WO2010053884A1 - Lighting systems - Google Patents
Lighting systems Download PDFInfo
- Publication number
- WO2010053884A1 WO2010053884A1 PCT/US2009/063027 US2009063027W WO2010053884A1 WO 2010053884 A1 WO2010053884 A1 WO 2010053884A1 US 2009063027 W US2009063027 W US 2009063027W WO 2010053884 A1 WO2010053884 A1 WO 2010053884A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- encapsulant
- nvis
- compliant
- assembly according
- led die
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Definitions
- the present invention relates to lighting systems and more particularly, although not necessarily exclusively, to lighting systems compliant with requirements for night vision imaging systems (NVISs) or compatible with NVIS equipment.
- NVISs night vision imaging systems
- Cockpit lighting demands for military or other professional aircraft may be impacted by nighttime, or other low light, operations.
- flight crews may have donned night vision goggles or similar equipment to enhance visibility of terrain and other features outside the aircraft. Because these goggles are sensitive to infrared and near-infrared radiation, cockpit illumination often must be designed to minimize output in these regions of the lighting spectrum. Illumination of this type that meets military or other recognized standards in this area is frequently referred to as "NVIS compliant.”
- It is another object of this invention to provide an electronic component for use in a night vision imaging system environment comprising a printed circuit board assembly comprising a light source having an emission non-compliant to the night vision imaging system standard, a conformal coating covering the printed circuit board assembly, including an absorbing agent, for filtering quantities of energy of the emission, such that the infrared emission of the printed circuit board assembly is filtered by the absorbing agent.
- a printed circuit board assembly comprising a light source having an emission non-compliant to the night vision imaging system standard, a conformal coating covering the printed circuit board assembly, including an absorbing agent, for filtering quantities of energy of the emission, such that the infrared emission of the printed circuit board assembly is filtered by the absorbing agent.
- FIG. 2 of the Lemay patent Illustrated in Fig. 2 of the Lemay patent is "a typical assembly of light emitting diodes producing light compliant with a night vision imaging system standard.” Id., 11. 28-30. Shown in the figure are two LEDs (green and blue) assembled on a printed circuit board and coated externally with a conformal coating to which absorbing dye has been added. An optical filter and diffusing film may also be positioned atop the LEDs, with the conformal coating instead applied to the diffusing film in an alternative version of the assembly. See id., col. 5, 11. 7-48. Absent inclusion of (at least) the external conformal coating with its absorbing dye, the assembly would not be NVIS compliant.
- FIG. 1 of this application depicts a conventional system similar to that of the Lemay patent.
- a standard surface-mount LED package 10 includes an encapsulated LED die 14 positioned within a housing 18, with the encapsulant 22 typically comprising phosphor 26.
- An external filtering dye or pigment 30 (which may be in the form of a doped glass or polymeric film) is then coated onto or bonded to the exterior of the housing 18. hi yet other existing systems, the filtering material is separated from—but still external to— the housing of the LED.
- the present invention provides systems with internal filtering that are NVIS-compliant or, at least, compatible with NVIS equipment. Certain presently- preferred versions of the systems incorporate filtering material into the encapsulant for an LED. Additionally or alternatively incorporated into the encapsulant may be phosphor or quantum dots. Although not presently preferred, systems of the present invention alternatively or additionally could incorporate filtering material into the housing of the encapsulated LED. In any circumstance, common to all of these systems is that need for an external filtering agent is eliminated.
- both phosphor and an absorber of infrared and near- infrared energy are incorporated into the encapsulant of a blue (or other wavelength) LED die.
- the encapsulated die is then positioned within a housing (typically, but not necessarily, made of polymeric material or ceramic).
- component assembly may occur in any other appropriate order.
- the preferred result, in any event, is an NVIS-compliant LED ready for installation and use.
- FIG. 1 is a schematicized view of an existing LED package with external filtering material.
- FIG. 2 is a schematicized view of an exemplary LED package of the present invention omitting external filtering material.
- exemplary assembly 50 of FIG. 2 preferably omits external filtering dye or pigment 30. This omission simplifies creation of NVIS-compliant or compatible lighting systems, as assembly 50 need not be coated with (or otherwise processed to include) an external filtering agent to ensure NVIS compliance. Avoiding any need for use of an external filtering agent also reduces time and expense associated with processing assembly 50, as the assembly 50 effectively may be supplied usage-ready without modification.
- Assembly 50 may comprise LED die 54, encapsulant 58, and housing 62.
- die 54 preferably—although not necessarily—will be blue, green, or red.
- Encapsulant 58 may encapsulate die 54, with both encapsulant 58 and die 54 being housed in housing 62.
- assembly 50 too preferably contains filtering material.
- filtering material 66 is illustrated in FIG. 2 as dye or pigment configured to absorb at least some energy in either or both of the infrared and near-infrared portions of the light spectrum. It may absorb some energy in the visible portion of the light spectrum as well.
- Material 66 need not necessarily be dye or pigment or in the form of a doped film, however; instead, it may comprise any agent and structure satisfactory for reducing emissions of die 54 in one or more regions of the spectrum.
- Filtering material 66 is, however, incorporated into encapsulant 58. It thus is internal to housing 62, rather than external to housing 18 as shown in FIG. 1 or to the LED packages of the Lemay patent. Also shown as incorporated into encapsulant 58 is phosphor 26, although inclusion of phosphor 26 is optional in some embodiments of assembly 50. Alternatively or additionally, quantum dots may be incorporated into encapsulant 58. In any event, preferred versions of assembly 50 are NVIS compliant.
- Certain alternate versions of assembly 50 incorporate filtering material 66 into housing 62.
- This filtering material 66 may be in lieu of or in addition to that discussed in the preceding paragraph. It nevertheless continues to be internal to assembly 50 as opposed to the external coatings of existing systems.
- Other alternate versions of assembly 50 may involve coating die 54 directly with phosphor 26 while continuing to incorporate filtering material 66 into encapsulant 58.
- Yet other versions of assembly 50 contemplate injecting a mixture of phosphor 26 and filtering material into encapsulant 58 in a manner permitting the (higher) specific gravity of phosphor 26 to cause it to settle onto die 54.
- Assembly 50 may, if desired, be attached to a printed circuit board similar to the system of the Lemay patent. However, because assembly 50 typically is already NVIS compliant, at least the conformal coating of the Lemay patent is unnecessary. (Although unnecessary, such conformal coating may, however, be added to assembly 50 if desired.) Likewise, if desired, the diffusing film and optical filter of the Lemay patent may also be used with assembly 50.
- any number of LED packages of the present invention, on or off any number of integrated circuits or printed circuit boards, may be included in lighting systems of the present invention.
- an assembly 50 of the present invention may include as few as one LED die 54, whereas assemblies of the Lemay patent require a minimum of two LED dies (one blue, one green). Assembly 50 nevertheless may include both blue and green (or other color) LED dies if desired, as the concept of incorporating filtering material 66 into encapsulant 58 (or into housing 62) is independent of the type of die 54 included.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2741864A CA2741864C (en) | 2008-11-07 | 2009-11-03 | Lighting systems |
CN2009801444863A CN102210033A (en) | 2008-11-07 | 2009-11-03 | Lighting systems |
BRPI0921259A BRPI0921259A2 (en) | 2008-11-07 | 2009-11-03 | set in accordance with nvis |
EP09753277A EP2364509A1 (en) | 2008-11-07 | 2009-11-03 | Lighting systems |
JP2011535616A JP2012508464A (en) | 2008-11-07 | 2009-11-03 | Lighting system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11222808P | 2008-11-07 | 2008-11-07 | |
US61/112,228 | 2008-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010053884A1 true WO2010053884A1 (en) | 2010-05-14 |
Family
ID=41611431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/063027 WO2010053884A1 (en) | 2008-11-07 | 2009-11-03 | Lighting systems |
Country Status (7)
Country | Link |
---|---|
US (1) | US8523372B2 (en) |
EP (1) | EP2364509A1 (en) |
JP (1) | JP2012508464A (en) |
CN (1) | CN102210033A (en) |
BR (1) | BRPI0921259A2 (en) |
CA (1) | CA2741864C (en) |
WO (1) | WO2010053884A1 (en) |
Cited By (1)
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---|---|---|---|---|
US9698315B2 (en) | 2014-10-31 | 2017-07-04 | Nichia Corporation | Light emitting device |
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AU2007325132A1 (en) * | 2006-11-28 | 2008-06-05 | Hayward Industries, Inc. | Programmable underwater lighting system |
TWI385834B (en) * | 2009-02-06 | 2013-02-11 | Yu Nung Shen | Light emitting diode chip package and manufacturing method thereof |
US8541793B2 (en) * | 2010-02-04 | 2013-09-24 | Yu-Nung Shen | Light emitting diode device and method for fabricating the same |
US20110267834A1 (en) | 2010-04-28 | 2011-11-03 | Hayward Industries, Inc. | Underwater Light Having A Sealed Polymer Housing and Method of Manufacture Therefor |
WO2013034461A2 (en) * | 2011-09-09 | 2013-03-14 | Osram Ag | An improved occupancy sensor device |
KR20130080613A (en) * | 2012-01-05 | 2013-07-15 | 금호전기주식회사 | Led lighting apparatus using color filter |
US20150062963A1 (en) * | 2012-03-31 | 2015-03-05 | Noam Meir | Illumination system and method for backlighting |
DE102012211217A1 (en) * | 2012-06-28 | 2014-01-02 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC COMPONENT DEVICE |
AU2014228186B2 (en) | 2013-03-15 | 2019-11-07 | Hayward Industries, Inc. | Modular pool/spa control system |
DE102013103984A1 (en) * | 2013-04-19 | 2014-11-06 | Osram Opto Semiconductors Gmbh | Illumination device for backlighting a display or a television, display and television |
US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
US11720085B2 (en) | 2016-01-22 | 2023-08-08 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
US10272014B2 (en) | 2016-01-22 | 2019-04-30 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
US11592701B2 (en) | 2018-11-28 | 2023-02-28 | Eyesafe Inc. | Backlight unit with emission modification |
US11810532B2 (en) | 2018-11-28 | 2023-11-07 | Eyesafe Inc. | Systems for monitoring and regulating harmful blue light exposure from digital devices |
US11168876B2 (en) | 2019-03-06 | 2021-11-09 | Hayward Industries, Inc. | Underwater light having programmable controller and replaceable light-emitting diode (LED) assembly |
US10971660B2 (en) * | 2019-08-09 | 2021-04-06 | Eyesafe Inc. | White LED light source and method of making same |
CN111273482A (en) * | 2020-01-21 | 2020-06-12 | 苏州奥科飞光电科技有限公司 | Novel night vision compatible backlight module |
KR102543767B1 (en) * | 2020-11-26 | 2023-06-16 | 주식회사 사이언 | Light emitting diode for night vision imaging system |
CN116951343B (en) * | 2023-09-19 | 2023-11-24 | 东莞市红富照明科技有限公司 | Multi-light-effect intelligent lighting device and intelligent desk lamp |
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2009
- 2009-11-03 CA CA2741864A patent/CA2741864C/en active Active
- 2009-11-03 WO PCT/US2009/063027 patent/WO2010053884A1/en active Application Filing
- 2009-11-03 BR BRPI0921259A patent/BRPI0921259A2/en not_active IP Right Cessation
- 2009-11-03 US US12/611,130 patent/US8523372B2/en active Active
- 2009-11-03 JP JP2011535616A patent/JP2012508464A/en active Pending
- 2009-11-03 EP EP09753277A patent/EP2364509A1/en not_active Withdrawn
- 2009-11-03 CN CN2009801444863A patent/CN102210033A/en active Pending
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JPH07193282A (en) * | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | Infrared visible light conversion light emitting diode of small directivity |
WO2003006876A1 (en) * | 2001-07-12 | 2003-01-23 | Northrop Grumman Corporation | Programmable multi-color backlight for a liquid crystal display |
US20040145893A1 (en) * | 2003-01-29 | 2004-07-29 | Cmc Electronique Inc. | Night vision imaging system (NVIS) compliant instrument panel component |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9698315B2 (en) | 2014-10-31 | 2017-07-04 | Nichia Corporation | Light emitting device |
Also Published As
Publication number | Publication date |
---|---|
CA2741864A1 (en) | 2010-05-14 |
EP2364509A1 (en) | 2011-09-14 |
BRPI0921259A2 (en) | 2018-05-29 |
CA2741864C (en) | 2015-12-29 |
US20100118511A1 (en) | 2010-05-13 |
CN102210033A (en) | 2011-10-05 |
JP2012508464A (en) | 2012-04-05 |
US8523372B2 (en) | 2013-09-03 |
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