Classifications

• • E—FIXED CONSTRUCTIONS
  • E04—BUILDING
  • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
  • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
  • E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
  • E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
  • E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
  • E04C2/292—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating composed of insulating material and sheet metal
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F24—HEATING; RANGES; VENTILATING
  • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
  • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
  • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F24—HEATING; RANGES; VENTILATING
  • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
  • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
  • F24F5/0089—Systems using radiation from walls or panels
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

• the present invention relates to a building element in accordance with the preamble of claim 1 , and particularly, to a building element comprising a first and a second plate made of metal and placed substantially electrically and thermally isolated apart from one another.
• thermoelectric effect or the so-called Peltier effect constitute a solution of this kind utilizing the difference in temperature.
• the thermoelectric effect and the Peltier effect are commonly known, and consequently they are not explained in this application.
• the thermoelectric effect and the Peltier effect have also been utilized in construction technology in various heating and cooling solutions.
• a complete Peltier module is mounted, for instance, on a building element or attached to a window structure.
• the Peltier module generates thermal and/or refrigeration energy in its electrodes, wherefrom it is transferred to structures of the building element, such as surface plates or window panes.
• the object of the invention is thus to provide a building element, whereby the above problems will be solved.
• a building element in accordance with the characterizing part of claim 1 , which is characterized in that the first and the second plates are interconnected with one or more semiconductor elements in order to make the building element a thermoelectric element.
• the invention is based on the fact that plates made of metal, such as surface plates of a sandwich panel, included in a building element or building panel are utilized for providing a thermoelectric module or a Peltier module.
• metal plates of a building element that are electrically isolated from one another are interconnected by means of semiconductor elements so as to provide a thermoelectric module. It is further possible to connect to this thermoelectric module a current source such that the current generates a difference in temperature between the electrically isolated metal plates.
• the method and the system of the invention have an advantage that significant changes need not be made in the building element for mounting a thermoelectric module or a Peltier module, but the building element may be utilized as such as a part of the thermoelectric module or Peltier module.
• the building element may be utilized as such as a part of the thermoelectric module or Peltier module.
• these building elements may be produced in the same manufacturing process and advantageously in the same production line as other conventional building elements.
• the heat- transfer capacity of the metal plates of the building element is good, the heat transfer surface of the thermoelectric module or the Peltier module will be large, and heat transfer to a room space need not pass through a poorly heat conducting building plate, but heat transfer may take place directly through the metal plates of the building element alone. This further enables heating or cooling of even large spaces. Additionally, in that case the whole wall or another structure made of building elements will be able to serve throughout its surface as a heat transfer surface.
• Figure 2 shows a second embodiment of the building element in accordance with the present invention.
• Figure 3 shows a third embodiment of the building element in accordance with the present invention.
• FIG. 1 shows an embodiment of a building element 1 in accordance with the present invention.
• the building element 1 is an insulated building panel, such as a sandwich panel, which comprises a first surface plate 2 and a second surface plate 4 and an insulation material 16 between them.
• the surface plates 2, 4 are mounted such that they are electrically isolated from one another and advantageously also thermally isolated from one another.
• the surface plates 2, 4 are made of metal and advantageously they are made of sheet metal, such as sheet steel.
• Insulation material 10 is attached by gluing, for instance, to inner surfaces, i.e. those facing one another, of the surface plates 2, 4.
• the present invention may be applied to any building element that comprises two metal plates that are electrically isolated and advantageously also thermally isolated from one another.
• the first and the second surface plates 2, 4 are interconnected with one or more semiconductor elements 6, 8.
• the semiconductor elements may be rods as in Figure 1 or bars, beams or pieces of some other shape or size, which are mounted between the first and the second surface plates 2, 4.
• the semiconductor elements it is possible to use any semiconductor material, such as silica or germanium.
• the semiconductor elements may be pure semiconductors, doped materials containing one or more semiconductors or doped semiconductors.
• doped materials may be, for instance, metals doped with a semiconductor, the metals being other than those in the surface plates 2, 4.
• the semiconductor material is doped with some other material so as to obtain desired properties or material structure.
• the semiconductor elements are provided to be either p-type or n-type semiconductors, depending on the application.
• One building element may include p-type semiconductor elements or n-type semiconductor elements, or alternatively, both p-type and n-type semiconductor elements.
• the semiconductor elements 6, 8 are inside the building element 1 such that they traverse the building element 1 and extend between the first and the second surface plates 2, 4.
• Semiconductor elements 6, 8 of this kind may be mounted in the building element 1 during its fabrication, for instance before or after fitting of the insulation material 10, or alternatively, after the fabrication of the building element 1 , whereby rod-like semiconductor elements 6, 8 may be inserted through the building element 1 such that they connect the first and the second surface plates 2, 4.
• all the semiconductor elements 6, 8 may be either p-type or n-type semiconductors, or alternatively, they comprise at least one n-type semiconductor element and at least one p-type semiconductor element.
• Figure 2 shows a second embodiment for placing semiconductor elements 7, 9 in the building element 1.
• the semiconductor elements 7, 9 are placed on the lateral edges of the building element 1 as shown in Figure 2.
• the semiconductor elements 7, 9 connect the surface plates 2, 4 to one another in one or more lateral edges.
• on at least one lateral edge of the building element 1 there is mounted one or more semiconductor elements 7, 9 such that it connects the first and the second plates 2, 4.
• the semiconductor elements 7, 9 mounted on the lateral edges of the building element 1 may all be either n-type or p-type semiconductors, or alternatively, on one lateral edge there may be one or more p-type semiconductor elements and on one lateral edge there may be one or more n-type semiconductor elements.
• the building element 1 comprises at least on two lateral edges thereof tongue-and-groove forms 12, 14 provided in the first and/or the second plate 2, 4 so as to connect the building element 1 to another similar building element. At least one of the tongue-and-groove forms 12, 14 may be furnished with at least one semiconductor element 7, 9. In that case the semiconductor elements 7, 9 will be concealed in the joint or gap between two adjacent building elements 1.
• these semiconductor elements 7, 9 mounted on the lateral edges may be common to the adjacent building elements 1 , when they connect the first and the second surface plates 2, 4 of both adjacent building elements 1.
• the semiconductor elements 7, 9 are advantageously placed to extend along the lateral edges or tongue- and groove forms 12, 14 of the building element 1 , and advantageously substantially throughout the length of the lateral edge or the tongue-and-groove form 12, 14.
• the semiconductor elements 7, 9 to be mounted on the lateral edges may be, for instance, thin plate-like or strip-like elements that are arranged to fit in the dimensions and shapes of the lateral edges or tongue-and- groove forms 12, 14.
• thermoelectric module By means of the connections between the surface plates 1 of the building element 1 and the semiconductor elements 6, 7, 8, 9 the building element 1 is rendered a thermoelectric module.
• the thermoelectric module is generated an electric current or voltage when there is a difference in temperature between two different metals, or a metal and a semiconductor, because different metals or metals and semiconductors react differently to temperature differences.
• a thermoelectric module of this kind is produced, when the first and the second surface plates 2, 4 are at different temperatures while being connected to one another by means of semiconductor elements 6, 7, 8, 9.
• first and the second surface plates 2, 4 are only connected to one another using either n-type or p-type semiconductors, between the first and the second surface plate 2 there is generated a voltage difference, but if the first and the second surface plates 2, 4 are connected to one another using both n-type and p-type semiconductors there is produced a circuit, in which a current runs through the semiconductors.
• the voltage difference and the current are proportional to the temperature difference between the first and the second surface plates 2, 4.
• the first and the second surface plates 2, 4 serve as electrodes of the thermoelectric module.
• the thermoelectric module it is possible to generate a voltage or an electric current by means of the temperature difference of the electrodes.
• thermoelectric module A module of this kind is commonly known as a Peltier module.
• this Peltier module it is possible to provide a temperature difference between the electrodes, in the present invention between the surface plates 2, 4, by means of the current source. This temperature difference may be further utilized in accordance with the invention for heating or cooling of the building.
• the actual building element is rendered a thermoelectric module or a Peltier module.
• a current source (not shown) is connected to the building element 1 , the positive pole of the current source being connected to the first plate 2 and the negative pole to the second plate 4, and the first and the second plates 2, 4 are interconnected with one or more n-type or p-type semiconductor elements 6, 7, 8, 9 so as to form a Peltier module and to produce a temperature difference between the first and the second plates 2, 4.
• the electrons move in the opposite direction in relation to the electric current, i.e. in this case from the second plate 4 to the first plate 2.
• the second plate 4 is cooled, when a difference in temperature is generated between the first and the second plates 2, 4.
• the same effect is provided by using only p-type semiconductor elements, whereby the gaps in the p-type semiconductor run in the direction of the current. If the coupling of the current source is changed such that the positive pole is connected to the second plate 4 and the negative pole to the first plate 2, the first plate 2 is cooled and the second plate 4 is heated.
• control means or a thermostat for changing the heating/cooling direction of the Peltier module and/or for changing the polarity of the current source and/or for adjusting the temperature difference or temperature between the first and the second plates 2, 4.
• control means or the thermostat may be arranged to change the polarity of the current source and/or to adjust the current from the current source.
• FIG. 3 shows a second embodiment of the present invention.
• the first plate 2 of the building element 1 is divided into a first and a second plate sections 18, 20 that are electrically isolated from one another.
• a current source the positive pole of which is connected to the first plate section 18 and the negative pole to the second plate section 20.
• the first plate section 18 is connected to the second plate 4 with one or more n-type semiconductor elements 8 and the second plate section 20 is connected to the second plate 4 with one or more p-type semiconductor elements 6 so as to form a Peltier module and to create a temperature difference between the plate sections 18, 20 of the first plate and the second plate 2, 4.
• the first plate 2 may be divided into plate sections 18, 20, for instance into two sections, either during manufacture of the building element 1 or thereafter. In that case it is further possible to place, for instance sealing material, such as sealing tape, between the plate sections 18, 20.
• the Peltier module was provided from one individual building element 1.
• the building element 1 constituted a separate Peltier module.
• the first plate 2 of the building element 1 is arranged for being connected in an electrically isolated manner to the first plate of an adjacent similar building element.
• the second plate 4 of the building element 1 is further arranged for being connected in an electrically conductive manner to the second plate of the adjacent similar building element.
• the first and the second plates 2, 4 of the building element 1 are interconnected with one or more n-type semiconductor elements and the first and the second plates of the adjacent building element are interconnected with one or more p-type semiconductor elements.
• the positive pole of the current source is connected to the first plate 2 of the building element 1 and the negative pole of the current source is connected to the first plate of the adjacent building element so as to form a Peltier module and to create a temperature difference between the first and the second plates 2, 4 of the building elements.
• the interconnection of the first plates of the adjacent building elements in an electrically isolating manner corresponds to the division of the first plate 2 into two sections in Figure 3.
• In order to mount the adjacent building elements 1 such that the first plates 2 are interconnected in an electrically isolating manner may be implemented by placing a sealing at least in the first plate of the second building element.
• the second plates of the building elements may be formed and connected such that they constitute an electrically conductive coupling with one another.
• the second plate 4 may alternatively be divided into two sections or the second plates of the adjacent building elements may be electrically isolated from one another, whereas the first plates are interconnected in an electrically conductive manner.
• the control means or the thermostat in connection with the current source may be employed in a desired manner in connection with all embodiments.
• the current source is a solar panel (not shown), which is mounted on the building element's 1 first plate 2 constituting a front surface of the building element 1.
• a solar panel as the current source it is possible that each building element 1 or an assembly of two or more building elements provide an independently operating Peltier module.
• the building element 1 may be further provided with one or more heat accumulators or heat stabilizers for temporary storage and release of thermal and/or refrigeration energy.
• the heat stabilizer may be an element, for instance, which has a high heat storage capacity.
• An alternative is to use phase exchange material in the heat stabilizer or the heat accumulator.
• the heat accumulator or the heat stabilizer is a plate- like part that is placed to have a heat transfer connection with the first and/or the second plate 2, 4.
• the plate-like part may be placed on the inside or outside of the first and/or the second plate 2, 4.
• the building element 1 is described as an insulated building panel or sandwich panel, but the building ele- ment may be any building element comprising a first plate and a second plate that are set electrically apart from one another.

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• Engineering & Computer Science (AREA)
• Architecture (AREA)
• Life Sciences & Earth Sciences (AREA)
• Sustainable Development (AREA)
• Chemical & Material Sciences (AREA)
• Combustion & Propulsion (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Civil Engineering (AREA)
• Structural Engineering (AREA)
• Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

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Applications Claiming Priority (2)

Publications (1)

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Cited By (4)

Citations (4)

Family Cites Families (2)

• 2008
  • 2008-09-12 FI FI20085860A patent/FI121675B/fi not_active IP Right Cessation
• 2009
  • 2009-09-09 EP EP09812743.4A patent/EP2334881A4/en not_active Withdrawn
  • 2009-09-09 WO PCT/FI2009/050722 patent/WO2010029217A1/en active Application Filing

Patent Citations (4)

Non-Patent Citations (1)

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