WO2010039175A3 - Ejecteur de gouttes de liquide à trou auto-aligné - Google Patents

Ejecteur de gouttes de liquide à trou auto-aligné Download PDF

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Publication number
WO2010039175A3
WO2010039175A3 PCT/US2009/005197 US2009005197W WO2010039175A3 WO 2010039175 A3 WO2010039175 A3 WO 2010039175A3 US 2009005197 W US2009005197 W US 2009005197W WO 2010039175 A3 WO2010039175 A3 WO 2010039175A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
insulating layer
forming
opening
self
Prior art date
Application number
PCT/US2009/005197
Other languages
English (en)
Other versions
WO2010039175A2 (fr
Inventor
John Andrew Lebens
Weibin Zhang
Christopher Newell Delametter
Original Assignee
Eastman Kodak Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Company filed Critical Eastman Kodak Company
Priority to JP2011529007A priority Critical patent/JP2012504059A/ja
Priority to EP09789329A priority patent/EP2331334A2/fr
Publication of WO2010039175A2 publication Critical patent/WO2010039175A2/fr
Publication of WO2010039175A3 publication Critical patent/WO2010039175A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14467—Multiple feed channels per ink chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

La présente invention se rapporte à un procédé de formation d’un trou auto-aligné dans un substrat afin de former un passage d’alimentation en fluide, le procédé comprenant les étapes consistant à : former initialement une couche isolante sur un premier côté d’un substrat ayant deux côtés opposés; et former un élément sur la couche isolante; graver ensuite une ouverture dans la couche isolante, de sorte que l’ouverture soit physiquement alignée sur l’élément situé sur la couche isolante; et recouvrir l’élément d’une couche de matériau de protection. Le modelage de la couche de matériau de protection exposera l’ouverture dans la couche isolante. La gravure sèche depuis le premier côté du substrat forme un trou borgne d’alimentation dans le substrat correspondant à l’emplacement de l’ouverture dans la couche isolante, le trou borgne d’alimentation comprenant un fond. Par la suite, on meule un second côté du substrat et on le grave sur banchet pour former un trou dans tout le substrat.
PCT/US2009/005197 2008-09-30 2009-09-18 Ejecteur de gouttes de liquide à trou auto-aligné WO2010039175A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011529007A JP2012504059A (ja) 2008-09-30 2009-09-18 自己整合穴を有する液滴吐出器
EP09789329A EP2331334A2 (fr) 2008-09-30 2009-09-18 Procédé de formation d'un trou auto-aligné dans un substrat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/241,747 2008-09-30
US12/241,747 US8173030B2 (en) 2008-09-30 2008-09-30 Liquid drop ejector having self-aligned hole

Publications (2)

Publication Number Publication Date
WO2010039175A2 WO2010039175A2 (fr) 2010-04-08
WO2010039175A3 true WO2010039175A3 (fr) 2010-05-27

Family

ID=41327646

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/005197 WO2010039175A2 (fr) 2008-09-30 2009-09-18 Ejecteur de gouttes de liquide à trou auto-aligné

Country Status (4)

Country Link
US (2) US8173030B2 (fr)
EP (3) EP2374621A1 (fr)
JP (1) JP2012504059A (fr)
WO (1) WO2010039175A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101562201B1 (ko) * 2008-10-01 2015-10-22 삼성전자주식회사 잉크젯 프린터 헤드 및 그의 제조방법
WO2013003017A1 (fr) 2011-06-28 2013-01-03 Eastman Kodak Company Dispositif microfluidique ayant une adhérence d'une couche d'époxyde améliorée
US8652765B2 (en) 2011-06-28 2014-02-18 Eastman Kodak Company Making a microfluidic device with improved adhesion
US8820883B2 (en) 2011-06-28 2014-09-02 Eastman Kodak Company Microfluidic device having improved epoxy layer adhesion
US20130082028A1 (en) * 2011-09-30 2013-04-04 Emmanuel K. Dokyi Forming a planar film over microfluidic device openings
US20130083126A1 (en) 2011-09-30 2013-04-04 Emmanuel K. Dokyi Liquid ejection device with planarized nozzle plate
US8608283B1 (en) 2012-06-27 2013-12-17 Eastman Kodak Company Nozzle array configuration for printhead die
JP5943755B2 (ja) * 2012-07-20 2016-07-05 キヤノン株式会社 液体吐出ヘッドの基板の製造方法
US9597873B2 (en) 2012-09-12 2017-03-21 Hewlett-Packard Development Company, L.P. Printhead protective coating
JP6112809B2 (ja) * 2012-09-21 2017-04-12 キヤノン株式会社 液滴吐出ヘッドの製造方法
US9340023B2 (en) 2013-05-31 2016-05-17 Stmicroelectronics, Inc. Methods of making inkjet print heads using a sacrificial substrate layer
JP6399285B2 (ja) * 2014-03-28 2018-10-03 セイコーエプソン株式会社 液体噴射装置及び液体噴射ヘッドユニット
JP6576152B2 (ja) 2015-08-05 2019-09-18 キヤノン株式会社 構造物の製造方法、および液体吐出ヘッドの製造方法
US11037904B2 (en) * 2015-11-24 2021-06-15 Taiwan Semiconductor Manufacturing Company, Ltd. Singulation and bonding methods and structures formed thereby
US9855566B1 (en) 2016-10-17 2018-01-02 Funai Electric Co., Ltd. Fluid ejection head and process for making a fluid ejection head structure
CN110446613B (zh) 2017-04-24 2022-01-11 惠普发展公司，有限责任合伙企业 模制到模制主体中的流体喷射管芯
US11731426B2 (en) 2019-06-18 2023-08-22 Hewlett-Packard Development Company L.P. Fluid feed hole corrosion detection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1044438A (ja) * 1996-08-06 1998-02-17 Canon Inc インクジェット記録ヘッドおよびその製造方法
WO2002005946A1 (fr) * 2000-07-13 2002-01-24 Centre National De La Recherche Scientifique Tete d'injection et de dosage thermique, son procede de fabrication et systeme de fonctionnalisation ou d'adressage la comprenant
US20060044352A1 (en) * 2004-08-31 2006-03-02 Martin Bresciani Substrate and method of forming substrate for fluid ejection device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3946398A (en) 1970-06-29 1976-03-23 Silonics, Inc. Method and apparatus for recording with writing fluids and drop projection means therefor
SE349676B (fr) 1971-01-11 1972-10-02 N Stemme
US4296421A (en) 1978-10-26 1981-10-20 Canon Kabushiki Kaisha Ink jet recording device using thermal propulsion and mechanical pressure changes
US5658471A (en) * 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
US6951383B2 (en) * 2000-06-20 2005-10-04 Hewlett-Packard Development Company, L.P. Fluid ejection device having a substrate to filter fluid and method of manufacture
US6555480B2 (en) * 2001-07-31 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate with fluidic channel and method of manufacturing
JP3937804B2 (ja) * 2001-10-30 2007-06-27 キヤノン株式会社 貫通孔を有する構造体の製造方法
US6679587B2 (en) * 2001-10-31 2004-01-20 Hewlett-Packard Development Company, L.P. Fluid ejection device with a composite substrate
KR100484168B1 (ko) * 2002-10-11 2005-04-19 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
US6672712B1 (en) * 2002-10-31 2004-01-06 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
JP2005119224A (ja) * 2003-10-20 2005-05-12 Canon Inc インクジェット記録ヘッドとその作製方法、シリコンオンインシュレータ基板とその作製方法及びインクジェット記録ヘッド用基体
JP4239902B2 (ja) * 2004-06-07 2009-03-18 セイコーエプソン株式会社 インクジェットヘッド及びインクジェットプリンタ
KR100612326B1 (ko) * 2004-07-16 2006-08-16 삼성전자주식회사 잉크젯 헤드의 제조방법
US7622048B2 (en) * 2004-10-21 2009-11-24 Fujifilm Dimatix, Inc. Sacrificial substrate for etching
US7824560B2 (en) * 2006-03-07 2010-11-02 Canon Kabushiki Kaisha Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
US7600856B2 (en) 2006-12-12 2009-10-13 Eastman Kodak Company Liquid ejector having improved chamber walls
US7857422B2 (en) 2007-01-25 2010-12-28 Eastman Kodak Company Dual feed liquid drop ejector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1044438A (ja) * 1996-08-06 1998-02-17 Canon Inc インクジェット記録ヘッドおよびその製造方法
WO2002005946A1 (fr) * 2000-07-13 2002-01-24 Centre National De La Recherche Scientifique Tete d'injection et de dosage thermique, son procede de fabrication et systeme de fonctionnalisation ou d'adressage la comprenant
US20060044352A1 (en) * 2004-08-31 2006-03-02 Martin Bresciani Substrate and method of forming substrate for fluid ejection device

Also Published As

Publication number Publication date
EP2374622A1 (fr) 2011-10-12
US20120188309A1 (en) 2012-07-26
EP2374621A1 (fr) 2011-10-12
US8173030B2 (en) 2012-05-08
JP2012504059A (ja) 2012-02-16
EP2331334A2 (fr) 2011-06-15
WO2010039175A2 (fr) 2010-04-08
US8608288B2 (en) 2013-12-17
US20100078407A1 (en) 2010-04-01

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