WO2010055070A2

WO2010055070A2 - Optoelectronic module and cooling device comprising an optoelectronic module

Info

Publication number: WO2010055070A2
Application number: PCT/EP2009/065008
Authority: WO
Inventors: Christopher Eichelberger; Kimberly Peiler
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2008-11-12
Filing date: 2009-11-11
Publication date: 2010-05-20
Also published as: WO2010055070A3

Abstract

An optoelectronic module (100) is provided which is suitable for illuminating a cooling device and comprises a carrier plate (1), at least one radiation-emitting semiconductor component (2) arranged on the carrier plate (1), a first housing (31) and a second housing (32). The carrier plate (1) is arranged in the first housing (31) in such a way that the radiation-emitting semiconductor component (2) is surrounded by the carrier plate (1) and the first housing (31). The first housing (31) is surrounded by the second housing (32), wherein at least one channel (4) is arranged between the first housing (31) and the second housing (32), said at least one channel (4) connecting an opening (31a) in the first housing (31) to an opening (32a) in the second housing (32). Furthermore, a cooling device comprising such an optoelectronic module (100) is provided.

Description

Optoelectronic module and cooling device comprising an optoelectronic module

This patent application claims the priority of US patent application No. 61/113,987, the disclosure content of which is hereby incorporated by reference.

The present invention relates to an optoelectronic module suitable for illuminating a cooling device and having at least one radiation-emitting semiconductor component arranged on a carrier plate. The invention furthermore relates to a cooling device comprising such an optoelectronic module.

Cooling devices having a radiation-emitting module are known for example from the document US 2008/0006049 Al. In this case, a refrigerator has a unit which emits radiation for promoting the photosynthesis of vegetables.

Furthermore, the document US 2007/0223226 Al discloses a refrigerator with an illumination device integrated therein and a light-emitting device for illuminating the refrigerator .

In this case, the illumination devices are integrated into the refrigerators in such a way that material arranged at the illumination device, in particular the material surrounding the radiation-emitting components, has to satisfy the property of being thermally stable. This means that costly materials for sections of the illumination device which extend to the component are disadvantageously necessary. In order to reduce the risk of damage to the individual components of the illumination device owing to excessively high temperatures produced during operation, the individual components have to be arranged at a distance from one another. This disadvantageously leads to an increased space requirement of the illumination device.

The invention is based on the object of specifying an optoelectronic module suitable for illuminating a cooling device, which module is particularly space-saving and in particular has an improved heat dissipation of the heat produced during operation. Furthermore, the invention is based on the object of specifying a cooling device comprising such an optoelectronic module.

These objects are achieved inter alia by means of an optoelectronic module comprising the features of patent claim 1 and of patent claim 11. Furthermore, these objects are achieved by means of a cooling device comprising the features of claim 13. The dependent claims relate to advantageous embodiments and preferred developments of the optoelectronic module and of the cooling device.

The invention provides an optoelectronic module suitable for illuminating a cooling device and comprising a carrier plate, at least one radiation-emitting semiconductor component arranged on the carrier plate, a first housing and a second housing. The carrier plate is arranged in the first housing in such a way that the radiation-emitting semiconductor component is surrounded by the carrier plate and the first housing. The first housing is surrounded by the second housing, wherein at least one channel is arranged between the first housing and the second housing, said at least one channel connecting an opening in the first housing to an opening in the second housing.

The heat produced during operation of the optoelectronic module can be dissipated effectively through the channel and through the openings in the first housing and in the second housing. Preferably, the channel dissipates the heat produced during operation of the radiation-emitting semiconductor component toward the outside, in particular into the cooling space of a cooling device. The heat produced during operation is conducted away from the radiation-emitting semiconductor component and out of the optoelectronic module by means of the channel integrated in the module.

Materials having low requirements with regard to thermal stability can therefore advantageously be used for the first and the second housing of the module. By way of example, an inexpensive plastic can be employed for the first and the second housing.

Furthermore, the total volume of the optoelectronic module can advantageously be reduced since the improved heat dissipation enables the individual components of the module to be arranged close to one another. A space-saving optoelectronic module suitable in particular for illuminating a cooling device can thus be produced.

In one preferred configuration of the optoelectronic module, the channel is embodied as a cutout of the second housing, which cutout adjoins the first housing.

As a result of the integration of the channel into the second housing, the module size can advantageously be reduced further without in the process impeding effective heat dissipation of the heat produced during operation.

In a further preferred configuration, side faces of the second housing apart from the region of the channel directly adjoin side faces of the first housing. A compact module having effective heat dissipation is advantageously made possible in this way.

In a further preferred configuration of the optoelectronic module, the opening in the first housing is arranged at a side face of the carrier plate.

The heat produced during operation of the radiation-emitting semiconductor component can thus be passed via the carrier plate to the opening in the first housing and be conducted from the opening in the first housing via the channel to the opening in the second housing and subsequently out of the module. The heat dissipation of the heat produced during operation advantageously takes place close to the regions of the module at which the heat arises. In particular, the heat dissipation takes place close to the semiconductor component arranged on the carrier plate, whereby efficient heat dissipation of the heat produced during operation from the radiation-emitting semiconductor component can be obtained.

This advantageously lengthens the lifetime of the optoelectronic module since damage to the module which can be produced on account of the heat produced during operation is advantageously reduced by the heat dissipation by means of a channel . In a further preferred configuration of the optoelectronic module, two channels arranged at laterally opposite sides of the module are formed between the first housing and the second housing.

Particularly preferably, the first housing and the second housing in this case have two openings, wherein the openings in the first housing are arranged at mutually opposite side faces of the carrier plate. A respective channel thus begins at a side face of the carrier plate and is connected to a respective opening in the second housing. The opposite arrangement of two channels makes it possible to produce efficient heat dissipation of the heat produced during operation of the module from the module. The lifetime of the module is advantageously improved in this way.

In a further preferred configuration of the optoelectronic module, the channel or the channels contain (s) air.

The air arranged in the channel or in the channels enables the heat produced during operation of the semiconductor component to be conducted toward the outside, in particular into the cooling space of a cooling device, by means of air flow. As a result, the heat produced in the semiconductor component can be effectively emitted from the module. Effective cooling of the semiconductor component can therefore advantageously be obtained.

As an alternative, the channel or the channels can contain a thermally conductive material.

The thermally conductive material advantageously has a lowest possible thermal resistance and a highest possible thermal conductivity, such that the heat emitted from the semiconductor component to the channel can be effectively distributed in the channel. Efficient heat spreading of the lossy heat emitted by the semiconductor component is thereby effected in the channel, whereby efficient heat dissipation from the module can be produced by means of the channel.

Channels containing air or thermally conductive material are particularly suitable for the heat dissipation of the heat produced during operation of the module from the module.

In a further preferred configuration, a heat expanding layer, which can be also called a heat spreading layer, is arranged in regions at a side of the carrier plate which faces the semiconductor component.

The heat expanding layer advantageously has a lowest possible thermal resistance and a highest possible thermal conductivity, such that the heat emitted from the semiconductor component to the carrier plate and from the carrier plate to the heat expanding layer can be effectively distributed in the heat expanding layer. Efficient heat spreading of the heat emitted by the semiconductor component is thereby effected in the heat expanding layer, which heat can in turn advantageously be emitted to the carrier plate in expanded fashion.

By means of the heat expanding layer, the heat, in an improved manner, can thus be distributed in the carrier plate and conducted to the side faces, such that the heat can subsequently be passed out of the module via the channel. In particular, the heat expanding layer expands the heat emitted to the carrier plate in the carrier plate in such a way that improved heat distribution is obtained in the carrier plate. The carrier plate can thus consist of a material which does not have to have high requirements with regard to the thermal stability. A larger selection of materials for the carrier plate therefore advantageously results.

The heat expanding layer is preferably arranged on that side of the carrier plate which faces the semiconductor component. Preferably, a mounting region of the carrier plate which is provided for the semiconductor component is free of the heat expanding layer.

In a further preferred configuration of the optoelectronic module, a thermally conductive plate is arranged at an opposite side of the carrier plate with respect to the semiconductor component.

The heat emitted from the semiconductor component to the carrier plate can advantageously be forwarded to the thermally conductive plate. Consequently, the carrier plate is only temporarily a carrier of the heat emitted by the semiconductor component. From the thermally conductive plate, the heat produced during operation can subsequently be conducted out of the module via the channel. Improved heat conduction in the module advantageously results.

Furthermore, the material of the carrier plate in this way does not have to have high requirements with regard to thermal stability. A larger selection of materials for the carrier plate therefore advantageously results.

In a further preferred configuration of the optoelectronic module, spacers are arranged between the carrier plate and the first housing at an opposite side of the carrier plate with respect to the semiconductor component.

The spacers produce a spacing between carrier plate and first housing at an underside of the carrier plate. The heat emitted to the carrier plate during operation of the semiconductor component is thus virtually not passed on to the first housing by virtue of the spacing between carrier plate and first housing. Consequently, the first housing does not have to have high requirements with regard to thermal stability. Preferably, the spacing between carrier plate and first housing comprises air. Air has a low thermal conductivity, such that thermal insulation between the carrier plate and the first housing can be obtained.

Advantageously, the material of the first and of the second housing is virtually freely selectable with regard to thermal stability. An inexpensive material can advantageously be used for the first and the second housing. In particular, a plastic can be used for the first housing and the second housing.

A further preferred configuration of the optoelectronic module suitable for illuminating a cooling device comprises a carrier plate, at least one radiation-emitting semiconductor component arranged on the carrier plate, a first housing and a second housing, wherein the carrier plate is arranged on a base area of the first housing, such that the radiation-emitting semiconductor component is surrounded by the first housing. The first housing is surrounded by the second housing, wherein the first housing projects from the second housing at an outer side of the module lying opposite the carrier plate and comprises a thermally conductive material .

For the heat dissipation of the heat produced during operation of the semiconductor component, in particular the first housing comprises a thermally conductive material. The heat produced during operation can thus be conducted from the semiconductor component to the carrier plate and from the carrier plate to the base area of the first housing. From the base area of the first housing, the heat is preferably emitted further to side faces of the first housing. The heat can subsequently be dissipated from the module via regions of the first housing which project from the second housing. Heat dissipation of the heat produced in the module out of the module via the first housing is advantageously made possible.

Preferably, a spacing is arranged between the base area of the first housing and a base area of the second housing. Particularly preferably, the spacing contains air. Air has a low thermal conductivity, such that thermal insulation between the first housing and the second housing can be produced. The heat thus emitted to the first housing is not forwarded to the second housing. The second housing can accordingly comprise a material which does not have high requirements with regard to thermal stability. Accordingly, the material selection of the material of the second housing has no restrictions with regard to thermal stability.

In particular, plastic can be used as material of the second housing. In a further preferred configuration, a heat expanding layer is arranged in regions at a side face of the first housing which faces the semiconductor component.

The heat expanding layer extends the heat conducted at the side face of the first housing onto the side face of the first housing. Heat expansion in the side face of the first housing is advantageously made possible. As a result, the material of the first housing does not have to satisfy high requirements with regard to thermal stability.

In one preferred configuration, a plurality of radiation-emitting semiconductor components are arranged on the carrier plate. The number of radiation-emitting semiconductor components arranged on the carrier plate can be adapted depending on the application of the module.

Preferably, the radiation-emitting semiconductor component (s) is (are) light-emitting diodes (LEDs) , in particular LED chips.

Preferably, the module has a radiation exit side lying opposite the carrier plate, through which radiation exit side radiation generated in the module can leave the module. Preferably, the outer side of the module lying opposite the carrier plate is the radiation exit side.

Preferably, an optical element is arranged on the first housing toward the radiation exit side. Optical elements should be understood to mean, inter alia, components which have beam-shaping properties for the radiation emitted by the semiconductor components, that is to say which influence in a targeted manner in particular the emission characteristic and/or the directionality of the emitted radiation. By way of example, a lens can be arranged on the housing toward the emission exit side.

The semiconductor component is preferably a thin-film semiconductor component. In the context of the application, a thin-film semiconductor component is considered to be a semiconductor component during whose production the growth substrate, onto which a semiconductor layer sequence comprising a semiconductor body of the thin-film semiconductor component was grown epitaxially, for example, has been stripped away.

The layers of the semiconductor component are preferably based on a III/V compound semiconductor material. A III/V compound semiconductor material comprises at least one element from the third main group, such as, for example, Al,

Ga, In, and an element from the fifth main group, such as, for example, N, P, As. In particular, the term III/V compound semiconductor material encompasses the group of binary, ternary and quaternary compounds which contain at least one element from the third main group and at least one element from the fifth main group, in particular nitride and phosphide compound semiconductors. Such a binary, ternary or quaternary compound can additionally comprise for example one or more dopants and additional constituents.

The semiconductor component preferably has an active layer for generating radiation. The active layer of the semiconductor component has a pn junction, a double heterostructure, a single quantum well (SQW) or a multiple quantum well (MQW) structure for generating radiation. In this case, the designation quantum well structure does not exhibit any significance with regard to the dimensionality of the quantization. It therefore encompasses, inter alia, quantum wells, quantum wires and quantum dots and any combination of these structures.

The carrier plate preferably contains a thermally conductive material. Thus, the heat produced during operation of the semiconductor components can be optimally passed via the carrier plate to the channels in the module.

The carrier plate is particularly preferably a printed circuit board (PCB) .

The invention furthermore provides a cooling device comprising an optoelectronic module, wherein the module adjoins a cooled region of the cooling device, which region contains air having a temperature lower than room temperature .

Room temperature is, in particular, the temperature that usually prevails in occupied rooms. In particular, room temperature lies within a range of between 18°C and 25°C.

The heat produced in the module during operation can advantageously be dissipated from the module and into the cooled region of the cooling device by means of the channels arranged in the module. The air of the cooled region has a temperature lower than room temperature, such that effective cooling of the module by means of the cooled region of the cooling device can be obtained. Materials used in the module thus advantageously do not have to have high requirements with regard to thermal stability. Inexpensive materials can advantageously be used in the module. Furthermore, individual components of the module can be arranged close to one another without being exposed to the risk of thermal damage. A space-saving module is advantageously made possible.

Preferably, the temperature of the air of the cooled region is lower than 15°C.

In one preferred configuration, the cooling device is a refrigerator, a cold store, a cool box, a freezer, a freezing compartment, a freezing box or a freezing store.

Further features, advantages, preferred configurations and expediencies of the optoelectronic module will be apparent from the exemplary embodiments explained below in conjunction with figures 1 to 4.

In the figures:

Figure IA shows a schematic cross section of a first exemplary embodiment of a module according to the invention,

Figure IB shows a schematic plan view of the module of the exemplary embodiment from figure IA,

Figure 2A shows a schematic cross section of a further exemplary embodiment of a module according to the invention,

Figure 2B shows a schematic plan view of the module of the exemplary embodiment from figure 2A, Figure 3 shows a schematic cross section of a further exemplary embodiment of a module according to the invention,

Figure 4A shows a schematic cross section of a further exemplary embodiment of a module according to the invention, and

Figure 4B shows a schematic plan view of the module of the exemplary embodiment from figure 4A.

Identical or identically acting constituent parts are in each case provided with the same reference symbols. The constituent parts illustrated and also the size relationships of the constituent parts among one another should not be regarded as true to scale.

Figures IA and IB illustrate a first exemplary embodiment of an optoelectronic module 100. In particular, figure IA illustrates a cross section of an optoelectronic module 100 and figure IB illustrates a plan view of the module of the exemplary embodiment from figure IA. The module 100 comprises a carrier plate 1, a plurality of radiation-emitting semiconductor components 2 arranged on the carrier plate 1, a first housing 31 and a second housing 32.

The radiation-emitting semiconductor components 2 are preferably LEDs. The radiation-emitting semiconductor components 2 preferably each have an active layer suitable for generating electromagnetic radiation. The semiconductor component 2 is preferably embodied such that it is of thin-film design. In particular, the semiconductor component 2 comprises preferably epitaxially deposited layers that form the semiconductor component 2. The layers of the semiconductor component are preferably based on a III/V compound semiconductor material.

The carrier plate 1 of the optoelectronic module 100 preferably contains a thermally conductive material. Particularly preferably, the carrier plate 1 is a circuit board, in particular a PCB.

The fixing of the carrier plate 1 to the first housing 31 is preferably effected by means of spacers 11a, lib, for example by means of a column 11a arranged between the carrier plate 1 and the first housing 31 and/or by means of a clamp lib led from the carrier plate 1 to a side face of the first housing 31.

By means of the spacer 11a, the carrier plate 1 advantageously does not bear directly on a base area of the housing 31. Consequently, the heat emitted from the semiconductor components 2 to the carrier plate 1 does not transfer directly to the first housing 31. The material of the first housing 31 therefore does not have to have high requirements with regard to thermal stability like the carrier plate 1.

The module 100 preferably has a radiation exit side, at which the radiation generated from the semiconductor components emerges from the module 100. The radiation exit side of the module 100 is preferably arranged at the opposite side from the carrier plate 1. In particular, the radiation exit side is arranged at an outer side 101 of the module 100 lying opposite the carrier plate 1. The carrier plate 1 is arranged in the first housing 31 in such a way that the radiation-emitting semiconductor components 2 are surrounded by the carrier plate 1 and the first housing 31. Preferably, an optical element 31d is arranged on the first housing 31 toward the radiation exit side. The radiation-emitting semiconductor components 2 are thus surrounded by the carrier plate 1, the first housing 31 and the optical element 31d. The optical element 31d is preferably a lens.

The first housing 31 is surrounded by a second housing 32, wherein at least one channel 4 is arranged between the first housing 31 and the second housing 32. The channel 4 connects an opening 31a in the first housing 31 to an opening 32a in the second housing 32.

Preferably, the opening 31a in the first housing 31 is arranged at a side face 10 of the carrier plate 1. The channel 4 accordingly begins at a side face 10 of the carrier plate 1 and leads between the first housing 31 and the second housing 32 in the direction of the outer side 101 of the module 100.

In particular, two channels 4 arranged at two mutually opposite sides of the module 100 are formed between the first housing 31 and the second housing 32.

The channels 4 of the exemplary embodiment from figure IA preferably contain air.

The channels 4 integrated in the module enable the heat generated during operation of the semiconductor components 2 to be dissipated from the module in an improved manner. A lengthened lifetime of the module is advantageously made possible. Furthermore, a compact module is made possible since a space-saving arrangement of individual components of the module is advantageously made possible by the targeted dissipation of the heat from the module.

Advantageously, the first and the second housing 31, 32 do not have to have high thermal stabilities since the heat generated during operation is dissipated from the module 100 through the channel 4. Accordingly, high requirements with regard to thermal stability are not necessary in respect of material for the first housing 31 and the second housing 32. Inexpensive materials, such as plastic for example, can thus be used for the first housing 31 and the second housing 32.

The heat dissipation of the heat emitted during operation of the radiation-emitting semiconductor components 2 through a channel 4 is illustrated by way of example by an arrow in figure IA.

The optoelectronic module 100 is arranged in a cooling device in the exemplary embodiment in figure IA. In particular, the module 100 adjoins, by the outer side 101, a cooled region of the cooling device. The cooled region preferably contains air having a temperature lower than room temperature, in particular lower than 15°C. In particular, the cooling device is a refrigerator in the exemplary embodiment in figure IA. The refrigerator has an inner wall 9 serving as delimitation of the cooled region. Furthermore, the refrigerator has an outer insulation 8, for example a foam insulation. The heat produced during operation of the radiation-emitting semiconductor components can be dissipated via the carrier plate 1 by means of the channels 4 and the openings 31a, 32a in the first housing 31 and the second housing 32 into the cooled region of the cooling device. Improved heat dissipation and associated therewith efficient cooling of the module are advantageously made possible. The lifetime of the module is therefore advantageously lengthened.

Furthermore, a space-saving arrangement of the individual components of the module 100 is thus possible without the components of the module 100 in this case being exposed to the risk of thermal damage. Furthermore, the channels integrated in the module for heat dissipation enable the use of inexpensive materials for the components of the module 100.

Figure IB illustrates a plan view of a module from figure IA. The radiation-emitting semiconductor components 2 are surrounded by the carrier plate 1 and the first housing 31. Furthermore, the second housing 32 surrounds the first housing 31.

The channels 4 of the module are preferably embodied as cutouts of the second housing 32 which in each case adjoin the first housing. In particular, the side faces 32b of the second housing 32 apart from the regions of the channels 4 directly adjoin side faces 31b of the first housing 31. A space-saving arrangement of the individual components of the module 100 is advantageously made possible. The risk of damage to the components of the module, for example the first housing 31 and the second housing 32, as a result of an excessively high temperature is reduced by the heat dissipation by means of the channels 4.

Figure 2A illustratese a cross section of a further exemplary embodiment of a module 100 according to the invention. In contrast to the exemplary embodiment illustrated in figure

IA, two spacers 11a are arranged between carrier plate 1 and first housing 31, which spacers define a fixed spacing between carrier plate 1 and first housing 31. A clamp lib led from the carrier plate 1 to a side face of the first housing

31 as illustrated in figure IA can advantageously be dispensed with.

Furthermore, in contrast to the exemplary embodiment illustrated in figure IA, in figure 2A a heat expanding layer

5 is arranged in regions on a side of the carrier plate 1 that faces the semiconductor components 2. The heat expanding layer 5 is arranged in particular preferably in side regions of the carrier plate 1. In particular, the heat expanding layer 5 is arranged close to the openings 31a in the first housing 31.

The heat emitted to the carrier plate 1 during operation of the semiconductor components 2 can be expanded by the heat expanding layer 5 arranged on the carrier plate 1. The risk of damage to the carrier plate 1 as a result of an excessively high temperature is therefore advantageously minimized. Furthermore, the heat expanding layer 5, preferably arranged in side regions of the carrier plate 1, improves the dissipation of the heat contained in the carrier plate 1 via the opening 31a in the first housing 31 into the channel 4 of the module 100. Improved heat dissipation of the heat produced in the module 100 during operation is advantageously made possible.

Figure 2B illustrates a plan view of the module 100 from figure 2A. In contrast to the exemplary embodiment from figure IB, a heat expanding layer 5 is arranged in regions on that side of the carrier plate 1 which faces the semiconductor components 2. In particular, the heat expanding layer 5 is arranged in each case close to the channels 4 of the module 100. In particular, only side regions of the carrier plate 1 in each case have a heat expanding layer. Mounting regions of the carrier plate 1, on which the semiconductor components 2 are arranged, preferably have no heat expanding layer 5.

Figure 3 illustrates a further cross section of a further exemplary embodiment of a module 100 according to the invention. In comparison with the exemplary embodiment illustrated in figure IA, a thermally conductive plate 6 is arranged at an opposite side of the carrier plate 1 with respect to the semiconductor components 2. In particular, the thermally conductive plate 6 bears at least in regions on side faces of the housing 31. The thermally conductive plate 6 accordingly projects into the opening 31a in the first housing 31.

The thermally conductive plate 6 arranged below the carrier plate 1 improves the heat conduction of the heat contained in the carrier plate 1 into the channel 4. In particular, on account of the heat dissipation via the thermally conductive plate 6, the material of the carrier plate 1 can have a reduced requirement with regard to thermal stability. The heat produced during operation of the semiconductor components is dissipated via the carrier plate 1 to the thermally conductive plate 6. From the thermally conductive plate 6, the heat is conducted via the openings 31a in the first housing 31 further into the channel and via the channel through the openings 32a in the second housing 32 out of the module .

Contrary to the exemplary embodiment in figure IA, a spacer is advantageously not necessary in the exemplary embodiment in figure 3.

Figures 4A and 4B illustrate a further exemplary embodiment of an optoelectronic module 100. In particular, figure 4A shows a cross section of a module and figure 4B shows a plan view of the module illustrated in figure 4A.

The optoelectronic module 100 comprises a carrier plate 1, a plurality of radiation-emitting semiconductor components 2 arranged on the carrier plate 1, a first housing 31 and a second housing 32.

In contrast to the previous exemplary embodiments, the carrier plate 1 is arranged on a base area 31c of the first housing 31. The carrier plate 1 is therefore in direct contact with the base area 31c of the first housing 31.

Furthermore, the radiation-emitting semiconductor components 2 are completely surrounded by the first housing 31. In particular, the radiation-emitting semiconductor components 2 are surrounded by the base area 31c, by side faces 31b and by an optical element 31d arranged on the first housing 31 in such a way that the radiation-emitting semiconductor components 2 are arranged in a closed space. The first housing 31 is surrounded by the second housing 32. In this case, in particular, side faces 32b of the second housing 32 bear directly against side faces 31b of the first housing 31. A base area of the second housing 32 is spaced apart, however, from a base area 31c of the first housing 31.

The first housing 31 projects from the second housing 32 at an outer side 101 of the module 100 lying opposite the carrier plate 1. In particular, in regions the first housing 31 bears on regions of the second housing 32 at the outer side 101 of the module 100.

The first housing comprises a thermally conductive material.

The heat from the semiconductor components 2 that is produced during operation can thus be dissipated via the carrier plate 1 directly onto the first housing 31. From the base area 31c of the first housing 31, the heat can be conducted via side faces 31b of the first housing 31 to the outer side 101 of the module 100. Improved heat dissipation of the heat produced in the module during operation can advantageously be produced in this way. In particular, the heat produced during operation can thus be dissipated efficiently to the outer side 101 of the module 100 without further components of the module 100 in this case being exposed to the risk of damage as a result of an excessively high operating temperature.

As in the preceding figures 1 to 3, the module 100 is preferably arranged in a cooling device. In particular, preferably a cooled region adjoins the outer side 101 of the module 100. The heat generated during operation of the module 100 can thus be dissipated into the cooled region, such that the risk of damage to the module as a result of an excessively high operating temperature is reduced during operation. A space-saving arrangement of the components of the module 100 and inexpensive materials of the components of the module 100 are advantageously made possible.

A heat expanding layer 5 is arranged in regions at side faces 31b of the first housing 31 that face the semiconductor components 2. As in the exemplary embodiment in figures 2A and 2B, the heat expanding layer 5 serves for heat expansion of the components arranged underneath, in this case of the side faces 31b of the first housing 31. In contrast to the exemplary embodiment from figures 2A and 2B, the heat expanding layer 5 is arranged at side faces of the first housing 31 and not on the carrier plate 1. Improved heat guidance in the module 100, in particular improved heat dissipation of the heat from the module 100, is advantageously obtained.

In particular, the module of the exemplary embodiment in figures 4A and 4B has no channels between the first housing 31 and the second housing 32. Furthermore, a first housing 31 and second housing 32 embodied as in figure 4 have no openings 31a, 32a. By virtue of a first housing 31 embodied as in figure 4, channels for heat dissipation are advantageously not necessary.

Figure 4B illustrates a plan view of the exemplary embodiment from figure 4A. In contrast to the exemplary embodiment illustrated in figure 2B, the heat expanding layer 5 is arranged at side faces of the first housing 31. The carrier plate 1 has, in particular, no heat expanding layer. Channels arranged between the first housing 31 and the second housing 32, in particular channels embodied as cutouts of the second housing 32, are not employed in the exemplary embodiment in figures 4A and 4B.

The explanation of the module according to the invention on the basis of the exemplary embodiments described above should not be regarded as a restriction of the invention thereto. Rather, the invention encompasses any new feature and also any combination of features, which in particular comprises any combination of features in the patent claims, even if these features themselves or this combination itself are or is not explicitly specified in the patent claims or the exemplary embodiments.

Claims

Patent Claims

1. An optoelectronic module (100) suitable for illuminating a cooling device and comprising a carrier plate (1), at least one radiation-emitting semiconductor component (2) arranged on the carrier plate (1), a first housing (31) and a second housing (32), wherein the carrier plate (1) is arranged in the first housing (31) in such a way that the radiation-emitting semiconductor component (2) is surrounded by the carrier plate (1) and the first housing (31), the first housing (31) is surrounded by the second housing (32), wherein at least one channel (4) is arranged between the first housing (31) and the second housing (32), said at least one channel (4) connecting an opening (31a) in the first housing (31) to an opening (32a) in the second housing (32) .

2. The optoelectronic module as claimed in claim 1, wherein the channel (4) is embodied as a cutout of the second housing

(32), said cutout adjoining the first housing (31).

3. The optoelectronic module as claimed in any of the preceding claims, wherein side faces (32b) of the second housing (32) apart from the region of the channel (4) directly adjoin side faces (31b) of the first housing (31) .

4. The optoelectronic module as claimed in any of the preceding claims, wherein the opening (31a) in the first housing (31) is arranged at a side face (10) of the carrier plate (1) .

5. The optoelectronic module as claimed in any of the preceding claims, wherein two channels (4) arranged at two mutually opposite sides of the module (100) are formed between the first housing (31) and the second housing (32) .

6. The optoelectronic module as claimed in any of the preceding claims, wherein the channel or the channels (4) contain air.

7. The optoelectronic module as claimed in any of the preceding claims, wherein the channel or the channels (4) contain a thermally conductive material.

8. The optoelectronic module as claimed in any of the preceding claims, wherein a heat expanding layer (5) is arranged in regions at a side of the carrier plate (1) which faces the semiconductor component (2) .

9. The optoelectronic module as claimed in any of the preceding claims, wherein a thermally conductive plate (6) is arranged at an opposite side of the carrier plate (1) with respect to the semiconductor component (2).

10. The optoelectronic module as claimed in any of the preceding claims, wherein spacers (11) are arranged between the carrier plate (1) and the first housing (31) at an opposite side of the carrier plate (1) with respect to the semiconductor component (2).

11. An optoelectronic module (100) suitable for illuminating a cooling device and comprising a carrier plate (1), at least one radiation-emitting semiconductor component (2) arranged on the carrier plate (1), a first housing (31) and a second housing (32), wherein the carrier plate (1) is arranged on a base area (31c) of the first housing (31), such that the radiation-emitting semiconductor component (2) is surrounded by the first housing (31) , - the first housing (31) is surrounded by the second housing (32), wherein the first housing (31) projects from the second housing (32) at an outer side (101) of the module

(100) lying opposite the carrier plate (1) and comprises a thermally conductive material.

12. The optoelectronic module as claimed in claim 11, wherein a heat expanding layer (5) is arranged in regions at a side face (31b) of the first housing (31) which faces the semiconductor component (2).

13. A cooling device comprising an optoelectronic module (100) as claimed in any of the preceding claims 1 to 12, wherein the module (100) adjoins a cooled region of the cooling device, which region contains air having a temperature lower than room temperature.

14. The cooling device as claimed in claim 13, wherein the temperature of the air of the cooled region is lower than 15°C.

15. The cooling device as claimed in either of the preceding claims 13 and 14, wherein the cooling device is a refrigerator, a cold store, a cool box, a freezer, a freezing compartment, a freezing box or a freezing store.