WO2010012271A3 - Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current - Google Patents

Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current Download PDF

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Publication number
WO2010012271A3
WO2010012271A3 PCT/DE2009/001051 DE2009001051W WO2010012271A3 WO 2010012271 A3 WO2010012271 A3 WO 2010012271A3 DE 2009001051 W DE2009001051 W DE 2009001051W WO 2010012271 A3 WO2010012271 A3 WO 2010012271A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
current
conducting
conducting current
layer
Prior art date
Application number
PCT/DE2009/001051
Other languages
German (de)
French (fr)
Other versions
WO2010012271A2 (en
Inventor
Harald Redelberger
Original Assignee
Brose Fahrzeugteile Gmbh & Co. Kg, Würzburg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brose Fahrzeugteile Gmbh & Co. Kg, Würzburg filed Critical Brose Fahrzeugteile Gmbh & Co. Kg, Würzburg
Publication of WO2010012271A2 publication Critical patent/WO2010012271A2/en
Publication of WO2010012271A3 publication Critical patent/WO2010012271A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Abstract

Apparatus, in particular for conducting current, having a heat-generating element (1), in particular a component through which current flows, in particular for high powers, having a current-conducting element (2), in particular a conductor grid to which the heat-generating element is applied, and having a heat-dissipating means (3), in particular a heat sink which, in order to dissipate heat, in particular as a result of power loss, is thermally coupled to the current-conducting element, wherein the heat-dissipating means should be thermally coupled using a layer (4) comprising a heat-conducting, in particular plastic, solid medium, in particular a metal layer, and at least one insulation layer (5) for at least partial electrical insulation between the current-conducting element and the solid medium layer is provided between the current-conducting element and the solid medium layer.
PCT/DE2009/001051 2008-07-30 2009-07-29 Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current WO2010012271A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810035485 DE102008035485A1 (en) 2008-07-30 2008-07-30 Device, in particular for power line, to a method for producing a device, in particular for power line
DE102008035485.6 2008-07-30

Publications (2)

Publication Number Publication Date
WO2010012271A2 WO2010012271A2 (en) 2010-02-04
WO2010012271A3 true WO2010012271A3 (en) 2010-05-06

Family

ID=41100839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/001051 WO2010012271A2 (en) 2008-07-30 2009-07-29 Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current

Country Status (2)

Country Link
DE (1) DE102008035485A1 (en)
WO (1) WO2010012271A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039550A1 (en) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag control module
DE102012223287A1 (en) * 2012-12-14 2014-06-18 Hella Kgaa Hueck & Co. Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19654353A1 (en) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Mounting arrangement of a semiconductor device on a circuit board
EP0920055A2 (en) * 1997-11-28 1999-06-02 Robert Bosch Gmbh Cooling device for a heat generating componant on a printed board
DE19805492A1 (en) * 1998-02-11 1999-08-26 Siemens Ag Circuit board e.g. for electrical communications and measurement engineering
EP1168906A1 (en) * 2000-06-23 2002-01-02 Alstom Power module with electronic power components and production method thereof
JP2003204021A (en) * 2002-01-10 2003-07-18 Sumitomo Metal Electronics Devices Inc Substrate for semiconductor module
US20040232544A1 (en) * 2003-05-06 2004-11-25 Eiji Mochizuki Semiconductor device and method of manufacturing the same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222838C2 (en) * 1991-09-21 2002-03-28 Bosch Gmbh Robert Electrical device, in particular switching and control device for motor vehicles
DE4218419C2 (en) * 1992-06-04 2001-10-11 Philips Corp Intellectual Pty Printed circuit board with a plate-shaped metal core
DE10045193A1 (en) * 2000-09-13 2001-10-04 Siemens Ag Cooling system has electrically mutually insulated semiconducting chips has individual chip cooling systems arranged in cooling body so as to be electrically isolated from each other
DE10341453A1 (en) * 2003-09-09 2005-03-31 Robert Bosch Gmbh circuit support
JP2006100770A (en) * 2004-09-01 2006-04-13 Toyota Industries Corp Manufacturing method of substrate base plate, substrate base plate and substrate using base plate
DE202005019094U1 (en) * 2004-12-22 2006-05-04 Behr-Hella Thermocontrol Gmbh Electrical circuit for electrical lines and for cooling of components of electrical circuit has metal core printed circuit board with metal core layers are separated with isolation layers forming high current path
DE102005048702B4 (en) * 2005-10-11 2014-02-20 Continental Automotive Gmbh Electrical arrangement of two electrically conductive joining partners and method for fixing a plate on a base plate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19654353A1 (en) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Mounting arrangement of a semiconductor device on a circuit board
EP0920055A2 (en) * 1997-11-28 1999-06-02 Robert Bosch Gmbh Cooling device for a heat generating componant on a printed board
DE19805492A1 (en) * 1998-02-11 1999-08-26 Siemens Ag Circuit board e.g. for electrical communications and measurement engineering
EP1168906A1 (en) * 2000-06-23 2002-01-02 Alstom Power module with electronic power components and production method thereof
JP2003204021A (en) * 2002-01-10 2003-07-18 Sumitomo Metal Electronics Devices Inc Substrate for semiconductor module
US20040232544A1 (en) * 2003-05-06 2004-11-25 Eiji Mochizuki Semiconductor device and method of manufacturing the same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Also Published As

Publication number Publication date
DE102008035485A1 (en) 2010-02-04
WO2010012271A2 (en) 2010-02-04

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