the LED package is mounted.
  • bracket 13 coupled to the primary heat sink 14 may be easily coupled inside the existing streetlight frame, thereby improving compatibility with the existing streetlight frame.
  • FIG. 11 is a perspective view when the LED lighting module of the present invention is applied to a street lamp frame.
  • the existing lamp may be easily replaced with the LED lighting module 1.
  • FIG. 12 is a circuit diagram of the LED lighting module according to an embodiment of the present invention.
  • the circuit of the LED lighting module of the present invention is supplied with an external AC power, and converts the DC power into a DC power supply and outputs the DC power supplied from the power supply 4. It is composed of a control unit 5 for increasing the voltage and precisely controlling the current required by the LED package 11, and a lighting unit 6 which is turned on by the current supplied from the control unit 5. .
  • the power supply unit 4 uses a switch-mode power supply (SMPS).
  • SMPS switch-mode power supply
  • control unit 5 uses the five LED packages 11 as one group, and when three groups form one module, the current is supplied to each of these groups.
  • the controllers 51, 52, and 53 which control are provided, respectively.
  • Each of the controllers 51, 52, and 53 includes an electrolytic capacitor C1 for boosting the voltage transmitted from the power supply unit 4, and three resistors R1 for adjusting the current value required by the LED package 11. , R2, R3), Schottky diode (D), ceramic capacitor (C2), IC chip (IC) for adjusting output current amount through PWM (PULSE WIDTH MODULATION) control, and coil (L) have. That is, in the past, the current value was adjusted by using one resistor, but in the present invention, the LED is connected by combining three resistors (R1, R2, R3) and an IC chip (IC) that performs PWM control in response to these resistance values. A stable current value can be supplied to the package 11.
  • the lighting unit 6 means a group of the LED package 11.
  • FIG. 13 is a circuit diagram illustrating a case where two LED lighting modules are connected by using a harness.
  • FIG. 13 shows only a circuit when two LED lighting modules are connected, but a plurality of LED lighting modules may be connected through a harness 7 connected to an output terminal of the power supply unit 4.

Abstract

La présente invention porte sur un module d’éclairage à DEL permettant de minimiser la consommation d’énergie et la génération de chaleur, ledit module pouvant être monté sur un cadre existant. Selon un mode de réalisation de l’invention, le module d’éclairage à DEL comprend : une carte à circuit imprimé ; une première plaque de dissipation thermique en contact avec la partie inférieure de la plaque pour recevoir la chaleur générée par les DEL ; une seconde plaque de dissipation thermique, une surface de celle-ci étant en contact avec la première plaque de dissipation thermique et son autre surface étant en contact avec une pluralité de tiges de dissipation thermique destinées au rayonnement de la chaleur de conduction ; et un support par l’intermédiaire duquel la première plaque de dissipation thermique est couplée à un cadre pour lampe.
PCT/KR2009/003070 2008-11-11 2009-06-09 Module d’éclairage à del WO2010055983A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080111431A KR20100052629A (ko) 2008-11-11 2008-11-11 Ｌｅｄ 조명등
KR10-2008-0111431 2008-11-11

Publications (1)

Publication Number Publication Date
WO2010055983A1 true WO2010055983A1 (fr) 2010-05-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003070 WO2010055983A1 (fr) 2008-11-11 2009-06-09 Module d’éclairage à del

Country Status (2)

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KR (1) KR20100052629A (fr)
WO (1) WO2010055983A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102537697A (zh) * 2010-12-21 2012-07-04 格拉维顿莱特有限公司 照明装置和装配方法
CN108488642A (zh) * 2018-05-25 2018-09-04 深圳市明微电子股份有限公司 一种发光二极管照明装置和发光二极管单元

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101287901B1 (ko) 2011-02-25 2013-07-18 주식회사 우리조명지주 피엔접합 발광소자 조명 장치
KR101246034B1 (ko) 2011-02-25 2013-03-26 주식회사 우리조명지주 피엔접합 발광소자 조명장치
KR101246033B1 (ko) * 2011-02-25 2013-03-26 주식회사 우리조명지주 피엔접합 반도체 발광소자 조명 장치 및 이를 조광하는 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035513A (ja) * 2005-07-28 2007-02-08 Koito Mfg Co Ltd 車両用灯具
KR20080010904A (ko) * 2006-07-28 2008-01-31 주식회사 씨쎄븐 발광 소자 내장형 조명 장치, 브라켓 및 조립체
KR20080093527A (ko) * 2007-04-17 2008-10-22 주식회사 대진디엠피 엘이디 조명 장치
KR20080096271A (ko) * 2007-04-27 2008-10-30 김태완 발광다이오드를 이용한 등기구

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035513A (ja) * 2005-07-28 2007-02-08 Koito Mfg Co Ltd 車両用灯具
KR20080010904A (ko) * 2006-07-28 2008-01-31 주식회사 씨쎄븐 발광 소자 내장형 조명 장치, 브라켓 및 조립체
KR20080093527A (ko) * 2007-04-17 2008-10-22 주식회사 대진디엠피 엘이디 조명 장치
KR20080096271A (ko) * 2007-04-27 2008-10-30 김태완 발광다이오드를 이용한 등기구

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102537697A (zh) * 2010-12-21 2012-07-04 格拉维顿莱特有限公司 照明装置和装配方法
CN108488642A (zh) * 2018-05-25 2018-09-04 深圳市明微电子股份有限公司 一种发光二极管照明装置和发光二极管单元

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Publication number Publication date
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