WO2010052682A3 - Mems with poly-silicon cap layer - Google Patents

Mems with poly-silicon cap layer Download PDF

Info

Publication number
WO2010052682A3
WO2010052682A3 PCT/IB2009/054992 IB2009054992W WO2010052682A3 WO 2010052682 A3 WO2010052682 A3 WO 2010052682A3 IB 2009054992 W IB2009054992 W IB 2009054992W WO 2010052682 A3 WO2010052682 A3 WO 2010052682A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems
devices
poly
oscillators
cap layer
Prior art date
Application number
PCT/IB2009/054992
Other languages
French (fr)
Other versions
WO2010052682A2 (en
Inventor
Greja Johanna Adriana Verheijden
Gerhard Koops
Original Assignee
Nxp B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp B.V. filed Critical Nxp B.V.
Publication of WO2010052682A2 publication Critical patent/WO2010052682A2/en
Publication of WO2010052682A3 publication Critical patent/WO2010052682A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00277Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0136Growing or depositing of a covering layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0145Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The present invention relates to a novel way of sealing a MEMS and the MEMS obtained thereby. MEMS resonators are being intensively studied in many research groups and some first products have recently been released. This type of device offers a high Q-factor, small size, high level of integration and potentially low cost. These devices are expected to replace bulky quartz crystals in high-precision oscillators and may also be used as RF filters. The oscillators are widely used in time-keeping and frequency reference applications such as RF modules in mobile phones, devices containing blue-tooth modules and other digital and telecommunication devices.
PCT/IB2009/054992 2008-11-10 2009-11-10 Mems with poly-silicon cap layer WO2010052682A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08168722 2008-11-10
EP08168722.0 2008-11-10

Publications (2)

Publication Number Publication Date
WO2010052682A2 WO2010052682A2 (en) 2010-05-14
WO2010052682A3 true WO2010052682A3 (en) 2011-04-07

Family

ID=42153355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/054992 WO2010052682A2 (en) 2008-11-10 2009-11-10 Mems with poly-silicon cap layer

Country Status (1)

Country Link
WO (1) WO2010052682A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012218147A (en) * 2011-04-11 2012-11-12 Imec Method for sealing microcavity
JP6299142B2 (en) * 2013-10-21 2018-03-28 セイコーエプソン株式会社 Vibrator, vibrator manufacturing method, electronic device, electronic apparatus, and moving body
JP2015171740A (en) * 2014-03-12 2015-10-01 セイコーエプソン株式会社 Mems device and manufacturing method of the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040152228A1 (en) * 2001-03-22 2004-08-05 Hubert Benzel Method for producing micromechanic sensors and sensors produced by said method
US20050189318A1 (en) * 2004-02-02 2005-09-01 Twan Bearda Method for forming macropores in a layer and products obtained thereof
US20060144142A1 (en) * 2005-01-06 2006-07-06 Gogoi Bishnu P Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
US20070235501A1 (en) * 2006-03-29 2007-10-11 John Heck Self-packaging MEMS device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040152228A1 (en) * 2001-03-22 2004-08-05 Hubert Benzel Method for producing micromechanic sensors and sensors produced by said method
US20050189318A1 (en) * 2004-02-02 2005-09-01 Twan Bearda Method for forming macropores in a layer and products obtained thereof
US20060144142A1 (en) * 2005-01-06 2006-07-06 Gogoi Bishnu P Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
US20070235501A1 (en) * 2006-03-29 2007-10-11 John Heck Self-packaging MEMS device

Also Published As

Publication number Publication date
WO2010052682A2 (en) 2010-05-14

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