WO2010021508A3 - 반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치 - Google Patents

반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치 Download PDF

Info

Publication number
WO2010021508A3
WO2010021508A3 PCT/KR2009/004655 KR2009004655W WO2010021508A3 WO 2010021508 A3 WO2010021508 A3 WO 2010021508A3 KR 2009004655 W KR2009004655 W KR 2009004655W WO 2010021508 A3 WO2010021508 A3 WO 2010021508A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
semiconductor equipment
cleaning
cleaning components
equipment
Prior art date
Application number
PCT/KR2009/004655
Other languages
English (en)
French (fr)
Other versions
WO2010021508A2 (ko
Inventor
김익년
김홍진
장홍기
지영연
Original Assignee
트리플코어스코리아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 트리플코어스코리아 filed Critical 트리플코어스코리아
Publication of WO2010021508A2 publication Critical patent/WO2010021508A2/ko
Publication of WO2010021508A3 publication Critical patent/WO2010021508A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치가 제공된다. 발명에 따른 반도체 장비 부품 세정 방법은 a) 세정하고자 하는 반도체 장비 부품에 표면 처리액을 접촉시키는 단계; 및 (b) 상기 부품을 반응 챔버에서 플라즈마 세정하는 단계를 포함하는 것을 특징으로 하며, 보다 경제적인 방식으로 반도체 장비 부품을 세정할 수 있으며, 특히 노후된 반도체 장비 부품에 응집되어 있는 유기 또는 무기물질을 매우 효과적으로 제거할 수 있으므로, 장비에 사용된 부품의 사용수명을 연장할 수 있으며, 부품의 재사용을 통하여 장비의 경제성을 제고할 수 있다
PCT/KR2009/004655 2008-08-21 2009-08-21 반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치 WO2010021508A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080082078A KR100987977B1 (ko) 2008-08-21 2008-08-21 반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치
KR10-2008-0082078 2008-08-21

Publications (2)

Publication Number Publication Date
WO2010021508A2 WO2010021508A2 (ko) 2010-02-25
WO2010021508A3 true WO2010021508A3 (ko) 2010-06-17

Family

ID=41707570

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004655 WO2010021508A2 (ko) 2008-08-21 2009-08-21 반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치

Country Status (3)

Country Link
KR (1) KR100987977B1 (ko)
TW (1) TW201013764A (ko)
WO (1) WO2010021508A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647586B1 (ko) * 2015-02-24 2016-08-10 강원대학교산학협력단 기체-액체 하이브리드 상압 플라즈마를 이용한 반도체 기판의 세정 방법
KR102461911B1 (ko) 2018-07-13 2022-10-31 삼성전자주식회사 플라즈마 제네레이터, 이를 포함하는 세정수 처리 장치, 반도체 세정 장치 및 세정수 처리 방법
KR101995688B1 (ko) 2019-02-14 2019-07-02 이선수 반도체 장비 부품의 이물질 제거 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121683A (ja) * 1997-06-30 1999-01-26 Sumitomo Metal Ind Ltd 半導体デバイス製造装置用アルミニウム製部品の洗浄方法
KR20010063031A (ko) * 1999-12-21 2001-07-09 손정하 건식 식각 장비의 세정 방법
KR20020060794A (ko) * 2001-01-12 2002-07-19 주성엔지니어링(주) 플라즈마 세정을 이용한 ＨＳＧ－Ｓｉ 형성방법
KR20060017612A (ko) * 2003-05-22 2006-02-24 어플라이드 머티어리얼스, 인코포레이티드 프로세스 챔버의 부품 세정하는 방법 및 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121683A (ja) * 1997-06-30 1999-01-26 Sumitomo Metal Ind Ltd 半導体デバイス製造装置用アルミニウム製部品の洗浄方法
KR20010063031A (ko) * 1999-12-21 2001-07-09 손정하 건식 식각 장비의 세정 방법
KR20020060794A (ko) * 2001-01-12 2002-07-19 주성엔지니어링(주) 플라즈마 세정을 이용한 ＨＳＧ－Ｓｉ 형성방법
KR20060017612A (ko) * 2003-05-22 2006-02-24 어플라이드 머티어리얼스, 인코포레이티드 프로세스 챔버의 부품 세정하는 방법 및 장치

Also Published As

Publication number Publication date
TW201013764A (en) 2010-04-01
KR20100023363A (ko) 2010-03-04
WO2010021508A2 (ko) 2010-02-25
KR100987977B1 (ko) 2010-10-18

Similar Documents

Publication Publication Date Title
HK1123010A1 (en) Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
MY143763A (en) Method and system for using a two-phases substrate cleaning compound
SG149849A1 (en) Method and apparatus for cleaning a substrate using non-newtonian fluids
TW200738868A (en) Method and system for using a two-phases substrate cleaning compound
EP1717344A4 (en) PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE
TW200723379A (en) Substrate processing apparatus and substrate processing method
TW200628236A (en) Apparatus and method for processing a substrate
TW200725727A (en) Substrate processing method and substrate processing apparatus
TWI351060B (en) Substrate dryer using supercritical fluid, apparatus including the same, and method for treating substrate
TW200623260A (en) Methods of removing photoresist on substrates
DE502006006950D1 (de) Vorrichtung, anlage und verfahren zur oberflächenbehandlung von substraten
EP2195827A4 (en) SHOWER HEAD, SUBSTRATE PROCESSING DEVICE WITH THE SHOWER HEAD AND PLASMA FEEDING PROCEDURE WITH THE SHOWER HEAD
WO2008121373A3 (en) Membrane biofilm reactor for removing contaminants from ground water
TW200610573A (en) Fluid treating apparatus
WO2009151656A3 (en) Method of dielectric film treatment
SG148971A1 (en) Substrates and methods of using those substrates
MY158269A (en) Method and apparatus for removing contamination from substrate
SG132602A1 (en) Apparatus and methods for slurry cleaning of etch chambers
UA90890C2 (ru) устройство и способ для удаления краски и герметика
WO2010021508A3 (ko) 반도체 장비 부품 세정 방법 및 이를 이용한 반도체 장비 부품 세정 장치
ATE545950T1 (de) Substratverarbeitungssystem
TW200802572A (en) Substrate cleaning apparatus and method
WO2010028031A3 (en) Electrochemically-activated liquid for cosmetic removal
TW200718828A (en) Interleaving paper for glass
WO2010014399A3 (en) Chamber plasma-cleaning process scheme

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09808412

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09808412

Country of ref document: EP

Kind code of ref document: A2