WO2010052682A3 - Mems with poly-silicon cap layer - Google Patents
Mems with poly-silicon cap layer Download PDFInfo
- Publication number
- WO2010052682A3 WO2010052682A3 PCT/IB2009/054992 IB2009054992W WO2010052682A3 WO 2010052682 A3 WO2010052682 A3 WO 2010052682A3 IB 2009054992 W IB2009054992 W IB 2009054992W WO 2010052682 A3 WO2010052682 A3 WO 2010052682A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mems
- devices
- poly
- oscillators
- cap layer
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present invention relates to a novel way of sealing a MEMS and the MEMS obtained thereby. MEMS resonators are being intensively studied in many research groups and some first products have recently been released. This type of device offers a high Q-factor, small size, high level of integration and potentially low cost. These devices are expected to replace bulky quartz crystals in high-precision oscillators and may also be used as RF filters. The oscillators are widely used in time-keeping and frequency reference applications such as RF modules in mobile phones, devices containing blue-tooth modules and other digital and telecommunication devices.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08168722 | 2008-11-10 | ||
EP08168722.0 | 2008-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010052682A2 WO2010052682A2 (en) | 2010-05-14 |
WO2010052682A3 true WO2010052682A3 (en) | 2011-04-07 |
Family
ID=42153355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2009/054992 WO2010052682A2 (en) | 2008-11-10 | 2009-11-10 | Mems with poly-silicon cap layer |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2010052682A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012218147A (en) * | 2011-04-11 | 2012-11-12 | Imec | Method for sealing microcavity |
JP6299142B2 (en) * | 2013-10-21 | 2018-03-28 | セイコーエプソン株式会社 | Vibrator, vibrator manufacturing method, electronic device, electronic apparatus, and moving body |
JP2015171740A (en) * | 2014-03-12 | 2015-10-01 | セイコーエプソン株式会社 | Mems device and manufacturing method of the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040152228A1 (en) * | 2001-03-22 | 2004-08-05 | Hubert Benzel | Method for producing micromechanic sensors and sensors produced by said method |
US20050189318A1 (en) * | 2004-02-02 | 2005-09-01 | Twan Bearda | Method for forming macropores in a layer and products obtained thereof |
US20060144142A1 (en) * | 2005-01-06 | 2006-07-06 | Gogoi Bishnu P | Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor |
US20070235501A1 (en) * | 2006-03-29 | 2007-10-11 | John Heck | Self-packaging MEMS device |
-
2009
- 2009-11-10 WO PCT/IB2009/054992 patent/WO2010052682A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040152228A1 (en) * | 2001-03-22 | 2004-08-05 | Hubert Benzel | Method for producing micromechanic sensors and sensors produced by said method |
US20050189318A1 (en) * | 2004-02-02 | 2005-09-01 | Twan Bearda | Method for forming macropores in a layer and products obtained thereof |
US20060144142A1 (en) * | 2005-01-06 | 2006-07-06 | Gogoi Bishnu P | Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor |
US20070235501A1 (en) * | 2006-03-29 | 2007-10-11 | John Heck | Self-packaging MEMS device |
Also Published As
Publication number | Publication date |
---|---|
WO2010052682A2 (en) | 2010-05-14 |
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