WO2010032304A1

WO2010032304A1 - Piping device, and fluid carrying device

Info

Publication number: WO2010032304A1
Application number: PCT/JP2008/066847
Authority: WO
Inventors: 久明山蔭; 雅人花田; 義人山田
Original assignee: 東芝三菱電機産業システム株式会社
Priority date: 2008-09-18
Filing date: 2008-09-18
Publication date: 2010-03-25
Also published as: JP5183744B2; JPWO2010032304A1

Abstract

Provided is a piping device, which can heat a fluid carrying pipe (40) efficiently thereby to improve the homogeneity of the temperature of the fluid to flow in the pipe (40). The piping device includes the pipe (40) and a heating portion disposed at the end portion of the pipe (40) for heating the pipe (40). Inside of the annular wall of the pipe (40), there are disposed a plurality of tubes (42) along the extending direction of the pipe (40), a connecting pipe (43) for connecting the one-side ends of the tubes (42) to each other, and a connecting pipe (44) for connecting the other ends of the tubes (42) to each other. The tubes (42), the connecting pipe (43) and the connecting pipe (44) constitute a looped thin heat pipe (30).

Description

Piping device and fluid transfer device

The present invention relates to a piping device and a fluid conveyance device, and more particularly, to a piping device and a fluid conveyance device that apply heat to a fluid that is an object to be conveyed.

Conventionally, when a pipe for transporting fluid requires high-precision temperature control of the fluid transported inside the pipe, the temperature of the fluid may be controlled by heating the pipe. For example, in a film forming apparatus, a pipe that connects a vaporizer that vaporizes a liquid raw material and a reaction chamber that supplies the vaporized gaseous raw material to the substrate and forms a film on the surface of the substrate. In order to prevent re-liquefaction and thermal decomposition of the reaction gas and stably supply the raw material to the reaction chamber, for example, a tape heater or the like is wound around the pipe and the pipe is heated.

FIG. 23 is a block diagram showing a configuration of a conventional film forming apparatus. 24 is a schematic diagram showing a configuration of a piping device used in the film forming apparatus shown in FIG. As shown in FIG. 23, in the conventional film forming apparatus, the vaporizer 240 and the reaction chamber 250 are connected by a pipe 241. A tape heater 243 for heating the pipe 241 is wound around the outer peripheral surface of the pipe 241 and temperature control is performed on the pipe 241 in order to prevent liquefaction of the gas vaporized by the vaporizer 240 and prevention of thermal decomposition.

In order to control the entire length of the pipe 241 to a uniform temperature, the tape heater 243 needs to be wound evenly around the outer peripheral surface of the pipe 241. However, the temperature of the pipe 241 may vary due to the winding method of the tape heater 243 and the temperature unevenness of the tape heater 243 itself. Further, when a part of the tape heater 243 is disconnected, it is necessary to remove the disconnected tape heater 243 and to rewind the tape heater 243 again. However, it takes time to rewind the tape heater 243, and it is difficult to reproduce the same winding method of the tape heater 243 as before rewinding. Therefore, there is a problem that the temperature distribution of the pipe 241 at the time of heating changes from the state before the disconnection of the tape heater 243 and affects the film forming performance.

For this reason, conventionally, a technology has been proposed in which the outer wall of a pipe is covered with a heat pipe, the temperature of the pipe is maintained at a predetermined temperature with good uniformity, and the temperature of the entire pipe is controlled with high accuracy without winding a heater around the entire length of the pipe. (For example, see JP-A-6-168877 (Patent Document 1)).

By the way, the conventional heat pipe evacuates the inside of the tube and encloses an appropriate amount of working fluid, heats one end of the tube to evaporate the working fluid, and cools and condenses the vapor at the other end. This is a device that transports a large amount of heat from one end side to the other end side of the tube by making it into a liquid. In order to return the liquid working fluid condensed on the low temperature side to the high temperature side, narrow grooves, meshes or porous structures (collectively called wicks) are arranged on the inner wall of the tube, and capillary action due to surface tension To return the working fluid to the high temperature side.

In the conventional heat pipe, when the hot part of the pipe is in a top heat state where the position of the hot part is higher than that of the cold part, the condensed working fluid stays on the lower side (cold side) and resists gravity with the wick capillary force alone Thus, the working fluid may not be sufficiently recirculated to the high temperature part. In such a top heat state, a conventional heat pipe cannot perform sufficient heat transport. In view of this, a loop-type thin tube heat pipe has been proposed as a technique for suppressing fluctuations in heat transport capacity due to the influence of gravity (see, for example, Japanese Patent Laid-Open No. Hei 4-190090 (Patent Document 2)).
JP-A-6-168877 Japanese Patent Laid-Open No. 4-190090

By sticking the loop type thin tube heat pipe to the outer surface of the pipe for conveying the fluid, heat can be transmitted from the loop type thin pipe heat pipe to the pipe, and the fluid flowing in the pipe can be heated. However, the outer surface of the pipe and the surface of the thin tube constituting the loop-type thin tube heat pipe have an uneven structure, and it is difficult to bring the contact surfaces into close contact with each other. When a fluid with low thermal conductivity such as air exists in the gap between the contact surfaces, a large thermal resistance called contact thermal resistance is generated. In other words, when the loop type thin tube heat pipe is brought into contact with the outer surface of the pipe, the heat transfer from the loop type thin pipe heat pipe to the pipe is not necessarily sufficient because the outer surface of the pipe and the surface of the thin pipe are not completely adhered. No, there is room for further improvement.

In addition, when a pipe for conveying a fluid is heated using a heat pipe, it is necessary to provide a separate heat source for heating the working fluid enclosed in the heat pipe. There was a problem that the cost and operating cost increased.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a piping device that can efficiently heat the piping for conveying the fluid and improve the uniformity of the temperature of the fluid flowing inside the piping. Is to provide. Another object of the present invention is to provide a low-cost fluid conveyance device including a heat pipe that heats a pipe for conveying a fluid.

The piping device according to the present invention is a piping device for transporting a fluid, and includes a tubular member and a heating unit that heats the tubular member. Inside the annular wall portion of the tubular member, there are a plurality of thin tube portions along the extending direction of the tubular member, a first connecting tube portion that connects one ends of the thin tube portions, and a second tube that connects the other ends of the thin tube portions. Two connecting pipe portions are provided. The thin tube portion, the first connecting tube portion, and the second connecting tube portion constitute a loop-type thin tube heat pipe.

Preferably, in the above piping device, the tubular member includes an inner tube and an outer tube whose inner peripheral surface is in close contact with the outer peripheral surface of the inner tube. The narrow tube portion is formed by forming irregularities on at least one of the outer peripheral surface of the inner tube and the inner peripheral surface of the outer tube.

Preferably, in the above piping device, the piping device further includes an outer tube that encloses the tubular member, and has a vacuum space between the outer peripheral surface of the tubular member and the inner peripheral surface of the outer tube.

The fluid conveyance device according to the present invention includes a first heating unit, a second heating unit, a tubular member that connects the first heating unit and the second heating unit, and a heat pipe that is in thermal contact with the tubular member. Prepare. The tubular member conveys fluid from the first heating unit to the second heating unit. The heat pipe is heated by at least one of the first heating unit and the second heating unit.

Here, “thermal contact” means that heat is directly transferred between the tubular member and the heat pipe, and that the heat transfer efficiency is sufficiently high. The present invention is not limited to the case where the pipe is in contact with and directly in mechanical contact. For example, when the tubular member and the heat pipe are integrated with each other, such as a structure in which the heat pipe is built in the tubular member, the tubular member and the heat pipe are indirectly interposed by interposing a substance having excellent heat conductivity. The case where is in contact with each other is also included in the state of being in thermal contact.

Preferably, the fluid conveyance device further includes an outer tube that encloses the tubular member and the heat pipe, and has a vacuum space between the outer peripheral surface of the tubular member and the inner peripheral surface of the outer tube.

In the fluid conveying device, preferably, the heat pipe is a loop type thin pipe heat pipe.

Preferably, in the fluid conveyance device, a plurality of thin tube portions along the extending direction of the tubular member, a first connecting tube portion that connects one ends of the thin tube portions, and a thin tube portion are disposed inside the annular wall portion of the tubular member. And a second connecting pipe portion that connects the other ends of the two. The thin tube portion, the first connecting tube portion, and the second connecting tube portion constitute a loop-type thin tube heat pipe.

According to the piping device of the present invention, it is possible to eliminate the contact thermal resistance caused by sticking the thin tube of the loop type thin tube heat pipe to the tubular member, so that the tubular member is efficiently heated and the fluid conveyed inside the tubular member The temperature uniformity can be improved. According to the fluid conveyance device of the present invention, since it is not necessary to newly provide a heat source for heating the heat pipe, it is possible to achieve cost reduction and miniaturization of the fluid conveyance device including the heat pipe.

It is a block diagram which shows schematic structure of the substance supply system for supplying a gaseous substance to the reaction chamber provided with the fluid conveyance apparatus which concerns on this invention. It is a schematic diagram which shows an example of the fluid conveying apparatus of this invention. It is a perspective view which shows the structure of a heat pipe. FIG. 4 is a view showing a cross section of the heat pipe taken along line IV-IV shown in FIG. 3. It is a schematic diagram which shows the operating principle of a heat pipe. 4 is a graph showing a temperature change of a pipe that conveys a reaction gas of the fluid conveyance device according to the first embodiment. 6 is a schematic diagram illustrating a configuration of a fluid transport path according to Embodiment 2. FIG. It is the schematic diagram which looked at the fluid conveyance path | route shown in FIG. 7 from the end surface side. FIG. 6 is a schematic diagram illustrating a configuration of a fluid transport path according to a third embodiment. It is a schematic diagram explaining the structure and operating principle of a loop type thin tube heat pipe. 10 is a schematic diagram illustrating an example of an arrangement of a fluid transportation path according to Embodiment 3. FIG. It is a schematic diagram which shows the state which expand | deployed piping of Embodiment 4 in flat form. It is the figure which looked at piping expanded in flat form from the arrow XIII direction shown in FIG. FIG. 10 is a perspective view of a pipe according to a fourth embodiment. FIG. 10 is a perspective view of a pipe according to a fifth embodiment. FIG. 16 is a cross-sectional view of the pipe along the line XVI-XVI shown in FIG. 15. FIG. 10 is a perspective view of a pipe according to a sixth embodiment. FIG. 18 is a cross-sectional view of a pipe taken along line XVIII-XVIII shown in FIG. It is a block diagram which shows schematic structure of the modification 1 of a substance supply system. It is a block diagram which shows schematic structure of the modification 2 of a substance supply system. It is a block diagram which shows schematic structure of the modification 3 of a substance supply system. It is a block diagram which shows schematic structure of the modification 4 of a substance supply system. It is a block diagram which shows the structure of the conventional film-forming apparatus. It is a schematic diagram which shows the structure of the piping apparatus used for the film-forming apparatus shown in FIG.

Explanation of symbols

1 material supply system, 2 fluid transfer device, 10, 40, 50 piping, 10a, 40a outer peripheral surface, 10b one end, 10c other end, 11, 12 heat insulation wall, 13, 14 space, 20 heat pipe, 20a, 20b end , 21 outer pipe, 22 wick, 23 working fluid, 24 space, 27 high temperature part, 28 low temperature part, 30 loop type capillary heat pipe, 31 heating part, 32 cooling part, 33 liquid phase, 34 gas phase, 35 vapor bubble, 41 wall portion, 42 narrow tube portion, 43, 44 connecting tube, 51 outer tube, 51a inner peripheral surface, 52 inner tube, 52a outer peripheral surface, 60 outer covering tube, 60a inner peripheral surface, 61 vacuum space, 110 liquid raw

material supply device

111, 114, 121, 124, 141, 144, 161a, 164a, fluid transport path, 112, 122, 142, 16 a, 162n valve, 113,123,143,146,163A, 163n heating unit, 120 a carrier gas supply unit, 130 control unit, 140 carburetor, 145 junction, 150 and 150a, 150n reaction chamber.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

In the embodiments described below, each component is not necessarily essential for the present invention unless otherwise specified. In the following embodiments, when referring to the number, amount, etc., unless otherwise specified, the above number is an example, and the scope of the present invention is not necessarily limited to the number, amount, etc.

(Embodiment 1)
FIG. 1 is a block diagram showing a schematic configuration of a substance supply system for supplying a gaseous substance to a reaction chamber provided with a fluid conveyance device according to the present invention. As shown in FIG. 1, the substance supply system 1 heats the liquid raw material supplied from the liquid raw material supply apparatus 110 by receiving the liquid raw material from the outside and supplying the liquid raw material to the vaporizer 140. A vaporizer 140 that is vaporized and vaporized, and a reaction chamber 150 in which a gaseous raw material is supplied and a predetermined reaction such as film formation on the surface of the substrate is performed. The substance supply system 1 also includes a carrier gas supply device 120 that supplies the vaporizer 140 with a carrier gas that conveys the raw material vaporized in the vaporizer 140 toward the reaction chamber 150.

The liquid material supply device 110 and the vaporizer 140 are connected by a fluid transport path 111, a valve 112, and a fluid transport path 114. The

fluid transport paths

111 and 114 between the liquid raw material supply apparatus 110 and the vaporizer 140 are joined via a valve 112. The carrier gas supply device 120 and the vaporizer 140 are connected by a fluid transport path 121, a valve 122, and a fluid transport path 124. The

fluid transport paths

121 and 124 between the carrier gas supply device 120 and the vaporizer 140 are joined via a valve 122. The vaporizer 140 and the reaction chamber 150 are connected by a fluid transport path 141, a valve 142, and a fluid transport path 144. The

fluid transport paths

141 and 144 between the vaporizer 140 and the reaction chamber 150 are joined via a valve 142.

The liquid raw material supplied from the liquid raw material supply device 110 is heated in the vaporizer 140 to rise in temperature, and changes its state to gas when it reaches the boiling point. The gaseous raw material vaporized by the vaporizer 140 (referred to as a reaction gas) passes through the fluid transport path 141, the valve 142, and the fluid transport path 144 by the carrier gas supplied from the carrier gas supply device 120. A reaction gas is supplied to the reaction chamber 150.

The substance supply system 1 also includes a control unit 130. The supply amount of the raw material from the liquid raw material supply device 110 to the vaporizer 140 is controlled by the control unit 130 in the opening degree of the valve 112 between the

fluid transport paths

111 and 114 between the liquid raw material supply device 110 and the vaporizer 140. Is controlled. The flow rate of the carrier gas is controlled by controlling the opening degree of the valve 122 between the

fluid transport paths

121 and 124 between the carrier gas supply device 120 and the vaporizer 140 by the control unit 130. The supply amount of the reaction gas is controlled by controlling the opening degree of the valve 142 between the

fluid transport paths

141 and 144 between the vaporizer 140 and the reaction chamber 150 by the control unit 130.

The temperature inside the vaporizer 140 is controlled by the control unit 130 controlling the amount of heat supplied by a heating unit such as a heater (not shown) disposed inside the vaporizer 140. The temperature inside the reaction chamber 150 is also controlled by controlling the amount of heat supplied by a heating unit (not shown) disposed inside the reaction chamber 150 by the control unit 130. A dotted line arrow shown in FIG. 1 indicates a path of a control signal from the control unit 130.

FIG. 2 is a schematic diagram showing an example of the fluid conveyance device of the present invention. FIG. 2 illustrates a fluid conveyance device 2 that includes a fluid conveyance path 141 that connects the vaporizer 140 and the valve 142 as an example of the fluid conveyance device. The fluid conveyance device 2 includes a vaporizer 140 as a first heating unit, a heating unit 143 as a second heating unit, a pipe 10 as a tubular member, and a heat pipe 20 that covers the outer peripheral surface 10a of the pipe 10. Prepare. The pipe 10 conveys the gaseous raw material supplied from the liquid raw material supply device 110 and vaporized by the vaporizer 140 in the direction from the vaporizer 140 to the valve 142.

One end 10 b which is one end of the pipe 10 is connected to the vaporizer 140. The other end 10 c, which is the other end of the pipe 10, is connected to the valve 142. A heating unit 143 is disposed around the valve 142. The heating unit 143 is provided so as to include the valve 142 and heats a portion including the valve 142. The control unit 130 controls the temperature of the reaction gas passing through the valve 142 by controlling the amount of heat supplied from the heating unit 143 to the valve 142. The pipe 10 connects the vaporizer 140 and the heating unit 143.

A heat insulating wall 11 is provided so as to surround one end 10 b of the pipe 10 joined to the vaporizer 140. The pipe 10 in the vicinity of the one end 10b and the end 20a of the heat pipe 20 in the vicinity of the one end 10b are arranged in a space 13 surrounded by the outer wall of the vaporizer 140 and the heat insulating wall 11. A heat insulating wall 12 is provided so as to surround the pipe 10 in the vicinity of the other end 10 c joined to the valve 142. The pipe 10 in the vicinity of the other end 10 c and the end 20 b of the heat pipe 20 adjacent to the other end 10 c are disposed in a space 14 surrounded by the outer wall of the heating unit 143 and the heat insulating wall 12.

The heat flow HF is illustrated by the arrows in FIG. The heat flow HF is transmitted from the vaporizer 140 and the heating unit 143 to the heat pipe 20 and indicates a heat flow released to the outside. Heat is transmitted from the vaporizer 140 to the space 13 via the outer wall of the vaporizer 140, the space 13 is heated, and heat is applied from the space 13 to the vicinity of the end 20 a of the heat pipe 20. In addition, heat is transmitted from the heating unit 143 to the space 14 via the outer wall of the heating unit 143, the space 14 is heated, and heat is transmitted from the space 14 to the vicinity of the end 20 b of the heat pipe 20. The vicinity of the

end portions

20a and 20b of the heat pipe 20 constitutes a high-temperature portion that has a relatively high atmospheric temperature and heats the heat pipe 20 to evaporate the working fluid.

On the other hand, in the vicinity of an intermediate point between the vaporizer 140 and the heating unit 143, the heat pipe 20 is not heated from the surroundings. In the vicinity of this intermediate point, heat is released from the heat pipe 20 to the outside. In the vicinity of an intermediate point between the vaporizer 140 and the heating unit 143, the ambient temperature is relatively low, and constitutes a low-temperature unit that condenses the working fluid by radiating heat from the heat pipe 20.

The configuration of the heat pipe 20 will be described below. FIG. 3 is a perspective view showing the configuration of the heat pipe. FIG. 4 is a view showing a cross section of the heat pipe taken along line IV-IV shown in FIG. As shown in FIGS. 3 and 4, in the fluid transport path 141, a double pipe structure is formed in which the outer pipe 21 is provided outside the pipe 10 and the pipe 10 is inserted into the hollow space inside the outer pipe 21. ing. The outer tube 21 is made of a metal material such as copper, aluminum, or stainless steel. A porous wick 22 having a capillary force is provided on the inner surface of the outer tube 21. As the wick 22, a wire mesh may be attached to the inner surface of the outer tube 21, and fine grooves may be formed on the inner surface of the outer tube 21.

A space 24 is formed between the outer peripheral surface of the pipe 10 and the inner peripheral surface of the outer tube 21. The interior of the space 24 is evacuated and decompressed. An appropriate amount of hydraulic fluid 23 is injected into this space 24. In this way, the structure of the heat pipe 20 can be provided between the pipe 10 and the outer pipe 21.

FIG. 5 is a schematic diagram showing the operating principle of the heat pipe. A part of the heat pipe structure shown in FIGS. 3 and 4 is arranged in the high temperature part 27 having a relatively high ambient temperature, and the other part is arranged in the low temperature part 28 having a relatively low ambient temperature. The high temperature part 27 is heated by, for example, a heater, and the temperature is higher than that of the low temperature part 28. As shown in the heat flow HF, the outer tube 21 is heated by heat transfer from the surroundings in the high temperature portion 27. Therefore, the working fluid 23 sealed between the pipe 10 and the outer tube 21 is also heated, absorbing heat as latent heat, and the working fluid 23 evaporates into a gaseous state.

As the vapor of the evaporated working fluid 23 flows from the high temperature portion 27 side to the low temperature portion 28 side as shown in the vapor flow SF, heat is carried as vapor in the direction in which the vapor flow SF flows. At this time, the vapor of the working fluid 23 is condensed by releasing latent heat on the outer surface of the pipe 10 and the inner surface of the outer pipe 21, thereby heating the pipe 10 uniformly over its entire length. The hydraulic fluid 23 condensed on the low temperature part 28 side is returned to the high temperature part 27 side by the capillary force of the wick 22 as shown in the liquid flow LF. Further, in the low temperature part 28, heat is radiated to the outside from the outer wall of the outer tube 21 transferred from the hydraulic fluid 23, as indicated by the heat flow HF.

In this way, the temperature of the reaction gas flowing in the pipe 10 is maintained at a constant temperature. That is, heat transport is performed by vaporization and liquefaction of the working fluid 23 between the pipe 10 and the outer pipe 21, and the temperature uniformity of the reaction gas can be improved over the entire length of the pipe 10.

FIG. 6 is a graph showing a change in temperature of the pipe that conveys the reaction gas of the fluid conveyance device of the first embodiment. In FIG. 6, the vertical axis represents the temperature of the pipe. In addition, the horizontal axis indicates the reaction gas path from the vaporizer 140 shown in FIG. 2 to the heating unit 143. 6 corresponds to a region inside the vaporizer 140 and the space 13 surrounded by the heat insulating wall 11 in the fluid conveyance device 2 shown in FIG. Region B corresponds to the region from the exit of space 13 to the entrance of space 14 shown in FIG. The area C corresponds to the area inside the space 14 surrounded by the heat insulating wall 12 shown in FIG. 2 and the area inside the heating unit 143.

As shown in FIG. 6, the temperature of the piping is changed in the region A due to the heat transfer effect from the vaporizer 140 and in the region C due to the heat transfer effect from the heating unit 143. In the region B, since the pipe 10 is uniformly heated over the entire length by the heat pipe 20 heated using the vaporizer 140 and the heating unit 143 as a heat source, the reaction gas flowing inside the pipe 10 from the region A toward the region C Therefore, it is possible to prevent re-liquefaction due to condensation of the reaction gas and to control the temperature of the reaction gas with high accuracy.

As described above, in the first embodiment, the fluid transport path 141 has a double-pipe structure, and the vacuum space 24 and the wick 22 are provided between the outer peripheral surface of the pipe 10 and the inner peripheral surface of the outer tube 21 to heat. By making the pipe, the heat pipe 20 is brought into contact with the outer surface of the pipe 10. By heating a part of the heat pipe 20, it is possible to achieve soaking over the entire length of the pipe 10, so that a heater such as a tape heater is not disposed over the entire length of the fluid transport path 141. The temperature of the reaction gas flowing through the pipe 10 can be easily controlled with high accuracy.

In Embodiment 1, the heat pipe 20 is heated by being transferred from the vaporizer 140 and the heating unit 143. Therefore, the fluid conveyance device 2 does not need to include another heat source such as a heater or hot water for heating the heat pipe 20 and evaporating the working liquid 23. That is, the fluid conveyance device 2 does not include a heating device only for the heat pipe 20. Therefore, the manufacturing cost and operating cost of the fluid transfer device 2 can be reduced, and the size of the fluid transfer device 2 can be reduced.

In the fluid conveyance device 2 illustrated in FIG. 2, the example in which the heat pipe 20 is heated from both the vaporizer 140 and the heating unit 143 and is radiated to the outside between the vaporizer 140 and the heating unit 143 has been described. The heat pipe 20 may be heated by either the vaporizer 140 or the heating unit 143.

(Embodiment 2)
FIG. 7 is a schematic diagram illustrating a configuration of a fluid transport path according to the second embodiment. FIG. 8 is a schematic view of the fluid transport path shown in FIG. 7 viewed from the end face side. In the first embodiment, the outer periphery of the pipe 10 that conveys the gaseous reaction gas by forming the fluid transport path 141 into a double pipe structure and providing the wick 22 on the inner peripheral surface of the outer pipe 21 to form a heat pipe. The example which provides the heat pipe 20 in the part was demonstrated. In contrast, in the second embodiment, as shown in FIGS. 7 and 8, a plurality of heat pipes 20 are affixed to the outer peripheral surface 10 a of the pipe 10, and the pipe 10 is connected by heat transport of these heat pipes 20. An example of soaking over the entire length is shown.

The configuration and operating principle of the heat pipe 20 are the same as those of the heat pipe 20 of the first embodiment described with reference to FIGS. 3 to 5, and the working liquid 23 is contained in the heat pipe 20 as in the first embodiment. By performing heat transport by vaporization and liquefaction, it is possible to make the temperature uniform over the entire length of the pipe 10. In the second embodiment, a plurality of heat pipes 20 are attached to the outer peripheral surface of the pipe 10 to transfer heat from the heat pipe 20 to the pipe 10, without changing the structure of the existing pipe 10, The temperature of the reaction gas flowing inside the pipe 10 can be easily uniformed with high accuracy.

7 and 8 illustrate the fluid transport path 141 in which the heat pipe 20 is attached to the outer peripheral surface 10a of the pipe 10 and the heat pipe 20 directly contacts the pipe 10. In addition to this, the fluid transport path 141 has a configuration in which a groove capable of storing the heat pipe 20 is processed in the extending direction of the pipe 10 on the outer peripheral surface 10a of the pipe 10, and the heat pipe 20 is stored in the groove. Also good.

Further, the heat pipe 20 is attached to the outer peripheral surface 10a of the pipe 10 with a substance having high thermal conductivity interposed therebetween, and the heat pipe 20 and the pipe 10 are not in direct mechanical contact, but the heat pipe 20 to the pipe 10 It is good also as a structure by which the heat transfer performance to is ensured. That is, if the heat pipe 20 is the fluid transport path 141 in which the heat pipe 20 is in thermal contact with the outer peripheral surface 10a of the pipe 10, the temperature of the reaction gas flowing inside the pipe 10 can be made uniform with high accuracy.

(Embodiment 3)
FIG. 9 is a schematic diagram illustrating a configuration of a fluid transport path according to the third embodiment. In the first and second embodiments, the heat pipe 20 for heating the pipe 10 is a conventional wick-type heat pipe. On the other hand, in the third embodiment, a meandering loop type thin tube is attached to the outer peripheral surface 10a of the pipe 10 as shown in FIG. 9, and a two-phase condensable working fluid is sealed inside the loop type thin tube. An example in which the heat pipe that is in thermal contact with the pipe 10 is a loop type thin pipe heat pipe 30 will be described.

FIG. 10 is a schematic diagram for explaining the configuration and operating principle of a loop type thin tube heat pipe. FIG. 10 shows a state in which the pipe 10 shown in FIG. 9 is cut open in the extending direction and the tubular pipe 10 is developed in a flat plate shape. FIG. 10 shows a state in which the loop thin tube heat pipe 30 arranged so as to be wound around the pipe 10 is two-dimensionally developed along the shape of the flat plate.

As shown in FIG. 10, there are a plurality of thin tubes that are working fluid flow paths between a heating unit 31 that inputs heat into the loop thin tube heat pipe 30 and a cooling unit 32 that dissipates heat from the loop thin tube heat pipe 30. The book is arranged. Even numbers of the thin tubes are provided along the extending direction of the pipe 10 shown in FIG. One ends that are one end portions of the plurality of thin tubes and the other ends that are end portions on the other side of the thin tubes are connected by a connecting tube. The loop type thin tube heat pipe 30 is formed in a meandering structure in which a thin tube is caused to repeat a number of turns between a heating unit 31 and a cooling unit 32 and the thin tube is reciprocated. Due to this meandering structure, the loop type thin tube heat pipe 30 has a large number of heat receiving portions that receive heat from the heating portion 31 and a large number of heat radiating portions that release heat to the cooling portion 32.

A gas-liquid two-phase working fluid is sealed inside the loop type thin tube heat pipe 30. The working fluid is sealed inside the narrow tube after the inside of the narrow tube having a meandering structure is decompressed and evacuated. Therefore, the inside of the narrow tube is filled with liquid and gaseous working fluid while maintaining an equilibrium state. FIG. 10 shows a liquid phase 33 filled with a liquid working fluid, a gas phase 34 and a vapor bubble 35 filled with a gaseous working fluid.

When the amount of heat transferred to the loop type thin pipe heat pipe 30 is small, the liquid phase 33 is biased toward the cooling unit 32 and becomes a stationary U-shaped liquid column. As the amount of heat input from the heating unit 31 to the loop-type capillary tube heat pipe 30 increases, the liquid phase 33 absorbs heat and causes nucleate boiling in the liquid phase 33. Due to this nucleate boiling, a part of the liquid phase 33 changes from a liquid to a gas, and a vapor bubble 35 is generated in the liquid phase 33. The generated vapor bubbles 35 move in the narrow tube from the heating unit 31 side to the cooling unit 32 side. When the vapor bubbles 35 reach the cooling unit 32, the gas contained in the vapor bubbles 35 is cooled and condensed, and the phase changes from gas to liquid. Utilizing the movement of the vapor bubbles 35, the latent heat is transferred from the heating unit 31 to the cooling unit 32.

Further, due to the development of the vapor bubble 35 in the heating unit 31 and the contraction of the vapor bubble 35 in the cooling unit 32, the liquid phase 33 in the narrow tube vibrates self-excited, and as shown by the double arrows in FIG. The interface between 33 and the gas phase 34 moves along the extending direction of the thin tube. Using the vibration of the liquid phase 33, the sensible heat is transferred from the heating unit 31 to the cooling unit 32. As described above, in the loop type thin tube heat pipe 30, the temperature difference between the heating unit 31 and the cooling unit 32 is used as a driving force to cause the movement of the vapor bubbles 35 and the vibration of the liquid phase 33. By sensible heat transport by the liquid phase 33, heat transport from the heating unit 31 to the cooling unit 32 is performed.

The loop-type thin tube heat pipe 30 that operates as described above is also referred to as a self-excited vibration heat pipe, and is capable of transporting heat from the heating unit 31 to the cooling unit 32 regardless of the inclined posture. Moreover, in order to mix and transport latent heat and sensible heat, the loop type thin tube heat pipe 30 has a high heat transport capability. In addition, since the loop type thin tube heat pipe 30 uses a thin tube having no internal structure such as a wick, the thin tube can be bent freely, and the heat transport performance is not lowered by the bend. Can be realized at a cost.

Further, in the loop type thin tube heat pipe 30, the amount of heat transport can be increased or decreased by increasing or decreasing the meandering number of the narrow tubes, and a desired heat transport amount can be obtained over a wide range. That is, the heat transport efficiency from the heating unit 31 to the cooling unit 32 can be improved as the number of thin tubes is increased. Since it is necessary to arrange the meandering loop type narrow tubes in a limited space, it is preferable to have an even number of narrow tubes because the meandering structure can be formed efficiently. Moreover, it is good also as a structure which affixes a some loop type thin tube on the outer peripheral surface of the piping 10 according to desired heat transport amount.

Further, the narrow tube constituting the loop type thin tube heat pipe 30 has an inner diameter of about 1 to 2 mm, and the outer diameter of the thin tube including the plate thickness is about 2 mm to 3 mm. Therefore, compared with the case where the conventional heat pipe 20 shown in FIG. 3 and FIG. 7 is brought into thermal contact with the outer peripheral surface of the pipe 10, the outer diameter of the piping device including the pipe 10 and the loop type thin pipe heat pipe 30 is reduced. Can be significantly smaller. Therefore, the reaction gas flowing in the pipe 10 can be heated by a smaller circuit, and it is possible to achieve downsizing of the entire apparatus.

FIG. 11 is a schematic diagram illustrating an example of the arrangement of the fluid transport path according to the third embodiment. The fluid transport path shown in FIG. 11 is arranged in a top heat state in which the high temperature part 27 is arranged on the upper side and the low temperature part 28 is arranged on the lower side. In order to heat the reaction gas through the pipe 10 and heat the reaction gas through the pipe 10 as shown in the gas flow GF, a meandering tubule constituting the loop type thin pipe heat pipe 30 is attached to the outer peripheral surface of the pipe 10. It is attached. Thus, in Embodiment 3, since the loop type thin tube heat pipe 30 is used as a heat pipe that is in thermal contact with the pipe 10, heat transport is possible even in a top heat state where the height difference of the pipe 10 is large. It becomes. Therefore, it is possible to obtain the fluid conveyance device 2 that can perform heat transport regardless of the posture of the pipe 10, and to greatly improve the degree of design freedom related to the arrangement plan of the pipe 10.

(Embodiment 4)
FIG. 12 is a schematic diagram illustrating a state in which the pipe according to the fourth embodiment is expanded in a flat plate shape. FIG. 13 is a view of the pipe developed in a flat plate shape from the direction of the arrow XIII shown in FIG. FIG. 12 shows a view of the pipe developed in a flat plate shape from the direction of the arrow XII shown in FIG. FIG. 14 is a perspective view of the piping according to the fourth embodiment.

In the third embodiment, the example in which the narrow pipe meandering is attached to the outer peripheral surface of the pipe 10 and the loop type thin pipe heat pipe 30 is brought into thermal contact with the pipe 10 has been described. On the other hand, in the fourth embodiment, as shown in FIGS. 12 and 13, a loop type thin tube heat pipe 30 is incorporated in a flat plate on which the piping 40 is developed. After manufacturing a flat plate incorporating a meandering loop type thin tube, the flat plate is bent to form a tubular pipe 40, whereby the pipe 40 incorporating the loop type thin tube heat pipe 30 can be obtained. This piping 40 can be applied to the fluid conveyance device 2 in place of the piping 10 and the heat pipe 20 shown in FIG.

That is, the pipe 40 as a tubular member shown in FIG. 14 has a wall portion 41 having an annular cross-sectional shape intersecting with the extending direction of the pipe 40. Inside the wall portion 41, there are provided a plurality of thin tube portions 42 along the extending direction of the pipe 40 and connecting

tubes

43, 44 that connect the ends of the thin tube portions 42. The connecting pipe 43 connects one end portions of the thin tube portion 42 to each other. The connecting tube 44 connects the other ends of the thin tube portion 42. The thin tube portion 42 and the connecting

tubes

43 and 44 constitute a loop-shaped thin tube heat pipe 30 having a meandering structure that repeats many turns. Based on the principle of operation described with reference to FIG. 10, the vicinity of one of the connecting

pipes

43 and 44 is the heating unit 31, and the other is the cooling unit 32. Heat transport to the cooling unit 32 can be performed.

In this way, the loop type thin tube heat pipe 30 is formed inside the pipe 40, and heat is applied to the pipe 40 from a heat source, and the pipe 40 is applied as a heating pipe that heats the fluid conveyed through the inside. The reaction gas flowing inside the pipe 40 can be heated more efficiently. That is, when the loop-type thin tube heat pipe 30 shown in FIG. 9 is attached to the outer periphery of the pipe 10, the outer surface of the pipe and the surface of the thin tube are not completely adhered, and the outer surface of the pipe and the surface of the thin tube There is a gap between them. As a result, a large thermal resistance called contact thermal resistance is generated, and the heat transfer efficiency from the loop type thin tube heat pipe 30 to the pipe 10 is lowered.

On the other hand, in the pipe 40 shown in FIG. 14, the loop thin tube heat pipe 30 is formed in the wall surface, so that no contact thermal resistance is generated, and the pipe 40 is efficiently heated by the loop thin tube heat pipe 30. can do. Therefore, the uniformity of the temperature of the reaction gas flowing through the inside of the pipe 40 can be further improved by applying the pipe 40 to the piping device that transports the reaction gas. In addition, as described with reference to FIG. 11, when the loop type thin tube heat pipe 30 is used, heat transport is possible even in a top heat state where the height difference of the pipe 40 is large. Therefore, it is possible to obtain the fluid conveyance device 2 that can transport heat regardless of the posture of the pipe 40.

(Embodiment 5)
FIG. 15 is a perspective view of a pipe according to the fifth embodiment. 16 is a cross-sectional view of the piping along the line XVI-XVI shown in FIG. In the fourth embodiment, the pipe 40 that bends a flat plate in which the loop type thin pipe heat pipe 30 is formed to be processed into a tubular shape has been described. On the other hand, the pipe 50 of the fifth embodiment includes an outer pipe 51 and an inner pipe 52 as shown in FIGS. 15 and 16. The inner peripheral surface 51 a of the outer tube 51 is in close contact with the outer peripheral surface 52 a of the inner tube 52.

The outer peripheral surface 52a of the inner tube 52 is grooved. This groove shape includes a plurality of narrow grooves along the extending direction of the inner tube 52. On the outer peripheral surface 52 a of the inner tube 52, a narrow groove that becomes the thin tube portion 42 of the circuit of the loop thin tube heat pipe 30 is processed. After the outer tube 51 is placed outside the inner tube 52 and integrally joined by welding or the like, the groove formed in the outer peripheral surface 52a is evacuated and sealed with a working fluid, whereby the loop type thin tube heat pipe 30 is formed. The piping 50 as a tubular member built in the inside can be configured.

15 and 16 show an example in which grooves are formed on the outer peripheral surface 52a that is the outer surface of the inner tube 52. FIG. After processing the groove on the inner peripheral surface 51a which is the inner surface of the outer tube 51, the inner tube 52 and the outer tube 51 are integrally joined to form a circuit of the loop type thin tube heat pipe 30 similar to the above. It may be. Further, after the groove pattern having the same pattern is formed on both the outer peripheral surface 52a of the inner tube 52 and the inner peripheral surface 51a of the outer tube 51, the inner tube 52 and the outer tube 51 are integrally joined, and the same as described above. A circuit of the loop type thin tube heat pipe 30 may be formed.

Further, not only the narrow groove constituting the narrow tube portion 42 of the loop type thin tube heat pipe 30, but also the narrow groove constituting the connecting

pipes

43 and 44 may be formed on the inner peripheral surface 51a or the outer peripheral surface 52a. Further, at least one of the outer peripheral surface 52a of the inner tube 52 and the inner peripheral surface 51a of the outer tube 51 is formed with a concavo-convex shape on the inner peripheral surface 51a or the outer peripheral surface 52a, such as embossing, in addition to groove processing. You may make it form the circuit of the loop type thin tube heat pipe 30 by performing arbitrary uneven | corrugated processing.

In this way, by processing a general piping material, the outer pipe 51 and the inner pipe 52 are formed, and these are integrated and joined, so that the pipe 50 incorporating the loop type thin pipe heat pipe 30 can be easily formed. Obtainable. Therefore, it is not necessary to bend the flat plate as shown in the fourth embodiment or to join the flat plate into a tubular shape after the bending, and the inner surface of the pipe 50 can be easily polished. Therefore, it is possible to obtain the pipe 50 including the loop type thin pipe heat pipe 30 that is easy to manufacture and low in cost.

(Embodiment 6)
FIG. 17 is a perspective view of a pipe according to the sixth embodiment. 18 is a cross-sectional view of the piping along the line XVIII-XVIII shown in FIG. The pipe shown in FIG. 17 further surrounds the pipe 40 described with reference to FIG. The outer tube 60 includes a pipe 40 that houses the loop-type thin tube heat pipe 30. A vacuum space 61 is formed between the outer peripheral surface 40 a of the pipe 40 and the inner peripheral surface 60 a of the outer tube 60.

By having the vacuum space 61 between the outer peripheral surface 40a of the pipe 40 and the inner peripheral surface 60a of the outer tube 60, the pipe 40 is vacuum-insulated, and heat radiation from the outer peripheral surface 40a of the pipe 40 to the outside is suppressed. In addition, a structure that reduces energy loss from the pipe 40 to the surroundings can be obtained. Since the reaction gas flowing inside the pipe 40 is heated by a heat pipe, soaking of the entire pipe 40 is possible without providing a heating unit such as a tape heater on the outer surface of the pipe 40. It is easy to provide the vacuum space 61 on the outer peripheral surface 40a of 40.

By providing such a vacuum space 61 and reducing the amount of heat released from the pipe 40 to reduce heat loss, it is not necessary to wrap a heat insulating material around the pipe 40. Therefore, since it is not necessary to attach or remove the heat insulating material, the maintenance of the piping is facilitated, and there is an effect that the usage environment of the piping can be kept clean. Furthermore, compared to the outer diameter of the heat insulating material when the heat insulating material is wound around the pipe, the same heat insulating effect can be obtained even if the outer diameter of the outer tube 60 is significantly reduced, and the device can be downsized. can do. Alternatively, if the vacuum space 61 is formed using the outer tube 60 having an outer diameter equivalent to the outer diameter of the heat insulating material, a higher heat insulating performance can be obtained, so that a higher heat insulating property can be obtained in a limited space. The heat insulation structure which has can be formed.

As described above, the piping described in the first to fifth embodiments is surrounded by the outer tube 60 to form the vacuum space 61 and is thermally insulated by vacuum, so that the heat insulating material can be eliminated and the apparatus can be downsized. It goes without saying that the effect of can be obtained.

(Embodiment 7)
In the description of the first to sixth embodiments, the fluid transport path 141 provided between the vaporizer 140 and the heating unit 143 shown in FIG. 1 has been described as an example. It can be used for various systems. 19 to 22 are block diagrams showing a schematic configuration of a modified example of the substance supply system.

The substance supply system shown in FIG. 19 includes n (n is an integer of 2 or more) reaction chambers 150a to 150n. A joint 145 for branching the pipe is connected to the fluid transport path 144, and the periphery of the joint 145 is covered with a heating unit 146. The

fluid transport paths

161a and 164a from the joint 145 to the reaction chamber 150a are joined via a valve 162a for controlling the flow rate of the reaction gas. The valve 162a is covered with a heating unit 163a, and the valve 162a is heated by heat transfer from the heating unit 163a. The path from the junction 145 to the other reaction chamber 150n has the same configuration as described above.

In the substance supply system shown in FIG. 19, by applying any one of the fluid conveyance devices described in the first to sixth embodiments to the

fluid transport paths

141, 144, 161a to 161n, 164a to 164n, The temperature of the reaction gas reaching the reaction chambers 150a to 150n can be made uniform.

In the substance supply system shown in FIG. 20, the vaporizer 140 and the reaction chamber 150 are directly connected by the fluid transport path 141 and do not have the valve 142 for controlling the flow rate of the reaction gas. Even in this case, the fluid transfer device according to any one of the first to sixth embodiments is applied to the fluid transport path 141, and the heat of the vaporizer 140 or the reaction chamber 150 is transferred to the heat pipe that heats the fluid transport path 141. Thus, the temperature of the reaction gas from the vaporizer 140 to the reaction chamber 150 can be made uniform.

The substance supply system shown in FIG. 21 includes a heating unit 113 that heats the valve 112, and is capable of preheating the liquid raw material supplied from the liquid raw material supply apparatus 110 to the vaporizer 140 upstream of the vaporizer 140. It is said that. Even in this case, the fluid conveyance device according to any one of the first to sixth embodiments is applied to the

fluid transport paths

111 and 114, and the heat of the heating unit 113 or the vaporizer 140 is applied to the heat pipe that heats the

fluid transport paths

111 and 114. By conducting heat transfer, the temperature of the liquid raw material from the liquid raw material supply apparatus 110 to the vaporizer 140 can be made uniform. That is, the piping device and the fluid conveyance device of the present invention are not limited to a device that conveys gas, and can also be applied to a device that conveys liquid.

The substance supply system shown in FIG. 22 includes a heating unit 123 that heats the valve 122, and is configured to be able to preheat the carrier gas supplied from the carrier gas supply device 120 to the vaporizer 140 upstream of the vaporizer 140. ing. Even in this case, the fluid conveyance device according to any one of the first to sixth embodiments is applied to the

fluid transportation paths

121 and 124, and the heat of the heating unit 123 or the vaporizer 140 is applied to the heat pipe that heats the

fluid transportation paths

121 and 124. By conducting heat transfer, the temperature of the carrier gas from the carrier gas supply device 120 to the vaporizer 140 can be made uniform.

(Embodiment 8)
In the first to seventh embodiments, the heating of the pipe using the heat pipe has been described. However, a cooler that actively takes heat from the heat pipe and cools the working fluid of the heat pipe is thermally connected to the heat pipe. You may provide so that it may contact. If the heat pipe is cooled by the cooler after stopping the heating of the heat pipe by the heating unit, the entire heat pipe can be efficiently cooled by cooling a part of the heat pipe. That is, it is not necessary to cool the entire heat pipe by the heat transport operation of the conventional heat pipe described in the first embodiment or the heat transport operation of the loop type thin tube heat pipe described in the third embodiment. The heat pipe can be cooled.

In this way, when it is desired to lower the temperature of the pipe during maintenance, etc., the pipe can be lowered at a uniform temperature at a higher speed, so the time required to lower the temperature of the pipe can be shortened and the maintenance time can be shortened. Can do.

Although the embodiments of the present invention have been described as above, the configurations of the embodiments may be combined as appropriate. In addition, it should be considered that the embodiment disclosed this time is illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

A piping device and a fluid conveyance device of the present invention are, for example, a piping device that conveys a substance that requires high-precision temperature management, such as a reaction gas when a film formation target is formed on a semiconductor wafer, a liquid crystal glass substrate, or the like. It can be applied particularly advantageously to a fluid conveying device.

Claims

A piping device for conveying a fluid,
A tubular member (40);
A heating section (140, 143) for heating the tubular member (40),
Inside the annular wall portion (41) of the tubular member (40), a plurality of thin tube portions (42) along the extending direction of the tubular member (40) and one ends of the thin tube portions (42) are connected. A first connecting pipe part (43) and a second connecting pipe part (44) for connecting the other ends of the narrow pipe part (42) are provided,
The said thin tube part (42), said 1st connection pipe part (43), and said 2nd connection pipe part (44) are piping apparatuses which comprise a loop type thin tube heat pipe (30).
The tubular member (50) includes an inner tube (52) and an outer tube (51) in which an inner peripheral surface (51a) is in close contact with an outer peripheral surface (52a) of the inner tube (52),
The narrow tube portion (42) is formed by unevenly processing at least one of the outer peripheral surface (52a) of the inner tube (52) and the inner peripheral surface (51a) of the outer tube (51). The piping device according to claim 1.
An outer tube (60) containing the tubular member (40);
The vacuum space (61) according to claim 1, comprising a vacuum space (61) between an outer peripheral surface (40a) of the tubular member (40) and an inner peripheral surface (60a) of the outer tube (60). Plumbing equipment.
A first heating section (140);
A second heating unit (143);
A tubular member (10) for connecting the first heating unit (140) and the second heating unit (143) and conveying a fluid from the first heating unit (140) to the second heating unit (143); ,
A heat pipe (20) in thermal contact with the tubular member (10),
The said heat pipe (20) is a fluid conveying apparatus (2) heated by at least any one of said 1st heating part (140) and said 2nd heating part (143).
An outer tube (60) containing the tubular member (10) and the heat pipe (20);
The vacuum space (61) is provided between the outer peripheral surface (10a) of the tubular member (10) and the inner peripheral surface (60a) of the outer tube (60). Fluid transfer device.
The fluid transfer device according to claim 4 or 5, wherein the heat pipe is a loop type thin pipe heat pipe (30).
Inside the annular wall portion (41) of the tubular member (40), a plurality of thin tube portions (42) along the extending direction of the tubular member (40) and one ends of the thin tube portions (42) are connected. A first connecting pipe part (43) and a second connecting pipe part (44) for connecting the other ends of the narrow pipe part (42) are provided,
The said thin tube part (42), said 1st connection pipe part (43), and said 2nd connection pipe part (44) comprise the said loop type thin tube heat pipe (30), Claim 6 characterized by the above-mentioned. Fluid transfer device.