WO2010055872A1

WO2010055872A1 - Spherical shell contact, and method for manufacturing same

Info

Publication number: WO2010055872A1
Application number: PCT/JP2009/069250
Authority: WO
Inventors: 眞司村田
Original assignee: アルプス電気株式会社
Priority date: 2008-11-12
Filing date: 2009-11-12
Publication date: 2010-05-20
Also published as: JP2012021773A

Abstract

Provided is a spherical shell contact capable of exhibiting a high elastic force independently of the directivity of an external force application direction by using a simple constitution. Also provided is a method for manufacturing the spherical shell contact. The spherical shell contact (1) is equipped with a spring portion (2) which is formed into a partially buried spherical shell shape in such a manner that a portion of the spherical shell is buried in a wiring board (4) to be used in a probe card and that at least one through hole is formed. In the method for manufacturing the spherical shell contact (1), the spring portion (2) is plated by using, as a mold, a resist sphere formed by thermally setting a resist pillar formed on the wiring board (4).

Description

Spherical shell type contactor and manufacturing method thereof

The present invention relates to a spherical shell type contactor and a method for manufacturing the same, and more particularly to a spherical shell type contactor that can be suitably used as a probe arranged in an array and a method for manufacturing the same.

Generally, in an integrated circuit manufacturing process, a probe card is used to perform a wafer test before separating a wafer into individual chips. In the probe card, a terminal used for electrical connection with the wafer is a contact called a probe.

The conventional contactor structure can be broadly divided into a cantilever structure composed of an elongated cantilever plate arranged horizontally or inclined, and a vertical composed of a vertically extendable needle or spring standing upright in the vertical direction (height direction). There are two structures called molds. Here, the contact of the cantilever structure is said to be advantageous in that the structure is simple and the mechanical characteristics can be easily adjusted by changing the lever length and lever width. On the other hand, it is said that the vertical contact has a merit in that the layout of the contact is higher than that of the cantilever contact and can be arranged in an array (see Patent Document 1). .

JP 2004-340794 A

Here, this is not an ideal case where the electrode of the wafer in contact with the contact is pushed in the expansion / contraction direction of the contact, usually in the vertical direction (height direction). Consider a case where the electrode of the wafer is in contact with the contact while being inclined due to the formation surface being inclined. In this case, the external force applied from the electrode of the wafer works not only in the vertical direction (height direction) of the contact but also in any one of the horizontal directions.

However, since the conventional cantilever type contactor is formed assuming only expansion and contraction in the vertical direction (height direction), when it is bent in any direction in the horizontal direction, the contactor shape is changed. Depending, it will cause irregular elastic deformation. In other words, the conventional cantilever type contactor has a problem that its elastic force depends on the directionality of the external force application direction. If the elastic force of the contact depends on the directionality of the direction in which the external force is applied, the contact cannot be reliably brought into contact with the electrode of the wafer, and it becomes difficult to accurately perform the wafer test.

In addition, the conventional vertical contact is formed to be vertically extendable by a spring that expands and contracts in the vertical direction (height direction) imparting a bias in the vertical direction (height direction) to the needle that becomes the contact portion. Therefore, as described above, there is a problem that the structure becomes complicated as well as the problem that the elastic force cannot be exhibited without depending on the directionality of the application direction of the external force. When the structure of the contact is complicated, it is difficult to arrange the contacts at high density, so that the merit that the array can be arranged cannot be fully utilized.

Therefore, the present invention has been made in view of these points, and a sphere capable of exerting a large elastic force without depending on the directionality of the external force application direction and realizing it with a simple structure. It is an object of the present invention to provide a shell-type contact and a method for manufacturing the same.

In order to achieve the above-described object, a first embodiment of the spherical shell contactor of the present invention is a partially embedded ball in which a part of a spherical shell is embedded in a wiring board used in a probe card. It is characterized by having a spring portion that is formed in a shell shape and is provided with one or a plurality of through holes or through grooves.

According to the spherical shell type contactor of the first aspect of the present invention, since the spring portion is curved based on the spherical curvature, the spring elastic force is uniform in the vertical direction (height direction) and the horizontal direction. Can be demonstrated. Further, the resist resin present in the spherical shell contactor during the manufacture of the spherical shell contactor can be removed from the through hole or the through groove.

The spherical shell-type contact of the second aspect of the present invention is the spherical shell-type contact of the first aspect, wherein the partially embedded spherical shell shape means that a portion exceeding half of the spherical shell is buried, It is characterized in that a portion that is less than half of the shell is exposed as a spring portion.

According to the spherical shell type contactor of the second aspect of the present invention, since the entire spring part is formed inside the boundary part between the spring part and the wiring board, the spherical shell type contactor is strong in the horizontal direction. Even when an external force is applied, it is possible to prevent the spherical shell-type contactor from being separated from the boundary portion.

The spherical shell-type contact of the third aspect of the present invention is the spherical shell-type contact of the first aspect, wherein the partially embedded spherical shell shape means that a portion less than half of the spherical shell is embedded. In addition, it is characterized in that a part exceeding half of the spherical shell is exposed as a spring part.

According to the spherical shell-type contact of the third aspect of the present invention, a portion passing through the center of the spherical shell and perpendicular to the height direction of the spherical shell intersects with the spherical shell. Since the spherical shell contactor performs a spring action such as a pantograph expansion / contraction operation as a bent part of the part, the shape of the spherical shell contactor can be enlarged or reduced at a constant ratio when the spherical shell contactor is deformed.

The spherical shell contact of the fourth aspect of the present invention is characterized in that, in the spherical shell contact of the first aspect, one through hole is formed at the top of the spring portion.

According to the spherical shell-type contact of the fourth aspect of the present invention, the contact portion of the spherical shell-type contact is changed from a point contact to an annular contact by the top through hole. The contact area is enlarged, and the contact object of the spherical shell contact can be easily brought into contact.

The spherical shell contact of the fifth aspect of the present invention is the virtual shell contact of the first aspect, wherein the through hole passes through the apex of the spring portion in the height direction at the bottom periphery of the spring portion. A plurality of rotationally symmetric axes with respect to the axis of symmetry.

According to the spherical shell contactor of the fifth aspect of the present invention, the elastic force of the spring portion is adjusted according to the size and number of the through holes without breaking the symmetry of the spring elastic force in the spherical shell contactor. can do.

The spherical shell contact of the sixth aspect of the present invention is the spherical shell contact of the first aspect, wherein the through groove is formed in a slit shape from the top of the spring portion to the bottom thereof, and A plurality of rotationally symmetrical arrangements are made with a virtual axis passing through the apex of the spring portion in the height direction as a symmetry axis.

According to the spherical shell type contactor of the sixth aspect of the present invention, the elasticity of the spring portion is determined according to the width, length, or number of the through grooves without breaking the symmetry of the spring elastic force in the spherical shell type contactor. The power can be adjusted.

The spherical shell contact of the seventh aspect of the present invention is the spherical shell contact of the sixth aspect, wherein the plurality of through grooves are formed in a spiral shape with the top of the spring portion as the center. It is characterized by.

According to the spherical shell type contactor of the seventh aspect of the present invention, the distance from the top to the bottom of the spring part becomes long, so that it is possible to make it difficult to cause permanent deformation of the spring part due to fatigue.

The spherical shell contact of the eighth aspect of the present invention is the spherical shell contact of the sixth aspect, wherein the through hole is the top of the spring portion and the center of the through hole is displaced from the center of the top of the spring portion. One spring portion is formed, and the spring portion is divided into a plurality of independent spring pieces having different heights by one through-hole that is shifted from the top portion.

According to the spherical shell-type contact of the eighth aspect of the present invention, the plurality of spring pieces having different heights are sequentially brought into contact with the contact object in the descending order of the spring pieces. The spring elastic force of the spring portion can be increased stepwise.

In order to achieve the above-mentioned object, as a first aspect of the method for manufacturing a spherical shell contactor of the present invention, a thermosetting resin for resist is thermoset on the surface of a wiring board used for a probe card. A resist column forming process in which a resist column formed in a cylindrical shape, an elliptical column shape or a polygonal column shape is provided, and a resist column is thermally cured to form a partially embedded spherical shape in which a part of a sphere is embedded A resist sphere forming step of forming a resist sphere on the surface of the wiring board by deforming, and a part in which a part of the spherical shell is embedded by patterning a thin film of spring material on the surface of the resist sphere A spring part forming step of forming a spring part of a spherical shell type contactor formed on the surface of the resist sphere in a shape of an embedded spherical shell and having one or a plurality of through holes or through grooves; By the through hole or through groove of the spring portion to provide a resist removing agent, is characterized by comprising a resist sphere removing step for removing the resist spheres dissolved from the through hole or through groove.

According to the method for manufacturing a spherical shell contact of the first aspect of the present invention, a resist sphere having a spherical curvature can be formed by thermally curing a resist column before thermosetting. Thus, the spring part of the spherical shell contactor that is curved can be accurately and easily plated.

The manufacturing method of the spherical shell type contactor according to the second aspect of the present invention is the method of manufacturing the spherical shell type contactor according to the first aspect, wherein the resist ball has a partially embedded spherical shape in which a portion exceeding half of the spherical body is included. It is characterized in that a portion less than half of the sphere is exposed as a resist sphere by being buried.

According to the method for manufacturing a spherical shell contact according to the second aspect of the present invention, it is possible to form a spherical shell contact in which a portion less than half of the spherical shell is exposed as a spring portion.

The method for manufacturing a spherical shell-type contact according to the third aspect of the present invention is the method for manufacturing the spherical shell-type contact according to the first aspect, wherein the partially embedded spherical shape of the resist sphere is a portion less than half of the sphere. As a result, it is characterized in that a portion exceeding half of the sphere is exposed as a resist sphere.

According to the method for manufacturing a spherical shell contact of the third aspect of the present invention, a plane that passes through the center of the spherical shell and intersects perpendicularly to the height direction of the spherical shell intersects the spherical shell. It is possible to form a spherical shell-type contact having the portion to be bent as a bent portion of the spring portion.

The method for manufacturing a spherical shell contactor according to a fourth aspect of the present invention is the method for manufacturing a spherical shell contactor according to the first aspect, wherein the pattern forming method of the thin film of the spring material in the spring portion forming step is for resist. By forming a resist pin in the shape of a resin pin on the top of the resist sphere, and forming a plating film thinner than the resist pin on the surface of the resist sphere on which the resist pin is formed And a plating step of forming a spring portion having one through hole at the top on the surface of the resist sphere.

According to the method of manufacturing the spherical shell contact according to the fourth aspect of the present invention, the contact portion of the spherical shell contact is changed from a point contact to a ring contact by the top through-hole. The initial contact area of the child is enlarged, and the contact object of the spherical shell contact can be easily brought into contact.

According to a fifth aspect of the present invention, there is provided a spherical shell contactor manufacturing method according to the first aspect, wherein the thin film pattern forming method of the spring material in the spring portion forming step is a resist sphere. A resist protrusion forming step of forming a plurality of rotationally symmetrical resist protrusions on the bottom periphery of the resist sphere using a resist resin, with a virtual axis passing through the top of the resist in the height direction as a symmetry axis; By plating the surface of the formed resist sphere with a plating film that is thinner than the height of the resist protrusions, a plurality of rotationally symmetrical arrangements are made with the virtual axis passing through the apex of the spring portion in the height direction as the symmetry axis. And a plating step of forming a spring portion having a through hole on the surface of the resist sphere.

According to the manufacturing method of the spherical shell type contactor of the fifth aspect of the present invention, the elasticity of the spring part according to the size and the number of the through holes without breaking the symmetry of the spring elastic force in the spherical shell type contactor. The power can be adjusted.

The manufacturing method of the spherical shell type contactor according to the sixth aspect of the present invention is the method of manufacturing the spherical shell type contactor according to the first aspect, wherein the pattern forming method of the thin film of the spring material in the spring forming step is a resist sphere. Resist resin is used to form resist stripes that are arranged in a rotationally symmetrical manner with a virtual axis that protrudes linearly from the surface of the resist sphere from the top to the bottom of the resist and passes through the apex of the resist sphere in the height direction. And forming a plating film thinner than the height of the resist streaks on the surface of the resist sphere on which the resist streaks are formed, from the top of the spring portion toward the bottom thereof. A resist portion having a spring portion having a plurality of through grooves formed in a slit shape and rotationally symmetric with a virtual axis passing through the apex of the spring portion in the height direction as a symmetry axis It is characterized by and a plating step of forming on the surface of the.

According to the method of manufacturing the spherical shell type contactor of the sixth aspect of the present invention, the spring according to the width, length or number of the through-grooves without breaking the symmetry of the spring elastic force in the spherical shell type contactor. The elastic force of the part can be adjusted.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a spherical shell contactor according to the sixth aspect of the present invention, wherein the resist line and the through groove of the spring portion are the resist sphere or the top of the spring portion. It is characterized by being formed in a spiral shape with the center at the center.

According to the manufacturing method of the spherical shell type contactor of the seventh aspect of the present invention, since the distance from the top to the bottom of the spring part becomes long, the permanent deformation of the spring part due to fatigue can be made difficult to occur.

The method for manufacturing a spherical shell-type contact according to the eighth aspect of the present invention is the method for manufacturing a spherical shell-type contact according to the first aspect, wherein there are two or more types of resist spheres. Is characterized in that it is determined based on the diameter, major axis, minor axis or width of the resist column.

According to the method for manufacturing a spherical shell-type contact of the eighth aspect of the present invention, the height of the resist sphere can be adjusted without changing the height of the resist pillar and its thermosetting condition. Resist spheres having different heights can be formed simultaneously and easily.

According to the spherical shell-type contact of the present invention, the partially embedded spherical shell-shaped spring portion that does not have a complicated structure exhibits a uniform spring elastic force in the vertical direction (height direction) and the horizontal direction. There is an effect that a large elastic force can be exhibited without depending on the directionality of the external force application direction, and that it can be realized with a simple structure.

In addition, according to the method for manufacturing a spherical shell contactor of the present invention, the spring portion of the spherical shell contactor that is curved based on the spherical curvature is formed, so that it is applied in the vertical direction (height direction) and the horizontal direction. There is an effect that the above-mentioned spherical shell type contactor corresponding to an external force can be manufactured accurately and easily.

The perspective view which shows the spherical shell type contact of 1st Embodiment The perspective view which shows the case where the shape which the part exceeding half of a spherical shell body is exposed is employ | adopted as a spring part in the spherical shell type contactor of 1st Embodiment. The longitudinal cross-sectional view which shows the case where the shape which the part exceeding half of a spherical shell body is exposed is employ | adopted for a spring part in the spherical shell type contactor of 1st Embodiment The longitudinal cross-sectional view which shows the case where the through-hole of a spring part is shifted from the top center of a spring part in the spherical shell type contactor of 1st Embodiment 1 is a longitudinal sectional view showing a manufacturing method of a spherical shell contact according to a first embodiment in the order of A to D; Perspective view showing two types of resist cylinders with different diameters A perspective view showing a resist sphere obtained by thermosetting two types of resist cylinders having different diameters FIG. 4 is a longitudinal sectional view showing a method for forming a thin film pattern of a spring material in the order of A to C in the first embodiment. The perspective view which shows the state which the spherical shell type contact of 1st Embodiment pressed and contracted The perspective view which shows the spherical shell type contactor of 2nd Embodiment. The top view which shows the spherical shell type | mold contactor of 2nd Embodiment The longitudinal cross-sectional view which shows the pattern formation method of the thin film of the spring material in 2nd Embodiment in order of AC The perspective view which shows the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in linear form The top view which shows what is the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in linear form The perspective view which shows the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in the spiral shape The plane which shows the spherical shell type contactor of a 3rd embodiment, and the penetration groove was formed in the shape of a spiral. The longitudinal cross-sectional view which shows the pattern formation method of the thin film of the spring material in 3rd Embodiment in order of AC The perspective view which shows the spherical shell type contactor of 4th Embodiment The longitudinal cross-sectional view which shows the spherical shell type contactor of 4th Embodiment Stress-strain diagram showing the elastic characteristics of the spherical shell contact of the fourth embodiment The perspective view which shows an example of the spherical shell type contactor of other embodiment The perspective view which shows an example of the spherical shell type contactor of other embodiment The perspective view which shows an example of the spherical shell type contactor of other embodiment

Hereinafter, the spherical shell type contactor of the present invention will be described with reference to the drawings by a plurality of embodiments.

First, the spherical shell type contact 1A of the first embodiment will be described. FIG. 1 shows a spherical shell contact 1A of the first embodiment. As shown in FIG. 1, the spherical shell contact 1 A of the first embodiment includes a spring portion 2 and a flange portion 3, and a plurality of arrays are formed on the surface 4 a of the wiring board 4 used for the probe card. Is arranged.

The spring portion 2 is formed in a partially embedded spherical shell shape in which a part of a spherical shell is embedded in the wiring board 4 used for the probe card. The spherical shell may not be a true spherical shell, but may be a substantially spherical shell that is close to it or an elliptical spherical shell that expands or contracts in the height direction or in the horizontal direction. In addition, as shown in FIG. 1, the partially embedded spherical shell is a shape in which a portion less than half of the spherical shell is exposed and the remaining portion (the remaining portion exceeding half of the spherical shell) is buried. 2 and 3, as shown in FIG. 2 and FIG. 3, the part exceeding half of the spherical shell was exposed as the spring part 2, and the remaining part (the remaining part less than half of the spherical shell) was buried. Such a shape may be used. Note that the part that exceeds half of the spherical shell (or the part that is less than half of the spherical shell) means that the horizontal plane that passes through the center of the spherical shell (the plane that intersects the height of the spherical shell perpendicularly) A circle formed by intersecting the surface of the body, that is, a portion including the great circle 2c of the spherical shell (a portion not including the great circle 2c of the spherical shell if the portion is less than half of the spherical shell).

Further, one or a plurality of through holes or through grooves are formed in the spring portion 2 as a common matter of the embodiments. In the first embodiment, one through-hole 5 is formed in the top 2t of the spring portion 2 that is a contact portion of the spherical shell contact 1A with a wafer electrode (not shown). As shown in FIG. 1, the center 5c of the through hole 5 may be formed at the top center 2tc of the spring portion 2, or the top hole 2t of the spring portion 2 as shown in FIG. Although it is located, the center 5 c of the through hole 5 may be formed at a position shifted from the top center 2 tc of the spring portion 2.

Regarding the dimensions of the spring portion 2, the outer diameter is 100 μm to 200 μm in terms of the spherical shell diameter, the spherical shell thickness is 1 μm to 20 μm, and the height is about 50 μm to 100 μm. The pitch interval of the spring portions 2 is 100 μm to 500 μm. However, since these values are set in accordance with the shape of the wafer (not shown), values other than these values may be selected, and other values may be selected in the first embodiment. It does not mean that it cannot be technically created.

As the material of the spring portion 2, a Ni-based spring alloy such as Ni-P or Ni-Co is selected. Since the material of the spring part 2 is selected from the viewpoint of improving its spring characteristics, a highly conductive material such as Au is provided on the surface of the spring part 2 in order to improve the conductivity of the spherical shell contact 1A. It is preferable to form a conductive portion (not shown) in the spring portion 2 by forming a thin film.

The flange portion 3 is a thin film formed uniformly on the surface 4a of the wiring board 4 on which the spring portion 2 is formed. The wafer and wiring connected to the conductive pattern of the wiring board 4 and in contact with the spherical shell contact 1A It plays a role of conducting the plate 4. However, the flange 3 is auxiliary formed when the conductive pattern of the wiring board 4 does not exist below the spring 2. Therefore, the conductive pattern of the wiring board 4 exists below the spring part 2, and the conductive part formed on the surface of the spring part 2 or the spring part 2 makes the wafer and the wiring board 4 conductive. When not used as a part, it is not necessary to form the collar part 3 on the spherical shell contact 1A.

Next, a method for manufacturing the spherical shell contact 1A of the first embodiment will be described.

FIG. 5 shows the manufacturing method of the spherical shell contact 1A of the first embodiment in the order of steps from A to D. The spherical shell contact 1A of the first embodiment is manufactured through a resist pillar forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order.

In the resist column forming step, as shown in FIG. 5A, the resist thermosetting resin is uniformly applied to a thickness of about 100 μm on the surface 4a of the wiring board 4 used in the probe card, leaving a cylindrical shape. The resist cylinder 11 is provided by performing an appropriate patterning. Here, the resist cylinder 11 is formed without being thermally cured. For example, when the resist thermosetting resin is a photosensitive resin, the resist cylinder 11 is formed only by exposure and development. The diameter and height of the resist cylinder 11 will be described in the next step.

In the resist sphere formation step, as shown in FIG. 5B, the resist cylinder 11 is thermally cured at 130 ° C. to deform the resist cylinder 11 into a partially embedded sphere shape. As a result, resist spheres 12 are formed on the surface 4 a of the wiring board 4. Here, the partially embedded sphere shape of the resist sphere 12 is a shape in which a part of the sphere is embedded. Similar to the partially-embedded spherical shell described above, the partially-embedded spherical shape may be a shape in which more than half of the sphere is buried and less than half of the sphere is exposed, or half of the sphere A shape in which a portion that is not filled is buried and a portion that exceeds half of the sphere is exposed as the resist sphere 12 may be used. This is selected according to the shape of the spring part 2 to be formed.

When forming a resist sphere with a shape where less than half of the sphere is exposed, set the height lower than the diameter of the resist cylinder, set the thermosetting temperature low, or set the thermosetting time short. The resist sphere is formed under conditions such as On the other hand, when forming a resist sphere with a shape in which more than half of the sphere is exposed, the height of the resist cylinder is set high, the thermosetting temperature is set high, or the thermosetting time is set. The resist sphere is formed under conditions such as setting it long.

When there are two or more types of resist spheres 12, the height of the resist spheres 12 is determined based on the diameter of the resist cylinder 11. This will be described with reference to FIGS. FIG. 6 shows two types of resist

cylinders

11A and 11B having the same height and different diameters. FIG. 7 shows the two types of resist

cylinders

11A and 11B shown in FIG. 6 thermally cured under the same thermosetting conditions. Two types of resist

spheres

12A and 12B are shown.

For example, when the resist

spheres

12A and 12B have two types of heights of 90 μm and 75 μm, as shown in FIG. 6, the diameter of the resist cylinder 11A that sets the height of the resist sphere 12A to 90 μm is set to 130 μm. The diameter of the resist cylinder 11B that sets the height of the sphere 12B to 75 μm is set to 100 μm. The heights of these two types of resist

cylinders

11A and 11B are set equal to 90 μm. When the two types of resist

cylinders

11A and 11B shown in FIG. 6 are thermally cured under the same conditions, the resist cylinder 11A having a diameter of 130 μm becomes a resist sphere 12A having a diameter of 150 μm and a height of 90 μm. . The resist cylinder 11B having a diameter of 100 μm is a resist sphere 12B having a diameter of 120 μm and a height of 75 μm.

In the spring portion forming step, a thin film of spring material is formed on the surface of the resist sphere 12 as shown in FIG. 5C. As the spring material, Ni-based spring alloys such as Ni-P and Ni-Co are selected. Thereby, the spring part 2 of the spherical shell contact 1 A is formed on the surface of the resist sphere 12. As described above, the spring portion 2 has a partially embedded spherical shell shape in which a part of a spherical shell is embedded, and is formed in a shape in which one or a plurality of through holes 5 or through grooves are provided. . Since the spring portion 2 of the first embodiment does not have a through groove, the shape of the spring portion 2 is a partially embedded spherical shell shape having one through hole 5. The conductive portion may be formed on the spring portion 2 by forming a thin film of a good conductive material such as Au on the surface of the spring portion 2 by sputtering or the like.

Here, an example of the pattern forming method of the thin film of the spring material is shown. The spring material thin film pattern forming method includes a seed film forming process, a resist pin forming process, a plating process, a resist removing process, and a seed film removing process.

In the seed film formation step, a seed film 21 is formed on the surface 4a of the wiring board (see FIG. 5B) 4 on which the resist spheres 12 are formed. The material of the seed film 21 is a thin film having a thickness of about 0.3 μm using a highly conductive metal such as a two-layer film of Ti and Cu, and is formed by sputtering or the like.

In the resist pin forming step, as shown in FIG. 8A, a resist resin is applied to the surface 4a of the wiring board 4 on which the seed film 21 is formed to form a resist film. The thickness of the resist film is set to about 150 μm. Thereafter, the resist film 13 is patterned to form a pin-shaped resist pin 13 on the top of the resist sphere 12. When a plurality of resist spheres 12 are formed, a resist film is left between the resist spheres 12.

In the plating step, as shown in FIG. 8B, a plating film 22 thinner than the height of the resist pin 13 is formed on the surface of the resist sphere 12 on which the resist pin 13 is formed. Specifically, the thickness of the plating film 22 is about 10 μm. As a result, the spring portion 2 having one through hole 5 in the top portion 2t is formed on the surface of the resist sphere 12. Ni-based spring alloys such as Ni—P and Ni—Co are selected as the plating metal. In addition, between the resist film 14 left between the resist spheres 12 and the spring portion 2, the flange portion 3 of the spherical shell contact 1 A is formed along with the formation of the spring portion 2. Note that the flange 3 is not formed unless there is a gap between the resist film 14 left between the resist spheres 12 and the spring portion 2.

In the resist removal step, as shown in FIG. 8C, the resist film 14 left between the resist pins 13 and the resist spheres 12 is removed using a resist remover. When a novolac resist material is selected as the resist resin, N-methyl-2-pyrrolidone (trade name: NMP) can be selected as the resist remover.

In the seed film removal step, the resist film 14 and the resist pin 13 left between the resist spheres 12 are removed, and the exposed seed film 21a (see FIG. 8C) 21a is removed by dry etching. As a method for removing the seed film 21, for example, ion milling can be selected.

After completion of the spring portion forming step shown in FIG. 5C, in the resist sphere removing step, a resist remover is supplied from the through hole 5 or the through groove of the spring portion 2 as shown in FIG. 5D. Thereby, the resist sphere 12 dissolved from the through hole or the through groove is removed. In the first embodiment, since no through groove is formed in the spring portion 2, a resist remover is supplied from the through hole 5 of the spring portion 2 to remove the resist sphere 12.

Note that values other than the numerical values shown above may be selected, and it does not mean that values other than the numerical values shown above cannot be technically created in the first embodiment.

Next, the operation of the spherical shell contact 1A of the first embodiment will be described.

In the spherical shell-type contact 1A of the first embodiment, as shown in FIG. 1, a partially embedded spherical shell-shaped spring portion 2 in which one through hole 5 is formed is formed. By adopting such a shape, the spring portion 2 is curved based on the spherical curvature, so that a uniform spring elastic force can be exhibited in the vertical direction (height direction) and the horizontal direction. Further, at the time of manufacturing the spherical shell contact 1A, the resist resin present in the spherical shell contact 1A can be removed from the through hole 5 or the through groove.

In the above partially embedded spherical shell shape, as shown in FIG. 1, when adopting a shape in which a portion less than half of the spherical shell is exposed as the spring portion 2, the entire spring portion 2 is combined with the spring portion 2. It is formed inside the boundary part with the wiring board 4. In this case, even if a strong external force is applied from the side of the spherical shell-type contact 1A, the spring portion 2 opposite to the direction in which the external force is applied has a great effect on the external force. The child 1A can be prevented from peeling off.

On the other hand, in the above partially embedded spherical shell shape, as shown in FIGS. 2 and 3, when a shape in which a part exceeding half of the spherical shell body is exposed as the spring portion 2 is adopted, The circle 2c portion can be a bent portion of the spring portion 2. That is, when the spherical shell contact 1A is pushed in the vertical direction (height direction), as shown in FIG. 9, the great circle 2c portion of the spherical shell is bent, so that the spherical shell contact 1A becomes a pantograph. It performs a spring action like a telescopic action. Therefore, the shape of the spherical shell contact 1A can be enlarged or reduced at a certain ratio when the spring is deformed.

It is preferable that one through hole 5 of the spring portion 2 is formed at the top 2t of the spring portion 2. When the through hole 5 is not formed at the top 2t of the spring part 2, the contact portion of the spherical shell contact 1A is point contact, but when the through hole 5 is formed at the top 2t of the spring part 2, Since the contact portion of the spherical shell contactor 1A can be changed from a point contact to an annular contact, the initial contact area of the spherical shell contactor 1A is expanded, and the contact object of the spherical shell contactor 1A can be easily changed. Can be contacted. Further, as shown in FIG. 4, when the through hole 5 is deviated from the top center 2tc of the spring portion 2, the ridge line of the through hole 5 causes an edge action, and an oxide film formed on the surface of the contacted wafer electrode is formed. Since cutting is performed, conduction between the wafer and the contact can be reliably performed.

Next, the operation of the manufacturing method of the spherical shell contact 1A of the first embodiment will be described.

As shown in FIGS. 5A to 5D, the manufacturing method of the spherical shell contact 1A of the first embodiment includes the above-described resist column forming step, resist sphere forming step, spring portion forming step, and resist sphere removing step. Yes. Here, the resist sphere 12 having a spherical curvature can be formed by thermosetting the resist cylinder 11 before thermosetting created in the resist column forming step in the resist sphere forming step. If the spring portion 2 is formed by using the surface of the resist sphere 12 as a mold, the spring portion 2 of the spherical shell contact 1A that is curved based on the spherical curvature can be plated accurately and easily.

Here, as shown in FIG. 5B, when the shape of the resist sphere 12 is set to a shape in which a portion less than half of the sphere is exposed as the resist sphere 12, the spring portion 2 is formed based on the shape, as shown in FIG. A spherical shell-type contact 1A having a spring portion 2 with a shape in which less than half of the spherical shell is exposed as shown in FIG.

On the other hand, as shown in FIG. 7, when the shape of the resist sphere 12 is set to a shape in which a portion exceeding half of the sphere is exposed as the resist sphere 12, the great circle 2 c portion of the resist sphere 12 is exposed. Therefore, if the spring portion 2 is formed based on this, a spherical shell type contact 1A having a bent portion of the great circle 2c portion of the spring portion 2 as shown in FIGS. 2 and 3 can be formed.

As shown in FIG. 7, when there are two or more types of resist

spheres

12A and 12B, the height of the resist

spheres

12A and 12B may be determined based on the diameters of the resist

cylinders

11A and 11B. That is, the height of the resist

spheres

12A and 12B can be adjusted by setting the height of the resist

cylinders

11A and 11B and the thermosetting conditions to be the same and changing only the diameter of the resist

cylinders

11A and 11B. To change the height of the resist

cylinders

11A and 11B in order to change the height of the resist

spheres

12A and 12B, the thickness of the resist film for forming the resist

cylinders

11A and 11B must be changed appropriately, which is complicated. Forced process. Further, it is difficult to adopt the same wiring board 4 to change the thermosetting conditions in order to change the height of the resist

spheres

12A and 12B. On the other hand, it is easy to change only the diameters of the resist

cylinders

11A and 11B because it is only necessary to change the diameter when forming the resist

cylinders

11A and 11B. Therefore, if the heights of the resist

spheres

12A and 12B are determined based on the diameters of the resist

cylinders

11A and 11B, the resist

spheres

12A and 12B having different heights can be simultaneously and easily formed on the same wiring board 4. it can.

As for the pattern forming method of the spring material thin film in the spring portion forming step, as shown in FIGS. 8A to 8C, the pattern forming method of the plating film 22 is adopted, so that a through hole is formed in the top portion 2t of the spring portion 2. 1A can be easily produced. In addition, since the thickness of the spring portion 2 can be easily increased, the thickness can be easily set. Since the contact portion of the spherical shell contact 1A is changed from a point contact to an annular contact by the through hole 5 of the top 2t, the spherical shell contact 1A having the through hole 5 at the top 2t of the spring portion 2 The initial contact area of the shell-type contact 1A is enlarged, and it can be easily brought into contact with the wafer electrode that is the contact target of the spherical shell-type contact 1A.

Next, the spherical shell contact 1B of the second embodiment will be described. FIG. 10 is a perspective view showing a spherical shell contact 1B of the second embodiment, and FIG. 11 is a plan view showing the spherical shell contact 1B of the second embodiment.

As shown in FIGS. 10 and 11, the spherical shell contact 1 B of the second embodiment includes a spring portion 2 and a flange portion 3 as in the first embodiment, and is used for a probe card. A plurality of arrays are arranged on the surface 4 a of the plate 4.

The part other than the through hole 5 of the spring part 2 and the flange part 3 are the same as those in the first embodiment.

Four (a plurality) of through holes 6 formed in the spring portion 2 are formed in a trapezoidal shape at the periphery of the bottom portion 2 b of the spring portion 2. The four through-holes 6 are arranged in a rotationally symmetrical manner with an imaginary axis passing through the apex of the spring portion 2 in the height direction as an axis of symmetry by being arranged at intervals of 90 degrees.

Next, a method for manufacturing the spherical shell contact 1B of the second embodiment will be described.

The spherical shell contactor 1B of the second embodiment is manufactured through a resist column forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order. The steps other than the spring portion forming step are the same as those in the first embodiment. Further, as shown in FIGS. 12A to 12C, the spring material thin film pattern forming method in the spring portion forming process includes a seed film forming process, a resist protrusion forming process, a plating process, a resist removing process, and a seed film removing process. The seed film formation step and the seed film removal step are the same as those in the first embodiment.

In the resist protrusion forming step, as shown in FIG. 12A, four (a plurality) resist protrusions 15 are formed using resist resin on the periphery of the bottom 2b of the resist sphere 12 on which the seed film 21 is formed in the seed film forming step. Form. The four resist protrusions 15 are arranged at 90-degree intervals, so that they are formed rotationally symmetric with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis.

In the plating step, as shown in FIG. 12B, a plating film 22 that is thinner than the height of the resist protrusion 15 is formed on the surface of the resist sphere 12 on which the resist protrusion 15 is formed, thereby arranging them at intervals of 90 degrees. The spring portion 2 having the four through-holes 6 is formed on the surface of the resist sphere 12. The through holes 6 of these four spring portions 2 are arranged rotationally symmetrically with an imaginary axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis.

In the resist removal step, as shown in FIG. 12C, the resist film 14 left between the resist protrusions 15 and the resist spheres 12 is removed using a resist remover. Except for the point that the resist pin 13 in FIG. 8 is changed to the resist protrusion 15, it is the same as the resist removing process of the first embodiment.

Next, the operation of the spherical shell contact 1B of the second embodiment will be described.

In the spherical shell contact 1B of the second embodiment, as shown in FIGS. 10 and 11, the four through holes 6 arranged at intervals of 90 degrees on the periphery of the bottom 2b of the spring 2 are spring portions 2. Is formed. These four through holes 6 are provided for the purpose of weakening the elastic force of the spring part 2 and making the spring part 2 easily contract in the height direction. However, these four through-holes 6 are formed rotationally symmetric with a virtual axis passing through the apex of the spring part 2 in the height direction as the symmetry axis, so that the geometric symmetry of the spring part 2 is maintained. Yes. As a result, the elastic force of the spring portion 2 can be adjusted according to the size and number of the through holes 6 without breaking the symmetry of the spring elastic force in the spherical shell contact 1B.

Next, the operation of the method for manufacturing the spherical shell contact 1B of the second embodiment will be described.

In the manufacturing method of the spherical shell contact 1B of the second embodiment, the spring forming step is different from that of the first embodiment. Further, the pattern forming method of the spring material thin film in the spring portion forming step is different from that of the first embodiment in that the resist pin 13 is changed to the resist protrusion 15.

In the resist projection forming step of the spring material thin film pattern forming method, four resist projections 15 arranged at intervals of 90 degrees are arranged on the periphery of the bottom portion 2b of the resist sphere 12. Since the four resist protrusions 15 are formed in a rotationally symmetrical manner with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis, when the spring portion 2 is formed on the surface of the resist sphere 12, A spring portion 2 having four through holes 6 arranged at intervals of 90 degrees based on the four resist protrusions 15 is formed. Therefore, it is possible to form the spring portion 2 that can adjust the elastic force of the spring portion 2 according to the size and number of the through holes 6 without breaking the symmetry of the spring elastic force in the spherical shell contact 1B. it can.

Next, a spherical shell contact 1C of the third embodiment will be described. FIG. 13 shows a perspective view of a spherical shell contact 1C of the third embodiment, and FIG. 14 shows a plan view of the spherical shell contact 1C of the third embodiment.

As shown in FIGS. 13 and 14, the spherical shell type contact 1 C of the third embodiment includes a spring portion 2 and a flange portion 3, as in the first embodiment, and is used for a probe card. A plurality of arrays are arranged on the surface 4 a of the plate 4.

The part other than the through hole 5 of the spring portion 2 and the flange portion 3 in the third embodiment are the same as those in the first embodiment.

Unlike the first embodiment, the spring portion 2 is formed with four (a plurality of) through grooves 7 instead of the through holes 5. These four through-grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom 2b, and an imaginary axis passing through the apex of the spring portion 2 in the height direction is used as an axis of symmetry. Arranged in rotational symmetry. As shown in FIGS. 13 and 14, the width of the through groove 7 may be set so that the width dimension increases from the top 2 t of the spring portion 2 toward the bottom 2 b, or uniform. It may be a width dimension.

Further, the through groove 7 may be formed in a straight line as shown in FIGS. 13 and 14, or as shown in FIGS. 15 and 16, a spiral shape with the top 2t of the spring part 2 as the center. It may be formed.

Next, a method for manufacturing the spherical shell contact 1C of the third embodiment will be described.

The spherical shell-type contact 1C of the third embodiment is manufactured through a resist pillar forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order. The steps other than the spring portion forming step are the same as those in the first embodiment. Further, as shown in FIGS. 17A to 17C, the pattern forming method of the spring material thin film in the spring portion forming process includes a seed film forming process, a resist streak forming process, a plating process, a resist removing process, and a seed film removing process. The seed film formation step and the seed film removal step are the same as those in the first embodiment.

In the resist streak forming step, as shown in FIG. 17A, four (plural) pieces of resist resin are used from the top to the bottom 2b of the resist sphere 12 on which the seed film 21 is formed in the seed film forming step. Resist stripes 16 are formed. The four resist stripes 16 bulge linearly from the surface of the resist sphere 12. Further, the four resist stripes 16 are arranged at 90 degree intervals, so that they are arranged rotationally symmetrically with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis. The width of the resist stripe 16 may be set so that its width dimension increases from the top of the resist sphere 12 toward its bottom 2b, or it may be a uniform width.

In the plating step, as shown in FIG. 17B, a plating film 22 thinner than the height of the resist streaks 16 is formed on the surface of the resist sphere 12 on which the resist streaks 16 are formed. As a result, the spring portion 2 having four through grooves 7 arranged at intervals of 90 degrees based on the resist stripes 16 is formed on the surface of the resist sphere 12. The four through grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom portion 2b, and are rotationally symmetric with a virtual axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis. Is formed. Since the through groove 7 is formed based on the resist stripe 16, the width dimension of the through groove 7 is set similarly to the setting of the width of the resist stripe 16.

In the resist removal step, as shown in FIG. 17C, the resist film 14 left between the resist streaks 16 and the resist spheres 12 is removed using a resist remover. Except for the point that the resist pin 13 of FIG. 8 is changed to the resist stripe 16, it is the same as the resist removing process of the first embodiment.

Note that the resist stripes 16 may be formed linearly around the top of the resist sphere 12 or may be formed in a spiral shape. As shown in FIGS. 13 and 14, the through groove 7 of the spring portion 2 formed based on the linear resist stripes 16 is formed in a straight line with the top portion 2 t of the spring portion 2 as the center. Further, the through groove 7 of the spring portion 2 formed based on the spiral resist stripe 16 is formed in a spiral shape with the top portion 2t of the spring portion 2 as the center, as shown in FIGS.

Next, the operation of the spherical shell contact 1C of the third embodiment will be described.

In the spring portion 2 of the spherical shell contact 1C of the third embodiment, as shown in FIGS. 13 and 14, four through grooves 7 are formed. Since these four through grooves 7 are formed in a slit shape from the top 2t of the spring part 2 toward the bottom part 2b, the elastic force of the spring part 2 depends on the width, length or number of the through grooves 7 Can be adjusted.

Further, these four through grooves 7 are arranged at 90 degree intervals, so that they are arranged rotationally symmetrically with an imaginary axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis. When the through grooves 7 are not symmetrically arranged, the elasticity in the vertical direction (height direction) and the horizontal direction varies depending on the position of the spring portion 2, but by arranging the through grooves 7 symmetrically, The elastic force of the spring portion 2 can be adjusted without breaking the symmetry of the spring elastic force in the spherical shell contact 1C.

Further, as shown in FIGS. 15 and 16, when the four through grooves 7 are formed in a spiral shape around the top 2t of the spring portion 2, the spring portion 2 has a spiral shape. The distance from the top 2t to the bottom 2b is increased by that amount. If the length of the spring portion 2 is increased, the fatigue applied to the spring portion 2 is alleviated by the length, so that the permanent deformation of the spring portion 2 due to fatigue can be made difficult to occur.

Next, the operation of the method for manufacturing the spherical shell contact 1C of the third embodiment will be described.

In the manufacturing method of the spherical shell type contactor 1C of the third embodiment, the spring forming step is different from that of the first embodiment. The pattern forming method of the spring material thin film in the spring portion forming step is different from that of the first embodiment in that the resist pin 13 is changed to the resist stripe 16 as shown in FIGS. 17A to 17C. .

In the resist streak forming step in the pattern forming method for the thin film of spring material, as shown in FIG. 17A, resist streaks 16 arranged at intervals of 90 degrees are formed from the top of the resist sphere 12 to its bottom 2b. Further, in the subsequent plating step, as shown in FIG. 17B, the spring portion 2 having the four through grooves 7 is formed on the surface of the resist sphere 12. The four through grooves 7 are formed on the basis of the four resist stripes 16 formed on the surface of the resist sphere 12, so that they are formed in a slit shape from the top 2 t of the spring portion 2 toward the bottom 2 b thereof. And it arrange | positions in rotational symmetry about the virtual axis which passes the vertex of the spring part 2 in a height direction as a symmetry axis. Therefore, the elastic force of the spring portion 2 can be adjusted according to the width, length, or number of the through grooves 7 without breaking the symmetry of the spring elastic force in the spherical shell contact 1C.

Further, these four resist stripes 16 may be formed in a spiral shape with the top of the resist sphere 12 as the center. By doing so, these four through grooves 7 formed on the basis of the resist stripes 16 are formed in a spiral shape with the top portion 2t of the spring portion 2 as the center. As a result, as described above, since the distance from the top 2t to the bottom 2b of the spring portion 2 is increased, it is possible to prevent permanent deformation of the spring portion 2 due to fatigue.

Next, a spherical shell contact 1D of the fourth embodiment will be described. FIG. 18 shows a perspective view of a spherical shell contact 1D of the fourth embodiment, and FIG. 19 shows a longitudinal sectional view of the spherical shell contact 1D of the fourth embodiment.

As shown in FIGS. 18 and 19, the spherical shell contact 1D of the fourth embodiment includes a spring portion 2 and a flange portion 3 as in the first embodiment, and is used for a probe card. A plurality of arrays are arranged on the surface 4 a of the plate 4.

The points other than the addition of the through groove 7 to the spring portion 2 of the fourth embodiment are the same as in the first embodiment.

In the spring portion 2 of the fourth embodiment, as shown in FIGS. 18 and 19, the through hole 5 is the top portion 2 t of the spring portion 2, and the center 5 c of the through hole 5 is from the top center 2 tc of the spring portion 2. One is formed at a shifted position (see FIG. 4). Further, the four (plurality) of through grooves 7 are arranged at intervals of 90 degrees as in the third embodiment. These four through-grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom 2b, and an imaginary axis passing through the apex of the spring portion 2 in the height direction is used as an axis of symmetry. Arranged in rotational symmetry. By forming these one through hole 5 and four through grooves 7, the spring portion 2 is divided into four independent spring pieces 9A to 9D. Also, the heights of the four independent spring pieces 9A to 9D are different from each other by the single through hole 5 that is shifted from the top 2t.

In addition, about the manufacturing method of the spherical shell type contactor 1D of 4th Embodiment, the through-hole 5 is formed by utilizing the manufacturing method of 1st Embodiment, and the manufacturing method of 3rd Embodiment is utilized. By doing so, the through groove 7 is formed, so that the manufacturing method is obtained by adding the manufacturing method of the first embodiment and the manufacturing method of the third embodiment. At that time, as long as it is before the plating step, the resist pin 13 and the resist stripe 16 may be formed at the same time, or may be formed first.

Next, the operation of the spherical shell contact 1D of the fourth embodiment will be described.

In the spring portion 2 of the spherical shell type contact 1D of the fourth embodiment, as shown in FIGS. 18 and 19, as described above, the one through hole 5 shifted from the top center 2tc and the interval of 90 degrees. There are four through grooves 7 arranged. Further, the spring portion 2 is divided into four independent spring pieces 9A to 9D having different heights by the through holes 5 and the through grooves 7. By these four independent spring pieces 9A to 9D, the elastic characteristics of the spring portion 2 of the spherical shell contactor 1D behave differently from the other embodiments.

FIG. 20 shows a stress-strain diagram in the spherical shell contact 1D of the fourth embodiment. The numbers 1 to 4 shown in FIG. 20 indicate the number of contacts of the spring pieces 9A to 9D that are in contact with the wafer electrode. If the heights of the four independent spring pieces 9A to 9D in the spring portion 2 are different, they come into contact in descending order from the highest spring piece 9A when contacting the wafer electrode. When the number of contacts of the spring pieces 9A to 9D is one, the spring pieces 9A to 9D are distorted with a slight stress. However, as the number of contacts of the spring pieces 9A to 9D increases to 2, 3, and 4, a large stress is required to distort the spring pieces 9A to 9D. This phenomenon changes stepwise depending on the number of contacts of the spring pieces 9A to 9D. Therefore, in the initial contact stage of the spring pieces 9A to 9D, the spring part 2 is easily bent, and as the pushing amount of the spring part 2 increases, the number of contacts of the spring pieces 9A to 9D increases, and the elastic force of the spring part 2 also increases. Therefore, even when the heights of the plurality of electrodes formed on the wafer are different, the plurality of spherical shell-type contacts 1D are appropriately brought into contact with all the electrodes, respectively. Can do.

That is, according to the spherical shell-type contact of this embodiment, the partially embedded spherical shell-shaped spring part 2 having no complicated structure has a uniform spring elastic force in the vertical direction (height direction) and the horizontal direction. This produces the effect of exerting a large elastic force without depending on the directionality of the direction in which the external force is applied, and can be realized with a simple structure.

Further, according to the method of manufacturing the spherical shell contactor of the present embodiment, the spring portion 2 of the spherical shell contactor that is curved based on the spherical curvature is formed, so that the vertical direction (height direction) ) And the above-mentioned spherical shell-type contactor that appropriately corresponds to the external force applied in the horizontal direction can be produced accurately and easily.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made as necessary.

For example, with respect to the through holes and the through grooves 7 provided in the spring portion 2, various embodiments can be adopted depending on the number and place of formation.

FIG. 21 shows a spherical shell-type contact 1E according to an embodiment obtained by adding the first and second embodiments. That is, the spherical shell-type contact 1E according to the embodiment in which one circular through hole 5 is provided at the top 2t of the spring part 2 and four rectangular through holes 6 are provided around the bottom 2b of the spring part 2. It has become.

FIG. 22 shows a spherical shell type contact 1F according to an embodiment obtained by adding the second and third embodiments. That is, four rectangular through holes 6 are provided around the bottom 2b of the spring portion 2, and four through grooves 7 arranged at intervals of 90 degrees from the top 2t of the spring 2 to the bottom 2b are provided. In this embodiment, the spherical shell contact 1F is provided.

Further, FIG. 23 shows a spherical shell-type contact 1G according to an embodiment obtained by adding the first to third embodiments. That is, one circular through hole 5 is provided at the top 2t of the spring portion 2, four rectangular through holes 6 are provided around the bottom 2b of the spring 2, and the top 2t to the bottom 2b of the spring 2 are provided. Thus, the spherical shell contact 1G of the embodiment in which four through grooves 7 arranged at intervals of 90 degrees are provided.

Further, in the resist column forming step in the manufacturing method of the present embodiment, the resist column 11 may not be a columnar shape but may be an elliptical column shape or a polygonal column shape. In the case of adopting a polygonal column shape for the resist column 11, it is preferable that the number of polygonal prisms increases as the number of polygonal columns increases, such as an octagonal column shape or a dodecagonal column shape, rather than a triangular column shape. In the case of adjusting the height of the resist sphere, the diameter is a resist cylinder, but the diameter is long or short if it is an elliptical column, and the width is wide if it is a polygonal column. To the standard.

1A to 1G Spherical shell type contact 2 Spring part 2b Bottom part of spring 2c Large circle of spherical shell (based on the shape of spring part) 2t Top part of spring part 2tc Top center of spring part 3 鍔 4 Wiring board 5 Through hole 5 c (formed at the top of the spring) 5 c Center of the through hole (formed at the top of the spring) 6 Through hole 7 (formed at the bottom of the spring) 7 Through groove 9A to

9D Spring pieces

11, 11A, 11B Resist

cylinders

12, 12A, 12B Resist spheres 13 Resist pins 15 Resist protrusions 16 Resist streaks 21 Seed film 22 Plating film

Claims

It is a partially embedded spherical shell shape in which a part of a spherical shell is embedded in a wiring board used for a probe card, and is formed in a shape provided with one or a plurality of through holes or through grooves. A spherical shell-type contact having a spring portion.
The partially embedded spherical shell shape is a shape in which a portion less than half of the spherical shell is exposed as the spring portion by burying a portion exceeding half of the spherical shell. The spherical shell contact according to claim 1.
The partially embedded spherical shell shape is a shape in which a portion less than half of the spherical shell body is buried, and a portion exceeding half of the spherical shell body is exposed as the spring portion. The spherical shell contact according to claim 1.
The spherical shell type contactor according to claim 1, wherein one through hole is formed at a top portion of the spring portion.
2. The plurality of through holes are formed in a rotationally symmetrical manner with an imaginary axis passing through the apex of the spring portion in the height direction at a peripheral edge of the bottom portion of the spring portion as a symmetry axis. Spherical shell contactor.
The through groove is formed in a slit shape from the top of the spring portion toward the bottom thereof, and a plurality of rotational grooves are arranged in a rotationally symmetrical manner with a virtual axis passing through the apex of the spring portion in the height direction. The spherical shell-type contact according to claim 1, wherein the contact is made.
The spherical shell-type contactor according to claim 6, wherein the plurality of through grooves are formed in a spiral shape around the top of the spring portion.
One through hole is formed at a position where the center of the through hole is deviated from the center of the top of the spring part.
The spherical shell contact according to claim 6, wherein the spring portion is divided into a plurality of independent spring pieces having different heights by the one through hole that is shifted from the top of the spring portion. Child.
A resist column forming step of providing a resist column formed in a cylindrical shape, an elliptical column shape or a polygonal column shape without thermosetting the thermosetting resin for resist on the surface of the wiring board used for the probe card;
Resist sphere formation step of forming a resist sphere on the surface of the wiring board by thermosetting the resist pillar and deforming the resist pillar into a partially embedded sphere shape in which a part of the sphere is embedded;
By patterning a thin film of a spring material on the surface of the resist sphere, a partially embedded spherical shell shape in which a part of the spherical shell is embedded is provided with one or more through holes or through grooves. A spring part forming step of forming a spring part of a spherical shell type contactor formed in a shape on the surface of the resist sphere;
And a resist sphere removing step of removing the resist sphere dissolved from the through hole or the through groove by supplying a resist remover from the through hole or the through groove of the spring portion. Child manufacturing method.
The partially embedded sphere shape of the resist sphere is a shape in which a portion less than half of the sphere is exposed as the resist sphere when a portion exceeding half of the sphere is buried. Item 10. A method for producing a spherical shell contact according to Item 9.
The partially embedded sphere shape of the resist sphere is a shape in which a portion that is less than half of the sphere is buried and a portion exceeding half of the sphere is exposed as the resist sphere. Item 10. A method for producing a spherical shell contact according to Item 9.
The method of forming a thin film pattern of a spring material in the spring portion forming step is as follows:
A resist pin forming step of forming a resist pin in the shape of a pin for resist resin on the top of the resist sphere;
By plating a plating film thinner than the height of the resist pin on the surface of the resist sphere on which the resist pin is formed, the spring portion having one through hole at the top is formed on the surface of the resist sphere. The method for producing a spherical shell contactor according to claim 9, further comprising:
The method of forming a thin film pattern of a spring material in the spring portion forming step is as follows:
A resist protrusion forming step of forming a plurality of resist protrusions formed rotationally symmetrically with a virtual axis passing through the apex of the resist sphere in the height direction as an axis of symmetry, using a resist resin on the bottom periphery of the resist sphere; ,
By forming a plating film that is thinner than the height of the resist protrusion on the surface of the resist sphere on which the resist protrusion is formed, a virtual axis that passes through the apex of the spring portion in the height direction is used as an axis of symmetry. The spherical shell-type contactor according to claim 9, further comprising a plating step of forming, on the surface of the resist sphere, the spring portion having a plurality of through holes arranged in a rotationally symmetrical manner. Production method.
The method of forming a thin film pattern of a spring material in the spring portion forming step is as follows:
A plurality of resists arranged in a rotationally symmetrical manner with a virtual axis that protrudes linearly from the surface of the resist sphere from the top to the bottom of the resist sphere and passes through the apex of the resist sphere in the height direction. A resist streak forming step of forming a streak using a resist resin;
By forming a plating film thinner than the height of the resist streaks on the surface of the resist sphere on which the resist streaks are formed, a slit shape is formed from the top of the spring portion toward the bottom thereof, and And a plating step of forming on the surface of the resist sphere the spring part having a plurality of the through-grooves arranged rotationally symmetrically with a virtual axis passing through the apex of the spring part in the height direction. The manufacturing method of the spherical shell type contactor of Claim 9 characterized by the above-mentioned.
15. The spherical shell-type contactor according to claim 14, wherein the resist bars and the through-grooves of the spring part are formed in a spiral shape around the resist sphere or the top of the spring part. Method.
The height of the resist sphere is determined based on a diameter, a major axis, a minor axis, or a width of the resist column when there are two or more types of resist spheres. Manufacturing method of spherical shell type contactor.