WO2010024605A3 - 적층형 복합 칩 소자 - Google Patents

적층형 복합 칩 소자 Download PDF

Info

Publication number
WO2010024605A3
WO2010024605A3 PCT/KR2009/004787 KR2009004787W WO2010024605A3 WO 2010024605 A3 WO2010024605 A3 WO 2010024605A3 KR 2009004787 W KR2009004787 W KR 2009004787W WO 2010024605 A3 WO2010024605 A3 WO 2010024605A3
Authority
WO
WIPO (PCT)
Prior art keywords
common mode
suppressor
mode filter
data line
single chip
Prior art date
Application number
PCT/KR2009/004787
Other languages
English (en)
French (fr)
Other versions
WO2010024605A2 (ko
Inventor
주현태
황윤호
류재수
임병국
이재욱
조민수
Original Assignee
주식회사 아모텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아모텍 filed Critical 주식회사 아모텍
Publication of WO2010024605A2 publication Critical patent/WO2010024605A2/ko
Publication of WO2010024605A3 publication Critical patent/WO2010024605A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

공통모드필터와 서프레서를 하나의 칩으로 구현하여 고속의 데이터 라인에서 발생하는 노이즈 성분의 제거 및 ESD보호를 동시에 행할 수 있도록 한 적층형 복합 칩 소자를 제시한다. 제시된 적층형 복합 칩 소자는 적층된 복수의 시트를 포함하는 소체의 상면에 갭 방전을 위한 복수의 방전부가 형성된 서프레서층, 및 소체의 내부에 형성되되 상호 반대의 방향으로 감겨진 복수의 공통모드 전극 패턴을 갖는 공통모드필터층을 포함하고, 서프레서층과 공통모드필터층은 적층되어 원칩화된 것이다. 공통모드필터와 서프레서를 혼합 구성하여 하나의 칩으로 구현함으로써, 데이터 라인에서 발생하는 리플 성분의 제거 및 ESD취약부분인 고속 데이터 라인에 대한 ESD 보호를 동시에 행할 수 있다. 공통모드필터와 서프레서를 하나의 칩으로 구현함에 따라 한번의 라인폭 수정으로 임피던스 매칭을 행할 수 있게 되어 작업이 매우 간편해지는 효과가 있고, 소자가 하나 줄어들게 됨으로 인해 라인 길이도 짧아져서 여유공간을 더 확보할 수 있게 된다.
PCT/KR2009/004787 2008-08-29 2009-08-27 적층형 복합 칩 소자 WO2010024605A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080085109A KR20100026199A (ko) 2008-08-29 2008-08-29 적층형 복합 칩 소자
KR10-2008-0085109 2008-08-29

Publications (2)

Publication Number Publication Date
WO2010024605A2 WO2010024605A2 (ko) 2010-03-04
WO2010024605A3 true WO2010024605A3 (ko) 2010-06-24

Family

ID=41722126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004787 WO2010024605A2 (ko) 2008-08-29 2009-08-27 적층형 복합 칩 소자

Country Status (2)

Country Link
KR (1) KR20100026199A (ko)
WO (1) WO2010024605A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101135354B1 (ko) * 2010-10-14 2012-04-16 주식회사 이노칩테크놀로지 회로 보호 소자 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294724A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd 複合電子部品およびその製造方法
JP2007043216A (ja) * 2005-07-29 2007-02-15 Tdk Corp サージ吸収素子及びサージ吸収回路
KR100686991B1 (ko) * 2000-03-08 2007-02-27 마쯔시다덴기산교 가부시키가이샤 노이즈 필터 및 노이즈 필터를 이용한 전자 기기
KR20080056917A (ko) * 2006-12-19 2008-06-24 주식회사 아모텍 칩형 서지 흡수기
KR100844151B1 (ko) * 2007-04-11 2008-07-07 주식회사 이노칩테크놀로지 회로 보호 소자 및 그 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100686991B1 (ko) * 2000-03-08 2007-02-27 마쯔시다덴기산교 가부시키가이샤 노이즈 필터 및 노이즈 필터를 이용한 전자 기기
JP2006294724A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd 複合電子部品およびその製造方法
JP2007043216A (ja) * 2005-07-29 2007-02-15 Tdk Corp サージ吸収素子及びサージ吸収回路
KR20080056917A (ko) * 2006-12-19 2008-06-24 주식회사 아모텍 칩형 서지 흡수기
KR100844151B1 (ko) * 2007-04-11 2008-07-07 주식회사 이노칩테크놀로지 회로 보호 소자 및 그 제조 방법

Also Published As

Publication number Publication date
KR20100026199A (ko) 2010-03-10
WO2010024605A2 (ko) 2010-03-04

Similar Documents

Publication Publication Date Title
WO2011106751A8 (en) Electric discharge protection for surface mounted and embedded components
GB201213445D0 (en) Security wrap
WO2009117599A3 (en) Shielded three-terminal flat-through emi/energy dissipating filter
WO2009147205A3 (en) Synergistic fungicidal mixtures
GB2452770B (en) A ceramic armour element for use in armour
WO2014195482A3 (en) Organic electronic device
WO2007053272A3 (en) Electrostatic discharge (esd) protection circuit for multiple power domain integrated circuit
TWI369050B (en) Esd protection circuit
TR201810736T4 (tr) Substitüe polisiklik karbamoil piridon derivatı ön-ilacı.
EP1905141A4 (en) SCR ESD PROTECTION WITH GUARDRING
EP1927174A4 (en) ESD PROTECTION CIRCUITS
WO2008011254A3 (en) Electrostatic discharge protection for components of an rfid tag
TR200600313A2 (tr) Ortak-modlu bukağı bobinini kapsayan bobin tertibatı.
WO2008114681A1 (ja) 受動部品
EP4216274A3 (en) System and method for protecting an integrated circuit (ic) device
WO2011103266A3 (en) Shielding structure for transmission lines
WO2007100666A3 (en) Interleaved method for parallel implementation of the fast fourier transform
WO2010024605A3 (ko) 적층형 복합 칩 소자
EP2226914A3 (en) Systems and methods for protecting a series capacitor bank
MX2010003591A (es) Capa protectora mecanica para formas de dosificacion solidas.
TW200737413A (en) Single passivation layer scheme for forming a fuse
JP2009038807A5 (ko)
NL2001706A1 (nl) Printed circuit board assembly and manufacturing method for the same.
WO2014053272A3 (en) Method for manufacturing a turbine assembly
WO2012150777A3 (en) The printed circuit board and the method for manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09810210

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09810210

Country of ref document: EP

Kind code of ref document: A2